Substrate processing apparatus and substrate processing method

Abstract

A substrate processing apparatus and a substrate processing method of processing a substrate are disclosed. The substrate processing apparatus includes: a housing for providing a processing space to process a substrate; a support unit located in the processing space and configured to support the substrate; a nozzle for supplying a processing solution to the substrate supported on the support unit; and a heating unit for heating an edge region of the substrate supported on the support unit, in which the support unit includes: a support plate on which the substrate is placed; a pin for supporting the substrate placed on the support plate; and a driving unit for rotating the support plate, and the heating unit includes: an insertion body made of metal and located inside the chuck pin; and a magnet unit for heating the insertion body by an induction heating method. Therefore, when the substrate is processed, the substrate can be processed at a uniform temperature.

Description

Technical Field

[0001] The present invention relates to a substrate processing method and a substrate processing apparatus, and more specifically, to a substrate processing apparatus for processing a substrate at a uniform temperature. Background Technology

[0002] Semiconductor processes include cleaning thin films, foreign matter, particles, etc., from a substrate. These processes are achieved by placing the substrate on a rotating chuck (with the patterned surface facing up or down), applying a processing solution to the substrate while the chuck rotates, and then drying the wafer.

[0003] When treating a substrate with a processing solution, the substrate can be treated either by supplying the processing solution heated to a high temperature to the substrate, or by heating the substrate to a high temperature and treating it at that temperature. In the case of high-temperature treatment, since the reactivity of the processing solution changes with the temperature of the processing solution, it is necessary to maintain a uniform temperature on the substrate.

[0004] However, typically, when rotating the substrate, the temperature of the processing solution in the edge regions drops more easily because the velocity at the edges is higher than at the center of the substrate. Furthermore, even if a heater is installed in the support unit, it may not be configured to heat the front surface of the substrate. Therefore, the problem is that the temperature uniformity of the processing solution is not maintained, and the substrate is processed unevenly. Summary of the Invention

[0005] This invention aims to provide a substrate processing apparatus and a substrate processing method that can process the substrate at a uniform temperature when the substrate is treated with a high-temperature processing solution.

[0006] This invention also aims to provide a substrate processing apparatus and a substrate processing method capable of inductively heating the edge region of a substrate.

[0007] The purpose of this disclosure is not limited thereto, and other purposes not stated herein will be readily apparent to those skilled in the art from the following description.

[0008] An exemplary embodiment of the present invention is a substrate processing apparatus, the apparatus comprising: a housing for providing a processing space for processing a substrate; a support unit located in the processing space for supporting the substrate; a nozzle for supplying a processing solution to the substrate supported on the support unit; and a heating unit for heating an edge region of the substrate supported on the support unit, wherein the support unit comprises: a support plate on which the substrate is placed; a pin for supporting the substrate placed on the support plate; and a drive unit for rotating the support plate, and the heating unit may comprise: an insertion body made of metal and located within a chuck pin; and a magnet unit for heating the insertion body by induction heating.

[0009] According to an exemplary embodiment of the present invention, the pin may be a chuck pin, which supports a side portion of a substrate placed on a support plate.

[0010] According to an exemplary embodiment of the present invention, the magnet unit is located at the lower portion of the chuck pin and can be configured to be spaced apart from the support plate.

[0011] According to an exemplary embodiment of the present invention, the support unit includes a frame surrounding the drive unit, the frame being configured to be rotated and fixed in place relative to the support unit, and a magnet unit may be mounted on the frame.

[0012] According to an exemplary embodiment of the present invention, the support unit includes a frame surrounding the drive unit, the frame being provided with a cleaning unit for cleaning the lower portion of the support plate, and the magnet unit includes a plurality of magnets, which can be installed in the cleaning unit.

[0013] According to an exemplary embodiment of the present invention, the magnet unit includes a plurality of magnets, and the plurality of magnets may be arranged to be spaced apart from each other along the circumferential direction of the support plate.

[0014] According to an exemplary embodiment of the present invention, each of the plurality of magnets may be provided with a top end and a bottom end with different polarities, and the top ends of adjacent magnets among the plurality of magnets have different polarities.

[0015] According to an exemplary embodiment of the present invention, the device may further include a controller for controlling the drive unit, wherein the controller controls the rotational speed of the support plate according to a set temperature for processing the substrate.

