Wafer peeling apparatus and wafer peeling method

Abstract

The application provides a wafer stripping device and a wafer stripping method. The wafer stripping device comprises a detection mechanism, an adjusting mechanism, a wind knife structure and a control device. The detection mechanism comprises a first driving device, a first moving piece and a detection device. The first moving piece is connected to the first driving device and the detection device. The first driving device drives the first moving piece to move the detection device to detect the position of the wafer and output a detection signal. The adjusting mechanism comprises a second driving device and a second moving piece connected to the second driving device. The wind knife structure comprises a fixed plate and a wind knife. The fixed plate is provided with a groove. The wind knife is installed on the fixed plate through the groove. The top of the wind knife is connected to the second moving piece. The control device is electrically connected to the first driving device and the second driving device. The control device is configured to receive the detection signal output by the detection device, determine the inclination angle of the wafer according to the detection signal, and control the second driving device to drive the wind knife to adjust to a target angle according to the inclination angle of the wafer.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing, and more specifically to a wafer stripping apparatus and a wafer stripping method. Background Technology

[0002] In semiconductor manufacturing, wafers are typically cut from a single crystal ingot using a multi-wire dicing process. After dicing, they undergo processes such as debinding, cleaning, and drying before entering subsequent inspection and sorting processes. Wafer stripping is a crucial step in the cleaning process, separating the cleaned, adhered wafers one by one so that a robot can pick them up and transfer them to the next process. Wafer stripping primarily relies on air knives, which spray high-pressure airflow onto the top of the wafer, causing it to flip forward, detach from the adhesive, and adhere to a baffle for the robot to pick up.

[0003] Currently, after ingots are cut by an in-line dicing machine, they form multiple wafers of uniform thickness, with tiny gaps between each wafer. When these wafers enter the after-saw cleaning (ASC) machine and are cleaned with deionized water (DIW), adjacent wafers, due to increased surface hydrophilicity, tightly adhere and merge, forming multiple ingots of varying lengths. The gaps between each ingot become larger and different, resulting in varying tilt angles for each ingot. However, in related technologies, because the air knife has a fixed angle, it cannot dynamically adjust the angle according to the different tilt angles of the ingots. This causes some wafers to fail to tilt forward to the baffle during stripping, preventing the wafer pick-up robot from picking up the wafers, triggering equipment alarms, and consequently affecting the overall production line efficiency and reliability.

[0004] Therefore, improvements are needed to at least partially address the aforementioned problems. Summary of the Invention

[0005] The summary section introduces a series of simplified concepts, which will be further explained in detail in the detailed description section. This summary section is not intended to limit the key and essential technical features of the claimed technical solution, nor is it intended to determine the scope of protection of the claimed technical solution.

[0006] To address the existing problems, this application provides a wafer stripping apparatus, comprising: a detection mechanism, the detection mechanism including a first driving device, a first moving member, and a detection device, wherein the first moving member is connected to the first driving device and the detection device, wherein the first driving device drives the first moving member to move the detection device to detect the position of the wafer and output a detection signal; an adjustment mechanism, the adjustment mechanism including a second driving device and a second moving member connected to the second driving device; an air knife structure, the air knife structure including a fixed plate and an air knife, the fixed plate having a groove, the air knife being mounted on the fixed plate through the groove, wherein the top of the air knife is also connected to the second moving member; and a control device, the control device being electrically connected to the first driving device and the second driving device, the control device being configured to receive the detection signal output by the detection device, and determine the tilt angle of the wafer based on the detection signal, and control the second driving device to adjust the air knife to a target angle based on the tilt angle of the wafer.

[0007] For example, the first moving component includes a first coupling, a first lead screw, and a first slider. One end of the first coupling is connected to the first driving device, and the other end of the first coupling is connected to the first lead screw. The first slider is sleeved on the first lead screw, and the detection device is disposed on the first slider. The first driving device is configured to drive the first coupling and the first lead screw to move the detection device on the first slider along the axial direction of the crystal rod. The detection signal is used to characterize the tilt angle of the wafer, and a plurality of wafers constitute the crystal rod.

[0008] For example, the second moving component includes a second coupling, a second lead screw, a second slider, and a telescopic rod. One end of the second coupling is connected to the second driving device, and the other end of the second coupling is connected to the second lead screw. The second slider is sleeved on the second lead screw. One end of the telescopic rod is connected to the second slider, and the other end of the telescopic rod is connected to the top of the air knife. The control device is configured to control the second driving device to drive the telescopic rod to move so as to adjust the air knife to the target angle.

[0009] For example, the first driving device and the second driving device are servo motors, and the detection device is any one of photoelectric reflective displacement sensor, laser rangefinder sensor or industrial camera.

[0010] For example, the target angle ranges from 84 degrees to 90 degrees.

[0011] For example, the wafer stripping device further includes a baffle, which is disposed at the end of the spray direction of the air knife and is used to contact the wafer to be stripped.

[0012] For example, the wafer stripping device further includes a wafer picking device disposed near the baffle for adsorbing and picking up wafers attached to the baffle.

[0013] According to another aspect of this application, a wafer stripping method is provided. This wafer stripping method uses the aforementioned wafer stripping device to strip the wafer. The wafer stripping method includes: after the wafer is desorbed, activating a detection mechanism; a control device controlling a first driving device to drive a first moving member to move the detection device from a starting position at a preset speed, wherein the starting position is the position of a wafer in a vertical orientation; the detection device detecting the wafer's position information to obtain a detection signal; determining the wafer's tilt angle based on the detection signal; based on the tilt angle, the control device controlling a second driving device to drive a second moving member to move, causing an air knife to rotate around a groove, adjusting the air knife to a target angle; the air knife spraying directional airflow to push the wafer against a baffle; and a wafer picking device picking up the wafer against the baffle to complete the wafer stripping.

