A system and method for processing a printed circuit board prior to layout

Abstract

The application discloses a kind of processing system and method before printing circuit board layout, and the application relates to layout processing technical field.It includes: contour data acquisition module, minimum enclosing rectangle calculation module, circuit board area calculation module, effective proportion analysis module, multi-circuit board combination optimization module, effective layout area determination module, layoutable quantity calculation module, layout coordinate positioning module;The present application scans and identifies irregular circuit board contour, calculates minimum enclosing rectangle, area and effective proportion, manually combines and optimizes low-proportion board type, significantly improves substrate utilization and production efficiency;Accurately divide effective layout area and standardize coordinate positioning, reduce positioning error, improve processing quality and stability;Flexibly adapt to diversified board type demand, reduce material waste and manual trial and error cost, bring obvious economic benefits and environmental benefits to enterprises.

Description

Technical Field

[0001] This invention relates to the field of typesetting technology, specifically to a processing system and method for printed circuit boards before typesetting. Background Technology

[0002] In the electronics manufacturing industry, printed circuit boards (PCBs) are the core components that carry electronic components and realize circuit connections. In the production process, the technical level of the substrate layout stage directly determines the manufacturing cost control, raw material utilization rate, and production cycle length. As electronic devices upgrade towards miniaturization and multi-functionality, the shape design of PCBs has gradually broken through the traditional rectangular structure, resulting in a large number of customized products with irregular notches and asymmetrical contours. The layout optimization of these irregular PCBs has become a key bottleneck restricting the industry's capacity improvement and cost reduction.

[0003] Current circuit board layout technologies have significant limitations in processing the outline data of irregular circuit boards. While some technologies employ image scanning and recognition to obtain circuit board shape information, they cannot accurately quantify the effective proportion of space occupied by irregular circuit boards. When a circuit board has many blank areas, resulting in a low effective proportion, a large amount of space within the effective area of ​​the substrate becomes idle, leading to low material utilization and a significant increase in the consumption cost of substrate raw materials.

[0004] As the electronics manufacturing industry continues to demand higher efficiency and cost control in mass production, the shortcomings of existing typesetting technologies in terms of data processing depth are becoming increasingly apparent, making it difficult to meet the needs of efficient and low-cost production. Therefore, there is an urgent need to develop a pre-typesetting processing system and method for printed circuit boards to solve the problem of low material utilization in existing technologies and help upgrade the circuit board manufacturing process towards intelligence and efficiency. Summary of the Invention

[0005] (a) Technical problems to be solved

[0006] To address the shortcomings of existing technologies, this invention provides a processing system and method for printed circuit board layout, solving the problems mentioned in the background section.

[0007] (II) Technical Solution

[0008] To achieve the above objectives, the present invention provides the following technical solution: a method for processing printed circuit boards before layout, comprising the following steps:

[0009] Step 1: Obtaining the outline data of a single irregular circuit board:

[0010] An image scanning device is used to scan an irregular circuit board to obtain an image containing the outline of the circuit board; then, image recognition technology is used to extract the set of edge point coordinates of the circuit board outline; the edge point coordinates in the set of edge point coordinates are taken as the x-axis with a fixed edge of the substrate and the y-axis with the direction perpendicular to the x-axis;

[0011] Step 2: Calculation of the minimum enclosing rectangle area of ​​a single irregular circuit board:

[0012] Among all the x and y coordinates of the edge points, the x coordinates of the rightmost and leftmost edge points in the horizontal direction of the irregular circuit board are extracted as the maximum values ​​x. max and minimum value x min ; and extract the y-coordinates of the uppermost and lowermost edge points of the irregular circuit board in the vertical direction as the maximum values ​​y and y, respectively. max Minimum value y min Subsequently, through the maximum value x max Subtract the minimum value x min and through the maximum value y max Subtract the minimum value y min The width and height of the minimum bounding rectangle of a single irregular circuit board are obtained respectively. Then, the width and height are multiplied to obtain the area of ​​the minimum bounding rectangle of the circuit board.

[0013] Step 3: Calculation of the area of ​​a single irregular circuit board:

[0014] The area of ​​an irregular circuit board is calculated based on the cross product of vectors. The area of ​​the polygon is obtained by calculating the sum of the cross products of vectors formed by adjacent vertices in turn and then taking half of the absolute value.

[0015] Step 4: Calculation of the effective proportion of a single irregular circuit board:

[0016] The effective proportion of the irregular circuit board area in the minimum enclosing rectangle area is determined by the ratio of the area of ​​the irregular circuit board to the area of ​​the minimum enclosing rectangle.

