Atomizing core, atomizer and electronic atomizing device

Abstract

The atomization core, the atomizer and the electronic atomization device comprise a first liquid guide layer, a second liquid guide layer and a heating element, the first liquid guide layer is provided with a plurality of through micropores penetrating through a liquid absorption face and a liquid outlet face, and the second liquid guide layer is arranged on one side of the liquid outlet face of the first liquid guide layer; at least part of the second liquid guide layer is in contact with the liquid outlet surface, and disordered micropores are formed in the second liquid guide layer; at least part of the straight-through micropores of the first liquid guide layer are communicated with the disordered micropores; the heating element is arranged between the second liquid guide layer and the first liquid guide layer, or the heating element is arranged on the surface, away from the first liquid guide layer, of the second liquid guide layer, and the heating element is a metal net. Specifically, the disordered micropores of the second liquid guide layer can communicate the straight-through micropores which are not communicated with one another in the first liquid guide layer, so that liquid supply to the heating element can be improved, the atomization efficiency of the atomization core is improved, and the dry burning phenomenon of the atomization core is improved.

Description

Technical Field

[0001] This application relates to the field of electronic atomization technology, and in particular to an atomizing core, atomizer, and electronic atomization device. Background Technology

[0002] The atomizer core is the core component of a resistance-heated electronic atomizing device, which generally includes a heating element and a liquid guiding substrate. Among them, the metal mesh heating element has a long lifespan and high safety, so it is widely used; the dense substrate with through-hole micropores as a liquid guiding substrate has advantages such as fast oil conduction, high strength, and good pore size consistency.

[0003] However, although the dense substrate with through-hole micropores and the metal mesh heating element each have many advantages, when they are combined to form an atomizing core, the atomization efficiency (the proportion of energy converted into smoke) is low, and it may even lead to dry burning. Summary of the Invention

[0004] The atomizing core, atomizer, and electronic atomizing device provided in this application can solve the problem of low atomization efficiency in atomizing cores formed by combining a dense substrate with through-hole micropores with a metal mesh heating element.

[0005] To address the aforementioned technical problems, the first technical solution provided in this application is: to provide an atomizing core, comprising:

[0006] The first liquid guiding layer has an absorbent surface and an outlet surface that are arranged opposite to each other. The first liquid guiding layer is formed by opening a plurality of through-holes in a dense liquid guiding matrix, which penetrate the absorbent surface and the outlet surface. The through-holes are used for conduction and buffering of the medium to be atomized.

[0007] A second liquid guiding layer is disposed on the liquid outlet side of the first liquid guiding layer; at least a portion of the second liquid guiding layer is in contact with the liquid outlet surface, and the second liquid guiding layer has disordered micropores; wherein, at least a portion of the through micropores of the first liquid guiding layer are in communication with the disordered micropores;

[0008] A heating element is disposed between the second liquid guiding layer and the first liquid guiding layer, or the heating element is disposed on the surface of the second liquid guiding layer away from the first liquid guiding layer. The heating element is used to heat and atomize the medium to be atomized. The heating element is a metal mesh.

[0009] In one embodiment, the heating element is disposed between the second liquid guiding layer and the first liquid guiding layer, and the heating element includes a heating part and a pin part;

[0010] The second liquid guiding layer covers the heating element and passes through the hollow portion of the heating element to contact the liquid outlet surface of the first liquid guiding layer; the pin portion exposes the second liquid guiding layer.

[0011] In one embodiment, the atomizing core further includes an adhesive layer disposed between the heating element and the first liquid guiding layer, the adhesive layer being used to bond the heating element and the first liquid guiding layer.

[0012] In one embodiment, the paste of the adhesive layer is printed on one surface of the heating element, and the heating element is adhered to the liquid outlet surface of the first liquid guiding layer by the paste of the adhesive layer, and then sintered to form the adhesive layer located between the heating element and the first liquid guiding layer.

[0013] In one embodiment, the heating element is disposed on the surface of the second liquid-conducting layer opposite to the first liquid-conducting layer; the surface of the second liquid-conducting layer opposite to the first liquid-conducting layer has a receiving groove, and at least a portion of the heating element is received in the receiving groove.

[0014] In one embodiment, the heating element is completely housed within the receiving groove, and the surface of the heating element facing away from the first liquid guiding layer is flush with the opening of the receiving groove.

[0015] In one embodiment, the atomizing core further includes a third liquid-conducting substrate, which is disposed on the surface of the heating element away from the first liquid-conducting layer, and the third liquid-conducting substrate has disordered micropores.

[0016] In one embodiment, the heating element includes a heating part and a pin part;

[0017] The third liquid-conducting substrate covers the heating element and passes through the hollow portion of the heating element to contact the second liquid-conducting layer; the pin portion exposes the third liquid-conducting substrate.

[0018] In one embodiment, the thickness of the third liquid-conducting substrate is 10µm-50µm.

[0019] In one embodiment, the thickness of the heating element is 30um-200um; the thickness of the first liquid-conducting layer is 0.3mm-5mm; and the thickness of the second liquid-conducting layer is 50um-200um.

[0020] In one embodiment, the porosity of the first liquid guiding layer is 20%-80%; the porosity of the second liquid guiding layer is 40%-80%; the pore size of the disordered micropores is 10um-200um; and the pore size of the through micropores is 10um-200um.

[0021] In one embodiment, the second liquid guiding layer is sintered and formed on the liquid outlet side of the first liquid guiding layer.

[0022] To solve the above-mentioned technical problems, the second technical solution provided in this application is: an atomizer, comprising:

[0023] The casing has a liquid storage cavity;

[0024] The atomizing core is in fluid communication with the liquid storage chamber, wherein the atomizing core is any one of the atomizing cores described above.

[0025] To address the aforementioned technical problems, the third technical solution provided in this application is: to provide an electronic atomizing device, comprising:

[0026] Atomizer, wherein the atomizer is the atomizer described above;

[0027] The main unit is used to power the atomizer and control its operation.

