Semiconductor chip coating device and coating method

Abstract

The invention belongs to the technical field of semiconductors, and particularly relates to a semiconductor chip coating device and method.The semiconductor chip coating device comprises a workbench, a coating disc is rotationally arranged on the upper end face of the workbench, a plurality of supporting frames designed in a circumferential array mode are fixedly installed on the upper end face of the coating disc, and an adsorption pipe is arranged on the inner side of each supporting frame; a chip body is arranged above each supporting frame, the adsorption pipe is used for adsorbing the lower end face of the chip body, a film coating frame is installed on the side of the workbench and located on the side wall of the film coating disc, and a film coating head is arranged on the end face of the film coating frame; the controller controls the film coating disc to stop rotating and controls the film coating head to move towards the side close to the chip body, and then the film coating head conducts film coating treatment on the upper end face and the periphery of the chip body; through the design of the first contact and the second contact, when the first contact and the second contact are in contact with each other, one group of chip bodies can just move to the position below a coating head.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of semiconductor, and particularly relates to a semiconductor chip coating device and a coating method. BACKGROUND

[0002] Semiconductor chips are everywhere, and coating is an important part of the production of semiconductor chips. The current coating device mostly adopts a vacuum coating process, and the vacuum coating process needs to use a coating device.

[0003] The prior art also proposes some solutions. For example, a semiconductor chip coating device is disclosed in a Chinese patent application with the announcement number CN210866113U, which comprises a bottom plate, an operation disc, an operation disc control unit, a baffle, a circular shaft control unit, a circular shaft, a coating head and a support column. The upper surface of the bottom plate is fixedly connected with support frame one, support frame two and a support plate. The middle part of the bottom plate is provided with the operation disc control unit. The support frame one is located on the front side of the bottom plate. The operation disc is installed on the upper part of the operation disc control unit. The support column is fixedly connected to the upper surface of the left end of the bottom plate. The support column is a right-angle support column. The middle part of the right side surface of the support column is fixedly connected with a support rod. When the semiconductor chip coating device works, it can coat completely, quickly and efficiently.

[0004] Although the above technical solution improves the chip coating efficiency, it still has other problems in specific use. In order to improve the stability in the coating process, the chip needs to be clamped at present. However, when clamping with the clamping mechanism, the chip side wall will be clamped, which causes the problem that the coating head is difficult to coat the clamped part of the side wall in the subsequent coating process. Moreover, because the clamping mechanism directly contacts the surface of the chip, the surface of the chip may be scratched.

[0005] Therefore, the application provides a semiconductor chip coating device and a coating method. SUMMARY

[0006] In order to make up for the deficiencies of the prior art and solve at least one technical problem in the background art.

[0007] The technical scheme adopted by the application to solve the technical problems is that the semiconductor chip coating device comprises a workbench, the upper end surface of the workbench is rotationally provided with a coating disc, the upper end surface of the coating disc is fixedly provided with a plurality of support frames arranged in a circumferential array, the inner side of each support frame is provided with a suction tube, the suction tube is used for suction of the lower end surface of the chip body, the side of the workbench and the side wall of the coating disc are provided with a coating frame, and the end surface of the coating frame is provided with a coating head.

[0008] Preferably, the side wall of the support frame is fixedly installed with the contact one, the side wall of the coating frame is installed with the contact two through the support rod, and the coating disc drives the contact one to rotate and contact with the contact two of the side wall of the coating frame during rotation.

[0009] Preferably, the inside of the coating disc is provided with an annular pipeline, the bottom end of each adsorption pipe penetrates into the inside of the annular pipeline, the inside of the annular pipeline realizes internal negative pressure through the external suction pipe, the suction pipe is installed in the inside of the coating disc and is controlled through the controller and the valve body; during work, the suction pipe is controlled to suck through the controller, so that the annular pipeline and each adsorption pipe are in a negative pressure state, so that the adsorption pipe can adsorb the lower end face of the chip body, thereby ensuring the stability during subsequent coating process; in this way, the problem that the coating head is difficult to coat the clamping part of the side wall during subsequent coating due to the use of the clamping mechanism to clamp the side wall of the chip body in the prior art can be avoided, and the problem that the chip body may be damaged due to excessive force of the clamping mechanism due to the small hardness of the chip body can also be avoided, which is beneficial to the subsequent use of the semiconductor chip.

