Three-dimensional (3D) inductor with dual-sided bond wires

Abstract

A three-dimensional (3D) inductor with double-sided bond wires is disclosed. The 3D inductor enables high inductance, for example, for integrated voltage regulators (IVR) and / or external voltage regulators (EVR). A magnetic molding compound may be utilized to enhance the inductance of the 3D inductor.

Description

TECHNICAL FIELD

[0001] The present disclosure relates generally to integrated circuits, and more particularly, but not exclusively, to integrated circuits having three-dimensional (3D) inductors, such as 3D magnetic inductors, with double-sided bondwires. BACKGROUND

[0002] Integrated circuit technology has made great strides in improving computing power through miniaturization of active components. Devices, such as semiconductor devices, can be found in many electronic devices, including processors, servers, radio frequency (RF) integrated circuits, etc.

[0003] In RF front end (RFFE) applications (e.g., transformers, couplers, etc.), the use of inductors is very high. In some applications (e.g., switching frequency for power management ICs), large inductance is desired. Also, external inductors can be high cost.

[0004] Accordingly, there is a need for systems, apparatuses, and methods, including the methods, systems, and apparatuses provided herein, that overcome the deficiencies of conventional integrated circuits having inductors. SUMMARY

[0005] The following presents a simplified summary of one or more aspects and / or examples associated with the apparatuses and methods disclosed herein. As such, the following summary should not be considered an extensive overview of all contemplated aspects and / or examples, nor be considered to identify key or critical elements of all contemplated aspects and / or examples or to delineate the scope of any

[0006] An example three-dimensional (3D) inductor is disclosed. The 3D inductor can include a plurality of first leads on a first side of the inductor. The 3D inductor can also include one or more second leads on a second side of the inductor opposite the first side. The 3D inductor can further include one or more upper leads. Each upper lead can electrically couple an upper surface of a second lead with an upper surface of a first lead. The 3D inductor can also include one or more lower leads. Each lower lead can electrically couple a lower surface of a first lead with a lower surface of a second lead. The 3D inductor can also further include an upper mold. The upper mold can at least partially encapsulate the plurality of first leads. The upper mold can also at least partially encapsulate the plurality of second leads. The upper mold can further encapsulate the one or more upper leads. The 3D inductor can additionally include a lower mold encapsulating the one or more lower leads. The plurality of first leads, the one or more second leads, the one or more upper leads, and the one or more lower leads can be configured to form one or more loops of the 3D inductor.

[0007] An example method of manufacturing a three-dimensional (3D) inductor is disclosed. The method can include forming a plurality of first leads on a first side of the inductor. The method can also include forming one or more second leads on a second side of the inductor opposite the first side. The method can further include forming one or more upper leads. Each upper lead can electrically couple an upper surface of a second lead with an upper surface of a first lead. The method can also include forming one or more lower leads. Each lower lead can electrically couple a lower surface of a first lead with a lower surface of a second lead. The method can also further include forming an upper mold. The upper mold can at least partially encapsulate the plurality of first leads. The upper mold can also at least partially encapsulate the plurality of second leads. The upper mold can further encapsulate the one or more upper leads. The method can additionally include forming a lower mold encapsulating the one or more lower leads. The plurality of first leads, the one or more second leads, the one or more upper leads, and the one or more lower leads can be configured to form one or more loops of the 3D inductor.

[0008] Other features and advantages associated with the various devices and methods disclosed herein will be apparent from the following detailed description, taken in connection with the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0009] Aspects of the disclosure, together with its many attendant advantages, will be understood by reference to the following detailed description, taken in conjunction with the accompanying drawings, which are presented solely for the purpose of illustration and are not intended to limit the disclosure in any way.

[0010] FIG. 1AA perspective view of an example of a 3D inductor is illustrated in accordance with one or more aspects of the disclosure.

[0011] FIG. 1B A cross-sectional view of an example of a 3D inductor is illustrated in accordance with one or more aspects of the disclosure.

[0012] FIGS. 2A-2G An example stage of manufacturing a 3D inductor is illustrated in accordance with one or more aspects of the disclosure.

[0013] FIG. 3 and FIG. 4 A flowchart of an example method of manufacturing a 3D inductor is illustrated in accordance with one or more aspects of the disclosure.

[0014] FIG. 5 Various electronic devices that can utilize one or more aspects of the disclosure are illustrated.

[0015] Other objects and advantages associated with aspects disclosed herein will be apparent to those skilled in the art based on the accompanying drawings and detailed description. To the extent that certain details are presented in a certain manner, it is not intended to limit or preclude the scope of the aspects as set forth in the claims. Accordingly, the drawings are not to be considered as limiting; the situations they depict are schematic only. Additionally, like reference numerals are used to denote like parts throughout the specification and drawings. DETAILED DESCRIPTION

[0016] Aspects of the disclosure are illustrated in the following description and accompanying drawings, which are not intended to be exhaustive or to limit the scope of the teachings to the aspects described. Alternative aspects or embodiments can be devised without departing from the scope of the teachings. Additionally, well-known elements of exemplary implementations described herein can not be described in detail or can be omitted so as to not obscure the relevant details of the teachings.

[0017] In some described example implementations, instances are identified in which various component structures and portions of the operation can be taken from known conventional technologies and subsequently arranged in accordance with one or more example implementations. In such instances, internal details of the known conventional component structures and / or portions of the operation can be omitted to help avoid potential obfuscation of the concepts illustrated in the example implementations disclosed herein.

[0018] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting. As used herein, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises," "comprising," when used herein, specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0019] As noted above, inductors are useful. In many instances, obtaining an inductor with sufficient inductance can be costly. To address these and other issues, it is proposed to provide a three-dimensional (3D) inductor with dual-sided (or double-sided) bonding wires. The proposed 3D inductor with dual-sided bonding wires can increase inductance by more than a factor of two (e.g., from about 155 nH to about 350 nH) compared to single-sided bonding wire inductors.