[0016] According to an exemplary embodiment of the present invention, the support unit may include: an electromagnet; and a power source for supplying power to the electromagnet.

[0017] According to an exemplary embodiment of the present invention, the device may further include a controller for controlling a power supply, wherein the controller controls the power supply such that a set power is applied to the electromagnet according to a set temperature for processing the substrate.

[0018] According to an exemplary embodiment of the present invention, the insertion body has a plate-like shape, and multiple insertion bodies can be provided to be stacked on top of each other.

[0019] According to an exemplary embodiment of the present invention, the support unit may include a heater for heating a substrate supported by a support plate.

[0020] An exemplary embodiment of the present invention is a method for processing a substrate using a substrate processing apparatus, the method comprising: the substrate processing apparatus comprising: a housing for providing a processing space for processing the substrate; a support unit located in the processing space for supporting the substrate; a nozzle for supplying a processing solution to the substrate supported on the support unit; and a heating unit for heating an edge region of the substrate supported on the support unit, the support unit comprising: a support plate on which the substrate is placed; a chuck pin for supporting a side portion of the substrate placed on the support plate; and a drive unit for rotating the support plate, and the heating unit comprising: an insertion body made of metal and located within the chuck pin; and a magnet unit for heating the insertion body by induction heating, and the method comprising: supplying a processing solution to the rotating substrate, and using the heating unit to induction heat the insertion body to heat the edge region of the substrate.

[0021] According to an exemplary embodiment of the present invention, the processing solution can be supplied to the substrate under a heated state.

[0022] According to an exemplary embodiment of the present invention, the support unit may include a heater for heating a substrate supported by a support plate, and the heater heats the substrate.

[0023] According to an exemplary embodiment of the present invention, a chuck pin includes: a first chuck pin; and a second chuck pin having an insertion body having a thickness different from that of an insertion body disposed in the first chuck pin, and the method may include processing the substrate by mounting a chuck pin selected from the first chuck pin and the second chuck pin on a support plate according to a set temperature for processing the substrate.

[0024] According to an exemplary embodiment of the present invention, the rotational speed of the support unit can be changed according to a set temperature for processing the substrate.

[0025] According to an exemplary embodiment of the present invention, the magnet unit includes an electromagnet and a power source for supplying power to the electromagnet, and the method may include changing the power supplied to the electromagnet according to a set temperature for processing the substrate.

[0026] An exemplary embodiment of the present invention is a substrate processing apparatus, comprising: a housing for providing a processing space for processing a substrate; a support unit located in the processing space and for supporting the substrate; a nozzle for supplying a processing solution to the substrate supported on the support unit; and a heating unit for heating an edge region of the substrate supported on the support unit, wherein the support unit includes: a support plate on which the substrate is placed; a chuck pin for supporting a side portion of the substrate placed on the support plate; a drive unit for rotating the support plate; and a heater for heating the substrate supported by the support plate, the heating unit including: an insertion body made of metal and located within the chuck pin; and a magnet unit located at a lower portion of the pin and spaced apart from the support plate, the support unit further including a frame surrounding the drive unit, the magnet unit including a plurality of magnets spaced apart from each other along the circumferential direction of the support plate, each of the plurality of magnets having a different polarity than another of the plurality of magnets, and the plurality of magnets of different polarities may be arranged adjacent to each other.

[0027] According to an exemplary embodiment of the present invention, the support unit further includes: an electromagnet; and a power supply for supplying power to the electromagnet, the device further including a controller for controlling the power supply, and the controller can control the power supply according to the temperature for processing the substrate or the speed for rotating the substrate.

[0028] According to an exemplary embodiment of the present invention, uniformity can be improved when the substrate is treated with high temperature.

[0029] According to an exemplary embodiment of the present invention, the edge region of the substrate can be inductively heated.

[0030] The effects of this disclosure are not limited to those described above, and those skilled in the art will clearly understand any effects not mentioned based on this specification and the accompanying drawings. Attached Figure Description

[0031] Figure 1 This is a schematic top plan view of a substrate processing apparatus according to an exemplary embodiment of the present invention.

[0032] Figure 2 This is an illustrative representation according to an exemplary embodiment. Figure 1 A diagram of the liquid handling chamber.