[0010] Preferably, the outer circumferential surface of the adsorption pipe is fixedly installed with a square block, both side walls of the square block are provided with a guide groove, the groove wall of the guide groove is fixedly installed with an electric telescopic rod, the telescopic end of the electric telescopic rod is fixedly installed with an inclined frame, and the top end of the inclined frame is fixedly installed with an annular placing frame.

[0011] Preferably, the inner wall of the annular placing frame is provided with a limiting ring groove, the diameter of the limiting ring groove is greater than the length of the chip body, the limiting ring groove is provided with smooth rubber, and the shape of the guide groove is matched with the shape of the electric telescopic rod; during work, since the limiting ring groove is arranged on the inner wall of the annular placing frame, the chip body is first placed in the limiting ring groove when the chip body is transferred by the mechanical hand to the inner wall of the annular placing frame, and then the annular placing frame and the limiting ring groove move along the side wall of the chip body when the annular placing frame is lowered through the above control after the adsorption pipe adsorbs. In this way, the chip body can be conveniently placed on the inside of the limiting ring groove, and the chip body will not be moved when the limiting ring groove moves from the side wall of the chip body.

[0012] Preferably, the inner wall of the annular pipeline is installed with a circumferentially arrayed elastic telescopic column, each group of elastic telescopic columns and adsorption pipes are in one-to-one correspondence, the upper end surface of each group of elastic telescopic columns is fixedly installed with a magnetic plate, the outer surface of the elastic telescopic column is sleeved with a telescopic spring, the upper side of the workbench and the side wall of the coating disc are installed with a recovery table, the upper side of the workbench is provided with a recovery unit, the recovery unit is used to recover the chip body after coating, the inside of the workbench and the side close to the recovery table are installed with a magnetic block, and the magnetism of the magnetic block is the same as that of the magnetic plate.

[0013] Preferably, the recycling unit comprises an L-shaped fixed rod installed at the middle of the workbench and not in contact with the coating disc, one end of the L-shaped fixed rod away from the workbench is fixedly installed with an arc-shaped protruding block, the lower end surface of the chip body will be in contact with the protruding end of the arc-shaped protruding block during the rotation of the coating disc and the supporting frame and the chip body, and the recycling table is designed to be inclined relative to the horizontal plane. When the coating disc stops rotating, the chip body with completed coating is just moved to the side corresponding to the position of the magnetic block, and the magnetic plate moves towards the bottom of the adsorption tube; during this process, the coating disc drives the chip body with completed coating to move towards the side close to the arc-shaped protruding block, and gradually moves along the horizontal surface of the arc-shaped protruding block to the protruding surface, then under the limiting of the protruding surface of the arc-shaped protruding block, the chip body is in an inclined state, at this time the adsorption force of the adsorption tube is reduced, and the chip body in the inclined state slides to the surface of the recycling table and is recycled to the external device along the recycling table.

[0014] Preferably, the surface of the recycling table is installed with a plurality of rotating rollers, and the plurality of rotating rollers are arranged in a linear array; when the chip body is inclined on the surface of the recycling table, the rotating rollers can be controlled to rotate to drive the chip body to move, so that the chip body is quickly moved away from the adsorption tube.

[0015] Preferably, a semiconductor chip coating method is provided, which adopts the semiconductor chip coating device described above, and comprises the following steps: S1, the chip body is clamped from the conveying station to the upper side of the supporting frame by an external mechanical adsorption hand, and the lower end surface of the chip body is tightly adsorbed on the upper side of the supporting frame by the adsorption of the adsorption tube to generate negative pressure; S2, then the coating disc is controlled to rotate above the workbench by an external controller, so that the coating disc drives one of the supporting frames and the chip body to move towards the side close to the coating frame; S3, when the chip body moves below the coating head, the movement of the coating disc is stopped, and then the chip body can be coated by the coating head.

