Backlight module and display terminal

By introducing heat-conducting components and heat transfer parts with higher thermal conductivity than the backplate into the backlight module, the problem of high heat generation of the light strip is solved, achieving better heat dissipation and improved brightness.

CN120928610APending Publication Date: 2025-11-11TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202511267656.4
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-09-04
Publication Date
2025-11-11

AI Technical Summary

Technical Problem

Traditional backlight modules cannot meet the high heat generation requirements caused by the increased current of the LED strips, resulting in poor heat dissipation.

Method used

A heat-conducting component with a higher thermal conductivity than the back plate is installed between the light strip and the side plate, and the heat is conducted to the bottom plate through the heat transfer part to enhance the heat dissipation effect.

Benefits of technology

The heat dissipation performance of the backlight module has been improved to meet the requirements of high brightness, while maintaining the module's thinness and cost-effectiveness.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN120928610A_ABST
    Figure CN120928610A_ABST
Patent Text Reader

Abstract

The invention relates to a backlight module and a display terminal. The backlight module comprises a back plate, a light bar, a heat conduction piece and a heat transfer part, the back plate comprises a bottom plate and side plates arranged on the periphery of the bottom plate, and the bottom plate and the side plates form a containing cavity; the light bar is arranged on the side, close to the bottom plate, of the side plate. The heat conduction piece is arranged between the side plate and the light bar; the heat transfer part is connected with the heat conduction piece and the bottom plate, and the heat conductivity of the heat conduction piece is larger than that of the back plate. According to the backlight module, the heat conduction piece is arranged between the light bar and the side plate, the heat conductivity of the heat conduction piece is larger than that of the back plate, and the heat conduction piece can conduct heat of the light bar to the side plate; meanwhile, the heat conduction piece is connected with the bottom plate through the heat transfer part, the heat transfer part can further conduct heat of the lamp strip to the bottom plate, and the heat dissipation effect is improved.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a backlight module and display terminal. Background Technology

[0002] The consumer market is demanding increasingly higher brightness from LCD displays. To provide this higher brightness, the current of the LED strips in edge-lit backlight modules is also increasing. This increased current leads to increased heat generation from the LED strips, placing greater demands on the heat dissipation of the backlight module. Traditional backlight modules can no longer meet these requirements. Summary of the Invention

[0003] This application provides a backlight module and a display terminal, which improves the technical problem that traditional backlight modules can no longer meet heat dissipation requirements.

[0004] To achieve the above objectives, according to a first aspect of this application, a backlight module is provided, comprising:

[0005] The back plate includes a bottom plate and side plates disposed around the periphery of the bottom plate, the bottom plate and the side plates forming a receiving cavity;

[0006] A light strip is installed on the side of the side panel near the bottom plate;

[0007] A heat-conducting component is disposed between the side plate and the light strip;

[0008] A heat transfer section connects the heat-conducting element to the base plate, wherein the thermal conductivity of the heat-conducting element is greater than that of the back plate.

[0009] Optionally, the edge of the base plate has a groove, the heat-conducting component includes a first sub-part and a second sub-part connected together, the first sub-part being disposed between the side plate and the light strip, the second sub-part being located in the groove, the backlight module further includes a fastener, and the second sub-part is connected to the base plate in the groove by the fastener.

[0010] Optionally, the heat transfer part is a double-sided adhesive disposed between the second sub-part and the bottom wall of the groove, and the double-sided adhesive is bonded to the second sub-part and the bottom wall of the groove.

[0011] Optionally, the thickness of the double-sided adhesive is less than or equal to 0.05 mm.

[0012] Optionally, the heat transfer part is a double-sided adhesive and a metal sheet. The double-sided adhesive is disposed between the second sub-part and the bottom wall of the groove. The double-sided adhesive is bonded to the second sub-part and the bottom wall of the groove. One end of the metal sheet overlaps the second sub-part and the opposite end overlaps the bottom plate outside the groove.

