Chip packaging structure, chip packaging method and ink-jet printing equipment

Abstract

The invention discloses a chip packaging structure, a chip packaging method and ink-jet printing equipment, which are applied to the field of semiconductors, and comprise a circuit board and a chip, a hollow part is formed on the circuit board, and the chip is fixedly connected in the hollow part through protective glue; the chip is pre-installed in the hollow part through a peelable temporary fixing layer before the protection glue is prepared, and the chip is temporarily connected with the temporary fixing layer so as to be fixed to the relative position of the circuit board; the temporary fixing layer covers the hollow part of the back surface of the circuit board, and the chip is temporarily connected to one side, close to the front surface of the circuit board, of the temporary fixing layer; the bonding pad of the chip is in bonding connection with the circuit board through the lead, and the protection glue covers the lead, the bonding pad of the chip and the structure at the bonding position of the circuit board. According to the invention, the chip is pre-installed by using the temporary fixing layer, so that the chip is fixed relative to the circuit board before being fixed, and the stability of the chip and the circuit board during subsequent processing is realized.

Description

Technical Field

[0001] This invention relates to the field of semiconductors, and in particular to a chip packaging structure, a chip packaging method, and an inkjet printing device. Background Technology

[0002] Taking inkjet head chips as an example, in the current packaging of inkjet head chips, openings need to be set at the chip placement positions on the circuit board, and the chip and circuit board need to be connected by leads. Therefore, it is necessary to ensure the relative position of the chip and the circuit board. The current packaging method for inkjet head chips cannot guarantee that the relative position between the chip and the circuit board is fixed, resulting in low efficiency. During the packaging process, problems such as chip displacement, bonding failure, and uneven coverage of protective glue may occur.

[0003] Therefore, how to achieve high-precision mounting, reliable bonding, and effective protection on circuit boards is a technical problem that urgently needs to be solved in this field. Summary of the Invention

[0004] In view of this, the purpose of the present invention is to provide a chip packaging structure, a chip packaging method, and an inkjet printing device, which solves the problems in the prior art where chip misalignment, bonding failure, and uneven coverage of protective adhesive are common during the packaging process of connecting the chip to the cutout part of the circuit board.

[0005] To address the aforementioned technical problems, this invention provides a chip packaging structure, comprising:

[0006] Circuit boards and chips;

[0007] The circuit board has a cutout portion, and the chip is fixedly connected to the cutout portion by a protective adhesive. Before the protective adhesive is prepared, the chip is pre-installed in the cutout portion by a peelable temporary fixing layer, and the chip is temporarily connected to the temporary fixing layer to fix its relative position to the circuit board. The temporary fixing layer covers the cutout portion on the back surface of the circuit board, and the chip is temporarily connected to the side of the temporary fixing layer facing the front surface of the circuit board.

[0008] The chip's pads are bonded to the circuit board via leads, and the protective adhesive covers the leads, the chip's pads, and the structure at the bonding location on the circuit board.

[0009] Optionally, the chip is fixedly connected to the sidewall of the cutout portion by pre-applying adhesive.

[0010] Optionally, the pre-dispensing adhesive is disposed between the chip and the sidewall of the cutout portion, corresponding to the location where the lead wire is laid.

[0011] Optionally, the thickness of the pre-dispensed adhesive between the chip and the sidewall of the cutout portion is 530 micrometers to 750 micrometers, and the width of the pre-dispensed adhesive extending along the edge contour of the chip is 0.4 millimeters to 0.6 millimeters.

[0012] Optionally, the temporary fixing layer is heat-resistant tape.

[0013] Optionally, the chip is an inkjet head chip, and the circuit board is a multi-row flexible circuit board;

[0014] Multiple inkjet head chips are fixedly connected to the cutout portion of the multi-row flexible circuit board by protective adhesive.

[0015] The present invention also provides a chip packaging method, comprising:

[0016] A circuit board and a chip are provided; the circuit board has a cutout in the direction from the front surface to the back surface, and the opening on the back surface of the circuit board is covered with a peelable temporary fixing layer.

[0017] The chip is installed in the cutout and temporarily connected to the temporary fixing layer on the side of the circuit board facing the front surface.

[0018] The chip's pads are wire-bonded to the circuit board, and a protective adhesive is prepared to fix the chip and the circuit board together, covering and protecting the wires, the chip's pads, and the structure at the bonding location on the circuit board, thus completing the encapsulation.