[0016] Preferably, in the step S1, the material of the adsorption tube is rubber.

[0017] The beneficial effects of the present application are as follows: 1. The semiconductor chip coating device and coating method provided by the present application can realize the automatic recycling function of the chip body with completed coating by moving the magnetic plate close to the bottom of the adsorption tube, then the adsorption force of the adsorption tube on the side of the recycling table becomes smaller, and the chip body with completed coating is pressed by the recycling unit and moved to the surface of the recycling table, so that the manual operation of the staff is not needed.

[0018] 2. The semiconductor chip coating device and coating method of the present application, when the subsequent chip body coating is completed and the coating disc continues to rotate, one of the magnetic plates is separated from the magnetic block at this time, and under the elastic force of the elastic telescopic column, the magnetic plate can be driven to return to the initial position, and when the subsequent chip body moves above the magnetic block again, the chip body with completed coating can be taken out according to the above steps, so that the chip body coating and recycling can be continuously performed, the operation is more convenient, and the subsequent semiconductor chip is beneficial to use. BRIEF DESCRIPTION OF DRAWINGS

[0019] The present application will be further described below in conjunction with the drawings.

[0020] Figure 1 is a perspective view of the present application; Figure 2 is a schematic view of the coating rack structure in the present application; Figure 3 is a schematic view of the top structure in the present application; Figure 4 is a schematic view of the support frame structure in the present application; Figure 5 is a schematic view of the adsorption tube structure in the present application; Figure 6 is a schematic view of the square block structure in the present application; Figure 7 is a schematic view of the magnetic block structure in the present application; Figure 8 is a schematic view of the recycling table structure in the present application; Figure 9 is a schematic view of the L-shaped fixed rod structure in the present application; Figure 10 is a schematic view of the arc-shaped protrusion structure in the present application; Figure 11 is a flow chart of the method in the present application.

[0021] In the drawings: 1, workbench; 101, coating rack; 102, coating head; 2, coating disc; 3, support frame; 4, adsorption tube; 301, chip body; 5, contact one; 6, contact two; 7, annular pipeline; 8, square block; 9, guide groove; 901, electric telescopic rod; 10, inclined frame; 11, annular placement frame; 12, limiting ring groove; 13, elastic telescopic column; 14, magnetic plate; 15, magnetic block; 16, recycling table; 17, L-shaped fixed rod; 18, arc-shaped protrusion; 19, rotating roller. DETAILED DESCRIPTION

[0022] In order to make the technical means, creative features, purposes and effects of the present application easy to understand, the present application will be further described below in conjunction with specific embodiments.

[0023] As Figures 1 to 10 shown in the figure, the semiconductor chip coating device comprises a workbench 1, the upper end surface of the workbench 1 is rotationally provided with a coating disc 2, the upper end surface of the coating disc 2 is fixedly installed with a plurality of support frames 3 designed in a circumferential array, the inner side of each support frame 3 is provided with a suction tube 4, when coating, the chip body 301 is placed above each support frame 3, the suction tube 4 is used for adsorbing the lower end surface of the chip body 301, the side of the workbench 1 and located at the side wall of the coating disc 2 is installed with a coating frame 101, the end surface of the coating frame 101 is provided with a coating head 102; When working, the chip body 301 is clamped and sent from the transportation station to the upper side of the support frame 3 by the external mechanical suction hand, and the negative pressure is generated by the suction of the suction tube 4, so that the lower end surface of the chip body 301 is tightly adsorbed above the support frame 3; then the coating disc 2 is controlled to rotate above the workbench 1 by the external controller, so that the coating disc 2 drives one group of support frames 3 and the chip body 301 to move to the side close to the coating frame 101, when the chip body 301 moves below the coating head 102, the movement of the coating disc 2 is stopped at this time, then the chip body 301 can be coated by the coating head 102; the lower end surface of the chip body 301 is adsorbed by the suction tube 4, which can avoid the problem that the side wall of the chip body 301 is clamped by the clamping mechanism in the prior art, so that the clamping part of the side wall is difficult to be coated by the coating head 102 during subsequent coating, and also can avoid the problem that the chip body 301 is damaged due to the excessive force of the clamping mechanism because of the small hardness of the chip body 301; It should be noted that the movement mode of the coating frame 101 controlling the coating head 102 and the coating of the chip body 301 by the coating head 102 are both prior art, that is, the top surface and the four side walls of the chip body 301 are sputtered with stainless steel (transition layer) and copper (shielding layer) to prevent electromagnetic interference, which is not described in detail in the embodiment of the application; Moreover, the driving rotation mode of the coating disc 2 is also prior art, in the embodiment of the application, the outer wall of the coating disc 2 can be provided with a gear ring, and the rotation of the gear ring and the coating disc 2 can be driven by a gear.

