Substrate carrier, substrate carrier holding mechanism, vacuum apparatus, use and method

Abstract

Various embodiments according to the present invention relate to a substrate carrier segment (150) comprising: a carrier frame (102); a substrate holding mechanism (106) for holding a substrate, at least partially integrated into the carrier frame (102) or mounted on the carrier frame (102); a mounting mechanism (104) for mounting a substrate carrier segment, adjacent to the carrier frame (102), the carrier frame (102) narrowing towards the mounting mechanism (104); two form-fitting contours (502a, 502b), which are arranged complementary to each other and between which are arranged an outer side of the carrier frame (102) opposite the mounting means (104).

Description

Technical Field

[0001] This invention relates to a substrate carrier, a substrate carrier holding mechanism, a vacuum device, its application, and a method. Background Technology

[0002] Generally, substrates can be processed (e.g., plated) in a vacuum environment, thereby altering their chemical and / or physical properties. Various plating processes can be used to plate substrates, with physical vapor deposition (PVD) being one of the most mature technologies. For example, vacuum plating systems can be used to deposit one or more layers onto one or more substrates via chemical and / or physical vapor deposition.

[0003] Such vacuum coating systems can be, for example, so-called rotary system types or so-called continuous system types.

[0004] A turntable system has a disc-shaped substrate carrier (also called a turntable) that carries multiple substrates and moves them along a circular transport path by rotation. Intuitively, this turntable system provides a more compact alternative to a continuous system, where the substrates must be transported along a straight path through the entire vacuum coating system, which occupies a large amount of structural space.

[0005] For various applications, the coating process implemented in this rotary system must meet stringent requirements. During this process, various structural and process parameters are interrelated and can all affect the coating outcome. Summary of the Invention

[0006] According to various embodiments of the present invention, a substrate carrier, a substrate carrier holding mechanism, a vacuum device, an application, and a method are provided to help meet stringent requirements for the results of coating processes (also known as process requirements). For example, substrate orientation deviations (e.g., relative to the coating apparatus) can be effectively reduced.

[0007] Clearly, with increasingly stringent process requirements, the spatial position (i.e., positioning and / or orientation, also known as substrate orientation) of the substrate during transport within a vacuum chamber is becoming increasingly important as a process parameter in the plating process. This spatial position affects the distance between the substrate and the plating apparatus, thereby influencing how the substrate is exposed to the plating material.

[0008] In this regard, the substrate orientation depends on the accuracy that the substrate carrier carrying the substrate can achieve during installation and configuration. However, conventional substrate carriers have almost no room for improving this accuracy.

[0009] For example, a substrate carrier often has multiple segments (also called substrate carrier sections), which can individually load and install substrates (also called multi-segment substrate carrier). The assembled substrate carrier sections form, for example, a ring structure, with the rotation axis of the substrate carrier arranged at the center of the ring structure, and each substrate carrier section can hold one or more substrates.

[0010] Against this backdrop, the present invention proposes several embodiments that help simplify the provision (e.g., manufacturing and / or assembly) of high-precision substrate carriers. For example, it improves the mounting accuracy of each substrate carrier segment. For example, it improves the manufacturing accuracy of each substrate carrier segment. This reduces variation factors that adversely affect the substrate orientation, such as manufacturing deviations and / or assembly deviations.

[0011] The following describes various embodiments relating to the above description and the accompanying drawings.

[0012] Example 1. The configuration according to any of the appended claims.

[0013] Example 2. A substrate carrier segment (preferably configured according to Example 1) includes: a carrier frame; a substrate holding mechanism for holding a substrate, at least partially integrated into or mounted on the carrier frame; a mounting mechanism for mounting the substrate carrier segment, adjacent to the carrier frame, the carrier frame narrowing toward the mounting mechanism; and two shape-fitting profiles (also known as support profiles) that are complementary to each other and have outer sides of the carrier frame and the mounting mechanism arranged between them.

[0014] Example 3. According to the configuration described in any of Examples 1 to 2, the carrier frame has two opposing end faces that are configured opposite to each other (e.g., inclined to each other) such that the carrier frame narrows toward the mounting mechanism.

[0015] Example 4. According to the configuration described in any of Examples 1 to 3, wherein each shape-fitting profile is set on one of the end faces.

[0016] Example 5. A substrate carrier segment (preferably configured according to any one of Examples 1 to 4) includes: two opposing end faces configured opposite each other (e.g., edges inclined to each other) such that the substrate carrier segment narrows toward a rotation axis; a mounting mechanism facing the rotation axis for mounting the substrate carrier segment; a substrate holding mechanism configured to hold the substrate and disposed between the two end faces; and two complementary shape-fitting profiles, wherein each shape-fitting profile is disposed on one of the end faces.