[0028] The beneficial effects of this application are as follows: Unlike the prior art, the atomizing core, atomizer, and electronic atomizing device provided in this application are configured to have a second liquid guiding layer with disordered micropores in contact with a first liquid guiding layer with through-holes. This allows at least some of the through-holes in the first liquid guiding layer to communicate with the disordered micropores in the second liquid guiding layer. Consequently, the disordered micropores in the second liquid guiding layer can connect the non-communicating through-holes in the first liquid guiding layer, thus utilizing the through-holes that the heating element cannot use. This improves the liquid supply to the heating element, thereby increasing the atomization efficiency of the atomizing core and mitigating the dry burning phenomenon of the atomizing core. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] Figure 1 This is a partial structural cross-sectional view of the atomizing core provided in the first embodiment of this application;

[0031] Figure 2 This is a partial top view of the atomizing core provided in the first embodiment of this application;

[0032] Figure 3 yes Figure 2 A top view of a partial structure of the atomizing core after the second liquid guiding layer has been removed;

[0033] Figure 4 This is a partial structural cross-sectional view of an atomizing core provided in the second embodiment of this application;

[0034] Figure 5This is a partial structural cross-sectional view of another atomizing core provided in the second embodiment of this application;

[0035] Figure 6 This is a partial top view of the atomizing core provided in the second embodiment of this application;

[0036] Figure 7 This is a partial structural cross-sectional view of another atomizing core provided in the second embodiment of this application;

[0037] Figure 8 This is a partial top view of another atomizing core provided in the second embodiment of this application;

[0038] Figure 9 This is a schematic flowchart of the preparation method of the atomizing core provided in the third embodiment of this application;

[0039] Figure 10 This is a schematic flowchart of the preparation method of the atomizing core provided in the fourth embodiment of this application;

[0040] Figure 11 This is a schematic diagram of the electronic atomizing device provided in the fifth embodiment of this application;

[0041] Figure 12 This is a structural cross-sectional view of the atomizer provided in the sixth embodiment of this application. Detailed Implementation

[0042] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0043] In the following description, specific details such as particular system architectures, interfaces, and technologies are presented for illustrative purposes rather than for limiting purposes, in order to provide a thorough understanding of this application.

[0044] The terms "first," "second," and "third" in this application are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of the stated features. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified. All directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationships and movement of components in a specific posture (as shown in the figures). If the specific posture changes, the directional indications also change accordingly. The terms "comprising" and "having," and any variations thereof, in the embodiments of this application are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or components inherent to these processes, methods, products, or devices.

[0045] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment that is mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0046] The present application will now be described in detail with reference to the accompanying drawings and embodiments.

[0047] The inventors discovered that although the oil guiding speed of the liquid guiding substrate with straight holes is fast, compared with the liquid guiding substrate with disordered holes, its disadvantage is that the holes or layers are not interconnected. Therefore, when combined with the metal mesh heating element, the proportion of oil guiding holes that can actually effectively contact or cover the heating element is not high. As a result, the overall utilization efficiency of the liquid supply is low, which leads to low atomization efficiency and high heating element temperature. When the power is increased, it is easy to produce a burnt smell.

[0048] To address the aforementioned issues, this application provides an atomizing core that, based on existing atomizing cores with a liquid-conducting substrate (with through-holes) and a heating element (mesh), further adds a liquid-conducting substrate (with disordered micropores). By arranging the liquid-conducting substrate with disordered micropores in contact with the liquid-conducting substrate with through-holes, at least some of the through-holes and disordered micropores are connected. This allows the disordered micropores to connect the previously unconnected through-holes, thereby improving the liquid supply to the heating element, enhancing the atomization efficiency of the atomizing core, and mitigating the dry-burning phenomenon of the atomizing core.

[0049] For details, see Figures 1-8 , Figure 1 This is a partial structural cross-sectional view of the atomizing core provided in the first embodiment of this application; Figure 2 This is a partial top view of the atomizing core provided in the first embodiment of this application; Figure 3 yes Figure 2 A top view of a partial structure of the atomizing core after the second liquid guiding layer has been removed; Figure 4 This is a partial structural cross-sectional view of an atomizing core provided in the second embodiment of this application;

[0050] Figure 5 This is a partial structural cross-sectional view of another atomizing core provided in the second embodiment of this application; Figure 6 This is a partial top view of the atomizing core provided in the second embodiment of this application; Figure 7 This is a partial structural cross-sectional view of another atomizing core provided in the second embodiment of this application; Figure 8 This is a partial top view of another atomizing core provided in the second embodiment of this application.

[0051] This application provides an atomizing core, including a first liquid guiding layer 11, a second liquid guiding layer 12, and a heating element 13.

[0052] The first liquid guiding layer 11 includes a dense liquid guiding substrate, such as dense ceramic or dense glass. The first liquid guiding layer 11 has an absorbent surface A1 and an outlet surface A2 that are arranged opposite to each other. Specifically, the first liquid guiding layer 11 is formed by opening a plurality of through-holes A3 in the dense liquid guiding substrate, which penetrate the absorbent surface A1 and the outlet surface A2. The through-holes A3 have capillary force and are used to buffer or conduct the atomized medium absorbed from the absorbent surface A1 to the outlet surface A2.

[0053] Among them, the straight-through micropore A3 refers to the center line of the micropore being approximately a straight line (a straight line or an approximate straight line). It should be noted that the center line of the straight-through micropore A3 can be perpendicular to the plane where the liquid absorption surface A1 is located or the plane where the liquid outlet surface A2 is located, or it can be not perpendicular to the plane where the liquid absorption surface A1 is located or the plane where the liquid outlet surface A2 is located (inclined setting). This application takes the example where the center line of the straight-through micropore A3 is perpendicular to the plane where the liquid absorption surface A1 is located and the plane where the liquid outlet surface A2 is located.

[0054] The second liquid-conducting layer 12 is a disordered porous liquid-conducting matrix, such as disordered porous ceramics or disordered porous glass. The second liquid-conducting layer 12 has multiple disordered micropores (not shown in the figure), and these micropores exhibit capillary forces. These disordered micropores can be formed by adding a pore-forming agent to a ceramic slurry and sintering it. Specifically, the second liquid-conducting layer 12 is disposed on the liquid outlet surface A2 side of the first liquid-conducting layer 11; and at least a portion of the second liquid-conducting layer 12 is in contact with the liquid outlet surface A2, wherein at least a portion of the through-holes A3 of the first liquid-conducting layer 11 communicates with the disordered micropores of the second liquid-conducting layer 12.

[0055] Among them, disordered micropores refer to the irregularly distributed and extended micropores formed in the porous liquid-conducting matrix itself during the preparation process, and the disordered micropores in the porous liquid-conducting matrix are interconnected.

[0056] The heating element 13 is used to heat and atomize the medium to be atomized, and in this embodiment, the heating element 13 is a metal mesh.

[0057] Specifically, in the first embodiment provided in this application, the heating element 13 is disposed between the second liquid guiding layer 12 and the first liquid guiding layer 11; in the second embodiment provided in this application, the second liquid guiding layer 12 is disposed at the liquid outlet surface A2 of the first liquid guiding layer 11, and the heating element 13 is disposed on the surface of the second liquid guiding layer 12 away from the first liquid guiding layer 11.