[0014] For example, when the wafer is detected, the movement time of the detection device relative to the detected wafer is obtained; the back tilt distance of the wafer is obtained based on the preset speed and the movement time, and the tilt angle of the wafer is determined based on the back tilt distance and the diameter of the wafer.

[0015] For example, it further includes: detecting whether the wafer picking device has successfully picked up the wafer by a sensing element disposed on the baffle; when the sensing element does not detect the wafer, the control device records an alarm code and suspends the execution of subsequent process flows related to the current wafer; when the sensing element detects the wafer, the wafer is successfully peeled off and the peeling of the next wafer continues.

[0016] The wafer stripping apparatus and method provided in this application, by setting up a detection mechanism including a first driving device, a first moving part, and a detection device, wherein the first driving device drives the first moving part to move the detection device to detect the wafer position and output a detection signal, and the control device determines the wafer tilt angle based on the detection signal, and controls the second moving part connected to the second driving device to adjust the air knife to the target angle, realizes real-time perception of wafer posture and dynamic adjustment of air knife spray angle, effectively solves the problem of wafer stripping failure caused by the fixed angle of the air knife in conventional devices, improves the wafer stripping success rate and reliability, reduces the occurrence of wafer pick-up device adsorption failure and machine alarm, and thus improves the overall production line efficiency and reliability. Attached Figure Description

[0017] The above and other objects, features, and advantages of this application will become more apparent from the more detailed description of the embodiments of this application in conjunction with the accompanying drawings. The drawings are provided to further illustrate the embodiments of this application and form part of the specification. They are used together with the embodiments of this application to explain this application and do not constitute a limitation thereof. In the drawings, the same reference numerals generally represent the same components or steps.

[0018] In the attached image:

[0019] Figure 1 A schematic diagram of the structure of a wafer lift-off apparatus according to an exemplary embodiment of this application is shown;

[0020] Figure 2 This invention provides a schematic diagram of the structure of an air knife according to an exemplary embodiment of the present application.

[0021] Figure 3 A schematic diagram of the structure of the baffle and the part-retrieving device according to an exemplary embodiment of this application is shown;

[0022] Figure 4 A flowchart illustrating a wafer stripping method according to an exemplary embodiment of this application is shown;

[0023] Figure 5 This illustration shows a schematic diagram of a detection apparatus for detecting a wafer according to an exemplary embodiment of this application. Detailed Implementation

[0024] In the following description, numerous specific details are set forth in order to provide a more thorough understanding of this application. However, it will be apparent to those skilled in the art that the invention may be practiced without one or more of these details. In other instances, certain technical features well-known in the art have not been described in order to avoid obscuring the invention.

[0025] It should be understood that this application can be implemented in various forms and should not be construed as limited to the embodiments set forth herein. Rather, providing these embodiments will make the disclosure thorough and complete, and will fully convey the scope of the invention to those skilled in the art. In the drawings, for clarity, the dimensions and relative dimensions of layers and regions may be exaggerated. The same reference numerals denote the same elements throughout.

[0026] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art. It will also be understood that terms as defined in commonly used dictionaries shall be construed as having a meaning consistent with their meaning in the relevant field and / or the context of this specification, and not as interpreted in an ideal or overly formal sense, unless expressly defined herein.

[0027] To fully understand this application, detailed steps and structures will be presented in the following description to illustrate the technical solutions proposed in this application. Preferred embodiments of this application are described in detail below; however, in addition to these detailed descriptions, this application may have other implementation methods.

[0028] Currently, after the crystal rods are cut by the in-line dicing machine, they are formed into multiple wafers of uniform thickness. A tiny gap is left between each wafer. When they enter the post-dicing cleaning machine, they are cleaned with deionized water (DIW). Due to the increased hydrophilicity of the surface, the adjacent parts of the wafers will tightly adhere and merge, forming multiple crystal rods of different lengths. The gaps between each crystal rod become larger and different. Because of the different gaps between each crystal rod, the overall tilt angle of each crystal rod will be different.

[0029] While air knives can be used to peel wafers from ingots, in related technologies, the fixed installation of air knives at a fixed angle prevents them from dynamically adjusting to the tilt angle of different ingots. This results in some wafers failing to tilt forward to the baffle during peeling, preventing the wafer pick-up robot from picking up the wafers and triggering machine alarms. Furthermore, the devices in these technologies lack online detection capabilities for wafer orientation and an automatic air knife angle adjustment device linked to the detection results. This prevents precise adjustment based on the actual tilt angle, leading to poor stability in the peeling process and impacting overall production line efficiency and reliability.

[0030] Therefore, in view of the aforementioned technical problems, this application proposes a wafer stripping device, which includes:

[0031] The testing mechanism includes a first driving device, a first moving part, and a testing device. The first moving part is connected to the first driving device and the testing device. The first driving device drives the first moving part to move the testing device to detect the position of the wafer and output a testing signal.

[0032] The adjustment mechanism includes a second drive device and a second moving part connected to the second drive device;

[0033] The air knife structure includes a fixed plate and an air knife. The fixed plate has a groove, and the air knife is installed on the fixed plate through the groove. The top of the air knife is also connected to a second moving part.

