Device for determining placement position of material pad before heat treatment of cast ingot and use method of device

Abstract

The invention provides a device for determining the placement position of a material pad before ingot casting heat treatment and a use method thereof. The device comprises a sensor group and a calculation module connected with the sensor group, the sensor groups are communicated with the calculation module by adopting analog quantity; the detection position is provided with a thickness sensor, a stay wire encoder and an object existence sensor; a corresponding algorithm and a receiving module are arranged in the calculation module, and the numerical value L and the cast ingot thickness H returned by the stay wire encoder can be received in real time; the calculation module calculates and judges whether the material pad is placed at an accurate position or not according to H and L, and can obtain a corresponding material pad placement position curve to serve subsequent optimization; the problems that in the prior art, the efficiency is low and the accuracy is poor when the placement position of the material pad is determined manually can be solved, accurate and efficient determination of the placement position of the material pad is achieved, and stable placement of cast ingots is guaranteed.

Description

Technical Field

[0001] This invention relates to the field of aluminum alloy strip processing and manufacturing technology, and in particular to a device for determining the placement position of the pad before heat treatment of an ingot and its method of use. Background Technology

[0002] In the aluminum processing industry, ingots require heat treatment before hot rolling. To maximize the use of space in the heating furnace and accommodate as many ingots as possible, the ingots need to be placed vertically. Different ingot models have varying widths and thicknesses, and generally, the ingot's center of gravity should be located at the center of the bottom pad to ensure stability during ingot insertion. Therefore, before placing the ingot, the pad needs to be quickly positioned correctly. If the pad is misplaced or incorrect, an ingot removal operation is required, and the pad must be repositioned. This increases feeding time and ultimately reduces production efficiency. Summary of the Invention

[0003] In view of this, the purpose of the present invention is to provide a device and method for determining the placement position of the pad before heat treatment of ingots, which solves the problems of low efficiency and poor accuracy in the prior art that rely on manual determination of the pad placement position, and achieves accurate and efficient determination of the pad placement position to ensure the stability of ingot placement.

[0004] To achieve the above objectives, the present invention adopts the following technical solution: a device for determining the placement position of the pad before ingot heat treatment, comprising an ingot presence detection sensor, an ingot thickness detection sensor, a wire encoder, and a control calculation module; the ingot presence detection sensor is placed perpendicular to the ingot movement direction and is used to detect whether the ingot has reached the thickness measurement area; the ingot thickness detection sensor is placed perpendicular to the ingot plane and is used to measure the ingot thickness H; the wire encoder is placed on the same horizontal plane as the pushing mechanism's movement direction and is used to measure the real-time position L of the pad; the ingot presence detection sensor, ingot thickness detection sensor, and wire encoder send the monitored ingot information to the control calculation module to obtain a calculation formula for the required position of the pad corresponding to an ingot of any thickness: Where D0 is the distance from the pusher mechanism when the flipping mechanism is flipped, and W is the length of the pad. The control calculation module has built-in data of D0 and W. When the feedback value of the wire encoder is the same as L, it means that the pad has been placed in the designated position.

[0005] In a preferred embodiment, when the ingot enters the thickness measurement zone, the pre-flip angle is θ, and the ingot thickness detection sensor measures 10 sets of valid data from H0 to H9. Then, the actual ingot thickness H at this time is...

[0006]

[0007] This invention provides a method for using a device for determining the placement position of a material pad before heat treatment of an ingot, based on the aforementioned device for determining the placement position of a material pad before heat treatment of an ingot; including the following steps:

[0008] Step S1: The material pad is transported to the front of the pushing equipment for use in the next feeding; at this time, the material pad should be 0-50mm away from the pushing equipment to ensure that the pushing equipment leads the placement of the material pad;

[0009] Step S2: The ingot conveyor transports the ingot to the thickness measurement position, according to the formula... When the feedback value of the wire encoder is the same as L, it means that the pad has been placed in the designated position;

[0010] Step S3: The ingot conveyor waits for 1-5 seconds to measure the thickness of the ingot. This time should be longer than the time required for 10 thickness measurements.

[0011] Step S4: The pushing equipment begins the material pad setting operation based on the material pad placement position calculated by the control calculation module;

[0012] Step S5: The control calculation module compares the calculated value with the real-time feedback value of the wire encoder. When the value of the wire encoder is greater than or equal to the theoretical value, the material pad is stopped from pushing. At this time, the material pad is in the optimal position.