[0024] The side wall of the support frame 3 is fixedly installed with a contact one 5, the side wall of the coating frame 101 is installed with a contact two 6 through a support rod, the coating disc 2 drives the contact one 5 to rotate during rotation, and the contact one 5 contacts with the contact two 6 of the side wall of the coating frame 101; When working, the coating disc 2 is controlled to rotate above the workbench 1 by an external controller, so that the coating disc 2 drives one group of support frames 3 and the chip body 301 to move to the side close to the coating frame 101, and the coating disc 2 drives the support frame 3 and the contact one 5 to move to the side close to the contact two 6 at the same time. When the contact one 5 and the contact two 6 are in contact, the contact two 6 transmits a contact signal to the external controller. The controller controls the coating disc 2 to stop rotating first, and then controls the coating head 102 to move to the side close to the chip body 301. Then, the coating head 102 performs coating treatment on the upper end surface and the periphery of the chip body 301. Through the design of the contact one 5 and the contact two 6, one group of chip bodies 301 can be moved just below the coating head 102 when the two are in contact. In this way, the movement of the coating disc 2 can be automatically controlled, and the coating of the chip body 301 is facilitated.

[0025] The inside of the coating disc 2 is provided with an annular pipeline 7. The bottom end of each suction pipe 4 penetrates the inside of the annular pipeline 7. The inside of the annular pipeline 7 is connected to an external suction pipe to achieve internal negative pressure. The suction pipe is installed in the inside of the coating disc 2 and is controlled by a controller and a valve body. When working, the controller controls the suction pipe to suck, so that the annular pipeline 7 and each suction pipe 4 are in a negative pressure state, so that the suction pipe 4 can adsorb the lower end surface of the chip body 301, ensuring the stability in the subsequent coating process. In this way, the problem that the coating head 102 is difficult to coat the clamping part of the side wall when using the clamping mechanism to clamp the side wall of the chip body 301 in the prior art can be avoided. Moreover, the problem that the surface of the chip body 301 is scratched due to direct contact between the chip body 301 and the clamping mechanism can also be avoided, which is beneficial to the subsequent use of the semiconductor chip.

[0026] The outer periphery of the suction pipe 4 is fixedly provided with a square block 8. The two side walls of the square block 8 are provided with guide grooves 9. The groove walls of the guide grooves 9 are fixedly provided with electric telescopic rods 901. The telescopic ends of the electric telescopic rods 901 are fixedly provided with inclined frames 10. The top ends of the inclined frames 10 are fixedly provided with annular placing frames 11. When the chip body 301 is transferred to above the suction pipe 4 by an external mechanical suction hand, the chip body 301 will first fall on the inside of the annular placing frame 11, and the chip body 301 will be adsorbed by the suction pipe 4 when the chip body 301 is in the position shown in the figure. Figure 5When the chip body 301 is adsorbed by the adsorption tube 4, the controller controls the telescopic end of the electric telescopic rod 901 to move, so that the telescopic end drives the inclined frame 10 to move downward, and the inclined frame 10 drives the annular placing frame 11 to move downward, that is, the annular placing frame 11 moves away from the chip body 301, and then the lower end surface of the chip body 301 is adsorbed by the adsorption tube 4, so that the annular placing frame 11 does not affect the film coating head 102 to coat the side wall of the chip body 301. It should be noted that during the transfer process of the mechanical adsorption hand, the part adsorbed by the mechanical adsorption hand is the upper end surface of the chip body 301, and when falling on the upper end surface of the annular placing frame 11, it is the lower end surface of the chip body 301.

