System and method for detecting parallelism of array optical waveguide

Abstract

The invention discloses an array optical waveguide parallelism detection system and method. The system comprises an optical interference thickness measuring device, a software control module and an algorithm module. The optical interference thickness measuring device comprises an interferometer, a motion platform, an array optical waveguide carrier, an interferometer controller and an upper computer. The interferometer is cooperatively arranged on the motion platform, the interferometer comprises an interferometer probe, the array optical wave carrier is provided with a to-be-detected array optical waveguide, and the to-be-detected array optical waveguide is arranged below the interferometer probe; the software control module is electrically connected with the motion platform, and the software control module is used for controlling the motion platform to move along the X axis, the Y axis and the Z axis; the optical waveguide to be detected comprises a plurality of layers of laminations, the interferometer measures the thickness data of each layer of laminations, the parallelism data between the semi-transparent and semi-reflecting surfaces is analyzed according to the thickness data, the multi-layer thickness data of the array optical waveguide laminations can be measured at one time by using the interferometer based on the optical interference thickness measurement device, and the thickness measurement precision reaches submicron.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of parallelism detection, and particularly relates to a system and method for detecting parallelism of an array optical waveguide. BACKGROUND

[0002] As an important core component in the AR field, the optical display module is one of the most promising display solutions in many optical display solutions. It is light and thin, and its form is similar to that of traditional glasses.

[0003] The array optical waveguide is also known as a geometric optical waveguide. The optical efficiency of the geometric optical waveguide is one order of magnitude higher than that of the diffractive optical waveguide, and it is an ideal solution for AR glasses. The geometric optical waveguide uses multiple arrayed semi-transparent and semi-reflective surfaces to expand the exit pupil. The principle is relatively simple, but the process requirements are extremely strict.

[0004] The parallelism of the optical array surface in the AR geometric optical waveguide is crucial to the display effect of the display picture. The optical array surface is composed of multiple parallel semi-transparent and semi-reflective films. If the optical array surface is not strictly parallel, ghosting will occur in the display field picture, affecting the user's viewing experience. Unlike traditional optical devices, the optical array surface of the AR geometric optical waveguide is inside the optical waveguide device and cannot be processed and corrected after processing. Therefore, before mass production, the production process needs to be evaluated according to the parallelism of the optical array surface in the geometric optical waveguide to reduce the rate of defective products.

[0005] Therefore, the measurement technology of the AR optical waveguide is extremely important, and the parallelism measurement of the semi-transparent and semi-reflective surface array is extremely important. There is no obvious good solution for measuring the parallelism of the semi-transparent and semi-reflective surface array.

[0006] The existing Chinese patent CN113884028A provides an AR geometric array optical waveguide measurement method and device. The laser emitted by the laser is incident into the optical waveguide; the semi-transparent and semi-reflective surface array in the optical waveguide emits the incident laser to produce reflected outgoing light; the outgoing light of each semi-transparent and semi-reflective surface is emitted onto the receiving screen to produce a corresponding number of light spots; the position image of the outgoing light spots is captured by a camera and processed, the inclination offset is calculated according to the position of the light spots, the uniformity of the light spots and whether the light spots are offset are obtained, and the parallelism of the semi-transparent and semi-reflective surface in the optical waveguide is judged. This method measures the finished AR geometric array optical waveguide, and the parallelism angle precision is limited.

[0007] A kind of AR lens parallelism measurement method and system are disclosed in Chinese patent CN116592795A, which detects the parallelism of the finished product after the adhesion of multiple diffraction optical waveguide AR lenses, uses the principle of spectral confocal to measure the gap distance difference of adjacent lenses on each combination point corresponding measurement point and the length distance of each combination point, and calculates the parallelism of the AR lens to be measured. This method can only be used to detect the parallelism of diffraction optical waveguide AR lenses, and cannot detect the parallelism of AR geometric array optical waveguides. Limited by the dispersion principle, the refractive index changes with wavelength, the thickness measurement accuracy is limited, and the parallelism angle accuracy is limited. SUMMARY

[0008] The purpose of the present application is to provide an array optical waveguide parallelism detection system, comprising an optical interference thickness measuring device, a software control module and an algorithm module.

