Holding device, alignment device, film forming device, film forming method, and manufacturing method

Abstract

A holding device is provided with: a holding member that holds an object; a support member that supports the holding member in a suspended state; and a first weight member provided to the holding member. The outer shape of the holding member has a polygonal shape including a first side portion, and the first weight member is disposed along the first side portion and is disposed closer to the center side of the first side portion than an end portion of the first side portion.

Description

TECHNICAL FIELD

[0001] The present application relates to a holding device, an alignment device, a film forming device, a film forming method, and a manufacturing method. BACKGROUND

[0002] As a mechanism for holding an object, a mechanism for supporting an object in a levitated state has been proposed. For example, a mechanism for supporting a stage for holding a substrate in a levitated state in a semiconductor exposure device is disclosed in Patent Literature 1. In such a holding mechanism, a counterweight member is used to adjust a levitated posture of the stage, and the stage is maintained in a horizontal posture, for example.

[0003] PRIOR ART DOCUMENTS

[0004] PATENT LITERATURE

[0005] Patent Literature 1: Japanese Patent Application Laid-Open No. 2004-342987 SUMMARY

[0006] PROBLEMS TO BE SOLVED BY THE INVENTION

[0007] While it is advantageous that the counterweight member is provided to adjust the levitated posture, on the other hand, the provision of the counterweight member sometimes has an influence on the vibration characteristics of the mechanism for holding the object. For example, the natural vibration frequency of the mechanism for holding the object sometimes decreases due to the provision of the counterweight member, and the vibration characteristics deteriorate.

[0008] An object of the present application is to suppress the influence of the counterweight member on the vibration characteristics while adjusting the levitated posture with the counterweight member.

[0009] SOLUTION TO THE PROBLEM

[0010] According to the present application, there is provided a holding device including:

[0011] a holding member that holds an object;

[0012] a supporting member that supports the holding member in a levitated state; and

[0013] a first counterweight member provided to the holding member, characterized in that

[0014] an outer shape of the holding member is a polygonal shape including a first edge portion,

[0015] the first counterweight member is disposed along the first edge portion, and is disposed at a position on a central side of the first edge portion from an end portion of the first edge portion.

[0016] EFFECT OF THE INVENTION

[0017] According to the present application, it is possible to suppress the influence of the counterweight member on the vibration characteristics while adjusting the levitation posture using the counterweight member. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 is a schematic view showing a part of the structure of a production line of an electronic device to which the present application can be applied.

[0019] Figure 2 is a schematic view of a film formation apparatus of an embodiment of the present application.

[0020] Figure 3 is a partial enlarged view of Figure 2 .

[0021] Figure 4 is a schematic view showing an example of the operation of the film formation apparatus.

[0022] Figure 5 is a schematic view showing an example of the operation of the film formation apparatus.

[0023] Figure 6 is a plan view of the holding apparatus in the A-A line direction. Figure 3

[0024] Figure 7 is a perspective view of the holding unit 3.

[0025] Figure 8A is an explanatory view of the arrangement region of the counterweight member.

[0026] Figure 8B is an explanatory view of the arrangement region of the counterweight member.

[0027] Figure 9 is a schematic view showing a primary natural vibration mode of the main body.

[0028] Figure 10A is a schematic view showing an example of an organic EL display device.

[0029] Figure 10B is a schematic view showing an example of an organic EL display device.

[0030] Figure 11A is a plan view showing an arrangement example of the counterweight member.

[0031] Figure 11B is a plan view showing an arrangement example of the counterweight member.

[0032] Figure 11C is a plan view showing an arrangement example of the counterweight member.

[0033] Figure 12 is a side view showing an arrangement example of the counterweight member. ​

[0034] Figure 13A is a plan view showing the number of configurations of the weight member.

[0035] Figure 13B is a plan view showing the number of configurations of the weight member.

[0036] Figure 14A is a plan view showing an example of the outer shape of the main body portion.

[0037] Figure 14B is a plan view showing an example of the outer shape of the main body portion. DETAILED DESCRIPTION

[0038] Hereinafter, the embodiments will be described in detail with reference to the drawings. Furthermore, the following embodiments are not intended to limit the technical scope of the present application. Although a plurality of features are described in the embodiments, all of the above-described features are not necessarily essential to the application, and a plurality of features can be arbitrarily combined. In the drawings, the same or similar structures are designated by the same reference numerals, and repetitive description is omitted.

[0039] <First Embodiment>

[0040] <Production Line of Electronic Device>

[0041] Figure 1 is a schematic view showing a part of the structure of a production line of an electronic device to which the present application can be applied. Figure 1 The production line of Fig. 1 is used, for example, for manufacturing a display panel of an organic EL display device for a smartphone, and a substrate 1 is sequentially transported to film formation modules 401, and film formation of an organic EL is performed on the substrate 1.

[0042] In the film formation module 401, a plurality of film formation chambers 403a to 403d that perform film formation processing on the substrate 1 and a mask housing chamber 405 that houses masks before and after use are arranged around a transport chamber 402 that has an octagonal shape in plan view. A transport robot 402a that transports the substrate 1 is arranged in the transport chamber 402. The transport robot 402a includes a hand that holds the substrate 1 and a multi-joint arm that moves the hand in the horizontal direction. In other words, the film formation module 401 is a cluster-type film formation unit in which the plurality of film formation chambers 403a to 403d are arranged so as to surround the periphery of the transport robot 402a. Furthermore, in the case where the film formation chambers 403a to 403d are collectively referred to or in the case where no distinction is made, the expression "film formation chamber 403" is used.

[0043] On the transport direction (arrow direction) of the substrate 1, a buffer chamber 406, a rotation chamber 407, and a handover chamber 408 are arranged on the upstream side and the downstream side of the film formation module 401, respectively. During the manufacturing process, each chamber is maintained in a vacuum state. Furthermore, in the case where the buffer chamber 406, the rotation chamber 407, and the handover chamber 408 are collectively referred to or in the case where no distinction is made, the expression "chamber 406" is used. Figure 1Only one film forming module 401 is illustrated, but the production line of the present embodiment has a plurality of film forming modules 401 having a structure composed of a buffer chamber 406, a rotation chamber 407, and a transfer chamber 408, and connected by a connecting device. Further, the structure of the connecting device is not limited thereto, and for example, can be composed of only the buffer chamber 406 or the transfer chamber 408.