[0019] Optionally, before wire bonding the chip's pads to the circuit board and preparing the protective adhesive, the method further includes:

[0020] Pre-applied adhesive is applied between the chip and the sidewall of the cutout portion for reinforcement.

[0021] Optionally, the circuit board is a multi-row flexible circuit board, and the multi-row flexible circuit board connects multiple chips;

[0022] After the packaging is completed, the following is also included:

[0023] The packaged chip structure is cut to obtain a single chip package structure.

[0024] The present invention also provides an inkjet printing device, including the chip packaging structure as described above.

[0025] As can be seen, the chip packaging structure provided by this invention includes a circuit board and a chip. The circuit board has a cutout portion, and the chip is fixedly connected to the cutout portion by a protective adhesive. Before the protective adhesive is prepared, the chip is pre-installed in the cutout portion by a peelable temporary fixing layer, and the chip is temporarily connected to the temporary fixing layer to fix its relative position to the circuit board. The temporary fixing layer covers the cutout portion on the back surface of the circuit board, and the chip is temporarily connected to the side of the temporary fixing layer facing the front surface of the circuit board. The chip's pads are bonded to the circuit board by leads, and the protective adhesive covers the leads, the chip's pads, and the structure at the bonding position on the circuit board. This invention utilizes a temporary fixing layer to pre-install the chip, thereby fixing the chip's relative position to the circuit board before final fixing, achieving stability for the chip and circuit board during subsequent processing.

[0026] In addition, the present invention also provides a chip packaging method and an inkjet printing device, which also have the above-mentioned beneficial effects. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0028] Figure 1 This is a schematic diagram of a chip packaging structure without removing the temporary fixing layer, provided by an embodiment of the present invention;

[0029] Figure 2 This is a schematic diagram of a chip packaging structure with the temporary fixing layer removed, provided by an embodiment of the present invention;

[0030] Figure 3 This is a schematic diagram of another chip packaging structure provided in an embodiment of the present invention;

[0031] Figure 4 A flowchart of a chip packaging method provided in an embodiment of the present invention;

[0032] The annotations in the attached figures are explained as follows:

[0033] 10-Circuit board, 20-Chip, 21-Pad, 30-Cutout section, 40-Protective adhesive, 50-Temporary fixing layer, 60-Lead wire, 70-Pre-applied adhesive. Detailed Implementation

[0034] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0035] Please refer to Figure 1 , Figure 1 This is a schematic diagram of a chip packaging structure with the temporary fixing layer not removed, provided as an embodiment of the present invention. The chip packaging structure may include:

[0036] Circuit board 10 and chip 20;

[0037] The circuit board 10 has a cutout portion 30, and the chip 20 is fixedly connected to the cutout portion 30 by a protective adhesive 40. Before the protective adhesive 40 is prepared, the chip 20 is pre-installed in the cutout portion 30 by a peelable temporary fixing layer 50, and the chip 20 is temporarily connected to the temporary fixing layer 50 to fix its relative position to the circuit board 10. The temporary fixing layer 50 covers the cutout portion 30 on the back surface of the circuit board 10, and the chip 20 is temporarily connected to the side of the temporary fixing layer 50 facing the front surface of the circuit board 10.

[0038] The pads 21 of the chip 20 are bonded to the circuit board 10 via leads 60, and the protective adhesive 40 covers the leads 60, the pads 21 of the chip 20, and the structure at the bonding location of the circuit board 10.

[0039] In this embodiment, the cutout portion 30 refers to a through hole or window formed on the circuit board 10 by methods such as stamping or laser cutting. The size of the cutout portion 30 needs to be set larger than the functional area of ​​the chip 20, for example, larger than the size of the nozzle plate, to ensure that the functional surface of the chip 20 is fully exposed and its function is not obstructed. This cutout portion 30 is key to achieving the suspended exposure of the functional surface of the chip 20, avoiding interference of the circuit board 10 with the function of the chip 20. The final chip packaging structure formed in this embodiment can be referred to Figure 2 , Figure 2 This is a schematic diagram of a chip packaging structure with the temporary fixing layer removed, provided as an embodiment of the present invention.