[0009] The optical interference thickness measuring device comprises an interferometer, a motion platform, an array optical waveguide carrier, an interferometer controller and an upper computer.

[0010] The interferometer is arranged on the motion platform, the interferometer comprises an interferometer probe, the array optical waveguide carrier is provided with a to-be-measured array optical waveguide, and the to-be-measured array optical waveguide is arranged below the interferometer probe.

[0011] The software control module is electrically connected with the motion platform, and the software control module is used to control the motion platform to move along the X-axis, the Y-axis and the Z-axis.

[0012] The to-be-detected optical waveguide comprises a plurality of laminated sheets, the interferometer measures the thickness data of each laminated sheet, and the algorithm module analyzes the parallelism data between each half-transmission half-reflection surface according to the thickness data.

[0013] Further, the interferometer probe and the interferometer controller are connected through an optical fiber, and the interferometer controller and the upper computer communicate through a network port or a USB interface.

[0014] Further, the motion platform comprises an X-axis motion module, a Y-axis motion module and a Z-axis motion module, and the Z-axis motion module is used to control the working distance between the interferometer probe and the to-be-measured array optical waveguide.

[0015] Further, the upper computer and the interferometer controller and the motion platform are electrically connected, and the interferometer controller and the motion platform are triggered synchronously based on the upper computer.

[0016] Further, an electric leveling mechanism is arranged on one side of the interferometer probe.

[0017] A second aspect of the present application provides an array optical waveguide parallelism detection method applied in an array optical waveguide parallelism detection system, comprising the following steps:

[0018] The interferometer is started and preheated, an upper computer is connected, and the array optical waveguide to be detected is placed on a carrier;

[0019] According to the sample thickness, the working distance of the interferometer probe and the array optical waveguide to be detected is adjusted based on the Z-axis module;

[0020] Based on the electric leveling machine, the interferometer probe is leveled according to the levelness feedback of the interferometer probe;

[0021] Based on the motion platform, the light of the interferometer probe is controlled to be at the initial measurement point of the array optical waveguide to be detected;

[0022] The scanning interval is set, and after the motion platform is controlled by the upper computer to move to the measured point, the thickness data of each layer of the array optical waveguide to be detected is measured by the interferometer;

[0023] According to the thickness data, the parallelism data between each semi-transparent and semi-reflective surface is fitted and calculated.

[0024] Further, the process of the array optical waveguide includes glass substrate cutting, grinding and polishing, film plating, multi-layer glass pressing and beveling, wherein the multi-layer glass pressing includes pressing 5-20 layers of glass into an optical waveguide stack by glue after film plating.

[0025] Further, the XY size of the stack of the array optical waveguide is 45*45mm, and 14*14 points are scanned at an interval of 3mm.

[0026] Due to the use of the above technical solution, the present application has the following advantages compared with the prior art:

[0027] The present application is based on an optical interference thickness measuring device, which uses an interferometer to measure the multi-layer thickness data of the array optical waveguide stack at one time, and the thickness measurement accuracy reaches sub-microns, and the angle accuracy after algorithm module calculation reaches the level of angle seconds.

[0028] The optical interference thickness measuring device of the present application synchronously triggers the motion platform and the interferometer through the software control module, the XY direction sampling interval is optional, and full-automatic detection can be realized, and the scanning effective area of the array optical waveguide stack can reach 90%.

[0029] The device can not only detect the parallelism during the multi-layer glass pressing of the array optical waveguide stack, but also can timely screen out defective products after pressing, reduce cost, and improve the efficiency and process performance of the geometric optical waveguide production.

[0030] The present application can realize automatic measurement of the thickness data and parallelism between each semi-transparent and semi-reflective surface of the array optical waveguide, to help process personnel screen out defective products and improve the display effect of the AR array optical waveguide. Attached Figure Description

[0031] Figure 1 This illustrates an optical interferometric thickness measurement device provided in an embodiment of the present invention;

[0032] Figure 2 The schematic diagram of the optical interferometric thickness measurement device provided in this embodiment is shown.