[0034] The control device is electrically connected to the first drive device and the second drive device. The control device is configured to receive the detection signal output by the detection device, determine the tilt angle of the wafer based on the detection signal, and control the second drive device to adjust the air knife to the target angle based on the tilt angle of the wafer.

[0035] The wafer stripping device provided in this application, by setting up a detection mechanism including a first driving device, a first moving part, and a detection device, allows the first driving device to drive the first moving part to move the detection device to detect the wafer position and output a detection signal. Combined with the control device, the wafer tilt angle is determined based on the detection signal, and the second moving part connected to the second driving device is controlled to adjust the air knife to the target angle. This realizes real-time perception of the wafer posture and dynamic adjustment of the air knife spray angle, effectively solving the problem of wafer stripping failure caused by the fixed angle of the air knife in conventional devices. It improves the wafer stripping success rate and reliability, reduces the occurrence of wafer pick-up device adsorption failure and machine alarms, and thus improves the overall production line efficiency and reliability.

[0036] Example 1

[0037] Below, for reference Figures 1 to 3 The wafer lift-off apparatus of this application is described in detail, such as... Figure 1 As shown, the wafer stripping device includes: a detection mechanism 10, which includes a first driving device 100, a first moving member 101, and a detection device 102. The first moving member 101 is connected to the first driving device 100 and the detection device 102. The first driving device 100 drives the first moving member 101 to move the detection device 102 to detect the position of the wafer and output a detection signal; an adjustment mechanism 11, which includes a second driving device 110 and a second moving member 111 connected to the second driving device 110; and an air knife structure 12, which includes a solid... The system includes a fixed plate 120 and an air knife 121. The fixed plate 120 has a groove 1201, and the air knife 121 is mounted on the fixed plate 120 through the groove 1201. The top of the air knife 121 is also connected to the second moving member 111. The system also includes a control device 13, which is electrically connected to the first driving device 100 and the second driving device 110. The control device 13 is configured to receive the detection signal output by the detection device 102, determine the tilt angle of the wafer based on the detection signal, and control the second driving device 110 to adjust the air knife 121 to the target angle based on the tilt angle of the wafer.

[0038] In this embodiment, the wafer stripping device includes a detection mechanism 10, an adjustment mechanism 11, an air knife structure 12, and a control device 13. The detection mechanism 10 consists of a first driving device 100, a first moving member 101, and a detection device 102. The first moving member 101 is connected to the first driving device 100 and the detection device 102. The first driving device 100 drives the first moving member 101 to move by outputting torque, thereby driving the detection device 102 to move synchronously, ensuring that the detection device 102 can detect wafers at different positions on the wafer ingot, avoiding missed detections due to insufficient detection range. The first driving device 100 is also electrically connected to the control device 13, and can start or stop moving according to the instructions of the control device 13, as well as adjust the moving direction and speed, etc. The adjustment mechanism 11 consists of a second drive device 110 and a second moving member 111. The second moving member 111 is connected to the second drive device 110, and the second drive device 110 is electrically connected to the control device 13. The second drive device 110 drives the second moving member 111 to move by outputting torque. The air knife 121 of the air knife structure 12 is connected to the second moving member 111. The air knife 121 is mounted on the fixed plate 120 through a groove 1201. The movement of the second moving member 111 can drive the air knife 121 to rotate in the groove 1201, thereby achieving angle adjustment. The control device 13 is electrically connected to the first drive device 100 and the second drive device 110. The control device 13 calculates the tilt angle of the wafer based on the detection signal output by the detection device 102 and records the movement time of the detection device 102, thereby determining the target angle that the air knife 121 needs to be adjusted, and then controls the adjustment mechanism 11 to drive the air knife 121 to complete the angle adjustment. This application can detect wafer orientation in real time and dynamically adjust the spray angle of the air knife, ensuring that the airflow from the air knife always acts vertically or nearly vertically on the wafer. This effectively avoids the problem of wafers failing to adhere to the baffle, leading to pick-up failure of the pick-up device. It improves the stability and success rate of single-wafer peeling, reduces the alarm frequency of the machine, and supports automated processing of different batches of crystal ingots without the need for manual adjustment of the air knife or mechanical parts. This enhances the flexibility and intelligence of the cleaning machine and is suitable for continuous operation of multiple types of crystal ingots. In addition, by adjusting the air knife angle to ensure that the wafers accurately adhere to the baffle, it reduces the possibility of wafer slippage or breakage caused by misalignment of the pick-up device, protecting wafer yield and improving the reliability of the production line.

[0039] It is worth mentioning that the target angle refers to the working angle that the air knife needs to achieve, calculated or mapped, in order for the air curtain or airflow generated by the air knife to effectively act on a wafer with an inclined angle (wafer surface or wafer top, etc.). Optionally, when the air knife is adjusted to the target angle, the direction of the airflow ejected by the air knife is roughly consistent with the tilt angle of the wafer, or, when the air knife is adjusted to the target angle, it can be ensured that the airflow ejected by the air knife acts on the top or local surface of the wafer.