[0033] Figure 3 Is shown as added Figure 2 A schematic diagram of the heater in the liquid handling chamber.

[0034] Figure 4 It is shown Figure 2 A cross-sectional view of the chuck pin.

[0035] Figure 5 It is shown schematically. Figure 4 A diagram of another exemplary embodiment of the chuck pin.

[0036] Figure 6 It is shown schematically in Figure 2 A diagram showing the use of electromagnets in a liquid handling chamber.

[0037] Figure 7 It is shown schematically in Figure 2 A diagram showing the use of a lifting unit in a liquid handling chamber.

[0038] Figure 8 It is shown schematically in Figure 2 A diagram showing the use of a cleaning unit in a liquid handling chamber. Detailed Implementation

[0039] In the following description, exemplary embodiments of the invention will be described in more detail with reference to the accompanying drawings. Exemplary embodiments of the invention may be modified in various forms, and the scope of the invention should not be construed as limited to the following exemplary embodiments. These exemplary embodiments are provided to explain the invention more fully to those skilled in the art. Therefore, the shapes of the elements in the drawings are enlarged for clearer description.

[0040] Figure 1 This is a schematic top plan view of a substrate processing apparatus according to an exemplary embodiment of the present invention.

[0041] refer to Figure 1 The substrate processing apparatus includes a transposition module 10, a processing module 20, and a controller 30. In an exemplary embodiment, the transposition module 10 and the processing module 20 are arranged along one direction. Hereinafter, the direction in which the transposition module 10 and the processing module 20 are arranged is referred to as a first direction 92, and when viewed from above, a direction perpendicular to the first direction 92 is referred to as a second direction 94, and a direction perpendicular to both the first direction 92 and the second direction 94 is referred to as a third direction 96.

[0042] The transposition module 10 transfers the substrate W from the container 80 containing the substrate W to the processing module 20, and accommodates the substrate W, which has already been fully processed in the processing module 20, within the container 80. The longitudinal direction of the transposition module 10 is arranged in the second direction 94. The transposition module 10 includes a loading port 12 and a transposition frame 14. Based on the transposition frame 14, the loading port 12 is located on the side opposite to the processing module 20. The container 80 containing the substrate W is placed on the loading port 12. Multiple loading ports 12 can be provided, and the multiple loading ports 12 can be arranged in the second direction 94.

[0043] As container 80, an airtight container, such as a front-opening unified pod (FOUP), can be used. Container 80 can be placed on loading port 12 by a transfer tool (not shown) (such as an overhead conveyor, overhead transporter, or automated guided vehicle) or by an operator.

[0044] A transposition robot 120 is disposed within a transposition frame 14. A guide rail 140, with its longitudinal direction being a second direction 94, is disposed within the transposition frame 14, and the transposition robot 120 is configured to move along the guide rail 140. The transposition robot 120 includes a hand 122 on which a substrate W is placed, and the hand 122 is configured to be movable back-and-forth, rotatable about a third direction 96, and movable along the third direction 96. A plurality of hands 122 are arranged to be spaced apart from each other in the vertical direction and are capable of moving back-and-forth independently.

[0045] Processing module 20 includes a buffer unit 200, a transfer chamber 300, and a processing chamber 400. The buffer unit 200 provides space for the substrate W loaded into and unloaded from the processing module 20 to temporarily reside therein. The processing chamber 400 performs a liquid processing procedure on the substrate W by supplying liquid onto it. The transfer chamber 300 transfers the substrate W between the buffer unit 200 and the liquid processing chamber 400.

[0046] The transfer chamber 300 can be configured such that the longitudinal direction is a first direction 92. A buffer unit 200 can be disposed between the indexing module 10 and the transfer chamber 300. A plurality of liquid processing chambers 400 are provided, and these liquid processing chambers can be disposed on the side of the transfer chamber 300. The liquid processing chambers 400 and the transfer chamber 300 can be disposed in a second direction 94. The buffer unit 200 can be located at one end of the transfer chamber 300.

[0047] According to the example, the liquid processing chamber 400 can be respectively disposed on both sides of the transfer chamber 300. On each of the two sides of the transfer device 300, the liquid processing device 400 can be arranged in an array of A×B (each of A and B is a natural number of 1 or greater than 1) in a first direction 92 and a third direction 96.