[0033] Figure 3 The process flow diagram of the arrayed optical waveguide provided in this embodiment is shown;

[0034] Figure 4 This embodiment shows a schematic diagram of the XY scanning points.

[0035] Figure 5 The flowchart of the method for detecting the parallelism of an array optical waveguide provided in this embodiment is shown.

[0036] Figure 6 The parallelism test results of Example 1 provided in this embodiment are shown;

[0037] Figure 7 The parallelism test results of Example 2 provided in this embodiment are shown;

[0038] Figure 8 A schematic diagram of the cross-section of the 4-layer arrayed optical waveguide stack provided in this embodiment is shown. Detailed Implementation

[0039] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort should fall within the scope of protection of the present application.

[0040] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate for the embodiments of this application described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0041] It should be noted that the embodiments in the present application and the features in the embodiments can be combined with each other without conflict. The present application will be described in detail below with reference to the drawings and in combination with the embodiments.

[0042] As shown in Figures 1-4 The embodiment of the present application provides an array optical waveguide parallelism detection system, which comprises an optical interference thickness measuring device, a software control module and an algorithm module.

[0043] The optical interference thickness measuring device comprises an interferometer, a motion platform, an array optical waveguide carrier, an interferometer controller and an upper computer.

[0044] The interferometer is arranged on the motion platform, and the interferometer comprises an interferometer probe. An array optical waveguide to be measured is arranged on the array optical waveguide carrier, and the array optical waveguide to be measured is arranged below the interferometer probe.

[0045] The software control module is electrically connected with the motion platform, and the software control module is used for controlling the motion platform to move along the X axis, the Y axis and the Z axis.

[0046] The optical waveguide to be detected comprises a plurality of laminated sheets. The interferometer measures thickness data of each laminated sheet, and the algorithm module analyzes parallelism data between each semi-transparent semi-reflective surface according to the thickness data.

[0047] According to the embodiment of the present application, the interferometer probe and the interferometer controller are connected through an optical fiber, and the interferometer controller and the upper computer communicate through a network port or a USB interface.

[0048] According to the embodiment of the present application, the motion platform comprises an X-axis motion module, a Y-axis motion module and a Z-axis motion module. The Z-axis motion module is used for controlling the working distance between the interferometer probe and the array optical waveguide to be measured.

[0049] According to the embodiment of the present application, the upper computer and the interferometer controller are electrically connected with the motion platform, and the interferometer controller and the motion platform are synchronously triggered based on the upper computer.

[0050] According to the embodiment of the present application, an electric leveling mechanism is arranged on one side of the interferometer probe.

[0051] Specifically, as shown in Figure 2As shown, the optical interference thickness gauge adopts the Michelson interferometer principle of a coherent light source. The coherent light beam emitted by the coherent light source can be divided into two beams through the optical fiber coupler. The two beams of light are focused on the measurement arm and the reference arm through the lens respectively; the reference arm is a displacement mirror, and the measurement arm is the sample area to be measured; in the measurement arm, the light beam is reflected by the internal surfaces of the measured optical waveguide sheet; in the reference arm, the light beam is reflected by the scanning mirror; in the optical fiber coupler, the two beams of light produce interference with R1 and R2 respectively; and the two interference signals are converted into electrical signals by the photodiode and then displayed by the display.

[0052] The reflection signals from different surfaces of the measured optical waveguide sheet have different optical paths. By adjusting the position of the scanning mirror to change the optical path of the reference light, when the optical path difference between the reference reflected light and the reflected light of a certain surface of the measured optical waveguide sheet is zero, an interference maximum value signal is generated. With the increase of the optical path difference, the coherent signal rapidly decreases.

[0053] By adjusting the position of the scanning mirror in the optical path, two positions of the maximum values of the two interference signals are obtained. The difference between the positions of the scanning mirror in the reference arm corresponding to the two maximum values is the optical thickness of a certain layer inside the measured optical waveguide sheet. The actual thickness is the optical thickness divided by the refractive index.