[0013] Optionally, the side surface of the second sub-part away from the bottom wall of the groove is flush with the surface of the bottom plate outside the groove.

[0014] Optionally, in the thickness direction of the first sub-part, the length of the second sub-part is less than the length of the metal sheet.

[0015] Optionally, in the thickness direction of the first sub-part, the length of the metal sheet is less than the length of the base plate outside the groove.

[0016] Optionally, the metal sheet is made of copper or aluminum.

[0017] According to a second aspect of this application, a display terminal is provided, including the backlight module described above.

[0018] In the backlight module of this application embodiment, a heat-conducting component is provided between the lamp strip and the side plate. The heat conductivity of the heat-conducting component is greater than that of the back plate. The heat-conducting component can conduct the heat of the lamp strip to the side plate. At the same time, the heat-conducting component is connected to the base plate through a heat transfer part, which can further conduct the heat of the lamp strip to the base plate, thereby improving the heat dissipation effect.

[0019] Other features and advantages of this application will be described in detail in the following detailed description section. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0022] Figure 1 This is a top view of a backlight module provided in an exemplary embodiment of this disclosure;

[0023] Figure 2 yes Figure 1 Schematic diagram of the cross-sectional structure at point CC;

[0024] Figure 3 yes Figure 2 A partial three-dimensional structural diagram of the back panel;

[0025] Figure 4 yes Figure 3 Another partial three-dimensional structural diagram of the back panel;

[0026] Figure 5 yes Figure 2 A schematic diagram of a partial three-dimensional structure at the heat transfer section;

[0027] Figure 6 yes Figure 2 A top view schematic diagram of the structure at the back panel;

[0028] Figure 7 This is a cross-sectional structural diagram of a display terminal provided in an exemplary embodiment of this disclosure.

[0029] Explanation of reference numerals in the attached figures:

[0030] 1-Backlight module;

[0031] 10-Back panel; 11-Bottom panel; 11a-Groove; 12-Side panel;

[0032] 20 - LED strip; 21 - Circuit board; 22 - LED chip;

[0033] 30 - Thermal conductive component; 31 - First sub-part; 32 - Second sub-part; 32a - Screw hole;

[0034] 40 - Heat transfer part; 41 - Double-sided adhesive; 42 - Metal sheet;

[0035] 50-Fasteners;

[0036] 61-Middle frame; 611-Connecting plate; 612-Bearing plate;

[0037] 62-Reflective sheet; 63-Light guide plate; 64-Optical film; 65-Adhesive part; 66-Thermal conductive adhesive;

[0038] s1 - Length of the second sub-part 32;

[0039] s2 - the length of the metal sheet 42;

[0040] The length of the base plate 11 outside the groove 11a;

[0041] 2-Display terminal; 3-LCD panel; 4-Outer frame. Detailed Implementation

[0042] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0043] According to the first aspect of this application, Figures 1 to 6As shown, a backlight module 1 is provided, including a back plate 10, a light strip 20, a heat-conducting component 30, and a heat transfer section 40. The back plate 10 includes a base plate 11 and a side plate 12 disposed on the periphery of the base plate 11, with the base plate 11 and the side plate 12 forming a receiving cavity. The light strip 20 is disposed on the side plate 12 near the base plate 11. The heat-conducting component 30 is disposed between the side plate 12 and the light strip 20. The heat transfer section 40 connects the heat-conducting component 30 and the base plate 11, and the thermal conductivity of the heat-conducting component 30 is greater than that of the back plate 10.

[0044] Backlight module 1 is used to provide a backlight source for LCD panel 3, etc.

[0045] like Figure 1 and Figure 2 As shown, the backlight module 1 includes a backplate 10. The backplate 10 includes a base plate 11 and a side plate 12 disposed around the base plate 11. The side plate 12 and the base plate 11 together form a receiving cavity. A light source assembly can be disposed within the receiving cavity of the backplate 10.

[0046] like Figure 2 As shown, the light source assembly may include a reflective sheet 62, a light guide plate 63, and an optical film 64 stacked in sequence.