[0048] The transfer chamber 300 includes a transfer robot 320. A guide rail 340 in the longitudinal direction in a first direction 92 is disposed in the transfer chamber 300, and the transfer robot 320 is configured to move on the guide rail 340. The transfer robot 320 includes a hand 322 therein in which a substrate W is placed, and the hand 322 is configured to be movable back and forth, rotatable about a third direction 96, and movable along the third direction 96. A plurality of hands 322 are configured to be spaced apart in the vertical direction, and the hands 322 can move back and forth independently of each other.

[0049] The buffer unit 200 includes a plurality of buffers 220 on which the substrate W is placed. The buffers 220 may be configured to be spaced apart from each other on a third direction 96. The front and rear of the buffer unit 200 are open. The front is the surface facing the transposition module 10, and the rear is the surface facing the transfer chamber 300. The transposition robot 120 can access the buffer unit 200 through the front, and the transfer robot 320 can access the buffer unit 200 through the rear.

[0050] Figure 2 It is shown schematically. Figure 1 A figure showing an exemplary embodiment of the liquid handling chamber 400. (Refer to...) Figure 2 The liquid handling chamber 400 includes a housing 410, a cup 420, a support unit 440, a nozzle unit 460, a lifting unit 480, a heating unit 500, and a controller 600.

[0051] The housing 410 is configured as a generally rectangular parallelepiped shape. The cup 420, the support unit 440, and the nozzle unit 460 are disposed within the housing 410.

[0052] Cup 420 has a processing space with an open top, and substrate W undergoes liquid processing within the processing space. Support unit 440 supports substrate W within the processing space. Nozzle unit 460 supplies liquid to substrate W supported on support unit 440. Various types of liquid can be provided and can be supplied to substrate W sequentially. Lifting unit 480 adjusts the relative height between cup 420 and support unit 440.

[0053] According to the example, cup 420 includes a plurality of recovery containers 422, 424, and 426. Each of the recovery containers 422, 424, and 426 has a recovery space for recovering liquid used to process the substrate. Each of the recovery containers 422, 424, and 426 is configured in an annular shape surrounding the support unit 440. As the liquid processing proceeds, the processed liquid dispersed by the rotation of the substrate W is introduced into the recovery space through inlets 422a, 424a, and 426a of the respective recovery containers 422, 424, and 426. According to the example, cup 420 includes a first recovery container 422, a second recovery container 424, and a third recovery container 426. The first recovery container 422 is configured to surround the support unit 440, the second recovery container 424 is configured to surround the first recovery container 422, and the third recovery container 426 is configured to surround the second recovery container 424. The second inlet 424a, which introduces liquid into the second recycling container 424, may be located above the first inlet 422a, which introduces liquid into the first recycling container 422, and the third inlet 426a, which introduces liquid into the third recycling container 426, may be located above the second inlet 424a.

[0054] The support unit 440 includes a support plate 442, a drive unit 444, a frame 446, and a pin 448. The upper surface of the support plate 442 may be generally circular in shape, and its diameter may be larger than the diameter of the substrate W. The drive unit 444 includes a drive shaft 444a and a driver 444b. The drive shaft 444a is coupled to the center of the lower surface of the support plate 442. Furthermore, the drive shaft 444a is equipped with the driver 444b to provide rotational force. The driver 444b causes the drive shaft 444a to rotate. Therefore, the support plate 442 rotates about the axis of the drive shaft 444a. In one example, the driver 444b may be a motor. The frame 446 is configured to rotate around the drive shaft 444a. The frame 446 may be configured to be independent of the rotation of the drive shaft 444a. Therefore, even when the support plate 442 is rotated by the drive unit 444, the frame 446 may remain stationary. The frame 446 may be coupled to a magnet unit 530, which will be described later. Pin 448 includes a support pin 448a and a chuck pin 448b. Support pin 448a supports the rear surface of the substrate W. Support pin 448a is disposed on the top surface of the support plate 442. Support pin 448a is disposed inside the chuck pin 448b. Support pin 448a has a top end protruding from the support plate 442, such that the substrate W is spaced apart from the support plate 442 by a certain distance. Chuck pin 448b supports a side portion of the substrate W such that the substrate W does not separate from the support unit 440 when the substrate W rotates. The chuck pin 448b can be removably provided from the support plate 442. The insertion body 510, described later, can be disposed within the chuck pin 448b. Further details regarding the chuck pin 448b will be discussed later.

