Chip wafer testing machine probe card center support mechanism detection calibration method

Abstract

The application relates to the technical field of wafer testing, and particularly discloses a detection and calibration method for a center support mechanism of a probe card of a chip wafer testing machine, which is based on a detection mechanism, a center support mechanism and a calibration mechanism; the detection mechanism comprises a panel, the detection mechanism replaces the probe card with the panel when the center support mechanism is detected, a plurality of groups of displacement sensors are installed on the panel, the number of the displacement sensors is the same as that of the calibration mechanism, the displacement sensors are used for detecting the moving distances of various regions on the surface of a top plate when the top plate moves downward, and a processor is installed on the panel. Before wafer testing, the support strength and the support effect of the center support mechanism are detected by the detection mechanism, and the support surface of the center support mechanism is calibrated, so that the support strength and the size precision of the center support mechanism on the probe card can be effectively improved, and the testing stability and the testing precision of the probe card in the testing process are improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer testing, and in particular to a detection and calibration method for a center support mechanism of a wafer test machine probe card. BACKGROUND

[0002] With the rapid development of semiconductor technology, the capacity and integration of storage chips are continuously improved, and the precision and stability of the wafer testing link are put forward with more stringent requirements. The wafer test machine is the key equipment to ensure the performance and yield of the chip, which contacts the pads on the wafer through the probe card to complete the electrical test. Since the probe card required for storage chip testing is usually large in size, its connection and fixing mechanism of the test machine is mostly distributed at the edge of the card body. In the testing process, the central region of the probe card is prone to deformation or displacement due to the lack of effective constraints, and thus the contact between the probe and the wafer is poor, which seriously affects the accuracy and consistency of the test results.

[0003] To solve this problem, the industry usually designs an automatic ejection support mechanism in the test machine for the central region of the probe card. The mechanism presses the back of the probe card downward during testing to compensate for the deformation caused by the suspended center region, so that the probe card and the wafer remain parallel, thereby ensuring the uniformity and stability of the contact. The ejection force of the support mechanism and the flatness accuracy of its support surface directly determine the effectiveness of the support: insufficient ejection force will not completely correct the deformation, and excessive ejection force may introduce new stress or damage; and if the support surface has flatness deviation, it will cause uneven distribution of support force, which will also affect the overall flatness of the probe card.

[0004] However, the existing center support mechanism faces significant technical bottlenecks in actual application: first, the ejection force of the support mechanism lacks precise quantitative calibration means, and is mostly set by relying on the experience of engineers, and its rationality is difficult to scientifically evaluate and guarantee; second, there is no effective detection method for the flatness accuracy of the support surface, and it cannot be ensured that the support surface and the back of the probe card achieve full and uniform surface contact; third, due to the lack of special calibration and testing tools, the actual effect of the support state (such as contact fullness and force distribution) cannot be directly observed and quantitatively evaluated. This leads to potential risks in the flatness and long-term testing stability of the central wafer testing region of the probe card, which may further cause test deviation, yield misjudgment, and increased equipment maintenance costs.

[0005] Therefore, it is urgent to develop a special tool and method that can accurately calibrate and quantitatively test the ejection force and flatness of the center support mechanism, in order to fundamentally improve the precision and reliability of the wafer testing of storage chips. SUMMARY

[0006] The chip wafer testing machine probe card center support mechanism detection calibration method aims at the deficiencies of the prior art, and solves the technical problems that the center support mechanism ejection force and flatness cannot be quantitatively calibrated and detected, and the rationality of the contact state and force of the probe card is difficult to ensure.

[0007] The object of the present application can be achieved by the following technical solutions:

[0008] A chip wafer testing machine probe card center support mechanism detection calibration method, the calibration method is based on a detection mechanism, a center support mechanism and a calibration mechanism, the center support mechanism is installed in a connecting seat, the connecting seat is installed on the testing machine through a mounting frame, the center support mechanism includes a movable plate, the movable plate is movably sleeved in the connecting seat, a plurality of sets of support pieces are installed on the movable plate, the support pieces are used to confirm that the center support mechanism has been tightly pressed against the probe card, the bottom of the movable plate is connected to a top plate through a plurality of sets of calibration mechanisms, the calibration mechanisms are used to calibrate the flatness of the top plate, a through hole is formed in the bottom of the connecting seat, the top plate passes through the through hole, an outer cover is arranged on the top of the movable plate, a driving piece is arranged on the connecting seat, and the driving piece drives the outer cover to move up and down.

