High-power-density PCB stator winding structure and wiring method thereof, motor and miniature fan

By employing a six-layer circular PCB coil board and a specific winding method in the micro fan, the problems of low coil utilization and large electromagnetic torque fluctuations were solved, achieving a micro fan design with high power density and stable operation.

CN120915031APending Publication Date: 2025-11-07东莞市鸿盈电子科技有限公司
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Patent Information

Application Number
CN202510996460.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-07-18
Publication Date
2025-11-07

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Abstract

The invention discloses a high-power-density PCB stator winding structure and a wiring method thereof, a motor and a miniature fan, the wiring method of the high-power-density PCB stator is reasonable, the appearance of a PCB coil board is designed to be circular so as to avoid interference with other parts, and structural design is facilitated; each layer is printed with six 2D printing coils in a circle center symmetry mode to form six windings, the windings are of a centralized winding topological structure with the 120-degree electrical angle, connection of the 2D printing coils of the same layer or different layers of the same phase is achieved through ingenious connection logic, windings U1, V1, W1, U2, V2 and W2 are formed, two windings with the mechanical angle of 180 degrees form one phase, and then U, V and W three-phase windings are formed. The space utilization rate is increased, the power is increased, the problem of large electromagnetic torque fluctuation is effectively solved, and the operation stability is good; and the whole structure is simple, so that the motor or the miniature fan is more compact and light.
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Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of stator, in particular to a high-power-density PCB stator winding structure, a wiring method thereof, a motor and a micro fan. BACKGROUND

[0002] With the development of intelligent terminals such as notebook computers, tablet computers, mobile phones and other products in the direction of light and thin, the fan used for heat dissipation of terminal products is also thinner and thinner, and how to further compress the size of the micro fan poses a great challenge to the fan industry. One of the solutions is to use a micro fan with a PCB stator winding.

[0003] The overall shape of the existing PCB stator winding PCB board is mostly non-circular structure, that is, the outer periphery has a protruding structure, which can only be embedded with the base, and once the protruding structure protrudes on the base, it will interfere with the rotor. Moreover, the coil area utilization rate of the PCB board is relatively low, and even the positions of the coils are not symmetrical and the shapes are not consistent, resulting in large electromagnetic torque fluctuation. SUMMARY

[0004] In view of the above problems, the present application aims to provide a high-power-density PCB stator winding structure, a wiring method thereof, a motor and a micro fan.

[0005] To achieve the above-mentioned purpose, the technical solution provided by the present application is as follows:

[0006] A high-power-density PCB stator wiring method, the PCB coil board is six layers, the PCB coil board is circular, each layer is circularly symmetric and printed with six 2D printed coils with substantially the same shape to form six windings, one end of the 2D printed coil forms an outer end of the winding on the outside, and the other end is spirally wound to the inside of the geometric center to form an inner end of the winding.

[0007] S1, winding U1: arranging the head wire of winding U1 on the first layer to form the head end of U phase, and then connecting according to the following winding method and interlayer sequence;

[0008] 1.1 First layer: the winding of the first layer is wound from the outside to the inside, and the inner end of the winding of the first layer is connected in series to the inner end of the winding located in the second layer through the internal interlayer via hole;

[0009] 1.2 Second layer: the winding of the second layer is wound from the inside to the outside, and the outer end of the winding of the second layer is connected in series to the outer end of the winding located in the third layer through the external interlayer via hole;

[0010] 1.3 Third layer: the winding of the third layer is wound from the outside to the inside, and the inner end of the winding of the third layer is connected in series to the inner end of the winding located in the fifth layer through the internal interlayer via hole;

[0011] 1.4 The fifth layer: the winding of the fifth layer is wound from inside to outside, the outer end of the winding of the fifth layer is connected in series to the outer end of the winding located in the sixth layer through the outer interlayer via;

[0012] 1.5 The sixth layer: the winding of the sixth layer is wound from outside to inside, the inner end of the winding of the sixth layer is connected in series to the inner end of the winding located in the fourth layer through the inner interlayer via;

[0013] 1.7 The fourth layer: the winding of the fourth layer is wound from inside to outside, the outer end of the winding of the fourth layer is connected in series to the winding U2 through the same layer cross-line;

[0014] S2, winding the winding U2: arranging the head wire of the winding U2 in the fourth layer for connecting with the outer end of the winding located in the fourth layer in the winding U1, and then connecting in the following winding method and interlayer sequence;

[0015] 2.1 The fourth layer: the winding of the fourth layer is wound from outside to inside, the inner end of the winding of the fourth layer is connected in series to the inner end of the winding located in the sixth layer through the inner interlayer via;

[0016] 2.2 The sixth layer: the winding of the sixth layer is wound from inside to outside, the outer end of the winding of the sixth layer is connected in series to the outer end of the winding located in the fifth layer through the outer interlayer via;

[0017] 2.3 The fifth layer: the winding of the fifth layer is wound from outside to inside, the inner end of the winding of the fifth layer is connected in series to the inner end of the winding located in the third layer through the inner interlayer via;

[0018] 2.4 The third layer: the winding of the third layer is wound from inside to outside, the outer end of the winding of the third layer is connected in series to the outer end of the winding located in the first layer through the outer interlayer via;

[0019] 2.5 The first layer: the winding of the first layer is wound from outside to inside, the inner end of the winding of the first layer is connected in series to the inner end of the winding located in the second layer through the inner interlayer via;

[0020] 2.6 The second layer: the winding of the second layer is wound from inside to outside, the outer end of the winding of the second layer forms the tail end of the U phase;

[0021] S3, winding the winding V1: arranging the head wire of the winding V1 in the first layer to form the head end of the V phase, and then connecting in the following winding method and interlayer sequence;

[0022] 3.1 The first layer: the winding of the first layer is wound from outside to inside, the inner end of the winding of the first layer is connected in series to the inner end of the winding located in the second layer through the inner interlayer via;

[0023] 3.2 The second layer: the winding of the second layer is wound from inside to outside, the outer end of the winding of the second layer is connected in series to the outer end of the winding located in the third layer through the outer interlayer via;

[0024] 3.3 Third layer: The winding of the third layer is wound from outside to inside, and the inner end of the winding of the third layer is connected in series to the inner end of the winding located in the fourth layer through the internal interlayer via;