[0017] Example 6. According to any one of Examples 1 to 5, the configuration includes a first shape-fitting profile, which is preferably disposed on a first end face of the two end faces and / or has a protrusion; wherein the two shape-fitting profiles include a second shape-fitting profile, which is preferably disposed on a second end face of the two end faces and / or has a notch complementary to the protrusion.

[0018] Example 7. According to the configuration described in any of Examples 1 to 6, the included angle of the two end faces and / or the narrowing angle of the carrier frame are integer multiples of 360 degrees.

[0019] Example 8. According to any of Examples 1 to 7, the configuration is such that two shape-fitting profiles (e.g., end faces through their shape-fitting profiles) are configured to mesh with each other.

[0020] Example 9. According to any of Examples 1 to 8, the configuration is such that two shape-fitting profiles (e.g., end faces through their shape-fitting profiles) are configured to be centered.

[0021] Example 10. According to any one of Examples 1 to 9, the configuration is such that the shape-fitting contour is configured to achieve a mortise and tenon connection.

[0022] Example 11. According to any of Examples 1 to 10, the configuration is such that one or more shape-fitting profiles are at least partially wedge-shaped.

[0023] Example 12. According to the configuration described in any of Examples 1 to 11, wherein the first shape-fitting profile of the two shape-fitting profiles is provided by a wedge-shaped and / or stepped protrusion, preferably (at least partially) and wherein the first shape-fitting profile is preferably provided by a tenon-shaped interlocking mechanism that extends the wedge-shaped section of the protrusion and / or is opposite to the second shape-fitting profile of the two shape-fitting profiles.

[0024] Example 13. According to any one of Examples 1 to 12, the substrate holding mechanism is configured to hold two substrates, for example, two substrates spaced apart from each other, vertically.

[0025] Example 14. According to any one of Examples 1 to 13, the substrate holding mechanism is configured to receive one or more substrates in a form-fitting manner.

[0026] Example 15. The configuration according to any one of Examples 1 to 14 further includes: processing a pattern to process (e.g., cutting and / or roughening) a substrate carrier segment (e.g., its surface and / or its edges) according to the processing pattern, wherein the processing pattern is symmetrical, preferably symmetrical about an axis extending from the mounting mechanism (e.g., the axis of symmetry of the substrate carrier).

[0027] Example 16. According to the configuration described in any of Examples 1 to 15, a rolling direction is further included, which is parallel or transverse to the axis of symmetry of the substrate carrier segment and / or parallel or transverse to the axis extending from the mounting mechanism (e.g., the axis of symmetry of the substrate carrier).

[0028] Example 17. The configuration according to any one of Examples 1 to 16 further includes: an outer side away from the mounting mechanism, the outer side (e.g. extending toward the mounting mechanism and / or into the frame) having one or more (e.g., channel-shaped) notches (also known as coupling notches or gripping grooves), each notch preferably: angled toward one of two shape-fitting profiles (or at least an end face); having a section that narrows toward the mounting mechanism; and / or being defined by a zigzag shape-fitting profile.

[0029] Example 18. A substrate carrier comprising: a plurality of substrate carrier segments, wherein each substrate carrier segment is configured according to any one of Examples 1 to 17.

[0030] Example 19. A substrate carrier holding mechanism, comprising: a rotating shaft; a plurality of mounting bases (also referred to as mounting mechanisms of the substrate carrier holding mechanism) arranged in a pattern (symmetric about the rotating shaft) around the rotating shaft, wherein each mounting base includes: a receiving mechanism (e.g., a movable, rotatable support) for receiving a substrate carrier segment, preferably configured according to any one of Examples 1 to 17; a first actuating mechanism (also referred to as an alignment member) configured to (preferably in response to actuation) modulate the angle (also referred to as an alignment angle) between the rotating shaft and the receiving mechanism; an optional locking mechanism configured to selectively lock or release the angle modulation (preferably in response to actuation); and an optional pivot through which the mounting mechanism is movably supported.

[0031] Example 20. According to the configuration described in Example 19, it further includes: a bearing mechanism (also known as a base bearing), through which the receiving mechanism is movably supported relative to the rotating shaft; the base bearing preferably has a rotating bearing.

[0032] Example 21. According to the configuration described in Example 19 or Example 20, wherein the first actuator is configured to transmit torque to the receiving mechanism to adjust the angle and / or has a transmission mechanism for transmitting torque (e.g., provided by a thread).

[0033] Example 22. According to the configuration described in Example 19 or Example 21, the receiving mechanism has two grippers that are movably supported relative to each other, forming a receiving gap between the two grippers and / or being held by a first actuator.