[0009] The detection mechanism includes a panel, the detection mechanism uses the panel to replace the probe card when detecting the center support mechanism, a plurality of sets of displacement sensors are installed on the panel, the number of displacement sensors is the same as that of the calibration mechanisms, the displacement sensors are used to detect the movement distance of each area on the surface of the top plate when the top plate moves downward, and a processor is installed on the panel.

[0010] As a preferred form of the above technical solution, the support piece includes a fixed cylinder, the fixed cylinder is fixed on the top of the movable plate, a sliding cylinder is movably installed in the fixed cylinder, a top rod is movably installed in the sliding cylinder, the top rod penetrates through the sliding cylinder, the movable plate and the top plate, an elastic piece one is connected between the top rod and the sliding cylinder, a fixed rod is arranged on the top of the sliding cylinder, the fixed rod penetrates through the fixed cylinder, an elastic piece two is connected between the sliding cylinder and the fixed cylinder, a baffle is arranged on the top of the fixed rod, a vertical plate is arranged on the top of the movable plate, a contact sensor is installed on the vertical plate, and the baffle and the contact sensor are used in cooperation.

[0011] As a preferred form of the above technical solution, a flange plate is arranged on the bottom of the panel, a pressure sensor is installed on the flange plate, a test flange is arranged on the pressure sensor, the test flange is located on the top of the panel, and the test flange is in direct contact with the top rod and the top plate.

[0012] As a preferred form of the above technical solution, the calibration mechanism includes:

[0013] an upper fixed block and a lower fixed block, the upper fixed block is fixed on the bottom of the movable plate, and the lower fixed block is fixed on the top of the top plate.

[0014] a telescopic piece installed between the upper fixing block and the lower fixing block;

[0015] a suction pipe connected with an external air supply unit, the suction pipe being connected with the telescopic piece through a connecting pipe, air being supplied to the telescopic piece through the suction pipe and the connecting pipe to extend the telescopic piece and align the top plate, and a flow valve being arranged on the suction pipe;

[0016] The driving piece, the contact sensor, the pressure sensor, the displacement sensor, the suction pipe and the flow valve are connected with the processor.

[0017] As a preferred embodiment of the above technical solution, the telescopic piece comprises a cylinder and a piston rod, the piston rod being sleeved in the cylinder, the cylinder being provided with an air inlet pipe and an air outlet pipe at the top and the bottom respectively, the air inlet pipe being connected with the connecting pipe, the cylinder being provided with an upper sliding block at the top, the upper sliding block being slidingly installed in the upper fixing block, the piston rod being provided with a lower sliding block at the bottom, the lower sliding block being slidingly installed in the lower fixing block, the upper sliding block and the lower sliding block being provided with clamping blocks respectively, corresponding clamping grooves being formed in the upper fixing block and the lower fixing block respectively, and the top end of the lower fixing block being inclined downward from the center of the top plate to the edge.

[0018] As a preferred embodiment of the above technical solution, the aligning mechanism further comprises a vertical plate, an elastic piece three and a push plate, the vertical plate being fixed at the bottom of the movable plate, the elastic piece three being fixed on the vertical plate, the other end of the elastic piece three being provided with the push plate, and the push plate being in elastic abutment with the surface of the cylinder.

[0019] As a preferred embodiment of the above technical solution, a support is arranged around the connecting seat, a plurality of mounting plates are slidingly arranged on the support, the detection mechanism and the probe card are mounted on the mounting plates, and the detection mechanism or the probe card is moved to the lower side of the connecting seat by sliding the mounting plates.