[0058] Specifically, the existing metal mesh heating element 13, due to its structural design, has a low proportion of through-holes A3 that can effectively contact or cover the heating element 13 when it is bonded to the dense liquid-conducting substrate. Therefore, the overall utilization efficiency of the liquid supply is low, resulting in low atomization efficiency and high temperature of the heating element 13, which easily produces a burnt smell when the power is increased. This application further provides a second liquid-conducting layer 12 with disordered micropores, and at least some of the through-holes A3 of the first liquid-conducting layer 11 are connected to the disordered micropores of the second liquid-conducting layer 12. This allows the disordered micropores of the second liquid-conducting layer 12 to connect the unconnected through-holes A3 in the first liquid-conducting layer 11. Therefore, the second liquid-conducting layer 12 can utilize the through-holes A3 that the heating element 13 cannot use, thereby improving the liquid supply to the heating element 13, thus improving the atomization efficiency of the atomizing core and improving the dry burning phenomenon of the atomizing core.

[0059] See Figures 1-3 In the first embodiment provided in this application, the heating element 13 is disposed between the second liquid guiding layer 12 and the first liquid guiding layer 11.

[0060] Specifically, the heating element 13 is disposed between the second liquid guiding layer 12 and the first liquid guiding layer 11. Its beneficial effects are as follows: First, the disordered micropores of the second liquid guiding layer 12 can connect the non-interconnected through-holes A3 in the first liquid guiding layer 11, thereby improving the liquid supply to the heating element 13 and thus improving the atomization efficiency of the atomizing core. Even if there are local gaps between the heating element 13 and the first liquid guiding layer 11, local dry burning will not occur, leading to excessively high temperatures, thus improving the dry burning phenomenon of the atomizing core. Second, the second liquid guiding layer 12... 2. Covering at least part of the heating element 13 provides insulation for the heating element 13 and improves energy utilization; 3. The second liquid guiding layer 12 enhances the adhesion between the heating element 13 and the first liquid guiding layer 11; 4. It can reduce the atomization temperature of the heating element 13, improving safety and taste; 5. The presence of the second liquid guiding layer 12 can improve the thickness of the oil film on the surface of the heating element 13, preventing the oil film on the surface of the heating element 13 from being too thick, thereby reducing the risk of leakage caused by atomized spraying, splattering, or seepage.

[0061] See Figure 3 In this embodiment of the application, the heating element 13 includes a heating part 131 and a pin part 132.

[0062] The resistance of the pin portion 132 is much smaller than that of the heating portion 131, giving the pin portion 132 excellent conductivity. Since the pin portion 132 and the heating portion 131 are connected in series, when the entire heating element 13 is energized, the heating portion 131 can generate a large amount of heat, while the heat generated on the pin portion 132 can be relatively negligible.

[0063] In this embodiment, the second liquid guiding layer 12 at least covers the heating element 131. For example, the second liquid guiding layer 12 may cover both the heating element 131 and the pin portion 132, or the second liquid guiding layer 12 may only cover the heating element 131. In this embodiment, since the heat generated by the pin portion 132 cannot atomize the atomizing medium, only the second liquid guiding layer 12 covers the heating element 131, and the pin portion 132 is exposed above the second liquid guiding layer 12 for electrical connection with an external circuit.

[0064] Since the heating element 13 is a metal mesh, the heating part 131 has a hollow part 133 to form a mesh structure. The second liquid guiding layer 12 passes through the hollow part 133 of the heating part 131 and contacts the liquid outlet surface A2 of the first liquid guiding layer 11, thereby realizing the communication between at least a portion of the through-holes A3 of the first liquid guiding layer 11 and the disordered micropores of the second liquid guiding layer 12.

[0065] See Figure 1 In one embodiment, the atomizing core further includes an adhesive layer 14, which is disposed between the heating element 13 and the first liquid guiding layer 11. The adhesive layer 14 is used to reliably bond the heating element 13 and the first liquid guiding layer 11.

[0066] Specifically, the adhesive layer 14 is basically made of inorganic materials. In order to ensure reliability, it has high requirements for bonding strength, consistency and stability (if the heating element 13 is not bonded to the first liquid guiding layer 11 and there is a gap, the heat conduction in this area is prone to problems, resulting in high temperature and scorching). Therefore, it has high requirements for the consistency of the thermal expansion coefficients of the first liquid guiding layer 11 and the heating element 13, which limits the application of many types of substrates.

[0067] In one preparation method of this application, the paste of the adhesive layer 14 is printed on one surface of the heating element 13, and the heating element 13 is adhered to the liquid outlet surface of the first liquid guiding layer 11 by the paste of the adhesive layer 14, and then sintered to form an adhesive layer 14 located between the heating element 13 and the first liquid guiding layer 11.

[0068] In this process, an adhesive layer 14 is formed by sintering, connecting the heating element 13 and the first liquid guiding layer 11. The adhesive layer 14 can improve the stability and durability of the atomizing core. Specifically, the sintering process can firmly fix the heating element 13 to the first liquid guiding layer 11, forming a stable integral structure, reducing the risk of detachment or damage caused by vibration or mechanical stress during use, thereby extending the service life of the atomizing core.

[0069] In this embodiment, the adhesive layer 14 is composed of one or more inorganic oxides, which are printed onto one side of the heating element 13 by preparing a paste, and then sintered with the first liquid guiding layer 11 to firmly adhere to the liquid outlet surface A2 of the first liquid guiding layer 11. Furthermore, in this application, the thickness of the adhesive layer 14 is 10µm-40µm, for example, 10µm, 20µm, 30µm, or 40µm, and it is partially embedded inside the first liquid guiding layer 11; and the linear thermal expansion coefficient of the adhesive layer 14 is 6 to 30E-6 / ℃, for example, 6E-6 / ℃, 12E-6 / ℃, 18E-6 / ℃, 24E-6 / ℃, or 30E-6 / ℃.

[0070] In addition, in this embodiment, the adhesive layer 14 has corresponding liquid guiding holes in the area corresponding to the through-hole A3, so as to avoid the adhesive layer 14 affecting the liquid supply of the first liquid guiding layer 11 to the heating element 13 and the second liquid guiding layer 12.

[0071] See Table 1. Table 1 is a comparison table of the amount of aerosol produced by heating and atomizing the atomizing core provided in the first embodiment of this application compared with the amount of aerosol produced by existing atomizing cores (which only include a dense liquid-conducting matrix with through-holes A3 and a heating element).