[0047] like Figure 2 As shown, the reflector 62 is disposed on the side of the light guide plate 63 near the base plate 11. The reflector 62 is mainly used to reflect the light emitted from the bottom of the light guide plate 63 back into the light guide plate 63, so that it can be concentrated and emitted from the front of the light guide plate 63, reducing light loss and increasing the light source efficiency of the backlight module 1.

[0048] In some embodiments, the light guide plate 63 may be made of a transparent polymer material, such as polymethyl methacrylate (PMMA) or polycarbonate (PC).

[0049] In some embodiments, reflective strips are provided on the other sidewalls of the light guide plate 63 that are not provided with light strips 20. The reflective strips are used to reflect the light emitted from the side of the light guide plate 63, so that it can be concentrated and projected from the front, further reducing light loss and increasing the light source efficiency of the backlight module 1.

[0050] like Figure 2 As shown, the optical film 64 is disposed on the side of the light guide plate 63 facing away from the base plate 11. The optical film 64 may include diffuser sheets, prism sheets, etc., stacked sequentially. The diffuser sheet is used to diffuse the light emitted from the light guide plate 63, so that the light is evenly distributed on the light-emitting surface, effectively homogenizing the light. The prism sheet is disposed on the side of the diffuser sheet away from the light guide plate 63. The prism sheet corrects the direction of the light through the principle of light refraction and reflection, concentrating the scattered light towards the front, thereby improving the brightness of the backlight module 1.

[0051] like Figure 2As shown, the light-emitting surface of the backlight module 1 refers to the side surface of the optical film 64 that faces away from the base plate 11. The light-emitting surface of the backlight module 1 is correspondingly arranged to the display area of ​​the liquid crystal panel 3, which means that the backlight module 1 can provide a planar light source for at least the entire display area of ​​the liquid crystal panel 3.

[0052] The backlight module 1 can be a side-lit backlight. The backlight module 1 also includes a light strip 20, which is disposed between the side wall of the light guide plate 63 and the side plate 12.

[0053] like Figure 2 As shown, the light strip 20 includes multiple LED beads 22, which can be LEDs or the like. The LED beads 22 face one side wall of the light guide plate 63. The light emitted from the LED beads 22 is incident on the side wall of the light guide plate 63, and is conducted through the light guide plate 63 to the entire plane of the light guide plate 63, thereby forming a planar light source.

[0054] In some embodiments, such as Figure 2 As shown, the light strip 20 includes a circuit board 21 and LED beads 22. The material of the circuit board 21 can be a flexible printed circuit board (FPC), a printed circuit board (PCB), etc.

[0055] In some embodiments, such as Figure 2 As shown, the LED strip 20 can be bonded to the side plate 12 using thermally conductive adhesive 66, thereby fixing the LED strip 20. The thermally conductive adhesive 66 not only has adhesive properties but also excellent thermal conductivity, capable of conducting the heat generated by the LED beads 22 to the side plate 12. The thermal conductivity of the thermally conductive adhesive 66 is approximately 0.3-8 Kelvin per meter (W / (m·K)).

[0056] In some embodiments, such as Figure 2 As shown, the backlight module 1 also includes a middle frame 61, which is disposed on the outside of the side panel 12. The middle frame 61 is used to fix the light source assembly of the backlight module 1, ensuring the structural stability of the backlight module 1, and also playing a certain role in light shielding and protection.

[0057] In some embodiments, the material of the middle frame 61 can be plastic or the like. The middle frame 61 can be integrally formed by injection molding. Specifically, after heating and melting the plastic raw material, it is injected into a specific mold cavity, cooled and solidified inside the mold, and the middle frame 61 is formed in one step.

[0058] like Figure 2 As shown, the middle frame 61 may include a connecting plate 611 and a support plate 612 connected to the connecting plate 611. The connecting plate 611 may engage with the side plate 12 of the back plate 10, but is not limited thereto. The support plate 612 may extend into the receiving cavity of the back plate 10, and the support plate 612 may press against the edge of the optical film 64, thereby limiting the thickness direction of the optical film 64 and preventing the optical film 64 from falling out of the receiving cavity.