[0020] As a preferred embodiment of the above technical solution, the method comprises the following steps:

[0021] Step S1: preparation, first mounting the detection mechanism under the connecting seat;

[0022] Step S2: ejecting force detection, the movable plate drives a plurality of sets of supporting pieces to move downward by the driving piece, the supporting pieces contact and press the pressure sensor, a plurality of contact sensors are first sensed, and then the pressure sensor is pressed to a certain suitable force F when the movable plate and the top plate continue to move downward, at which time it is considered that the top plate supports the back of the probe card uniformly and sufficiently.

[0023] Step S3: top plate flatness detection, a plurality of sets of displacement sensors detect the displacement of each area at the bottom of the top plate in real time, the top plate is in an inclined state when a plurality of sets of displacement values are not equal, and vice versa.

[0024] Step S4: top plate flatness calibration, the displacement amount detected by the plurality of sets of displacement sensors is calculated by the processor to obtain a displacement amount deviation value, and the extension member is elongated when the corresponding area is controlled to exhaust, so that the top plate is gradually calibrated to a horizontal state.

[0025] The beneficial effects of the present application are:

[0026] 1、In the present application, before wafer testing, the support force and support effect of the center support mechanism are detected by the detection mechanism, and the support surface of the center support mechanism is calibrated, which can effectively improve the support force and size accuracy of the center support mechanism on the probe card, thereby improving the test stability and test accuracy of the probe card during testing.

[0027] 2、In the present application, when the calibration mechanism calibrates the top plate, the extension member is elongated, and the lower sliding block moves along the inclined lower fixed block, so that the extension member moves towards the edge of the top plate during elongation, thereby dispersing the internal stress caused by the elongation and extrusion of the top plate, effectively avoiding the distortion of the top plate, and ensuring that the bottom of the top plate is flush, which can ensure that the top plate supports the back of the probe card fully and uniformly, thereby further improving the test stability and test accuracy of the probe card during testing. BRIEF DESCRIPTION OF DRAWINGS

[0028] Figure 1 It is a schematic diagram of the overall structure of the present application;

[0029] Figure 2 It is another perspective structure schematic diagram of the present application;

[0030] Figure 3 It is a schematic diagram of the cross-sectional structure of the detection mechanism and the center support mechanism;

[0031] Figure 4 It is Figure 3 It is a schematic diagram of the enlarged structure at A in the present application;

[0032] Figure 5 It is a schematic diagram of the detection mechanism structure;

[0033] Figure 6 It is another perspective structure schematic diagram of the detection mechanism;

[0034] Figure 7 It is a schematic diagram of the cross-sectional structure of the detection mechanism;

[0035] Figure 8 It is a schematic diagram of the calibration mechanism structure;

[0036] Figure 9 It is a schematic diagram of the cross-sectional structure of the extension member.

[0037] In the figure:

[0038] 1. Mounting bracket; 2. Connecting seat; 21. Perforation; 3. Bracket; 4. Mounting plate; 5. Detection mechanism; 51. Panel; 52. Flange; 53. Pressure sensor; 54. Test flange; 55. Displacement sensor; 56. Processor; 6. Central support mechanism; 61. Movable plate; 62. Outer cover; 63. Drive component; 64. Support component; 641. Fixed cylinder; 642. Sliding cylinder; 643. Top rod; 644. Elastic element one; 645. Fixed rod; 646, elastic element two; 647, baffle; 648, upright plate; 649, contact sensor; 65, top plate; 7, calibration mechanism; 71, upper fixed block; 72, lower fixed block; 73, telescopic component; 731, cylinder; 7311, upper slider; 732, piston rod; 7321, lower slider; 74, locking block; 75, suction pipe; 751, flow valve; 76, connecting pipe; 77, vertical plate; 78, elastic element three; 79, push plate. Detailed Implementation