[0072] In Table 1, serial numbers 1, 17, and 33 represent the relevant parameters of existing atomizing cores and the amount of aerosol produced by heating and atomization. The other atomizing cores in Table 1 are identical to existing cores except for the addition of a porous liquid-conducting substrate (second liquid-conducting layer 12). Furthermore, the aerosol production amounts of each atomizing core in Table 1 are obtained using the same apparatus and the same heating power, as shown below:

[0073]

[0074]

[0075]

[0076] Table 1

[0077] Referring to Table 1, where T11 is a type of material for the dense liquid-conducting matrix, and 430, FeCrAl, and composite materials are different material types for the heating element 13. As can be seen from Table 1, when the heating element 13 and the dense liquid-conducting matrix material are the same, the atomizing core provided in the first embodiment of this application produces a larger amount of aerosol compared to existing atomizing cores.

[0078] See Figures 4-8 In the second embodiment provided in this application, the second liquid guiding layer 12 is disposed on the liquid outlet surface A2 of the first liquid guiding layer 11, and the heating element 13 is disposed on the surface of the second liquid guiding layer 12 away from the first liquid guiding layer 11.

[0079] Specifically, the second liquid guiding layer 12 is disposed on the liquid outlet surface A2 of the first liquid guiding layer 11, and the heating element 13 is disposed on the surface of the second liquid guiding layer 12 away from the first liquid guiding layer 11. The beneficial effects are as follows: First, the disordered micropores of the second liquid guiding layer 12 can connect the non-interconnected through-holes A3 in the first liquid guiding layer 11, thereby improving the liquid supply to the heating element 13 and thus improving the atomization efficiency of the atomizing core; Second, compared with the first embodiment, the advantage is that the second liquid guiding layer 12 also plays the role of bonding and fixing the heating element 13, eliminating the need for the bonding layer 14, which is simpler in terms of process and lower in cost; Third, the printing area of ​​the second liquid guiding layer 12 is larger, increasing the utilization rate of the number of through-holes A3 in the first liquid guiding layer 11, further improving the liquid supply to the heating element 13.

[0080] Further, see Figure 5In this embodiment, the surface of the second liquid guiding layer 12 facing away from the first liquid guiding layer 11 has a receiving groove, and at least a portion of the heating element 13 is received in the receiving groove. Specifically, embedding or completely embedding the heating element 13 into the receiving groove can improve the fixing effect of the second liquid guiding layer 12 on the heating element 13, and minimize the presence of local gaps between the heating element 13 and the second liquid guiding layer 12, thereby improving the situation of excessively high temperature caused by local dry burning and improving the dry burning phenomenon of the atomizing core.

[0081] In one specific embodiment, the heating element 13 is completely housed within the receiving groove, and the surface of the heating element 13 facing away from the first liquid guiding layer 11 is flush with the opening of the receiving groove. Specifically, by setting the surface of the heating element 13 facing away from the first liquid guiding layer 11 to be flush with the opening of the receiving groove, compared to the heating element 13 protruding from the second liquid guiding layer 12, the oil film thickness on the surface of the heating element 13 is thinner, thereby reducing the risk of leakage caused by atomized spraying, splattering, or seepage.

[0082] See Figure 7 and Figure 8 In the second embodiment of this application, the atomizing core further includes a third liquid guiding substrate 15, which is disposed on the surface of the heating element 13 away from the first liquid guiding layer 11, and the third liquid guiding substrate 15 has disordered micropores.

[0083] The third liquid-conducting substrate 15 can be basically the same as the second liquid-conducting layer 12 in terms of material and structure.

[0084] Specifically, the third liquid-conducting substrate 15 is disposed on the surface of the heating element 13 away from the first liquid-conducting layer 11. Its beneficial effects are as follows: First, the third liquid-conducting substrate 15 covers at least part of the heating element 13, which plays a role in heat preservation of the heating element 13 and can improve energy utilization. Second, the third liquid-conducting substrate 15 can enhance the bonding between the heating element 13 and the second liquid-conducting layer 12. Third, it can reduce the atomization temperature of the heating element 13, which improves safety and taste. Fourth, the presence of the third liquid-conducting substrate 15 can further improve the oil film thickness on the surface of the heating element 13, thereby reducing the risk of leakage caused by atomized spraying, splattering, and seepage.

[0085] In one specific embodiment, the third liquid-conducting substrate 15 at least covers the heating element 131. For example, the third liquid-conducting substrate 15 may cover both the heating element 131 and the pin portion 132, or the third liquid-conducting substrate 15 may only cover the heating element 131. In this embodiment, since the heat generated by the pin portion 132 cannot atomize the atomizing medium, only the third liquid-conducting substrate 15 covers the heating element 131, and the pin portion 132 is exposed outside the third liquid-conducting substrate 15 for electrical connection with an external circuit.

[0086] Since the heating element 13 is a metal mesh, the heating part 131 has a hollow part 133 to form a mesh structure. The third liquid guiding substrate 15 passes through the hollow part 133 of the heating part 131 and contacts the second liquid guiding layer 12, thereby realizing the communication between the disordered micropores of the second liquid guiding layer 12 and the disordered micropores of the third liquid guiding substrate 15.

[0087] In this embodiment, the thickness of the third liquid-conducting substrate 15 is 10um-50um. For example, 10um, 20um, 30um, 40um, or 50um, etc., are designed according to actual needs.

[0088] In addition, in the first and second embodiments of this application, the thickness of the heating element 13 is 30um-200um. For example, 30um, 60um, 90um, 120um, 150um, 180um, or 200um.

[0089] The resistance range of the heating element 13 is 0.3Ω to 3Ω. For example, 0.3Ω, 1Ω, 1.7Ω, 2.4Ω, or 3Ω.

[0090] The heating element 13 can be made of iron-chromium-aluminum, stainless steel, nickel-chromium, or other composite metal conductive materials. Specifically, the thickness, resistance, and material of the heating element 13 are related to the atomization efficiency, reliability, and aerosol flavor of the atomizing core. The specific parameters are not limited here and are designed according to actual needs.

[0091] In the first and second embodiments of this application, the second liquid guiding layer 12 is sintered and formed on the liquid outlet surface A2 side of the first liquid guiding layer 11.

[0092] Understandably, the sintering process can firmly fix the second liquid guiding layer 12 onto the first liquid guiding layer 11, forming a stable overall structure, reducing the risk of detachment or damage caused by vibration or mechanical stress during use, thereby extending the service life of the atomizing core.

[0093] In the first and second embodiments of this application, the thickness of the first liquid guiding layer 11 is 0.3mm-5mm. For example, 0.3mm, 1mm, 2mm, 3mm, 4mm, or 5mm, etc.

[0094] The porosity of the first liquid-conducting layer 11 is 20%-80%. For example, 20%, 40%, 60%, or 80%.