[0017] Step 5: Optimization Analysis of Multi-Circuit Board Combinations

[0018] If the effective proportion of a single irregular circuit board within the minimum bounding rectangle Small For the corresponding preset effective proportion threshold, the multi-circuit board combination optimization analysis is carried out through manual-assisted layout;

[0019] As a further aspect of the present invention, the multi-circuit board combination optimization analysis is as follows:

[0020] Select two or more circuit boards from the irregular circuit boards to be laid out; then manually rotate each selected circuit board, and adjust the position of each circuit board based on the rotation to form a combined circuit board.

[0021] Next, for the modular circuit board, the outline data of the modular circuit board is obtained in the first step, the minimum enclosing rectangle area of ​​the modular circuit board is calculated in the second step, the area of ​​the modular circuit board is calculated in the third step, and the effective proportion of the modular circuit board is calculated in the fourth step.

[0022] Subsequently, among various combined circuit boards and single irregular circuit boards, the method with the largest effective proportion was selected to calculate the number of circuit boards that can be laid out on the substrate and determine the circuit board layout coordinates.

[0023] As a further aspect of the present invention: if the effective proportion of a single irregular circuit board within the minimum enclosing rectangle... big Based on the corresponding preset effective percentage threshold, the number of circuit boards that can be laid out on the substrate and the circuit board layout coordinates are directly calculated.

[0024] As a further aspect of the present invention, the calculation of the number of circuit boards that can be arranged on a single irregular circuit board and the determination of the circuit board layout coordinates are consistent.

[0025] As a further aspect of the present invention, the calculation method for the number of circuit boards that can be arranged on the substrate is as follows:

[0026] The overall length, overall width, and width of the invalid edge region of the substrate are collected. The overall length of the substrate is then labeled L, and the overall width is labeled B. The width of the invalid edge region includes the width of the invalid region at the substrate edge in the x-axis direction and the width in the y-axis direction, and these are labeled K respectively. x and K y ; where, on both the left and right sides along the x-axis, there is a width of K. x The invalid region has a width of K on both the top and bottom sides along the y-axis. y Invalid regions;

[0027] Then subtract twice the value of K from the total length L. x And by subtracting twice the value of K from the overall width B. y The length LY and width BY of the effective layout area corresponding to the substrate are obtained respectively.

[0028] Let W and H be the width and height of the minimum enclosing rectangle of a single irregular circuit board, respectively.

[0029] pass: Calculate the total number N of circuit boards that can be arranged in the effective layout area corresponding to the substrate;

[0030] In the formula, N x N represents the number of circuit boards that can be arranged along the x-axis in the effective layout area corresponding to the substrate. y This represents the number of circuit boards that can be arranged in the y-axis direction within the corresponding effective layout area of ​​the substrate. ⌊⌋ indicates a round-down operation.

[0031] As a further aspect of the present invention: the overall length of the substrate is determined along the x-axis direction, and the overall width of the substrate is determined along the y-axis direction; the effective layout area refers to the area on the substrate used for arranging and placing the printed circuit board to be processed, which is the remaining operable area after excluding the invalid areas of the corresponding edges of the substrate.

[0032] As a further aspect of the present invention, the method for determining the layout coordinates of a single irregular circuit board is as follows:

[0033] pass:

[0034] Calculate the coordinates (X, Y) of the bottom left corner of a single irregular circuit board. m，k ,Y m，k );

[0035] Among them, X m，u It is the x-coordinate of the bottom left corner of the circuit board in the m-th row and u-th column; Y m，u It is the y-coordinate of the bottom left corner of the circuit board in row m and column u; m and u are the row index and column index, respectively, used to identify the position of the irregular circuit board in the effective layout area of ​​the substrate along the y-axis and along the x-axis.

[0036] As a further aspect of the present invention: in the layout planning, the effective layout area of ​​the substrate is divided into multiple rows along the vertical direction from bottom to top, and the value of m represents the row number of the current circuit board; at the same time, the effective layout area of ​​the substrate is divided into multiple columns along the horizontal direction from left to right, and the value of u represents the column number of the current circuit board.

[0037] As a further aspect of the present invention: the values ​​of m and u both start from 0, that is, the 0th row is the bottom row in the vertical direction, and the 0th column is the leftmost column in the horizontal direction.

[0038] A pre-layout processing system for printed circuit boards, the system being used to perform a pre-layout processing method for printed circuit boards, the system comprising:

[0039] The contour data acquisition module is used to acquire contour images of irregular circuit boards through an image scanning device and extract the set of edge point coordinates using image recognition technology.

[0040] The minimum bounding rectangle calculation module is used to extract the maximum and minimum values ​​in the x and y directions from the coordinates of the edge points, calculate the width and height of the minimum bounding rectangle of the circuit board, and obtain its area.