[0039] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0040] like Figures 1-7 As shown, a method for detecting and calibrating the central support mechanism of a probe card in a chip wafer testing machine is disclosed. The calibration method is based on a detection mechanism 5, a central support mechanism 6, and a calibration mechanism 7. The central support mechanism 6 is installed in a connecting seat 2, which is mounted on the testing machine via a mounting bracket 1. The central support mechanism 6 includes a movable plate 61, which is movably fitted inside the connecting seat 2. Several sets of support members 64 are installed on the movable plate 61. The support members 64 are used to confirm that the central support mechanism 6 has tightened the probe card. The bottom of the movable plate 61 is connected to a top plate 65 via several sets of calibration mechanisms 7. The calibration mechanisms 7 are used to calibrate the flatness of the top plate 65. A through hole 21 is provided at the bottom of the connecting seat 2, through which the top plate 65 passes. An outer cover 62 is provided at the top of the movable plate 61. A driving member 63 is provided on the connecting seat 2, which drives the outer cover 62 to move up and down.

[0041] The testing mechanism 5 includes a panel 51. When the testing mechanism 5 is supported by the testing center support mechanism 6, the panel 51 replaces the probe card. Several sets of displacement sensors 55 are installed on the panel 51. The number of displacement sensors 55 is the same as the number of calibration mechanisms 7. The displacement sensors 55 are used to detect the movement distance of each area on the surface of the top plate 65 when the top plate 65 moves down. A processor 56 is installed on the panel 51.

[0042] The support 64 comprises a fixing cylinder 641 fixed on the top of the movable plate 61, a sliding cylinder 642 movably arranged in the fixing cylinder 641, a top rod 643 movably arranged in the sliding cylinder 642, the top rod 643 penetrating through the sliding cylinder 642, the movable plate 61 and the top plate 65, an elastic member one 644 connected between the top rod 643 and the sliding cylinder 642, a fixing rod 645 arranged on the top of the sliding cylinder 642 and penetrating through the fixing cylinder 641, an elastic member two 646 connected between the sliding cylinder 642 and the fixing cylinder 641, a baffle 647 arranged on the top of the fixing rod 645, a vertical plate 648 arranged on the top of the movable plate 61, a contact sensor 649 arranged on the vertical plate 648, and the baffle 647 used in cooperation with the contact sensor 649.

[0043] The flange plate 52 is arranged on the bottom of the panel 51, the pressure sensor 53 is arranged on the flange plate 52, the test flange 54 is arranged on the pressure sensor 53, the test flange 54 is located on the top of the panel 51, and the test flange 54 is in direct contact with the top rod 643 and the top plate 65.

[0044] In one case of the embodiment, the elastic member one 644 and the elastic member two 646 can both be springs, and the elastic coefficient of the elastic member one 644 is greater than that of the elastic member two 646.

[0045] In actual application, the ejection force of the center support mechanism 6 is detected by the detection mechanism 5 first, so as to ensure that the ejection force of the center support mechanism 6 is fully uniform; the flatness of the top plate 65 is detected after the ejection force is qualified, and the flatness of the top plate 65 is calibrated by the calibration mechanism 7 when the top plate 65 is found to be inclined, so as to ensure that the top plate 65 remains in a horizontal state, i.e., the top plate 65 can completely abut against the back of the probe card after the probe card is installed.

[0046] The detection mechanism 5 is installed below the connecting seat 2, and then the movable plate 61 is driven downward by the driving member 63 to drive the outer cover 62, at this time, the jacking rods 643 gradually contact the test flange 54, at this time, the jacking rods 643 and the sliding cylinder 642 are extruded and slowly move upward, so that the fixed rods 645 move upward with the blocking pieces 647, when the blocking pieces 647 contact the corresponding contact sensors 649, the contact sensors 649 are all sensed, at this time, the displacement of the center supporting mechanism 6 is s (the displacement s corresponding to the probe card of different specifications is different), at this time, it can be considered that the probe card is tightly pressed by the jacking rods 643, but due to various errors, at this time, it does not mean that the probe card is fully supported by the jacking rods 643, on the basis of the above, the center supporting mechanism 6 continues to be extruded by a displacement δ, until the pressure sensor 53 is extruded by a certain suitable force F, at this time, it is considered that the probe card is fully supported by the jacking rods 643, at this time, the jacking rods 643 are partially retracted into the sliding cylinder 642, that is, the bottom end of the jacking rods 643 is flush with the bottom surface of the top plate 65, at this time, the top plate 65 contacts the test flange 54, that is, the probe card is fully contacted with the top plate 65, so as to achieve the effect of fully and uniformly supporting;

