Integrated circuit film expanding device and integrated circuit film expanding method

Abstract

The invention discloses an integrated circuit film expanding device and an integrated circuit film expanding method, and belongs to the technical field of integrated circuit manufacturing. The integrated circuit film expanding device comprises a machine body, an edge covering component is arranged on the lower side of a first air cylinder and comprises an electric guide rail arranged on the outer surface of a pressing disc, and a guide block is slidably connected into the electric guide rail; according to the cutting device, the arranged fixing frame is matched with the extrusion block to lock a film strip, then the film strip is rotated to surround the outer edge of a wafer, due to the fact that in the process of cutting the film by the cutting tool, the film strip is cut by the cutting tool, the cutting efficiency is improved, and the cutting efficiency is improved. The extrusion block is matched with the fixing frame to pull the film strip, so that the film strip and the cutting tool rotate synchronously, the outer edge of the wafer is wrapped by the film strip, and surface pollution of the wafer caused by impurities generated in the steps of wire welding, dispensing and curing during subsequent processing of the wafer is avoided.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of integrated circuit manufacturing, and more particularly, to an integrated circuit film expanding device and an integrated circuit film expanding method. BACKGROUND

[0002] The "film expanding" in the field of semiconductor manufacturing is not a standard term, and generally refers to a diffusion process or other film-related processing steps. The commonly used integrated circuit film expanding equipment is a crystal expanding machine, which is also called a wafer stretching machine or a wafer expander. The crystal expanding machine is widely used in the wafer stretching process in the production of light emitting diodes (LEDs), small and medium power triodes, backlights, integrated circuits and some special semiconductor devices. The crystal expanding machine utilizes the plasticity of the LED film under heating, and controls the single LED wafer to uniformly spread to the four directions through the up-down control of the double air cylinders. After the wafer gap is satisfied, the film is automatically formed and the film is tightly stretched without deformation.

[0003] Generally, the crystal expanding is to separate the chips originally arranged closely to a proper distance, so as to facilitate subsequent operations such as die bonding, wire bonding, etc. The subsequent steps after the crystal expanding, such as die bonding, wire bonding, dispensing and curing, etc., can cause pollution to the unedged positions. The materials used in these steps and the residues (such as dust, oil stains, etc.) generated in the process can pollute the surface or edge of the chip. In particular, in the wire bonding step, metal particles or splashes can be generated in the welding process of the metal wire, and these particles can be attached to the unedged position of the chip. In addition, the encapsulation glue used in the dispensing and curing steps can also generate volatile substances or residues in the curing process, which can pollute the surface of the chip. In the prior art, the edging is part of the packaging process, and its main purpose is to enhance the edge strength of the chip, prevent damage, and provide an additional protective layer. However, the edging step is usually performed after the film expanding and other processing steps are completed, and therefore the problem of surface pollution of the integrated circuit caused by the wire bonding, dispensing and curing processes exists. SUMMARY

[0004] In view of the problems in the prior art, the present application aims to provide an integrated circuit film expanding device and an integrated circuit film expanding method, which can realize the wrapping of the outer edge of the wafer by the film strip during the cutting process of the film by the cutting tool, and avoid the surface pollution of the wafer caused by the impurities generated in the wire bonding, dispensing and curing steps during the subsequent processing of the wafer.

[0005] To solve the above problems, the present application adopts the following technical solutions.

[0006] The utility model provides an integrated circuit film expanding device, including the body and the jacking disc of setting body inner surface downside, the upper end of body inner surface both sides are provided with first air cylinder, the telescopic end of first air cylinder left and right is fixedly connected with the pressing frame, the upper center of body inner surface is provided with second air cylinder, the telescopic end of second air cylinder is fixedly connected with the pressing disc, the front side of body is equipped with the controller, the downside of first air cylinder is equipped with the edge part, The edge part includes an electric guide rail provided on the outer surface of the pressing disc, a guide block slidably connected inside the electric guide rail, a cutting tool fixedly connected to the lower side of the guide block, a fixed frame fixedly connected to the right side of the guide block, an active slot opened on the outer surface of the fixed frame, an extrusion block slidably connected inside the left side of the active slot, and an electric push rod provided inside the left side of the active slot and fixedly connected to the left side of the extrusion block.