[0044] The transport robot 402a performs the carrying-in of the substrate 1 from the upstream-side transfer chamber 408 to the transport chamber 402, the transport of the substrate 1 between the film forming chambers 403, the transport of the mask between the mask housing chamber 305 and the film forming chamber 303, and the carrying-out of the substrate 1 from the transport chamber 402 to the downstream-side buffer chamber 406.

[0045] The buffer chamber 406 is a chamber for temporarily housing the substrate 1 according to the operation state of the production line. In the buffer chamber 406, a substrate housing shelf, also referred to as a cassette, and a lifting mechanism are provided. The substrate housing shelf has a multi-layer structure capable of housing a plurality of substrates 1 in a state in which the processed surface (the film forming surface) of the substrate 1 is oriented downward in the direction of gravity. The lifting mechanism lifts the substrate housing shelf in order to match the layer into which the substrate 1 is carried-in or carried-out with the transport position. Thus, a plurality of substrates 1 can be temporarily accommodated and held in the buffer chamber 406.

[0046] The rotation chamber 407 is provided with a device that changes the orientation of the substrate 1. For example, the orientation of the substrate 1 is rotated 180 degrees in the rotation chamber 407 by a transport robot provided in the rotation chamber 407. The transport robot provided in the rotation chamber 407 rotates 180 degrees in a state in which the substrate 1 received by the buffer chamber 406 is supported and is delivered to the transfer chamber 408, whereby the front end and the rear end of the substrate are exchanged in the buffer chamber 406 and the transfer chamber 408. Thus, the orientation of the substrate 1 when carried into the film forming chamber 403 becomes the same orientation in each film forming module 401, and therefore, it is possible to make the scanning direction with respect to the film formation of the substrate 1 and the orientation of the mask consistent in each film forming module 401. By providing such a structure, it is possible to make the orientation of the mask provided in the mask housing chamber 405 consistent in each film forming module 401, and it is possible to simplify the management of the mask and improve the availability.

[0047] The control system of the production line includes the upper device 400 that controls the entire production line as a host computer, and the control devices 140a to 140d, 409, and 410 that control each structure, which can communicate via a wired or wireless communication line 400a. The control devices 140a to 140d are provided corresponding to the film forming chambers 403a to 403d, and control the film forming device 100 described later. Further, in the case of collectively referring to the control devices 140a to 140d or in the case of not distinguishing, it is expressed as the control device 140.

[0048] The control device 409 controls the conveyance robot 402a. The control device 410 controls the devices of the rotation chamber 307. The host device 400 transmits information related to the substrate 1, a conveyance timing, and the like to each of the control devices 140, 409, and 410, and each of the control devices 140, 409, and 410 controls each structure based on the received instructions.

[0049] <Deposition Apparatus>

[0050] Figure 2 is a schematic view of a deposition apparatus 100 that schematically illustrates an embodiment of the present application. The deposition apparatus 100 is an apparatus that deposits a vapor-deposited substance on a substrate 1, and forms a thin film of the vapor-deposited substance in a predetermined pattern on the substrate 1 using a mask 2. The material of the substrate 1 on which deposition is performed in the deposition apparatus 100 can be appropriately selected from, for example, a material such as glass, resin, metal, and the like. As the vapor-deposited substance, a substance such as an organic material, an inorganic material (metal, metal oxide, and the like), and the like is used. In the deposition process, the substrate 1 is placed on the mask 2, and the deposition process is performed in a state in which the substrate 1 and the mask 2 are overlapped with each other.

[0051] The deposition apparatus 100 can be applied, for example, to a manufacturing apparatus of an electronic device such as a display device (flat panel display and the like), a thin-film solar cell, an organic photoelectric conversion element (organic thin-film photographic element), and the like, an optical member, and the like, and in particular, to a manufacturing apparatus of an organic EL panel. In the following description, an example in which the deposition apparatus 100 deposits the substrate 1 by vacuum evaporation is assumed, but the present application is not limited thereto, and various deposition methods such as sputtering, CVD, and the like can be applied. In each of the drawings, an arrow Z indicates a vertical direction (a direction of gravity), and arrows X and Y indicate horizontal directions that are orthogonal to each other.

[0052] The deposition apparatus 100 has a vacuum chamber 110 (sometimes referred to simply as a chamber 110) that has a box shape with a bottom portion 111, a side portion 112, and a top portion 113. An inner space 114 of the vacuum chamber 110 is maintained in a vacuum environment or an inert gas environment such as nitrogen. In the present embodiment, the vacuum chamber 110 is connected to a vacuum pump that is not shown. In the present specification, "vacuum" refers to a state in which a gas having a lower pressure than atmospheric pressure fills, in other words, a state of reduced pressure.

[0053] In the inner space 114 of the vacuum chamber 110, a holding device 300 that holds the substrate 1 in a horizontal attitude, a mask support unit 9 that supports the mask 2, a vapor deposition unit 12, and a plate unit 11 are arranged.

[0054] The mask 2 has an opening pattern corresponding to a thin film pattern formed on the substrate 1, and is placed on the mask stage 91. Further, the mask stage 91 can be replaced by other members that fix the mask 2 to a predetermined position. As the mask 2, a mask having a configuration in which a mask foil having a thickness of several μm to several tens of μm is fixed by welding on a frame-shaped mask frame can be used. The material of the mask is not particularly limited, but a metal having a small coefficient of thermal expansion such as Invar is preferably used. The film formation process is performed in a state in which the substrate 1 is placed on the mask 2 and the substrate 1 and the mask 2 are overlapped with each other.

[0055] The plate unit 11 has a cooling plate 11a, a magnet plate 11b, and a plate movable portion 11c. The cooling plate 11a is disposed below the magnet plate 11b, and the cooling plate 11a and the magnet plate 11b are suspended by the plate movable portion 11c so as to be displaceable in the Z direction. The cooling plate 11a has a function of cooling the substrate 1 attracted to the holding portion 6 by approaching the holding portion 6 at the time of film formation. The cooling plate 11a is not limited to actively cool the substrate 1 by having a water cooling mechanism or the like, but can be a plate-shaped member that steals heat from the substrate 1 by approaching the holding portion 6 although a water cooling mechanism or the like is not provided. The magnet plate 11b is a plate that attracts the mask 2 by magnetic force, and is placed above the substrate 1 to improve the tightness of the substrate 1 and the mask 2 at the time of film formation.