[0013] Compared with the prior art, the present invention has the following advantages: By adding sensors to the feeding mechanism of the heating furnace and programming, the present invention realizes the automatic placement of the material pad under ingots of different specifications by the pushing mechanism, which improves production efficiency and has been well applied on site. Attached Figure Description

[0014] Appendix Figure 1 This is a diagram showing the final arrangement of the ingots required by the present invention.

[0015] Appendix Figure 2 This is a side view of the device and corresponding equipment placement of the present invention;

[0016] Appendix Figure 3 This is a schematic diagram of the operation flow of the present invention. Detailed Implementation

[0017] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0018] It should be noted that the following detailed descriptions are illustrative and intended to provide further explanation of this application. Unless otherwise specified, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0019] It should be noted that the terminology used herein is for the purpose of describing particular implementations only and is not intended to limit the exemplary implementations according to this application; as used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise; furthermore, it should be understood that when the terms “comprising” and / or “including” are used in this specification, they indicate the presence of features, steps, operations, devices, components and / or combinations thereof.

[0020] A device for determining the placement position of the pad before heat treatment of ingots, referenced. Figure 1-3 ,include:

[0021] (1) Ingot presence detection sensor: placed perpendicular to the ingot movement direction, used to detect whether the ingot has reached the thickness measurement area;

[0022] (2) Ingot thickness detection sensor: placed perpendicular to the ingot plane to measure the ingot thickness H;

[0023] (3) Wire encoder: placed horizontally in the direction of the feeding mechanism, used to measure the real-time position L of the pad.

[0024] (4) The control and calculation module automatically places the bedding material through built-in PLC programming, enabling quick and accurate placement. This PLC programming control is existing technology known to those skilled in the art and will not be described in detail here.

[0025] This embodiment is implemented on a 720T vertical pusher furnace. The furnace heat-treats ingots with a thickness of 420-650mm. The ingots are required to be placed precisely in the center of a material pad. A pusher mechanism is used to place the material pad, and its tail is equipped with a wire encoder to provide real-time feedback on the pad's position. Specific ingot placement requirements are as follows: Figure 1 As shown.

[0026] Because the thickness of the ingots produced is not uniform, the placement of the material pad is also not fixed. To address this issue, this device incorporates the following sensors and their placement: an ingot presence detection sensor, positioned perpendicular to the ingot's movement direction, detects whether the ingot has reached the thickness measurement zone; an ingot thickness detection sensor, positioned perpendicular to the ingot plane, measures the ingot thickness H; and a wire encoder, positioned horizontally to the pushing mechanism's movement direction, measures the real-time position L of the material pad. The specific placement is as follows: Figure 2 As shown;

[0027] To ensure timely measurement of the ingot's thickness when it is located in the measurement area, at point ①, both an ingot thickness detection sensor and an ingot presence detection sensor should be placed simultaneously. At point ②, a wire encoder should be used, characterized by one end fixed in a precise and secure position, while the other end should be in close contact with the material pad to ensure accurate measurement of the material pad's position. Figure 2As shown by the dashed line, point ③ is a rotary encoder used to measure angle θ. This module is optional and is used for high-precision measurement.

[0028] By properly arranging the sensor's installation position, the accuracy and effectiveness of the detection can be ensured. Furthermore, to guarantee measurement accuracy, for the thickness measuring device, the average of 10 sets of data is calculated. This leads to the appropriate material pad placement method:

[0029] Assuming the pre-flip angle is θ when the ingot enters the thickness measurement zone, and the ingot thickness detection sensor measures 10 sets of valid data from H0 to H9, then the actual thickness H of the ingot at this time is...

[0030]

[0031] This leads to the formula for calculating the required position of the pad for an ingot of any thickness:

[0032]

[0033] Where D0 is the distance from the pusher mechanism when the flipping mechanism is in the flipped state, and W is the length of the pad. The calculation module has built-in data for D0 and W, which can quickly output the results. When the feedback value of the wire encoder is the same as L, it means that the pad has been placed in the specified position.

[0034] Finally, based on the calculated placement position of the pad, the pusher mechanism is automatically controlled to achieve automated pad placement.

[0035] To achieve the above-mentioned automatic placement of the material pad, this embodiment employs the following control method through programming, specifically including the following steps:

[0036] Step S1: The material pad is transported to the front of the pusher for use in the next feeding. At this time, the material pad should be 0-50mm away from the pusher to ensure that the pusher leads the placement of the material pad.

