Liquid ejecting head, liquid ejecting apparatus, and method of manufacturing liquid ejecting head

Abstract

The invention relates to a liquid ejecting head, a liquid ejecting apparatus, and a method of manufacturing the liquid ejecting head. The liquid ejecting head includes: a liquid ejecting substrate configured to have a hole surface provided with an ejecting hole that ejects a liquid; a surface cover configured to be bonded to the liquid ejection substrate and protect the hole surface; and a support member configured to support the face cover, in which the support member is provided with a groove in a surface engaged with the face cover, the groove partially overlapping the face cover when viewed from a direction perpendicular to the hole face, and in which the support member is configured to support the face cover, the liquid ejecting head includes a resin provided above the groove and a space surrounded by the support member and the surface cover, the resin forming an inclined surface toward the hole surface.

Description

Technical Field

[0001] This invention relates to a liquid jet head, a liquid jetting device, and a method for manufacturing the liquid jet head. Background Technology

[0002] A liquid jetting head includes a liquid jetting substrate with jetting orifices for jetting liquid. The liquid jetting substrate is typically mounted on a support member, which also functions as a flow path member for supplying the liquid. The liquid jetting substrate jets the supplied liquid from the jetting orifices and performs recording on a recording medium. During the transport of the recording medium, if the end of the recording medium is bent (curled), the end of the recording medium may come into contact with the side of the liquid jetting head, potentially causing a paper jam.

[0003] As a method to prevent the aforementioned problems, Japanese Patent Application Publication No. 2023-66364 discusses a liquid ejection head, which includes: a nozzle plate having a nozzle (ejection orifice) for ejecting liquid to a target; a nozzle protection member covering at least a portion of a nozzle surface (excluding the nozzle) of the nozzle plate, the nozzle surface facing the liquid ejection direction; and a nozzle protection member retaining member having a peripheral wall portion that engages with the nozzle protection member. In this liquid ejection head, a resin member is provided between the side of the nozzle protection member that engages with the nozzle protection member retaining member and the surface of the peripheral wall portion facing the liquid ejection direction. Even if the end of the recording medium bends, this structure allows the recording medium to pass between the liquid ejection head and the recording medium transport surface. Therefore, paper jams are reduced. Furthermore, the occurrence of nozzle protection member detachment is reduced.

[0004] A resin component (i.e., a cover) is provided to prevent the recording medium from contacting the sides of the nozzle protection component. However, the resin component is weak in the lateral direction and may detach due to contact with the recording medium. Summary of the Invention

[0005] According to one aspect of this disclosure, a liquid jet head is provided, the liquid jet head comprising: a liquid jet substrate configured to have an orifice surface having jet holes for jetting liquid; a cover configured to engage with the liquid jet substrate and protect the orifice surface; and a support member configured to support the cover, wherein the support member has a groove in a surface engaging with the cover, the groove partially overlapping the cover when viewed from a direction perpendicular to the orifice surface, and wherein the liquid jet head comprises resin disposed in the space surrounded by the support member and the cover and above the groove, forming an inclined surface toward the orifice surface.

[0006] According to another aspect of this disclosure, a method for manufacturing a liquid jet head is provided. The liquid jet head includes: a liquid jet substrate configured to have an orifice surface having jet holes for jetting liquid; a cover configured to engage with the liquid jet substrate and protect the orifice surface; and a support member configured to support the cover, wherein the support member has a groove in a surface engaging with the cover, the groove partially overlapping the cover when viewed from a direction perpendicular to the orifice surface. The manufacturing method includes: disposing resin over the space enclosed by the support member and the cover and over the groove, such that the resin forms an inclined surface toward the orifice surface.

[0007] Other features of the invention will become apparent from the following description of exemplary embodiments with reference to the accompanying drawings. Attached Figure Description

[0008] Figure 1 This is a perspective view illustrating a schematic structure of a liquid injection device according to a first exemplary embodiment.

[0009] Figure 2A and Figure 2B This is a perspective view of a liquid injection head according to a first exemplary embodiment.