[0007] Further, the guide block is in the shape of an inverted "L", anti-slip patterns are opened on the right side of the extrusion block and the right side of the interior of the active slot, the diameter of the inner surface of the pressing frame is greater than the diameter of the outer surface of the pressing disc, and the diameter of the jacking disc is greater than the diameter of the pressing disc.

[0008] Further, the upper side of the pressing disc is provided with a material positioning assembly, and the material positioning assembly includes an active seat slidably lapped on the back side of the upper end of the pressing disc.

[0009] Further, a material roller is rotatably connected between the interior of the active seat and the upper side of the pressing disc, a limiting rod is fixedly connected to the back side of the upper end of the pressing disc, the active seat is slidably sleeved on the outer side of the limiting rod, a compression spring is fixedly connected between the outer side of the limiting rod and the upper side of the active seat, an extension block is fixedly connected to the front side of the active seat, a through hole is opened through the front side of the extension block, a pressure sensor is provided on the upper front end of the extension block, and the upper side of the fixed frame is in extrusion contact with the lower side of the pressure sensor after being moved upward.

[0010] Further, the outer side of the pressing frame is provided with a flattening assembly, and the flattening assembly includes a rack fixedly connected to the left and right sides of the pressing frame.

[0011] Further, the lower side of the inner surface of the body is arranged with a plurality of moving grooves in a rectangular array, a transmission member is arranged inside the moving grooves on the left and right sides of the front end, a gear is arranged on the left and right sides of the transmission member, a support is arranged in parallel on the outer side of the transmission member, an extrusion piece is hingedly connected to the opposite surfaces of the left and right supports, the opposite surfaces of the left and right extrusion pieces are in extrusion contact, and the support is in the shape of a "C".

[0012] Further, the transmission member comprises a bidirectional screw rod rotatably connected inside the front moving groove, both ends of the bidirectional screw rod penetrating the machine body, and the opposite surfaces of the left and right gears are fixedly connected with both ends of the bidirectional screw rod, respectively, and the left and right parts outside the bidirectional screw rod are threadedly connected with screw nuts, and the outside of the screw nut is sleeved with a movable sleeve, and the outside of the movable sleeve is fixedly connected with the front side of the lower end of the support, and the outside of the gear is engaged with the front side of the rack.

[0013] Further, the inside and outside of the machine body are provided with a directional component, and the directional component comprises a sliding block fixedly connected to the front side of the lower end of the support.

[0014] Further, the inside of the lower side of the sliding block is rollingly connected with a ball, and the sliding block and the ball are slidably connected inside the back moving groove, and the opposite surfaces of the left and right extrusion pieces are fixedly connected with magnetic strips, and the left and right magnetic strips are magnetically attracted to each other.

[0015] An integrated circuit film expanding method of an integrated circuit film expanding device: S1: the wafer and the film are sequentially passed through the support and placed above the jacking disc, so that the film covers above the wafer, at this time, the extrusion pieces between the two supports are suspended by being attracted to each other through the magnetic strips; S2: after the rack moves downward, the transmission member drives the two supports to move to the left and right sides, respectively, the extrusion pieces contact the film after the two supports are separated, and the film is flattened after moving, then the jacking disc lifts the wafer upward, and the pressing frame stretches the film, finally the second cylinder pushes the pressing disc downward; S3: the movable seat is pulled upward, the material roller with the film strip wound thereon is placed between the pressing frame and the movable seat, the spring of the pressure spring quickly resets the movable seat, then one side of the film strip is pulled out from the through hole in the side of the extension block and pulled into the inside of the movable groove; S4: the electric guide rail drives the guide block and the cutting tool below to cut the film after film expansion, and the fixed frame cooperates with the extrusion block to pull the film strip, so that the film strip surrounds the outer edge of the wafer after the film is cut by the cutting tool.

[0016] Compared with the prior art, the beneficial effects of the present application are: (1) The fixed frame cooperates with the extrusion block to lock the film strip, and then surrounds the outer edge of the wafer after rotating, because the film strip is pulled by the extrusion block and the fixed frame during the cutting process of the cutting tool, the film strip rotates synchronously with the cutting tool, and the outer edge of the wafer is wrapped by the film strip, avoiding the pollution of the wafer surface caused by impurities generated in the welding, dispensing and curing steps during subsequent processing of the wafer.