[0095] The pore size of the through-hole A3 in the first liquid-conducting layer 11 is 10um-200um. For example, 10um, 50um, 100um, 150um or 200um.

[0096] The linear thermal expansion coefficient of the first liquid-conducting layer 11 is 6 to 30E-6 / ℃, for example, 6E-6 / ℃, 12E-6 / ℃, 18E-6 / ℃, 24E-6 / ℃ or 30E-6 / ℃.

[0097] The thermal conductivity of the first liquid-conducting layer 11 is 0.1 to 30.0 W / mK. For example, 0.1 W / mK, 5.0 W / mK, 10.0 W / mK, 15.0 W / mK, 20.0 W / mK, 25.0 W / mK, or 30.0 W / mK.

[0098] Specifically, the thickness, porosity, pore size, linear thermal expansion coefficient, and thermal conductivity of the first liquid guiding layer 11 are related to the liquid guiding efficiency, atomization efficiency, and reliability of the atomizing core. The specific parameters are not limited here and are designed according to actual needs.

[0099] In the first and second embodiments of this application, the thickness of the second liquid-conducting layer 12 is 50um-200um. For example, 50um, 100um, 150um or 200um, etc., are not limited here, and are designed according to actual needs.

[0100] The porosity of the second liquid-conducting layer 12 is 40%-80%. For example, 40%, 60%, or 80%.

[0101] The disordered micropores of the second liquid-conducting layer 12 have a pore size of 10um-200um. For example, 10um, 50um, 100um, 150um, or 200um.

[0102] Specifically, the thickness, porosity, and pore size of the disordered micropores of the second liquid guiding layer 12 are related to the liquid guiding efficiency, atomization efficiency, and reliability of the atomizing core. The specific parameters are not limited here and are designed according to actual needs.

[0103] See Table 2, which is a comparison table of the amount of aerosol produced by heating and atomizing the atomizing core provided in the second embodiment of this application compared with the amount of aerosol produced by existing atomizing cores (which only include a dense liquid-conducting matrix with through-holes A3 and a heating element).

[0104] In Table 2, serial numbers 1, 17, and 33 represent the relevant parameters of existing atomizing cores and the amount of aerosol produced by heating and atomization. The atomizing cores represented by the other serial numbers in Table 1 are identical to existing atomizing cores except for the addition of a porous liquid-conducting substrate (second liquid-conducting layer 12). Furthermore, the aerosol production amounts of each atomizing core in Table 2 are obtained using the same apparatus and the same heating power, as shown below:

[0105]

[0106]

[0107]

[0108] Table 2

[0109] Referring to Table 2, T11 is a type of material for the dense liquid-conducting matrix, and 430, FeCrAl, and composite materials are different material types for the heating element 13. As can be seen from Table 2, when the heating element 13 and the dense liquid-conducting matrix material are the same, the atomizing core provided in the second embodiment of this application produces a larger amount of aerosol compared to existing atomizing cores.

[0110] Specifically, the atomizing core provided in this application has a second liquid guiding layer 12 with disordered micropores, and at least some of the through-holes A3 of the first liquid guiding layer 11 are connected to the disordered micropores of the second liquid guiding layer 12. This allows the disordered micropores of the second liquid guiding layer 12 to connect the non-connected through-holes A3 in the first liquid guiding layer 11. The heating element 13 is disposed on and in contact with the second liquid guiding layer 12. Therefore, the through-holes A3 that the heating element 13 cannot utilize can be utilized, thereby improving the liquid supply to the heating element 13, thereby improving the atomization efficiency of the atomizing core and improving the dry burning phenomenon of the atomizing core.

[0111] See Figure 9 , Figure 9 This is a schematic flowchart of the atomizer core preparation method provided in the third embodiment of this application. The third embodiment of this application provides a method for preparing an atomizer core, including:

[0112] Step S11: Provide a first liquid guiding layer 11 with through micropores A3.

[0113] The first liquid-conducting layer 11 is a dense liquid-conducting matrix, such as dense ceramics or dense glass, which can be composed of glass, alumina, zirconium oxide, silicon carbide, diatomaceous earth or a mixture of various inorganic non-metallic materials.

[0114] The first liquid guiding layer 11 has an absorbent surface A1 and an outlet surface A2 that are arranged opposite to each other; and has a plurality of through-holes A3 that penetrate the absorbent surface A1 and the outlet surface A2, wherein the through-holes A3 have capillary force.

[0115] The first liquid guiding layer 11 mainly serves to provide liquid supply, oil storage, liquid locking, and support the mounting strength of the heating element. In some embodiments, the thickness of the first liquid guiding layer 11 is 0.3mm-5mm, such as 0.3mm, 1mm, 2mm, 3mm, 4mm, or 5mm.

[0116] The porosity of the first liquid-conducting layer 11 is 20%-80%. For example, 20%, 40%, 60%, or 80%.

[0117] The pore size of the through-hole A3 in the first liquid-conducting layer 11 is 10um-200um. For example, 10um, 50um, 100um, 150um or 200um.

[0118] The linear thermal expansion coefficient of the first liquid-conducting layer 11 is 6 to 30E-6 / ℃, for example, 6E-6 / ℃, 12E-6 / ℃, 18E-6 / ℃, 24E-6 / ℃ or 30E-6 / ℃.

[0119] The thermal conductivity of the first liquid-conducting layer 11 is 0.1 to 30.0 W / mK. For example, 0.1 W / mK, 5.0 W / mK, 10.0 W / mK, 15.0 W / mK, 20.0 W / mK, 25.0 W / mK, or 30.0 W / mK.

[0120] Specifically, the thickness, porosity, pore size, linear thermal expansion coefficient, and thermal conductivity of the first liquid guiding layer 11 are related to the liquid guiding efficiency, atomization efficiency, and reliability of the atomizing core. The specific parameters are not limited here and are designed according to actual needs.

[0121] Step S12: Attach the heating element 13 to the liquid outlet surface A2 of the first liquid guiding layer 11.

[0122] In this application, the heating element 13 is heated by resistance heating to provide atomization energy.

[0123] In some embodiments, the heating element 13 may be made of iron-chromium-aluminum, stainless steel, nickel-chromium, or other composite metal conductive materials.

[0124] The thickness of the heating element 13 is 30um-200um. For example, 30um, 60um, 90um, 120um, 150um, 180um or 200um, etc.

[0125] The resistance range of the heating element 13 is 0.3Ω to 3Ω. For example, 0.3Ω, 1Ω, 1.7Ω, 2.4Ω, or 3Ω.