[0041] The circuit board area calculation module uses a polygon area calculation method based on vector cross product to calculate the actual area of ​​irregular circuit boards.

[0042] The effective proportion analysis module calculates the effective proportion by comparing the ratio of the actual area of ​​the circuit board to the area of ​​the minimum enclosing rectangle, and compares it with a preset threshold. Based on this comparison result, it determines whether a single circuit board needs to be optimized by combining multiple circuit boards.

[0043] The multi-circuit board combination optimization module is activated when the effective proportion is below a threshold. It provides manual-assisted combination optimization functions, supports the rotation and position adjustment of multiple circuit boards, and recalculates the outline, area and effective proportion of the combined circuit board.

[0044] The effective layout area determination module is used to collect the overall size of the substrate and the width of the invalid edge area, and calculate the length and width of the effective area that can be used for layout.

[0045] The layout quantity calculation module is used to calculate the total number of substrates that can be laid out based on the effective layout area size and the circuit board size;

[0046] The layout coordinate positioning module calculates the lower left corner coordinates of each circuit board in the effective layout area of ​​the substrate by using the row and column indices and size parameters of the irregular circuit boards in the effective layout area of ​​the substrate.

[0047] (III) Beneficial Effects

[0048] This invention provides a processing system and method for printed circuit boards before layout. Compared with the prior art, it has the following advantages:

[0049] This invention identifies circuit board shapes with low utilization rates by accurately calculating the minimum enclosing rectangle and actual area of ​​irregular circuit boards, combined with effective proportion analysis. For these low-utilization board shapes, manual optimization is introduced, using rotation and position adjustments to form composite circuit boards, effectively reducing substrate waste. This process significantly increases the number of circuit boards that can be laid out per unit substrate, reduces production costs, and improves overall production efficiency.

[0050] Traditional layout methods often struggle with irregularly shaped circuit boards, leading to significant material waste. This invention's multi-circuit board combination optimization analysis function allows for flexible handling of circuit boards of various complex shapes. Through manual rotation and position adjustment, not only can circuit boards of different shapes be combined, but optimal layout can also be achieved while ensuring electrical performance. This flexibility enables the production process to adapt to diverse product demands, enhancing the company's market competitiveness.

[0051] The effective layout area calculation method for the substrate of this invention accurately considers the ineffective edge areas, ensuring that all laid-out circuit boards are within the processable range. Simultaneously, the standardized coordinate calculation method guarantees the accuracy of each circuit board's position, reducing positioning errors during production. This not only simplifies subsequent processing steps but also improves product quality stability and reduces the scrap rate caused by layout issues.

[0052] Through an effective proportion threshold judgment mechanism, this invention can automatically identify the types of circuit boards that need optimization and guide operators to perform combination optimization. This intelligent decision support system reduces the time and cost of manual trial and error, making the layout process more scientific and efficient. At the same time, by improving material utilization and production efficiency, it brings significant economic and environmental benefits to enterprises. Attached Figure Description

[0053] Figure 1 This is a system block diagram of a preprocessing system for printed circuit board layout according to the present invention.

[0054] Figure 2 This is a flowchart illustrating a preprocessing method for printed circuit board layout according to the present invention. Detailed Implementation

[0055] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0056] Please see Figure 1 and Figure 2 As shown, the embodiments of the present invention provide the following technical solutions:

[0057] Solve the problems of material waste and inaccurate positioning when laying out irregularly shaped printed circuit boards;

[0058] As an embodiment of the present invention:

[0059] This invention relates to a method for processing printed circuit boards before layout, comprising the following steps:

[0060] Step 1: Obtaining the outline data of a single irregular circuit board:

[0061] An image scanning device is used to scan an irregular circuit board to obtain an image containing the outline of the circuit board;

[0062] Then, using image recognition technology, the set of edge point coordinates of the circuit board outline is extracted, and the number of extracted edge points is marked as n, while the coordinates of each edge point are marked as (x, y, y). i ,y i ), where i = 1, 2, ..., n;

[0063] In this embodiment, image recognition technology utilizes edge detection algorithms, such as the Canny algorithm, which can accurately locate the edges of the circuit board outline by calculating the gradient changes in pixel grayscale in the image. After obtaining the edge information, a contour tracking algorithm is then used to sequentially collect the coordinates of edge points along the edge, thereby forming a set of edge point coordinates. Image recognition technology has long been widely used in many fields such as industrial visual inspection and image analysis, and is very mature and reliable. It can accurately and efficiently obtain the edge point coordinates of the circuit board outline, so it will not be elaborated further.