[0055] In the above example, the invention has been described based on the case where no means for heating the substrate W are provided. However, it is not limited thereto; the support plate 442 may be provided with a heater 442a for heating the substrate W, such as... Figure 3 As shown. Heater 442a can be a heating plate or a heating wire. However, it is not limited to this; any device capable of heating the substrate W will be sufficient. Therefore, the substrate W can be heated while the processing solution is supplied at a high temperature, or the substrate W can be heated while a low-temperature processing solution is supplied to the substrate W.

[0056] Nozzle unit 460 includes a first nozzle 462 and a second nozzle 464. The first nozzle 462 supplies a processing solution to the substrate W. The processing solution can be a liquid with a temperature above room temperature. According to one example, the processing solution can be an aqueous phosphoric acid solution. The aqueous phosphoric acid solution can be a mixture of phosphoric acid and water. Optionally, the aqueous phosphoric acid solution may also contain other substances. For example, the other material can be silicon. The second nozzle 464 supplies water to the substrate W. The water can be pure water or deionized water.

[0057] The first nozzle 462 and the second nozzle 464 are each supported on different arms 461, and these arms 461 can move independently. Optionally, the first nozzle 462 and the second nozzle 464 can be mounted on the same arm and move simultaneously.

[0058] Optionally, in addition to the first nozzle 462 and the second nozzle 464, the liquid supply unit may also include one or more nozzles. The additional nozzles can supply different types of processing solutions to the substrate. For example, other types of processing solutions may be acid or alkaline solutions used to remove foreign matter from the substrate. Alternatively, another type of processing solution may be an alcohol with a lower surface tension than water. For example, the alcohol may be isopropanol.

[0059] The lifting unit 480 moves the cup 420 vertically. This vertical movement of the cup 420 changes the relative height between the cup 420 and the substrate W. Therefore, the recovery containers 422, 424, and 426 for recovering the treatment solution vary depending on the type of liquid supplied to the substrate W, and thus the liquid can be recovered separately. Alternatively, the cup 420 may be fixedly mounted, and the lifting unit 480 may move the support unit 440 vertically. In one example, the lifting unit 480 may include a motor (not shown).

[0060] The heating unit 500 heats the edge region of the substrate W. The heating unit 500 includes an insertion body 510 and a magnet unit 530. The insertion body 510 can be disposed within the chuck pin 448b.

[0061] Figure 4 This illustrates an exemplary embodiment. Figure 2 A cross-sectional view of the chuck pin. (Reference) Figure 4 An insertion body 510 may be disposed inside the chuck pin 448b. The insertion body 510 may be made of metal. The insertion body 510 may be shaped like a plate. Furthermore, multiple insertion bodies 510 may be provided, and they may be stacked on top of each other. The insertion body 510 may be induction heated by a heating unit described later.

[0062] Figure 5 It is shown schematically. Figure 4 A diagram of another exemplary embodiment of the chuck pin. (Refer to...) Figure 5The chuck pin 448b may include a first chuck pin 448b-1 and a second chuck pin 448b-2. The insertion bodies 510 disposed in the first chuck pin 448b-1 and the second chuck pin 448b-2 may be provided in different numbers. In one example, the number of insertion bodies 510 disposed in the first chuck pin 448b-1 may be greater than the number of insertion bodies 510 disposed in the second chuck pin 448b-2. Depending on the substrate processing procedure, the first chuck pin 448b-1 and the second chuck pin 448b-2 may be used interchangeably.

[0063] The magnet unit 530 induction heats the insert 510. The magnet unit 530 may include a support 533 and a magnet 531. The magnet 531 may be positioned such that the magnetic field formed by the magnet 531 can interfere with the insert body 510. In the following description, the invention has been based on the case where the magnet 531 is located in the lower portion of the chuck pin 448b.