[0025] 3.4 Fourth layer: The winding of the fourth layer is wound from inside to outside, and the outer end of the winding of the fourth layer is connected in series to the outer end of the winding located in the sixth layer through the external interlayer via;

[0026] 3.5 Sixth layer: The winding of the sixth layer is wound from outside to inside, and the inner end of the winding of the sixth layer is connected in series to the inner end of the winding located in the fifth layer through the internal interlayer via;

[0027] 3.7 Fifth layer: The winding of the fifth layer is wound from inside to outside, and the outer end of the winding of the fifth layer is connected in series with the winding V2 through the same-layer cross-line;

[0028] S4, winding the winding V2: arranging the head wire of the winding V2 in the fifth layer for connection with the outer end of the winding located in the fifth layer in the winding V1, and then connecting in the following winding method and interlayer sequence;

[0029] 4.1 Fifth layer: The winding of the fifth layer is wound from outside to inside, and the inner end of the winding of the fifth layer is connected in series to the inner end of the winding located in the sixth layer through the internal interlayer via;

[0030] 4.2 Sixth layer: The winding of the sixth layer is wound from inside to outside, and the outer end of the winding of the sixth layer is connected in series to the outer end of the winding located in the fourth layer through the external interlayer via;

[0031] 4.3 Fourth layer: The winding of the fourth layer is wound from outside to inside, and the inner end of the winding of the fourth layer is connected in series to the inner end of the winding located in the third layer through the internal interlayer via;

[0032] 4.4 Third layer: The winding of the third layer is wound from inside to outside, and the outer end of the winding of the third layer is connected in series to the outer end of the winding located in the first layer through the external interlayer via;

[0033] 4.5 First layer: The winding of the first layer is wound from outside to inside, and the inner end of the winding of the first layer is connected in series to the inner end of the winding located in the second layer through the internal interlayer via;

[0034] 4.6 Second layer: The winding of the second layer is wound from inside to outside, and the outer end of the winding of the second layer forms the tail end of the W phase;

[0035] S5, winding the winding W1: arranging the head wire of the winding W1 in the first layer to form the head end of the W phase, and then connecting in the following winding method and interlayer sequence;

[0036] 5.1 First layer: the winding of the first layer is wound from outside to inside, the inner end of the winding of the first layer is connected in series to the inner end of the winding located in the second layer through the inner interlayer via;

[0037] 5.2 Second layer: the winding of the second layer is wound from inside to outside, the outer end of the winding of the second layer is connected in series to the outer end of the winding located in the third layer through the outer interlayer via;

[0038] 5.3 Third layer: the winding of the third layer is wound from outside to inside, the inner end of the winding of the third layer is connected in series to the inner end of the winding located in the fourth layer through the inner interlayer via;

[0039] 5.4 Fifth layer: the winding of the fifth layer is wound from inside to outside, the outer end of the winding of the fifth layer is connected in series to the outer end of the winding located in the sixth layer through the outer interlayer via;

[0040] 5.5 Fourth layer: the winding of the fourth layer is wound from outside to inside, the inner end of the winding of the fourth layer is connected in series to the inner end of the winding located in the sixth layer through the inner interlayer via;

[0041] 5.7 Sixth layer: the winding of the sixth layer is wound from inside to outside, the outer end of the winding of the sixth layer is connected in series to the winding W2 through the same layer cross-line;

[0042] S6, winding the winding W2: arranging the head line of the winding W2 in the sixth layer, for connecting with the outer end of the winding located in the fifth layer in the winding W1, and then connecting in the following winding method and interlayer sequence;

[0043] 6.1 Sixth layer: the winding of the sixth layer is wound from outside to inside, the inner end of the winding of the sixth layer is connected in series to the inner end of the winding located in the fourth layer through the inner interlayer via;

[0044] 6.2 Fourth layer: the winding of the fourth layer is wound from inside to outside, the outer end of the winding of the fourth layer is connected in series to the outer end of the winding located in the fifth layer through the outer interlayer via;

[0045] 6.3 Fifth layer: the winding of the fifth layer is wound from outside to inside, the inner end of the winding of the fifth layer is connected in series to the inner end of the winding located in the third layer through the inner interlayer via;

[0046] 6.4 Third layer: the winding of the third layer is wound from inside to outside, the outer end of the winding of the third layer is connected in series to the outer end of the winding located in the first layer through the outer interlayer via;

[0047] 6.5 First layer: the winding of the first layer is wound from outside to inside, the inner end of the winding of the first layer is connected in series to the inner end of the winding located in the second layer through the inner interlayer via;

[0048] 6.6 Second layer: the winding of the second layer is wound from inside to outside, the outer end of the winding of the second layer forms the tail end of the W phase;

[0049] Wherein, the steps S1, S3 and S5 have no sequence; the head and tail of the U-phase, V-phase and W-phase can be exchanged by reverse winding connection.

[0050] As a preferred scheme of the present application, the 2D printed coil has an isosceles trapezoidal shape, wherein the upper base is close to the center of the PCB coil board, the upper base and the two sides are straight lines, and the lower base is a circular arc line, and the center of the circular arc line is not coincident with the center of the PCB coil board. The center of the circular arc line is not coincident with the center of the PCB coil board to generate the necessary torque.

[0051] As a preferred scheme of the present application, the connection between the upper base and the two sides adopts an outer chamfer transition, the connection between the lower base and the two sides adopts an inner chamfer transition, and the positions between the outer chamfers of the two adjacent 2D printed coils form six outer triangular areas on the PCB coil board, and the positions between the inner chamfers of the two adjacent 2D printed coils form six inner triangular areas on the PCB coil board. The outer triangular areas and the inner triangular areas provide reasonable space for the subsequent pad and via hole setting, facilitate the connection and layout of the lines, have high space utilization, and improve the compactness of the structure.

[0052] As a preferred scheme of the present application, each outer triangular area is provided with two outer interlayer vias, and each inner triangular area is provided with three inner interlayer vias. Reasonable positions of the outer interlayer vias and the inner interlayer vias can further improve the space utilization and have good compactness of the structure.