[0040] In this embodiment, the peelable temporary fixing layer 50 is a temporary adhesive medium, mainly used to provide sufficient adhesive force to accurately maintain the relative position of the chip 20 and the circuit board 10 before the permanent fixing adhesive, such as the protective adhesive 40 mentioned above, cures. It can be completely peeled off without leaving any adhesive residue after subsequent processes. This embodiment does not limit the specific type of the temporary fixing layer 50. For example, the temporary fixing layer 50 can be a UV-degradable adhesive or other temporary bonding materials. However, it must be ensured that the temporary fixing layer 50 can withstand the high temperatures during the subsequent curing process of the protective adhesive 40, for example, remaining stable between 85 degrees Celsius and 95 degrees Celsius. In this embodiment, the chip 20's placement accuracy error is within 0.05 mm.

[0041] In this embodiment, the protective adhesive 40 differs from the temporary fixing layer 50 described above; it is a permanent fixing adhesive, typically an epoxy resin-based adhesive, prepared using a COB (Chip-On-Board) dispensing process. This protective adhesive 40 serves two purposes: firstly, it provides mechanical fixation, permanently encapsulating the chip 20 within the cutout portion 30; secondly, it provides electrical protection, encapsulating and protecting the fragile leads 60, the chip 20's pads 21, and the circuit board bonding area, isolating them from the external environment and preventing short circuits, corrosion, or breakage. In this embodiment, the protective adhesive 40 should possess good rheological properties to ensure coverage of all protected areas, while also exhibiting chemical stability. In this embodiment, the dispensing position error during the preparation of the protective adhesive 40 is within 0.2 mm to avoid affecting other structures.

[0042] In this embodiment, the lead 60 is typically made of gold wire, and the electrical interconnection between the pad 21 of the chip 20 and the pad of the circuit board 10 is achieved through thermo-ultrasonic bonding. After bonding, the arc height of the lead 60 can be set between 80 micrometers and 150 micrometers, the bonding pull force can be greater than or equal to 5 grams, and the gold ball push force is greater than 25 grams. The gold ball is a gold ball welding structure formed at the contact points between the gold wire and the pad 21, etc.

[0043] Furthermore, to improve the stability of the connection between chip 20 and circuit board 10, reference can be made to... Figure 3 , Figure 3 This is a schematic diagram of another chip packaging structure provided in an embodiment of the present invention. The chip 20 can be fixedly connected to the sidewall of the cutout portion 30 via pre-applied adhesive 70.

[0044] In this embodiment, pre-dispensing 70 is a preliminary local dispensing operation performed before applying the large-area protective adhesive 40. Its main purpose is for mechanical reinforcement, providing additional, preliminary mechanical fixation for the chip 20 outside the temporary fixing layer 50. This enhances the chip 20's vibration resistance during subsequent bonding processes and prevents chip 20 displacement leading to bonding failure. By filling the gap between the side of the chip 20 and the sidewall of the cutout portion 30, the pre-dispensing 70 strengthens the overall structure, especially resisting cutting stress during subsequent individual chip cutting, preventing the chip 20 from detaching or being damaged.

[0045] Furthermore, in order to improve the stability of the lead 60, the pre-applied adhesive 70 can be disposed between the chip 20 and the sidewall of the cutout portion 30, corresponding to the placement position of the lead 60.

[0046] In this embodiment, the pre-applied adhesive 70 is placed near the location where the lead wire 60 is laid, which can provide better buffering and support for the lead wire 60.

[0047] Furthermore, in order to ensure that the pre-dispensed adhesive 70 is fully filled while avoiding overflow and contamination of other components, the thickness of the pre-dispensed adhesive 70 between the chip 20 and the sidewall of the cutout portion 30 can be set to 530 micrometers to 750 micrometers, and the width of the pre-dispensed adhesive 70 extending along the edge contour of the chip 20 can be set to 0.4 millimeters to 0.6 millimeters.

[0048] In this embodiment, by setting the shape parameters of the pre-dispensed adhesive 70 to a thickness of 530-750 μm and a width of 0.4-0.6 mm, it is possible to ensure that the adhesive is fully filled while avoiding excessive overflow and contamination of other areas.

[0049] Furthermore, in order to ensure the stability of the temporary fixing layer 50, the temporary fixing layer 50 can be made of heat-resistant tape.

[0050] In this embodiment, the temporary fixing layer 50 is set as a heat-resistant tape. The heat-resistant tape can be made of a high-temperature resistant substrate such as polyimide (PI) coated with removable silicone or acrylic adhesive to ensure stability at the subsequent curing process temperature.

[0051] Furthermore, in order to reduce manufacturing costs, the chip 20 can be set as an inkjet head chip, and the circuit board 10 can be a multi-row flexible circuit board.