[0126] Specifically, the thickness, resistance, and material of the heating element 13 are related to the atomization efficiency, reliability, and aerosol taste of the atomizing core. The specific parameters are not limited here and are designed according to actual needs.

[0127] In one embodiment, the heating element 13 is bonded to the liquid outlet surface A2 of the first liquid guiding layer 11 by an adhesive layer 14. Specifically, the paste of the adhesive layer 14 is printed on one surface of the heating element 13, and the heating element 13 is bonded to the liquid outlet surface of the first liquid guiding layer 11 by the paste of the adhesive layer 14, and then sintered to form an adhesive layer 14 located between the heating element 13 and the first liquid guiding layer 11.

[0128] In this process, an adhesive layer 14 is formed by sintering, connecting the heating element 13 and the first liquid guiding layer 11. The adhesive layer 14 can improve the stability and durability of the atomizing core. Specifically, the sintering process can firmly fix the heating element 13 to the first liquid guiding layer 11, forming a stable integral structure, reducing the risk of detachment or damage caused by vibration or mechanical stress during use, thereby extending the service life of the atomizing core.

[0129] The adhesive layer 14 is mainly made of inorganic materials. In order to ensure reliability, it has high requirements for bonding strength, consistency and stability (if the heating element 13 is not bonded to the first liquid guiding layer 11 and there is a gap, the heat conduction in this area is prone to problems, resulting in high temperature and scorching). Therefore, it has high requirements for the consistency of the thermal expansion coefficients of the first liquid guiding layer 11 and the heating element 13.

[0130] In this embodiment, the adhesive layer 14 is composed of one or more inorganic oxides, which are printed onto one side of the heating element 13 by preparing a paste, and then sintered with the first liquid guiding layer 11 to firmly adhere to the liquid outlet surface A2 of the first liquid guiding layer 11. Furthermore, in this application, the thickness of the adhesive layer 14 is 10µm-40µm, for example, 10µm, 20µm, 30µm, or 40µm, and it is partially embedded inside the first liquid guiding layer 11; and the linear thermal expansion coefficient of the adhesive layer 14 is 6 to 30E-6 / ℃, for example, 6E-6 / ℃, 12E-6 / ℃, 18E-6 / ℃, 24E-6 / ℃, or 30E-6 / ℃.

[0131] In addition, in this embodiment, the adhesive layer 14 has the same pattern as the heating part 131 of the heating element 13 at the position of the heating element 13, so as to avoid the adhesive layer 14 affecting the liquid supply of the first liquid guiding layer 11 to the heating element 13 and the second liquid guiding layer 12.

[0132] Step S13: A second liquid guiding layer 12 with disordered micropores is formed on the liquid outlet surface A2 side of the first liquid guiding layer 11, and the second liquid guiding layer 12 covers the heating part 131 of the heating element 13; wherein, at least a portion of the through micropores A3 of the first liquid guiding layer 11 are connected to the disordered micropores.

[0133] The second liquid-conducting layer 12 is a porous liquid-conducting matrix, such as porous ceramics or porous glass. It can be composed of two or more inorganic non-metallic materials, and the second liquid-conducting layer 12 has disordered micropores, which have capillary forces.

[0134] The functions of the second liquid guiding layer 12 are as follows: First, the disordered micropores of the second liquid guiding layer 12 can connect the non-interconnected through micropores A3 in the first liquid guiding layer 11, thereby improving the liquid supply to the heating element 13 and thus improving the atomization efficiency of the atomizing core. Even if there is a local gap between the heating element 13 and the first liquid guiding layer 11, local dry burning will not occur, resulting in excessively high temperatures, thus improving the dry burning phenomenon of the atomizing core. Second, the second liquid guiding layer 12 covers at least part of the heating element 13, which plays a role in heat preservation of the heating element 13 and can improve energy utilization. Third, the second liquid guiding layer 12 can enhance the adhesion between the heating element 13 and the first liquid guiding layer 11. Fourth, it can reduce the atomization temperature of the heating element 13, which improves safety and taste. Fifth, the presence of the second liquid guiding layer 12 can improve the thickness of the oil film on the surface of the heating element 13, avoiding an excessively thick oil film on the surface of the heating element 13, thereby reducing the risk of leakage caused by atomization spraying, splattering, and seepage.

[0135] In this embodiment, the second liquid guiding layer 12 is sintered and formed on the liquid outlet surface A2 side of the first liquid guiding layer 11.

[0136] Understandably, the sintering process can firmly fix the second liquid guiding layer 12 onto the first liquid guiding layer 11, forming a stable overall structure, reducing the risk of detachment or damage caused by vibration or mechanical stress during use, thereby extending the service life of the atomizing core.

[0137] In some embodiments, the thickness of the second liquid guiding layer 12 is 50um-200um. For example, 50um, 100um, 150um or 200um, etc., are not limited here, and are designed according to actual needs.

[0138] The porosity of the second liquid-conducting layer 12 is 40%-80%. For example, 40%, 60%, or 80%.

[0139] The disordered micropores of the second liquid-conducting layer 12 have a pore size of 10um-200um. For example, 10um, 50um, 100um, 150um, or 200um.

[0140] Specifically, the thickness, porosity, and pore size of the disordered micropores of the second liquid guiding layer 12 are related to the liquid guiding efficiency, atomization efficiency, and reliability of the atomizing core. The specific parameters are not limited here and are designed according to actual needs.

[0141] See Figure 10 , Figure 10 This is a schematic flowchart of the preparation method of the atomizer core provided in the fourth embodiment of this application. The fourth embodiment of this application provides a method for preparing an atomizer core, including:

[0142] Step S21: Provide a first liquid guiding layer 11 with through micropores A3.

[0143] The first liquid-conducting layer 11 is a dense liquid-conducting matrix, such as dense ceramics or dense glass, which can be composed of glass, alumina, zirconium oxide, silicon carbide, diatomaceous earth or a mixture of various inorganic non-metallic materials.

[0144] The first liquid guiding layer 11 has an absorbent surface A1 and an outlet surface A2 that are arranged opposite to each other; and has a plurality of through-holes A3 that penetrate the absorbent surface A1 and the outlet surface A2, wherein the through-holes A3 have capillary force.

[0145] The first liquid guiding layer 11 mainly serves to provide liquid supply, oil storage, liquid locking, and support the mounting strength of the heating element. In some embodiments, the thickness of the first liquid guiding layer 11 is 0.3mm-5mm, such as 0.3mm, 1mm, 2mm, 3mm, 4mm, or 5mm.

[0146] The porosity of the first liquid-conducting layer 11 is 20%-80%. For example, 20%, 40%, 60%, or 80%.

[0147] The pore size of the through-hole A3 in the first liquid-conducting layer 11 is 10um-200um. For example, 10um, 50um, 100um, 150um or 200um.