[0054] The thickness measurement accuracy of the interference thickness gauge is 0.1 um, and the repeat accuracy can reach 0.02 um; at most, 30 layers can be measured simultaneously, and the total thickness can be measured up to 50 mm.

[0055] As shown in Figure 3 The process of the array optical waveguide includes five steps: glass substrate cutting, grinding and polishing, film plating, multilayer glass pressing, and beveling. The most critical process is the pressing of the multilayer coated glass. The 5-20 layers of glass are pressed into an optical waveguide stack through glue. During this process, the uniformity of the glue needs to be ensured to ensure the parallelism between the coated surfaces. If the glue is not uniform, the angle between the coated surfaces will be too large, resulting in various stray light and poor display effect of the final beveled array optical waveguide product. The current detection method is mainly to detect the beveled array optical waveguide product, such as Chinese patent CN 113884028 A. However, at this time, the optical waveguide stack has been beveled, and each process will increase the cost. Therefore, the parallelism detection during the fourth step of pressing and after the pressing is completed is beneficial to timely screening of defective products, reducing costs, and improving the yield of subsequent processes.

[0056] As shown in Figure 4As shown, since the interferometer probe operates in point scanning mode, XY direction scanning is required to detect the entire effective area of ​​the arrayed waveguide stack. An example of the XY scanning point location is shown below. Figure 4 The X-axis of the sample is parallel to the X-axis of the motion platform, and the Y-axis of the sample is parallel to the Y-axis of the motion platform. The XY dimensions of the arrayed waveguide stack are 45*45mm. 14*14 points are scanned at 3mm intervals, and the effective scanning area can reach 90%.

[0057] like Figures 5-8 As shown, a second aspect of the present invention provides a method for detecting the parallelism of an arrayed optical waveguide, applied in an arrayed optical waveguide parallelism detection system, comprising the following steps:

[0058] The interferometer is powered on and warmed up, then connected to the host computer. The optical waveguide of the array to be tested is placed on the carrier.

[0059] Adjust the working distance between the interferometer probe and the optical waveguide of the array to be tested based on the sample thickness using the Z-axis module.

[0060] The interferometer probe is leveled based on the horizontality feedback from the interferometer probe using an electric leveling machine.

[0061] The light beam from the interferometer probe, controlled by a motion platform, moves to the initial measurement point in the optical waveguide of the array to be tested.

[0062] After setting the scanning interval, the host computer controls the motion platform to move to the point to be measured, and then synchronously triggers the interferometer to measure the thickness data of each layer of the optical waveguide array to be tested.

[0063] The parallelism data between each semi-transparent and semi-reflective surface is fitted and calculated based on the thickness data.

[0064] Specifically, the thickness data processing procedure according to the algorithm module is as follows:

[0065] 1. Data preprocessing (generate_real_height_matrices):

[0066] Read the X and Y coordinates from the CSV (convert the units from mm to μm) and divide them into a two-dimensional grid of x_bins×y_bins.

[0067] Extract the thickness data of all layers (such as H1, H2...) and construct a two-dimensional matrix for each layer.

[0068] Calculate the true height matrix: the value of each layer is the sum of the thickness of the current layer and the layers below it, reflecting the "cumulative structural height" of the material.

[0069] 2. Generation of cut mask (generate_cut_masks_all_layers):

[0070] Based on the given cropping start and end positions x1 to x2 and the skew angle angle_deg, calculate the projection offset (skew compensation) of each layer in the image coordinates.

[0071] Generate a mask map of the beveled region (one for each layer) to indicate where data is retained for analysis after beveling.

[0072] 3. Local section extraction and normal vector fitting (compute_cut_normals + fit_plane_normal):

[0073] Data is extracted from each mask region and fitted to the plane using the least squares method: the normal vectors of all layers are standardized to unit vectors.