[0040] In some embodiments, such as Figure 1 As shown, the wafer stripping device includes a detection mechanism 10, which comprises a first driving device 100, a first moving member 101, and a detection device 102. The first moving member 101 connects the first driving device 100 and the detection device 102. The first driving device 100 drives the first moving member 101 to move the detection device 102 to detect the wafer's position and output a detection signal. Exemplarily, the core function of the detection mechanism 10 is to use the detection device 102 to detect in real time the actual tilt state of the wafer after stripping, i.e., the tilt angle of the wafer plane relative to the vertical direction (i.e., the back tilt angle), providing key input data for the dynamic adjustment of the subsequent air knife angle. The first driving device 100 provides a power source for the detection mechanism 10, and the first moving member 101 connects the power output of the first driving device 100 to the detection device 102, achieving motion transmission and position linkage.

[0041] For example, the first driving device 100 can be a servo motor with a resolution ranging from 65536 pulses / rev to 262144 pulses / rev, adapting to different accuracy requirements, such as 131072 pulses / rev or 262144 pulses / rev, etc., without specific limitation. The servo driver can set the electronic gear ratio to 65536:500, 131072:1000, or 262144:2000, etc., without specific limitation. The purpose of selecting a high-resolution servo motor is to ensure high repeatability and smoothness of the detection action, avoiding detection errors caused by motor jitter or missed steps. In other examples, the servo motor can also be other models, and the parameter settings can also be other suitable parameters, without specific limitation. For example, the detection device 102 can be any one of a photoelectric reflective displacement sensor, a laser rangefinder sensor, or an industrial camera. When the detection device 102 moves along the axial direction of the crystal rod with the first moving member 101, it accurately locates the edge position of the wafer by means of light signal reflection, distance measurement or image recognition, and converts the detected wafer spatial position information into a time signal and other quantized detection signal and feeds it back to the control device 13, providing a basis for the control device 13 to calculate the tilt angle of the wafer.

[0042] In some embodiments, such as Figure 1As shown, the first moving part 101 includes a first coupling 1010, a first lead screw 1011, and a first slider 1012. One end of the first coupling 1010 is connected to the first driving device 100, and the other end of the first coupling 1010 is connected to the first lead screw 1011. The first slider 1012 is sleeved on the first lead screw 1011, and the detection device 102 is disposed on the first slider 1012. The first driving device 100 is configured to drive the first coupling 1010 and the first lead screw 1011 to move the detection device 102 on the first slider 1012 along the axial direction of the crystal rod to obtain a detection signal. The detection signal is used to characterize the tilt angle of the wafer. Multiple wafers constitute a crystal rod. Specifically, the output end of the first drive device 100 is rigidly connected to one end of the first coupling 1010, and the other end of the first coupling 1010 is coaxially fixed to the first lead screw 1011. The first slider 1012 can be sleeved on the first lead screw 1011 through an internal circulating ball nut. The detection device 102 is fixed on the mounting plane of the first slider 1012 by bolts or other means. When the first drive device 100 is started, its output torque is transmitted to the first lead screw 1011 through the first coupling 1010, driving the first lead screw 1011 to rotate and converting it into linear motion of the first slider 1012, thereby driving the detection device 102 to move along the axial direction of the crystal rod (consistent with the arrangement direction of the crystal rod composed of multiple wafers). During this process, the detection device 102 obtains relevant data, such as time data, by detecting changes in the edge position of the wafer. After processing by the control device 13, the tilt angle of the wafer is obtained, providing a basis for subsequent air knife angle adjustment.

[0043] In some embodiments, such as Figure 1As shown, the wafer stripping device includes an adjustment mechanism 11, which includes a second drive device 110 and a second moving member 111 connected to the second drive device 110. Exemplarily, the adjustment mechanism 11 serves as the execution unit for adjusting the air knife angle. Its core components include the second drive device 110 providing power and the second moving member 111 realizing the transmission of force and motion. The second drive device 110 can be a servo motor with a resolution ranging from 65536 pulses / rev to 262144 pulses / rev, adapting to different precision requirements, such as 131072 pulses / rev or 262144 pulses / rev, etc., without specific limitation. The servo driver can set the electronic gear ratio to 65536:500, 131072:1000, or 262144:2000, etc., without specific limitation. The second drive device 110 and the first drive device 100 can be the same servo motor or different servo motors, without specific limitation. Based on the detection signal output by the detection device 102, the wafer tilt angle is obtained after processing by the control device 13. The control device 13 then controls the second drive device 110 to drive the second moving part 111 to move, thereby driving the air knife to adjust the spray angle to adapt to the wafer stripping requirements of different tilt angles.

[0044] In some embodiments, such as Figure 2 As shown, the wafer stripping device includes an air knife structure 12, which includes a fixed plate 120 and an air knife 121. The fixed plate 120 has a groove 1201, and the air knife 121 is mounted on the fixed plate 120 through the groove 1201. The top of the air knife 121 is also connected to a second moving member 111. Specifically, the fixed plate 120 has a groove 1201, which can be an arc-shaped groove or other suitable structure, such as a U-shaped groove. The air knife 121 has an angle hole 1210 that matches the groove 1201. Fasteners pass through the angle hole 1210 and the groove 1201 to rotatably connect the air knife 121 to the fixed plate 120. When the air knife 121 rotates around its rotation center, the angle hole 1210 allows the air knife 121 to be adjusted within the angle range defined by the groove. The fixing plate 120 is also provided with fixing holes 1202, and the air knife 121 is provided with connecting holes 1211. The fixing holes 1202 and connecting holes 1211 are positioned correspondingly. The position of the air knife is fixed by fasteners passing through the connecting holes 1211 and fixing holes 1202. When the air knife 121 is angled, the air knife 121 is adjusted with the connecting holes 1211 as the rotation reference point to prevent displacement during airflow impact or vibration, effectively improving the repeatability accuracy and safety of the wafer stripping process.

