Surge protector glue pouring packaging method and surge protector thereof

Abstract

The invention discloses a surge protector glue pouring packaging method and a surge protector thereof, and belongs to the technical field of electronic device packaging, the method comprises the following steps: pretreatment: cleaning and drying the interior of the surge protector; processing before glue filling: filling a filler into the surge protector; the method comprises the following steps: placing a surge protector in a vacuum environment, injecting potting glue, injecting the potting glue through a glue injection hole, placing the surge protector in a vacuumizer for vacuumizing, and placing the surge protector filled with the glue in the step 3 in a constant temperature box for curing. The filler is ensured to be uniformly distributed and completely cover internal components, and bubbles and gaps are avoided.

Description

Technical Field

[0001] This invention belongs to the field of electronic device packaging technology, specifically to a packaging method for potting an improved surge protector, which is particularly suitable for power system surge protection devices that require a high protection level (IP68). Background Technology

[0002] Surge protectors are devices used to protect equipment from surge voltage impacts. They are widely used in power systems, communication equipment, and industrial control. However, traditional surge protectors are prone to failure in harsh environments, mainly because their internal components lack effective protection.

[0003] The existing potting process for surge protectors typically uses a simple filling method, which cannot ensure uniform distribution of the adhesive and may contain air bubbles or voids, affecting the performance and reliability of the protector. Therefore, an improved potting method is needed to enhance the environmental adaptability and service life of surge protectors. Summary of the Invention

[0004] To address the problems mentioned in the background art, the present invention provides a surge protector encapsulation method for potting and a surge protector thereof. By optimizing the potting process, the method ensures that the adhesive is evenly distributed and completely covers the internal components, thereby producing a surge protector with improved waterproof, dustproof, and shockproof performance.

[0005] To achieve the above objectives, the present invention provides a method for potting a surge protector, a method for encapsulating a surge protector, comprising: Step 1, pretreatment: cleaning and drying the inside of the surge protector; Step 2, pretreatment before potting: filling the surge protector with filler; Step 3, injecting potting compound through the injection hole, and then placing the surge protector in a vacuum chamber for vacuuming; Step 4, placing the surge protector after potting in Step 3 in a constant temperature chamber for curing.

[0006] The preferred embodiment is as follows: In step two, the surge protector to be potted consists of an upper cover and a lower housing. The surge protector is placed into the lower housing, the filler is poured in, and then the upper cover is put on.

[0007] The preferred option is that, during the glue-filling process in step three, the amount of glue injected can be checked by ultrasound or through the gap in the terminal (glue-filling hole) to see if the amount of glue injected meets the standard.

[0008] The preferred embodiment is that the filler in step two is the same as the potting material in step three.

[0009] The preferred embodiment is as follows: In step four, the surge protector after potting is placed in a constant temperature chamber and cured at 60-80℃ for 2-4 hours. The specific temperature and time are adjusted according to the specific characteristics of the potting material.

[0010] The present invention also includes a surge protector, which is made by the potting method of the present invention, comprising a lower housing and an upper cover, wherein the surge protector encapsulated with potting compound is located in the lower housing, and the upper cover has a potting (injection) hole for vacuum potting injection port.

[0011] Compared with the prior art, the beneficial effects of the present invention are:

[0012] 1. The present invention uses the method of injecting filler through injection holes and vacuum infusion to ensure that the filler is evenly distributed and completely covers the internal components, thus avoiding the generation of bubbles and voids.

[0013] 2. The filler of the present invention is a potting material, which has good insulation, high temperature resistance and shock resistance, and is suitable for harsh environments.

[0014] 3. This potting process is simple and efficient, and can significantly improve the waterproof, dustproof and shockproof performance of surge protectors, extending their service life. Attached Figure Description

[0015] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a process flow diagram of the encapsulation method for potting surge protectors proposed in this invention;

[0017] Figure 2 This is a schematic diagram of the surge protector package of the present invention;

[0018] Figure 3 This is a packaging effect diagram of a product packaged using the prior art of this invention;

[0019] Figure 4 This is a rendering of the surge protector after it has been packaged according to the present invention.

[0020] Figure label:

[0021] 10... Surge protector

[0022] 11……Upper Cover

[0023] 111……Dip hole

[0024] 12……Lower shell Detailed Implementation

[0025] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0026] like Figure 1 As shown, the encapsulation method of the present invention includes: Step 1, pretreatment: cleaning and drying the inside of the surge protector; Step 2, pretreatment before potting: filling the surge protector with filler; Step 3, placing the surge protector in a vacuum environment and injecting potting compound; injecting potting compound through the injection hole, and then placing the surge protector in a vacuum pump to evacuate the vacuum; Step 4, placing the surge protector after potting in Step 3 in a constant temperature chamber for curing.

[0027] In step three, during the glue-filling process, the amount of glue injected can be checked by ultrasound or through the terminal gap (glue injection hole) to see if the standard is met.

[0028] To achieve excellent curing and encapsulation effects without bubble formation during the curing process, the filler in step two and the potting material in step three are the same, which can be silicone filler and potting adhesive, also silicone. The adhesive used is modified epoxy resin or modified polyurethane. Modified epoxy resin or modified polyurethane has excellent waterproof performance, forming a dense structure after curing that effectively blocks moisture penetration; good mechanical strength and shock resistance, high hardness, and the ability to withstand vibration and impact; good electrical insulation to ensure normal operation of the SPD; resistance to chemical corrosion, resisting corrosive substances such as acids, alkalis, and salts; and ease of processing: it can be encapsulated through a filling method.