[0148] The linear thermal expansion coefficient of the first liquid-conducting layer 11 is 6 to 30E-6 / ℃, for example, 6E-6 / ℃, 12E-6 / ℃, 18E-6 / ℃, 24E-6 / ℃ or 30E-6 / ℃.

[0149] The thermal conductivity of the first liquid-conducting layer 11 is 0.1 to 30.0 W / mK. For example, 0.1 W / mK, 5.0 W / mK, 10.0 W / mK, 15.0 W / mK, 20.0 W / mK, 25.0 W / mK, or 30.0 W / mK.

[0150] Specifically, the thickness, porosity, pore size, linear thermal expansion coefficient, and thermal conductivity of the first liquid guiding layer 11 are related to the liquid guiding efficiency, atomization efficiency, and reliability of the atomizing core. The specific parameters are not limited here and are designed according to actual needs.

[0151] Step S22: A second liquid-conducting layer 12 is printed on one surface of the heating element 13.

[0152] In this application, the heating element 13 is heated by resistance heating to provide atomization energy.

[0153] In some embodiments, the heating element 13 may be made of iron-chromium-aluminum, stainless steel, nickel-chromium, or other composite metal conductive materials.

[0154] The thickness of the heating element 13 is 30um-200um. For example, 30um, 60um, 90um, 120um, 150um, 180um or 200um, etc.

[0155] The resistance range of the heating element 13 is 0.3Ω to 3Ω. For example, 0.3Ω, 1Ω, 1.7Ω, 2.4Ω, or 3Ω.

[0156] Specifically, the thickness, resistance, and material of the heating element 13 are related to the atomization efficiency, reliability, and aerosol taste of the atomizing core. The specific parameters are not limited here and are designed according to actual needs.

[0157] In this embodiment, the second liquid-conducting layer 12 is sintered and formed on the liquid outlet surface A2 side of the first liquid-conducting layer 11. The second liquid-conducting layer 12 is a porous liquid-conducting matrix, such as porous ceramics or porous glass, which can be composed of two or more inorganic non-metallic materials, and the second liquid-conducting layer 12 has disordered micropores, and the disordered micropores have capillary forces.

[0158] Understandably, the sintering process can firmly fix the second liquid guiding layer 12 onto the first liquid guiding layer 11, forming a stable overall structure, reducing the risk of detachment or damage caused by vibration or mechanical stress during use, thereby extending the service life of the atomizing core.

[0159] In some embodiments, the thickness of the second liquid guiding layer 12 is 50um-200um. For example, 50um, 100um, 150um or 200um, etc., are not limited here, and are designed according to actual needs.

[0160] The porosity of the second liquid-conducting layer 12 is 40%-80%. For example, 40%, 60%, or 80%.

[0161] The disordered micropores of the second liquid-conducting layer 12 have a pore size of 10um-200um. For example, 10um, 50um, 100um, 150um, or 200um.

[0162] Specifically, the thickness, porosity, and pore size of the disordered micropores of the second liquid guiding layer 12 are related to the liquid guiding efficiency, atomization efficiency, and reliability of the atomizing core. The specific parameters are not limited here and are designed according to actual needs.

[0163] In one embodiment, the printing area of ​​the second liquid guiding layer 12 is larger than that of the heating element 13, so as to enclose the entire heating element 13 inside.

[0164] Step S23: The surface of the second liquid guiding layer 12 disposed on the heating element 13 is bonded and sintered with the first liquid guiding layer 11; wherein at least a portion of the through micropores A3 of the first liquid guiding layer 11 are connected to the disordered micropores.

[0165] Specifically, the second liquid guiding layer 12 is bonded and sintered with the first liquid guiding layer 11 so that at least some of the through-holes A3 in the first liquid guiding layer 11 are connected to the disordered micropores. The functions of the second liquid guiding layer 12 are: first, the disordered micropores of the second liquid guiding layer 12 can connect the non-connected through-holes A3 in the first liquid guiding layer 11, thereby improving the liquid supply to the heating element 13 and thus improving the atomization efficiency of the atomizing core; second, compared with the first embodiment, the second liquid guiding layer 12 also plays the role of bonding and fixing the heating element 13, eliminating the need for the adhesive layer 14, which is simpler and cheaper in terms of process; third, the printing area of ​​the second liquid guiding layer 12 is larger, increasing the utilization rate of the number of through-holes A3 in the first liquid guiding layer 11, further improving the liquid supply to the heating element 13.

[0166] See Figure 11 , Figure 11 This is a schematic diagram of the structure of the electronic atomizing device provided in the fifth embodiment of this application. In this embodiment, an electronic atomizing device 1000 is provided. The electronic atomizing device 1000 can be used to atomize a substrate. The electronic atomizing device 1000 includes an atomizer 100 and a main unit 200 that are electrically connected to each other.

[0167] The atomizer 100 is used to store and atomize the substrate to be atomized, forming an aerosol that can be inhaled by the user. The atomizer 100 can be used in various fields, such as medical, beauty, and recreational inhalation.

[0168] The following embodiments use the atomizer 100 for recreational inhalation as an example; of course, in other embodiments, the atomizer 100 can also be applied to hairspray devices to atomize hairspray for hair styling; or to devices for treating diseases of the upper and lower respiratory systems to atomize medical drugs.

[0169] The specific structure and function of the atomizer 100 can be found in the following embodiments, which describe the specific structure and function of the atomizer 100 and can achieve the same or similar technical effects. They will not be described again here.

[0170] The main unit 200 is used to power the atomizer 100 and control its operation. In one embodiment, the main unit 200 includes a battery (not shown) and a controller (not shown). The battery provides electrical energy to the atomizer 100 so that it can atomize the substrate to be atomized to form an aerosol; the controller controls the operation of the atomizer 100. The main unit 200 may also include other components such as a battery holder and an airflow sensor.

[0171] The atomizer 100 and the main unit 200 can be integrated, such as a disposable electronic atomizing device 1000, which is disposable after use. Alternatively, the atomizer 100 and the main unit 200 can be detachably connected. For example, after the atomizing medium in the atomizer 100 is used up, the atomizer 100 can be removed from the main unit 200 to replace it with a new one or to refill it. The design can be customized to specific needs.

[0172] Please see Figure 12 , Figure 12 This is a structural cross-sectional view of the atomizer provided in the sixth embodiment of this application.

[0173] The atomizer 100 includes a housing 20 and an atomizing core 10.