[0045] In some embodiments, such as Figure 1As shown, the second moving part 111 includes a second coupling 1110, a second lead screw 1111, a second slider 1112, and a telescopic rod 1113. One end of the second coupling 1110 is connected to the second drive device 110, and the other end of the second coupling 1110 is connected to the second lead screw 1111. The second slider 1112 is sleeved on the second lead screw 1111. One end of the telescopic rod 1113 is connected to the second slider 1112, and the other end of the telescopic rod 1113 is connected to the top of the air knife 121. The control device 13 is configured to control the second drive device 110 to drive the telescopic rod 1113 to move so as to adjust the air knife 121 to the target angle. Specifically, the output end of the second drive device 110 is rigidly connected to one end of the second coupling 1110, and the other end of the second coupling 1110 is coaxially fixed to the second lead screw 1111. The second slider 1112 can be sleeved on the second lead screw 1111 through an internal circulating ball nut. One end of the telescopic rod 1113 is fixedly connected to the second slider 1112 and moves synchronously with the second slider 1112. The other end of the telescopic rod 1113 can be connected to the top of the air knife 121 through a hinge structure or threaded connection to form a force transmission path. When the control device 13 issues an adjustment command according to the tilt angle of the wafer, it controls the second drive device 110 to start, drives the second lead screw 1111 to rotate, drives the second slider 1112 to move along the lead screw axis, and then pushes or pulls the telescopic rod 1113 to make linear motion. Since the air knife 121 is rotatably mounted in the groove 1201 of the fixed plate 120, its top is driven by the linear force of the telescopic rod 1113, thereby rotating around the rotation center to adjust the air knife spray angle. For example, the telescopic rod 1113 is an adjustable-length mechanical push rod with a certain adjustment margin to adapt to the length change when adjusting the air knife angle.

[0046] For example, the first lead screw 1011 and the second lead screw 1111 can adopt an internal circulation ball return structure, with a lead of 1.5mm to 4.0mm, such as 1.5mm, 2mm, 2.5mm, 3mm, 3.5mm, or 4mm, etc., without specific limitation. The drive device, in conjunction with the lead screw, can achieve a slider movement accuracy of 0.05mm to 0.2mm, thereby achieving an air knife rotation angle adjustment accuracy of 0.1 degrees to 0.5 degrees, ensuring that the airflow direction of the air knife can adaptively match the actual wafer posture, achieving smooth and non-destructive peeling. The device has high precision, fast response speed, and simple control. By adopting a modular structure design of couplings, lead screws, sliders, and telescopic rods, and a standardized interface between the control device and the detection device, it is easy to integrate with existing cleaning and peeling equipment. It is suitable for equipment manufacturers to upgrade or retrofit or introduce new equipment, reducing system maintenance costs and improving the economy and engineering feasibility over the system's life cycle.

[0047] In some embodiments, such as Figure 1As shown, the wafer stripping device includes a control device 13, which is electrically connected to the first drive device 100 and the second drive device 110. The control device 13 is configured to receive the detection signal output by the detection device 102, determine the tilt angle of the wafer based on the detection signal, and control the second drive device 110 to drive the air knife 121 to adjust to the target angle based on the tilt angle of the wafer. Specifically, after the wafer is desorbed, the control device 13 starts the detection process, controlling the first drive device 100 to drive the first moving part 101 to move the detection device 102 from the starting position along the axial direction of the crystal rod at a preset speed. When the detection device 102 detects the edge of the wafer, its output signal changes abruptly. The control device 13 records the movement time at this time, calculates the back tilt distance of the wafer in combination with the preset speed, and then determines the tilt angle of the wafer based on the wafer diameter and geometric relationship. When the tilt angle of the wafer is obtained, the control device 13 determines the target angle that the air knife 121 needs to be adjusted, and generates a corresponding control command to send to the second drive device 110. The second drive device 110 responds to the control command and drives the air knife 121 to rotate around the groove 1201 on the fixed plate 120 through the second moving part 111, so that the spray angle of the air knife is adjusted to the target angle, thereby ensuring that the airflow of the air knife acts evenly on the wafer and achieves smooth peeling. For example, the target angle ranges from 84 degrees to 90 degrees, such as 85 degrees, 86 degrees, 87 degrees, 88 degrees, 89 degrees, or 90 degrees.

[0048] In some embodiments, such as Figure 3 As shown, the wafer stripping device also includes a baffle 14, which is positioned at the end of the spray direction of the air knife 121 to contact the wafer to be stripped. Specifically, the baffle 14 is located on the movement path of the wafer after it is pushed and is arranged opposite to the air knife 121. When the air knife 121 sprays directional airflow, the airflow pushes the desorbed wafer forward until its edge or surface contacts the baffle 14. The baffle 14 serves as a positioning reference surface, used to limit and receive the stripped wafer, preventing it from moving excessively or flipping under the action of airflow. The baffle 14 can be made of non-metallic wear-resistant materials, such as polytetrafluoroethylene (PTFE), polyetheretherketone (PEEK), or ceramic coatings. The surface of the baffle 14 is smooth and has a certain degree of elasticity, which can effectively buffer the impact force of the wafer, avoid surface scratches or edge damage, and reduce particle shedding, thus meeting the cleanliness requirements of semiconductor processes. For example, the baffle 14 also integrates multiple sensing elements 141, such as photoelectric sensors or pressure sensing units, to detect whether the wafer has been in place, thereby providing feedback signals to the control device 13 to realize status monitoring and anomaly judgment of the stripping process.