[0010] Figure 3 This is a plan view of a liquid injection unit that has not yet been configured on a support member according to the first exemplary embodiment.

[0011] Figure 4A This is an example of a top view of a liquid injection unit configured on a support member according to a first exemplary embodiment, and Figure 4B This is an example of a side view of a liquid injection unit according to a first exemplary embodiment.

[0012] Figure 5A and Figure 5B This is an example of a cross-sectional view of a liquid injection head according to a first exemplary embodiment.

[0013] Figure 6 This is an example of a plan view of a support member according to a first exemplary embodiment.

[0014] Figures 7A to 7C The illustration shows a portion of the manufacturing process of a liquid jet head according to a first exemplary embodiment.

[0015] Figure 8 This is another example of a cross-sectional view of a liquid injection head according to a first exemplary embodiment.

[0016] Figure 9 This is another example of a top view of a liquid jet head according to a first exemplary embodiment.

[0017] Figure 10 This is an example of a cross-sectional view of a liquid injection head according to a second exemplary embodiment. Detailed Implementation

[0018] Exemplary embodiments of this disclosure will now be described with reference to the accompanying drawings.

[0019] The first exemplary embodiment will now be described. Figure 1 This is a perspective view illustrating a schematic structure of a liquid jetting apparatus 1000 to which the present disclosure may be applied. The liquid jetting apparatus 1000 includes a delivery unit 300 and a liquid jetting head 100, the delivery unit 300 delivering a recording medium 200 and the liquid jetting head 100 jetting a liquid such as ink. The delivery unit 300 delivers the recording medium 200 toward the liquid jetting head 100. Cut paper or roll paper is typically used as the recording medium 200. However, other media may also be used. Recording occurs as the recording medium 200 passes between the liquid jetting head 100 and the support surface 301 of the delivery unit 300. The recording medium 200 in… Figure 1 The liquid is conveyed in the direction indicated by arrow A shown in the diagram. The liquid jetting head 100 according to this exemplary embodiment is a linear head having a length corresponding to the width of the recording medium 200 (the width of the recording medium 200 in the direction perpendicular to the conveying direction A). However, this disclosure can also be applied to serial heads that jet liquid during reciprocating motion.

[0020] Figure 2A This is a perspective view of the liquid jet head 100 according to this exemplary embodiment, as viewed from the orifice 12 including the jet hole 11. Figure 2A The liquid injection head 100 shown includes a liquid injection unit 10 disposed on the support member 30 (see...). Figure 3 Each liquid jetting unit 10 includes a liquid jetting substrate 13 with jetting holes 11 in an aperture surface (liquid jetting surface) 12 for jetting liquid, and a cover 20 for protecting the aperture surface 12. A support member 30 supports the individual liquid jetting substrate 13 and the individual cover 20, and includes a flow path for supplying liquid to the jetting holes 11. A single liquid jetting unit 10 includes a flexible wiring substrate 40 (see...). Figure 3 The flexible wiring substrate 40 sends an electrical signal for spraying liquid to its corresponding liquid spraying substrate 13. In this exemplary embodiment, four liquid spraying units 10 are arranged in an alternating manner on the support member 30 to form a linear head. The number of liquid spraying units 10 can be appropriately varied according to the required head length. The liquid spraying units can be arranged in different ways. For example, an in-line arrangement can be used.

[0021] Figure 2BThis is a perspective view of the liquid jet head 100 according to this exemplary embodiment, as viewed from the opposite side of the aperture 12. The liquid jet head 100 includes a liquid flow path 50 (including a liquid flow path 50a and a liquid flow path 50b), which connects a tank (not shown) outside the liquid jet head 100 and a liquid jet substrate 13, and through which liquid flows. Figure 2B The structure shown includes a liquid flow path 50a through which liquid is supplied to the liquid injection head 100 and a liquid flow path 50b through which liquid is collected from the liquid injection head 100.

[0022] Liquid, such as ink, is supplied from the tank to the injection hole 11 sequentially via the liquid flow path 50, the support member 30, and the liquid injection substrate 13. The liquid injection head 100 may also be equipped with liquid circulation function, temperature control function, filtration function, etc., depending on the physical properties of the liquid and the performance of the liquid injection head 100.