[0059] In some embodiments, such as Figure 1 and Figure 2 As shown, the backlight module 1 also includes an adhesive portion 65, which is used to adhere the liquid crystal panel 3. The adhesive portion 65 can be disposed on the upper surface of the carrier plate 612, and the carrier plate 612 can support the liquid crystal panel 3.

[0060] In some embodiments, the material of the back plate 10 can be a metal material such as hot-dip galvanized steel sheet (SGCC) or electro-galvanized steel sheet (SECC). Hot-dip galvanized steel sheet and electro-galvanized steel sheet are the mainstream materials for the back plate 10, but their thermal conductivity is poor. For example, the thermal conductivity of hot-dip galvanized steel sheet is approximately 45-55 W / (m·K), and the thermal conductivity of electro-galvanized steel sheet is approximately 45-50 W / (m·K).

[0061] In some embodiments, the heat-conducting element 30 is made of extruded aluminum. Aluminum profiles have good thermal conductivity. For example, the thermal conductivity of extruded aluminum is approximately 100-200 watts per meter (W / (m·K)).

[0062] like Figure 2 As shown, the heat transfer section 40 is used to connect the heat-conducting element 30 and the base plate 11. "Connection" means that the heat transfer section 40 is in contact with both the heat-conducting element 30 and the base plate 11. By making the heat transfer section 40 in contact with both the heat-conducting element 30 and the base plate 11, heat can be further conducted from the heat-conducting element 30 to the base plate 11.

[0063] In the embodiments of this application, a heat-conducting component 30 is added between the side plate 12 and the light strip 20. The heat-conducting component 30 has a higher thermal conductivity than the back plate 10. The heat-conducting component 30 can conduct the heat of the light strip 20 to the side plate 12. At the same time, the heat-conducting component 30 is connected to the base plate 11 through a heat transfer part 40. The heat transfer part 40 can further conduct the heat of the light strip 20 to the base plate 11, thereby improving the heat dissipation effect.

[0064] Optionally, such as Figure 4 As shown, the edge of the base plate 11 has a groove 11a. The heat-conducting component 30 includes a first sub-part 31 and a second sub-part 32 connected together. The first sub-part 31 is disposed between the side plate 12 and the light strip 20. The second sub-part 32 is located in the groove 11a. The backlight module 1 also includes a fastener 50. The second sub-part 32 is connected to the base plate 11 in the groove 11a by the fastener 50.

[0065] like Figure 4 As shown, the groove 11a is recessed towards the side away from the light-emitting surface of the backlight module 1, and the groove 11a can accommodate the second sub-part 32. The first sub-part 31 is disposed between the side plate 12 and the lamp strip 20, and the second sub-part 32 is located in the groove 11a.

[0066] In some embodiments, such as Figure 4 As shown, the first sub-part 31 and the second sub-part 32 can be flat, thereby avoiding an excessive increase in the width and thickness of the backlight module 1. The thickness direction of the second sub-part 32 is perpendicular to the light-emitting surface of the backlight module 1, the thickness direction of the first sub-part 31 is parallel to the light-emitting surface of the backlight module 1, and the thickness direction of the first sub-part 31 is perpendicular to the thickness direction of the second sub-part 32.

[0067] In some embodiments, the fastener 50 may be a screw, bolt, or other fastener with fixing capabilities.

[0068] In some embodiments, such as Figure 3 and Figure 4 As shown, the second sub-part 32 has multiple screw holes 32a, each screw hole 32a corresponding to one fastener 50. The number of fasteners 50 can be multiple, and their even arrangement facilitates contact between the second sub-part 32 and the base plate 11, improving the heat transfer between the fasteners 50 and the base plate 11.