[0053] As a preferred scheme of the present application, the PCB coil board is provided with at least four pads at the positions of the outer triangular areas. The pads are set in the outer triangular areas and serve as connection points. The space is fully utilized, the PCB space is saved, the pads do not occupy extra space to affect the winding layout and the compactness of the overall structure of the motor, and the production and processing and the subsequent line connection operation are facilitated.

[0054] As a preferred scheme of the present application, the inner interlayer via or the outer interlayer via is connected only with two 2D printed coils. This connection mode improves the reliability and accuracy of the connection, reduces the complexity and potential failure points caused by too many coils connected by the via, and is beneficial to improving the yield rate of the motor and the long-term operation stability.

[0055] As a preferred scheme of the present application, the line spacing in the 2D printed coil is the same as the spacing between the two adjacent 2D printed coils on the same layer.

[0056] A high-power-density PCB stator winding structure is prepared by using the high-power-density PCB stator connection method.

[0057] A motor comprising the high power density PCB stator winding structure.

[0058] A micro fan comprising the high power density PCB stator winding structure.

[0059] The high power density PCB stator winding method of the present application is reasonable, the shape of the PCB coil plate is designed as a circle to avoid interference with other components, facilitating the structural design; each layer is circularly symmetric and printed with six 2D printed coils with approximately the same shape to form six windings, the windings adopt a concentrated winding topology with an electrical angle of 120°, the 2D printed coils of the same phase on the same layer or different layers are connected through a clever connection logic to form windings U1, windings V1, windings W1, windings U2, windings V2, windings W2, and two windings with a mechanical angle of 180° constitute a phase, and then form U, V and W three-phase windings, which not only improves the space utilization rate, but also effectively solves the problem of large electromagnetic torque fluctuation and improves the operation stability; moreover, the shape of the 2D printed coil is approximately isosceles trapezoidal, the upper base and the two waist edges are straight lines, and the lower base is a circular arc line, the layout is compact, the coil density is high, the area utilization rate is effectively improved, and the power is increased; in addition, the high power density PCB stator winding structure is applied to a motor or a micro fan, which can effectively optimize the overall structural layout, make the motor or micro fan more compact and light.

[0060] The present application is further described below in conjunction with the drawings and examples. BRIEF DESCRIPTION OF DRAWINGS

[0061] Figure 1 is a structural schematic diagram of embodiment 1 of the present application.

[0062] Figure 2 is a first layer structural schematic diagram of embodiment 1 of the present application.

[0063] Figure 3 is a second layer structural schematic diagram of embodiment 1 of the present application.

[0064] Figure 4 is a third layer structural schematic diagram of embodiment 1 of the present application.

[0065] Figure 5 is a fourth layer structural schematic diagram of embodiment 1 of the present application.

[0066] Figure 6 is a fifth layer structural schematic diagram of embodiment 1 of the present application.

[0067] Figure 7 is a sixth layer structural schematic diagram of embodiment 1 of the present application.

[0068] Figure 8is a sectional structure schematic diagram of embodiment 2 of the present application.

[0069] Figure 9 is a disassembly structure schematic diagram of embodiment 2 of the present application.

[0070] Figure 10 is a sectional structure schematic diagram of embodiment 3 of the present application.

[0071] Figure 11 is a disassembly structure schematic diagram of embodiment 3 of the present application.

[0072] Figure 12 is a torque waveform diagram of the present application selected from a 6-slot 4-pole structure.

[0073] Figure 13 is a power waveform diagram of the present application selected from a 6-slot 4-pole structure.

[0074] Figure 14 is a torque waveform diagram of the present application selected from a 6-slot 8-pole structure.

[0075] Figure 15 is a power waveform diagram of the present application selected from a 6-slot 8-pole structure. DETAILED DESCRIPTION

[0076] Embodiment 1, see Figures 1 to 7 The embodiment provides a high-power-density PCB stator wiring method, the PCB coil plate is six layers, the six layers are arranged to ensure that the motor performance is improved, meanwhile, the feasibility of the production process and the cost control are considered, compared with more layers of design, the six-layer structure is relatively easier to process and manufacture, and the coil density and size requirements of the micro fan motor can be effectively met. The PCB coil plate 1 is circular, six 2D printed coils with approximately same shape are printed in the center of the circle to form six windings, one end of the 2D printed coil 2 forms an outer end of the winding outside, and the other end is spirally wound to the inside of the geometric center to form an inner end of the winding; the 2D printed coil 2 adopts a spiral coil printing method, so that the space of the PCB coil plate 1 can be fully utilized, the coil area utilization rate is improved, the effective conductor length is increased, and then the electromagnetic performance and power density of the motor are improved. The high-power-density PCB stator wiring method is as follows:

[0077] S1, winding the winding U1: arranging the head wire of the winding U1 on the first layer to form the head end of the U phase, and then connecting according to the following winding method and interlayer sequence;

[0078] 1.1 first layer: the winding of the first layer is wound from the outside to the inside, and the inner end of the winding of the first layer is connected to the inner end of the winding located on the second layer through the internal interlayer via;

[0079] 1.2 Second layer: The winding of the second layer is wound from inside to outside, and the outer end of the winding of the second layer is connected in series to the outer end of the winding located in the third layer through the outer interlayer via;

[0080] 1.3 Third layer: The winding of the third layer is wound from outside to inside, and the inner end of the winding of the third layer is connected in series to the inner end of the winding located in the fifth layer through the inner interlayer via;

[0081] 1.4 Fifth layer: The winding of the fifth layer is wound from inside to outside, and the outer end of the winding of the fifth layer is connected in series to the outer end of the winding located in the sixth layer through the outer interlayer via;

[0082] 1.5 Sixth layer: The winding of the sixth layer is wound from outside to inside, and the inner end of the winding of the sixth layer is connected in series to the inner end of the winding located in the fourth layer through the inner interlayer via;

[0083] 1.7 Fourth layer: The winding of the fourth layer is wound from inside to outside, and the outer end of the winding of the fourth layer is connected in series to the winding U2 through the same layer cross-line;

[0084] S2, winding winding U2: The head wire of winding U2 is arranged in the fourth layer for connection with the outer end of the winding located in the fourth layer in winding U1, and then connected in the following winding method and interlayer sequence;

