Wafer cleaning system, control method and device of wafer cleaning system

Abstract

The application relates to a wafer cleaning system, a control method and device thereof. The wafer cleaning system comprises a rotating mechanism, a swing arm mechanism, a two-fluid nozzle and a drying nozzle. The rotating mechanism comprises a machine body, a suction disc and a first driving assembly. The suction disc is arranged on the machine body and used for adsorbing a wafer. The first driving assembly is arranged in the machine body and is drivingly connected with the suction disc. The swing arm mechanism comprises a swing arm and a second driving assembly drivingly connected with the swing arm. The swing arm is located above the suction disc. The second driving assembly is used for driving the swing arm to swing. The two-fluid nozzle is arranged on the swing arm. The two-fluid nozzle is used for spraying a mixture of compressed air and liquid to the wafer adsorbed by the suction disc. The drying nozzle is arranged on the swing arm. The drying nozzle is used for spraying dry gas to the wafer after the wafer adsorbed by the suction disc is cleaned by the two-fluid nozzle. The wafer surface drying speed can be accelerated, and the wafer cleaning efficiency can be improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of grinding equipment, in particular to a wafer cleaning system, a control method and device of the wafer cleaning system. BACKGROUND

[0002] Since the silicon powder generated in the process of thinning the wafer by the grinding equipment is easy to adhere to the surface of the wafer, the surface of the wafer needs to be cleaned.

[0003] In the prior art, the surface of the wafer is generally cleaned by spraying a mixture of compressed air and liquid on the surface of the wafer through a single two-fluid nozzle. However, in the case where the water supply pipeline for supplying water to the two-fluid nozzle is insufficient, the liquid in the water supply pipeline is easy to flow directly to the surface of the wafer under the action of the pressure of the gas supply pipeline for supplying gas to the two-fluid nozzle, thereby causing the liquid to continuously exist on the surface of the wafer and failing to dry the surface of the wafer quickly, which seriously affects the cleaning efficiency of the wafer. SUMMARY

[0004] The present application aims at least to solve one of the problems in the prior art or related art.

[0005] To this end, the present application provides a wafer cleaning system, a control method and device of the wafer cleaning system, which can dry the surface of the wafer cleaned by the two-fluid nozzle through dry gas to accelerate the drying speed of the surface of the wafer, thereby improving the cleaning efficiency of the wafer.

[0006] According to the first aspect of the present application, a wafer cleaning system applied to a grinding equipment comprises:

[0007] A rotating mechanism comprising a body, a suction cup and a first driving assembly, the suction cup being arranged on the body and used for adsorbing a wafer, and the first driving assembly being arranged in the body and drivingly connected with the suction cup;

[0008] An oscillating arm mechanism comprising an oscillating arm and a second driving assembly drivingly connected with the oscillating arm, the oscillating arm being located above the suction cup, and the second driving assembly being used for driving the oscillating arm to oscillate;

[0009] A two-fluid nozzle arranged on the oscillating arm, the two-fluid nozzle being used for spraying a mixture of compressed air and liquid on the wafer adsorbed by the suction cup;

[0010] A drying nozzle arranged on the oscillating arm, the drying nozzle being used for spraying dry gas on the wafer after the wafer is cleaned by the two-fluid nozzle.

[0011] Optionally, the second driving assembly comprises:

[0012] A rotating shaft, one end of which is connected with the oscillating arm;

[0013] The other end of the swing arm motor is connected to the swing arm motor drive, and the swing arm motor is used to drive the swing arm to swing.

[0014] The first control module is used to control the operation of the swing arm motor in order to control the number of reciprocating swings of the swing arm.

[0015] Optionally, the system also includes a protective cover assembly; the protective cover assembly is used to form a closed cavity that isolates the wafer, the two-fluid nozzle and the drying nozzle from the outside when the two-fluid nozzle cleans the wafer adsorbed by the suction cup and / or the drying nozzle sprays dry gas onto the wafer adsorbed by the suction cup.

[0016] Optionally, the protective shield assembly includes:

[0017] The first protective cover is mounted on the machine body in a height-adjustable manner, and the first protective cover has a cavity for covering the suction cup;

[0018] The second protective cover is located above the swing arm, and the second drive assembly is mounted on the second protective cover;

[0019] When the first protective shield moves to contact the second protective shield, the first and second protective shields form a closed cavity.

[0020] Optionally, the two-fluid nozzle is mounted on the swing end of the swing arm, with the nozzle of the two-fluid nozzle facing the surface of the suction cup, so that the turbulence of the mixture ejected by the two-fluid nozzle is perpendicular to the surface of the wafer adsorbed by the suction cup.