[0027] The inner wall of the annular placing frame 11 is provided with a limiting ring groove 12, the diameter of the limiting ring groove 12 is greater than the length of the chip body 301, the limiting ring groove 12 is provided with smooth rubber, and the shape of the guide groove 9 and the shape of the electric telescopic rod 901 are matched. During work, since the limiting ring groove 12 is arranged on the inner wall of the annular placing frame 11, when the chip body 301 is transferred by the mechanical hand to the inner wall of the annular placing frame 11, the chip body 301 will be placed in the limiting ring groove 12 first, and then after the adsorption tube 4 is adsorbed, the annular placing frame 11 is moved downward by the above-mentioned control, so that the annular placing frame 11 and the limiting ring groove 12 move along the side wall of the chip body 301. By this design, the chip body 301 can be conveniently placed on the inner side of the limiting ring groove 12, and the subsequent movement of the limiting ring groove 12 from the side wall of the chip body 301 will not move the chip body 301.

[0028] The inner wall of the annular pipe 7 is provided with a circumferential array of elastic telescopic columns 13, each group of elastic telescopic columns 13 and the adsorption tube 4 is in one-to-one correspondence, the upper end surface of each group of elastic telescopic columns 13 is fixedly provided with a magnetic plate 14, the outer surface of the elastic telescopic column 13 is sleeved with a telescopic spring, the upper side of the workbench 1 and the side wall of the film coating disc 2 are provided with a recovery table 16, the upper side of the workbench 1 is provided with a recovery unit, the recovery unit is used for recovering the chip body 301 after film coating, the inner side of the workbench 1 and the side close to the recovery table 16 are provided with a magnetic block 15, and the magnetism of the magnetic block 15 is the same as that of the magnetic plate 14. When the chip body 301 is plated once, the plating disc 2 continues to rotate, and the subsequent support frame 3 and the contact one 5 continue to rotate, and when the next group of contact one 5 and contact two 6 are in contact, the chip body 301 plated at this time is just moved to the side of the recovery table 16, and the contact two 6 transmits the contact signal to the controller, and the plating disc 2 stops rotating; the chip body 301 plated is just moved to the side corresponding to the magnetic block 15, and because the magnetism of the magnetic block 15 is the same as that of the magnetic plate 14, according to the principle of same nature repelling each other, the magnetic plate 14 moves away from the magnetic block 15, that is, the magnetic plate 14 moves to the bottom of the adsorption tube 4, and then the magnetic plate 14 is close to the bottom of the adsorption tube 4, so that the adsorption force of the adsorption tube 4 moving to the side of the recovery table 16 is small, and then under the action of the recovery unit, the chip body 301 plated can be pressed and moved to the surface of the recovery table 16, realizing the automatic recovery function of the chip body 301 plated without manual operation of the staff. It should be noted that the repulsive force of the magnetic block 15 to the magnetic plate 14 can drive the magnetic plate 14 to move to the bottom of the adsorption tube 4.

[0029] The recovery unit comprises an L-shaped fixed rod 17, which is installed in the middle of the workbench 1 and does not contact the plating disc 2, and an arc-shaped protrusion 18 is fixedly installed at the end away from the workbench 1, and the lower end surface of the chip body 301 contacts the protruding end of the arc-shaped protrusion 18 during the rotation of the plating disc 2, support frame 3 and chip body 301, and the recovery table 16 is designed to be inclined relative to the horizontal plane. When the plating disc 2 stops rotating, the chip body 301 plated is just moved to the side corresponding to the magnetic block 15, and the magnetic plate 14 moves to the bottom of the adsorption tube 4; during this process, the plating disc 2 drives the chip body 301 plated to move to the side close to the arc-shaped protrusion 18, and gradually moves along the horizontal surface of the arc-shaped protrusion 18 to the protruding surface, and then under the limiting of the protruding surface of the arc-shaped protrusion 18, the chip body 301 is in an inclined state, at this time the adsorption force of the adsorption tube 4 is reduced, and the chip body 301 in the inclined state slides to the surface of the recovery table 16 and is recovered to the external equipment along the recovery table 16; It should be noted that when the magnetic plate 14 contacts the bottom of the adsorption tube 4, the adsorption force of the adsorption tube 4 is small, and at this time the adsorption force is not enough to adsorb the chip body 301, and the chip body 301 falls on the recovery table 16 under the gravity.