[0017] (2) The present invention allows for quick replacement of the rollers with the film strips wound around them by setting up a movable seat. Since the film strips can be cut by a cutting tool during the process of wrapping the outer edge of the wafer, and the film strips will be stretched during the process of being pulled, so that the film strips are stretched outward from the center and the outer edge of the wafer. The elasticity of the film strips will wrap the outer edge of the wafer. At the same time, the film strips can be quickly replaced, so that the film strips can continuously wrap the edges of multiple wafers.

[0018] (3) The present invention uses two extrusion plates to flatten the film above the wafer after separation. As the pressing frame moves toward the film, the support works with the extrusion plates to gradually press the film above the wafer and flatten the film at the same time, thus avoiding the formation of air bubbles between the film and the wafer due to wrinkles, thereby ensuring the film expansion quality of the wafer. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure of the present invention; Figure 2 This is a cross-sectional structural schematic diagram of the present invention; Figure 3 This is a schematic diagram of the pressing frame of the present invention; Figure 4 This is a cross-sectional view of the pressing frame of the present invention; Figure 5 This is a schematic diagram of the structure of the movable seat of the present invention; Figure 6 This is a cross-sectional view of the fixing frame of the present invention; Figure 7 This is a partially enlarged schematic diagram of the transmission component of the present invention; Figure 8 This is a partially enlarged schematic diagram of the extrusion sheet of the present invention.

[0020] Explanation of the labels in the diagram: 1. Machine body; 11. Lifting plate; 12. First cylinder; 13. Pressing frame; 14. Second cylinder; 15. Pressing plate; 16. Controller; 2. Hemming components; 21. Electric guide rail; 22. Guide block; 23. Cutting tool; 24. Fixed frame; 25. Movable groove; 26. Extrusion block; 27. Electric push rod; 28. Material fixing assembly; 281. Movable seat; 282. Material roller; 283. Limiting rod; 2 84. Compression spring; 285. Extension block; 286. Through hole; 287. Pressure sensor; 29. ​​Flattening assembly; 291. Rack; 292. Moving groove; 293. Transmission component; 2931. Two-way lead screw; 2932. Lead screw nut; 2933. Movable sleeve; 294. Gear; 295. Bracket; 296. Extrusion plate; 3. Orientation component; 31. Slider; 32. Ball bearing; 33. Magnetic strip. DETAILED DESCRIPTION

[0021] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all the other embodiments obtained by a person of ordinary skill in the art without creative work fall within the protection scope of the present application.

[0022] Please refer to Figures 1 to 8 The integrated circuit film expanding device comprises a body 1, a jacking disc 11 arranged on the lower side of the inner surface of the body 1, first air cylinders 12 arranged on the left and right sides of the upper end of the inner surface of the body 1, a pressing frame 13 fixedly connected to the extension ends of the left and right first air cylinders 12, a second air cylinder 14 arranged at the center of the upper side of the inner surface of the body 1, a pressing disc 15 fixedly connected to the extension end of the second air cylinder 14, a controller 16 arranged on the front side of the body 1, and a trimming part 2 arranged on the lower side of the first air cylinder 12. The trimming part 2 comprises an electric guide rail 21 arranged on the outer surface of the pressing disc 15, a guide block 22 slidably connected to the inside of the electric guide rail 21, a trimming cutter 23 fixedly connected to the lower side of the guide block 22, a fixed frame 24 fixedly connected to the right side of the guide block 22, a movable groove 25 formed on the outer surface of the fixed frame 24, an extrusion block 26 slidably connected to the inside left side of the movable groove 25, and an electric push rod 27 arranged on the inside left side of the movable groove 25 and fixedly connected to the left side of the extrusion block 26.

[0023] The guide block 22 is in the shape of an inverted "L", anti-slip lines are formed on the right side of the extrusion block 26 and the inside right side of the movable groove 25, the diameter of the inner surface of the pressing frame 13 is greater than the diameter of the outer surface of the pressing disc 15, and the diameter of the jacking disc 11 is greater than the diameter of the pressing disc 15.