[0056] Further, the cooling plate 11a and the magnet plate 11b can be appropriately omitted. For example, in the case where a cooling mechanism is provided to the holding portion 6, the cooling plate 11a can not be provided. In addition, as a structure in which the holding portion 6 attracts the mask 2, a structure in which the magnet plate 11b is not provided can be used.

[0057] The evaporation unit 12 is constituted by a heater, a baffle, a driving mechanism of an evaporation source, an evaporation rate monitor, and the like, and is an evaporation source that evaporates an evaporation material on the substrate 1. More specifically, in the present embodiment, the evaporation unit 12 is a linear evaporation source in which a plurality of nozzles (not shown) are arranged in the X direction and an evaporation material is discharged from each nozzle. For example, the linear evaporation source is reciprocally moved in the Y direction (the depth direction of the apparatus) by an evaporation source moving mechanism (not shown). In the present embodiment, the evaporation unit 12 is provided in the vacuum chamber 110 together with the alignment device 2 described later.

[0058] <Alignment Device>

[0059] The film formation apparatus 1 has an alignment device 200 that performs alignment of the substrate 1 and the mask 2. The alignment device 200 has a holding device 300 that holds the substrate 1, a mask support unit 9, a position measuring unit 10, a measurement unit 13, and a damping unit 120. In addition, the holding device 300 has a holding unit 3 that holds the substrate 1, and the like. Each structure of the alignment device 200 will be described below.

[0060] The mask support unit 9 includes a mask stage 91, a mask support column 92, a mask lifting mechanism 93, and an airtight member 94. The mask stage 91 is fixed to the mask support column 92. The mask support column 92 is connected to the mask lifting mechanism 93 through the airtight member 94 provided between the support frame 130 and the top portion 113. The mask lifting mechanism 93 is provided to the support frame 130 to lift the mask support column 92 in the Z direction. The airtight member 94 is, for example, a bellows, and has airtightness and flexibility. The airtight member 94 can prevent the vacuum degree of the vacuum chamber 110 from being damaged when the mask support column 92 is lifted.

[0061] The position measurement unit 10 measures the position of the holding unit 3 that holds the substrate 1. The position measurement unit 10 is provided with a plurality of (only one of which is illustrated in the figure) in the X direction, the Y direction, and the Z direction of the mask stage 91 in a manner to measure the position of the holding unit 3. The floating attitude (for example, the inclination with respect to the X-Y plane) and the floating position (for example, the position in the Z direction) of the holding unit 3 can be adjusted based on the position information in each direction of the holding unit 3 measured by the position measurement unit 10. The position measurement unit 10 can also use, for example, a laser displacement meter that measures the distance to an object in a non-contact manner. Figure 2

[0062] The measurement unit 13 measures the positional deviation of the substrate 1 held by the holding unit 3 and the mask 2. The measurement unit 13 is provided to the support frame 130, and can take an image in the vacuum chamber 110 through the window portions 130a, 113a formed in the support frame 130 and the vacuum chamber top plate 113. Alignment marks (not illustrated) are formed on the substrate 1 and the mask 2, respectively. The measurement unit 13 takes an image of each of the alignment marks of the substrate 1 and the mask 2. Based on the measurement result of the measurement unit 13, the holding device 300 is controlled by the control device 140 described later to eliminate the positional deviation of each alignment mark and adjust the relative position of the substrate 1 and the mask 2.

[0063] The measurement unit 13 can use, for example, a variety of alignment cameras such as a low magnification CCD camera (coarse camera) that has a relatively wide field of view but has a lower resolution, a high magnification CCD camera (fine camera) that has a relatively narrow field of view but has a higher resolution (for example, on the order of several μm). Thus, the positional deviation of the substrate 1 and the mask 2 can be measured with high accuracy while measuring the approximate positional deviation of the substrate 1 and the mask 2.

[0064] ​The vibration damping unit 120 consists of a vibration damping platform base 121, a vibration damping platform 122, etc. The vibration damping unit 120 can also be, for example, an active vibration damping device or a passive vibration damping device such as vibration damping rubber. The vibration damping unit 120 is installed on the upper part of the vacuum chamber top plate 113, and suppresses the transmission of vibration to the support frame 130 side when the vacuum chamber 110 vibrates. Therefore, even when the vacuum chamber 110 vibrates, the alignment device 200 can perform high-precision alignment.

[0065] <Holding device>

[0066] Apart from Figure 2 In addition, it also uses Figure 3 The holding device 300 will be described. Figure 3 It is Figure 2 The image shows an enlarged view of the holding device 300 and its surroundings. The holding device 300 includes a holding unit 3 for holding a substrate, a support unit 7 for supporting the holding unit 3 in a suspended state, and a position adjustment unit 8 for displacing the holding unit 3.

[0067] The holding unit 3 has a holding portion 6 for holding the substrate 1 and a plate member, namely the main body 5, that supports the holding portion 6. The holding portion 6 is provided on the lower surface D of the main body 5. The holding portion 6 is, for example, an electrostatic chuck that attracts the substrate 1 by electrostatic force. The electrostatic chuck, for example, has a structure in which circuits such as metal electrodes are embedded inside a ceramic substrate (also called a matrix). When a positive (+) voltage and a negative (-) voltage are applied to the metal electrodes, polarized charges are induced on the substrate 1 through the ceramic substrate, and the substrate 1 is fixed to the adsorption surface (lower surface) of the holding portion 6 by the electrostatic attraction (electrostatic force) between the substrate 1 and the holding portion 6.

[0068] In this embodiment, the support unit 7 supports the holding unit 3 in a suspended state using magnetic force. The support unit 7 includes a magnetic force generating part 7a disposed on the main body 5 and a magnetic force generating part 7b disposed on the fixing member 4. The fixing member 4 is fixed to the vacuum chamber 110 and supports the magnetic force generating part 7b. The magnetic force generating parts 7a and 7b are permanent magnets. The holding unit 3 can be magnetically levitated and supported relative to the fixing member 4 in a non-contact manner using the magnetic attraction (or magnetic repulsion) between the magnetic force generating parts 7a and 7b. The support unit 7 can generate a levitation force equivalent to the weight of the holding unit 3.