[0021] Optionally, the drying nozzle is mounted on the arm of the swing arm, and the angle between the nozzle of the drying nozzle and the surface of the suction cup is 30° to 60°, so that the airflow of the drying gas sprayed by the drying nozzle and the surface of the wafer adsorbed by the suction cup form an angle of 30° to 60°.

[0022] A control method for a wafer cleaning system according to a second aspect of the present invention, applied to the wafer cleaning system described above, includes:

[0023] After the wafer is adsorbed onto the chuck, the chuck rotates axially through the first drive component.

[0024] While the suction cup rotates axially, the swing arm is controlled to swing by the second drive assembly, and the two-fluid nozzle is controlled to spray a mixture of compressed air and liquid onto the wafer adsorbed by the suction cup to clean the surface of the wafer.

[0025] While maintaining the axial rotation of the suction cup and the swing of the swing arm, the drying nozzle is controlled to spray drying gas onto the wafer to remove the liquid adhering to the wafer surface.

[0026] Optionally, before controlling the drying nozzle to spray drying gas onto the wafer to remove liquid adhering to the wafer surface, the method further includes:

[0027] Stop supplying liquid to the two-fluid nozzle until the two-fluid nozzle can only spray compressed air to the wafer, then stop supplying compressed air to the two-fluid nozzle to complete the shutdown control of the two-fluid nozzle.

[0028] According to a third aspect of the present invention, a control device for a wafer cleaning system is applied to the control method of the aforementioned wafer cleaning system. The device comprises:

[0029] The suction cup rotation control module is used to control the axial rotation of the suction cup through the first drive component after the wafer is adsorbed onto the suction cup;

[0030] The two-fluid nozzle control module is used to control the swing arm to swing through the second drive component when the suction cup rotates axially, and to control the two-fluid nozzle to spray a mixture of compressed air and liquid onto the wafer adsorbed by the suction cup to clean the surface of the wafer.

[0031] The drying nozzle control module is used to control the drying nozzle to spray drying gas onto the wafer while maintaining the axial rotation of the suction cup and the swing of the swing arm, so as to remove the liquid adhering to the surface of the wafer.

[0032] According to a fourth aspect of the present invention, a grinding apparatus is provided, wherein the grinding apparatus uses the control method of the wafer cleaning system described above.

[0033] According to a fifth aspect of the present invention, a computer-readable storage medium includes a stored program, wherein the program executes the control method of the wafer cleaning system described above.

[0034] One of the above technical solutions has at least the following advantages or beneficial effects:

[0035] The wafer cleaning system provided by this invention, by mounting both the two-fluid nozzle and the drying nozzle on a swing arm, allows the two-fluid nozzle and the drying nozzle to move as the second driving component drives the swing arm to swing above the wafer adsorbed by the suction cup. This allows the mixture of compressed air and liquid ejected from the two-fluid nozzle and the drying gas ejected from the drying nozzle to sequentially clean and dry the surface of the wafer. This achieves the following: after the two-fluid nozzle cleans the particles attached to the wafer surface, the drying gas dries the cleaned wafer surface, thereby accelerating the drying speed of the wafer surface and improving the cleaning efficiency of the wafer. Attached Figure Description

[0036] Figure 1This diagram illustrates the structure of a wafer cleaning system according to an embodiment of the present invention when the wafer is not being cleaned.

[0037] Figure 2 This diagram illustrates the structure of a wafer cleaning system according to an embodiment of the present invention during wafer cleaning.

[0038] Figure 3 A schematic diagram of the structure of a first driving component according to an embodiment of the present invention is shown;

[0039] Figure 4 A schematic flowchart of a control method for a wafer cleaning system according to an embodiment of the present invention is shown;

[0040] Figure 5 A schematic diagram of a control device for a wafer cleaning system according to an embodiment of the present invention is shown;

[0041] Figure 6 A schematic block diagram of an electronic device according to an embodiment of the present invention is shown.

[0042] Explanation of reference numerals in the attached figures:

[0043] 1. Rotary mechanism; 101. Machine body; 102. Suction cup; 103. First drive assembly; 104. Mist outlet; 105. Drain outlet; 1031. Rotary joint; 1032. Coupling; 1033. Rotary motor.

[0044] 2. Swing arm mechanism, 201. Swing arm, 202. Second drive assembly, 2021. Rotary shaft, 2022. Swing arm motor;

[0045] 3. Two-fluid nozzle;

[0046] 4. Drying nozzle;

[0047] 5. Protective cover assembly, 501. First protective cover, 502. Second protective cover, 503. Telescopic assembly. Detailed Implementation

[0048] To better explain and facilitate understanding of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0049] After the wafer thinning process, silicon powder will cover the wafer surface, affecting the next processing step. Therefore, the wafer must be cleaned immediately after processing.