[0047] The flatness detection and calibration of the top plate 65, in the process of the downward movement of the top plate 65, the test flange 54 and the pressure sensor 53 are extruded, and the displacement sensors 55 detect the displacement of each area of the bottom surface of the top plate 65 in real time, when the pressure sensor 53 is extruded by a certain suitable force F, at this time, it is considered that the probe card is fully supported, but the top plate 65 may be inclined, through the deviation of the detected displacement, whether the top plate 65 is inclined can be detected, when the top plate 65 is inclined, the flatness of the top plate 65 is calibrated by the calibration mechanism 7, so that the top plate 65 remains in a horizontal state;

[0048] Before the wafer test, the center supporting mechanism 6 is detected and calibrated by the test mechanism 5, so that the supporting force and size accuracy of the center supporting mechanism 6 on the probe card are effectively improved, so as to improve the test stability and test accuracy of the probe card in the test process.

[0049] As shown in Figure 8 and Figure 9 The calibration mechanism 7 comprises:

[0050] The upper fixed block 71 is fixed at the bottom of the movable plate 61, and the lower fixed block 72 is fixed at the top of the top plate 65;

[0051] The telescopic member 73 is installed between the upper fixed block 71 and the lower fixed block 72;

[0052] The suction pipe 75 is connected with the external air supply unit, and is connected with the telescopic member 73 through the connecting pipe 76. The telescopic member 73 is elongated to calibrate the top plate 65 by supplying air into the telescopic member 73 through the suction pipe 75 and the connecting pipe 76. The suction pipe 75 is provided with a flow valve 751.

[0053] The driving member 63, the contact sensor 649, the pressure sensor 53, the displacement sensor 55, the suction pipe 75 and the flow valve 751 are connected with the processor 56.

[0054] In actual application, when the displacement values detected by the displacement sensors 55 have a deviation, the suction pipe 75 corresponding to the small displacement region is controlled to suck air, so that the compressed air enters the telescopic member 73 through the connecting pipe 76, thereby elongating the telescopic member 73, and gradually calibrating the inclined top plate 65 to the horizontal state.

[0055] When starting to detect, the driving member 63 is elongated by the processor 56, so that the movable plate 61 moves downward. When all the contact sensors 649 are sensed, the center support mechanism 6 is lifted by the displacement s. At this time, the driving member 63 is controlled by the processor 56 to lift the center support mechanism 6 by the displacement δ. When the pressure sensor 53 detects that the pressure is F, the driving member 63 stops working. At this time, the displacement sensor 55 detects the displacement of each region of the bottom surface of the top plate 65, and transmits the data to the processor 56. The processor 56 calculates the displacement deviation value. If the displacement deviation value is 0, it indicates that the top plate 65 is in the horizontal state. If the displacement deviation value is not 0, it indicates that the top plate 65 is in the inclined state. At this time, the processor 56 controls the suction pipe 75 corresponding to the small displacement region to suck air, so that the telescopic member 73 at this position is elongated, and the top plate 65 is gradually calibrated to the horizontal state.

[0056] Further, the telescopic member 73 comprises a cylinder body 731 and a piston rod 732. The piston rod 732 is sleeved in the cylinder body 731. The cylinder body 731 is provided with an air inlet pipe and an air outlet pipe at the top and bottom respectively. The air inlet pipe is connected with the connecting pipe 76. The cylinder body 731 is provided with an upper sliding block 7311 at the top. The upper sliding block 7311 is slidingly installed in the upper fixed block 71. The piston rod 732 is provided with a lower sliding block 7321 at the bottom. The lower sliding block 7321 is slidingly installed in the lower fixed block 72. The upper sliding block 7311 and the lower sliding block 7321 are both provided with a clamping block 74. The upper fixed block 71 and the lower fixed block 72 are both provided with a corresponding clamping groove. The top end of the lower fixed block 72 is inclined downward from the center position of the top plate 65 to the edge position.