[0069] The position adjustment unit 8 in this embodiment is a unit that uses magnetic force to displace the holding unit 3, such as a linear motor. The position adjustment unit 8 has a magnetic force generating part 8a provided on the main body 5 and a magnetic force generating part 8b provided on the fixing member 4. One of the magnetic force generating parts 8a and 8b is a permanent magnet, and the other is an electromagnet.

[0070] Position adjustment unit 8 is provided with multiple sets (see below)Figure 6 (etc.), which enables the holding unit 3 to perform translational displacement in the XYZ direction, rotational displacement around the X, Y, and Z axes, and attitude adjustment (tilt relative to the horizontal direction).

[0071] <Control Device>

[0072] The control device 140 controls the entire film-forming apparatus 100. The control device 140 includes a processing unit 140a, a storage unit 140b, an input / output interface (I / O) 140c, and a communication unit 140d. The processing unit 140a, a processor such as a CPU, executes programs stored in the storage unit 140b to control the film-forming apparatus 100. The storage unit 140b is a storage device such as ROM, RAM, or HDD, which stores various control information in addition to the programs executed by the processing unit 140a. The I / O 140c is the interface for transmitting and receiving signals between the processing unit 140a and external devices. The communication unit 140d is a communication device that communicates with the aforementioned apparatus or other control devices via communication lines.

[0073] <Example of the operation of the film-forming device>

[0074] use Figure 4 and Figure 5 An example of the operation of the film-forming device 100 will be explained. Figure 4 and Figure 5 An example of the state of the film-forming apparatus 100 is shown when the substrate 1 is moved into the vacuum chamber 114 and the substrate 1 and the mask 2 are aligned, and a film is formed on the substrate 1 by vapor deposition.

[0075] Figure 4 State ST41 shows the use of Figure 1 The image shows an example of the film deposition apparatus 100 before the transport robot 402a moves the substrate 1 into the internal space 114 of the vacuum chamber 110. The mask stage 91 is lowered using the mask lifting mechanism 93. Figure 4 Starting from state ST41, the substrate 1 is moved into the internal space 114 and held in the holding part 6 of the holding unit 3.

[0076] Figure 4 State ST42 shows the state of the film forming apparatus 100 during the alignment operation of substrate 1 and mask 2. Substrate 1 is held in the holding portion 6. Mask 2 is raised to the alignment position. Alignment of substrate 1 and mask 2 is performed with substrate 1 and mask 2 slightly separated. Figure 4 and Figure 5 In order to make the action easier to understand, the gap between substrate 1 and mask 2 is exaggerated.

[0077] During the alignment process, firstly, the position measurement unit 10, installed on the mask stage 91, measures the floating position of the holding unit 3. Based on the information measured by the position measurement unit 10, the alignment is then performed using... Figure 1 The control device 140 shown performs coordinate transformation and calculates the position information of the six degrees of freedom (X direction, Y direction, Z direction, θX direction, θY direction, θZ direction) of the holding unit 3. Based on the position information of the six degrees of freedom of the holding unit 3, the control device 140 controls the position adjustment unit 8 to adjust the suspension position of the holding unit 3. The position adjustment unit 8 maintains the suspension attitude of the holding unit 3 at a horizontal position. In this way, by adjusting the suspension attitude of the holding unit 3 to a horizontal position, high-precision alignment can be performed.

[0078] Next, the measuring unit 13 photographs the alignment marks set on the substrate 1 and the mask 2, and measures the positional offset between the substrate 1 and the mask 2. "Positional offset" refers to the relative offset between the substrate 1 and the mask 2 in the X direction, Y direction, and θ direction about the Z-axis. The control device 104 controls the position adjustment unit 8 to reduce the positional offset and adjusts the position of the holding unit 3. Measurement and position adjustment are repeated until the positional offset is within an acceptable range. Thus, the relative position of the substrate 1 with respect to the mask 2 is adjusted.

[0079] During the alignment process, substrate 1 is placed on mask 2. For example... Figure 5 As shown in state ST51, the cooling plate 11a and magnet plate 11b of the plate unit 11 are lowered to the opening 50a of the main body 5. The plate unit 11 descends toward the opening 50a of the main body 5, as... Figure 5 As shown in state ST52, the cooling plate 11a is brought close to the holding part 6. The mask 2 is attracted by the magnetic force of the magnet plate 11b, making the mask 2 and the substrate 1 in close contact. Then, a film formation process is performed to discharge the vapor-deposited material from the vapor deposition unit 12 to the substrate 1 through the mask 2. A thin film of the vapor-deposited material is formed on the substrate 1.

[0080] <Construction of the retaining unit>

[0081] The detailed structure of the holding unit 3 will be described. As described above, the alignment operation to adjust the positional offset between the substrate 1 and the mask 2 is performed while the holding unit 3 is suspended. By placing a counterweight member in the main body 5, the weight balance of the holding unit 3 can be adjusted, making it easier to make the suspended posture of the holding unit 3 horizontal. On the other hand, the placement of the counterweight member can sometimes affect the vibration characteristics of the holding unit 3. In this embodiment, a structure is shown that, while adjusting the suspended posture of the holding unit 3 using the counterweight member, the influence of the counterweight member on the vibration characteristics is suppressed by the placement of the counterweight member. Figure 6is a plan view of the holding unit 3, corresponding to Figure 3 the A-A line direction view. Figure 7 is a perspective view of the holding unit 3. In the following description, for convenience, the Y direction is sometimes referred to as the front-rear direction, and the X direction is sometimes referred to as the left-right direction.

[0082] The main body 5 forms the outer shape of the holding unit 3 in plan view. The outer shape of the main body 5 is a polygonal shape, particularly a rectangle (square). The point P is the center of the outer shape of the main body 5. The main body 5 is a plate-like member having a circular opening 50a in the center portion thereof. The opening 50a has a size that allows the cooling plate 11a and the magnet plate 11b of the plate unit 11 to pass therethrough.

[0083] The main body 5 has a front edge portion 5F and a rear edge portion 5B facing each other in the Y direction, and a left edge portion 5L and a right edge portion 5R facing each other in the X direction between the front edge portion 5F and the rear edge portion 5B, and has corner portions 5a to 5d. The corner portions 5a and 5b are corner portions of both end portions of the front edge portion 5F. The corner portions 5c and 5d are corner portions of both end portions of the rear edge portion 5B. The corner portions 5a and 5d are corner portions of both end portions of the left edge portion 5L. The corner portions 5b and 5c are corner portions of both end portions of the right edge portion 5R. The front edge portion 5F and the rear edge portion 5B are parallel, and the left edge portion 5L and the right edge portion 5R are parallel. The directions of the front edge portion 5F and the rear edge portion 5B are orthogonal to the directions of the left edge portion 5L and the right edge portion 5R.