[0050] In existing technologies, the silicon powder produced after grinding and thinning is very fine and easily adheres to the surface of the wafer. The particles generate adsorption forces, making it difficult to clean. The current common method is to use a water and air mixture to clean the wafer surface through a single two-fluid nozzle. However, due to the merging of the water and air paths connected to the two-fluid nozzle, when drying the wafer surface through the two-fluid nozzle, only the air pipe supplies pressure to the nozzle. This creates a pressure difference at the nozzle nozzle, causing water in the water pipe to be continuously carried out without pressure, resulting in continuous dripping of water from the two-fluid nozzle onto the wafer surface. This leads to incomplete cleaning and drying of the wafer surface through the two-fluid nozzle. At the same time, the two-fluid nozzle generates a large amount of water mist when cleaning the wafer surface, which can easily cause secondary contamination of the wafer.

[0051] To address at least one of the technical problems existing in the prior art or related technologies, this invention provides a wafer cleaning system. The system includes a rotary mechanism, a swing arm mechanism, a two-fluid nozzle, and a drying nozzle. The rotary mechanism includes a body, a suction cup, and a first driving assembly. The suction cup is mounted on the body for adsorbing wafers. The first driving assembly is located within the body and is driven and connected to the suction cup. The swing arm mechanism includes a swing arm and a second driving assembly connected to the swing arm. The swing arm is located above the suction cup, and the second driving assembly drives the swing arm to swing. The two-fluid nozzle is mounted on the swing arm and sprays a mixture of compressed air and liquid onto the wafer adsorbed by the suction cup. The drying nozzle is mounted on the swing arm and sprays drying gas onto the wafer after the two-fluid nozzle has cleaned it. This invention can accelerate the drying speed of the wafer surface and improve the wafer cleaning efficiency by cleaning the particles attached to the wafer surface with the two-fluid nozzle and then drying the cleaned wafer surface with drying gas.

[0052] The following describes, with reference to the accompanying drawings, some embodiments of a wafer cleaning system, a control method for the wafer cleaning system, and an apparatus thereof provided according to the present invention.

[0053] See Figures 1 to 3This invention provides a wafer cleaning system applied to a grinding equipment. The wafer cleaning system includes a rotary mechanism 1, a swing arm mechanism 2, a two-fluid nozzle 3, and a drying nozzle 4. The rotary mechanism 1 includes a body 101, a suction cup 102, and a first driving assembly 103. The suction cup 102 is mounted on the body 101 and used to adsorb wafers. The first driving assembly 103 is located inside the body 101 and is drivenly connected to the suction cup 102. The swing arm mechanism 2 includes a swing arm 201 and a... The second drive assembly 202 is connected to the drive assembly 01. The swing arm 201 is located above the suction cup 102. The second drive assembly 202 is used to drive the swing arm 201 to swing. The two-fluid nozzle 3 is provided on the swing arm 201. The two-fluid nozzle 3 is used to spray a mixture of compressed air and liquid onto the wafer adsorbed by the suction cup 102. The drying nozzle 4 is provided on the swing arm 201. The drying nozzle 4 is used to spray drying gas onto the wafer adsorbed by the suction cup 102 after the two-fluid nozzle 3 has cleaned it.

[0054] Here, the swing arm 201 is arranged parallel to the upper surface of the suction cup 102, and when the second drive assembly 202 drives the swing arm 201 to swing, the two-fluid nozzle 3 can move with the swing arm 201 to a position directly above the edge of the wafer on the suction cup 102.

[0055] It should be noted that the liquid in the mixture sprayed by the two-fluid nozzle 3 can be either water or a cleaning agent.

[0056] Further, see Figure 3 The first drive assembly 103 includes a rotary joint 1031, a coupling 1032, and a rotary motor 1033. The first end of the rotary joint 1031 is connected to the bottom of the suction cup 102, and the second end of the rotary joint 1031 is connected to the rotary motor 1033 through the coupling 1032. The rotary motor 1033 is used to drive the rotary joint 1031 to rotate, so as to drive the suction cup 102 to rotate.

[0057] In this embodiment, by mounting both the two-fluid nozzle 3 and the drying nozzle 4 on the swing arm 201, the two-fluid nozzle 3 and the drying nozzle 4 can be moved by the second driving component 202 driving the swing arm 201 to swing above the wafer adsorbed by the suction cup 102. This allows the mixture of compressed air and liquid ejected by the two-fluid nozzle 3 and the drying gas ejected by the drying nozzle 4 to sequentially clean and dry the surface of the wafer. This achieves the following: after the two-fluid nozzle 3 cleans the particles attached to the wafer surface, the drying gas is used to dry the cleaned wafer surface, thereby accelerating the drying speed of the wafer surface and improving the cleaning efficiency of the wafer.