[0074] 4. Normal vector angle analysis and confusion matrix plotting (plot_confusion_matrix):

[0075] Calculate the angles between each pair of normal vectors in each layer (including the angle with the standard reference normal vector [0,0,1]), and convert them to angles using the cosine angle formula:

[0076] Construct an angle matrix and visualize it using a Seaborn heatmap to show the differences in slope / angle changes between layers.

[0077] 5. Animation demonstrating the beveled area (animate_cut_layers):

[0078] The system dynamically displays the actual height matrix and its corresponding skew mask layer by layer, helping users understand the spatial location of the skew process in each layer.

[0079] 6. 3D visualization of oblique cut surface (plot_3d_cut_surface_slanted):

[0080] Construct the projection position of each section in three-dimensional space, taking into account angular offset and inter-layer height difference.

[0081] According to an embodiment of the present invention, the process of the arrayed optical waveguide includes glass substrate cutting, grinding and polishing, coating, multilayer glass lamination and beveling, wherein multilayer glass lamination includes laminating 5-20 layers of glass into an optical waveguide stack using adhesive after glass coating.

[0082] According to an embodiment of the present invention, the XY dimensions of the stack of arrayed optical waveguides are 45*45mm, and 14*14 points are scanned at 3mm intervals.

[0083] Specifically, as shown in Embodiment 1 of the present application, Figure 6 The parallelism data calculated according to the thickness data is visually displayed by using a matrix, and the labels of the two coordinate axes are L0, L1, L2, L3 and L4, so as to form a two-dimensional matrix to represent the parallelism data of any two surfaces of the arrayed optical waveguide stack, for example, for sample 1, the data corresponding to L0 and L4 is the parallelism between the surfaces of L0 and L4, which is 0.280, and the unit is angle second. The parallelism between the surfaces of L2 and L4 is 5.929 angle seconds, indicating that the surface of L2 and the substrate have a large error.

[0084] As shown in Embodiment 2 of the present application, Figure 7 For sample 2, the parallelism between the surfaces of L2 and L0 is 14.463 angle seconds, indicating that the surface of L2 and the substrate have a large error, and also indicating that the substrate of the surface of L0 has a large error, while the errors between other surfaces are small. Figure 8 As shown in Embodiment 3 of the present application, the surface of a 4-layer arrayed optical waveguide stack can be understood as follows: only when the multiple optical array surfaces L0, L1, L2, L3 and L4 are strictly parallel, can the human eye view complete and high-quality picture information. If a certain optical array surface deviates, the picture will show a ghosting defect.

[0085] In summary, the present application uses an interferometer to measure the thickness data of the multiple layers of the arrayed optical waveguide stack at one time based on the optical interference thickness measuring device, and the thickness measurement accuracy reaches sub-microns, and the angle accuracy after calculation by the algorithm module reaches the angle second level.

[0086] The optical interference thickness measuring device of the present application synchronously triggers the motion platform and the interferometer through the software control module, the sampling interval in the XY direction is optional, and full-automatic detection can be realized, and the scanning effective area of the arrayed optical waveguide stack can reach 90%.

[0087] The device can detect the parallelism during the pressing process of the multiple layers of the arrayed optical waveguide stack, and can also timely screen out defective products after the pressing is completed, so as to reduce the cost and improve the efficiency and process performance of the geometric optical waveguide production.

[0088] The present application can realize automatic measurement of the thickness data and parallelism between each semi-transparent semi-reflective surface of the arrayed optical waveguide, so as to help the process personnel to screen out defective products and improve the display effect of the AR arrayed optical waveguide.

[0089] Those skilled in the art can understand that, in order to facilitate the description, one memory and one processor are taken as an example for description. In actual terminals or servers, there can be multiple processors and memories. The memory can also be referred to as a storage medium or a storage device, and the present application embodiments do not limit this.

[0090] It should be understood that in the embodiments of the present application, the processor can be a central processing unit (CPU), and can also be other general-purpose processors, digital signal processors (DSP), application specific integrated circuits (ASIC), field-programmable gate arrays (FPGA) or other programmable logic devices, discrete gates or transistor logic devices, discrete hardware components, etc. The processor can also be a general-purpose microprocessor, a graphics processing unit (GPU) or one or more integrated circuits, for executing relevant programs to implement the functions required by the embodiments of the present application.