[0084] The magnetic force generating portions 7b of the support units 7, the magnetic force generating portions 8b of the position adjustment units 8, and the counterweight members 15 are provided on the upper surface U of the main body 5. The surface U is the surface on the side of the fixed member 4. The holding portion 6 is provided on the lower surface D of the main body. The lower surface D is the surface on the side of the adsorption mask 2.

[0085] The holding device 300 of the present embodiment is provided with four support units 7 and four position adjustment units 8. Therefore, four magnetic force generating portions 7b and four magnetic force generating portions 8b are provided on the upper surface U of the main body 5. The four magnetic force generating portions 7b and the four magnetic force generating portions 8b are arranged at positions on the diagonal lines of the main body 5. Two of the four magnetic force generating portions 8b are arranged so as to extend in the Y direction, and the remaining two are arranged so as to extend in the X direction.

[0086] In the case of the present embodiment, the counterweight members 15 are provided for each of the edge portions 5F, 5B, 5L, and 5R, and there are four in total. By adjusting the weights of the respective counterweight members 15, it is possible to adjust the levitation posture of the holding unit 3. In the present embodiment, the counterweight members 15 are detachably attached to the main body 5 using fixing members 150. The fixing members 150 are, for example, bolts that are screwed into threaded holes formed in the main body 5. The replacement of the counterweight members 15 having different weights can be easily performed, and the levitation posture of the holding unit 3 can be adjusted more simply.

[0087] Each of the counterweight members 15 is disposed along the corresponding edge portion 5F, 5B, 5L, or 5R. Each of the counterweight members 15 is disposed at a position closer to the center 51 to 54 than the end portion (corner portion 5a to 5d) of the corresponding edge portion 5F to 5R.

[0088] For example, the counterweight member 15 disposed along the front edge portion 5F is disposed at a position closer to the center 51 of the front edge portion 5F than the corner portions 5a and 5b. Similarly, the counterweight member 15 disposed along the rear edge portion 5B is disposed at a position closer to the center 53 of the rear edge portion 5B than the corner portions 5c and 5d. The counterweight member 15 disposed along the left edge portion 5L is disposed at a position closer to the center 52 of the left edge portion 5L than the corner portions 5b and 5c. The counterweight member 15 disposed along the right edge portion 5R is disposed at a position closer to the center 54 of the right edge portion 5R than the corner portions 5a and 5d.

[0089] In the case of the present embodiment, the position of each of the counterweight members 15 along the corresponding edge portion 5F, 5B, 5L, and 5R is disposed so that the center in the longitudinal direction thereof (in other words, the centroid in plan view) is located at each of the centers 51 to 54 of the corresponding edge portion 5F, 5B, 5L, and 5R, but the disposition position of the counterweight member 15 is not limited thereto.

[0090] Reference Figure 8A and Figure 8B will be described. Figure 8A and Figure 8B are explanatory diagrams thereof, and are schematic diagrams of the main body portion 5. Figure 8A is a schematic diagram illustrating the disposition range of the counterweight member 15 along the edge portion 5F of the main body portion 5. The disposition range is, for example, a range L12 which is 3 / 5 of the range centered on the center 51 after the length L1 of the edge portion 5F is equally divided by five. The length L1 is also the length (interval distance) between the edge portion 5L and the edge portion 5R.

[0091] The disposition range can also be a range L11 which is narrower than L12. The range L11 is a range of 2 / 4 centered on the center 51 after the length L1 of the edge portion 5F is equally divided by four. Further, the disposition range can also be a range L10 which is narrower than L11. The range L10 is a range of 1 / 3 centered on the center 51 after the length L1 of the edge portion 5F is equally divided by three. In the present embodiment, the counterweight member 15 is disposed within the range L10.

[0092] Figure 8B are diagrams illustrating the same range as the range L10 of the edge portion 5F with respect to each of the edge portions 5B, 5L, and 5R.

[0093] The range L20 is a range of 1 / 3 of the center 52 after the length L2 of the edge portion 5R is tripartite, and in the present embodiment, the corresponding counterweight member 15 is arranged in the range L20. The length L2 is also the length (interval distance) between the edge portion 5F and the edge portion 5B.

[0094] The range L30 is a range of 1 / 3 of the center 53 after the length L3 of the edge portion 5B is tripartite, and in the present embodiment, the corresponding counterweight member 15 is arranged in the range L30. The length L3 is also the length (interval distance) between the edge portion 5L and the edge portion 5R.

[0095] The range L40 is a range of 1 / 3 of the center 54 after the length L4 of the edge portion 5L is tripartite, and in the present embodiment, the corresponding counterweight member 15 is arranged in the range L40. The length L4 is also the length (interval distance) between the edge portion 5F and the edge portion 5B.

[0096] According to the above structure, in the present embodiment, by arranging the counterweight member 15 at a position closer to the center 51 to 54 of each edge portion 5F to 5L than to the corner portion 5a to 5d of the main body portion 5, it is possible to suppress the influence of the counterweight member 15 on the vibration characteristics, particularly the natural vibration frequency, of the holding unit 3 as described below.

[0097] Referring to Figure 9 The vibration characteristics of the main body portion 5 will be described. Figure 9 is a schematic diagram that schematically shows the first natural vibration mode of the main body portion 5 in a state where there is no counterweight member 15. In the case of displacement of the holding unit 3 or the like, the main body portion 5 will generate a slight vibration. In the first natural vibration mode, due to the shape of the members of the main body portion 5, the amplitude will be large at the corner portions 5a to 5d, and the amplitude will be small at the centers 51 to 54 of each edge portion 5F to 5L. Therefore, when the counterweight member 15 is arranged near the corner portions 5a to 5d, it will act in a direction that increases the amplitude of the vibration. By arranging the counterweight member 15 at a position closer to the centers 51 to 54 than to the corner portions 5a to 5d of the main body portion 5, it is possible to reduce the increase in the amplitude of the vibration, and it is possible to suppress the decrease in the natural vibration frequency.