[0034] Example 23. According to the configuration described in Example 22, the receiving mechanism includes a spring for providing a restoring force applied between the grippers, preferably driving the grippers to separate.

[0035] Example 24. According to the configuration described in Example 22 or Example 23, wherein the receiving mechanism includes one or more protrusions for restricting the movement path when receiving the substrate carrier segment, wherein preferably, the second actuator is at least partially arranged between the two protrusions of the receiving mechanism, and / or wherein preferably, each protrusion includes a rotatably supported ring.

[0036] Example 25. The configuration according to any one of Examples 22 to 24, wherein the mounting mechanism includes a second actuator for transmitting force to the receiving area and / or for applying force between the grippers, preferably for clamping the mounting mechanism.

[0037] Example 26. According to the configuration described in Example 25, the second actuator includes a transmission mechanism (e.g., provided by a thread) that actuates the grippers.

[0038] Example 27. A vacuum device, comprising: a vacuum chamber and a substrate carrier holding mechanism disposed within the vacuum chamber according to any one of Examples 23 to 26.

[0039] Example 28. The configuration according to Example 27 further includes a plating apparatus configured to emit plating material, preferably with the substrate carrier holding mechanism exposed to the plating material.

[0040] Example 29. According to the configuration described in Example 27 or Example 28, a plurality of substrate carrier segments are held by a substrate carrier holding mechanism (preferably according to the configuration described in any one of Examples 1 to 17).

[0041] Example 30. An application of forming (e.g. manufacturing) a substrate carrier segment (preferably configured according to any one of Examples 1 to 17) by means of a heat treatment process (e.g., an ablation process and / or an irradiation process), wherein the heat treatment process is performed in a process pattern that is symmetrical about the axis of symmetry of the substrate carrier segment and / or about the included angle between two opposite end faces of the substrate carrier segment.

[0042] Example 31. According to the configuration described in Example 30, the heat treatment process (also known as the laser ablation process) is performed by laser.

[0043] Example 32. According to the configuration described in either Example 30 or Example 31, the process pattern realizes multiple pairs of regions (also known as irradiated regions) of, for example, a substrate carrier segment, wherein a pair of irradiated regions are symmetrical about an axis of symmetry and / or an included angle, and are exposed to processes (e.g., an ablation process and / or an irradiation process) in succession.

[0044] Example 33. According to any one of Examples 30 to 32, the process pattern is symmetrical about the rolling direction and / or rolling edge of the substrate carrier segment or at least one blank (e.g., sheet metal) forming the substrate carrier segment.

[0045] Example 34. According to any one of Examples 30 to 33, the process pattern is configured such that the strain of the substrate carrier segment caused by the ablation process is symmetrical about the included angle and / or the axis of symmetry.

[0046] Example 35. The configuration according to any one of Examples 30 to 34, wherein the process (e.g., ablation process and / or irradiation process) includes laser roughening.

[0047] Example 36. The configuration according to any one of Examples 30 to 35, wherein the process (e.g., ablation process and / or irradiation process) includes laser cutting (also known as laser cutout).

[0048] Example 37. A method (preferably configured according to any one of Examples 1 to 36) comprising: controlling a heat treatment process (e.g., an ablation process and / or an irradiation process) according to a process pattern; forming a substrate carrier segment by the ablation process (preferably configured according to any one of Examples 1 to 17), wherein the process pattern is symmetrical about the included angle between two opposite end faces of the substrate carrier segment and / or about the axis of symmetry of the substrate carrier segment.

[0049] Example 38. The configuration according to any one of Examples 1 to 37, wherein the mounting mechanism is plate-shaped and / or configured to be inserted into the receiving gap.

[0050] Example 39. The configuration according to any one of Examples 1 to 38, wherein the mounting mechanism has one or more recesses (also called mounting recesses) whose opening direction (e.g., radial) is opposite to the substrate holding mechanism.

[0051] Example 40. The configuration according to any one of Examples 1 to 39, wherein the carrier frame is integrally connected to the mounting mechanism and / or two shape-fitting contours.

[0052] Example 41. According to the configuration described in any of Examples 1 to 40, wherein the first shape locking profile of the two shape locking profiles is provided by a centering wedge, and the second shape locking profile of the two shape locking profiles is provided by a centering bucket complementary to the centering wedge.

[0053] Example 42. According to the configuration described in any of Examples 1 to 41, wherein the first shape-locking profile of the two shape-locking profiles is provided by a tenon, and the second shape-locking profile of the two shape-locking profiles is provided by a mortise that is complementary to the tenon.