[0020] FIG. 1A A perspective view of an example of a 3D inductor 100 in accordance with one or more aspects of the present disclosure is illustrated, and FIG. 1B A cross-sectional view thereof is illustrated. As seen, the proposed 3D inductor 100 can include a plurality of first leads 110 on a first side of the inductor 100. In this example, the number of first leads 110 is four (see FIG. 1A ). However, this is merely an example. The number of first leads 100 can be N, where N is two or more, i.e., N > 2.

[0021] In an aspect, each first lead 110 can include a first upper lead 112 and a first lower lead 114. Thus, there can be a plurality of first upper leads 112 (N of which) and a plurality of first lower leads 114 (N of which). Each first upper lead 112 can be located on and electrically coupled to a corresponding first lower lead 114. For example, the first upper lead 112 can be in physical contact with the first lower lead 114. Thus, the upper surface of the first upper lead 112 can be considered the upper surface of the first lead 110. Conversely, the lower surface of the first lower lead 114 can be considered the lower surface of the first lead 110. The first upper lead 112 and / or the first lower lead 114 can be formed of a conductive material such as copper (Cu), silver (Ag), aluminum (Al), etc.

[0022] It is noted that terms and phrases such as "upper," "lower," "top," "bottom," "left," "right," and the like are used herein for convenience and are not intended to refer to absolute orientation.

[0023] The 3D inductor 100 can include one or more second leads 120 on a second side of the inductor 100 opposite the first side. In this example, the number of second leads 120 is also four (see FIG. 1A ). Again, this is merely an example. The number of second leads 100 can be M, where M is one or more, i.e., M > 1.

[0024] In an aspect, each second lead 120 can include a second upper lead 122 and a second lower lead 124. Thus, there can be one or more second upper leads 122 (M of which) and one or more second lower leads 124 (M of which). Each second upper lead 122 can be located on and electrically coupled to a corresponding second lower lead 124. For example, the second upper lead 122 can be in physical contact with the second lower lead 124. Thus, the upper surface of the second upper lead 122 can be considered the upper surface of the second lead 110. Conversely, the lower surface of the second lower lead 124 can be considered the lower surface of the second lead 120. The second upper lead 122 and / or the second lower lead 124 can be formed of an electrically conductive material such as Cu, Al, etc.

[0025] The 3D inductor 100 can also include one or more upper wires 130. In this example, the number of upper wires 130 is three. More generally, there can be N-1 upper wires 130. The upper wires 130 can be formed of a material such as copper, aluminum, gold, silver, etc.

[0026] Each upper wire 130 can electrically couple the upper surface of a second lead 120 to the upper surface of a first lead 110. For example, one end of one upper wire 130 can physically contact the upper surface of one second lead 120 (e.g., the upper surface of one second upper lead 122), and the other end of the same upper wire 130 can physically contact the upper surface of one first lead 110 (e.g., the upper surface of one first upper lead 112). More specifically, assume that each first lead 110 can be identified with an index. That is, first lead (1) can represent the first first lead 110, and first lead (N) can represent the last first lead 110. Similarly, each second lead 120 can also be identified with an index. For example, second lead (1) can represent the first second lead 120, and second lead (M) can represent the last second lead 120. Then in an aspect, each upper wire 130 can electrically couple the upper surface of second lead (k) to the upper surface of first lead (k+1), where k = 1... N-1 (indicated in FIG. 1B ).

[0027] The 3D inductor 100 can include one or more lower leads 140. In this example, the number of lower leads 140 is four. More generally, there can be M upper leads 130. The lower leads 140 can be formed of a material such as copper, aluminum, gold, silver, etc.

[0028] Each lower lead 140 can electrically couple a lower surface of a first lead 110 to a lower surface of a second lead 120. For example, one end of one lower lead 140 can physically contact a lower surface of one first lead 110 (e.g., a lower surface of one first lower lead 112), and the other end of the same lower lead 140 can physically contact a lower surface of one second lead 120 (e.g., a lower surface of one second upper lead 122). Then in an aspect, each lower lead 140 can electrically couple a lower surface of a first lead (j) to a lower surface of a second lead (j), where j = 1...M (as indicated in FIG. 1B

[0029] The plurality of first leads 110, the one or more second leads 120, the one or more upper leads 130, and the one or more lower leads 140 can be configured to form one or more loops of the 3D inductor 100. For example, each turn of the inductor 100 can be configured by a first lead k, a lower lead k, a second lead k, and a first lead k+1. FIG. 1A An example is illustrated in which there are three half-loops.

[0030] The upper mold 170 and the lower mold 180 can encase the first leads 110 and the second leads 120, as well as the upper leads 130 and the lower leads 140. In particular, the upper mold 170 can encase the plurality of first leads 110, the plurality of second leads 120, and the one or more upper leads 130. In an aspect, a side surface of the first leads 110 (e.g., a side surface of the first upper leads 112) and a side surface of the second leads 120 (e.g., a side surface of the second upper leads 122) can be exposed. For example, a side surface of the first upper leads 112 (on a first side) and a side surface of the second upper leads 122 (on a second side) can be coplanar with a first side surface and a second side surface of the upper mold 170. That is, in an aspect, the upper mold 170 can at least partially encase the plurality of first leads 110. Alternatively or additionally, the upper mold 170 can at least partially encase the plurality of second leads 120. The lower mold 180 can encase the one or more lower leads 140.

[0031] ​It is contemplated that the upper mold 170 and / or the lower mold 180 can be formed of an epoxy material. However, to enhance inductance, it can be preferable that the upper mold 170 be formed of a first magnetic molding compound. Alternatively or additionally, it can be preferable that the lower mold 180 be formed of a second magnetic compound, which can be the same as or different from the first magnetic compound. The first magnetic compound and / or the second magnetic compound can be formed of any one of a polymer-bonded compound, a ferrite-bonded compound, an isotropic neodymium-bonded compound, an anisotropic isotropic neodymium-bonded compound, a samarium-cobalt-bonded compound, and the like.

[0032] To enable connection with external devices, the 3D inductor 100 can include a first terminal 150 electrically coupled to one end of the inductor loop, and a second terminal 160 electrically coupled to another end of the inductor loop. In an aspect, the first terminal 150 can be electrically coupled to an upper surface of a first one of the first plurality of leads 110 (e.g., a first one of the first upper leads 112). For example, the first terminal 150 can be in contact with the upper surface of the first lead n=0.