[0052] Multiple inkjet head chips are fixedly connected to the cutout portion 30 of the multi-row flexible circuit board by protective adhesive 40.

[0053] In this embodiment, the circuit board 10 is preferably a flexible printed circuit board, which is flexible and suitable for use with moving inkjet heads. The multi-row flexible circuit board has a cutout portion 30, and the inkjet head chip is fixedly connected to the multi-row flexible circuit board by protective adhesive 40. In this embodiment, multi-row refers to simultaneously encapsulating multiple chip units 20 on a large-format flexible printed circuit board panel. After encapsulation, the entire board can be divided into individual inkjet head modules by laser cutting or other methods. This greatly improves production efficiency and reduces unit production costs.

[0054] The chip 20 packaging structure provided in this embodiment includes a circuit board 10 and a chip 20. The circuit board 10 has a cutout portion 30, and the chip 20 is fixedly connected to the cutout portion 30 by a protective adhesive 40. Before the protective adhesive 40 is prepared, the chip 20 is pre-installed in the cutout portion 30 by a peelable temporary fixing layer 50, and the chip 20 is temporarily connected to the temporary fixing layer 50 to fix its relative position to the circuit board 10. The temporary fixing layer 50 covers the cutout portion 30 on the back surface of the circuit board 10, and the chip 20 is temporarily connected to the side of the temporary fixing layer 50 facing the front surface of the circuit board 10. The pads 21 of the chip 20 are bonded to the circuit board 10 by leads 60, and the protective adhesive 40 covers the leads 60, the pads 21 of the chip 20, and the structure at the bonding position of the circuit board 10. This embodiment of the invention utilizes the temporary fixing layer 50 to pre-install the chip 20, so that the chip 20 is fixed in relative position to the circuit board 10 before fixing, thereby achieving stability of the chip 20 and the circuit board 10 during subsequent processing.

[0055] Furthermore, in this embodiment of the invention, by setting the chip 20 to be fixedly connected to the sidewall of the cutout portion 30 via pre-dispensing adhesive 70, the stability of the connection between the chip 20 and the circuit board 10 is improved; by setting the pre-dispensing adhesive 70 between the chip 20 and the sidewall of the cutout portion 30, corresponding to the placement position of the lead 60, the stability of the lead 60 bond and connection is further improved; by setting the thickness of the pre-dispensing adhesive 70 between the chip 20 and the sidewall of the cutout portion 30 to be 530 micrometers to 750 micrometers, and the width of the pre-dispensing adhesive 70 extending along the edge contour of the chip 20 to be 0.4 millimeters to 0.6 millimeters, the pre-dispensing adhesive 70 is ensured to be fully filled while avoiding overflow and contamination of other components; by setting the temporary fixing layer 50 to be a heat-resistant tape, stability is ensured at the subsequent curing process temperature; by setting the chip 20 to be an inkjet head chip, the circuit board 10 to be a multi-row flexible circuit board, and by setting multiple inkjet head chips to be fixedly connected within the cutout portion 30 of the multi-row flexible circuit board via protective adhesive 40, the manufacturing efficiency is improved.

[0056] The following describes a chip packaging method provided by an embodiment of the present invention. The chip packaging method described below can be referred to in correspondence with the chip packaging structure described above.

[0057] Please refer to the details. Figure 4 , Figure 4 A flowchart of a chip packaging method provided in an embodiment of the present invention may include:

[0058] S101: Provides a circuit board and a chip; the circuit board has a cutout in the direction from the front surface to the back surface, and the opening on the back surface of the circuit board is covered with a peelable temporary fixing layer.

[0059] The execution subject of this embodiment is a chip packaging device. The circuit board 10 provided in this embodiment should have completed the necessary circuit wiring, and a peelable temporary fixing layer 50 covering all the cutouts 30 is provided on the back surface, providing an operational basis for subsequent chip mounting.

[0060] S102: Install the chip inside the cutout and temporarily connect it to the side of the temporary fixing layer facing the front surface of the circuit board.

[0061] In this embodiment, the chip 20 is mounted and fixed within the cutout portion 30 via the temporary fixing layer 50, and the placement accuracy of the chip 20 in the temporary fixing layer 50 must be maintained within 0.05 mm. Specifically, in this embodiment, a high-precision placement device can be used to pick up the chip 20 and accurately place it onto the temporary fixing layer 50.