[0069] Optionally, such as Figure 2 and Figure 5 As shown, the heat transfer part 40 is a double-sided adhesive 41 disposed between the second sub-part 32 and the bottom wall of the groove 11a, and the double-sided adhesive 41 is bonded to the second sub-part 32 and the bottom wall of the groove 11a.

[0070] Since both the back plate 10 and the heat-conducting component 30 have certain machining tolerances, when the base plate 11 is fixed to the second sub-part 32 using fasteners 50, an air gap will be formed between the upper surface of the base plate 11 and the lower surface of the second sub-part 32. The thermal conductivity of air is approximately 0.026 watts per meter Kelvin (W / (m·K)), and the presence of the air gap has a certain impact on heat dissipation.

[0071] In response to this, such as Figure 2 and Figure 5 As shown, double-sided tape 41 is attached to the lower surface of the second sub-part 32. The double-sided tape 41 can fill the space gap between the second sub-part 32 and the bottom wall of the groove 11a, reducing the impact of the air gap on heat dissipation.

[0072] The thermal conductivity of double-sided adhesive tape 41 is generally greater than that of air. For example, the thermal conductivity of ordinary pressure-sensitive double-sided adhesive tape 41 is about 0.05-0.2 watts per meter (W / (m·K)), while the thermal conductivity of thermally conductive double-sided adhesive tape 41 can be increased to 0.3-0.5 watts per meter (W / (m·K)) after adding ceramic or metal fillers.

[0073] The embodiments of this application can improve the heat conduction between the base plate 11 and the second sub-part 32 by filling the gap with double-sided adhesive 41, thereby improving the heat dissipation effect.

[0074] Optionally, the thickness of the double-sided adhesive 41 is less than or equal to 0.05 mm. The thickness of the double-sided adhesive 41 is the dimension of the double-sided adhesive 41 in the direction perpendicular to the bottom wall of the groove 11a.

[0075] The thickness of the double-sided adhesive 41 affects heat dissipation. The inventors discovered that for double-sided adhesive 41 made of the same material, its heat dissipation performance decreases when its thickness exceeds 0.05 mm. Even for thermally conductive adhesive 66, which has better thermal conductivity, its heat dissipation performance is still lower when its thickness exceeds 0.05 mm compared to double-sided adhesive 41 when its thickness is less than 0.05 mm. Therefore, setting the thickness of the double-sided adhesive 41 to less than or equal to 0.05 mm results in better heat dissipation. Furthermore, double-sided adhesive 41 has a cost advantage over thermally conductive adhesive 66, reducing the cost of the backlight module 1.

[0076] In some embodiments, the double-sided adhesive 41 includes a substrate and adhesive layers disposed on both sides of the substrate. The substrate material can be PET, etc. The adhesive material can be pressure-sensitive adhesive, etc.

[0077] Optionally, such as Figure 2 and Figure 6 As shown, the heat transfer part 40 consists of double-sided adhesive tape 41 and a metal sheet 42. The double-sided adhesive tape 41 is disposed between the second sub-part 32 and the bottom wall of the groove 11a. The double-sided adhesive tape 41 is bonded to the second sub-part 32 and the bottom wall of the groove 11a. One end of the metal sheet 42 overlaps the second sub-part 32 and the opposite end overlaps the bottom plate 11 outside the groove 11a.

[0078] In some embodiments, the heat transfer part 40 consists of double-sided adhesive tape 41 and a metal sheet 42. The metal sheet 42 can conduct heat from the second sub-part 32 to the other side of the base plate 11, thereby improving the heat dissipation effect. The metal sheet 42 is lightweight and will not add too much weight to the backlight module 1, thus balancing the requirements of heat dissipation and thinness.

[0079] In some embodiments, the metal sheet 42 may be made of copper or aluminum, for example, copper foil or aluminum foil. Copper and aluminum have high thermal conductivity, which can improve the heat conduction effect. The thermal conductivity of copper foil is approximately 380-400 watts per meter Kelvin (W / (m·K)), and the thermal conductivity of aluminum foil is approximately 200-230 watts per meter Kelvin (W / (m·K)).