[0058] In some possible implementations, the second drive assembly 202 includes a rotary shaft 2021, a swing arm motor 2022, and a first control module. One end of the rotary shaft 2021 is connected to the swing arm 201; the other end of the rotary shaft 2021 is driven to the swing arm motor 2022, which is used to drive the swing arm 201 to swing. The first control module is used to control the operation of the swing arm motor 2022 to control the number of reciprocating swings of the swing arm 201.

[0059] Here, the rotation axis 2021 is located directly above a portion of the edge of the suction cup 102, and the length of the swing arm 201 is not less than the radius of the suction cup 102. When the swing arm motor 2022 is not controlling the swing arm 201 to swing, the swing arm 201 is located on a first straight line, which is parallel to the upper surface of the suction cup 102, and the projection of the first straight line onto the suction cup 102 can at least partially coincide with a diameter of the suction cup 102. When the swing arm motor 2022 controls the swing arm 201 to swing, the swing arm 201 can swing left and right with the first straight line as the axis of symmetry. Furthermore, the axial direction of the rotation axis 2021 is perpendicular to the plane containing the suction cup 102.

[0060] It should be noted that when the first control module controls the swing motor to work, it can control the number of reciprocating swings of the swing arm 201 according to the control command. For example, when the two-fluid nozzle 3 sprays a mixture of compressed air and liquid onto the wafer adsorbed by the suction cup 102, the first control module controls the swing arm motor 2022 to make the swing arm 201 reciprocate 4 times; or when the drying nozzle 4 sprays drying gas onto the wafer, the first control module controls the swing arm motor 2022 to make the swing arm 201 reciprocate 2 times.

[0061] In this embodiment, by selecting the second drive component 202 as a structure including a rotary shaft 2021, a swing arm motor 2022 and a first control module, the swing arm motor 2022 can be controlled by the first control module, which can control the number of reciprocating swings of the swing arm 201, thereby facilitating the movement control of the two-fluid nozzle 3 and the drying nozzle 4 located on the swing arm 201 by the operator.

[0062] Furthermore, the cleaning system also includes a protective cover assembly 5; when the two-fluid nozzle 3 cleans the wafer adsorbed by the suction cup 102 and / or the drying nozzle 4 sprays dry gas onto the wafer adsorbed by the suction cup 102, the protective cover assembly 5 is used to form a closed cavity that isolates the wafer, the two-fluid nozzle 3 and the drying nozzle 4 from the outside.

[0063] It should be noted that before the two-fluid nozzle 3 cleans the wafer adsorbed by the suction cup 102, the protective cover assembly 5 does not form a closed cavity to facilitate placing the wafer on the suction cup 102. In addition, after the drying nozzle 4 completes the drying process of the wafer adsorbed by the suction cup 102, the closed cavity of the protective cover assembly 5 can be opened to facilitate removing the wafer from the suction cup 102.

[0064] In this embodiment, by setting the protective cover assembly 5, the wafer adsorbed by the suction cup 102 can be cleaned and dried in the closed cavity formed by the two-fluid nozzle 3 and the drying nozzle 4, thereby preventing the mixture sprayed by the two-fluid nozzle 3 and the drying gas sprayed by the drying nozzle 4 from interfering with other parts of the cleaning system.

[0065] Furthermore, the protective cover assembly 5 includes a first protective cover 501 and a second protective cover 502. The first protective cover 501 is vertically mounted on the body 101 and has a cavity for covering the suction cup 102. The second protective cover 502 is located above the swing arm, and the second drive assembly is mounted on the second protective cover 502, that is, the rotary shaft 2021 is mounted on the second protective cover 502. When the first protective cover 501 moves to contact the second protective cover 502, the first protective cover 501 and the second protective cover 502 form a closed cavity.

[0066] Here, the first protective cover 501 can be a cylindrical structure, and the second protective cover 502 can be a disc-shaped structure. The contact between the second protective cover 502 and the first protective cover 501 can be understood as the bottom of the side wall of the second protective cover 502 contacting and fitting with the top of the first protective cover 501, so that a closed cavity is formed between the first protective cover 501, the second protective cover 502, and the suction cup 102.

[0067] It should be noted that the first protective cover 501 can be connected to the telescopic component 503, which is vertically arranged on the plane where the suction cup 102 is located, so that the first protective cover 501 can move along its length direction under the drive of the telescopic component 503, thereby allowing the first protective cover 501 to be raised and lowered on the machine body 101 along its axial direction.

[0068] The wafer cleaning system also includes a second control module. This second control module controls the telescopic assembly 503 to raise the first protective cover 501 after the suction cup 102 has picked up the wafer. Once the first protective cover 501 reaches a first preset height (i.e., the bottom of the sidewall of the second protective cover 502 contacts the top of the first protective cover 501), the telescopic assembly 503 stops raising the first protective cover 501. After the drying nozzle 4 finishes spraying drying gas onto the wafer, the second control module also controls the telescopic assembly 503 to lower the first protective cover 501 until it reaches a second preset height (i.e., the top of the first protective cover 501 is no higher than the height of the suction cup 102).