[0037] Step S2: The ingot conveyor transports the ingot to the thickness measurement position, according to the formula... Where D0 is the distance from the pushing mechanism to the tilting mechanism in the tilted state, and W is the length of the material pad. The control calculation module has built-in data for D0 and W, enabling rapid output of results. When the feedback value from the wire encoder is the same as L, it indicates that the material pad has been placed in the designated position. In practice, to prevent ingot slippage, the ingot conveyor is allowed to tilt upwards at a certain angle. Therefore, θ in the formula should be changed accordingly, and the remaining parameters in the formula are based on the specific implementation steps described.

[0038] Step S3: The ingot conveyor waits 1-5 seconds to measure the ingot thickness. Figure 2During this process, the ingot should be placed on mechanism ①③ and its associated structures while waiting. This time should be greater than the time required for 10 thickness measurements.

[0039] Step S4: The feeding device begins the material pad adjustment operation based on the material pad placement position calculated by the control calculation module. The calculation module is usually a PLC, which has the formula and corresponding constants from step S2 built in for high-speed calculation.

[0040] Step S5: The calculation module PLC compares the calculated value with the real-time feedback value from the wire encoder. When the wire encoder value is greater than or equal to the theoretical value, the material pad pushing stops, and the material pad is at its optimal position. It is important to note that the material pad placement operation using the pushing mechanism should not be too fast to ensure accuracy. Furthermore, to ensure full utilization of the equipment's computing power, this comparison process should also be performed within the calculation module PLC in step S4. This method can reduce time loss and data accuracy fluctuations caused by data transmission.

[0041] Its action flow diagram is as follows Figure 3 As shown:

[0042] This embodiment improves production efficiency by adding sensors to the feeding mechanism of the heating furnace and programming the automatic placement of the material pads under ingots of different specifications through the pushing mechanism, and has been well applied on site.

[0043] The above description is only a preferred embodiment of the present invention. All equivalent changes and modifications made in accordance with the claims of the present invention shall be covered by the present invention.

Claims

1. A device for determining the placement position of a material pad before heat treatment of an ingot, characterized in that, The system includes an ingot presence detection sensor, an ingot thickness detection sensor, a wire encoder, and a control calculation module. The ingot presence detection sensor is positioned perpendicular to the ingot's movement direction and is used to detect whether the ingot has reached the thickness measurement area. The ingot thickness detection sensor is positioned perpendicular to the ingot plane and is used to measure the ingot thickness H. The wire encoder is positioned on the same horizontal plane as the pushing mechanism's movement direction and is used to measure the real-time position L of the material pad. The ingot presence detection sensor, ingot thickness detection sensor, and wire encoder send the monitored ingot information to the control calculation module to obtain the calculation formula for the required position of the material pad corresponding to an ingot of any thickness. Where D0 is the distance from the pusher mechanism when the flipping mechanism is flipped, and W is the length of the pad. The control calculation module has built-in data of D0 and W. When the feedback value of the wire encoder is the same as L, it means that the pad has been placed in the specified position.

2. The device for determining the placement position of the pad before heat treatment of an ingot, as described in claim 1, is characterized in that, Assuming the ingot enters the thickness measurement zone with a pre-flip angle of θ, and the ingot thickness detection sensor measures 10 sets of valid data from H0 to H9, then the actual ingot thickness H at this time is...

3. A method for using a device for determining the placement position of a material pad before heat treatment of an ingot, characterized in that, An apparatus for determining the placement position of a material pad before heat treatment of an ingot, based on any one of claims 1-2, includes the following steps: Step S1: The material pad is transported to the front of the pushing equipment for use in the next feeding; at this time, the material pad should be 0-50mm away from the pushing equipment to ensure that the pushing equipment leads the placement of the material pad; Step S2: The ingot conveyor transports the ingot to the thickness measurement position, according to the formula... When the feedback value of the wire encoder is the same as L, it means that the pad has been placed in the designated position; Step S3: The ingot conveyor waits for 1-5 seconds to measure the thickness of the ingot. This time should be longer than the time required for 10 thickness measurements. Step S4: The pushing equipment begins the material pad setting operation based on the material pad placement position calculated by the control calculation module; Step S5: The control calculation module compares the calculated value with the real-time feedback value of the wire encoder. When the value of the wire encoder is greater than or equal to the theoretical value, the material pad is stopped from pushing. At this time, the material pad is in the optimal position.

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