[0064] The substrate is the basic material used to support and cut printed circuit boards; with a fixed edge of the substrate as the x-axis and the direction perpendicular to the x-axis as the y-axis, x... i This represents the horizontal coordinate of the i-th edge point, y. i This represents the vertical coordinate value of the i-th edge point;

[0065] Step 2: Calculation of the minimum enclosing rectangle area of ​​a single irregular circuit board:

[0066] Extract the minimum x-coordinate from the x and y coordinates of all edge points. min and maximum value x max and the minimum value of the y-coordinate y min and maximum value y max ;

[0067] Where, x max This represents the x-coordinate of the rightmost edge point of the irregular circuit board in the horizontal direction. min The x-coordinate of the leftmost edge point; y-coordinate. max This represents the y-coordinate of the uppermost edge point of the irregular circuit board in the vertical direction. min This represents the y-coordinate of the bottom edge point;

[0068] Subsequently passed: Calculate the width W and height H of the minimum enclosing rectangle;

[0069] For example:

[0070] Suppose there is an irregular circuit board with edge points having x-coordinates of 1, 3, 5, 2 and y-coordinates of 2, 4, 6, 3; then x min =1, x max =5, so W=4; y min =2, y max =6, therefore H=4;

[0071] Then, the width W and height H of the minimum enclosing rectangle are multiplied together to calculate the area S0 of the minimum enclosing rectangle of the circuit board.

[0072] Step 3: Calculation of the area of ​​a single irregular circuit board:

[0073] The area of ​​an irregular circuit board is calculated using a polygon area calculation method. The formula is as follows:

[0074]

[0075] In the formula, S B Refers to the area of ​​an irregularly shaped circuit board;

[0076] In this embodiment, the polygon area calculation method is based on the cross product of vectors to calculate the polygon area. The polygon area is obtained by calculating the sum of the cross products of the vectors formed by adjacent vertices in turn, and then taking half of the absolute value.

[0077] Step 4: Calculation of the effective proportion of a single irregular circuit board:

[0078] The effective proportion of the irregular circuit board area in the minimum enclosing rectangle area is determined by the ratio of the area of ​​the irregular circuit board to the area of ​​the minimum enclosing rectangle.

[0079] The formula is:

[0080] In the formula, β refers to the effective proportion of the irregular circuit board within the minimum enclosing rectangle;

[0081] In this embodiment, the value of β reflects the space utilization efficiency of the irregular circuit board within its minimum enclosing rectangle. The closer β is to 1, the closer the circuit board shape is to a rectangle and the less space is wasted; conversely, the less space is wasted.

[0082] Step 5: Optimization Analysis of Multi-Circuit Board Combinations

[0083] If the effective proportion β of a single irregular circuit board within the minimum bounding rectangle is... Small For the corresponding preset effective proportion threshold, the multi-circuit board combination optimization analysis is carried out through manual-assisted layout;

[0084] The optimization analysis of multi-circuit board combinations is as follows:

[0085] Select two or more circuit boards from the irregular circuit boards to be laid out; then manually rotate each selected circuit board, and adjust the position of each circuit board based on the rotation to form a combined circuit board.

[0086] In this embodiment, a person can visually and intuitively judge the shape characteristics of the circuit board and try different combinations of rotation angles and positions based on experience, which can flexibly deal with various irregular shapes. At the same time, in actual printed circuit board layout scenarios, for some circuit board combinations with relatively complex shapes but not a particularly large number, manual operation can quickly try and adjust without the need for complex algorithms and a large amount of computing resources. In small-scale situations or when the requirements for layout efficiency are not extremely high, it can effectively achieve combination optimization.

[0087] Next, for the modular circuit board, the outline data of the modular circuit board is obtained in the first step, the minimum enclosing rectangle area of ​​the modular circuit board is calculated in the second step, the area of ​​the modular circuit board is calculated in the third step, and the effective proportion of the modular circuit board is calculated in the fourth step.

[0088] Subsequently, among various combined circuit boards and single irregular circuit boards, the method with the largest effective proportion is selected to continue the subsequent operation steps;

[0089] If the effective proportion β of a single irregular circuit board within the minimum bounding rectangle is... big If the corresponding preset effective percentage threshold is met, the subsequent operation steps will continue to be executed;

[0090] Example 1 systematically processes and optimizes key data before irregular circuit board layout, laying a precise foundation for subsequent layout. First, image scanning and recognition technology is used to obtain the coordinates of the circuit board's outline edge points, ensuring the accuracy of the basic data. Then, the area of ​​the minimum enclosing rectangle and the actual area of ​​the circuit board are calculated to determine the effective proportion, clearly quantifying the space utilization efficiency of a single circuit board and allowing staff to intuitively judge the impact of the circuit board shape on the layout. When the effective proportion is below a threshold, a combination optimization method involving manual multi-circuit board rotation and position adjustment is introduced. A unified calculation standard is used to compare the effective proportions of single and combined circuit boards, selecting the solution with the least space waste. This effectively avoids the substrate space waste problem that may be caused by a single layout method, providing a scientific decision-making basis for improving the overall layout efficiency.