[0033] The first terminal 150 can include a first side plate 152 formed on a side surface of the upper mold 170. A lower portion of the first side plate 152 can be coupled to, e.g., in contact with, an upper surface of a first one of the first plurality of leads 110 (i.e., the first lead n=l). The first terminal 150 can further include a first land 154 formed on an upper surface of the upper mold 170 and connected with the first side plate 152. For example, the first side plate 152 and the first land 154 can be integrally formed. The first terminal 150 can be formed of any one or more of copper, silver, and aluminum.

[0034] Similarly, the second terminal 160 can be electrically coupled to an upper surface of a last one of the one or more second leads 120 (e.g., a last one of the second upper leads 122). For example, the second terminal 160 can be in contact with the upper surface of the second lead m=M.

[0035] The second terminal 160 can include a second side plate 162 formed on a side surface of the upper mold 170. A lower portion of the second side plate 162 can be coupled to, e.g., in contact with, an upper surface of a last one of the one or more second leads 120 (i.e., the second lead m=N). The second terminal 160 can further include a second land 164 formed on an upper surface of the upper mold 170 and connected with the second side plate 162. For example, the second side plate 162 and the second land 164 can be integrally formed. The second terminal 160 can be formed of any one or more of copper, silver, and aluminum.

[0036] FIG. 1A andFIG. 1B An example is illustrated in which there are an equal number of first leads 110 and second leads 120 (four in this example). When the number of first leads 110 and second leads 120 are equal, e.g., when N = M, in such examples, the first end of the inductor loop can be the first of the first leads 110 (i.e., first lead n = 1), and the second end of the inductor loop can be the last of the second leads 120 (i.e., second lead m = M).

[0037] But in another embodiment (not shown), the number of first leads 110 and second leads 120 need not be equal. That is, N and M need not be the same. In particular, the second leads 120 can be one less than the first leads 110, i.e., M = N - 1. There will still be N - 1 upper leads 130, and each upper lead 130 can electrically couple the upper surface of the second lead (k) to the upper surface of the first lead (k + 1), k = 1... N - 1. There will still also be M lower leads 140, and each lower lead (j) can electrically couple the lower surface of the first lead (j) to the lower surface of the second lead (j), j = 1... M. However, because M = N - 1, the last of the first leads 110, i.e., first lead (N), will not be connected with any of the lower leads 140. In this example, the second terminal 160 can be electrically coupled to the upper surface of the last of the plurality of first leads 110, i.e., to the upper surface of first lead (N).

[0038] FIGS. 2A-2G An example stage of manufacturing a 3D inductor, such as 3D inductor 100, is illustrated in accordance with one or more aspects of the present disclosure. FIG. 2A A stage is illustrated in which first leads 110 and second leads 120 are formed. For example, first upper leads 112 and first lower leads 114 can be formed on the first side, and second upper leads 122 and second lower leads 124 can be formed on the second side.

[0039] FIG. 2B A stage is illustrated in which upper leads 130 can be bonded to the upper surfaces of the first leads 110 and second leads 120 (e.g., the upper surfaces of the first upper leads 112 and second upper leads 122).

[0040] FIG. 2CA stage in which the first leads 110, the second leads 120, and the upper leads 130 can be molded with an upper mold 170 (e.g., with a first magnetic molding compound) is illustrated. The sides of the upper mold 170 can then be etched (e.g., with an etchant or laser drilling) to expose portions of the leads that represent the ends of the inductor loops. For example, a portion of the upper surface of the first of the first leads 110 can be exposed. Also, a portion of the upper surface of the last of the second leads 120 can be exposed (e.g., when N = M). Alternatively (e.g., when N ≠ M), a portion of the upper surface of the last of the first leads 110 can be exposed (not shown).

[0041] FIG. 2D A stage in which the first terminal 150 and the second terminal 160 are formed is illustrated. For example, the first side plate 152 and the first pad 154 can be printed or plated. Also, the second side plate 162 and the second pad 155 can be printed or plated.

[0042] FIG. 2E A stage in which the structure is flipped and the lower leads 140 can be bonded to the lower surfaces of the first leads 110 and the second leads 120 (e.g., the lower surfaces of the first lower leads 114 and the second lower leads 124) is illustrated.

[0043] FIG. 2F A stage in which the lower leads 140 can be molded with a lower mold 180 (e.g., with a second magnetic molding compound) is illustrated.

[0044] In an aspect, a plurality of 3D inductors 100 can be fabricated, e.g., on a leadframe. FIG. 2G A stage in which singulation or sawing can be performed to form individual 3D inductors 100 is illustrated.

[0045] FIG. 3 A flowchart of an example method 300 of fabricating a 3D inductor, such as the 3D inductor 100, in accordance with one or more aspects of the present disclosure is illustrated.

[0046] In block 310, a plurality of first leads 110 can be formed on a first side of the inductor 100. Block 310 can correspond to the stage illustrated in FIG. 2A of FIG. 4.

[0047] In block 320, one or more second leads 120 can be formed on a second side of the inductor 100 opposite the first side. Block 320 can correspond to the stage illustrated in FIG. 2A of FIG. 4.

[0048] In block 330, one or more upper leads 130 can be formed. Each upper lead 130 can electrically couple an upper surface of a second lead 120 with an upper surface of a first lead 110. Block 330 can correspond to the stage illustrated in FIG. 2B FIG. 4B.

[0049] In block 340, one or more lower leads 140 can be formed. Each lower lead 140 can electrically couple a lower surface of a first lead 110 with a lower surface of a second lead 120. Block 340 can correspond to the stage illustrated in FIG. 2E FIG. 4B.

[0050] In block 350, an upper mold 170 can be formed. The upper mold 170 can at least partially encapsulate the plurality of first leads 110, at least partially encapsulate the plurality of second leads 120, and encapsulate the one or more upper leads 130. Block 350 can correspond to the stage illustrated in FIG. 2C FIG. 4B.

[0051] In block 360, a lower mold 180 can be formed. The lower mold 180 can encapsulate the one or more lower leads 140. Block 360 can correspond to the stage illustrated in FIG. 2F FIG. 4B.