[0080] Optionally, such as Figure 2As shown, the surface of the bottom wall of the second sub-part 32 away from the groove 11a is flush with the surface of the base plate 11 outside the groove 11a. This means that the upper surface of the second sub-part 32 is flush with the upper surface of the base plate 11 outside the groove 11a. This arrangement ensures a flat surface beneath the metal sheet 42, preventing wrinkles from forming. If the metal sheet 42 wrinkles, it will affect the flatness of the reflective sheet 62, thereby affecting the brightness uniformity of the backlight module 1.

[0081] It should be noted that the double-sided adhesive 41 can improve the heat dissipation between the second sub-part 32 and the base plate 11, and also absorb the manufacturing tolerances of the second sub-part 32, making its upper surface flush with the upper surface of the base plate 11 outside the groove 11a. Because the double-sided adhesive 41 has a certain degree of flexibility, its thickness can be adjusted within a certain range. When the double-sided adhesive 41 is compressed, its thickness can be reduced to a certain extent, thereby compensating for the manufacturing deviation in the distance between the upper surface of the second sub-part 32 and the surface of the base plate 11 outside the groove 11a.

[0082] Optionally, such as Figure 6 As shown, in the thickness direction of the first sub-part 31, the length s1 of the second sub-part 32 is less than the length s2 of the metal sheet 42.

[0083] To reduce the weight and cost of the heat-conducting component 30, its external dimensions need to be reduced. It should be noted that, to ensure effective heat dissipation along the length of the lamp strip 20, the length of the heat-conducting component 30 should be at least equal to the length of the lamp strip 20; that is, the dimensions of the heat-conducting component 30 along the length of the lamp strip 20 cannot be excessively reduced. The length direction of the lamp strip 20 is parallel to the light-emitting surface of the backlight module 1 and perpendicular to the thickness direction of the first sub-part 31.

[0084] In the thickness direction of the first sub-part 31, the length s1 of the second sub-part 32 can be reduced. In order to conduct heat to the other end of the base plate 11 away from the light strip 20, a lighter metal sheet 42 is used for heat conduction.

[0085] In some embodiments, such as Figure 6 As shown, the length s1 of the second sub-part 32 is less than the length s2 of the metal sheet 42, thereby minimizing the weight and cost of the heat-conducting sheet. Conversely, making the length s2 of the metal sheet 42 greater than the length s1 of the second sub-part 32 results in a lighter metal sheet 42, preventing excessive weight increase in the backlight module 1.

[0086] In some embodiments, the thermal conductivity of the metal sheet 42 is greater than that of the second sub-part 32, thereby not only reducing weight but also improving heat dissipation.

[0087] Optionally, such as Figure 6As shown, in the thickness direction of the first sub-part 31, the length s2 of the metal sheet 42 is less than the length s3 of the base plate 11 outside the groove 11a.

[0088] The length s2 of the metal sheet 42 is less than the length s3 of the base plate 11 outside the groove 11a. This means that the metal sheet 42 does not completely cover the base plate 11 along its length s2. The inventors discovered that a longer length s2 of the metal sheet 42 results in better heat dissipation, but the relationship between the length s2 and the heat dissipation effect is not linear. By adjusting the length s2 of the metal sheet 42 according to heat dissipation requirements, the material cost of the metal sheet 42 can be reduced while still meeting these requirements. In other words, this design achieves a balance between cost and heat dissipation effect.

[0089] Alternatively, the metal sheet 42 may be made of copper or aluminum.

[0090] According to the second aspect of this application, such as Figure 7 As shown, a display terminal 2 is provided, including the backlight module 1 described above.

[0091] In this embodiment, as Figure 7 As shown, the display terminal 2 includes a backlight module 1 and an LCD panel 3, which are combined into one unit.

[0092] In some embodiments, such as Figure 7 As shown, the adhesive part 65 can bond the liquid crystal panel 3 to the middle frame 61, thereby fixing the liquid crystal panel 3 to the backlight module 1.