[0098] Furthermore, the distance from the center of mass (center of gravity position) P of the main body portion 5 is closer on the side of the centers 51 to 54 than on the side of the corner portions 5a to 5d, and therefore, by arranging the counterweight member 15 on the side of the centers 51 to 54, it is possible to make the moment of inertia acting on the counterweight member 15 small. Therefore, as in the present embodiment, by arranging the counterweight member 15 at a position closer to the centers 51 to 54 of each edge portion 5F to 5L than to the corner portions 5a to 5d of the main body portion 5, it is possible to suppress the influence of the counterweight member 15, and it is possible to suppress the decrease in the natural vibration frequency, of the holding unit 3. Figure 8AFor example, compared with the range L12, by arranging the counterweight member 15 in the range L11, it is possible to reduce the influence of the vibration characteristics, and compared with the range L11, by arranging the counterweight member 15 in the range L10, it is possible to reduce the influence of the vibration characteristics.

[0099] <Method for manufacturing electronic device>

[0100] Next, an example of a method for manufacturing an electronic device will be described. Hereinafter, as an example of an electronic device, the structure and the manufacturing method of an organic EL display device will be exemplified. In the case of this example, Figure 1 The exemplified film forming module 401 is provided, for example, at three places on a production line.

[0101] First, an organic EL display device to be manufactured will be described. Figure 10A is a general view of an organic EL display device 500, Figure 10B is a view showing the cross-sectional structure of one pixel.

[0102] As Figure 10A shown in FIG. 1, a plurality of pixels 510 each having a plurality of light emitting elements are arranged in a matrix in a display region 501 of the organic EL display device 500. Details will be described later, but the light emitting elements each have a structure having an organic layer sandwiched by a pair of electrodes.

[0103] Further, the pixel referred to herein means the smallest unit capable of performing display of a desired color in the display region 501. In the case of a color organic EL display device, the pixel 510 is constituted by a combination of a plurality of sub-pixels of a first light emitting element 510R, a second light emitting element 510G, and a third light emitting element 510B each showing a different color of light. The pixel 510 is usually constituted by a combination of three kinds of sub-pixels of a red (R) light emitting element, a green (G) light emitting element, and a blue (B) light emitting element, but is not limited thereto. The pixel 510 can include at least one kind of sub-pixel, preferably two or more kinds of sub-pixels, and more preferably three or more kinds of sub-pixels. As the sub-pixels constituting the pixel 510, for example, a combination of four kinds of sub-pixels of a red (R) light emitting element, a green (G) light emitting element, a blue (B) light emitting element, and a yellow (Y) light emitting element can be exemplified.

[0104] FIG. 10(B) is Figure 10AA partial cross-sectional view at line AB. Pixel 510 has multiple sub-pixels on substrate 520 composed of organic EL elements. The organic EL elements include a first electrode (anode) 521, a hole transport layer 522, one of a red layer 522R, a green layer 522G, or a blue layer 522B, an electron transport layer 523, and a second electrode (cathode) 528. The hole transport layer 522, red layer 522R, green layer 522G, blue layer 522B, and electron transport layer 523 are equivalent to organic layers. The red layer 522R, green layer 522G, and blue layer 522B are respectively formed into patterns corresponding to light-emitting elements (sometimes referred to as organic EL elements) that emit red, green, and blue light.

[0105] Furthermore, the first electrode 521 is formed separately for each light-emitting element. The hole transport layer 522, the electron transport layer 523, and the second electrode 522 can be formed either shared across multiple light-emitting elements 510R, 510G, and 510B, or they can be formed separately for each light-emitting element. That is, as shown... Figure 10B As shown, it is also possible that, based on the hole transport layer 522 being formed as a shared layer covering multiple sub-pixel regions, the red layer 522R, the green layer 522G, and the blue layer 522B are formed separately according to each sub-pixel region, and then the electron transport layer 523 and the second electrode 522 are formed as a shared layer covering multiple sub-pixel regions on top of it.

[0106] In addition, to prevent short circuits between the adjacent first electrodes 521, an insulating layer 529 is provided between the first electrodes 521. Furthermore, since the organic EL layer is susceptible to deterioration due to moisture and oxygen, a protective layer 530 is provided to protect the organic EL element from the effects of moisture and oxygen.

[0107] exist Figure 10B In this design, the hole transport layer 522 and the electron transport layer 523 are represented by a single layer, but depending on the structure of the organic EL display element, they can also be formed by multiple layers having a hole blocking layer and an electron blocking layer. Alternatively, a hole injection layer with a band structure that allows for smooth injection of holes from the first electrode 521 to the hole transport layer 522 can be formed between the first electrode 521 and the hole transport layer 522. Similarly, an electron injection layer can also be formed between the second electrode 528 and the electron transport layer 523.

[0108] Each of the red layer 522R, the green layer 522G, and the blue layer 522B can be formed of a single light-emitting layer or can be formed by stacking a plurality of layers. For example, the red layer 522R can be configured by two layers, a layer on the upper side formed of a red light-emitting layer, and a layer on the lower side formed of a hole-transporting layer or an electron-blocking layer. Alternatively, the red layer 522R can be configured by two layers, a layer on the lower side formed of a red light-emitting layer, and a layer on the upper side formed of an electron-transporting layer or a hole-blocking layer. By providing a layer on the lower side or the upper side of the light-emitting layer as such, it is possible to adjust the light-emitting position of the light-emitting layer, and by adjusting the optical path length, it is possible to improve the color purity of the light-emitting element.

[0109] Further, in this embodiment, an example of the red layer 522R is shown, but the same configuration can be employed in the green layer 522G and the blue layer 522B. Further, the number of stacked layers can be two or more. Further, layers of different materials can be stacked, such as a light-emitting layer and an electron-blocking layer, or layers of the same material can be stacked, such as two or more light-emitting layers.

[0110] Next, an example of a manufacturing method of an organic EL display device will be described. In this embodiment, a case where the red layer 522R is configured by two layers, a lower layer 522R1 and an upper layer 522R2, and the green layer 522G and the blue layer 522B are configured by a single light-emitting layer, is assumed. As the film formation chamber 403, six film formation chambers are assumed.

[0111] First, a substrate 520 on which a circuit (not shown) for driving the organic EL display device 500 and the first electrode 521 are formed is prepared. Further, the material of the substrate 520 is not particularly limited, and the substrate 520 can be configured of glass, plastic, metal, or the like. In this embodiment, as the substrate 520, a substrate on which a film of polyimide is stacked on a glass substrate is used.