[0054] Example 43. According to the configuration described in any of Examples 1 to 42, the substrate carrier segment further includes a symmetry axis, and the substrate carrier segment is roughened according to a processing pattern symmetrical about the symmetry axis.

[0055] Example 44. According to the configuration described in any of Examples 1 to 43, the substrate carrier segment further includes a symmetry axis, and the rolling direction of the substrate carrier segment is transverse to the symmetry axis.

[0056] Example 45. The configuration according to any one of Examples 1 to 44, wherein the axis of symmetry is the bisector of the angle between the two opposite end faces of the substrate carrier segment.

[0057] Example 46. According to the configuration described in any of Examples 1 to 45, the two opposite end faces of the substrate carrier segment are at the same angle relative to the axis of symmetry of the substrate carrier segment. Attached Figure Description

[0058] Figure 1A and Figure 2A Schematic side views or cross-sectional views of the substrate carrier segment according to various embodiments are shown respectively;

[0059] Figure 1B A schematic side view or cross-sectional view of a substrate carrier according to various embodiments is shown;

[0060] Figure 2B and Figure 3A Different schematic diagrams of the conveying device according to various embodiments are shown respectively;

[0061] Figure 3B A schematic perspective view of the receiving mechanism according to various embodiments is shown;

[0062] Figure 4A A schematic perspective view of the mounting base according to various embodiments is shown;

[0063] Figure 4B A schematic side view or cross-sectional view of a conveying device according to various embodiments is shown;

[0064] Figure 5A and Figure 5B Schematic side views or cross-sectional views of the substrate carrier segment according to various embodiments are shown respectively;

[0065] Figure 5C A schematic side view or cross-sectional view of a conveying device according to various embodiments is shown;

[0066] Figure 6A and Figure 6B Schematic side views or cross-sectional views of the substrate carrier segment according to various embodiments are shown respectively;

[0067] Figure 7A and Figure 7B Schematic flowcharts of process patterns according to various embodiments are shown respectively.

[0068] Figure 8A and Figure 8B Schematic diagrams of process patterns according to various embodiments are shown respectively;

[0069] Figure 9A and Figure 9B Schematic side views or cross-sectional views of vacuum devices according to various embodiments are shown respectively. Detailed Implementation

[0070] The following description, in conjunction with the accompanying drawings which form part of this document, illustrates specific embodiments in which the invention may be practiced. In this regard, directional terms such as “up,” “down,” “front,” “back,” “forward,” and “backward” are used with reference to the orientation of the accompanying drawings. Components in various embodiments may be positioned in several different directions; therefore, the directional terms are illustrative and not restrictive. It is self-evident that other embodiments and structural or logical modifications may be made without departing from the inventive concept. It is self-evident that features of the various embodiments described herein can be combined with each other unless otherwise specifically indicated. Therefore, the following specific details should not be construed as restrictive, and the scope of protection of this invention should be defined by the appended claims.

[0071] In the context of this specification, the terms "connection," "docking," and "coupling" are used to describe direct and indirect connections (e.g., resistive and / or conductive connections), direct or indirect docking, and direct or indirect coupling. In the accompanying drawings, identical or similar elements may be labeled with the same reference numerals where appropriate.

[0072] According to various embodiments, the term "coupling" can be understood as, for example, a direct or indirect (e.g., mechanical, hydrostatic, thermal, and / or electrical) connection and / or interaction. Multiple elements may be coupled to each other, for example, along an interaction chain, and may exchange interactions along the interaction chain, such as fluid (also known as fluid-conductive coupling). For example, two coupled elements may exchange interactions with each other, such as mechanical, hydrostatic, thermal, and / or electrical interactions. Coupling of multiple vacuum components (e.g., valves, pumps, chambers, etc.) may include fluid-conductive coupling between these components. According to various embodiments, "connection" can be understood as a mechanical (e.g., material or physical) coupling, such as direct material contact. A connection may be configured to transmit mechanical interactions (e.g., forces, torques, etc.).

[0073] According to various embodiments, the bearing mechanism can be configured to support (e.g., guide, position, and / or retain) one or more components. For example, the bearing mechanism may have one or more bearings for each component to support (e.g., guide, position, and / or retain). Each bearing in the bearing mechanism may be configured to provide one or more degrees of freedom (e.g., translational or rotational degrees of freedom) to the component, allowing the component to move according to those degrees of freedom. Bearings include, for example, radial bearings, axial bearings, radial-axial double-direction bearings, and linear bearings (also known as linear guides). For example, each linear bearing may provide exactly one translational degree of freedom to the component.

