Multilayer three-dimensional PCB capable of effectively improving magnetic induction and heat dissipation and processing technology

Abstract

The invention discloses a multilayer three-dimensional PCB capable of effectively improving magnetic induction and heat dissipation, the multilayer three-dimensional PCB comprises a PCB thin plate and a PCB thick plate, a magnetic inductor is arranged on the back surface of the PCB thin plate, a hollow structure is formed in the position, corresponding to a component on the back surface of the PCB thin plate, of the PCB thick plate, a heating device is installed on the PCB thick plate, and the invention also discloses a processing technology of the multilayer three-dimensional PCB. Sensitivity of the magnetic induction component can be improved, heat dissipation of the component is improved, and electromagnetic interference is effectively reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of PCB circuit, in particular to a kind of effectively promote magnetic induction and heat dissipation multilayer three-dimensional PCB board and processing technology. BACKGROUND

[0002] At present, PCB board is integral type one board, due to many components, each other crossing influence leads to magnetic induction sensitivity reduction, heat dissipation effect is also greatly influenced, electromagnetic interference also exists, so the existing PCB board has certain defects, and further improvement design is needed, based on this, the present application person designs a kind of effectively promote magnetic induction and heat dissipation multilayer three-dimensional PCB board to solve the above problems. SUMMARY

[0003] In view of the above shortcomings of the prior art, the present application provides a kind of effectively promote magnetic induction and heat dissipation multilayer three-dimensional PCB board.

[0004] To achieve the above object, the present application is realized by the following technical scheme: A kind of effectively promote magnetic induction and heat dissipation multilayer three-dimensional PCB board, it is characterized by: including PCB thin plate and PCB thick plate, the magnetic inductor is arranged on the back of the PCB thin plate, the hollow structure is formed on the PCB thick plate corresponding to the position of the back component of the PCB thin plate, and the heating device is installed on the PCB thick plate.

[0005] Further preferably, the magnetic inductor is a plurality of, and the number of the hollow structure and the number of the magnetic inductor are consistent.

[0006] A kind of effectively promote magnetic induction and heat dissipation multilayer three-dimensional PCB board processing technology, it is characterized by: welding pad is arranged between the back of the PCB thin plate and the front of the PCB thick plate, and the welding pad is heated to realize the connection between the PCB thin plate and the PCB thick plate to form an integral structure.

[0007] Compared with the prior art, the present application has the following advantages: The present application divides the original PCB into two blocks, PCB-1 uses thin plate, prevents the magnetic inductor on the back of the plate, PCB-2 uses thick plate, hollows out the component position on the back of PCB-1, and places all heating devices on the back of PCB-2, and sets connection pad on the back of PCB-1 / PCB2 front surface, and the back of PCB-1 / PCB2 front surface is connected by heating through the pad;The present application can realize the following functions: 1, the present application increases the sensitivity of magnetic induction component.

[0008] 2, the present application increases the heat dissipation of component.

[0009] 3, the present application effectively reduces electromagnetic interference. Attached Figure Description

[0010] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are merely some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without any creative effort.

[0011] Figure 1 This is a schematic diagram of the structure of the present invention.

[0012] Figure 2 This is a schematic diagram of the structure of the present invention. Detailed Implementation

[0013] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0014] The terms "left," "right," "front," "back," "up," and "down" used in the following description refer to the orientation from the perspective of the front view. Example

[0015] Figure 1 and Figure 2 This invention discloses a multilayer 3D PCB board that effectively improves magnetic induction and heat dissipation. It is characterized by comprising a thin PCB board 1 and a thick PCB board 2. A magnetic sensor 3 is disposed on the back of the thin PCB board 1. A cutout structure 4 is formed on the thick PCB board 2 at positions corresponding to the components on the back of the thin PCB board 1. Heating components are mounted on the thick PCB board 2. The back of the thin PCB board 1 and the front of the thick PCB board 2 are connected by pads to form a whole. This invention divides the original PCB into two parts: PCB-1 uses a thin board with the magnetic sensor placed on its back; PCB-2 uses a thick board with cutouts at the positions of the components on the back of PCB-1. All heating components are placed on the back of PCB-2. Connecting pads are provided on the back of PCB-1 and the front of PCB-2, and the back of PCB-1 and the front of PCB-2 are connected by these pads for heating. This invention increases the sensitivity of the magnetic induction components, improves heat dissipation, and effectively reduces electromagnetic interference.

[0016] The processing technology for effectively improving the magnetic induction and heat dissipation of a multi-layer three-dimensional PCB is characterized in that: a solder pad is arranged between the back of the PCB thin plate 1 and the front of the PCB thick plate 2, and the solder pad is heated to realize the connection between the PCB thin plate 1 and the PCB thick plate 2 to form an integral structure. The process is simple, low in cost and conducive to market product competitive advantage.

[0017] The above examples are only used to illustrate the technical solutions of the present application, but not to limit it; although the present application has been described in detail with reference to the foregoing examples, those skilled in the art should understand that the technical solutions recorded in the foregoing examples can be modified, or some technical features can be replaced by equivalents; and these modifications or replacements will not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. An effective multi-layer three-dimensional PCB board with magnetic induction and heat dissipation, characterized in that: it comprises a PCB thin plate and a PCB thick plate, a magnetic inductor is arranged on the back surface of the PCB thin plate, a hollow structure is formed on the PCB thick plate at positions corresponding to components on the back surface of the PCB thin plate, and a heat generating component is mounted on the PCB thick plate. The magnetic inductor is a plurality of magnetic inductors, and the number of the corresponding hollow structures is consistent with the number of the magnetic inductors.

2. The efficient multi-layered three-dimensional PCB board for improving magnetic induction and heat dissipation according to claim 1, wherein A solder pad is arranged between the back surface of the PCB thin plate and the front surface of the PCB thick plate, and the solder pad is heated to realize the connection between the PCB thin plate and the PCB thick plate and form an integrated structure.

3. The processing technology for effectively improving magnetic induction and heat dissipation of multi-layer three-dimensional PCB board according to claim 1 or 2, characterized in that: ​

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