[0112] On the substrate 520 on which the first electrode 521 is formed, a resin layer of acrylic or polyimide is bar-coated or spin-coated, and the resin layer is patterned by a photolithography method so as to form an opening in a portion on which the first electrode 521 is formed, and an insulating layer 529 is formed. The opening portion corresponds to a light-emitting region in which the light-emitting element actually emits light. Further, in this embodiment, a large substrate is processed before the insulating layer 529 is formed, and a dicing process of dicing the substrate 520 is performed after the insulating layer 529 is formed.

[0113] The substrate 520 on which the insulating layer 529 is patterned is carried into the first film formation apparatus 100, and a hole-transporting layer 522 is formed on the first electrode 521 in the display region as a common layer. The hole-transporting layer 522 is formed using a mask on which openings are formed for each display region 501 which finally becomes a panel portion of one organic EL display device.

[0114] Next, the substrate 520 on which the hole transport layer 522 is formed is carried into the second film formation chamber 403. The alignment of the substrate 520 and the mask is performed, the substrate 520 is placed on the mask, and the red layer 56R is formed on the portion of the hole transport layer 522 on which the substrate 520 is disposed, that is, the region of the red light emitting element of the substrate 520 which becomes a red sub-pixel. Here, the mask used in the second film formation apparatus is a high-precision mask in which openings are formed in the regions of the substrate 520 which become red sub-pixels among the plurality of regions of the substrate 520 which become sub-pixels of the organic EL display device 500. Thus, the red layer 522R including the red light emitting layer is formed only in the regions of the substrate 520 which become red sub-pixels among the regions of the substrate 520 which become a plurality of sub-pixels. In other words, the red layer 522R is not formed in the regions of the substrate 520 which become blue sub-pixels and green sub-pixels among the regions of the substrate 520 which become a plurality of sub-pixels, and is selectively formed in the regions of the substrate 520 which become red sub-pixels.

[0115] The green layer 522G is formed in the third film formation chamber 503 in the same manner as the formation of the red layer 522R, and the blue layer 522B is formed in the fourth film formation chamber 503. After the formation of the red layer 522R, the green layer 522G, and the blue layer 522B is completed, the electron transport layer 523 is formed in the entire display region 501 in the fifth film formation apparatus 100. The electron transport layer 523 is formed as a common layer for the three color layers 522R, 522G, and 522B.

[0116] The substrate on which the electron transport layer 523 is formed is moved to the sixth film formation chamber 403, and the second electrode 528 is formed. In the first film formation chamber 403 to the sixth film formation chamber 403 in the present embodiment, each layer is formed by vacuum evaporation. However, the present application is not limited to this, and for example, the second electrode 528 in the sixth film formation chamber 403 can be formed by sputtering. After that, the substrate on which the second electrode 528 is formed is moved to a sealing apparatus, the protective layer 530 is formed by plasma CVD (sealing process), and the organic EL display device 500 is completed. In addition, here, the protective layer 530 is formed by the CVD method, but the present application is not limited to this, and the protective layer 530 can be formed by the ALD method or the inkjet method.

[0117] <Second Embodiment>

[0118] In the first embodiment, the counterweight member 15 is disposed on the upper surface U of the main body portion 5, but the disposition site of the counterweight member 15 is not limited to this. Figure 11A to Figure 11C and Figure 12 Examples of the disposition of the counterweight member 15 are shown.

[0119] Figure 11AAn example in which the counterweight member 15 is arranged on the side surface of the main body 5 is shown. Figure 11B An example in which the counterweight member 15 is arranged on the lower surface U of the main body 5 is shown. In this way, the counterweight member 15 can be arranged on the side surface of the main body 5 along the corresponding edge portion 5F, 5B, 5L, and 5L, or on the lower surface U.

[0120] In addition, as the arrangement of the counterweight member 15 in the region L10, in addition to the arrangement in which the entire counterweight member 15 is arranged in the region L10 as in the first embodiment, there can be an arrangement in which although a part of the counterweight member 15 protrudes from the region L10, the center of gravity thereof is arranged in the region L10. Figure 11C An example thereof is shown. In the counterweight member 15 arranged along the edge portion 5F, although both end portions in the longitudinal direction thereof slightly protrude from the region L10, the center of gravity position P' thereof is located within the region L10. The same applies to each of the counterweight members 15 along the other edge portions 5B, 5L, and 5R.

[0121] There can also be an arrangement in which all or a part of the counterweight member 15 is embedded inside the main body 5. Figure 12 An example in which the counterweight member 15 is arranged in the recess 50b provided on the upper surface U of the main body 5 is shown. By arranging the counterweight member 15 to be embedded in the main body 5 as such, it is possible to avoid the center of gravity position P' of the counterweight member 15 from being high. Therefore, it is possible to improve the stability of the levitation posture of the holding unit 3 while suppressing the influence on the vibration characteristics of the holding unit 3.

[0122] <Third Embodiment>

[0123] In the first embodiment, the counterweight member 15 is provided on each of the edge portions 5F, 5B, 5L, and 5R, but there can be an edge portion on which the counterweight member 15 is not provided. Figure 13A and Figure 13B An example of another arrangement of the counterweight member 15 is shown. Figure 13A An example in which the counterweight member 15 is arranged along the edge portion 5L and the edge portion 5R of the main body 5 and two are provided in total is shown. The counterweight member 15 corresponding to the edge portion 5F and the edge portion 5B is not provided.

[0124] The counterweight member 15 can also be composed of a plurality of counterweight portions. In Figure 13B In the example, the counterweight member 15 is composed of a plurality of counterweight portions 15'. By adjusting the number of the counterweight portions 15', it is possible to easily adjust the weight of each counterweight member 15.

[0125] <Fourth Embodiment>

[0126] The outer shape of the main body 5 can adopt various polygonal shapes. Figure 14AThe body portion 5 is a substantially quadrangular shape, and more strictly speaking, an octagonal shape, with chamfered portions 5g provided at the corners 5a to 5d of the body portion 5. The counterweight member 15 arranged along the side portion 5F is arranged at a position closer to the center than the both end portions el of the side portion 5F, and is arranged within a range L10. As an example, the range L10 is a range of 1 / 3 of the center of the side portion 5F, after the length LI between the side portion 5L and the side portion 5R is divided into three equal parts.