[0049] In some embodiments, such as Figure 3As shown, the wafer stripping device also includes a wafer picking device 15, which is located near the baffle 14 and is used to adsorb and remove the wafers attached to the baffle 14. Specifically, the wafer picking device 15 is located on the side of the baffle 14 away from the air knife 121. The baffle 14 has a wafer picking window, which is an opening structure that extends through the thickness direction of the baffle. The position of the wafer picking window matches the movement path of the wafer picking device 15. Its core function is that when the air jet from the air knife 121 pushes the wafer to the baffle 14, the wafer picking device 15 can extend through the wafer picking window to the side of the baffle 14 near the air knife 121 to adsorb and transfer the wafers attached to the baffle 14. Exemplarily, the wafer picking device 15 includes a robotic arm and an adsorption mechanism mounted thereon. The adsorption mechanism can be a vacuum chuck, an electrostatic chuck, or a magnetic adsorption component, etc., and is not specifically limited thereto.

[0050] The wafer stripping device of this application embodiment, by setting a detection mechanism including a first driving device, a first moving part, and a detection device, drives the first moving part to move the detection device to detect the wafer position and output a detection signal. Combined with the control device, the wafer tilt angle is determined according to the detection signal, and the second moving part connected to the second driving device is controlled to adjust the air knife to the target angle. This realizes real-time perception of the wafer posture and dynamic adjustment of the air knife spray angle, effectively solving the problem of wafer stripping failure caused by the fixed angle of the air knife in conventional devices, improving the wafer stripping success rate and reliability, reducing the occurrence of wafer pick-up device adsorption failure and machine alarm, and thus improving the overall production line efficiency and reliability.

[0051] Example 2

[0052] like Figure 4 As shown, this application provides a wafer stripping method. The wafer stripping method uses the wafer stripping apparatus of Embodiment 1 to perform wafer stripping. The wafer stripping method includes the following steps:

[0053] Step S1: After the wafer has been desorbed, start the detection mechanism;

[0054] Step S2: The control device controls the first driving device to drive the first moving part to move the detection device from the starting position at a preset speed, wherein the starting position is the position of a wafer when it is in a vertical posture.

[0055] Step S3: The detection device detects the position information of the wafer to obtain a detection signal;

[0056] Step S4: Determine the wafer tilt angle based on the detection signal;

[0057] Step S5: Based on the tilt angle, the control device controls the second drive device to drive the second moving part to move, so that the air knife rotates around the groove and adjusts the air knife to the target angle.

[0058] Step S6: The air knife sprays directional airflow to push the wafer against the baffle;

[0059] Step S7: The wafer picking device picks up the wafer that is attached to the baffle, completing the wafer stripping.

[0060] In some embodiments, such as Figures 1 to 3 As shown, after the wafer desorption is completed, the detection mechanism 10 is activated. Specifically, before the wafer desorption is completed, multiple crystal rods formed by the tight adhesion of wafers due to enhanced surface hydrophilicity are placed in the desorption tank. The tank is kept at a constant temperature of hot water, for example, the hot water temperature is 80 degrees to 90 degrees, to heat the resin board and the adhesive layer between it and the wafer. The hot water heats the outer periphery of the crystal rods by convection, which gradually softens the adhesive layer and reduces the adhesion force, creating conditions for subsequent smooth desorption. The heating time is set by the program, for example, 8 minutes to 12 minutes. The specific time can be adjusted adaptively according to different types of adhesives and wafer sizes. During this stage, the crystal rods are kept horizontal or slightly tilted and supported by brackets or guide rails in the tank, without significant displacement. Next, after the soaking time is reached, the adhesive layer loses its stickiness, and the wafer is freed from the resin plate and enters a free state. Under the influence of gravity, the bottom of the wafer acts as a support point and tilts backward as a whole, presenting an irregular angle arrangement. The tilt angle is determined by the intersegment gap of the crystal rod, the wafer thickness, liquid residue, and surface tension. The tilt angle varies from 87.3 degrees to 90 degrees. After the wafer completes desorption, the detection mechanism 10 is activated to enter the detection stage.

[0061] In some embodiments, such as Figure 5 As shown, after the wafer is desorbed, the control device 13 controls the first driving device 100 to drive the first moving member 101 to move the detection device 102 from the starting position at a preset speed. The starting position is the position when a wafer is in a vertical posture. Specifically, at this time, the control device 13 issues a command to activate the detection mechanism 10 to start working. The detection mechanism 10 includes the first driving device 100, the first moving member 101, and the detection device 102. The first driving device 100 responds to the control signal and drives the first moving member 101 to move the detection device 102 from the preset starting position along the axial direction of the crystal rod at a preset speed to perform a position scan on the desorbed wafer. A vertical wafer position is selected as the starting position of the detection device 102. The detection device 102 moves along the axial direction of the crystal rod at a preset speed, and the control device 13 starts timing. The preset speed is also set by the control device 13 and is not specifically limited.

[0062] In some embodiments, the detection device 102 detects the position information of the wafer to obtain a detection signal. For example, when a wafer is detected, the movement time of the detection device 102 relative to the detected wafer is obtained. Specifically, when the detection device 102 moves to the edge of the wafer, the received reflected signal undergoes a significant jump, at which point the timing of the control device 13 ends, thus obtaining the movement time of the detection device 102 when the wafer is detected.