[0069] In addition, an ion fan is provided on the first protective cover 501. The ion fan is located directly above the suction cup 102. The ion fan is used to blow ion airflow onto the surface of the wafer adsorbed by the suction cup 102 to eliminate static electricity on the wafer surface.

[0070] In this embodiment, by mounting a first protective cover 501 with a cavity for covering the suction cup 102 on the machine body 101 in a height-adjustable manner, and mounting a second protective cover 502 located above the swing arm on the rotary shaft 2021, it is possible to control the lifting and lowering of the first protective cover 501 on the machine body 101 so that the enclosed cavity formed by the second protective cover 502 and the first protective cover 501 can isolate the wafer, the two-fluid nozzle 3 and the drying nozzle 4 from the outside world.

[0071] In some feasible embodiments, the two-fluid nozzle 3 is mounted on the swing end of the swing arm 201, and the nozzle of the two-fluid nozzle 3 is positioned facing the surface of the suction cup 102 so that the turbulence of the mixture ejected by the two-fluid nozzle 3 is perpendicular to the surface of the wafer adsorbed by the suction cup 102.

[0072] It should be noted that the axial direction of the pipe located on the two-fluid nozzle 3 and connected to the nozzle of the two-fluid nozzle 3 is perpendicular to the plane where the suction cup 102 is located; in addition, the orifice surface of the nozzle of the two-fluid nozzle 3 is parallel to the surface of the suction cup 102.

[0073] In this embodiment, by installing the two-fluid nozzle 3 at the swing end of the swing arm 201, the two-fluid nozzle 3 can swing with the swing arm 201, so that the two-fluid nozzle 3 installed at the swing end has the largest movement trajectory during one swing of the swing arm 201 compared to the two-fluid nozzle 3 installed at other positions of the swing arm 201. Therefore, by installing the two-fluid nozzle 3 at the swing end of the swing arm 201, the turbulence of the mixture ejected by the two-fluid nozzle 3 during one swing of the swing arm 201 is maximized. The movement trajectory cleans the surface of the wafer, thereby improving the cleaning efficiency of the turbulent flow of the mixture ejected by the two-fluid nozzle 3 on the wafer. At the same time, by setting the nozzle of the two-fluid nozzle 3 toward the surface of the suction cup 102, the turbulent flow of the mixture ejected by the two-fluid nozzle 3 is perpendicular to the surface of the wafer adsorbed by the suction cup 102. This allows the turbulent flow of the mixture ejected by the two-fluid nozzle 3 to act on the surface of the wafer through the shortest path, thereby improving the cleaning efficiency of the turbulent flow of the mixture ejected by the two-fluid nozzle 3 on the surface of the wafer.

[0074] Furthermore, the drying nozzle 4 is mounted on the arm of the swing arm 201, and the angle between the nozzle of the drying nozzle 4 and the surface of the suction cup 102 is 30°~60°, so that the airflow of the drying gas sprayed by the drying nozzle 4 and the surface of the wafer adsorbed by the suction cup 102 form an angle of 30°~60°.

[0075] Here, the nozzle of the drying nozzle 4 gradually tilts towards the swing end of the swing arm 201 from bottom to top along the height direction.

[0076] It should be noted that the angle between the axial direction of the pipe located on the drying nozzle 4 and connected to the nozzle of the drying nozzle 4 and the plane where the suction cup 102 is located is a preset angle, which is any value between 30° and 60°; in addition, the angle between the orifice surface of the nozzle of the drying nozzle 4 and the surface of the suction cup 102 is also a preset angle, which is any value between 30° and 60°.

[0077] In this embodiment, by mounting the drying nozzle 4 on the arm of the swing arm 201 and setting the angle between the nozzle of the drying nozzle 4 and the surface of the suction cup 102 to 30°~60°, the range of the airflow of the drying gas sprayed by the drying nozzle 4 can be extended, thereby increasing the contact area between the airflow of the drying gas sprayed by the drying nozzle 4 and the wafer, and thus improving the drying efficiency of the airflow of the drying gas sprayed by the drying nozzle 4 on the surface of the wafer.

[0078] Furthermore, when the two-fluid nozzle 3 sprays a mixture of compressed air and liquid onto the wafer adsorbed by the chuck 102, the distance between the nozzle of the two-fluid nozzle 3 and the surface of the chuck 102 is 25~30mm.

[0079] Here, the distance between the nozzle of the two-fluid nozzle 3 and the surface of the suction cup 102 is controlled to be 25~30mm. This allows the two-fluid nozzle 3 to spray a mixture of compressed air and liquid onto the wafer adsorbed by the suction cup 102, which can act on the surface of the wafer and clean the surface of the wafer, thereby improving the cleaning efficiency of the wafer.