[0062] S103: Connect the chip's pads to the circuit board via wire bonding, and prepare a protective adhesive to fix the chip and circuit board together, covering the protective leads, chip pads, and the structure at the bonding location on the circuit board, thus completing the encapsulation.

[0063] In this embodiment, gold wire ball bonding can be used. A bonding machine is employed, using high temperature, pressure, and ultrasonic energy to bond one end of the gold wire to the pad on chip 20 and the other end to the corresponding pad on circuit board 10. Typically, the wire ultimately connects to the gold fingers on circuit board 10, forming an electrical interconnect. Additionally, plasma cleaning can be performed before bonding to remove oxides from the pad surface, improving bonding quality. In this embodiment, a protective adhesive 40 is applied to the bonding area of ​​chip 20 using a dispensing device. This protective adhesive 40 must completely cover the lead 60, the pads of chip 20, and the bonding points on circuit board 10, forming a robust protective layer that isolates it from the external environment, preventing corrosion, short circuits, and mechanical damage. After dispensing, high-temperature curing is required to fully cure the protective adhesive 40 to achieve its final strength. The curing temperature can be set to 90°C and baked continuously for 30 minutes.

[0064] Furthermore, to improve the stability of the connection between chip 20 and circuit board 10, before the above-mentioned wire bonding connection between the chip's pads and the circuit board and the preparation of protective adhesive, the following steps may be included:

[0065] Pre-applied adhesive is used to reinforce the chip and the sidewall of the cutout.

[0066] In this embodiment, before wire bonding and after chip mounting, a dispensing needle is used to apply an appropriate amount of pre-dispensed adhesive 70 to the gap between the side of the chip 20 and the sidewall of the cutout portion 30. This provides initial reinforcement to the chip 20, offering additional and stronger mechanical fixation beyond temporary fixation. This prevents the chip 20 from shifting due to equipment vibration during subsequent wire bonding, thus avoiding bonding failure. Furthermore, the pre-dispensed adhesive 70 filling the gap can buffer the thermal stress between the chip 20 and the circuit board 10 caused by the difference in their coefficients of thermal expansion, and enhances cutting reliability. When the entire board is subsequently cut into single-chip package structures, the cured adhesive effectively resists cutting stress, preventing the chip 20 from loosening or falling off during the cutting process.

[0067] Furthermore, in order to improve the manufacturing efficiency, the circuit board can be configured as a multi-row flexible circuit board, and the multi-row flexible circuit board connects multiple chips.

[0068] After the above encapsulation is completed, it may also include:

[0069] The packaged chip structure is cut to obtain a single chip package structure.

[0070] In this embodiment, the circuit board 10 is preferably a multi-row flexible circuit board (FPC), on which multiple cutouts 30 matching the size of the chip 20 are integrally formed. The chip 20 can be set as an inkjet head chip, with bonding pads on the front and a functional surface containing micro-nozzles on the back.

[0071] The chip packaging method provided in this embodiment of the invention includes S101: providing a circuit board and a chip; the circuit board has a cutout portion formed along the direction from the front surface to the back surface, and a peelable temporary fixing layer is covered and connected to the opening on the back surface of the circuit board; S102: mounting the chip in the cutout portion and temporarily connecting it to the side of the temporary fixing layer facing the front surface of the circuit board; S103: wire bonding the chip's pads to the circuit board and preparing a protective adhesive to fix the chip and the circuit board together, covering the protective leads, the chip's pads, and the structure at the bonding position of the circuit board, thus completing the packaging. This embodiment of the invention uses a temporary fixing layer 50 to pre-install the chip 20, so that the chip 20 is fixed in relative position to the circuit board 10 before fixing, achieving stability of the chip 20 and the circuit board 10 during subsequent processing.

[0072] Furthermore, in this embodiment of the invention, by pre-applying adhesive between the chip and the sidewall of the cutout portion for reinforcement before wire bonding the chip's pads to the circuit board and preparing the protective adhesive, the stability of the connection between the chip and the circuit board is improved. By setting the circuit board to a multi-row flexible circuit board, and connecting multiple chips to the multi-row flexible circuit board, the chip packaging structure is cut after the packaging is completed to obtain a single chip packaging structure, thereby improving the manufacturing efficiency.

[0073] The following describes an inkjet printing device provided by an embodiment of the present invention. The inkjet printing device described below can be referred to in correspondence with the chip packaging structure described above.

[0074] The inkjet printing device provided in this embodiment of the invention may include the chip packaging structure described above.