[0174] The housing 20 has a liquid storage chamber 21 for storing the medium to be atomized. Depending on the field in which the atomizer 100 is used, the medium to be atomized can be a medicinal liquid, a nutrient solution, a beauty solution, or a combination of oily substances with a specific fragrance, etc., and is not limited here.

[0175] The atomizing core 10 is in fluid communication with the liquid storage chamber 21 and is used to heat and atomize the medium to be atomized conducted from the liquid storage chamber 21 for user use. The atomizing core 10 can be any of the atomizing cores provided in the above embodiments.

[0176] In this embodiment, the atomizer further includes an atomizing seat 30. Specifically, the housing 20 has a liquid storage chamber 21 and an air outlet channel 22. The liquid storage chamber 21 is used to store the liquid medium to be atomized, and the liquid storage chamber 21 is arranged around the air outlet channel 22. The end of the housing 20 also has a nozzle 23, which communicates with the air outlet channel 22; specifically, one end of the air outlet channel 22 can form the nozzle 23. The housing 20 has a receiving cavity A on the side of the liquid storage chamber 21 away from the nozzle 23, and the atomizing seat 30 is disposed in the receiving cavity A. The atomizing seat 30 includes an atomizing top seat 31 and an atomizing base 32. The atomizing top seat 31 and the atomizing base 32 cooperate to form a receiving cavity 33; that is, the atomizing seat 30 has a receiving cavity 33. The atomizing core 10 is disposed in the receiving cavity 33 and together with the atomizing seat 30 is disposed in the receiving cavity A.

[0177] The atomizing top seat 31 is provided with a liquid discharge channel 311. One end of the liquid discharge channel is connected to the liquid storage chamber 21, and the other end is connected to the receiving chamber 33. That is, the liquid discharge channel 311 connects the liquid storage chamber 21 and the receiving chamber 33, so that the medium to be atomized in the liquid storage chamber 21 can enter the atomizing core 10 through the liquid discharge channel 311. In other words, the atomizing core 10 is in fluid communication with the liquid storage chamber 21, and the atomizing core 10 is used to absorb and heat the medium to be atomized.

[0178] In this embodiment, the surface of the atomizing core 10 furthest from the liquid storage chamber 21 is the atomizing surface. An atomizing chamber B is formed between the atomizing surface of the atomizing core 10 and the inner wall of the receiving chamber 33, and the atomizing chamber B is connected to the air outlet channel 22. An air inlet 321 is provided on the atomizing base 32 to allow communication between the outside world and the atomizing chamber B. External gas enters the atomizing chamber B through the air inlet 321, carrying the atomized aerosol from the atomizing core 10 into the air outlet channel 22, and finally reaches the mouthpiece 23, where it is inhaled by the user.

[0179] The above are merely embodiments of this application and do not limit the scope of this patent application. Any equivalent structural or procedural changes made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the scope of patent protection of this application.

Claims

1. An atomizing core, characterized in that, include: The first liquid guiding layer has an absorbent surface and an outlet surface that are arranged opposite to each other. The first liquid guiding layer is formed by opening a plurality of through-holes in a dense liquid guiding matrix, which penetrate the absorbent surface and the outlet surface. The through-holes are used for conduction and buffering of the medium to be atomized. A second liquid guiding layer is disposed on the liquid outlet side of the first liquid guiding layer; at least a portion of the second liquid guiding layer is in contact with the liquid outlet surface, and the second liquid guiding layer has a plurality of disordered micropores; wherein, at least a portion of the through micropores of the first liquid guiding layer are in communication with the disordered micropores; A heating element is disposed between the second liquid guiding layer and the first liquid guiding layer, or the heating element is disposed on the surface of the second liquid guiding layer away from the first liquid guiding layer. The heating element is used to heat and atomize the medium to be atomized. The heating element is a metal mesh.

2. The atomizing core according to claim 1, characterized in that, The heating element is disposed between the second liquid guiding layer and the first liquid guiding layer, and the heating element includes a heating part and a pin part; The second liquid guiding layer covers the heating element and passes through the hollow portion of the heating element to contact the liquid outlet surface of the first liquid guiding layer; the pin portion exposes the second liquid guiding layer.

3. The atomizing core according to claim 2, characterized in that, The atomizing core also includes an adhesive layer, which is disposed between the heating element and the first liquid guiding layer, and is used to bond the heating element and the first liquid guiding layer.

4. The atomizing core according to claim 3, characterized in that, The adhesive layer paste is printed on one surface of the heating element, and the heating element is adhered to the liquid outlet surface of the first liquid guiding layer by the adhesive layer paste, and then sintered to form the adhesive layer located between the heating element and the first liquid guiding layer.

5. The atomizing core according to claim 1, characterized in that, The heating element is disposed on the surface of the second liquid guiding layer opposite to the first liquid guiding layer; the surface of the second liquid guiding layer opposite to the first liquid guiding layer has a receiving groove, and at least a portion of the heating element is received in the receiving groove.

6. The atomizing core according to claim 5, characterized in that, The heating element is completely housed within the receiving groove, and the surface of the heating element facing away from the first liquid guiding layer is flush with the opening of the receiving groove.

7. The atomizing core according to claim 5 or 6, characterized in that, The atomizing core also includes a third liquid guiding substrate, which is disposed on the surface of the heating element away from the first liquid guiding layer, and the third liquid guiding substrate has disordered micropores.

8. The atomizing core according to claim 7, characterized in that, The heating element includes a heating part and a pin part; The third liquid-conducting substrate covers the heating element and passes through the hollow portion of the heating element to contact the second liquid-conducting layer; the pin portion exposes the third liquid-conducting substrate.

9. The atomizing core according to claim 7, characterized in that, The thickness of the third liquid-conducting substrate is 10um-50um.

10. The atomizing core according to claim 1, characterized in that, The thickness of the heating element is 30um-200um; the thickness of the first liquid-conducting layer is 0.3mm-5mm; and the thickness of the second liquid-conducting layer is 50um-200um.

11. The atomizing core according to claim 1, characterized in that, The porosity of the first liquid-conducting layer is 20%-80%; the porosity of the second liquid-conducting layer is 40%-80%. The pore size of the disordered micropores is 10um-200um, and the pore size of the through micropores is 10um-200um.

12. The atomizing core according to claim 1, characterized in that, The second liquid guiding layer is sintered and formed on the liquid outlet side of the first liquid guiding layer.

13. An atomizer, characterized in that, include: The casing has a liquid storage cavity; The atomizing core is in fluid communication with the liquid storage chamber, wherein the atomizing core is the atomizing core according to any one of claims 1-12.

14. An electronic atomizing device, characterized in that, include: Atomizer, wherein the atomizer is the atomizer as described in claim 13; The main unit is used to power the atomizer and control its operation.

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