[0080] Furthermore, when the drying nozzle 4 sprays drying gas onto the wafer adsorbed by the suction cup 102, the distance between the nozzle of the drying nozzle 4 and the surface of the suction cup 102 is 25~30mm.

[0081] Here, the distance between the nozzle of the drying nozzle 4 and the surface of the suction cup 102 is controlled to be 25~30mm. This allows the drying gas sprayed by the drying nozzle 4 onto the wafer adsorbed by the suction cup 102 to act on the surface of the wafer and dry the surface of the wafer, thereby improving the drying efficiency of the wafer.

[0082] In some feasible embodiments, the body 101 is provided with a mist exhaust port 104 and a drain port 105. The mist exhaust port 104 is located on the side wall of the body 101 and is disposed near the top of the body 101, while the drain port 105 is disposed at the bottom of the body 101.

[0083] Since the turbulent flow of the mixture ejected by the two-fluid nozzle 3 is a liquid mist atomized from liquid, this liquid mist can easily enter the interior of the housing 101. Therefore, a mist outlet 104 is provided on the housing 101, and the mist outlet 104 is located on the side wall of the housing 101 and near the top of the housing 101 to facilitate the discharge of the liquid mist inside the housing 101. This ensures that when the drying nozzle 4 dries the wafer, the liquid mist in the housing 101 flows towards the surface of the suction cup 102, thus affecting the drying of the wafer by the drying gas. At the same time, in order to quickly discharge the liquid accumulated inside the housing 101, a drain outlet 105 is also provided at the bottom of the housing 101 to facilitate the discharge of liquid inside the housing 101, thereby reducing the water molecule content inside the housing 101.

[0084] See Figure 4 An embodiment of the present invention provides a control method for a wafer cleaning system, applied to the wafer cleaning system described above. The method includes:

[0085] S110. After the wafer is adsorbed onto the chuck, the chuck is rotated axially by the first drive component.

[0086] Here, the rotational speed of suction cup 102 must not be less than 1500 rpm.

[0087] S120. While the suction cup rotates axially, the swing arm is controlled to swing by the second drive assembly, and the two-fluid nozzle is controlled to spray a mixture of compressed air and liquid onto the wafer adsorbed by the suction cup to clean the surface of the wafer.

[0088] In this step, while keeping the wafer rotating axially with the chuck 102, the swing arm 201 is controlled to swing by the second drive assembly 202. This allows the two-fluid nozzle 3 to spray a mixture of compressed air and liquid onto the rotating wafer in a moving state as the swing arm 201 swings, thereby cleaning the surface of the wafer.

[0089] S130. While maintaining the axial rotation of the suction cup and the swing of the swing arm, control the drying nozzle to spray drying gas onto the wafer to remove the liquid adhering to the surface of the wafer.

[0090] Here, while keeping the wafer rotating axially with the chuck 102, the swing arm 201 is controlled to swing by the second drive assembly 202, so that the drying nozzle 4 sprays drying gas onto the rotating wafer in a moving state as it swings with the swing arm 201, in order to remove the liquid adhering to the surface of the wafer.

[0091] Using the above method, when the chuck 102 drives the wafer to rotate axially, the second drive component 202 controls the swing arm 201 to swing, and controls the two-fluid nozzle 3 to spray a mixture of compressed air and liquid onto the wafer adsorbed by the chuck 102 to clean the surface of the wafer; while maintaining the axial rotation of the chuck 102 and the swing arm 201, the drying nozzle 4 is controlled to spray drying gas onto the wafer, which can accelerate the drying speed of the wafer surface and thus improve the cleaning efficiency of the wafer.

[0092] In some possible embodiments, before controlling the drying nozzle 4 to spray drying gas onto the wafer to remove liquid adhering to the wafer surface, the method further includes: stopping the supply of liquid to the two-fluid nozzle 3 until the two-fluid nozzle 3 can only spray compressed air onto the wafer, and then stopping the supply of compressed air to the two-fluid nozzle 3 to complete the shutdown control of the two-fluid nozzle 3.

[0093] Here, when the two-fluid nozzle 3 is closed, by first stopping the supply of liquid to the two-fluid nozzle 3, a small amount of liquid in the two-fluid nozzle 3 can flow to the wafer surface under the pressure of the air supply line. The small amount of liquid in the two-fluid nozzle 3 can also be atomized under the pressure of the air supply line to clean the wafer surface. Then, after the two-fluid nozzle 3 can only spray compressed air to the wafer, the supply of compressed air to the two-fluid nozzle 3 is stopped. This can prevent water in the water supply line from continuously flowing to the wafer through the two-fluid nozzle 3, which would lead to excessive water accumulation on the wafer surface and the formation of water stains.