[0074] In this article, "spatial location" can be understood as spatial information about the orientation and / or positioning of an object, such as relative to one or more object reference points (e.g., center of mass / center of gravity / centroid). For example, positioning can be represented as coordinate points in space, and orientation can be represented as the object's orientation relative to space (e.g., direction, spatial angle, or vector). For example, object positioning can be represented as the positioning of the object's center of mass in space. Alternatively or additionally, orientation can be represented as the relative positional relationship between the object's center of mass and centroid (e.g., vector or spatial angle).

[0075] A trajectory can refer to a series of positions along a path of motion (e.g., the position of a laser beam irradiation). These positions can be selectively associated with time components (i.e., motion-dependent, also known as motion), such as the temporal sequence or velocity of motion along the trajectory. Generally, position or other spatial information in three-dimensional space can be expressed using Cartesian coordinates. However, other coordinate systems, such as cylindrical coordinates, can also be used.

[0076] This article specifically uses the terms "pattern" (e.g., process pattern) and "timing" as logical groupings of specifications (e.g., expressed by working parameters) for guiding a laser beam toward an object (e.g., a metal plate or substrate carrier segment). The pattern visually corresponds to the target power distribution of the object to be irradiated, and is transmitted through the pattern during the irradiation of the object by the laser beam. The timing visually represents the temporal sequence (also known as order) of the irradiation process. The pattern and timing can be collectively represented as a trajectory that, when projected onto the object, indicates both the spatial power distribution (by pattern) and the temporal power distribution (by timing).

[0077] Each pattern may contain or consist of a series of parameters (also known as irradiation parameters) according to which a laser beam irradiates an object, for example, a series of exactly N (also known as the number of points) irradiation parameters. It is thus understood that this specification grouping is merely illustrative, and the related descriptions can certainly be applied analogously to specifications applicable to any other type of irradiated object.

[0078] In this document, "mounting mechanism" refers to a mechanism specifically designed for installation, such as mounting to a complementary mounting mechanism (also known as a mating mounting mechanism). During installation, multiple components are interconnected (e.g., rigidly connected) via their mounting mechanisms. This installation can be (e.g., only) form-fit and / or detachable. Preferably, the mounting mechanism may have a mounting surface (e.g., a mounting plane) that abuts against the complementary mounting surface of the mating mounting mechanism during installation. The mounting mechanism may, for example, have one or more (e.g., integral) mounting profiles (e.g., form-fit profiles), provided, for example, by means of the mounting mechanism's protrusions and recesses (e.g., protrusions or recesses). Mounting profiles include, for example, threads, mortises (e.g., keyways and / or dovetails), locking tabs, pins, tenons, etc.; protrusions and recesses include, for example, openings (e.g., through holes and / or threaded holes), pins (e.g., bolts).

[0079] The (cubic) extension of a component is configured to connect the component to another component. For example, a tenon may be configured as a protruding end. For example, the complementary portion of the tenon may have a (e.g., mortise) gap into which the tenon may be inserted (e.g., by friction fit and / or sliding fit). In this case, the tenon may also be referred to as a plug (also known as a tongue), particularly when it can close a complementary plug hole.

[0080] According to various embodiments, a vacuum chamber can be provided by a chamber housing containing one or more chambers. The chamber housing can be coupled (e.g., gas conduction coupling) to a pump assembly (e.g., a vacuum pump assembly) to provide negative pressure or vacuum (vacuum chamber housing) and can be stably configured to withstand the pressure effects of evacuation. The pump assembly (including at least one vacuum pump, such as a high-vacuum pump, or a turbomolecular pump) can pump out a portion of the gas from inside the processing chamber, for example, from the processing space. Accordingly, one or more vacuum chambers can be provided within the chamber housing. In other words, the chamber housing can be configured as a vacuum chamber housing, or a coated chamber can be configured as a vacuum chamber.

[0081] The term "actuator" (e.g., including actuators or actuators) can be understood as a converter configured to influence the state of a process (e.g., a plating process) or equipment in response to actuator activation. An actuator can convert the action it receives (through which it is controlled) into a change in mechanical motion or physical variable (e.g., force or movement). For example, a mechanical actuator can be configured to convert a force (e.g., torque) applied when the actuator is activated into another force or movement. Components of an actuator include, for example, valves (e.g., pump sets and / or gas supply devices), motors (e.g., valves or pumps), adjusting screws, gears, etc.