[0023] Figure 3 This is a plan view of the liquid injection unit 10 before it is mounted on the support member 30.

[0024] The liquid jetting substrate 13 is a substrate including a liquid flow path and an energy generation element for jetting liquid, and its substrate is formed, for example, from silicon. A plurality of jetting holes 11 for jetting liquid are formed in the surface of the liquid jetting substrate 13. The liquid jetting substrate 13 is made, for example, from a photosensitive resin. A cover 20 is bonded to the hole surface 12 including the jetting holes 11 to protect the hole surface 12. When viewed from a direction perpendicular to the hole surface 12, the cover 20 has openings that expose the jetting holes 11 of the liquid jetting substrate 13 to the outside. In other words, when viewed from a direction perpendicular to the hole surface 12, the cover 20 has openings through which the liquid jetting substrate 13 is disposed. The thickness of the cover 20 is, for example, 0.1 mm to 0.5 mm.

[0025] Liquid supplied to the liquid jetting substrate 13 is ejected from the jetting orifice 11 by driving an energy-generating element included in the liquid jetting substrate 13. Typically, a heating element or a piezoelectric element is used as the energy-generating element, and electrical signals and power are supplied through a flexible wiring substrate 40 electrically connected to the liquid jetting substrate 13. In this exemplary embodiment, two flexible wiring substrates 40 are provided on two opposite sides of a liquid jetting substrate 13. The flexible wiring substrate 40 mainly includes a base film, a cover film, and wires. For the base film and cover film, a flexible resin such as polyimide resin is used to increase the degree of deformation freedom. The wires are made of copper foil or the like and are bonded by adhesive to clamp the wires between the base film and the cover film. Part of the cover film is removed to expose part of the wires, and this exposed portion of the wires is electrically connected to the liquid jetting substrate 13.

[0026] Figure 4A and Figure 4B The illustration shows a configuration in which multiple liquid injection units 10 are joined to a support member 30 such that the heights of their respective orifice surfaces 12 are aligned. Figure 4A This is a plan view taken from a direction perpendicular to the hole surface 12, and Figure 4B This is a side view viewed from a direction perpendicular to the hole surface 12. Figure 1 The same as in the middle, Figure 4A Arrow A in the diagram indicates the direction of transport for the recording medium 200.

[0027] In this specification, "height" refers to the position in the direction perpendicular to the aperture surface 12. The liquid jetting unit 10 is precisely bonded to the support member 30 to achieve high-definition recording. The support member 30 supports the liquid jetting unit 10 and also acts as a flow path member having a flow path through which liquid is supplied to the liquid jetting substrate 13. An adhesive is applied to the support member 30 or the liquid jetting substrate 13 to bond them together without obstructing the flow path. Preferably, the adhesive has characteristics of being resistant to the jetting liquid. In this exemplary embodiment, a thermosetting epoxy resin is used and cured by heating at an actual temperature of 100°C. When the temperature of the liquid jetting head 100 changes due to heating during the adhesive's thermosetting or during the liquid jetting temperature control, internal stress is generated due to the difference in the linear expansion coefficients between the support member 30 and the liquid jetting substrate 13, and may damage the liquid jetting head 100.

[0028] Therefore, it is preferable to have a small difference in the linear expansion coefficients between the support member 30 and the liquid jet substrate 13. In this exemplary embodiment, alumina is used for the support member 30.