[0094] Figure 5 This is a schematic diagram of a control device for a wafer cleaning system according to an embodiment of the present invention, as shown below. Figure 5 As shown, a control device for a wafer cleaning system is applied to the control method of the aforementioned wafer cleaning system. The device includes:

[0095] The suction cup rotation control module 510 is used to control the axial rotation of the suction cup through the first drive component after the wafer is adsorbed onto the suction cup.

[0096] The two-fluid nozzle control module 520 is used to control the swing arm to swing through the second drive component when the suction cup rotates axially, and to control the two-fluid nozzle to spray a mixture of compressed air and liquid onto the wafer adsorbed by the suction cup to clean the surface of the wafer.

[0097] The drying nozzle control module 530 is used to control the drying nozzle to spray drying gas onto the wafer while maintaining the axial rotation of the suction cup and the swing of the swing arm, so as to remove the liquid adhering to the surface of the wafer.

[0098] In some possible embodiments, the device further includes:

[0099] The two-fluid nozzle shut-off module is used to stop supplying liquid to the two-fluid nozzle until the two-fluid nozzle can only spray compressed air to the wafer, and then stop supplying compressed air to the two-fluid nozzle to complete the shut-off control of the two-fluid nozzle.

[0100] This disclosure provides an embodiment of a polishing apparatus. Optionally, the polishing apparatus includes a memory for storing processor-executable instructions; a processor configured to execute the executable instructions in the memory to implement the steps of the control method for the wafer cleaning system provided in this disclosure.

[0101] Figure 6 This is a schematic block diagram of an electronic device 1100 according to an embodiment of the present invention.

[0102] like Figure 6 As shown, the electronic device 1100 may include a grinding device, and the electronic device 1100 may further include:

[0103] The system includes a memory 1101 and a processor 1102. The memory 1101 stores computer programs and transfers the program code to the processor 1102. In other words, the processor 1102 can retrieve and run the computer programs from the memory 1101 to implement the methods described in the embodiments of the present invention.

[0104] For example, the processor 1102 can be used to execute the above-described method embodiments according to instructions in the computer program.

[0105] In some embodiments of the present invention, the electronic device 1100 may include, but is not limited to:

[0106] General-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc.

[0107] In some embodiments of the present invention, the memory 1101 includes, but is not limited to:

[0108] Volatile memory and / or non-volatile memory. Non-volatile memory can be read-only memory (ROM), programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM), or flash memory. Volatile memory can be random access memory (RAM), used as an external cache. By way of example, but not limitation, many forms of RAM are available, such as Static RAM (SRAM), Dynamic RAM (DRAM), Synchronous DRAM (SDRAM), Double Data Rate SDRAM (DDR SDRAM), Enhanced Synchronous DRAM (ESDRAM), Synchronous Link DRAM (SLDRAM), and Direct Rambus RAM (DR RAM).

[0109] In some embodiments of the present invention, the computer program may be divided into one or more modules, which are stored in the memory 1101 and executed by the processor 1102 to perform the method provided by the present invention. The one or more modules may be a series of computer program instruction segments capable of performing a specific function, which describe the execution process of the computer program in the controller.

[0110] like Figure 6 As shown, the electronic device 1100 may further include:

[0111] Transceiver 1103, which can be connected to processor 1102 or memory 1101.

[0112] The processor 1102 can control the transceiver 1103 to communicate with other devices; specifically, it can send information or data to other devices or receive information or data sent by other devices. The transceiver 1103 may include a transmitter and a receiver. The transceiver 1103 may further include antennas, and the number of antennas may be one or more.

[0113] It should be understood that the various components in the electronic device are connected through a bus system, which includes a data bus, a power bus, a control bus, and a status signal bus.

[0114] The present invention also provides a computer storage medium having a computer program stored thereon, which, when executed by a computer, enables the computer to perform the methods of the above-described method embodiments. Alternatively, one embodiment of the present invention also provides a computer program product containing instructions that, when executed by a computer, cause the computer to perform the methods of the above-described method embodiments.

[0115] When implemented using software, it can be implemented entirely or partially as a computer program product. This computer program product includes one or more computer instructions. When these computer program instructions are loaded and executed on a computer, all or part of the processes or functions described in the embodiments of the present invention are generated. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions can be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another. For example, the computer instructions can be transmitted from one website, computer, server, or data center to another via wired (e.g., coaxial cable, fiber optic, Digital Subscriber Line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) means. The computer-readable storage medium can be any available medium accessible to a computer or a data storage device such as a server or data center that integrates one or more available media. The available medium can be a magnetic medium (e.g., floppy disk, hard disk, magnetic tape), an optical medium (e.g., Digital Video Disc (DVD)), or a semiconductor medium (e.g., Solid State Disk (SSD)).