[0082] In this document, a substrate carrier refers to a device for carrying one or more substrates. For this purpose, the substrate carrier has a frame (also called a carrier frame) and one or more substrate holding mechanisms, which may be at least partially (i.e., partially or completely) integrated into the frame and / or at least partially mounted on the frame. Components of the substrate holding mechanism include, for example: a recess (also called a substrate groove) for receiving the substrate; a substrate support portion (e.g., disposed in the substrate groove) for placing the substrate; and a locking mechanism configured to lock the substrate relative to the substrate holding mechanism (e.g., in a form-fit and / or force-fit manner). The frame may also include one or more sections for carrying or mounting the frame. For example, the section may include a mounting mechanism for mounting the substrate carrier.

[0083] The coating apparatus is configured to provide coating material, such as a transport path and / or a substrate exposed to the coating material. For example, the coating material may be directed toward the transport path and / or the substrate, for example, along a so-called emission direction. The coating apparatus includes, for example, a coating material source through which the coating material is provided (e.g., emitted). The coating apparatus may be configured, for example, to perform vapor deposition, such as physical vapor deposition (PVD) or chemical vapor deposition (CVD).

[0084] For example, the coating apparatus can be configured to provide gaseous coating material (material vapor) and / or liquid coating material, which can be deposited onto, for example, at least one substrate to form a coating. The coating material source may include at least one of the following: a sputtering apparatus, a thermal evaporation apparatus (e.g., a laser beam evaporator, an arc evaporator, an electron beam evaporator, and / or a thermal evaporator), a precursor gas source, or a liquid-phase atomizer. The sputtering apparatus can be configured to atomize the coating material using plasma. The thermal evaporation apparatus can be configured to evaporate the coating material using thermal energy. Depending on the properties of the coating material, both thermal evaporation (i.e., thermal conversion from liquid (liquid phase) to gaseous (gas phase)) and sublimation (i.e., thermal conversion from solid (solid phase) to gaseous) can occur. In other words, the thermal evaporation apparatus can also sublimate the coating material. The liquid-phase atomizer can be configured to apply the coating material, such as a dye, from the liquid phase.

[0085] To simplify the explanation of the geometry of various components (such as substrate carrier segments, substrate carriers and / or holding mechanisms), this article will use examples from each side.

[0086] For various embodiments, this document refers to the axis of symmetry of an object (e.g., a substrate carrier segment). It should be understood that not all contours of the object need to be symmetrical about this axis of symmetry. For example, the object may have a curved outer surface symmetrical about the axis of symmetry. For example, the object may have one or more surfaces symmetrical about the axis of symmetry (e.g., a substrate support surface). For example, the object may have multiple notches symmetrical about the axis of symmetry. For example, the object may have two outer edges symmetrical about the axis of symmetry. For example, the object may narrow symmetrically about and / or along the axis of symmetry. Symmetry includes, for example, mirror symmetry, translational symmetry, rotational symmetry, or combinations thereof.

[0087] Figure 1A A schematic side view or cross-sectional view of a substrate carrier segment 100a (preferably configured according to Example 1 and / or Example 2) according to various embodiments is shown, wherein the radial direction 105 and the transport direction 101 (based on the reference coordinate system of the substrate carrier segment) are indicated.

[0088] To simplify the explanation of the geometry of the substrate carrier segment, refer to its inner side 151 and outer side 153 (between which the substrate holding mechanism 106 is arranged) and its two end faces 155a and 155b. The radial direction 105 is from the outer side 153 to the inner side 151. The mounting mechanism 104 can face the inner side 151, and the carrier frame 102 narrows inward.

[0089] In one embodiment, the substrate carrier segment (preferably according to Example 40) comprises an integral plate containing a carrier frame 102 and a mounting mechanism 104. Alternatively or additionally (preferably according to Example 38), the mounting mechanism 104 and the carrier frame 102 are plate-shaped. It is understood that the carrier frame 102 and the mounting mechanism 104 may also be joined in a form-fit manner, for example, screwed together.

[0090] In one embodiment, the substrate holding mechanism 106 has a groove extending into the substrate.

[0091] The edges 102a, 102b (also referred to as bearing edges 102a, 102b) of the carrier frame 102 facing the end faces 155a, 155b may be inclined relative to each other and / or inclined relative to the radial direction 105, for example, in a straight line. This ensures that the carrier frame 102 narrows toward the inward side 151. Alternatively or additionally, the two opposite edges of the mounting mechanism 104 continue the bearing edges 102a, 102b.

[0092] The edges 102a and 102b of the carrier frame 102 facing the end faces 155a and 155b can form an included angle W (also known as a corner), and the bisector of this included angle W extends along the radial direction 105. This included angle can approximately satisfy the following relationship: W = 360° / k, where the parameter k (also known as the count k) is a natural number greater than 2, for example, k ≥ 3, k ≥ 4, k ≥ 6, k ≥ 8, k ≥ 10. The count k intuitively represents the number of substrate carrier segments spliced ​​to form the substrate carrier, as detailed below.