[0085] 2.1 Fourth layer: The winding of the fourth layer is wound from outside to inside, and the inner end of the winding of the fourth layer is connected in series to the inner end of the winding located in the sixth layer through the inner interlayer via;

[0086] 2.2 Sixth layer: The winding of the sixth layer is wound from inside to outside, and the outer end of the winding of the sixth layer is connected in series to the outer end of the winding located in the fifth layer through the outer interlayer via;

[0087] 2.3 Fifth layer: The winding of the fifth layer is wound from outside to inside, and the inner end of the winding of the fifth layer is connected in series to the inner end of the winding located in the third layer through the inner interlayer via;

[0088] 2.4 Third layer: The winding of the third layer is wound from inside to outside, and the outer end of the winding of the third layer is connected in series to the outer end of the winding located in the first layer through the outer interlayer via;

[0089] 2.5 First layer: The winding of the first layer is wound from outside to inside, and the inner end of the winding of the first layer is connected in series to the inner end of the winding located in the second layer through the inner interlayer via;

[0090] 2.6 Second layer: The winding of the second layer is wound from inside to outside, and the outer end of the winding of the second layer forms the tail end of the U phase;

[0091] S3, winding winding V1: The head wire of winding V1 is arranged in the first layer to form the head end of the V phase, and then connected in the following winding method and interlayer sequence;

[0092] 3.1 First layer: the winding of the first layer is wound from outside to inside, the inner end of the winding of the first layer is connected in series to the inner end of the winding located in the second layer through the inner interlayer via;

[0093] 3.2 Second layer: the winding of the second layer is wound from inside to outside, the outer end of the winding of the second layer is connected in series to the outer end of the winding located in the third layer through the outer interlayer via;

[0094] 3.3 Third layer: the winding of the third layer is wound from outside to inside, the inner end of the winding of the third layer is connected in series to the inner end of the winding located in the fourth layer through the inner interlayer via;

[0095] 3.4 Fourth layer: the winding of the fourth layer is wound from inside to outside, the outer end of the winding of the fourth layer is connected in series to the outer end of the winding located in the sixth layer through the outer interlayer via;

[0096] 3.5 Sixth layer: the winding of the sixth layer is wound from outside to inside, the inner end of the winding of the sixth layer is connected in series to the inner end of the winding located in the fifth layer through the inner interlayer via;

[0097] 3.7 Fifth layer: the winding of the fifth layer is wound from inside to outside, the outer end of the winding of the fifth layer is connected in series to the winding V2 through the same-layer cross-line;

[0098] S4, winding the winding V2: arranging the head line of the winding V2 in the fifth layer for connecting with the outer end of the winding located in the fifth layer in the winding V1, and then connecting according to the following winding method and interlayer sequence;

[0099] 4.1 Fifth layer: the winding of the fifth layer is wound from outside to inside, the inner end of the winding of the fifth layer is connected in series to the inner end of the winding located in the sixth layer through the inner interlayer via;

[0100] 4.2 Sixth layer: the winding of the sixth layer is wound from inside to outside, the outer end of the winding of the sixth layer is connected in series to the outer end of the winding located in the fourth layer through the outer interlayer via;

[0101] 4.3 Fourth layer: the winding of the fourth layer is wound from outside to inside, the inner end of the winding of the fourth layer is connected in series to the inner end of the winding located in the third layer through the inner interlayer via;

[0102] 4.4 Third layer: the winding of the third layer is wound from inside to outside, the outer end of the winding of the third layer is connected in series to the outer end of the winding located in the first layer through the outer interlayer via;

[0103] 4.5 First layer: the winding of the first layer is wound from outside to inside, the inner end of the winding of the first layer is connected in series to the inner end of the winding located in the second layer through the inner interlayer via;

[0104] 4.6 Second layer: the winding of the second layer is wound from inside to outside, the outer end of the winding of the second layer forms the tail end of the V-phase;

[0105] S5, winding the winding W1: the head wire of the winding W1 is arranged in the first layer to form the head end of the W phase, and then connected according to the following winding method and interlayer sequence;

[0106] 5.1 first layer: the winding of the first layer is wound from outside to inside, and the inner end of the winding of the first layer is connected in series to the inner end of the winding located in the second layer through the internal interlayer via hole;

[0107] 5.2 second layer: the winding of the second layer is wound from inside to outside, and the outer end of the winding of the second layer is connected in series to the outer end of the winding located in the third layer through the external interlayer via hole;

[0108] 5.3 third layer: the winding of the third layer is wound from outside to inside, and the inner end of the winding of the third layer is connected in series to the inner end of the winding located in the fourth layer through the internal interlayer via hole;

[0109] 5.4 fifth layer: the winding of the fifth layer is wound from inside to outside, and the outer end of the winding of the fifth layer is connected in series to the outer end of the winding located in the sixth layer through the external interlayer via hole;

[0110] 5.5 fourth layer: the winding of the fourth layer is wound from outside to inside, and the inner end of the winding of the fourth layer is connected in series to the inner end of the winding located in the sixth layer through the internal interlayer via hole;

[0111] 5.7 sixth layer: the winding of the sixth layer is wound from inside to outside, and the outer end of the winding of the sixth layer is connected in series to the winding W2 through the same layer cross-wire;

[0112] S6, winding the winding W2: the head wire of the winding W2 is arranged in the sixth layer, which is connected to the outer end of the winding in the fifth layer in the winding W1, and then connected according to the following winding method and interlayer sequence;

[0113] 6.1 sixth layer: the winding of the sixth layer is wound from outside to inside, and the inner end of the winding of the sixth layer is connected in series to the inner end of the winding located in the fourth layer through the internal interlayer via hole;

[0114] 6.2 fourth layer: the winding of the fourth layer is wound from inside to outside, and the outer end of the winding of the fourth layer is connected in series to the outer end of the winding located in the fifth layer through the external interlayer via hole;

[0115] 6.3 fifth layer: the winding of the fifth layer is wound from outside to inside, and the inner end of the winding of the fifth layer is connected in series to the inner end of the winding located in the third layer through the internal interlayer via hole;

[0116] 6.4 third layer: the winding of the third layer is wound from inside to outside, and the outer end of the winding of the third layer is connected in series to the outer end of the winding located in the first layer through the external interlayer via hole;

[0117] 6.5 First layer: the winding of the first layer is wound from outside to inside, and the inner end of the winding of the first layer is connected in series to the inner end of the winding located in the second layer through the internal interlayer via;

[0118] 6.6 Second layer: the winding of the second layer is wound from inside to outside, and the outer end of the winding of the second layer forms the tail end of the W phase;

[0119] Wherein, the steps S1, S3, S5 have no sequence; the head end and the tail end of the U phase, the V phase and the W phase can be exchanged in position by reverse winding connection.