[0052] It is noted that the plurality of first leads 110, the one or more second leads 120, the one or more upper leads 130, and the one or more lower leads 140 can be configured to form one or more loops of the 3D inductor 100.

[0053] FIG. 4 A flowchart of an example method 400 of manufacturing a 3D inductor, such as the 3D inductor 100, is illustrated in accordance with one or more aspects of the present disclosure. FIG. 4 may be more comprehensive views. FIG. 3

[0054] Block 410 can be similar to block 310. That is, in block 410, a plurality of first leads 110 can be formed on a first side of the inductor 100. Block 410 can correspond to the stage illustrated in FIG. 2A FIG. 4B.

[0055] Block 420 can be similar to block 320. That is, in block 420, one or more second leads 120 can be formed on a second side of the inductor 100 opposite the first side. Block 420 can correspond to the stage illustrated in FIG. 2A FIG. 4B.

[0056] ​Block 430 can be similar to block 330. That is, in block 430, one or more upper leads 130 can be formed. Each upper lead 130 can electrically couple an upper surface of a second lead 120 with an upper surface of a first lead 110. Block 430 can correspond to the stage illustrated in FIG. 4B. FIG. 2B The stage illustrated in FIG. 4B.

[0057] Block 440 can be similar to block 340. That is, in block 440, one or more lower leads 140 can be formed. Each lower lead 140 can electrically couple a lower surface of a first lead 110 with a lower surface of a second lead 120. Block 440 can correspond to the stage illustrated in FIG. 4C. FIG. 2E The stage illustrated in FIG. 4C.

[0058] Block 450 can be similar to block 350. That is, in block 450, an upper mold 170 can be formed. The upper mold 170 can at least partially enclose the plurality of first leads 110, at least partially enclose the plurality of second leads 120, and enclose the one or more upper leads 130. Block 450 can correspond to the stage illustrated in FIG. 4D. FIG. 2C The stage illustrated in FIG. 4D.

[0059] In block 455, a first terminal 150 can be formed on the upper mold 170. The first terminal 150 can be electrically coupled to an upper surface of a first one of the plurality of first leads 110, e.g., to an upper surface of first lead 1. Block 455 can correspond to the stage illustrated in FIG. 4E. FIG. 2D The stage illustrated in FIG. 4E.

[0060] In block 457, a second terminal 160 can be formed on the upper mold 170. The second terminal 160 can be electrically coupled to an upper surface of a last one of the plurality of first leads 110, e.g., to an upper surface of first lead N (not shown). Alternatively, the second terminal 160 can be electrically coupled to an upper surface of a last one of the plurality of second leads 120, e.g., to an upper surface of second lead M. Block 457 can correspond to the stage illustrated in FIG. 4F. FIG. 2D The stage illustrated in FIG. 4F.

[0061] Block 460 can be similar to block 360. That is, in block 460, a lower mold 180 can be formed. The lower mold 180 can enclose the one or more lower leads 140. Block 460 can correspond to the stage illustrated in FIG. 4G. FIG. 2F The stage illustrated in FIG. 4G.

[0062] FIG. 5Electronic devices 500 that can integrate with any of the aforementioned 3D inductors in accordance with various aspects of the present disclosure are illustrated. For example, a mobile phone device 502, a laptop computer device 504, and a fixed position terminal device 506 can each generally be considered user equipment (UE) and can include one or more 3D inductors as described herein. FIG. 5 The devices 502, 504, 506 illustrated in the middle are merely exemplary. Other electronic devices can also include a die package, including but not limited to a group of devices (e.g., electronic devices) including: a mobile device, a hand-held personal communication systems (PCS) unit, a portable data unit such as a personal digital assistant, a global positioning system (GPS) enabled device, a navigation device, a set-top box, a music player, a video player, an entertainment unit, a fixed location data unit such as a meter reading equipment, a communications device, a smartphone, a tablet computer, a computer, a wearable device, a server, a router, an electronic device implemented in an automotive vehicle (e.g., an autonomous vehicle), an Internet of Things (IoT) device, or any other device that stores or retrieves data or computer instructions, or any combination thereof.

[0063] The previously disclosed devices and functionality can be designed and configured in computer files (e.g., RTL, GDSII, GERBER, etc.) stored on computer readable media. Some or all such files can be provided to manufacturing handlers who fabricate devices based on such files. The resulting products can include semiconductor wafers that are then cut into semiconductor dies and packaged into glass antenna devices. The glass antenna devices can then be used in devices described herein.

[0064] Implementation examples are described in the following numbered clauses:

[0065] Clause 1 : A three-dimensional (3D) inductor, comprising: a plurality of first leads on a first side of the inductor; one or more second leads on a second side of the inductor opposite the first side; one or more upper leads, each upper lead electrically coupling an upper surface of a second lead with an upper surface of a first lead; one or more lower leads, each lower lead electrically coupling a lower surface of a first lead with a lower surface of a second lead; an upper mold at least partially encapsulating the plurality of first leads, and at least partially encapsulating the plurality of second leads, and encapsulating the one or more upper leads; and a lower mold encapsulating the one or more lower leads, wherein the plurality of first leads, the one or more second leads, the one or more upper leads, and the one or more lower leads are configured to form one or more loops of the 3D inductor.

[0066] Clause 2: The 3D inductor of Clause 1, further comprising: a first terminal on the upper mold and electrically coupled to an upper surface of a first one of the plurality of first leads; and a second terminal on the upper mold and electrically coupled to an upper surface of a last one of the plurality of first leads or an upper surface of a last one of the plurality of second leads.

[0067] Clause 3: The 3D inductor of Clause 2, wherein a number of first leads is N, N = 2 or higher, wherein a number of second leads is M = N, wherein a number of upper leads is N-1, each upper lead electrically coupling an upper surface of a second lead (k) to an upper surface of a first lead (k+1), k = 1...N-1, and wherein a number of lower leads is M, each lower lead electrically coupling a lower surface of a first lead (j) to a lower surface of a second lead (j), j = 1...M.

[0068] Clause 4: The 3D inductor of Clause 3, wherein the second terminal is electrically coupled to an upper surface of a second lead (M).