[0091] As a second embodiment of the present invention:

[0092] In specific implementation, compared with Embodiment 1, the only difference between the technical solution of this embodiment and Embodiment 1 is that the logic of the subsequent operation steps for a single irregular circuit board and multiple combined circuit boards is the same in this embodiment. Taking a single irregular circuit board as an example, the subsequent operation steps are performed as follows:

[0093] Step 6: Determining the effective layout area of ​​the circuit board substrate:

[0094] Collect the overall length, overall width, and width of the invalid edge area of ​​the substrate, and then mark the overall length of the corresponding substrate as L and the overall width as B.

[0095] The overall length of the substrate is determined along the x-axis, and the overall width of the substrate is determined along the y-axis.

[0096] The width of the invalid region at the edge includes: the width of the invalid region at the substrate edge in the x-axis direction and the width in the y-axis direction, and these are denoted as K respectively. x and K y ;

[0097] In actual production, there will be some areas on the edge of the substrate that cannot be used for laying out circuit boards, such as clamping areas used to fix the substrate, so it is necessary to identify the invalid areas.

[0098] Among them, the left and right sides along the x-axis each have a width of K. x The invalid region has a width of K on both the top and bottom sides along the y-axis. y Invalid regions;

[0099] Subsequently passed: Calculate the length LY and width BY of the effective layout area corresponding to the substrate;

[0100] The effective layout area refers to the area on the substrate used to arrange and place the printed circuit board to be processed. It is the remaining operable area after excluding the invalid area at the corresponding edge of the substrate.

[0101] Step 7: Calculation of the number of circuit boards that can be laid out on the substrate:

[0102] pass: Calculate the total number N of irregular circuit boards that can be arranged in the effective layout area corresponding to the substrate;

[0103] In the formula, N x N represents the number of circuit boards that can be arranged along the x-axis in the effective layout area corresponding to the substrate. y This represents the number of circuit boards that can be arranged in the y-axis direction within the corresponding effective layout area of ​​the substrate. ⌊⌋ indicates a round-down operation.

[0104] In this embodiment, for a modular circuit board, the total number of modular circuit boards that can be arranged in the effective layout area corresponding to the substrate is first determined, and then the number of single irregular circuit boards in the modular circuit board is extracted. Then, the two quantity values ​​are multiplied together to obtain the total number of single irregular circuit boards that can be arranged in the effective layout area corresponding to the substrate.

[0105] Example 2, building upon Example 1, focuses on determining the effective layout area of ​​the substrate and calculating the number of boards that can be laid out, further promoting the standardization and efficiency of the layout process. By collecting the overall dimensions of the substrate and the width of the invalid edge areas, it accurately calculates the length and width of the effective layout area. This fully considers the unusable conditions such as edge clamping areas during substrate production, avoiding the disconnect between layout planning and actual production caused by ignoring invalid areas, thus ensuring the feasibility of the layout scheme. Simultaneously, based on the effective layout area dimensions and relevant circuit board parameters, the total number of circuit boards that can be laid out is calculated by rounding down. This calculation method ensures the accuracy of the layout quantity and avoids production losses caused by forcibly laying out boards beyond the effective area. It allows staff to clearly know the substrate's layout capacity in advance, providing reliable data support for production planning and the rational allocation of substrate resources, thereby improving the utilization efficiency of substrate resources.

[0106] As an embodiment of the present invention:

[0107] In its specific implementation, compared to Embodiment 1 and Embodiment 2, the technical solution of this embodiment combines the solutions of Embodiment 1 and Embodiment 2. The difference between the technical solution of this embodiment and Embodiment 1 and Embodiment 2 lies only in that, in this embodiment, the logic of subsequent operation steps for a single irregular circuit board and multiple combined circuit boards is consistent. Taking a single irregular circuit board as an example, it continues to execute subsequent operation steps, which also include:

[0108] Step 8: Determining the coordinates of a single irregular circuit board layout:

[0109] pass:

[0110] Calculate the coordinates (X, Y) of the bottom left corner of a single irregular circuit board. m，k ,Y m，k );

[0111] Among them, X m，u It is the x-coordinate of the bottom left corner of the circuit board in the m-th row and u-th column; Y m，u It is the y-coordinate of the lower left corner of the circuit board in the m-th row and u-th column; m and u are the row index and column index, respectively, used to identify the position of the irregular circuit board in the effective layout area of ​​the substrate along the y-axis and along the x-axis.