[0063] In some embodiments, the wafer tilt angle is determined based on a detection signal. Exemplarily, the wafer backtilt distance is obtained based on a preset speed and movement time, and the wafer tilt angle is determined based on the backtilt distance and the wafer diameter. Specifically, the control device 13 calculates the wafer backtilt distance based on a preset movement speed and movement time of the detection device 102, and further obtains the wafer tilt angle using trigonometric relationships based on the backtilt distance and the wafer diameter.

[0064] In some embodiments, based on the tilt angle, the control device 13 controls the second drive device 110 to drive the second moving member 111 to move, so that the air knife 121 rotates around the groove 1201 and adjusts the air knife 121 to the target angle. Specifically, after calculating the tilt angle, the control device 13 controls the second drive device 110 to drive the second moving member 111 to move, so that the air knife 121 rotates around the groove 1201 to adjust the angle until the target angle is reached. The target angle is in the range of 84 degrees to 90 degrees, for example, 85 degrees, 86 degrees, 87 degrees, 88 degrees, 89 degrees, or 90 degrees. Then, the air knife 121 is activated and sprays out a directional airflow. The air pressure of the airflow can be 0.3MPa to 0.6MPa. The air knife 121 blows towards the top or slope of the wafer to be stripped, forming a thrust.

[0065] In some embodiments, the air knife 121 sprays a directional airflow to push the wafer against the baffle 14. Specifically, the directional airflow sprayed by the air knife 121 pushes the tilted wafer forward to flip or swing, causing the wafer edge to touch the baffle 14 in front, which is located at the end of the spray direction of the air knife 121. Exemplarily, the baffle 14 may be made of a non-metallic wear-resistant material, such as polytetrafluoroethylene (PTFE), polyetheretherketone (PEEK), or a ceramic coating, to cushion the wafer impact and assist in positioning.

[0066] In some embodiments, such as Figure 3As shown, the wafer pick-up device 15 picks up the wafer that is attached to the baffle 14, completing the wafer stripping. Exemplarily, the wafer pick-up device 15 includes a robotic arm and an adsorption mechanism mounted thereon. The adsorption mechanism can be a vacuum chuck, an electrostatic chuck, or a magnetic adsorption assembly, etc. The wafer pick-up device 15 may also be equipped with a vision or position correction system; there are no specific limitations on this. Specifically, the wafer pick-up device 15 advances to a preset adsorption position, and the adsorption mechanism aligns with the center area of ​​the wafer to complete the adsorption, ensuring uniform adsorption force and no damage to the edges. After adsorption, the robotic arm transports the wafer to the subsequent cleaning, drying, and inspection units according to path instructions.

[0067] For example, the baffle 14 also integrates multiple sensing elements 141, such as photoelectric sensors or pressure sensing units, to detect whether the wafer has been in place, thereby providing feedback signals to the control device 13 to realize status monitoring and anomaly judgment of the stripping process. Specifically, when the wafer picking device 15 picks up a wafer, the sensing element 141 set on the baffle 14 detects whether the wafer picking device 15 has successfully picked up the wafer. When the sensing element 141 does not detect the wafer, it means that the wafer picking device 15 has not picked up the wafer. At this time, the control device 13 records an alarm code and suspends the execution of subsequent processes related to the current wafer. When the sensing element 141 detects the wafer, the wafer is successfully peeled off and the wafer picking device 15 picks up the wafer. The transmission mechanism drives the entire crystal rod to move forward by one wafer distance through rollers or guide rails. The moving accuracy is adjusted by the first drive device 100. The detection device 102 determines whether the current position is aligned with the next wafer. At this time, the next wafer moves into the working area of ​​the air knife 121, ready for the peeling operation of the next wafer. The wafer peeling operation is repeated until all wafers in the current crystal rod are peeled off. If the peeling of the entire crystal rod is completed, the process switches to the next segment, or the workpiece is replaced after all crystal rods are finished.

[0068] In summary, the wafer stripping method of this application embodiment, by setting up a detection mechanism including a first driving device, a first moving part, and a detection device, allows the first driving device to drive the first moving part to move the detection device to detect the wafer position and output a detection signal. Combined with the control device determining the wafer tilt angle based on the detection signal, and controlling the second moving part connected to the second driving device to adjust the air knife to the target angle, it realizes real-time perception of the wafer posture and dynamic adjustment of the air knife spray angle. This effectively solves the problem of wafer stripping failure caused by the fixed angle of the air knife in conventional devices, improves the wafer stripping success rate and reliability, reduces the occurrence of wafer pick-up device adsorption failure and machine alarms, and thus improves the overall production line efficiency and reliability.

[0069] It is worth mentioning that the above steps are only examples, and the order of the steps can be adjusted without conflict.

[0070] Although exemplary embodiments have been described herein with reference to the accompanying drawings, it should be understood that the above exemplary embodiments are merely illustrative and are not intended to limit the scope of this application. Various changes and modifications can be made therein by those skilled in the art without departing from the scope and spirit of this application. All such changes and modifications are intended to be included within the scope of this application as claimed in the appended claims.

[0071] Numerous specific details are set forth in the specification provided herein. However, it will be understood that embodiments of this application may be practiced without these specific details. In some instances, well-known methods, structures, and techniques have not been shown in detail so as not to obscure the understanding of this specification.