[0069] Clause 5: The 3D inductor of Clause 2, wherein a number of first leads is N, N = 2 or higher, wherein a number of second leads is M = N-1, wherein a number of upper leads is N-1, each upper lead electrically coupling an upper surface of a second lead (k) to an upper surface of a first lead (k+1), k = 1...N-1, and wherein a number of lower leads is M, each lower lead electrically coupling a lower surface of a first lead (j) to a lower surface of a second lead (j), j = 1...M.

[0070] Clause 6: The 3D inductor of Clause 5, wherein the second terminal is electrically coupled to an upper surface of a first lead (N).

[0071] Clause 7: The 3D inductor of any of Clauses 2-6, wherein the first terminal comprises: a first side plate formed on a side surface of the upper mold, a lower portion of the first side plate in contact with the upper surface of the first one of the plurality of first leads; and a first pad formed on an upper surface of the upper mold and connected with the first side plate.

[0072] Clause 8: The 3D inductor of any one of clauses 2-7, wherein the second terminal comprises: a second side plate formed on a side surface of the upper mold, a lower portion of the second side plate in contact with the upper surface of the last first lead wire of the plurality of first lead wires or the upper surface of the last second lead wire of the plurality of second lead wires; and a second pad formed on an upper surface of the upper mold and connected with the second side plate.

[0073] Clause 9: The 3D inductor of any one of clauses 2-8, wherein the first terminal is formed of any one or more of copper, silver, and aluminum, wherein the second terminal is formed of any one or more of copper, silver, and aluminum, or both.

[0074] Clause 10: The 3D inductor of any one of clauses 1-9, wherein the upper mold is formed of a first magnetic molding compound, wherein the lower mold is formed of a second magnetic molding compound, or both.

[0075] Clause 11: The 3D inductor of clause 10, wherein the first magnetic molding compound is any one or more of a polymer bonded compound, a ferrite bonded compound, an isotropic neodymium bonded compound, an anisotropic isotropic neodymium bonded compound, and a samarium-cobalt bonded compound, wherein the second magnetic molding compound is any one or more of a polymer bonded compound, a ferrite bonded compound, an isotropic neodymium bonded compound, an anisotropic isotropic neodymium bonded compound, and a samarium-cobalt bonded compound, or both.

[0076] Clause 12: The 3D inductor of any one of clauses 1-11, wherein the plurality of first lead wires comprises a plurality of first upper lead wires and a plurality of first lower lead wires, each first upper lead wire is on a corresponding first lower lead wire, an upper surface of the plurality of first upper lead wires is the upper surface of the plurality of first lead wires, and a lower surface of the plurality of first lower lead wires is the lower surface of the first lead wires, wherein the plurality of second lead wires comprises a plurality of second upper lead wires and a plurality of second lower lead wires, each second upper lead wire is on a corresponding second lower lead wire, an upper surface of the plurality of second upper lead wires is the upper surface of the plurality of second lead wires, and a lower surface of the plurality of second lower lead wires is the lower surface of the second lead wires, or both.

[0077] Clause 13: The 3D inductor of clause 12, wherein the plurality of first upper leads are formed from any one or more of copper, silver, and aluminum, wherein the plurality of first lower leads are formed from any one or more of copper, silver, and aluminum, wherein the plurality of second upper leads are formed from any one or more of copper, silver, and aluminum, wherein the plurality of second lower leads are formed from any one or more of copper, silver, and aluminum, or any combination thereof.

[0078] Clause 14: The 3D inductor of any of clauses 1-13, wherein the one or more upper leads are formed from any one or more of copper, aluminum, gold, and silver, wherein the one or more lower leads are formed from any one or more of copper, aluminum, gold, and silver, or both.

[0079] Clause 15: The 3D inductor of any of clauses 1-14, wherein the 3D inductor is incorporated into a device selected from the group consisting of a music player, a video player, an entertainment unit, a navigation device, a communications device, a mobile device, a mobile phone, a smartphone, a personal digital assistant, a fixed location terminal, a tablet computer, a computer, a wearable device, an Internet of Things (IoT) device, a laptop computer, a server, and a device in an automotive vehicle.

[0080] Clause 16: A method of manufacturing a three-dimensional (3D) inductor, the method comprising: forming a plurality of first leads on a first side of the inductor; forming one or more second leads on a second side of the inductor opposite the first side; forming one or more upper leads, each upper lead electrically coupling an upper surface of a second lead with an upper surface of a first lead; forming one or more lower leads, each lower lead electrically coupling a lower surface of a first lead with a lower surface of a second lead; forming an upper mold at least partially encapsulating the plurality of first leads, and at least partially encapsulating the plurality of second leads, and encapsulating the one or more upper leads; and forming a lower mold encapsulating the one or more lower leads, wherein the plurality of first leads, the one or more second leads, the one or more upper leads, and the one or more lower leads are configured to form one or more loops of the 3D inductor.

[0081] Clause 17: The method of clause 16, further comprising: forming a first terminal on the upper mold and electrically coupled to an upper surface of a first one of the plurality of first leads; and forming a second terminal on the upper mold and electrically coupled to an upper surface of a last one of the plurality of first leads or an upper surface of a last one of the plurality of second leads.

[0082] Clause 18: The method of clause 17, wherein the number of first leads is N, N = 2 or higher, wherein the number of second leads is M = N, wherein the number of upper leads is N-1, each upper lead electrically coupling an upper surface of a second lead (k) to an upper surface of a first lead (k+1), k = 1...N-1, and wherein the number of lower leads is M, each lower lead electrically coupling a lower surface of a first lead (j) to a lower surface of a second lead (j), j = 1...M.

[0083] Clause 19: The method of clause 18, wherein the second terminal is electrically coupled to an upper surface of a second lead (M).

[0084] Clause 20: The method of clause 17, wherein the number of first leads is N, N = 2 or higher, wherein the number of second leads is M = N-1, wherein the number of upper leads is N-1, each upper lead electrically coupling an upper surface of a second lead (k) to an upper surface of a first lead (k+1), k = 1...N-1, and wherein the number of lower leads is M, each lower lead electrically coupling a lower surface of a first lead (j) to a lower surface of a second lead (j), j = 1...M.