[0112] In the layout planning, the effective layout area of ​​the substrate is divided into multiple rows along the vertical direction from bottom to top, and the value of m represents the row number of the current circuit board; at the same time, the effective layout area of ​​the substrate is divided into multiple columns along the horizontal direction from left to right, and the value of u represents the column number of the current circuit board.

[0113] The values ​​of m and u both start from 0, meaning that the 0th row is the bottom row in the vertical direction and the 0th column is the leftmost column in the horizontal direction.

[0114] In this embodiment, for a modular circuit board, the coordinates of its lower left corner are calculated. The overall lower left corner coordinates of the modular circuit board are sufficient to determine its position within the effective layout area of ​​the substrate. The calculation logic for these coordinates is consistent with that of a single circuit board, based on its row and column indices and its own size parameters within the substrate, ensuring that the modular circuit board can be arranged orderly on the substrate like a single circuit board. The individual irregular circuit boards contained within the modular circuit board do not require separate calculation of their coordinates within the substrate. The relative positions of these individual circuit boards are determined during the manual assembly optimization stage and can be separated using a preset cutting path—this cutting path is specifically defined during assembly layout based on the edge contours and relative positions of each individual circuit board, accurately distinguishing the boundaries of different circuit boards. During production, simply following this cutting path allows for the complete separation of each independent irregular circuit board from the modular circuit board, ensuring both layout efficiency and the integrity of each individual circuit board.

[0115] Example 3, building upon the core content of Examples 1 and 2, adds a step for determining the coordinates of a single irregular circuit board, further refining the details of the layout planning and making the layout scheme more operable. Through a clear coordinate calculation formula, combined with the row and column indexes of the circuit board within the effective layout area of ​​the substrate, it accurately locates the specific coordinates of the lower left corner of each circuit board, clearly defining the specific position of each circuit board on the substrate. This precise coordinate positioning method avoids the problems of chaotic and overlapping circuit board positions during the layout process, ensuring that multiple circuit boards can be arranged in an orderly manner within the effective area of ​​the substrate. Simultaneously, the row and column indexes start from 0 and have clearly defined directions (rows from bottom to top, columns from left to right), unifying the identification standards for layout positions, reducing communication costs and operational errors for staff in actual layout operations, providing strong support for subsequent efficient and accurate circuit board processing and production, and further improving the standardization and accuracy of the overall layout process.

[0116] As an embodiment of the present invention:

[0117] In specific implementation, compared with Embodiment 1, Embodiment 2 and Embodiment 3, the technical solution of this embodiment is to combine the solutions of Embodiment 1, Embodiment 2 and Embodiment 3.

[0118] Example 4 integrates all the technical solutions from Examples 1, 2, and 3, forming a complete processing system covering data acquisition, space efficiency analysis, combination optimization, determination of effective substrate area, calculation of layout quantity, and specific coordinate positioning before irregular circuit board layout. This complete system achieves full-process coverage from preliminary basic data processing to subsequent specific layout location planning, avoiding the potential for inconsistencies that may arise when using separate technical solutions at different stages, and ensuring the continuity and synergy between each step of the pre-layout processing. Workers do not need to frequently switch between different technical solutions; they can complete all preparatory work from data acquisition to layout positioning based on this unified system, greatly simplifying the pre-layout processing flow and reducing operational complexity. Simultaneously, the full-process technical integration allows the layout solution to comprehensively consider factors such as space utilization efficiency, production feasibility, and positional accuracy, further enhancing the scientific and rational nature of the layout solution. This provides comprehensive and systematic technical support for efficient and high-quality printed circuit board layout production, effectively improving overall production efficiency and substrate resource utilization.

[0119] The present invention also provides a processing system for printed circuit board layout, the system being used to perform a processing method for printed circuit board layout, the system comprising:

[0120] The contour data acquisition module is used to acquire contour images of irregular circuit boards through an image scanning device and extract the set of edge point coordinates using image recognition technology.

[0121] The minimum bounding rectangle calculation module is used to extract the maximum and minimum values ​​in the x and y directions from the coordinates of the edge points, calculate the width and height of the minimum bounding rectangle of the circuit board, and obtain its area.

[0122] The circuit board area calculation module uses a polygon area calculation method based on vector cross product to calculate the actual area of ​​irregular circuit boards.

[0123] The effective proportion analysis module calculates the effective proportion by comparing the ratio of the actual area of ​​the circuit board to the area of ​​the minimum enclosing rectangle, and compares it with a preset threshold. Based on this comparison result, it determines whether a single circuit board needs to be optimized by combining multiple circuit boards.