[0024] By adopting the above technical scheme, the wafer is placed above the jacking disc 11, then the film is covered above the wafer, the film also covers the inner surface of the machine body 1, then the first air cylinder 12 is started to move the pressing frame 13 downward, while the pressing block presses the film, the jacking disc 11 lifts the wafer upward, so that the wafer passes through the inside of the pressing disc 15, the wafer stretches the film in cooperation with the pressing disc 15, at this time the film is in close contact with the upper side of the wafer, then the second air cylinder 14 is started to push the pressing disc 15 downward, when the pressing disc 15 contacts the film, the film can be heated and softened, in the process that the pressing disc 15 contacts the film, the electric guide rail 21 outside the pressing disc 15 drives the guide block 22 to rotate, and the cutting tool 23 below the guide block 22 passes through the film between the pressing frame 13 and the pressing disc 15, then the electric guide rail 21 drives the guide block 22 and the cutting tool 23 to rotate and cut the stretched film, at this time the periphery of the wafer is not wrapped by the film, and in the process that the guide block 22 rotates, the electric push rod 27 inside the fixed frame 24 on the right side of the guide block 22 pushes the extrusion block 26, so that the extrusion block 26 stretches the film strip in cooperation with the movable slot 25, and the film strip locked by the fixed frame 24 wraps the outer edge of the wafer, since the cutting tool 23 cuts the film, the extrusion block 26 stretches the film strip in cooperation with the fixed frame 24, so that the film strip rotates synchronously with the cutting tool 23, and the film strip wraps the outer edge of the wafer, avoiding the surface pollution of the wafer caused by impurities generated in the subsequent processing steps such as soldering, dispensing and curing.

[0025] As shown in Figures 3 to 5 The upper side of the pressing disc 15 is provided with a material setting assembly 28, which includes a movable seat 281 slidingly lapped on the upper end back side of the pressing disc 15.

[0026] A material roller 282 is rotatably connected between the inside of the movable seat 281 and the upper side of the pressing disc 15, a limiting rod 283 is fixedly connected to the upper end back side of the pressing disc 15, the movable seat 281 is slidingly sleeved on the outside of the limiting rod 283, a pressure spring 284 is fixedly connected between the outside of the limiting rod 283 and the upper side of the movable seat 281, an extension block 285 is fixedly connected to the front side of the movable seat 281, a through hole 286 is formed in the front side of the extension block 285, a pressure sensor 287 is arranged on the upper end side of the extension block 285, and the fixed frame 24 moves upward and is in extrusion contact with the lower side of the pressure sensor 287.

[0027] By adopting the above technical scheme, when assembling the film strip, the movable seat 281 is pulled upward, so that the movable seat 281 slides outside the limiting rod 283, and at the same time, the movable seat 281 also extrudes the pressure spring 284 outside the limiting rod 283. After the movable seat 281 is lifted, the material roller 282 around which the film strip is wound is placed between the inside of the movable seat 281 and the upper side of the pressing frame 13, and the material roller 282 is limited. Then, one end of the film strip is inserted through the through hole 286 in the center of the extension block 285 and into the inside of the movable groove 25. With the pressing disc 15 in contact with the film, the fixed frame 24 moves upward relative to the pressing frame 13. At this time, the fixed frame 24 will be in contact with the pressure sensor 287 in front of the extension block 285. Then, the pressure sensor 287 transmits information to the controller 16, and the controller 16 starts the electric push rod 27 to push the extrusion block 26, so that the extrusion block 26 cooperates with the movable groove 25 to extrude one side of the film strip. The film strip that is pulled will drive the material roller 282 to rotate inside the movable seat 281. After the fixed frame 24 rotates one circle, the cutting tool 23 cuts the film strip. The controller 16 controls the electric push rod 27 to pull the extrusion block 26, so that the film strip loses the restriction from the extrusion block 26 and the fixed frame 24. Since the film strip can be cut by the cutting tool 23 during the process of wrapping the wafer outer edge, the film strip will be stretched during the pulling process, so that the film strip is stretched outward from the center to the wafer outer edge. The elasticity of the film strip wraps the outer edge of the wafer, and the film strip can be quickly replaced, so that the film strip can continuously wrap the edges of multiple wafers.

[0028] As shown in Figure 7 and Figure 8 , the outer side of the pressing frame 13 is provided with a flattening assembly 29, and the flattening assembly 29 includes a rack 291 fixedly connected to the left and right sides of the pressing frame 13.

[0029] The lower side of the inner surface of the body 1 is arranged in a rectangular array and is provided with a moving groove 292. The inside of the moving grooves 292 on the left and right sides of the front end is jointly provided with a transmission member 293. The left and right sides of the transmission member 293 are provided with a gear 294. The outer side of the transmission member 293 is provided with a bracket 295 in parallel arrangement. The opposite surfaces of the left and right brackets 295 are hingedly connected with extrusion pieces 296. The opposite surfaces of the left and right extrusion pieces 296 are extruded and contacted. The bracket 295 is in the shape of a "C".