[0085] Clause 21: The method of clause 20, wherein the second terminal is electrically coupled to an upper surface of a first lead (N).

[0086] Clause 22: The method of any of clauses 17-21, wherein the first terminal comprises: a first side plate formed on a side surface of the upper mold, a lower portion of the first side plate being in contact with the upper surface of the first one of the plurality of first leads; and a first land pad formed on an upper surface of the upper mold and connected with the first side plate.

[0087] Clause 23: The method of any of clauses 17-22, wherein the second terminal comprises: a second side plate formed on a side surface of the upper mold, a lower portion of the second side plate being in contact with the upper surface of the last one of the plurality of first leads or the last one of the plurality of second leads; and a second land pad formed on an upper surface of the upper mold and connected with the second side plate.

[0088] Clause 24: The method of any of clauses 17-23, wherein the first terminal is formed from any one or more of copper, silver, and aluminum, wherein the second terminal is formed from any one or more of copper, silver, and aluminum, or both.

[0089] Clause 25: The method of any one of clauses 16-24, wherein the upper mold is formed from a first magnetic molding compound, wherein the lower mold is formed from a second magnetic molding compound, or both.

[0090] Clause 26: The method of clause 25, wherein the first magnetic molding compound is any one or more of a polymeric bonded compound, a ferrite bonded compound, an isotropic neodymium bonded compound, an anisotropic isotropic neodymium bonded compound, and a samarium-cobalt bonded compound, wherein the second magnetic molding compound is any one or more of a polymeric bonded compound, a ferrite bonded compound, an isotropic neodymium bonded compound, an anisotropic isotropic neodymium bonded compound, and a samarium-cobalt bonded compound, or both.

[0091] Clause 27: The method of any one of clauses 16-26, wherein the plurality of first leads includes a plurality of first upper leads and a plurality of first lower leads, each first upper lead is on a corresponding first lower lead, an upper surface of the plurality of first upper leads is the upper surface of the plurality of first leads, and a lower surface of the plurality of first lower leads is the lower surface of the first leads, wherein the plurality of second leads includes a plurality of second upper leads and a plurality of second lower leads, each second upper lead is on a corresponding second lower lead, an upper surface of the plurality of second upper leads is the upper surface of the plurality of second leads, and a lower surface of the plurality of second lower leads is the lower surface of the second leads, or both.

[0092] Clause 28: The method of clause 27, wherein the plurality of first upper leads is formed from any one or more of copper, silver, and aluminum, wherein the plurality of first lower leads is formed from any one or more of copper, silver, and aluminum, wherein the plurality of second upper leads is formed from any one or more of copper, silver, and aluminum, wherein the plurality of second lower leads is formed from any one or more of copper, silver, and aluminum, or any combination thereof.

[0093] Clause 29: The method of any one of clauses 16-28, wherein the one or more upper conductive leads is formed from any one or more of copper, aluminum, gold, and silver, wherein the one or more lower conductive leads is formed from any one or more of copper, aluminum, gold, and silver, or both.

[0094] As used herein, the terms “user equipment” (or “UE”), “user device,” “user terminal,” “client device,” “communication device,” “wireless device,” “wireless communication device,” “handheld device,” “mobile device,” “mobile terminal,” “mobile station,” “handset,” “access terminal,” “subscriber device,” “subscriber terminal,” “subscriber station,” “terminal,” and variants thereof can interchangeably refer to any suitable mobile or stationary device that can receive wireless communication and / or navigation signals. These terms encompass music players, video players, entertainment units, navigation devices, communication devices, smartphones, personal digital assistants, fixed location terminals, tablet computers, computers, wearable devices, laptop computers, servers, onboard devices in motor vehicles, and / or other types of portable electronic devices that are typically carried by an individual and / or have communication capabilities (e.g., wireless, cellular, infrared, short-range wireless radio, etc.). These terms are also intended to include devices that communicate with another device that is capable of receiving wireless communication and / or navigation signals such as through short-range wireless, infrared, wireline connection, or other connection, regardless of whether satellite signal reception, assistance data reception, and / or position-related processing occurs at the device or at the other device. Additionally, these terms are intended to include all devices, including wireless and wireline communication devices, that are enabled to communicate via a Radio Access Network (RAN), with a core network, and with external networks such as the Internet, and with other UEs. Of course, other mechanisms of connecting to the core network and / or the Internet are also possible for UEs, such as over wired access networks, wireless local area network (WLAN) (e.g., based on IEEE 802.11, etc.), and so on. UEs can be embodied by any of a number of types of devices including but not limited to printed circuit (PC) cards, compact flash devices, external or

[0095] Wireless communication between electronic devices can be based on different technologies, such as code division multiple access (CDMA), W-CDMA, time division multiple access (TDMA), frequency division multiple access (FDMA), orthogonal frequency division multiplexing (OFDM), Global System for Mobile Communications (GSM), 3GPP Long Term Evolution (LTE), 5G New Radio, Bluetooth (BT), Bluetooth Low Energy (BLE), IEEE 802.11 (WiFi), and IEEE 802.15.4 (Zigbee / Thread), or other protocols that can be used in wireless communication networks or data communication networks. Bluetooth Low Energy (also known as Bluetooth LE, BLE, and Bluetooth Smart) is a wireless personal area network technology designed and marketed by the Bluetooth Special Interest Group, intended to provide considerably reduced power consumption and cost while maintaining a similar communication range. BLE was merged into the main Bluetooth standard in 2010 with the adoption of the Bluetooth Core Specification Version 4.0 and updated in Bluetooth 5.

[0096] The word “exemplary” is used herein to mean “serving as an example, instance, or illustration.” Any implementation described herein as “exemplary” is not necessarily to be construed as preferred or advantageous over other implementations. Likewise, the term “examples” does not mean all implementations include the discussed feature, advantage or mode of operation. Rather, the specific features, constructions, and / or parameters are shown as examples.

[0097] It should be noted that the terms “connected,” “coupled,” or any variant thereof, mean any connection or coupling, either direct or indirect, between elements, and can encompass the presence of an intermediate element between two elements that are “connected” or “coupled” together via the intermediate element, unless the connection is expressly indicated to be direct.