[0120] The outer shape of the 2D printed coil 2 is approximately isosceles trapezoidal, wherein the upper base 21 is close to the center of the PCB coil board 1, the upper base 21 and the two waist edges 22 are straight lines, and the lower base 23 is a circular arc line, the center of the circular arc line is not coincident with the center of the PCB coil board 1. The center of the circular arc line is not coincident with the center of the PCB coil board 1 to generate the necessary torque.

[0121] The connection between the upper base 21 and the two waist edges 22 adopts an outer rounded corner transition, and the connection between the lower base 23 and the two waist edges 22 adopts an inner rounded corner transition. The outer rounded corners between two adjacent 2D printed coils 2 form six outer triangular areas 11 on the PCB coil board 1, and the inner rounded corners between two adjacent 2D printed coils 2 form six inner triangular areas 12 on the PCB coil board 1. The outer triangular areas 11 and the inner triangular areas 12 provide reasonable space for the setting of subsequent pads and interlayer vias, facilitate circuit connection and layout, have high space utilization, and improve structural compactness. Preferably, two outer interlayer vias are arranged in each outer triangular area 11, and three inner interlayer vias are arranged in each inner triangular area 12. The three inner interlayer vias are arranged in a line. Reasonable positions of the outer interlayer vias and the inner interlayer vias can further improve space utilization and have good structural compactness.

[0122] The PCB coil board 1 is provided with at least four pads 13 corresponding to the positions of the six outer triangular areas 11, which are distributed at the positions of the outer triangular areas. Taking the six pads 13 as an example, there is one U pad, one V pad, one W pad and three COM pads, and a total of six pads 13 are formed. In the figure, U1, V1, W1, U2, V2, W2 are shown, that is, U2, V2, W2 correspond to the three COM pads.

[0123] The pads 13 are arranged on the outer triangular area 11 as connection points, which makes full use of the space, saves the PCB space, avoids the pads occupying extra space to affect the winding layout and the compactness of the overall structure of the motor, and is convenient for production and processing and subsequent line connection operation. In other embodiments, the number of pads 13 can also be four, that is, three COM pads are combined into one COM pad, that is, the three COM terminals are simplified into one COM pad, and the wiring is more convenient.

[0124] The internal interlayer via or the external interlayer via is connected only with two 2D printed coils 2. This connection mode improves the reliability and accuracy of the connection, reduces the complexity and potential failure points caused by too many coil connections of the via, and is beneficial to improve the production yield and long-term operation stability of the motor.

[0125] The line spacing D in the 2D printed coil 2 is the same as the spacing d between the adjacent two 2D printed coils 2 on the same layer. The 2D printed coil 2 adopts a spiral coil printing mode, which can make full use of the space of the PCB coil plate 1, improve the coil area utilization rate, increase the effective conductor length, and further improve the electromagnetic performance and coil density of the motor; the spacing between the coils of each layer is the same and the layers are sequentially connected, which maximizes the winding density and further improves the motor efficiency.

[0126] In order to facilitate further description of the interlayer via connection logic and the line connection logic mode, the external interlayer via and the internal interlayer via are collectively named VX, wherein V represents the interlayer via and X represents the interlayer via number.

[0127] The coil area is named LXY, wherein L is the 2D printed coil 2, X represents the first area, and Y represents the layer. For example, the PCB coil plate 1 is divided into six coil areas according to 60-degree phase belts. For example, L12 represents the 2D printed coil at the second layer in the first area. The coils at the above six positions are collectively referred to as the LXX coil group, for example, the six coils in the first area are collectively referred to as the L1X coil group (abbreviated as L1X); the six coils in the fourth area are collectively referred to as the L4X coil group (abbreviated as L4X).

[0128] The 2D printed coils 2 in the same coil area of different layers and the same sequence number can be connected to form a winding through the interlayer via. There are six windings, namely winding U1, winding V1, winding W1, winding U2, winding V2 and winding W2. Each winding area has two external interlayer vias and three internal interlayer vias, and the six PCB stator winding areas have thirty interlayer vias in total. Each interlayer via is connected to only two 2D printed coils. Two windings with a mechanical angle of 180° form a phase, and the six windings form three phases, namely U phase, V phase and W phase. For example, L1X and L4X form U phase, L2X and L5X form V phase, and L3X and L6X form W phase, forming a three-phase motor winding structure. Through the alternating change of three-phase current, a rotating magnetic field is generated to drive the motor rotor to rotate. Compared with a single-phase winding, a three-phase winding structure can generate a more stable rotating magnetic field, reduce the torque fluctuation of the motor, improve the stability and reliability of the motor operation, and also help to improve the efficiency and power factor of the motor, so that it can better meet the heat dissipation demand in the application of a micro fan.

[0129] In specific production and manufacturing, referring to Figures 2 to 7 :

[0130] The connection logic of L1X is as follows: the outer end of U1 is connected to the outer end of L11, the inner end of L11 is connected to the inner end of L12 through V3, the outer end of L12 is connected to the outer end of L13 through V1, the inner end of L13 is connected to the inner end of L15 through V5, the outer end of L15 is connected to the outer end of L16 through V2, and the inner end of L16 is connected to the inner end of L14 through V4.

[0131] The connection logic of L4X is as follows: the inner end of L44 is connected to the inner end of L46 through V18, the outer end of L46 is connected to the outer end of L45 through V16, the inner end of L45 is connected to the inner end of L43 through V20, the outer end of L43 is connected to the outer end of L41 through V17, the inner end of L41 is connected to the inner end of L42 through V19, and the outer end of L42 is connected to U2.