[0030] The surface of the recycling table 16 is provided with a plurality of rotating rollers 19 arranged in a linear array; in operation, when the chip body 301 is tilted on the surface of the recycling table 16, the rotating rollers 19 can be controlled to rotate to drive the chip body 301 to move, so that the chip body 301 is quickly moved away from the adsorption tube 4. When the subsequent chip body 301 is completed, the magnet plate 14 is separated from the magnetic block 15, and under the elastic force of the elastic telescopic column 13, the magnet plate 14 is restored to the initial position. When the subsequent chip body 301 is moved above the magnetic block 15 again, the chip body 301 after coating is taken out according to the above steps. This design can continuously coat and recycle the chip body 301, which is convenient to operate and is beneficial to the use of subsequent semiconductor chips.

[0031] As shown in Figure 11 A semiconductor chip coating method, which uses the semiconductor chip coating device described above, comprises the following steps: S1, the chip body 301 is clamped and sent from the transportation station to the upper side of the support frame 3 by an external mechanical adsorption hand, and the lower end surface of the chip body 301 is tightly adsorbed on the upper side of the support frame 3 by the adsorption of the adsorption tube 4 to generate negative pressure; S2, then the coating disc 2 is controlled to rotate above the workbench 1 by an external controller, so that the coating disc 2 drives one group of support frames 3 and chip bodies 301 to move to the side close to the coating frame 101; S3, when the chip body 301 moves below the coating head 102, the movement of the coating disc 2 is stopped, and then the chip body 301 can be coated by the coating head 102.

[0032] In the step S1, the material of the adsorption tube 4 is rubber.