[0029] When the liquid injection unit 10 is engaged with the support member 30, such as Figure 4B As shown, the flexible wiring substrate 40 is bent at approximately 90° in a direction opposite to the support surface 301, such that the flexible wiring substrate 40 passes through the interior of the support member 30 and is connected to the electrical substrate (not shown). Figure 5A It is along Figure 4A A cross-sectional view taken from the Va-Va line in the diagram, and Figure 5B yes Figure 5A An enlarged view of part Vb in the diagram. The support member 30 includes a first support member 31 supporting the liquid jet substrate 13, and a second support member 32 disposed near the bore surface 12 supported by the first support member 31 and engaged with the cover 20. (See diagram for details.) Figure 5A and Figure 5B As shown, the cover 20 is joined to the second support member 32 via a resin member 70. In this exemplary embodiment, the surface 32a of the second support member 32 that joins to the cover 20 has a groove 321 that partially overlaps with the cover 20 when viewed from a direction perpendicular to the bore surface 12. Figure 6This is a plan view of the second support member 32 including the groove 321. A single resin member 70 is disposed above the space enclosed by the second support member 32 and the corresponding cover 20, and above the corresponding groove 321. The structure including the groove 321 and the resin member 70, as described above, can provide the effect of improving the adhesiveness of the cover 20 against forces applied from the lateral direction.

[0030] A single resin component 70 forms an inclined surface 70a extending from the surface and end of the cover 20 toward the surface 32a of the second support component 32. In other words, the cover surface 20a on the opposite side of the cover 20 that engages with the surface of the second support component 32, the inclined surface 70a of the resin component 70, and the surface 32a of the second support component 32 form a continuous surface. This structure provides the effect of preventing the recording medium 200 from being clamped by the end of the cover 20 and removing the cover 20, as well as reducing paper jams of the recording medium 200.

[0031] The method for manufacturing a liquid injection head according to this disclosure will now be described.

[0032] In the case of a single liquid injection head 100 according to this exemplary embodiment, as described above, a plurality of liquid injection units 10 are configured on the support member 30. Each liquid injection unit 10 to be used has a different height. Therefore, in this exemplary embodiment, floating mounting is performed to align the heights of the orifice surfaces 12. Figures 7A to 7C The illustration shows the process of configuring and securing a single liquid injection unit 10 to a support member 30 using a resin component 70. Figure 7A The illustration shows a liquid injection unit 10 already configured on a support member 30. Figure 7A In the process, the resin component 70 has not yet been applied. By adjusting the amount of adhesive squeezed onto the first support member 31 to fix the liquid jetting substrate 13 to absorb the height difference of the orifice surfaces between the liquid jetting units 10, the individual liquid jetting substrate 13 is bonded to the first support member 31.

[0033] When floating installation is performed, if any of the faceplates 20 comes into contact with the second support member 32, the height of the liquid injection unit 10 will be misaligned. Therefore, as Figure 7A As shown, a first gap (space) 90 is formed between the second support member 32 and the single faceplate 20. In this exemplary embodiment, in Figure 7AIn the state shown, a second gap (space) 91 is formed in the space between the bottom of the groove 321 in the second support member 32 and the corresponding cover 20. For example, if a recording medium 200 with a curved end is conveyed to the first gap 90, the end of the recording medium 200 may enter the first gap 90 instead of the path between the support surface 301 of the conveying unit 300 and the liquid ejector head 100. If this happens, the recording medium 200 will deform and a paper jam will occur. When a paper jam occurs, the printing operation needs to be stopped to remove the jammed recording medium 200. The liquid ejector head 100 may also be damaged by impacts caused by the end of the recording medium 200 in contact with the liquid ejector substrate 13 or the ejection hole 11.

[0034] In this exemplary embodiment, the adhesive strength of the liquid injection head 100 (especially the faceplate 20) is ensured by applying the resin component 70 into the first gap 90 and the second gap 91. Figure 7A As shown, the liquid injection unit 10 is positioned on the support member 30 by floating. In this state, the first adhesive 71 is applied to the groove 321 in the second support member 32. At this time, when the first adhesive 71 comes into contact with the faceplate 20, the first adhesive 71 is drawn into the first gap 90 by the capillary force of the first gap 90 and fills the first gap 90. Figure 7B In this exemplary embodiment, a thermosetting resin is used as the first adhesive 71, which is cured by heat while remaining in the first gap 90 due to surface tension. Preferably, the first adhesive 71 has a low viscosity, thereby filling the first gap 90 by capillary force. Preferably, the viscosity before curing is greater than or equal to 4.0 Pa·s and less than or equal to 132 Pa·s. The first adhesive 71 is not limited to a thermosetting resin; for example, a moisture-curing resin can be suitably used. Preferably, the height of the first gap 90 is set such that the first gap 90 is filled by the first adhesive 71 by capillary force.