[0030] The transmission member 293 comprises a bidirectional screw rod 2931 rotatably connected inside the front moving groove 292, both ends of the bidirectional screw rod 2931 penetrating through the machine body 1, and opposite faces of the left and right gears 294 are fixedly connected with both ends of the bidirectional screw rod 2931 respectively, and both sides of the bidirectional screw rod 2931 are threadedly connected with screw nuts 2932, the outer side of the screw nut 2932 is sleeved with a movable sleeve 2933, and the outer side of the movable sleeve 2933 is fixedly connected with the front side of the lower end of the bracket 295, and the outer side of the gear 294 is engaged with the front side of the rack 291.

[0031] By adopting the above technical scheme, when the pressing frame 13 moves downward, the rack 291 on both sides of the pressing frame 13 will be engaged with the gear 294 at both ends of the bidirectional screw rod 2931, so that during the downward movement of the pressing frame 13, the gear 294 will drive the bidirectional screw rod 2931 to rotate inside the two moving grooves 292 on the front side, and at the same time, the two screw nuts 2932 on the outer side of the bidirectional screw rod 2931 will start to move according to the screw thread track on the outer side of the bidirectional screw rod 2931, and the two screw thread directions of the bidirectional screw rod 2931 are opposite, so that the two screw nuts 2932 originally close to each other gradually move away, and drive the movable sleeve 2933 on the outer side to slide inside the moving groove 292, and in this process, because the movable sleeve 2933 is fixed with the bracket 295, and the two brackets 295 are hingedly connected with the pressing piece 296, so that during the separation of the two brackets 295, the pressing piece 296 will also move together, and the film above the wafer will be flattened, and after the pressing frame 13 contacts with the film, the bracket 295 and the pressing piece 296 will be located in the recess on both sides of the pressing frame 13, and because the pressing frame 13 moves towards the film, the bracket 295 cooperates with the pressing piece 296 to gradually press the film above the wafer, and at the same time, the film is flattened, avoiding that the film is wrinkled to cause bubbles between the film and the wafer, thereby ensuring the film quality of the wafer.

[0032] As shown in Figure 2 , Figure 7 and Figure 8 , the inner and outer sides of the machine body 1 are provided with a directional component 3, and the directional component 3 comprises a sliding block 31 fixedly connected with the front side of the lower end of the bracket 295.

[0033] The lower side of the sliding block 31 is internally rollingly connected with a ball 32, and the sliding block 31 and the ball 32 are slidingly connected and jointly slidingly connected inside the back moving groove 292, and opposite faces of the left and right pressing pieces 296 are fixedly connected with magnetic strips 33, and the left and right magnetic strips 33 are magnetically attracted to each other.

[0034] By adopting the above technical scheme, when the wafer and the film are placed above the lifting disc 11, the two extrusion pieces 296 are in a suspended state due to the two magnetically attracted magnetic strips 33 arranged between the two extrusion pieces 296, and the wafer and the film can easily pass below the support 295 and the extrusion piece 296, when the two supports 295 gradually move away, the two magnetic strips 33 will also be separated, so that the extrusion piece 296 is turned downward due to its own weight and directly presses above the film, and after the support 295 moves, the slider 31 below the support 295 will slide in the other two moving grooves 292 through the ball 32 and support the support 295, since the two extrusion pieces 296 are kept in a suspended state by the adsorption of the magnetic strips 33 when the support 295 is not moved, the wafer and the film can be smoothly spread, and the extrusion piece 296 is in contact with the film after the support 295 moves, and the film is flattened after moving, so as to guarantee the film expansion efficiency of the wafer.