[0064] Magnet 531 can be located in the lower portion of chuck pin 448b. Magnet 531 can be located in the lower portion of support plate 442 and can be spaced apart from support plate 442. When viewed from above, magnet 531 can be positioned corresponding to chuck pin 448b. Multiple magnets 531 can be provided. Multiple magnets 531 can be arranged along the circumferential direction of support plate 442. In one example, multiple magnets 531 can be permanent magnets. In this case, magnet 531 can have N poles and S poles, and the upper surfaces of adjacent magnets 531 can be configured to have different poles.

[0065] The magnet 531 induction heats the insertion body 510. The magnetic field formed by the magnet 531 generates an electric current in the insertion body 510, and the electrical energy of the generated current is converted into heat as it is dissipated by the internal resistance of the metal, thereby causing the temperature of the insertion body 510 to rise.

[0066] In the above example, the invention was described based on the case where magnet 531 is a permanent magnet. However, without limitation, as... Figure 6 As shown, magnet 531 can be an electromagnet, and magnet unit 531 can also include a power supply 535 that supplies power to the electromagnet, and a controller 600 can be provided to control the power supply 535. Power supply 535 can supply alternating current to the electromagnet. In this case, controller 600 can change the power supplied to the electromagnet based on the processing temperature of substrate W.

[0067] Support member 533 supports magnet 531. Support member 533 is fixedly connected to frame 446. Support member 533 may have a shape extending outward from frame 446. Support member 533 may be connected to the upper wall of frame 446. In addition, support member 533 may be connected to the side wall of frame 446. However, the invention is not limited thereto, and it is sufficient if frame 446 is not provided and support member 533 is formed to support magnet 531 in the lower portion of chuck pin 448b.

[0068] The controller 600 may include a central processing unit (CPU), read-only memory (ROM), and random access memory (RAM). The CPU performs necessary processing, such as etching, based on various schemes stored in these memory areas. Schemes contain device control information representing the processing conditions. Meanwhile, programs or schemes representing the processing conditions may be stored on non-transitory computer-readable media. Non-transitory computer-readable media refers to media that stores data semi-permanently and can be read by a computer, rather than media that stores data temporarily, such as registers, caches, or memory. Specifically, the various applications or programs described above may be stored and provided on non-transitory readable media, such as CDs, DVDs, hard disks, Blu-ray discs, USB drives, memory cards, or ROMs.

[0069] Hereinafter, a substrate processing method according to exemplary embodiments will be described. The substrate processing method described herein can be found in references to... Figures 1 to 6 The substrate processing apparatus described herein is used to perform this process. Therefore, reference will be made below. Figures 1 to 5 The reference numerals shown in the accompanying drawings depict an exemplary substrate processing method without alteration. Furthermore, the substrate processing method described herein can be executed by controlling a controller 600 configured within the aforementioned substrate processing apparatus.

[0070] In an exemplary embodiment, a substrate W is loaded onto a support plate 442, and a chuck pin 448b supports the substrate W at a side portion. A driver 444b applies a rotational force to a drive shaft 444a to rotate the support plate 442, thereby rotating the substrate W. Then, a nozzle unit 460 supplies a processing solution to the substrate W, and the substrate W is processed by the processing solution. The substrate W is processed at a set temperature. The set temperature can be the temperature of the processing solution, or it can be the set temperature of the heater 442a. In one example, the processing solution can be a processing solution at 200°C or lower. As the support plate 442 rotates, the chuck pin 448b also rotates with the support plate 442. At this time, the insertion body 510 in the chuck pin 448b interferes with the magnetic field formed by a plurality of magnets 531 located at the bottom. Since the upper surfaces of the plurality of magnets 531 are arranged such that the N pole and the S pole alternate and repeat, the direction of the magnetic field interfering with the insertion body 510 changes continuously. Therefore, a current is formed in the insertion body 510, and the direction of the current changes. Current dissipates electrical energy through the resistor, and the electrical energy is converted into heat energy. That is, the insertion body 510 is inductively heated. The chuck pin 448b is heated by the inductively heated insertion body 510, and the heated chuck pin 448b heats the processing solution adjacent to the chuck pin 448b, which can improve the temperature uniformity of the processing solution present on the substrate W.

[0071] Furthermore, the substrate W can be processed by selectively mounting a first chuck pin 448b-1 and a second chuck pin 448b-2 on the support plate 442. In one example, the first chuck pin 448b-1 can be mounted during a first process, and the second chuck pin 448b-2 can be mounted during a second process. The first process can be a process in which the substrate is processed at a higher temperature than the second process. Since the higher the set temperature, the greater the temperature drop in the edge region, the induction heating effect can be enhanced by using the first chuck pin 448b-1 with more insertion bodies 510, thereby improving temperature uniformity.