[0124] The multi-circuit board combination optimization module is activated when the effective proportion is below a threshold. It provides manual-assisted combination optimization functions, supports the rotation and position adjustment of multiple circuit boards, and recalculates the outline, area and effective proportion of the combined circuit board.

[0125] The effective layout area determination module is used to collect the overall size of the substrate and the width of the invalid edge area, and calculate the length and width of the effective area that can be used for layout.

[0126] The layout quantity calculation module is used to calculate the total number of substrates that can be laid out based on the effective layout area size and the circuit board size;

[0127] The layout coordinate positioning module calculates the lower left corner coordinates of each circuit board in the effective layout area of ​​the substrate by using the row and column indices and size parameters of the irregular circuit boards in the effective layout area of ​​the substrate.

[0128] It should be stated that all user data collected in this application was collected with the user's consent and authorization, and the use of user data is legal and compliant, and the use and processing of user data comply with the relevant laws, regulations and standards of the relevant regions.

[0129] Furthermore, any content not described in detail in this specification is existing technology known to those skilled in the art.

[0130] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0131] The above formulas are all dimensionless calculations. Dimensionless calculation involves introducing a reference benchmark, such as the maximum, minimum, standard deviation, or theoretical extreme value of a physical quantity, to transform the original physical quantity into a dimensionless relative value. This value is usually mapped to a specific interval, such as [0,1] or [-1,1], which eliminates the influence of units while preserving the relative size relationship of the physical quantities. The formula is derived from software simulation based on a large amount of collected data to obtain the most recent real-world results. The preset parameters and thresholds in the formulas are set by those skilled in the art according to the actual situation.

[0132] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

[0133] The various embodiments of this application have been described above. These descriptions are exemplary and not exhaustive, nor are they limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is chosen to best explain the principles, practical application, or improvement of the technology in the market, or to enable others skilled in the art to understand the embodiments disclosed herein.

Claims

1. A method of processing before layout of a printed circuit board, characterized by, The method comprises the following steps: Firstly, an image scanning device is used to scan the irregular circuit board to obtain an image containing the outline of the circuit board; then, an image recognition technique is used to extract a set of edge point coordinates of the outline of the circuit board; the edge point coordinates in the set of edge point coordinates take a fixed edge of the substrate as an x-axis and a direction perpendicular to the x-axis as a y-axis; Second step, in all edge points of x coordinate and y coordinate, extract the x coordinate of the rightmost edge point and the x coordinate of the leftmost edge point of the irregular circuit board in the horizontal direction as the maximum value x max and the minimum value x min ; and The y coordinate of the uppermost edge point and the y coordinate of the lowermost edge point of the extracted irregular circuit board in the vertical direction are extracted as the maximum value y max The minimum value y min ; then the maximum value x max is subtracted from the minimum value x min , and the maximum value y max is subtracted from the minimum value y min , respectively, to obtain the width and height of the minimum enclosing rectangle of the single irregular circuit board, and then the width and the height are multiplied to obtain the area of the minimum enclosing rectangle of the circuit board. Thirdly, the area of the irregular circuit board is calculated based on vector cross multiplication; the area of the polygon is obtained by sequentially calculating the sum of the cross multiplication of vectors formed by adjacent vertices and then taking half of the absolute value; Fourthly, the effective proportion of the area of the irregular circuit board in the area of the minimum enclosing rectangle is determined; Fifthly, if the effective proportion of the single irregular circuit board in the minimum enclosing rectangle is less than a preset effective proportion threshold, manual auxiliary layout is used for multi-circuit board combination optimization analysis; The multi-circuit board combination optimization analysis is as follows: From the irregular circuit boards to be laid out, two or more circuit boards are selected; then, each selected circuit board is manually rotated, and the position of each circuit board is manually adjusted based on the rotation to form a combined circuit board; Then, the outline data of the combined circuit board is obtained in the first manner, the minimum enclosing rectangle area of the combined circuit board is calculated in the second manner, the area of the combined circuit board is calculated in the third manner, and the effective proportion of the combined circuit board is calculated in the fourth manner; Then, from the combined circuit boards and the single irregular circuit board, the one with the maximum effective proportion is selected to calculate the number of circuit boards that can be laid out on the substrate and determine the layout coordinates of the circuit boards.

2. The method of claim 1, wherein: If the effective proportion of the single irregular circuit board in the minimum enclosing rectangle is greater than the preset effective proportion threshold, the number of circuit boards that can be laid out on the substrate is directly calculated and the layout coordinates of the circuit boards are directly determined.

3. The method of claim 2, wherein: the first and second layers are formed of a material having a dielectric constant of less than 3.