[0098] Any reference to an element herein using a designation such as “first,” “second,” and so forth does not limit the quantity and / or order of those elements. Rather, these designations are used as a convenient method of distinguishing between two or more elements and / or instances of an element. Also, unless otherwise specified, a set of elements can comprise one or more elements.

[0099] Those skilled in the art will understand that information and signals can be represented using any of a variety of different technologies and techniques. For example, data, instructions, commands, information, signals, bits, symbols, and chips that can be referenced throughout the above description can be represented by voltages, currents, electromagnetic waves, magnetic fields or particles, optical fields or particles, or any combination thereof.

[0100] Nothing described or illustrated in this application is intended to offer any component, action, feature, benefit, advantage, or equivalent to the public, whether or not such component, action, feature, benefit, advantage, or equivalent is stated in the claims.

[0101] As can be seen in the detailed description above, different features are grouped together in the various examples. This manner of disclosure should not be construed as reflecting an intention that the claimed examples have more features than those explicitly mentioned in the corresponding claims. Rather, this disclosure may include all features of fewer than the individual examples disclosed. Therefore, the appended claims should thus be considered as incorporated into this description, where each claim may be a separate example in itself. Although each claim may be a separate example in itself, it should be noted that while dependent claims in the claims may refer to a specific combination with one or more claims, other examples may also cover or include combinations of the subject matter of said dependent claim with any other dependent claim or any feature with other dependent and independent claims. Such combinations are presented herein unless explicitly stated that a particular combination is not intended to be used. Furthermore, it is intended that features of a claim may be included in any other independent claim, even if said claim is not directly dependent on that independent claim.

[0102] Furthermore, it should be noted that the methods, systems, and apparatuses disclosed in this description or claims may be implemented by devices including components for performing corresponding actions and / or functions of the disclosed methods.

[0103] Furthermore, in some examples, a single action can be subdivided into one or more sub-actions, or contain one or more sub-actions. Such sub-actions can be included in the disclosure of a single action or can be part of the disclosure of a single action.

[0104] Although the foregoing disclosure has shown illustrative examples of this disclosure, it should be noted that various changes and modifications may be made therein without departing from the scope of this disclosure as defined by the appended claims. The functions and / or actions in the method claims of the examples of this disclosure described herein do not necessarily have to be performed in any particular order. Furthermore, well-known elements will not be described in detail or may be omitted so as not to obscure the relevant details of the aspects and examples disclosed herein. Moreover, although elements of this disclosure may be described or claimed in the singular, the plural form may also be considered unless explicitly stated as limited to the singular.

Claims

1. A three-dimensional (3D) inductor, comprising: a plurality of first leads on a first side of the inductor; one or more second leads on a second side of the inductor opposite the first side; one or more upper leads, each upper lead electrically coupling an upper surface of a second lead to an upper surface of a first lead; one or more lower leads, each lower lead electrically coupling a lower surface of a first lead to a lower surface of a second lead; an upper mold at least partially encapsulating the plurality of first leads, and at least partially encapsulating the plurality of second leads, and encapsulating the one or more upper leads; and a lower mold encapsulating the one or more lower leads, wherein the plurality of first leads, the one or more second leads, the one or more upper leads, and the one or more lower leads are configured to form one or more loops of the 3D inductor.

2. The 3D inductor of claim 1, further comprising: a first terminal on the upper mold and electrically coupled to an upper surface of a first one of the plurality of first leads; and a second terminal on the upper mold and electrically coupled to an upper surface of a last one of the plurality of first leads or an upper surface of a last one of the plurality of second leads.

3. The 3D inductor of claim 2, wherein a number of first leads is N, N = 2 or higher, wherein a number of second leads is M = N, wherein a number of upper leads is N - 1, each upper lead electrically coupling an upper surface of a second lead (k) to an upper surface of a first lead (k + 1), k = 1... N - 1, and wherein a number of lower leads is M, each lower lead electrically coupling a lower surface of a first lead (j) to a lower surface of a second lead (j), j = 1... M.

4. The 3D inductor of claim 3, wherein the second terminal is electrically coupled to an upper surface of a second lead (M).

5. The 3D inductor of claim 2, wherein a number of first leads is N, N = 2 or higher, wherein a number of second leads is M = N - 1, wherein a number of upper leads is N - 1, each upper lead electrically coupling an upper surface of a second lead (k) to an upper surface of a first lead (k + 1), k = 1... N - 1, and wherein a number of lower leads is M, each lower lead electrically coupling a lower surface of a first lead (j) to a lower surface of a second lead (j), j = 1... M.

6. The 3D inductor of claim 5, wherein the second terminal is electrically coupled to an upper surface of a first lead (N).

7. The 3D inductor of claim 2, wherein the first terminal comprises: a first side plate formed on a side surface of the upper mold, a lower portion of the first side plate in contact with the upper surface of the first one of the plurality of first leads; and a first terminal pad on the upper surface of the first one of the plurality of first leads. ​ a first pad formed on an upper surface of the upper mold and connected with the first side plate.

8. The 3D inductor of claim 2, wherein the second terminal is formed of any one or more of copper, silver, and aluminum, wherein the second terminal is formed of any one or more of copper, silver, and aluminum, or both.

10. The 3D inductor of claim 1, wherein the upper mold is formed of a first magnetic molding compound, wherein the lower mold is formed of a second magnetic molding compound, or both.

11. The 3D inductor of claim 10, wherein the first magnetic molding compound is any one or more of a polymer bonded compound, a ferrite bonded compound, an isotropic neodymium bonded compound, an anisotropic isotropic neodymium bonded compound, and a samarium-cobalt bonded compound, wherein the second magnetic molding compound is any one or more of a polymer bonded compound, a ferrite bonded compound, an isotropic neodymium bonded compound, an anisotropic isotropic neodymium bonded compound, and a samarium-cobalt bonded compound, or both.