[0035] An integrated circuit film expansion method of an integrated circuit film expansion device: S1: the wafer and the film pass through the support 295 in the order and are placed above the lifting disc 11, so that the film covers above the wafer, at this time, the extrusion piece 296 between the two supports 295 is suspended by the mutual adsorption of the magnetic strips 33; S2: after the rack 291 moves downward, the two supports 295 are driven to move to the left and right sides respectively by the transmission member 293, the extrusion piece 296 contacts the film after the two supports 295 are separated, and the film is flattened after moving, then the wafer is lifted upward by the lifting disc 11, the film is stretched by the pressing frame 13, and finally the pressing disc 15 is pushed downward by the second cylinder 14; S3: the movable seat 281 is pulled upward, the material roller 282 with the film strip wound thereon is placed between the pressing frame 13 and the movable seat 281, the spring of the pressure spring 284 quickly resets the movable seat 281, then one side of the film strip is pulled out from the through hole 286 on the side of the extension block 285 and pulled into the movable groove 25; S4: the guide block 22 and the cutting tool 23 below the guide block 22 are driven by the electric guide rail 21 to cut the film after film expansion, and the fixed frame 24 cooperates with the extrusion block 26 to pull the film strip, so that the film strip surrounds the outer edge of the wafer after the film is cut by the cutting tool 23.

[0036] Working principle: the wafer is placed above the lifting disc 11, then the first cylinder 12 is started to move the pressing frame 13 downwards, the rack 291 on both sides of the pressing frame 13 is engaged with the gear 294 at both ends of the bidirectional screw rod 2931, and the two supports 295 are pulled to both sides by the transmission member 293, when the two supports 295 are separated, the magnetic strip 33 between the two pressing pieces 296 is separated, so that the pressing pieces 296 contact the film due to the weight and flatten the film above the wafer, after the pressing frame 13 contacts the film, the lifting disc 11 lifts the wafer upwards, the wafer stretches the film with the pressing disc 15, then the second cylinder 14 is started to push the pressing disc 15 downwards, and the film is softened by heating, after stretching, the electric guide rail 21 drives the guide block 22 and the cutting tool 23 to rotate, the cutting tool 23 cuts the stretched film, before film expansion, the movable seat 281 is pulled upwards, then the material roller 282 with the film strip wound thereon is put into the movable seat 281 inside and between the upper side of the pressing frame 13, then one end of the film strip is inserted through the hole 286 in the center of the extension block 285 and sent into the inside of the movable groove 25, if the fixed frame 24 contacts the pressure sensor 287 on the front side of the extension block 285, the controller 16 starts the electric push rod 27 to push the pressing block 26, then the movable groove 25 presses one side of the film strip, after one rotation, it is wrapped around the outer edge of the wafer, and finally cut by the cutting tool 23.

[0037] The above merely describes the preferred embodiments of the present application; however, the protection scope of the present application is not limited to this. Any person skilled in the art, according to the technical solution and the improvement concept of the present application, makes equivalent replacement or change within the technical range disclosed by the present application, should be covered within the protection scope of the present application.

Claims

1. An integrated circuit film expansion device, comprising a body (1) and a lifting plate (11) disposed on the lower side of the inner surface of the body (1), wherein first cylinders (12) are disposed on both the left and right sides of the upper end of the inner surface of the body (1), and the telescopic ends of the left and right first cylinders (12) are fixedly connected to a pressing frame (13), and a second cylinder (14) is disposed at the center of the upper side of the inner surface of the body (1), and the telescopic end of the second cylinder (14) is fixedly connected to a pressing plate (15), and a controller (16) is disposed on the front side of the body (1), characterized in that: The lower side of the first cylinder (12) is provided with a hemming component (2); The hemming component (2) comprises an electric guide rail (21) arranged on the outer surface of the pressing disc (15), the inside of the electric guide rail (21) is slidably connected with a guide block (22), the lower side of the guide block (22) is fixedly connected with a cutting tool (23), the right side of the guide block (22) is fixedly connected with a fixed frame (24), the outer surface of the fixed frame (24) is provided with a movable groove (25), the inside left side of the movable groove (25) is slidably connected with an extrusion block (26), and the inside left side of the movable groove (25) is provided with an electric push rod (27), and the telescopic end of the electric push rod (27) is fixedly connected with the left side of the extrusion block (26).

2. The integrated circuit film expanding device according to claim 1, characterized by: The guide block (22) is in inverted "L" shape, anti-skid lines are arranged on the right side of the extrusion block (26) and the inside right side of the movable groove (25), the diameter of the inner surface of the pressing frame (13) is larger than that of the outer surface of the pressing disc (15), and the diameter of the jacking disc (11) is larger than that of the pressing disc (15).

3. The integrated circuit film expanding device of claim 1, wherein: The upper side of the pressing disc (15) is provided with a material positioning assembly (28), and the material positioning assembly (28) comprises a movable seat (281) slidably connected on the back side of the upper end of the pressing disc (15).