[0075] The aforementioned chip packaging structure includes at least a circuit board 10 and a chip 20. The circuit board 10 has a cutout 30, and the chip 20 is fixedly connected to the cutout 30 by a protective adhesive 40. Before the protective adhesive 40 is prepared, the chip 20 is pre-installed in the cutout 30 by a peelable temporary fixing layer 50, and the chip 20 is temporarily connected to the temporary fixing layer 50 to fix its relative position to the circuit board 10. The temporary fixing layer 50 covers the cutout 30 on the back surface of the circuit board 10, and the chip 20 is temporarily connected to the side of the temporary fixing layer 50 facing the front surface of the circuit board 10. The pads of the chip 20 are bonded to the circuit board 10 by leads 60, and the protective adhesive 40 covers the leads 60, the pads of the chip 20, and the structure at the bonding location of the circuit board 10. This invention utilizes a temporary fixing layer 50 to pre-install the chip 20, thereby fixing the chip 20 to the circuit board 10 in a relative position before final fixing, achieving stability of the chip 20 and the circuit board 10 during subsequent processing.

[0076] The various embodiments in this specification are described in a progressive manner. Each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0077] Furthermore, it should be noted that in this document, relationships such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprising," "including," or any other variations are intended to cover non-exclusive inclusion.

[0078] The chip packaging structure, chip packaging method, and inkjet printing equipment provided by the present invention have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of the present invention. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of the present invention. Therefore, the content of this specification should not be construed as a limitation of the present invention.

Claims

1. A chip packaging structure, characterized in that, include: Circuit boards and chips; The circuit board has a cutout portion, and the chip is fixedly connected to the cutout portion by a protective adhesive. Before the protective adhesive is prepared, the chip is pre-installed in the cutout portion by a peelable temporary fixing layer, and the chip is temporarily connected to the temporary fixing layer to fix its relative position to the circuit board. The temporary fixing layer covers the cutout portion on the back surface of the circuit board, and the chip is temporarily connected to the side of the temporary fixing layer facing the front surface of the circuit board. The chip's pads are bonded to the circuit board via leads, and the protective adhesive covers the leads, the chip's pads, and the structure at the bonding location on the circuit board.

2. The chip packaging structure according to claim 1, characterized in that, The chip is fixedly connected to the sidewall of the cutout portion by pre-applying adhesive.

3. The chip packaging structure according to claim 2, characterized in that, The pre-dispensing adhesive is disposed between the chip and the sidewall of the cutout portion, corresponding to the location where the lead wires are laid.

4. The chip packaging structure according to claim 2, characterized in that, The thickness of the pre-dispensed adhesive between the chip and the sidewall of the cutout portion is 530 micrometers to 750 micrometers, and the width of the pre-dispensed adhesive extending along the edge contour of the chip is 0.4 millimeters to 0.6 millimeters.

5. The chip packaging structure according to claim 1, characterized in that, The temporary fixing layer is heat-resistant tape.

6. The chip packaging structure according to claim 1, characterized in that, The chip is an inkjet head chip, and the circuit board is a multi-row flexible circuit board. Multiple inkjet head chips are fixedly connected to the cutout portion of the multi-row flexible circuit board by protective adhesive.

7. A chip packaging method, characterized in that, include: A circuit board and a chip are provided; the circuit board has a cutout in the direction from the front surface to the back surface, and the opening on the back surface of the circuit board is covered with a peelable temporary fixing layer. The chip is installed in the cutout and temporarily connected to the temporary fixing layer on the side of the circuit board facing the front surface. The chip's pads are wire-bonded to the circuit board, and a protective adhesive is prepared to fix the chip and the circuit board together, covering and protecting the wires, the chip's pads, and the structure at the bonding location on the circuit board, thus completing the encapsulation.

8. The chip packaging method according to claim 7, characterized in that, Before wire bonding the chip's pads to the circuit board and preparing the protective adhesive, the process further includes: Pre-applied adhesive is applied between the chip and the sidewall of the cutout portion for reinforcement.

9. The chip packaging method according to claim 7, characterized in that, The circuit board is a multi-row flexible circuit board, and the multi-row flexible circuit board connects multiple chips; After the encapsulation is completed, the following is also included: The packaged chip structure is cut to obtain a single chip package structure.

10. An inkjet printing device, characterized in that, Includes the chip packaging structure as described in any one of claims 1 to 6.

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