[0127] The counterweight member 15 arranged along the side portion 5R is arranged at a position closer to the center than the both end portions e2 of the side portion 5R, and is arranged within a range L20. As an example, the range L20 is a range of 1 / 3 of the center of the side portion 5R, after the length L2 between the side portion 5F and the side portion 5B is divided into three equal parts.

[0128] The counterweight member 15 arranged along the side portion 5B is arranged at a position closer to the center than the both end portions e3 of the side portion 5B, and is arranged within a range L30. As an example, the range L30 is a range of 1 / 3 of the center of the side portion 5B, after the length L3 between the side portion 5L and the side portion 5R is divided into three equal parts.

[0129] The counterweight member 15 arranged along the side portion 5L is arranged at a position closer to the center than the both end portions e4 of the side portion 5L, and is arranged within a range L40. As an example, the range L40 is a range of 1 / 3 of the center of the side portion 5L, after the length L4 between the side portion 5F and the side portion 5B is divided into three equal parts.

[0130] Figure 14B The body portion 5 is a substantially quadrangular shape, and more strictly speaking, an octagonal shape, with chamfered portions 5g provided at the corners 5a to 5d of the body portion 5. In this example, the counterweight member 15 arranged along the side portion 5F is also arranged at a position closer to the center than the both end portions el of the side portion 5F, and is arranged within a range L10. As an example, the range L10 is a range of 1 / 3 of the center of the side portion 5F, after the length LI between the side portion 5L and the side portion 5R is divided into three equal parts.

[0131] The counterweight member 15 arranged along the side portion 5R is arranged at a position closer to the center than the both end portions e2 of the side portion 5R, and is arranged within a range L20. As an example, the range L20 is a range of 1 / 3 of the center of the side portion 5R, after the length L2 between the side portion 5F and the side portion 5B is divided into three equal parts.

[0132] The counterweight member 15 arranged along the side portion 5B is arranged at a position closer to the center than the both end portions e3 of the side portion 5B, and is arranged within a range L30. As an example, the range L30 is a range of 1 / 3 of the center of the side portion 5B, after the length L3 between the side portion 5L and the side portion 5R is divided into three equal parts.

[0133] The weight member 15 arranged along the edge portion 5L is arranged at a position on the central side from both end portions e4 of the edge portion 5L and within a range L40. As an example, the range L40 is a range of 1 / 3 of the length L4 between the edge portion 5F and the edge portion 5B, which is divided into three equal parts, with the center of the edge portion 5L as the center.

[0134] The outer shape of the main body portion 5 can adopt a triangle, a hexagon, or the like, in addition to the above-described examples.

[0135] The present application is not limited to the above-described embodiments, and various modifications and alterations can be made without departing from the spirit and scope of the application. Therefore, a claim is appended in order to disclose the scope of the present application.

[0136] Explanation of Reference Numerals

[0137] 1 substrate, 2 mask, 3 holding unit, 4 fixing member, 5 main body portion, 6 holding portion, 7 support unit, 8 position adjustment unit, 9 mask support unit, 10 position measurement unit, 11 plate unit, 12 evaporation unit, 13 measurement unit, 15 weight member, 100 film forming apparatus, 200 alignment apparatus, 300 holding apparatus.

Claims

1. A holding device comprising: a holding member that holds an object; a support member that supports the holding member in a floating state; and a first counterweight member that is provided to the holding member, wherein the holding member has a polygonal shape including a first side portion, the first counterweight member is disposed along the first side portion, and is disposed at a position closer to a center of the first side portion than to an end of the first side portion.

2. The holding device according to claim 1, wherein the first counterweight member is disposed at a position of 1 / 3 of a center of a length of the first side portion.

3. The holding device according to claim 1, wherein the first counterweight member is detachably disposed to the holding member.

4. The holding device according to claim 1, further comprising a position adjustment member that displaces the holding member.

5. The holding device according to claim 1, further comprising a second counterweight member that is provided to the holding member, wherein the polygonal shape further includes a second side portion that faces the first side portion, the second counterweight member is disposed along the second side portion, and is disposed at a position closer to a center of the second side portion than to an end of the second side portion.

6. The holding device according to claim 5, further comprising a third counterweight member and a fourth counterweight member that are provided to the holding member, wherein the polygonal shape further includes a third side portion and a fourth side portion between the first side portion and the second side portion, the third counterweight member is disposed along the third side portion, and is disposed at a position closer to a center of the third side portion than to an end of the third side portion, and the fourth counterweight member is disposed along the fourth side portion, and is disposed at a position closer to a center of the fourth side portion than to an end of the fourth side portion.

7. The holding device according to claim 6, wherein the third side portion and the fourth side portion are side portions in a direction orthogonal to directions of the first side portion and the second side portion, the first counterweight member is disposed at a position of 1 / 3 of a center of a length between the third side portion and the fourth side portion, the second counterweight member is disposed at a position of 1 / 3 of a center of a length between the third side portion and the fourth side portion, the third counterweight member is disposed at a position of 1 / 3 of a center of a length between the first side portion and the second side portion, and the fourth counterweight member is disposed at a position of 1 / 3 of a center of a length between the first side portion and the second side portion.

8. An aligning device comprising: a holding member that holds a substrate; a support member that supports the holding member in a floating state; a first counterweight member that is provided to the holding member; and a second counterweight member that is provided to the holding member, wherein the holding member has a polygonal shape including a first side portion, the first counterweight member is disposed along the first side portion, and is disposed at a position closer to a center of the first side portion than to an end of the first side portion, the second counterweight member is disposed along the first side portion, and is disposed at a position closer to a center of the first side portion than to an end of the first side portion. ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ 8. An alignment device that adjusts a position of a substrate and a mask, characterized by, ​ ​ ​ ​ ​ adjusting means that displaces the holding means and adjusts the position of the substrate and the mask, the holding means has a polygonal shape including a first side portion and first corner portions on both sides of the first side portion, the first counterweight member is disposed along the first side portion and at a position closer to the center of the first side portion than the first corner portions.

9. A film forming apparatus characterized by comprising: The film forming apparatus is provided with: the alignment device according to claim 8; and film forming means that forms a film of an evaporation material on a substrate.

10. A film forming method characterized by, The film forming method uses the film forming apparatus according to claim 9 to form a film on a substrate via a mask.

11. A manufacturing method characterized by comprising: The manufacturing method uses the film forming method according to claim 10 to manufacture an electronic device.

Images