[0072] In addition, when using Figure 6 When the substrate processing equipment processes a substrate, the degree of induction heating of the chuck pin 448b can be adjusted by adjusting the amount of power supplied by the power supply 535 according to the set temperature of the substrate being processed, thereby improving temperature uniformity.

[0073] In the above example, the invention has been described based on the case where only the first chuck pin 448b-1 and the second chuck pin 448b-2 are provided. However, the invention is not limited thereto and may further include a plurality of chuck pins having insert bodies 510 with a thickness or number different from the thickness or number of insert bodies provided in the first chuck pin 448b-1 and the second chuck pin 448b-2, and which may be interchangeable according to the process.

[0074] In the above example, the invention has been described based on the case where the number of insertion bodies 510 provided in the first chuck pin 448b-1 and the second chuck pin 448b-2 is different. However, the invention is not limited thereto, and the same number of insertion bodies 510 can be provided, and insertion bodies 510 of different thicknesses can be provided.

[0075] Furthermore, in the above example, the invention has been described based on the case where the magnet 531 is located in the lower portion of the chuck pin 448b. However, the invention is not limited thereto, and it is sufficient if the magnet 531 is positioned where interference occurs between the insertion body 510 and the magnetic field formed by the magnet 531.

[0076] Furthermore, in the above example, the support member 533 is fixed to the frame 446, and the magnet 531 is fixed to the support member. However, the invention is not limited thereto, and the support member may be provided with a lifting member 537 for adjusting the height of the magnet 531 on the support member, such as... Figure 7 As shown, the magnet 531 can be configured to move up and down via the lifting member 537. In this case, by adjusting the height of the magnet 531, the interference between the insert 510 and the magnetic field can be adjusted to control the temperature of the insert body 510 by induction heating. In one example, the lifting member 537 can be a motor.

[0077] Furthermore, in the above example, the invention has been described based on the case where the support 533 is mounted on the frame 446 and the magnet 531 is mounted on the support 533. However, the invention is not limited thereto, and it is also possible to omit the support 533 and instead mount a cleaning unit 700, including a cleaning nozzle 710 for cleaning the lower portion of the support plate 442, on the frame 446, and mount the magnet 531 on the cleaning unit 700, as shown below. Figure 8 As shown.

[0078] Furthermore, in the above example, the invention has been described based on the case where induction heating is adjusted by replacing the chuck pin 448b or adjusting the power supply 535. However, the invention is not limited thereto, and induction heating can also be controlled by adjusting the rotational speed of the support plate 442.

[0079] The foregoing detailed description illustrates the present invention. Furthermore, while the above description illustrates and describes exemplary embodiments of the invention, the invention can be used in various other combinations, modifications, and environments. That is, changes or modifications are possible within the scope of the concept of the invention disclosed herein (which is equivalent to the written disclosure) and / or within the scope of skill or knowledge in the art. The foregoing exemplary embodiments describe the optimal state for carrying out the technical spirit of the invention, and various variations are possible for specific fields of application and uses of the invention. Therefore, the foregoing detailed description of the invention is not intended to limit the invention to the disclosed exemplary embodiments. Additionally, the appended claims should be construed as including other exemplary embodiments as well.

Claims

1. A substrate processing apparatus, the apparatus comprising: A housing that provides processing space for processing substrates; A support unit, located in the processing space and used to support the substrate; A nozzle for supplying a treatment solution to the substrate supported on the support unit; as well as A heating unit for heating the edge region of the substrate supported on the support unit. The support unit includes: A support plate on which the substrate is placed; Pins, used to support the substrate placed on the support plate; and A drive unit for rotating the support plate, and The heating unit includes: An insertion body, made of metal and located within the pin; and A magnet unit for heating the insertion body by induction heating.

2. The device of claim 1, wherein the pin is a chuck pin that supports a side portion of the substrate placed on the support plate.

3. The device according to claim 2, wherein the magnet unit is located in the lower portion of the chuck pin and is spaced apart from the support plate.