[0132] L1X and L4X are connected in series, specifically, the outer end of L14 and the outer end of L44 are connected through layer-to-layer connection on the fourth layer, that is, the connection is made through the outer sides of L24 and L34.

[0133] The connection logic of L2X is as follows: V1 is connected to the outer end of L21, the inner end of L21 is connected to the inner end of L22 through V8, the outer end of L22 is connected to the outer end of L23 through V6, the inner end of L23 is connected to the inner end of L24 through V10, the outer end of L24 is connected to the outer end of L26 through V7, and the inner end of L26 is connected to the inner end of L25 through V9.

[0134] The connection logic of L5X: the inner end of L55 is connected to the inner end of L56 through V24, the outer end of L56 is connected to the outer end of L54 through V21, the inner end of L54 is connected to the inner end of L53 through V23, the outer end of L53 is connected to the outer end of L51 through V22, the inner end of L51 is connected to the inner end of L52 through V25, and the outer end of L52 is connected to V2.

[0135] L2X and L5X are connected in series, specifically, the outer end of L25 and the outer end of L55 are connected through the same layer cross-line connection in the fifth layer, that is, the cross-line is connected by passing through the outer side positions of L35 and L45.

[0136] The connection logic of L3X: W1 is connected to the outer end of L31, the inner end of L31 is connected to the inner end of L32 through V13, the outer end of L32 is connected to the outer end of L33 through V11, the inner end of L33 is connected to the inner end of L35 through V14, the outer end of L35 is connected to the outer end of L34 through V12, and the inner end of L34 is connected to the inner end of L36 through V15.

[0137] The connection logic of L6X: the inner end of L66 is connected to the inner end of L64 through V28, the outer end of L64 is connected to the outer end of L65 through V26, the inner end of L65 is connected to the inner end of L63 through V30, the outer end of L63 is connected to the outer end of L61 through V27, the inner end of L51 is connected to the inner end of L62 through V29, and the outer end of L62 is connected to W2.

[0138] L3X and L6X are connected in series, specifically, the outer end of L36 and the outer end of L66 are connected through the same layer cross-line connection in the sixth layer, that is, the cross-line is connected by passing through the outer side positions of L46 and L56.

[0139] Embodiment 2, see Figures 8 to 9 The micro fan provided in the embodiment includes a base 3, an upper cover 4, a fan rotor assembly 5, an FPC soft plate 6, a PCB coil plate 1, and a back iron 7.

[0140] The FPC soft plate 6 is arranged in the base 31, and preferably, the FPC soft plate 6 is directly fixed in the base 3 by adhesive. Compared with the traditional mechanical fixing mode, the additional space occupation and structural complexity caused by the fixing members such as screws are avoided, and the operation is simple.

[0141] The FPC soft board 6 is provided with six welding points corresponding to the welding pads U1, V1, W1, U2, V2, W2 on the PCB coil board 1, and the head end and tail end of the U-phase, V-phase and W-phase are welded correspondingly. The welding pads U1, V1, W1, U2, V2, W2 on the PCB coil board 1 are welded on the welding points of the FPC soft board 6 by the SMT process, which is firm in combination, has good structural stability, and does not need wire arrangement process. In other embodiments, the number of welding pads 13 can also be four, that is, the U2, V2, W2 welding pads are combined into a COM welding pad, which can further simplify the structure and make the wiring more convenient.

[0142] The fan rotor assembly 5 corresponding to the position of the PCB coil board 1 is rotatably arranged on the base 3, and the upper cover 4 is buckled on the base 3. Preferably, waterproof sealing glue is arranged between the upper cover 4 and the base 3, which can improve the sealing effect and prevent foreign matters such as water and dust from entering the micro fan.

[0143] The middle tube 31 is arranged at the middle position in the base 3. The fan rotor assembly 5 includes a fan blade 51, a motor shell 52, a shaft core 53 and a magnet 54. The fan blade 51 is sleeved on the motor shell 52. One end of the shaft core 53 is fixed at the center position of the motor shell 52. The shaft core 53 is rotatably arranged on the middle tube 31 through a bearing. The magnet 54 is arranged in the motor shell 52 and corresponds to the PCB coil board 1. When the PCB coil board 1 is powered, the magnetic field generated drives the magnet 54 and the motor shell 52 to rotate, thereby driving the fan blade 51 to rotate to realize the blowing and heat dissipation function. If only a motor is needed, the fan blade 51 can be omitted.

[0144] The back iron 7 is embedded in the base 3. That is, during injection molding, the back iron 7 is positioned in the cavity of the mold, and the base 3 is formed by injection molding, so that the back iron 7 is embedded in the base 3 and corresponds to the position of the magnet 54. Since the back iron 7 is located in the base 3 and has a high height, the distance between the back iron 7 and the magnet 54 is shortened, the magnetic force is improved, the eddy current effect is effectively reduced, and the motor efficiency is improved. Preferably, the wear-resistant sheet 8 is arranged at the bottom position in the middle tube 31, which can support the shaft core 53, reduce the friction and wear of the shaft core 53 to the base 31 during rotation, and also reduce noise, so that the operation is more stable.

[0145] Embodiment 3, see Figures 10 to 11This embodiment provides a miniature fan that is basically similar to that of Embodiment 2, except that the base is replaced with an LDS base 9. The surface of the LDS base 9 is provided with an LDS circuit formed by the LDS process. The LDS circuit includes traces, solder joints, metal contacts, and other structures. The LDS circuit replaces the FPC flexible board 6. That is, the LDS circuit has six solder joints 91 corresponding to the solder pads U1, V1, W1, U2, V2, and W2 on the PCB coil board 1.

[0146] The pads U1, V1, W1, U2, V2, and W2 on the PCB coil board 1 are soldered to the six solder points 91 of the LDS circuit using SMT technology, thus achieving the same purpose of soldering and fixing. If the number of pads 13 is four, the number of solder points 91 on the LDS circuit is also reduced to four.

[0147] Experimental testing has shown that, compared with existing technologies, the micro fan utilizing the high power density PCB stator winding structure of this invention has the following advantages:

[0148] 1. The entire high-power-density PCB stator winding structure is circular in shape to avoid interference with other components, making it easy to apply to micro motor architectures.