[0093] Figure 1B A schematic side view or cross-sectional view of a substrate carrier 100b (preferably configured according to embodiment 100a) is shown according to various embodiments, the substrate carrier 100b having a plurality of substrate carrier segments 150. For example, the count k is 8.

[0094] Multiple substrate carrier segments 150 can be spliced ​​(also known as spliced ​​state) to form a ring structure, in which an opening 152 of the substrate carrier (also known as carrier opening 152) is formed. The mounting mechanism 104 of each substrate carrier segment 150 can be adjacent to the carrier opening 152.

[0095] Clearly, the carrier opening 152 provides structural space for a substrate carrier holding mechanism, for example, with a hub. In the assembled state, the carrier edges of adjacent substrate carrier segments 150 can engage with each other, as detailed below.

[0096] Figure 2A A schematic side view or cross-sectional view of a substrate carrier segment 200a (preferably configured according to any one of embodiments 100a to 100b) is shown.

[0097] In one embodiment, the mounting mechanism 104 has one or more shape-fitting profiles for assembly. In one embodiment, the shape-fitting profiles (preferably according to Example 39) are provided by mounting recesses that open in the radial direction 105. Each mounting recess 104a may, for example, narrow in the radial direction 105, thereby simplifying assembly.

[0098] In one embodiment, the substrate holding mechanism 106 has a support surface 106a (also referred to as a substrate support portion) that defines a groove. For example, the support surface 106a may be provided by a protrusion.

[0099] Figure 2B A schematic side view or cross-sectional view of a transfer device 200b (preferably configured according to any one of embodiments 100a to 200a) including a substrate carrier holding mechanism 250 and a substrate carrier (preferably configured according to Example 18) is shown according to various embodiments. For example, the count k is 10.

[0100] In the reference coordinate system of the substrate carrier, the radial direction 105 of each substrate carrier segment points to and / or is perpendicular to the rotation axis 201. During operation, the substrate carrier can rotate about the rotation axis 201, so that each substrate carrier segment is conveyed along a circular conveying path. The conveying direction 101 of each substrate carrier segment can be tangent to the conveying path and / or perpendicular to the rotation axis 201.

[0101] The substrate carrier holding mechanism 250 has k mounting bases 204, for example, one mounting base 204 for each substrate carrier segment 150. The mounting bases 204 are configured to establish a connection with the mounting mechanism 104 to mount the substrate carrier segment 150 to the substrate carrier holding mechanism 250.

[0102] In one embodiment, the substrate carrier holding mechanism 250 (preferably according to Example 19) further includes a bearing mechanism 251 (also called a hub) whereby the mounting base 204 is rotatably supported about the rotation axis 201 of the bearing mechanism. For this purpose, the bearing mechanism may have one or more rotary bearings, thereby providing the rotation axis 201.

[0103] The mounting substrate carrier segment 150 may include moving the substrate carrier segment 150 radially toward the substrate carrier holding mechanism 250 such that the mounting mechanism 104 and the mounting base 204 come into contact with each other (e.g., engage with each other).

[0104] Figure 3A A schematic perspective view is shown of a transfer device 300a (preferably configured according to any one of embodiments 100a to 200b) including a substrate carrier holding mechanism 250 and a substrate carrier (preferably configured according to Example 18) according to various embodiments.

[0105] In one embodiment, the mounting base 204 (preferably configured according to Example 21) includes a receiving mechanism 302 for receiving the substrate carrier segment 150, providing a receiving gap 302s. The receiving gap 302s is configured to receive the mounting mechanism 104, for example, allowing the mounting mechanism 104 to be inserted into the receiving gap 302s.

[0106] Figure 3B A schematic cross-sectional view of a receiving mechanism (preferably configured according to Example 22) according to various embodiments 300b (preferably configured according to any one of embodiments 100a to 300a) is shown.

[0107] In one embodiment, the receiving mechanism 302 (preferably according to Example 23) has one or more springs 352 arranged in a receiving gap 302s between two grippers 354a, 354b. The springs 352 are configured to apply a first force (also known as a restoring force) between the grippers, allowing the grippers 354a, 354b to move toward each other against this first force. Furthermore, the mounting base 204 has one or more screws as an actuator 356 (also known as a mounting member). The mounting member 356 is configured to influence the distance between the two grippers 354a, 354b, for example, by turning the screws (also known as tightening the screws). The mounting member 356 may, for example, be configured to engage in a mounting recess 104a of the mounting mechanism 104, thereby simplifying assembly.