[0035] In this exemplary embodiment, as an example, the height of the first gap 90 is set to 0.2 mm.

[0036] The second adhesive 72 is applied to the groove 321 to fill the second gap 91, and cured by heating or the like. Figure 7CThe second adhesive 72 forms an inclined surface 70a above the groove 321, extending from the surface and ends of the cover 20 toward the surface 32a of the second support member 32. In other words, when the second adhesive 72 is cured, an inclined surface is formed connecting the outer peripheral end of the cover 20 and the outer peripheral end of the groove 321. The inclined surface (inclined surface 70a) formed by the second adhesive 72 acts as a guide when conveying the recording medium 200. Therefore, it is difficult for the recording medium 200 to enter the path between the support member 30 and the cover 20. Preferably, the second adhesive 72 is a hard material that is not easily scraped off when the recording medium 200 comes into contact with the second adhesive 72. Preferably, the Young's modulus is about 7 GPa. Preferably, the cured second adhesive 72 does not protrude from the cover 20 toward the recording medium 200 in the height direction. Preferably, the cured second adhesive 72 does not adhere to the hole surface 12. Preferably, the inclined surface of the second adhesive 72 is gentle, for example, with an inclination angle of greater than or equal to 7° and less than or equal to 50° relative to the surface 32a. In this exemplary embodiment, as an example, a thermosetting epoxy resin with a pre-cured viscosity of 4.0 Pa·s is used as the first adhesive 71 and the second adhesive 72. The thermosetting epoxy resin is cured by heating at 100°C.

[0037] When a large amount of the first adhesive 71 is applied, such that both the first gap 90 and the second gap 91 are filled solely with the first adhesive 71, the first adhesive 71, which cannot be held by the capillary force of the first gap 90, may flow towards the liquid jet substrate 13. To avoid such outflow, preferably, as described in this exemplary embodiment, the resin component 70 is applied in two separate steps. First, the first adhesive 71 is applied in an amount that can be held by the capillary force of the first gap 90 and cured. In this way, the second adhesive 72 applied subsequently will not flow towards the liquid jet substrate 13. In this exemplary embodiment, the first gap 90 is filled with the first adhesive 71 using capillary force. Therefore, as Figure 5B and Figure 7B As shown, the cured first adhesive 71 (first resin) surrounded by the surface 20b of the cover 20 that is bonded to the support member 32 and the inner surface 32b of the support member 32 has a recessed shape and does not protrude toward the liquid jet substrate 13.

[0038] Ideally, the amount of the first adhesive 71 to be applied can be precisely controlled. For example, the height of the faceplate 20 and the second support member 32 can be measured using a laser displacement meter or the like, and the amount of the first adhesive 71 to be applied can be adjusted based on the measurement results. In this way, the first adhesive 71 can be applied optimally.

[0039] Since the groove 321 is provided in the surface 32a of the second support member 32, the applied second adhesive 72 can easily form a slope through surface tension, so that the outer peripheral end of the cover 20 and the outer peripheral end of the groove 321 are connected to each other. Because the second adhesive 72 applied to the groove 321 in the second support member 32 acts as an anchor, the adhesion between the second adhesive 72 and the second support member 32 is improved, thus making contact with the recording medium 200 less likely to cause damage. Furthermore, the cover 20's resistance to forces applied from the side surface direction is enhanced. To more appropriately obtain the anchoring effect of the configured resin member 70, it is desirable that the groove 321 have a depth greater than or equal to 0.2 mm. In this exemplary embodiment, as an example, the depth of the groove 321 is set to 0.4 mm (design tolerance ±0.2 mm).