[0149] 2. The shapes of each 2D printed coil 2 are roughly the same, and a symmetrical winding and wiring design is adopted. Specifically, the straight line segment side lengths of two adjacent 2D printed coils 2 on each layer are nearly equal, and the geometric center lines of the two PCB coil boards 2 are approximately symmetrical to avoid torque imbalance, good electromagnetic force balance, and small torque fluctuation of the motor.

[0150] 3. The resistance values ​​of each phase are relatively uniform, which reduces the impact of phase current fluctuations on torque fluctuations.

[0151] 4. Since the outline of the 2D printed coil 2 is roughly an isosceles trapezoid, and the blank areas formed by the inner and outer rounded corners create six outer triangular regions 11 and six inner triangular regions 12, this provides reasonable space for the placement of pads and interlayer vias, thereby maximizing the effective area of ​​the coil and improving motor performance. The electromagnetic simulation results of the motor are shown in Table 1:

[0152] Table 1

[0153] Number of layers Slot pole combination Torque (N.m) Power (W) Motor efficiency 6 6-slot 4-pole 2.03e-5 0.199 20.3% 6 6-slot 8-pole 2.50e-5 0.181 27.4%

[0154] The connection logic for 6 slots with 4 poles and 6 slots with 8 poles is the same; only the number of poles on the magnets is different.

[0155] Resistance values ​​for each phase: U phase 18.1 ohms, V phase 18.0 ohms, W phase 18.1 ohms, resistivity based on 0.0185 Ohm.mm 2 / m calculation.

[0156] 6-slot 4-pole simulation results (19000 RPM) see Figure 12 and Figure 13 6-slot 8-pole simulation results (19000 RPM) see Figure 14 and Figure 15 .

[0157] It can be seen that the electromagnetic force balance of the micro fan or motor using the high-power-density PCB stator winding structure of the present application is better, the torque fluctuation is smaller, and the efficiency is higher.

[0158] According to the disclosure and teaching of the above description, those skilled in the art of the present application can also make changes and modifications to the above embodiments. Therefore, the present application is not limited to the specific embodiments disclosed and described above, and some modifications and changes of the present application should fall within the protection scope of the claims of the present application. In addition, although some specific terms are used in the present specification, these terms are only for convenience of description and do not constitute any limitation on the present application. As described in the above embodiments of the present application, other stator structures, motors or fans obtained by the same or similar methods are also within the scope of protection of the present application.