[0033] The working principle is that in the initial state, the chip body 301 is clamped and sent from the transportation station to the upper side of the support frame 3 by an external mechanical adsorption hand, and the lower end surface of the chip body 301 is tightly adsorbed on the upper side of the support frame 3 by the adsorption of the adsorption tube 4 to generate negative pressure; then the coating disc 2 is controlled to rotate above the workbench 1 by an external controller, so that the coating disc 2 drives one group of support frames 3 and chip bodies 301 to move to the side close to the coating frame 101, and the coating disc 2 simultaneously drives the support frame 3 and the contact one 5 to move to the side close to the contact two 6; when the contact one 5 and the contact two 6 are in contact, the contact two 6 transmits a contact signal to the external controller, the controller controls the coating disc 2 to stop rotating, and controls the coating head 102 to move to the side close to the chip body 301, and then the coating head 102 performs coating treatment on the upper end surface and the surrounding of the chip body 301. The suction pipe is controlled by the controller to suck so that the annular pipeline 7 and each suction pipe 4 are in a negative pressure state, so that the suction pipe 4 can adsorb the lower end surface of the chip body 301, and the stability in the subsequent film plating process is ensured; in this way, the problem that the film plating head 102 is difficult to plating the clamping part of the side wall during the subsequent film plating process can be avoided, and the problem that the chip body 301 is directly contacted with the clamping mechanism, which causes the surface of the chip body 301 to be scratched, can also be avoided, which is beneficial to the subsequent use of the semiconductor chip; When the external mechanical suction hand transfers the chip body 301 to above the suction pipe 4, the chip body 301 will first fall on the inner side of the annular placing frame 11, and as shown in the attached Figure 5 As shown in the position, after the suction pipe 4 adsorbs the bottom of the chip body 301, the controller controls the telescopic end of the electric telescopic rod 901 to move, so that the telescopic end drives the inclined frame 10 to move downward, the inclined frame 10 drives the annular placing frame 11 to move downward, that is, the annular placing frame 11 moves away from the side of the chip body 301, and then only the suction effect of the suction pipe 4 is used to adsorb the lower end surface of the chip body 301, so that the annular placing frame 11 can avoid affecting the film plating of the film plating head 102 on the side wall of the chip body 301; since the limiting ring groove 12 is opened in the inner wall of the annular placing frame 11, when the chip body 301 is transferred by the mechanical hand to the inner wall of the annular placing frame 11, the chip body 301 will first be placed in the limiting ring groove 12, and then after the suction pipe 4 is adsorbed, the annular placing frame 11 is moved downward by the above control, so that the annular placing frame 11 and the limiting ring groove 12 move along the side wall of the chip body 301, in this way, the chip body 301 can be conveniently placed in the inner side of the limiting ring groove 12, and the subsequent movement of the limiting ring groove 12 from the side wall of the chip body 301 will not drive the chip body 301 to move; After the chip body 301 is plated once, the plating disc 2 is continuously controlled to rotate, and the plating disc 2 drives the subsequent support frame 3 and the contact one 5 to continue to rotate, when the subsequent contact one 5 and the contact two 6 are in contact, the chip body 301 plated at this time is just moved to the side of the recycling table 16, and the contact two 6 transmits the contact signal to the controller, and the plating disc 2 stops rotating; the chip body 301 plated is just moved to the side corresponding to the magnetic block 15, because the magnetism of the magnetic block 15 is the same as that of the magnetic plate 14, according to the principle of same nature repelling each other, the magnetic plate 14 moves to the side away from the magnetic block 15, that is, the magnetic plate 14 moves to the bottom of the adsorption tube 4, and then the magnetic plate 14 is close to the bottom of the adsorption tube 4, so that the adsorption force of the adsorption tube 4 moving to the side of the recycling table 16 is small, and then the plated chip body 301 is pressed by the recycling unit, and the chip body 301 is moved to the surface of the recycling table 16, so that the plated chip body 301 is automatically recycled without manual operation of the staff; When the plating disc 2 stops rotating, the chip body 301 plated is just moved to the side corresponding to the magnetic block 15, and the magnetic plate 14 moves to the bottom of the adsorption tube 4; in this process, the plating disc 2 drives the chip body 301 plated to move to the side close to the arc-shaped protrusion 18, and gradually moves along the horizontal plane of the arc-shaped protrusion 18 to the protruding surface, and then the chip body 301 is in an inclined state under the limiting of the protruding surface of the arc-shaped protrusion 18, at this time, the adsorption force of the adsorption tube 4 is reduced, and the chip body 301 in the inclined state slides to the surface of the recycling table 16 and is recycled to the external equipment along the recycling table 16; when the subsequent chip body 301 is plated, and the plating disc 2 is continuously controlled to rotate, at this time, one of the magnetic plates 14 is separated from the magnetic block 15, and under the elastic force of the elastic telescopic column 13, the magnetic plate 14 can be driven to return to the initial position, and when the subsequent chip body 301 moves above the magnetic block 15 again, the plated chip body 301 can be taken out according to the above steps, so that the chip body 301 can be continuously plated and recycled, and the operation is more convenient, which is beneficial to the use of the subsequent semiconductor chip.

[0034] The basic principle, main features and advantages of the present application are shown and described above. Those skilled in the art should understand that the present application is not limited to the above embodiments, and the above embodiments and descriptions in the specification are only to illustrate the principle of the present application, and various changes and improvements can be made without departing from the spirit and scope of the present application, and these changes and improvements all fall within the scope of the present application. The scope of protection of the present application is defined by the appended claims and their equivalents.