[0057] It should be noted that if the top plate 65 is in an inclined state, the lowest point of the top plate 65 is in full contact with the test flange 54, and the pressure sensor 53 detects the pressure F, at this time, the area above the lowest point of the top plate 65 needs to be adjusted downward, so that the area above the lowest point remains horizontal with the lowest point, so the lowest point of the top plate 65 remains unchanged during calibration; if the top end and the bottom end of the telescopic part 73 are in a fixed state, part of the telescopic part 73 remains unchanged, and the other part of the telescopic part 73 is elongated, which will cause internal stress of the top plate 65, and the top plate 65 may be twisted, which may on the one hand cause the bottom surface of the top plate 65 to be uneven, and on the other hand easily cause the top plate 65 to be damaged under the action of internal stress for a long time.

[0058] In actual application of the embodiment, the displacement sensors 55 detect the displacement amounts of the areas on the bottom surface of the top plate 65, the processor 65 takes the maximum displacement amount as the basis, calculates the deviation values of the other displacement amounts compared with the maximum displacement amount, and then controls the suction pipes 75 corresponding to the areas to suck air, so that the air inlet amount is controlled by the flow valves 751, the air inlet amount is divided by the cross section in the cylinder body 731 to equal the deviation value, so that the length of the telescopic part 73 extending out is equal to the deviation value, thereby compensating for the inclination angle of the top plate 65, and gradually calibrating the top plate 65 to a horizontal state.

[0059] In the process of elongation of the telescopic part 73, the lower sliding block 7321 on the piston rod 732 moves along the inclined lower fixed block 72, so that the telescopic part 73 moves towards the edge of the top plate 65 during elongation, thereby dispersing the internal stress caused by elongation and extrusion of the top plate 65, effectively avoiding the top plate 65 from being twisted, and ensuring that the bottom of the top plate 65 is flush, so that the support of the top plate 65 on the back of the probe card is fully uniform, thereby further improving the test stability and test precision of the probe card during testing.

[0060] Further, the calibration mechanism 7 further comprises a vertical plate 77, an elastic part three 78 and a push plate 79, the vertical plate 77 is fixed on the bottom of the movable plate 61, the elastic part three 78 is fixed on the vertical plate 77, the other end of the elastic part three 78 is provided with the push plate 79, and the push plate 79 is in elastic abutment with the surface of the cylinder body 731.

[0061] In actual application of the embodiment, the push plate 79 always has a tendency to push the telescopic part 73 through the elastic force of the elastic part three 78, when the telescopic part 73 is elongated, the push plate 79 will push the telescopic part 73 to move, so that the telescopic part 73 moves more smoothly towards the edge of the top plate 65 during elongation, effectively avoiding the telescopic part 73 from being stuck during elongation, and ensuring that the top plate 65 can be calibrated smoothly, thereby further improving the test stability and test precision of the probe card during testing.

[0062] As Figure 1 and Figure 2As shown, the connecting seat 2 is provided with a support 3, and a plurality of mounting plates 4 are slidably arranged on the support 3, and the detection mechanism 5 and the probe card are mounted on the mounting plates 4, and the detection mechanism 5 or the probe card is moved to the lower side of the connecting seat 2 by sliding the mounting plate 4.

[0063] In actual application, the detection mechanism 5 and the probe card are mounted on the mounting plate 4, when the center support mechanism 6 needs to be detected and calibrated, the detection mechanism 5 is moved to the lower side of the center support mechanism 6 by moving the mounting plate 4, when the wafer is tested, the detection mechanism 5 is moved away, and then the probe card is moved to the lower side of the center support mechanism 6, so that the detection mechanism and the probe card do not need to be frequently disassembled during detection and calibration and testing, and the efficiency of the whole testing process is improved.