12. The 3D inductor of claim 1, wherein the plurality of first leads includes a plurality of first upper leads and a plurality of first lower leads, each first upper lead is on a corresponding first lower lead, an upper surface of the plurality of first upper leads is the upper surface of the plurality of first leads, and a lower surface of the plurality of first lower leads is the lower surface of the first leads, wherein the plurality of second leads includes a plurality of second upper leads and a plurality of second lower leads, each second upper lead is on a corresponding second lower lead, an upper surface of the plurality of second upper leads is the upper surface of the plurality of second leads, and a lower surface of the plurality of second lower leads is the lower surface of the second leads, or both.

13. The 3D inductor of claim 12, wherein the plurality of first upper leads is formed of any one or more of copper, silver, and aluminum, wherein the plurality of first lower leads is formed of any one or more of copper, silver, and aluminum, wherein the plurality of second upper leads is formed of any one or more of copper, silver, and aluminum, wherein the plurality of second lower leads is formed of any one or more of copper, silver, and aluminum, or any combination thereof.

14. The 3D inductor of claim 1, wherein the one or more upper conductive lines is formed of any one or more of copper, aluminum, gold, and silver, wherein the one or more lower conductive lines is formed of any one or more of copper, aluminum, gold, and silver, or both. ​ ​ ​ ​ 15. The 3D inductor of claim 1, wherein the 3D inductor is incorporated into a device selected from the group consisting of a music player, a video player, an entertainment unit, a navigation device, a communications device, a mobile device, a mobile phone, a smartphone, a personal digital assistant, a fixed location terminal, a tablet computer, a computer, a wearable device, an Internet of Things (IoT) device, a laptop computer, a server, and a device in an automotive vehicle.

16. A method of manufacturing a three-dimensional (3D) inductor, the method comprising: forming a plurality of first leads on a first side of the inductor; forming one or more second leads on a second side of the inductor opposite the first side; forming one or more upper leads, each upper lead electrically coupling an upper surface of a second lead to an upper surface of a first lead; forming one or more lower leads, each lower lead electrically coupling a lower surface of a first lead to a lower surface of a second lead; forming an upper mold at least partially encapsulating the plurality of first leads, and at least partially encapsulating the plurality of second leads, and encapsulating the one or more upper leads; and forming a lower mold encapsulating the one or more lower leads, wherein the plurality of first leads, the one or more second leads, the one or more upper leads, and the one or more lower leads are configured to form one or more loops of the 3D inductor.

17. The method of claim 16, further comprising: forming a first terminal on the upper mold and electrically coupled to an upper surface of a first one of the plurality of first leads; and forming a second terminal on the upper mold and electrically coupled to an upper surface of a last one of the plurality of first leads or an upper surface of a last one of the plurality of second leads.

18. The method of claim 17, wherein a number of first leads is N, N = 2 or higher, wherein a number of second leads is M = N, wherein a number of upper leads is N - 1, each upper lead electrically coupling an upper surface of a second lead (k) to an upper surface of a first lead (k + 1), k = 1... N - 1, and wherein a number of lower leads is M, each lower lead electrically coupling a lower surface of a first lead (j) to a lower surface of a second lead (j), j = 1... M.

19. The method of claim 18, wherein the second terminal is electrically coupled to an upper surface of a second lead (M).

20. The method of claim 17, wherein a number of first leads is N, N = 2 or higher, wherein a number of second leads is M = N - 1, wherein a number of upper leads is N - 1, each upper lead electrically coupling an upper surface of a second lead (k) to an upper surface of a first lead (k + 1), k = 1... N - 1, and wherein a number of lower leads is M, each lower lead electrically coupling a lower surface of a first lead (j) to a lower surface of a second lead (j), j = 1... M. 21.The method of claim 20, wherein the second terminal is electrically coupled to an upper surface of the first lead (N). 22.The method of claim 17, wherein the first terminal includes: a first side plate formed on a side surface of the upper mold, a lower portion of the first side plate being in contact with the upper surface of the first one of the plurality of first leads; and a first land formed on an upper surface of the upper mold and connected with the first side plate. 23.The method of claim 17, wherein the second terminal includes: a second side plate formed on a side surface of the upper mold, a lower portion of the second side plate being in contact with the upper surface of the last one of the plurality of first leads or the last one of the plurality of second leads; and a second land formed on an upper surface of the upper mold and connected with the second side plate. 24.The method of claim 17, wherein the first terminal is formed of any one or more of copper, silver, and aluminum, wherein the second terminal is formed of any one or more of copper, silver, and aluminum, or both. 25.The method of claim 16, wherein the upper mold is formed of a first magnetic molding compound, wherein the lower mold is formed of a second magnetic molding compound, or both. 26.The method of claim 25, wherein the first magnetic molding compound is any one or more of a polymer bonded compound, a ferrite bonded compound, an isotropic neodymium bonded compound, an anisotropic isotropic neodymium bonded compound, and a samarium-cobalt bonded compound, wherein the second magnetic molding compound is any one or more of a polymer bonded compound, a ferrite bonded compound, an isotropic neodymium bonded compound, an anisotropic isotropic neodymium bonded compound, and a samarium-cobalt bonded compound, or both. 27.The method of claim 16, wherein the plurality of first leads includes a plurality of first upper leads and a plurality of first lower leads, each first upper lead being on a corresponding first lower lead, an upper surface of the plurality of first upper leads being the upper surface of the plurality of first leads, and a lower surface of the plurality of first lower leads being the lower surface of the first leads, wherein the plurality of second leads includes a plurality of second upper leads and a plurality of second lower leads, each second upper lead being on a corresponding second lower lead, an upper surface of the plurality of second upper leads being the upper surface of the plurality of second leads, and a lower surface of the plurality of second lower leads being the lower surface of the second leads, or both. 28.The method of claim 27, wherein the plurality of first upper leads is formed of any one or more of copper, silver, and aluminum, wherein the plurality of first lower leads is formed of any one or more of copper, silver, and aluminum, wherein the plurality of second upper leads is formed of any one or more of copper, silver, and aluminum, wherein the plurality of second lower leads is formed of any one or more of copper, silver, and aluminum, or both. any combination thereof.

29. The method of claim 16, wherein the one or more upper conductive lines are formed from any one or more of copper, aluminum, gold, and silver, wherein the one or more lower conductive lines are formed from any one or more of copper, aluminum, gold, and silver, or both.

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