[0091] The processor can also be an integrated circuit chip having a signal processing capability. In the implementation process, each step of the present application can be completed by the integrated logic circuit or the instruction in the form of software in the processor. The processor described above can implement or execute the disclosed methods, steps and logic block diagrams in the embodiments of the present application. The steps of the methods disclosed in the embodiments of the present application can be directly embodied as hardware code processing executed by the processor, or executed by a combination of hardware and software modules in the processor. The software module can be located in the random access memory, the flash memory and the read-only memory, the programmable read-only memory, the electrically erasable programmable memory, the register, or other mature storage media in the art. The storage medium is located in the storage memory, and the processor reads information in the storage memory and combines the hardware to complete the functions required by the units included in the methods, devices and storage media of the embodiments of the present application.

[0092] It should also be understood that the memory mentioned in the embodiments of the present application can be a volatile memory or a non-volatile memory, or can include both volatile and non-volatile memories. Among them, the non-volatile memory can be a read-only memory (ROM), a programmable read-only memory (PROM), an erasable programmable read-only memory (EPROM), an electrically erasable programmable read-only memory (EEPROM) or a flash memory. The volatile memory can be a random access memory (RAM) used as an external cache.

[0093] By way of example, and not limitation, many forms of RAM can be used, such as Static RAM (SRAM), Dynamic RAM (DRAM), Synchronous Dynamic RAM (SDRAM), Double Data Rate SDRAM (DDR SDRAM), Enhanced SDRAM (ESDRAM), SynchBurst DRAM (SLDRAM), and Direct Rambus RAM (DR RAM).

[0094] The memory can also be a read-only memory (ROM), erasable programmable ROM (EPROM), electrically programmable ROM (EEPROM), or flash ROM, or other types of nonvolatile memory, or a combination of these types of memory, but not limited to these. The memory can be independent of the processor, and connected to the processor through a bus. The memory can also be integrated with the processor, and the memory can store programs, and when the programs stored in the memory are executed by the processor, the processor is configured to execute the steps of the method for determining according to the embodiments of the present application.

[0095] It should be noted that when the processor is a general processor, DSP, ASIC, FPGA or other programmable logic device, discrete gate or transistor logic device, discrete hardware component, the memory (storage module) is integrated in the processor. It should be noted that the memory described herein is intended to include, but not limited to, these and any other suitable type of memory.

[0096] It should be understood that the term "and / or" herein is only a description of the association relationship between the associated objects, which means that there can be three relationships, for example, A and / or B can mean that A exists alone, A and B exist together, and B exists alone. In addition, the character " / " herein generally represents an "or" relationship between the associated objects before and after it.

[0097] In the implementation process, each step of the above method can be completed by integrated logic circuit of hardware in the processor or instruction in the form of software. The steps of the method disclosed in combination with the embodiments of the present application can be directly embodied as hardware processor execution completion, or executed by hardware and software module combination in the processor. The software module can be located in the mature storage medium in the field, such as random access memory, flash memory, read-only memory, programmable read-only memory, electrically erasable programmable memory, register, etc. The storage medium is located in the memory, and the processor reads the information in the memory, and combines the hardware to complete the steps of the above method. To avoid repetition, it will not be described in detail here.

[0098] Those of ordinary skill in the art can realize that the various illustrative logical blocks (ILB) and steps described in combination with the embodiments disclosed herein can be implemented by electronic hardware, or a combination of computer software and electronic hardware. Whether the functions are executed in hardware or software depends on the specific application and design constraints of the technical solution. Professional technicians can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of the present application.

[0099] In the above embodiments, all or part can be realized by software, hardware, firmware or any combination thereof. When realized by software, all or part can be realized in the form of a computer programmed program product. The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on the processor, all or part of the processes or functions according to the embodiments of the present application are generated. The computer can be a general-purpose computer, a computer network, or other programmable devices.