[0116] Those skilled in the art will recognize that the modules and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementations should not be considered beyond the scope of this invention.

[0117] In the several embodiments provided by this invention, it should be understood that the disclosed systems, apparatuses, and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of modules is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple modules or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between devices or modules may be electrical, mechanical, or other forms.

[0118] The modules described as separate components may or may not be physically separate. The components shown as modules may or may not be physical modules; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs. For example, the functional modules in the various embodiments of this application may be integrated into one processing module, or each module may exist physically separately, or two or more modules may be integrated into one module.

[0119] The above are merely specific embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A wafer cleaning system, applied to grinding equipment, characterized in that, include: The rotary mechanism includes a body, a suction cup, and a first driving component. The suction cup is disposed on the body and is used to adsorb wafers. The first driving component is disposed inside the body and is drivenly connected to the suction cup. A swing arm mechanism includes a swing arm and a second drive assembly connected to the swing arm. Both the swing arm and the second drive assembly are located above the suction cup. The second drive assembly is used to drive the swing arm to swing. A two-fluid nozzle is provided on the swing arm, and the two-fluid nozzle is used to spray a mixture of compressed air and liquid onto the wafer adsorbed by the suction cup; A drying nozzle is mounted on the swing arm. The drying nozzle is used to spray drying gas onto the wafer after the two-fluid nozzle has cleaned the wafer adsorbed by the suction cup. The system also includes a protective cover assembly; when the two-fluid nozzle cleans the wafer adsorbed by the suction cup, and / or the drying nozzle sprays dry gas onto the wafer adsorbed by the suction cup, the protective cover assembly is used to form a closed cavity that isolates the wafer, the two-fluid nozzle and the drying nozzle from the outside. The protective shield assembly includes: A first protective cover is mounted on the machine body in a height-adjustable manner, and the first protective cover has a cavity for covering the suction cup; The second protective cover is located above the swing arm, and the second drive assembly is mounted on the second protective cover; When the first protective cover moves to contact the second protective cover, the first protective cover and the second protective cover form a closed cavity.

2. The wafer cleaning system according to claim 1, characterized in that, The two-fluid nozzle is installed at the swing end of the swing arm, and the nozzle of the two-fluid nozzle is positioned facing the surface of the suction cup so that the turbulence of the mixture ejected by the two-fluid nozzle is perpendicular to the surface of the wafer adsorbed by the suction cup.

3. The wafer cleaning system according to claim 2, characterized in that, The drying nozzle is mounted on the arm of the swing arm, and the angle between the nozzle of the drying nozzle and the surface of the suction cup is 30° to 60°, so that the airflow of the drying gas sprayed by the drying nozzle forms an angle of 30° to 60° with the surface of the wafer adsorbed by the suction cup.

4. A control method for a wafer cleaning system, characterized in that, The method, applied to the wafer cleaning system according to any one of claims 1 to 3, comprises: After the wafer is adsorbed onto the chuck, the chuck is rotated axially by the first drive component. When the suction cup rotates axially, the second drive assembly controls the swing arm to swing and controls the two-fluid nozzle to spray a mixture of compressed air and liquid onto the wafer adsorbed by the suction cup to clean the surface of the wafer. While maintaining the axial rotation of the suction cup and the swing of the swing arm, the drying nozzle is controlled to spray drying gas onto the wafer to remove liquid adhering to the wafer surface.

5. The control method for the wafer cleaning system according to claim 4, characterized in that, Before controlling the drying nozzle to spray drying gas onto the wafer to remove liquid adhering to the wafer surface, the method further includes: Stop supplying liquid to the two-fluid nozzle until the two-fluid nozzle only sprays compressed air to the wafer, then stop supplying compressed air to the two-fluid nozzle to complete the shut-off control of the two-fluid nozzle.

6. A control device for a wafer cleaning system, characterized in that, The control method applied to the wafer cleaning system of claim 4 or 5, the apparatus comprising: The suction cup rotation control module is used to control the axial rotation of the suction cup through the first drive component after the wafer is adsorbed onto the suction cup; The two-fluid nozzle control module is used to control the swing arm to swing through the second drive component when the suction cup rotates axially, and to control the two-fluid nozzle to spray a mixture of compressed air and liquid onto the wafer adsorbed by the suction cup to clean the surface of the wafer. The drying nozzle control module is used to control the drying nozzle to spray drying gas onto the wafer while maintaining the axial rotation of the suction cup and the swing of the swing arm, so as to remove the liquid adhering to the surface of the wafer.

7. A grinding apparatus, characterized in that, The grinding equipment uses the control method of the wafer cleaning system described in claim 4 or 5.

8. A computer-readable storage medium, characterized in that, The computer-readable storage medium includes a stored program, wherein the program executes the control method of the wafer cleaning system according to claim 4 or 5.

Images