[0072] Similarly, it should be understood that, in order to streamline this application and aid in understanding one or more of the various inventive aspects, features of this application may sometimes be grouped together in a single embodiment, figure, or description thereof in the description of exemplary embodiments of this application. However, this approach should not be construed as reflecting an intention that the claimed application requires more features than are expressly recited in each claim. Rather, as reflected in the corresponding claims, its inventive point lies in solving the corresponding technical problem with features fewer than all features of a single disclosed embodiment. Therefore, the claims following the detailed description are hereby expressly incorporated into that detailed description, wherein each claim itself is a separate embodiment of this application.

[0073] Those skilled in the art will understand that, apart from the mutual exclusion of features, all features disclosed in this specification (including the accompanying claims, abstract, and drawings) and all processes or elements of any method or apparatus so disclosed may be combined in any combination. Unless otherwise expressly stated, each feature disclosed in this specification (including the accompanying claims, abstract, and drawings) may be replaced by an alternative feature that serves the same, equivalent, or similar purpose.

[0074] Furthermore, those skilled in the art will understand that although some embodiments herein include certain features but not others included in other embodiments, combinations of features from different embodiments are intended to be within the scope of this application and form different embodiments. For example, in the claims, any one of the claimed embodiments can be used in any combination.

[0075] The above description is merely a specific embodiment or illustration of the embodiments of this application. The scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. The scope of protection of this application shall be determined by the scope of the claims.

Claims

1. A wafer stripping device, characterized in that, The wafer lift-off device includes: The testing mechanism includes a first driving device, a first moving component, and a testing device. The first moving component connects the first driving device and the testing device. The first driving device drives the first moving component to move the testing device to detect the position of the wafer and output a testing signal. The adjustment mechanism includes a second driving device and a second moving part connected to the second driving device; An air knife structure includes a fixed plate and an air knife. The fixed plate has a groove, and the air knife is mounted on the fixed plate through the groove. The top of the air knife is also connected to the second moving part. A control device is electrically connected to the first drive device and the second drive device. The control device is configured to receive a detection signal output by the detection device, determine the tilt angle of the wafer based on the detection signal, and control the second drive device to adjust the air knife to the target angle based on the tilt angle of the wafer.

2. The wafer stripping apparatus as described in claim 1, characterized in that, The first moving component includes a first coupling, a first lead screw, and a first slider. One end of the first coupling is connected to the first driving device, and the other end of the first coupling is connected to the first lead screw. The first slider is sleeved on the first lead screw, and the detection device is disposed on the first slider. The first driving device is configured to drive the first coupling and the first lead screw to move the detection device on the first slider along the axial direction of the crystal rod. The detection signal is used to characterize the tilt angle of the wafer, and multiple wafers constitute the crystal rod.

3. The wafer stripping apparatus as described in claim 2, characterized in that, The second moving component includes a second coupling, a second lead screw, a second slider, and a telescopic rod. One end of the second coupling is connected to the second driving device, and the other end of the second coupling is connected to the second lead screw. The second slider is sleeved on the second lead screw. One end of the telescopic rod is connected to the second slider, and the other end of the telescopic rod is connected to the top of the air knife. The control device is configured to control the second driving device to drive the telescopic rod to move so as to adjust the air knife to the target angle.

4. The wafer stripping apparatus as described in claim 1, characterized in that, The first driving device and the second driving device are servo motors, and the detection device is any one of photoelectric reflective displacement sensor, laser rangefinder sensor or industrial camera.

5. The wafer lift-off apparatus as described in claim 1, characterized in that, The target angle ranges from 84 degrees to 90 degrees.

6. The wafer stripping apparatus as described in claim 1, characterized in that, The wafer stripping device also includes a baffle, which is located at the end of the spray direction of the air knife and is used to contact the wafer to be stripped.

7. The wafer stripping apparatus as described in claim 6, characterized in that, The wafer stripping device also includes a wafer picking device, which is located near the baffle and is used to adsorb and pick up the wafers attached to the baffle.

8. A wafer lift-off method, characterized in that, The wafer stripping method employs the wafer stripping apparatus as described in claim 6 to perform wafer stripping, and the wafer stripping method includes: After the wafer desorption is completed, the testing mechanism is activated; The control device controls the first driving device to drive the first moving component to move the detection device from the starting position at a preset speed, wherein the starting position is the position of a wafer when it is in a vertical posture; The detection device detects the position information of the wafer to obtain a detection signal; The tilt angle of the wafer is determined based on the detection signal; Based on the tilt angle, the control device controls the second drive device to drive the second moving part to move, so that the air knife rotates around the groove and adjusts the air knife to the target angle; The air knife sprays directional airflow to push the wafer against the baffle; The wafer picking device picks up the wafer that is attached to the baffle and completes the wafer stripping.

9. The wafer lift-off method as described in claim 8, characterized in that, When the wafer is detected, the movement time of the detection device relative to the detected wafer is obtained; The backtilt distance of the wafer is obtained based on the preset speed and the movement time, and the tilt angle of the wafer is determined based on the backtilt distance and the diameter of the wafer.

10. The wafer lift-off method as described in claim 8, characterized in that, Also includes: The sensor installed on the baffle detects whether the wafer picking device has successfully picked up the wafer; When the sensing device fails to detect the wafer, the control device records an alarm code and suspends the execution of subsequent process flows related to the current wafer. When the sensing device detects the wafer, the wafer is successfully peeled off and the peeling of the next wafer continues.

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