4. The device of claim 3, wherein the support unit comprises a frame surrounding the drive unit. The frame is configured to be rotated and fixed in place relative to the support unit, and The magnet unit is mounted on the frame.

5. The device according to claim 4, wherein the frame is provided with a cleaning unit for cleaning the lower portion of the support plate. The magnet unit comprises multiple magnets, and The plurality of magnets are installed in the cleaning unit.

6. The device according to claim 2, wherein the magnet unit comprises a plurality of magnets, and The plurality of magnets are arranged to be spaced apart from each other along the circumferential direction of the support plate.

7. The device according to claim 6, wherein each of the plurality of magnets is provided with a top end and a bottom end having different polarities, and The tips of adjacent magnets in the plurality of magnets have different polarities.

8. The device according to claim 2, further comprising: A controller, which is used to control the drive unit, The controller controls the rotation speed of the support plate according to a set temperature for processing the substrate.

9. The device according to claim 2, wherein the support unit comprises: Electromagnets; A power source, which supplies power to the electromagnet.

10. The device according to claim 9, further comprising: Controller, which is used to control the power supply. The controller controls the power supply to apply a set power to the electromagnet according to a set temperature for processing the substrate.

11. The device of claim 1, wherein the insertion body has a plate-like shape, and The insertion bodies are configured to be multiple and stacked on top of each other.

12. The device of claim 1, wherein the support unit includes a heater for heating the substrate supported by the support plate.

13. A method for processing a substrate using a substrate processing apparatus, the method comprising: The substrate processing equipment includes: A housing that provides processing space for processing substrates; A support unit located in the processing space and supporting the substrate; Nozzles for supplying a treatment solution to the substrate supported on the support unit; and A heating unit for heating the edge region of the substrate supported on the support unit. The support unit includes: A support plate on which the substrate is placed; A chuck pin for supporting a side portion of the substrate placed on the support plate; and A drive unit for rotating the support plate, and The heating unit includes: An insert body, made of metal and located within the chuck pin; and A magnet unit, used to heat the insertion body by induction heating, and The method includes supplying a processing solution to a rotating substrate and inductively heating the insertion body using the heating unit to heat the edge region of the substrate.

14. The method of claim 13, wherein the processing solution is supplied to the substrate under a heated state.

15. The method of claim 13, wherein the support unit includes a heater for heating the substrate supported by the support plate, and The heater heats the substrate.

16. The method of claim 13, wherein the chuck pin comprises: First chuck pin; as well as The second chuck pin has an insertion body, the thickness of which differs from the thickness of the insertion body in the first chuck pin. The method includes processing the substrate by mounting a chuck pin, selected from the first chuck pin and the second chuck pin, onto the support plate according to a set temperature for processing the substrate.

17. The method of claim 13, wherein the rotational speed of the support unit is varied according to a set temperature for processing the substrate.

18. The method of claim 13, wherein the magnet unit comprises an electromagnet and a power source for supplying power to the electromagnet, and The method includes varying the power supplied to the electromagnet based on a set temperature for processing the substrate.

19. A substrate processing apparatus, the apparatus comprising: A housing that provides processing space for processing substrates; A support unit located in the processing space and supporting the substrate; A nozzle for supplying a treatment solution to the substrate supported on the support unit; as well as A heating unit for heating the edge region of the substrate supported on the support unit. The support unit includes: A support plate on which the substrate is placed; A chuck pin for supporting a side portion of the substrate placed on the support plate; and A drive unit for rotating the support plate; and A heater for heating the substrate supported by the support plate. The heating unit includes: An insert body, made of metal and located within the chuck pin; and A magnet unit, located in the lower portion of the pin, is positioned spaced apart from the support plate. The support unit also includes a frame surrounding the drive unit. The magnet unit includes multiple magnets. The plurality of magnets are spaced apart from each other along the circumferential direction of the support plate. Each of the plurality of magnets has a different polarity than another magnet in the plurality of magnets, and The plurality of magnets of different polarities are arranged to be adjacent to each other.

20. The device of claim 19, wherein the support unit further comprises: Electromagnets; as well as A power source, which supplies power to the electromagnet, The device also includes a controller for controlling the power supply, and The controller controls the power supply based on the temperature used to process the substrate or the speed used to rotate the substrate.

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