[0040] The width of the groove 321 can be determined based on the size of the needle used to apply the resin component 70 (first adhesive 71 and second adhesive 72). To prevent the resin component 70 from overflowing from the groove 321 during application, preferably, the width of the portion of the groove 321 exposed from the faceplate 20 is greater than the outer diameter of the needle; more specifically, with the faceplate 20 configured, the width is greater than or equal to 1.0 mm when viewed from a direction perpendicular to the surface 32a of the second support member 32 where the groove 321 is located. In this exemplary embodiment, as an example, the width of the groove 321 is set to approximately 2.15 mm, and the amount of the portion of the groove 321 overlapping the faceplate 20 in its width direction is set to approximately 0.6 mm. Therefore, the width of the portion of the groove 321 that does not overlap with the faceplate 20 is approximately 1.55 mm. Assuming the outer diameter of the needle used to apply the resin component 70 is 0.72 mm, the needle can be easily inserted into the groove 321 when applying the resin component 70.

[0041] In this exemplary embodiment, as an example, the height of the first gap 90 is set to 0.2 mm, the length of the first gap 90 in the width direction of the groove 321 is set to 1.0 mm, the height (depth) of the groove 321 is set to 0.4 mm, and the height of the second gap 91 is set to 0.635 mm. When the second adhesive 72 is applied to the groove 321 having this structure, for example, 0.3 mm to 0.8 mm of the second adhesive 72 may be applied above the bottom of the groove 321 provided in the second support member 32. Forming a sufficient gap for the needle across the width of the groove 321 in the second support member 32 has several advantages. For example, it reduces the accuracy requirements of the automated application equipment used in the adhesive application step, and a universal application equipment can be used to manufacture the liquid jet head 100.

[0042] The first adhesive 71 can be pre-applied to the surface 32a of the second support member 32, and the faceplate 20 can be bonded to it. In this case, the first adhesive 71 is pressed through the faceplate 20. Specifically, as Figure 8 As shown, a first adhesive 71 protrudes, surrounding the surface 20b of the cover 20 and the inner surface 32b of the support member 32.

[0043] exist Figure 4A and Figure 6 In this case, a single groove 321 is formed around the entire outer periphery of the corresponding cover 20. However, the single groove 321 can also be formed in different ways. For example, as... Figure 9 As shown, a single groove 321 is formed around one side upstream of the corresponding cover 20 in the transport direction A of the recording medium 200. In this way, the single resin member 70 acts as a guide to prevent the recording medium 200 from entering the gap between the support member 30 and the corresponding cover 20, and to reduce the occurrence of paper jams.

[0044] like Figure 4A and Figure 6 As shown, the bonding strength between the cover 20 and the support member 30 can be further enhanced by forming a groove 321 around the outer periphery of each cover 20.

[0045] The second exemplary embodiment will now be described. The differences between the first and second exemplary embodiments described above will be emphasized below, and descriptions of the same parts as the first exemplary embodiment will be omitted.

[0046] Figure 10 This is a cross-sectional view of the liquid injection head according to this exemplary embodiment, and is consistent with the view in the first exemplary embodiment. Figure 5B The corresponding figure. In this exemplary embodiment, the resin member 70 and the inclined surface 70a are formed solely by the first adhesive 71, without using the second adhesive 72 according to the first exemplary embodiment. All the amount of the first adhesive 71 is applied at once, without heat curing in the middle of the process. In this case, it is also preferable to apply the first adhesive 71 precisely. Therefore, ideally, the distance between the cover 20 and the support member 32 is measured beforehand using a laser displacement meter or the like. Furthermore, ideally, based on the measurement results, an optimal amount of the first adhesive 71 is applied by adjusting the amount to be applied.

[0047] The first adhesive 71 forms an inclined surface 70a above the groove 321, extending from the surface and end of the cover 20 toward the surface 32a of the second support member 32. During this formation process, the viscosity of the first adhesive 71 can be appropriately selected based on the size and width of the first gap 90 so that the first adhesive 71 does not overflow toward the liquid jet substrate 13.

[0048] This disclosure provides a liquid ejector head that reduces paper jams caused by recording media and has high durability.