0. The logic of calculating the number of circuit boards that can be laid out on the substrate and determining the layout coordinates of the circuit boards is consistent for the single irregular circuit board and the combined circuit boards.

4. The method of claim 2, wherein: The number of circuit boards that can be laid out on the substrate is calculated as follows: ​ The overall length, overall width and edge invalid area width of the substrate are collected, and then the overall length of the circuit board corresponding to the substrate is marked as L, the overall width is marked as B; the edge invalid area width includes the width of the invalid area of the substrate edge in the x-axis direction and the width in the y-axis direction, and is marked as K respectively x and K y ; wherein the left and right sides of the x-axis direction each have an invalid area with a width of K x , and the upper and lower sides of the y-axis direction each have an invalid area with a width of K y . Subsequently, the length LY and the width BY of the effective layout area corresponding to the substrate are obtained by subtracting 2K from the overall length L and the overall width B, respectively. x Subsequently, the length LY and the width BY of the effective layout area corresponding to the substrate are obtained by subtracting 2K from the overall length L and the overall width B, respectively. y Subsequently, the length LY and the width BY of the effective layout area corresponding to the substrate are obtained by subtracting 2K from The width and height of the minimum enclosing rectangle of the single irregular circuit board are denoted as W and H respectively; By: , the total number N of circuit boards that can be arranged in the effective layout area corresponding to the substrate is calculated; In the formula, N x is the number of circuit boards that can be arranged in the x-axis direction corresponding to the effective layout area of the substrate, N y is the number of circuit boards that can be arranged in the y-axis direction corresponding to the effective layout area of the substrate, and ⌊ ⌋ represents a down rounding operation.

5. The method of claim 4, wherein: wherein, The overall length of the substrate is determined along the x-axis direction, and the overall width of the substrate is determined along the y-axis direction; the effective layout area refers to an area on the substrate for arranging and placing the printed circuit boards to be processed, which is the remaining operable area after excluding the invalid area corresponding to the edge of the substrate.

6. The method of claim 2, wherein: The layout coordinates of the single irregular circuit board are determined as follows: ​ By: The coordinates (X m，k ,Y m，k ) of the lower left corner of the single irregular circuit board are calculated. m，k m，k wherein X m，u is the x-coordinate of the lower left corner of the circuit board in the mth row and the u-th column; Y m，u is the y-coordinate of the lower left corner of the circuit board in the mth row and the u-th column; m and u are respectively the row index and the column index used to identify the arrangement position of the irregular circuit board in the effective layout area of the substrate along the y-axis direction and along the x-axis direction, wherein the values of m and u both start from 0, i.e. the 0th row is the lowermost row in the vertical direction, and the 0th column is the leftmost column in the horizontal direction.

7. The method of claim 6, wherein: In the layout planning, the effective layout area of the substrate is divided into multiple rows along the vertical direction from bottom to top, and the value of m represents the row number of the current circuit board; meanwhile, the effective layout area of the substrate is divided into multiple columns along the horizontal direction from left to right, and the value of u represents the column number of the current circuit board. ​ 8. A system for performing a method of processing a printed circuit board prior to layout according to any one of claims 1 to 7, characterized in that The system comprises: an outline data acquisition module, configured to acquire the outline image of the irregular circuit board by using an image scanning device and extract a set of edge point coordinates by using an image recognition technique; The minimum enclosing rectangle calculation module is configured to extract maximum and minimum values in x and y directions from the edge point coordinates, calculate the width and height of the minimum enclosing rectangle of the circuit board, and obtain the area of the minimum enclosing rectangle; The circuit board area calculation module is configured to calculate the actual area of the irregular circuit board by using a polygon area calculation method based on vector cross multiplication; The effective proportion analysis module is configured to calculate the effective proportion by comparing the actual area of the circuit board with the area of the minimum enclosing rectangle, and compare the effective proportion with a preset threshold value; and determine whether the single circuit board needs to be subjected to multi-circuit board combination optimization according to the comparison result; The multi-circuit board combination optimization module is configured to be started when the effective proportion is lower than the threshold value, provide an artificial aided combination optimization function, support rotation and position adjustment of the multi-circuit boards, and recalculate the contour, area and effective proportion after combination; The effective layout area determination module is configured to collect the overall size of the substrate and the width of the edge invalid area, and calculate the length and width of the effective area available for layout; The number of circuit boards available for layout calculation module is configured to calculate the total number of circuit boards available for layout of the substrate according to the effective layout area size and the circuit board size; The layout coordinate positioning module is configured to calculate the lower left corner coordinates of each circuit board in the effective area of the substrate according to the row and column indexes and size parameters of the irregular circuit board in the effective layout area of the substrate.

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