[0100] The present embodiment also provides a computer readable storage medium, which stores a computer program, and the computer program enables a computer to execute to realize the above-mentioned array optical waveguide parallelism detection method.

[0101] It should be noted that the computer instructions can be stored in or transferred from one computer-readable storage medium to another computer-readable storage medium, such as from one website site, computer, server or data center to another website site, computer, server or data center, through wired (such as coaxial cable, optical fiber) or wireless (such as infrared, wireless, microwave, etc.) manner, or from a website site, computer, server or data center to a mobile phone processor through a wired manner. The computer-readable storage medium can be any available medium that can be accessed by a computer or a data storage device such as a server, data center, etc. integrated with one or more available media sets. The available media can be a magnetic medium (such as a floppy disk, a hard disk), an optical medium (such as a DVD), or a semiconductor medium (such as a solid-state disk), etc.

[0102] Finally, it should be noted that the above is only the preferred embodiment of the present application and is not intended to limit the present application. Although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent replacements to some technical features, as long as they are within the spirit and principles of the present application. Any modification, equivalent replacement, improvement, etc. made shall be included in the protection scope of the present application.

Claims

1. An arrayed optical waveguide parallelism detection system, comprising: Optical interference thickness measuring device, software control module and algorithm module; characterized in that, The optical interference thickness measuring device comprises an interferometer, a motion platform, an array optical waveguide carrier, an interferometer controller and an upper computer; The interferometer is arranged on the motion platform, the interferometer comprises an interferometer probe, and the array optical wave carrier is provided with a to-be-measured array optical waveguide, and the to-be-measured array optical waveguide is arranged below the interferometer probe; The software control module is electrically connected with the motion platform, and the software control module is used for controlling the motion platform to move along the X axis, the Y axis and the Z axis; The to-be-detected optical waveguide comprises a plurality of laminated sheets, the interferometer measures thickness data of each laminated sheet, and the algorithm module analyzes parallelism data between each semi-transparent semi-reflective surface according to the thickness data.

2. The arrayed optical waveguide parallelism detection system of claim 1, wherein, The interferometer probe and the interferometer controller are connected through an optical fiber, and the interferometer controller and the upper computer communicate through a network port or a USB interface.

3. The arrayed optical waveguide parallelism detection system of claim 2, wherein, The motion platform comprises an X-axis motion module, a Y-axis motion module and a Z-axis motion module, and the Z-axis motion module is used for controlling the working distance between the interferometer probe and the to-be-measured array optical waveguide.

4. The arrayed optical waveguide parallelism detection system of claim 3, wherein, The upper computer, the interferometer controller and the motion platform are electrically connected, and the interferometer controller and the motion platform are synchronously triggered based on the upper computer.

5. The arrayed optical waveguide parallelism detection system of claim 4, wherein, An electric leveling mechanism is arranged on one side of the interferometer probe.

6. A method for arrayed optical waveguide parallelism detection, applied in the system for arrayed optical waveguide parallelism detection according to claim 5, characterized in that, The method comprises the following steps: The interferometer is started and preheated, the upper computer is connected, and the to-be-detected array optical waveguide is placed on the carrier; The working distance between the interferometer probe and the to-be-detected array optical waveguide is adjusted based on the Z-axis module according to the sample thickness; The interferometer probe is leveled based on the feedback of the levelness of the interferometer probe through the electric leveling machine; The light of the interferometer probe is controlled to move to the initial measurement point of the to-be-detected array optical waveguide based on the motion platform; The scanning interval is set, the upper computer controls the motion platform to move to the to-be-measured point, and then synchronously triggers the interferometer to measure the thickness data of each laminated sheet of the to-be-detected array optical waveguide; The parallelism data between each semi-transparent semi-reflective surface is fitted and calculated according to the thickness data.

7. The arrayed optical waveguide parallelism detection system of claim 6, wherein, The process of the array optical waveguide comprises glass substrate cutting, grinding and polishing, film plating, multilayer glass pressing and beveling, wherein the multilayer glass pressing comprises pressing 5-20 layers of glass into an optical waveguide laminated sheet through glue after film plating.

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