[0093] In some embodiments, such as Figure 7 As shown, the display terminal 2 also includes an outer frame 4, which covers the bezel of the liquid crystal panel 3. The outer frame 4 can be engaged with the connecting plate 611, but is not limited to this. The outer frame 4 can enhance the mechanical strength of the display terminal 2.

[0094] The liquid crystal panel 3 includes a first substrate and a second substrate facing each other, and a liquid crystal layer disposed between the first substrate and the second substrate. The first substrate is disposed on the side of the second substrate away from the backlight module 1. A first polarizer is disposed on the surface of the first substrate away from the second substrate, and a second polarizer is disposed on the surface of the second substrate away from the first substrate.

[0095] Light emitted from the backlight module 1 enters the liquid crystal panel 3. The liquid crystal molecules in the liquid crystal layer of the liquid crystal panel 3 are deflected under the action of the electric field. The light transmittance of liquid crystal molecules with different deflection angles is different, thereby controlling the light transmittance of the liquid crystal panel 3 and realizing the control of the brightness of the displayed image.

[0096] The liquid crystal panel 3 may include a bonding component, which is bonded to the first substrate. The bonding component may include a flip-chip film, a printed circuit board, a flexible printed circuit board, etc. The lamp strip 20 of the backlight module 1 may be electrically connected to the bonding component, and the bonding component may provide power to the lamp strip 20, etc.

[0097] In this embodiment, the display terminal 2 can be any product or component with display function, such as a mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or navigator.

[0098] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0099] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0100] The embodiments, implementation methods, and related technical features of this application can be combined and substituted for each other without conflict.

[0101] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of this application without departing from the scope of the technical solution of this application shall still fall within the scope of the technical solution of this application.

Claims

1. A backlight module, characterized in that, include: The back plate includes a bottom plate and side plates disposed around the periphery of the bottom plate, the bottom plate and the side plates forming a receiving cavity; A light strip is installed on the side of the side panel near the bottom plate; A heat-conducting component is disposed between the side plate and the light strip; A heat transfer section connects the heat-conducting element to the base plate, wherein the thermal conductivity of the heat-conducting element is greater than that of the back plate.

2. The backlight module according to claim 1, characterized in that, The edge of the base plate has a groove, and the heat-conducting component includes a first sub-part and a second sub-part connected together. The first sub-part is disposed between the side plate and the light strip, and the second sub-part is located in the groove. The backlight module also includes a fastener, and the second sub-part is connected to the base plate in the groove through the fastener.

3. The backlight module according to claim 2, characterized in that, The heat transfer part is a double-sided adhesive disposed between the second sub-part and the bottom wall of the groove, and the double-sided adhesive is bonded to the second sub-part and the bottom wall of the groove.

4. The backlight module according to claim 2, characterized in that, The heat transfer part consists of double-sided adhesive and a metal sheet. The double-sided adhesive is disposed between the second sub-part and the bottom wall of the groove. The double-sided adhesive is bonded to the second sub-part and the bottom wall of the groove. One end of the metal sheet overlaps the second sub-part, and the opposite end overlaps the bottom plate outside the groove.

5. The backlight module according to claim 4, characterized in that, The surface of the second sub-part away from the bottom wall of the groove is flush with the surface of the bottom plate outside the groove.

6. The backlight module according to claim 4, characterized in that, In the thickness direction of the first sub-part, the length of the second sub-part is less than the length of the metal sheet.

7. The backlight module according to claim 6, characterized in that, In the thickness direction of the first sub-part, the length of the metal sheet is less than the length of the base plate outside the groove.

8. The backlight module according to claim 4, characterized in that, The metal sheet is made of copper or aluminum.

9. The backlight module according to any one of claims 3 to 8, characterized in that, The thickness of the double-sided adhesive is less than or equal to 0.05 mm.

10. A display terminal, characterized in that, Includes the backlight module as described in any one of claims 1 to 9.