[0029] In this embodiment, in step four, the surge protector after being potted with modified epoxy resin is placed in a constant temperature chamber and cured at 60-80℃ for 2.5 hours to achieve complete curing.

[0030] like Figure 2 As shown, the surge protector 10 encapsulated in this invention has the following structure: Figure 2 As shown: The surge protector 10 includes an upper cover 11 and a lower housing 12. The surge protector encapsulated with potting compound is located inside the lower housing 12. The upper cover 11 has a potting hole 111 for vacuum potting.

[0031] like Figure 3 As shown, the existing packaging process is simple: potting, filling, and finally covering. However, it is clear that the packaging cannot achieve uniformity, and there is also glue overflow around the device, which cannot guarantee the stability of the device.

[0032] Figure 4For the present invention, the lower shell 12 is first filled with a portion of the filler material, and then the upper cover 11 is covered. Then, the glue is poured in through the glue-pouring hole 111 on the upper cover 11. Since the glue-pouring process is completed in a vacuum environment, the glue-pouring is more uniform.

[0033] The surge protector packaged using the prior art of this invention and the surge protector packaged using this invention were evaluated respectively, and the test results are shown in Table 1.

[0034] Table 1 Test Results

[0035]

[0036] As shown in Table 1, the existing encapsulation technology of this invention has strong anti-aging ability, good weather resistance, and strong impact resistance; it has excellent resistance to thermal changes and thermal conductivity, can be used in a wide operating temperature range, can maintain elasticity and not crack in a temperature range of -60℃ to 200℃, can be used for a long time at 250℃, and the temperature resistance of the heat-cured type is even higher. It has excellent electrical properties and insulation ability, and its insulation performance is better than that of epoxy resin, and it can withstand voltages of over 10000V. However, the encapsulation cannot completely seal with the shell, the process is complex, and the waterproof rating only reaches IP67.

[0037] As shown in Table 1, the encapsulation technology of this invention exhibits strong anti-aging capabilities, good weather resistance, and strong impact resistance. It provides a complete seal, excellent resistance to thermal changes and thermal conductivity, and can be used over a wide operating temperature range. It maintains elasticity and does not crack within a temperature range of -60℃ to 200℃, and can be used continuously at 250℃. The heat-curing type offers even higher temperature resistance. It also possesses excellent electrical and insulation properties, with better insulation performance than epoxy resin, and can withstand voltages exceeding 10,000V. Furthermore, the encapsulation ensures a complete seal with the outer shell, the process is simple, and the waterproof rating reaches IP68 or higher.

[0038] Compared with the prior art, the beneficial effects of the present invention are:

[0039] 1. The present invention uses the method of injecting filler through injection (glue) holes and vacuum potting to ensure that the filler is evenly distributed and completely covers the internal components, thus avoiding the generation of bubbles and voids.

[0040] 2. The filler of the present invention is a potting material, which has good insulation, high temperature resistance and shock resistance, and is suitable for harsh environments.

[0041] 3. This potting process is simple and efficient, and can significantly improve the waterproof, dustproof, and shockproof performance of surge protectors.

[0042] Extend its service life.

[0043] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

[0044] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the above-described division of functional units and modules is merely an example. In practical applications, the above functions can be assigned to different functional units and modules as needed, that is, the internal structure of the system can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiments can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit. Furthermore, the specific names of the functional units and modules are only for easy differentiation and are not intended to limit the scope of protection of this application. The specific working process of the units and modules in the above-described wireless terminal can be referred to the corresponding process in the foregoing method embodiments, and will not be repeated here.

[0045] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail or recorded in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0046] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementations should not be considered beyond the scope of this invention.

[0047] In the embodiments provided by this invention, it should be understood that the disclosed systems / terminal devices and methods can be implemented in other ways. For example, the system / terminal device embodiments described above are merely illustrative. For instance, the division of modules or units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through pins; the indirect coupling or communication connection between systems or units may be electrical, mechanical, or other forms.

[0048] The above-described embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included within the protection scope of the present invention.

Claims

1. A method for encapsulating a surge protector with potting compound, characterized in that, include: Step 1, Pre-treatment: Clean and dry the inside of the surge protector; Step 2, Pre-filling treatment: Fill the surge protector with filler material first; Step 3: Inject glue through the glue injection hole, and then place the surge protector in a vacuum pump to create a vacuum. Step 4: Place the surge protector, after applying the adhesive in Step 3, in a constant temperature chamber for curing.

2. The encapsulation method for a surge protector with potting compound according to claim 1, characterized in that, In step two, the surge protector that needs to be filled with glue consists of an upper cover and a lower housing. The surge protector is placed into the lower housing, the filler is poured in, and then the upper cover is put on.

3. The encapsulation method for a surge protector with potting compound according to claim 1, characterized in that, During the third step of the glue-filling process, the amount of glue injected is checked by ultrasound or through the glue-filling hole in the terminal gap to see if the standard is met.

4. The encapsulation method for a surge protector with potting compound according to claim 1, characterized in that, The filler in step two may be the same as or different from the potting material in step three.

5. The encapsulation method for a surge protector with potting compound according to claim 4, characterized in that, The filler in step two and the potting material in step three are modified epoxy resin or modified polyurethane.

6. The encapsulation method for a surge protector with potting compound according to claim 1, characterized in that, In step four, the surge protector after potting is placed in a constant temperature chamber and cured at 60-80℃ for 2-4 hours. The specific temperature and time are adjusted according to the specific characteristics of the potting material.

7. A surge protector, comprising the method described in claims 1-6, characterized in that, The device includes a lower housing and a upper cover. A surge protection device encapsulated with potting compound is located inside the lower housing, and the upper cover has a potting hole for vacuum potting.

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