[0064] A center support mechanism detection and calibration method of a chip wafer testing machine probe card, the method comprises the following steps:

[0065] Step S1: preparation, first mounting the detection mechanism 5 under the connecting seat 2;

[0066] Step S2: ejection force detection, the movable plate 61 drives a plurality of groups of support members 64 to move downward by the driving member 63, the support members 64 are in contact with and press the pressure sensor 53, a plurality of contact sensors 649 are all sensed, and then the pressure sensor 53 is pressed to a certain suitable force F by the continuous downward movement of the support members 64 and the top plate 65, at this time, it is considered that the top plate 65 supports the back of the probe card uniformly and sufficiently;

[0067] Step S3: flatness detection of the top plate 65, a plurality of groups of displacement sensors 55 detect the displacement of each area of the bottom of the top plate 65 in real time, when a plurality of groups of displacement values are not equal, the top plate 65 at this time is in an inclined state, otherwise it is in a horizontal state;

[0068] Step S4: flatness calibration of the top plate 65, the displacement deviation value calculated by the processor 56 from the displacement detected by the plurality of groups of displacement sensors 55, and the stretching member 73 is elongated by controlling the air suction pipe 75 to suck air in the corresponding area, so that the top plate 65 is gradually calibrated to a horizontal state.

[0069] The basic principles, main features and advantages of the present application are shown and described above. Those skilled in the art should understand that the present application is not limited to the above embodiments, and the above embodiments and descriptions in the specification are only to illustrate the principles of the present application, and various changes and improvements can be made without departing from the spirit and scope of the present application, and these changes and improvements all fall within the scope of the present application.

Claims

1. A method for detecting and calibrating the center support mechanism of a probe card in a chip wafer testing machine, characterized in that, The calibration method is based on a detection mechanism (5), a central support mechanism (6), and a calibration mechanism (7). The central support mechanism (6) is installed in a connecting seat (2), which is mounted on a testing machine via a mounting bracket (1). The central support mechanism (6) includes a movable plate (61), which is movably fitted inside the connecting seat (2). Several sets of support members (64) are installed on the movable plate (61). The support members (64) are used to confirm that the central support mechanism (6) has tightened the probe card. The bottom of the movable plate (61) is connected to the top plate (65) via several sets of calibration mechanisms (7). The calibration mechanisms (7) are used to calibrate the flatness of the top plate (65). A perforation (21) is provided at the bottom of the connecting seat (2), through which the top plate (65) passes. An outer cover (62) is provided on the top of the movable plate (61). A driving member (63) is provided on the connecting seat (2), which drives the outer cover (62) to move up and down. The detection mechanism (5) includes a panel (51). The detection mechanism (5) uses the panel (51) instead of the probe card when it is in the detection center support mechanism (6). Several sets of displacement sensors (55) are installed on the panel (51). The number of displacement sensors (55) is the same as the number of calibration mechanisms (7). The displacement sensors (55) are used to detect the movement distance of each area on the surface of the top plate (65) when the top plate (65) moves down. A processor (56) is installed on the panel (51).

2. The detection and calibration method for the central support mechanism of the probe card of a chip wafer tester according to claim 1, characterized in that, The support member (64) includes a fixed cylinder (641), which is fixed to the top of the movable plate (61). A sliding cylinder (642) is movably installed inside the fixed cylinder (641). A top rod (643) is movably installed inside the sliding cylinder (642). The top rod (643) passes through the sliding cylinder (642), the movable plate (61), and the top plate (65). An elastic element (644) connects the top rod (643) and the sliding cylinder (642). 42) A fixed rod (645) is provided at the top, the fixed rod (645) passes through the fixed cylinder (641), and an elastic element (646) is connected between the sliding cylinder (642) and the fixed cylinder (641). A baffle (647) is provided at the top of the fixed rod (645), and a vertical plate (648) is provided at the top of the movable plate (61). A contact sensor (649) is installed on the vertical plate (648), and the baffle (647) and the contact sensor (649) are used in conjunction.

3. The detection and calibration method for the central support mechanism of the probe card of a chip wafer tester according to claim 2, characterized in that, The bottom of the panel (51) is provided with a flange (52), a pressure sensor (53) is installed on the flange (52), a test flange (54) is provided on the pressure sensor (53), the test flange (54) is located at the top of the panel (51), and the test flange (54) is in direct contact with the top rod (643) and the top plate (65).