Claims

1. A semiconductor chip coating apparatus, characterized in that: The application relates to a chip coating device, which comprises a workbench, a coating disc is arranged on the upper end face of the workbench, a plurality of support frames in a circumferential array are fixedly arranged on the upper end face of the coating disc, an adsorption pipe is arranged on the inner side of each support frame and used for adsorbing the lower end face of a chip body, a coating frame is arranged on the side wall of the coating disc, and a coating head is arranged on the end face of the coating frame.

2. The semiconductor chip coating device of claim 1, wherein: A contact one is fixedly arranged on the side wall of the support frame, a contact two is arranged on the side wall of the coating frame through a supporting rod, the contact one is driven to rotate by the coating disc during rotation and is in contact with the contact two on the side wall of the coating frame.

3. The semiconductor chip coating device of claim 1, wherein: An annular pipeline is arranged in the coating disc, the bottom end of each adsorption pipe penetrates into the annular pipeline, internal negative pressure is formed in the annular pipeline through an external suction pipe, the suction pipe is arranged in the coating disc and is controlled by a controller and a valve body.

4. The semiconductor chip coating apparatus of claim 3, wherein: A square block is fixedly arranged on the outer circumferential surface of the adsorption pipe, guide grooves are arranged on the two side walls of the square block, electric telescopic rods are fixedly arranged on the groove walls of the guide grooves, an inclined frame is fixedly arranged on the telescopic end of the electric telescopic rod, and an annular placing frame is fixedly arranged on the top end of the inclined frame.

5. The semiconductor chip coating apparatus of claim 4, wherein: A limiting ring groove is arranged on the inner wall of the annular placing frame, the diameter of the limiting ring groove is larger than the length of the chip body, smooth rubber is arranged in the limiting ring groove, and the shape of the guide groove is matched with the shape of the electric telescopic rod.

6. The semiconductor chip coating apparatus of claim 4, wherein: A plurality of elastic telescopic columns in a circumferential array are arranged on the inner wall of the annular pipeline, each group of elastic telescopic columns and the adsorption pipe are in one-to-one correspondence, a magnetic plate is fixedly arranged on the upper end face of each group of elastic telescopic columns, a telescopic spring is sleeved on the outer surface of the elastic telescopic column, a recovery table is arranged above the workbench and on the side wall of the coating disc, a recovery unit is arranged above the workbench and is used for recovering the chip body after coating, a magnetic block is arranged in the workbench and close to one side of the recovery table, and the magnetism of the magnetic block is the same as that of the magnetic plate.

7. The semiconductor chip coating apparatus of claim 6, wherein: The recovery unit comprises an L-shaped fixing rod, the L-shaped fixing rod is arranged in the middle of the workbench and does not contact the coating disc, an arc-shaped convex block is fixedly arranged on the end of the L-shaped fixing rod away from the workbench, the lower end face of the chip body is in contact with the convex end of the arc-shaped convex block during the rotation of the coating disc, driving the support frame and the chip body, and the recovery table is designed to be inclined relative to the horizontal plane.

8. The semiconductor chip coating apparatus of claim 7, wherein: A plurality of rotating rollers are arranged on the surface of the recovery table and are arranged in a linear array; during work, when the chip body is inclined on the surface of the recovery table, the rotating rollers are controlled to rotate, so that the rotating rollers drive the chip body to move, thereby making the chip body move away from the adsorption pipe as soon as possible.

9. A method for coating a semiconductor chip using the coating apparatus for a semiconductor chip according to any one of claims 1 to 8, characterized by: The application further discloses a chip coating method, which comprises the following steps: S1, a chip body is clamped from a conveying station to the upper side of the support frame by an external mechanical adsorption hand, negative pressure is generated by adsorption of the adsorption pipe, and the lower end face of the chip body is tightly adsorbed on the upper side of the support frame; S2, the coating disc is controlled to rotate on the upper side of the workbench by an external controller, so that the coating disc drives one group of support frames and the chip body to move to the side close to the coating frame; S3, when the chip body moves to below the coating head, the movement of the coating disc is stopped at this time, and then the chip body can be coated by the coating head.

10. The method of claim 9, wherein the semiconductor chip is a flip chip. In the step S1, the material of the adsorption tube is rubber.

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