4. The integrated circuit film expanding device according to claim 3, wherein: A material roller (282) is rotatably connected between the inside of the movable seat (281) and the upper side of the pressing disc (15), a limiting rod (283) is fixedly connected to the back side of the upper end of the pressing disc (15), the movable seat (281) is slidably sleeved on the outside of the limiting rod (283), a pressure spring (284) is fixedly connected between the outside of the limiting rod (283) and the upper side of the movable seat (281), an extension block (285) is fixedly connected to the front side of the movable seat (281), a through hole (286) is formed in the front side of the extension block (285), a pressure sensor (287) is arranged on the upper front end of the extension block (285), and the fixed frame (24) is in extrusion contact with the lower side of the pressure sensor (287) after being moved upward.

5. The integrated circuit bumping device of claim 1, wherein: The outer side of the pressing frame (13) is provided with a flattening assembly (29), and the flattening assembly (29) comprises a rack (291) fixedly connected to the left and right sides of the pressing frame (13).

6. The integrated circuit film expanding device according to claim 5, wherein: The lower side of the inner surface of the machine body (1) is arranged in a rectangular array and provided with a moving groove (292), and the inside of the moving groove (292) located at the front end of the left and right sides is commonly provided with a transmission member (293), the left and right sides of the transmission member (293) are provided with a gear (294), the outer side of the transmission member (293) is arranged in parallel and provided with a bracket (295), the opposite surfaces of the left and right brackets (295) are hingedly connected with extrusion pieces (296), the opposite surfaces of the left and right extrusion pieces (296) are in extrusion contact, and the bracket (295) is in "C" shape.

7. The integrated circuit bumping device of claim 6, wherein: The transmission member (293) comprises a bidirectional screw rod (2931) rotatably connected inside the front moving groove (292), both ends of the bidirectional screw rod (2931) penetrate through the machine body (1), and the opposite surfaces of the left and right gear wheels (294) are fixedly connected with both ends of the bidirectional screw rod (2931) respectively, the left and right parts outside the bidirectional screw rod (2931) are threadedly connected with screw nuts (2932), the outside of the screw nut (2932) is sleeved with a movable sleeve (2933), and the outside of the movable sleeve (2933) is fixedly connected with the front side of the lower end of the support (295); and the outside of the gear wheel (294) is engaged with the front side of the rack (291).

8. The integrated circuit bumping device of claim 6, wherein: The inside and outside of the machine body (1) are provided with a directional component (3) together, the directional component (3) comprises a sliding block (31) fixedly connected with the front side of the lower end of the support (295).

9. The integrated circuit bumping device of claim 8, wherein: The inside of the lower side of the sliding block (31) is rollingly connected with a ball (32), and the sliding block (31) and the ball (32) are slidably connected together and are slidably connected inside the back moving groove (292); the opposite surfaces of the left and right extrusion pieces (296) are fixedly connected with magnetic strips (33), and the left and right magnetic strips (33) are magnetically attracted to each other.

10. An integrated circuit expansion method for use with the integrated circuit expansion apparatus of any one of claims 1-9, wherein, The method comprises the following steps: S1: the wafer and the film are arranged in the order of the support (295) and above the jacking disc (11), so that the film covers above the wafer, and at this time, the extrusion pieces (296) between the two supports (295) are suspended by the magnetic attraction between the magnetic strips (33); S2: the rack (291) is moved downward to drive the two supports (295) to move to the left and right sides respectively through the transmission member (293), the extrusion pieces (296) are in contact with the film after the two supports (295) are separated, and the film is flattened after moving, then the jacking disc (11) lifts the wafer upward to stretch the film through the pressing frame (13), and finally the pressing disc (15) is pushed downward by the second cylinder (14); S3: the movable seat (281) is pulled upward, the material roller (282) wound with the film strip is arranged between the pressing frame (13) and the movable seat (281), the spring of the pressure spring (284) quickly resets the movable seat (281), then one side of the film strip is pulled out from the through hole (286) on the side of the extension block (285) and pulled into the inside of the movable groove (25); S4: the electric guide rail (21) drives the guide block (22) and the cutting tool (23) below the guide block (22) to cut the film after film expansion, and the fixed frame (24) drives the extrusion block (26) to pull the film strip, so that the film strip surrounds the outer edge of the wafer after the film is cut by the cutting tool (23).

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