4. The detection and calibration method for the central support mechanism of the probe card of a chip wafer tester according to claim 3, characterized in that, The calibration facility (7) includes: Upper fixing block (71) and lower fixing block (72), wherein the upper fixing block (71) is fixed to the bottom of the movable plate (61) and the lower fixing block (72) is fixed to the top of the top plate (65); Telescopic component (73), which is installed between the upper fixed block (71) and the lower fixed block (72); An air extraction pipe (75) is connected to an external air supply unit. The air extraction pipe (75) is connected to a telescopic member (73) via a connecting pipe (76). Air is supplied to the telescopic member (73) through the air extraction pipe (75) and the connecting pipe (76) to extend the top plate (65) of the telescopic member (73). A flow valve (751) is provided on the air extraction pipe (75). The drive unit (63), contact sensor (649), pressure sensor (53), displacement sensor (55), air extraction pipe (75) and flow valve (751) are all connected to the processor (56).

5. The detection and calibration method for the central support mechanism of the probe card of a chip wafer tester according to claim 4, characterized in that, The telescopic component (73) includes a cylinder (731) and a piston rod (732). The piston rod (732) is fitted inside the cylinder (731). The cylinder (731) is provided with an air inlet pipe and an air outlet pipe at the top and bottom, respectively. The air inlet pipe is connected to the connecting pipe (76). The top of the cylinder (731) is provided with an upper slider (7311). The upper slider (7311) is slidably installed in the upper fixed block (71). The bottom of the piston rod (732) is provided with a lower slider (7321). The lower slider (7321) is slidably installed in the lower fixed block (72). Both the upper slider (7311) and the lower slider (7321) are provided with a locking block (74). Both the upper fixed block (71) and the lower fixed block (72) are provided with corresponding locking grooves. The top of the lower fixed block (72) is inclined, and it slopes downward from the center of the top plate (65) towards the edge.

6. The detection and calibration method for the central support mechanism of the probe card of a chip wafer tester according to claim 5, characterized in that, The calibration mechanism (7) also includes a vertical plate (77), an elastic element three (78) and a push plate (79). The vertical plate (77) is fixed to the bottom of the movable plate (61), the elastic element three (78) is fixed on the vertical plate (77), and the other end of the elastic element three (78) is provided with a push plate (79). The push plate (79) elastically abuts against the surface of the cylinder (731).

7. The detection and calibration method for the central support mechanism of the probe card of a chip wafer tester according to claim 1, characterized in that, The connecting seat (2) is provided with a bracket (3) on its periphery. Several mounting plates (4) are slidably arranged on the bracket (3). The detection mechanism (5) and the probe card are both installed on the mounting plate (4). The detection mechanism (5) or the probe card can be moved to the bottom of the connecting seat (2) by sliding the mounting plate (4).

8. The detection and calibration method for the central support mechanism of the probe card of a chip wafer testing machine according to any one of claims 1-7, characterized in that, The method includes the following steps: Step S1: Preparation work, first install the detection mechanism (5) below the connecting seat (2); Step S2: Push-out force detection. The driving component (63) causes the movable plate (61) to move several sets of support components (64) downward. The support components (64) contact and squeeze the pressure sensor (53), first making all the contact sensors (649) sense. Then, the support components (64) and the top plate (65) continue to move downward, so that the pressure sensor (53) reaches a certain appropriate force F. At this time, it is considered that the top plate (65) provides uniform and sufficient support to the back of the probe card. Step S3: Flatness detection of top plate (65). Several sets of displacement sensors (55) detect the displacement of each area at the bottom of the top plate (65) in real time. When the displacement values ​​of several sets are not equal, the top plate (65) is tilted at this time, and otherwise it is horizontal. Step S4: Flatness calibration of the top plate (65). The displacement detected by several sets of displacement sensors (55) is calculated by the processor (56) to obtain the displacement deviation value. When the air extraction pipe (75) in the corresponding area is evacuated, the telescopic component (73) is extended to make the top plate (65) gradually calibrated to a horizontal state.

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