Claims

1. A high power density PCB stator wire method, whose PCB coil plate is six layers, characterized in that: The PCB coil plate is circular, each layer is circularly symmetrically printed with six 2D printed coils with substantially same shape to form six windings, one end of the 2D printed coil forms an outer end of the winding outside, and the other end is spirally wound to an inner position of the geometric center to form an inner end of the winding; It comprises the following steps: S1, winding winding U1: arranging the head wire of winding U1 on the first layer to form the head end of U phase, and then connecting according to the following winding method and interlayer sequence; 1.1 First layer: the winding of the first layer is wound from outside to inside, and the inner end of the winding of the first layer is connected in series through the internal interlayer via hole to the inner end of the winding located in the second layer; 1.2 Second layer: the winding of the second layer is wound from inside to outside, and the outer end of the winding of the second layer is connected in series through the external interlayer via hole to the outer end of the winding located in the third layer; 1.3 Third layer: the winding of the third layer is wound from outside to inside, and the inner end of the winding of the third layer is connected in series through the internal interlayer via hole to the inner end of the winding located in the fifth layer; 1.4 Fifth layer: the winding of the fifth layer is wound from inside to outside, and the outer end of the winding of the fifth layer is connected in series through the external interlayer via hole to the outer end of the winding located in the sixth layer; 1.5 Sixth layer: the winding of the sixth layer is wound from outside to inside, and the inner end of the winding of the sixth layer is connected in series through the internal interlayer via hole to the inner end of the winding located in the fourth layer; 1.7 Fourth layer: the winding of the fourth layer is wound from inside to outside, and the outer end of the winding of the fourth layer is connected in series through the same layer cross wire with winding U2; S2, winding winding U2: arranging the head wire of winding U2 on the fourth layer for connecting with the outer end of the winding of winding U1 located in the fourth layer, and then connecting according to the following winding method and interlayer sequence; 2.1 Fourth layer: the winding of the fourth layer is wound from outside to inside, and the inner end of the winding of the fourth layer is connected in series through the internal interlayer via hole to the inner end of the winding located in the sixth layer; 2.2 Sixth layer: the winding of the sixth layer is wound from inside to outside, and the outer end of the winding of the sixth layer is connected in series through the external interlayer via hole to the outer end of the winding located in the fifth layer; 2.3 Fifth layer: the winding of the fifth layer is wound from outside to inside, and the inner end of the winding of the fifth layer is connected in series through the internal interlayer via hole to the inner end of the winding located in the third layer; 2.4 Third layer: the winding of the third layer is wound from inside to outside, and the outer end of the winding of the third layer is connected in series through the external interlayer via hole to the outer end of the winding located in the first layer; 2.5 First layer: the winding of the first layer is wound from outside to inside, and the inner end of the winding of the first layer is connected in series through the internal interlayer via hole to the inner end of the winding located in the second layer; 2.6 Second layer: the winding of the second layer is wound from inside to outside, and the outer end of the winding of the second layer forms the tail end of U phase; S3, winding winding V1: arranging the head wire of winding V1 on the first layer to form the head end of V phase, and then connecting according to the following winding method and interlayer sequence; 3.1 First layer: the winding of the first layer is wound from outside to inside, and the inner end of the winding of the first layer is connected in series through the internal interlayer via hole to the inner end of the winding located in the second layer; 3.2 Second layer: the winding of the second layer is wound from inside to outside, and the outer end of the winding of the second layer is connected in series through the external interlayer via hole to the outer end of the winding located in the third layer; 3.3 Third layer: the winding of the third layer is wound from outside to inside, the inner end of the winding of the third layer is connected in series to the inner end of the winding located in the fourth layer through the inner interlayer via; 3.4 Fourth layer: the winding of the fourth layer is wound from inside to outside, the outer end of the winding of the fourth layer is connected in series to the outer end of the winding located in the sixth layer through the outer interlayer via; 3.5 Sixth layer: the winding of the sixth layer is wound from outside to inside, the inner end of the winding of the sixth layer is connected in series to the inner end of the winding located in the fifth layer through the inner interlayer via; 3.7 Fifth layer: the winding of the fifth layer is wound from inside to outside, the outer end of the winding of the fifth layer is connected in series to the winding V2 through the same-layer cross-over; S4, winding the winding V2: arranging the head wire of the winding V2 in the fifth layer for being connected to the outer end of the winding located in the fifth layer in the winding V1, and then connecting according to the following winding method and interlayer sequence; 4.1 Fifth layer: the winding of the fifth layer is wound from outside to inside, the inner end of the winding of the fifth layer is connected in series to the inner end of the winding located in the sixth layer through the inner interlayer via; 4.2 Sixth layer: the winding of the sixth layer is wound from inside to outside, the outer end of the winding of the sixth layer is connected in series to the outer end of the winding located in the fourth layer through the outer interlayer via; 4.3 Fourth layer: the winding of the fourth layer is wound from outside to inside, the inner end of the winding of the fourth layer is connected in series to the inner end of the winding located in the third layer through the inner interlayer via; 4.4 Third layer: the winding of the third layer is wound from inside to outside, the outer end of the winding of the third layer is connected in series to the outer end of the winding located in the first layer through the outer interlayer via; 4.5 First layer: the winding of the first layer is wound from outside to inside, the inner end of the winding of the first layer is connected in series to the inner end of the winding located in the second layer through the inner interlayer via; 4.6 Second layer: the winding of the second layer is wound from inside to outside, the outer end of the winding of the second layer forms the tail end of the V phase; S5, winding the winding W1: arranging the head wire of the winding W1 in the first layer to form the head end of the W phase, and then connecting according to the following winding method and interlayer sequence; 5.1 First layer: the winding of the first layer is wound from outside to inside, the inner end of the winding of the first layer is connected in series to the inner end of the winding located in the second layer through the inner interlayer via; 5.2 Second layer: the winding of the second layer is wound from inside to outside, the outer end of the winding of the second layer is connected in series to the outer end of the winding located in the third layer through the outer interlayer via; 5.3 Third layer: the winding of the third layer is wound from outside to inside, the inner end of the winding of the third layer is connected in series to the inner end of the winding located in the fourth layer through the inner interlayer via; 5.4 Fifth layer: the winding of the fifth layer is wound from inside to outside, the outer end of the winding of the fifth layer is connected in series to the outer end of the winding located in the sixth layer through the outer interlayer via; 5.5 Fourth layer: the winding of the fourth layer is wound from outside to inside, the inner end of the winding of the fourth layer is connected in series to the inner end of the winding located in the sixth layer through the inner interlayer via; 5.7 Sixth layer: the winding of the sixth layer is wound from inside to outside, the outer end of the winding of the sixth layer is connected in series to the winding W2 through the same-layer cross-over; S6, winding the winding W2: arranging the head wire of the winding W2 in the sixth layer for being connected to the outer end of the winding located in the fifth layer in the winding W1, and then connecting according to the following winding method and interlayer sequence; 6.1 The sixth layer: the winding of the sixth layer is wound from outside to inside, the inner end of the winding of the sixth layer is connected in series to the inner end of the winding located in the fourth layer through the internal interlayer via; 6.2 The fourth layer: the winding of the fourth layer is wound from inside to outside, the outer end of the winding of the fourth layer is connected in series to the outer end of the winding located in the fifth layer through the external interlayer via; 6.3 The fifth layer: the winding of the fifth layer is wound from outside to inside, the inner end of the winding of the fifth layer is connected in series to the inner end of the winding located in the third layer through the internal interlayer via; 6.4 The third layer: the winding of the third layer is wound from inside to outside, the outer end of the winding of the third layer is connected in series to the outer end of the winding located in the first layer through the external interlayer via; 6.5 The first layer: the winding of the first layer is wound from outside to inside, the inner end of the winding of the first layer is connected in series to the inner end of the winding located in the second layer through the internal interlayer via; 6.6 The second layer: the winding of the second layer is wound from inside to outside, the outer end of the winding of the second layer forms the tail end of the W phase; Wherein, the steps S1, S3, S5 have no sequence; the head end and the tail end of the U phase, the V phase and the W phase can be exchanged in position through reverse winding connection.

2. The high power density PCB stator wire connecting method of claim 1, wherein: The outer shape of the 2D printed coil is roughly isosceles trapezoidal, wherein the upper base is close to the center of the PCB coil board, the upper base and the two waist sides are straight lines, and the lower base is a circular arc line, the center of the circular arc line is not coincident with the center of the PCB coil board.

3. The high power density PCB stator connection method of claim 2, wherein: The connection between the upper base and the two waist sides adopts external rounded corner transition, and the connection between the lower base and the two waist sides adopts internal rounded corner transition, the positions between the external rounded corners of two adjacent 2D printed coils form six external triangular areas on the PCB coil board, and the positions between the internal rounded corners of two adjacent 2D printed coils form six internal triangular areas on the PCB coil board.

4. The high power density PCB stator wire connecting method of claim 3, wherein: Each external triangular area is provided with two external interlayer vias, and each internal triangular area is provided with three internal interlayer vias.

5. The high power density PCB stator wire connecting method of claim 2, wherein: The PCB coil board is provided with at least four pads corresponding to the positions of the external triangular areas.

6. The high power density PCB stator wire connecting method of claim 1, wherein: The internal interlayer via or the external interlayer via is connected with only two 2D printed coils.

7. The high power density PCB stator wire connecting method of claim 1, wherein: The line spacing in the 2D printed coil is the same as the spacing between the two adjacent 2D printed coils on the same layer.

8. A high power density PCB stator winding structure characterized by: It is made by the high-power-density PCB stator connection method of any one of claims 1-7.

9. An electric machine characterized by: It comprises the high-power-density PCB stator winding structure of claim 8.

10. A micro fan characterized by: It comprises the high-power-density PCB stator winding structure of claim 8.