[0049] Although this disclosure has been described with reference to exemplary embodiments, it should be understood that this disclosure is not limited to the disclosed exemplary embodiments. The appended claims should be interpreted in the broadest possible sense to cover all such variations and equivalent structures and functions.

[0050] This application claims the benefit of Japanese Patent Application No. 2024-077929, filed on May 13, 2024, the entire contents of which are incorporated herein by reference.

Claims

1. A liquid injection head, the liquid injection head comprising: A liquid jetting substrate, wherein the liquid jetting substrate is configured to have a perforated surface having jetting holes for jetting liquid; A cover, configured to engage with the liquid jet substrate and protect the orifice surface; as well as Support member, the support member being configured to support the cover, The supporting member has a groove in its surface that engages with the cover. When viewed from a direction perpendicular to the hole surface, the groove partially overlaps with the cover. The liquid injection head includes resin, which is disposed in the space surrounded by the support member and the cover and above the groove, forming an inclined surface facing the orifice.

2. The liquid injection head according to claim 1, wherein, The cover surface, the inclined surface, and the surface with the groove on the opposite side of the surface of the cover that is engaged with the support member form a continuous surface.

3. The liquid injection head according to claim 1, wherein, When viewed from a direction perpendicular to the hole surface, the groove has a portion that does not overlap with the cover.

4. The liquid injection head according to claim 1, wherein, When viewed from a direction perpendicular to the hole surface, the cover has an opening through which the liquid jet substrate is disposed.

5. The liquid injection head according to claim 4, wherein, When viewed from a direction perpendicular to the surface of the hole, the groove surrounds the opening.

6. The liquid injection head according to claim 1, wherein, The space and the groove surrounded by the support member and the cover are filled with the resin.

7. The liquid injection head according to claim 1, wherein, The resin surrounding the surface of the cover that is joined to the support member and the side of the support member has a recessed shape.

8. The liquid injection head according to claim 1, wherein, The resin includes a first resin disposed in the space surrounded by the support member and the cover, and a second resin disposed in the groove.

9. The liquid injection head according to claim 1, wherein, The support member and the cover are joined together via the resin.

10. A liquid injection device, the liquid injection device comprising: Liquid injection head according to any one of claims 1 to 9; as well as A delivery unit configured to deliver the medium to which the liquid jet head sprays liquid.

11. The liquid injection device according to claim 10, wherein, When viewed from a direction perpendicular to the orifice, the groove has a portion located upstream of the liquid jet substrate in the medium delivery direction.

12. A method for manufacturing a liquid injection head, the liquid injection head comprising: A liquid jetting substrate, wherein the liquid jetting substrate is configured to have a perforated surface having jetting holes for jetting liquid; A cover, configured to engage with the liquid jet substrate and protect the orifice surface; as well as Support member, the support member being configured to support the cover, The support member has a groove in the surface that engages with the cover, and when viewed from a direction perpendicular to the hole surface, the groove partially overlaps with the cover. The manufacturing method includes: distributing resin in the space surrounded by the support member and the cover and above the groove, such that the resin forms an inclined surface facing the hole surface.

13. The method for manufacturing a liquid injection head according to claim 12, in, The resin includes a first resin and a second resin. The resin is provided in the following ways: The first resin is disposed within the space surrounded by the support member and the cover, and the first resin is cured; and The second resin is placed in the groove and cured. The first resin and the second resin are set sequentially.

14. The method for manufacturing a liquid injection head according to claim 13, the method further comprising: Prior to the setting of the resin, the cover is disposed on the support member to form the space.

15. The method for manufacturing a liquid injection head according to claim 14, wherein, The first resin is disposed in the space by capillary force.

16. The method for manufacturing a liquid injection head according to claim 13, wherein, The viscosity of the first resin is greater than or equal to 4.0 Pa·s and less than or equal to 132 Pa·s.

17. The method for manufacturing a liquid injection head according to claim 12, wherein, The resin is configured such that the cover surface, the surface of the resin, and the surface of the support member having the groove on the opposite side of the cover surface that is engaged with the support member form a continuous surface.

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