[0108] This embodiment or alternative embodiment of the receiving mechanism 302 (preferably according to Example 23) has one or more shape-fitting profiles (also known as base profiles) as guide members, which extend into the receiving gap 302s and / or are configured to engage with the mounting mechanism 104. In one embodiment, the guide members are implemented, for example, by protrusions 358 (also known as guide members) projecting into the receiving gap 302s. For example, the receiving mechanism 302 may have two guide members 358, with a mounting member 356 arranged between them, for example.

[0109] Each guide member 358 may, for example, be configured to engage in a mounting recess 104a of the mounting mechanism 104, thereby simplifying assembly. For example, each guide member 358 may extend through one of the springs and / or be implemented by a screw.

[0110] In one embodiment, the guide member 358 (preferably according to Example 24) includes a ball bearing 360 providing a rotatable support ring, thus simplifying assembly. For example, each guide member in the receiving mechanism may have two springs with the ball bearing 360 arranged between them to transmit restoring force through the ball bearing 360, thus simplifying the configuration because fewer parts are required to hold the ball bearing 360 and generate the restoring force.

[0111] Figure 4A A schematic perspective view of a mounting base 400a (preferably configured according to Example 20) is shown according to various embodiments (preferably configured according to any one of Embodiments 100a to 300b). The mounting base bearing mechanism 402 (also referred to as base bearing 402) visually provides a joint for movably connecting the receiving mechanism 302 to the hub 251.

[0112] In one embodiment, the base bearing 402 provides a rotating shaft (also known as an alignment shaft) that is spaced apart from the receiving mechanism 302 or at least spaced apart from the receiving gap 302s. This ensures that the orientation of the receiving mechanism 302 or at least the receiving gap 302s is variable.

[0113] In one embodiment, the first actuator 404 (also referred to as the alignment member) includes one or more screws (also referred to as alignment screws), for example, screwable into the receiving mechanism 302. The alignment screws are configured to, for example, adjust the orientation of the receiving mechanism 302 relative to a reference plane (a plane transverse to the rotation axis 201) by rotating the alignment screws. This changes the angle between the rotation axis 201 and the receiving mechanism 302.

[0114] For example, the alignment screw can be configured to apply a force between the receiving mechanism 302 and the hub 251. To do this, the alignment screw can, for example, extend through the receiving mechanism 302, and when the alignment screw is screwed into the receiving mechanism 302, its end presses against the support mechanism of the hub 251.

[0115] In one embodiment, the locking mechanism 406 includes one or more screws (also known as locking screws) configured to provide rotational freedom to the locking receiving mechanism 302 via the base bearing 402 (e.g., by screwing in the locking screws) or release that rotational freedom (e.g., by unscrewing the locking screws). This facilitates precise alignment and locking of the substrate carrier segment.

[0116] Alternatively or additionally, the locking mechanism 406 may be configured to limit the movable angle of the receiving mechanism 302 to a range (also known as the pivot range), which varies with the state of the locking mechanism 406. Preferably, the locking mechanism 406 may be configured to reduce the pivot range (e.g., by turning the locking screw) when it enters a first state. Preferably, the locking mechanism 406 may be configured to expand the pivot range (e.g., by turning the locking screw) when it enters a second state.

[0117] Figure 4BA schematic side or cross-sectional view of a transfer device 400b (preferably configured according to any one of embodiments 100a to 400a) including a substrate carrier holding mechanism 250 and a substrate carrier (preferably configured according to Example 18) is shown according to various embodiments. The alignment axis 401 of each mounting base 204s may be transverse to the rotation axis 201 of the hub 251 and / or parallel to the reference plane 451.

[0118] The reference plane 451 can be directly used as a reference plane for the alignment substrate support surface and / or alignment angle A. For example, during operation, the alignment angle A can be approximately 90°. The misalignment angle A* of the alignment angle A can be defined as the angle between the reference plane 451 and the substrate support surface.

[0119] Intuitively, once the substrate carrier segment is installed via its mounting mechanism 104 (also known as the installed state), the substrate carrier segment can be considered as a cantilever beam, which will deform under the action of gravity, for example, along a bending line. In the installed state, the position of the substrate carrier segment relative to the reference plane depends on the deformation and / or various parameters (such as the characteristics of the substrate carrier segment and / or the mounting base), which may vary from substrate carrier segment to substrate carrier segment.

[0120] These parameters (also known as positional parameters) may vary (also known as positional parameter deviations) due to the multiple substrate carrier segments of the substrate carrier, and include: curvature in the unloaded state, mechanical stiffness, position relative to the mounting base in the mounted state, stresses experienced in the mounted state (e.g., thermal and / or mechanical), historical records, crystal structure of the substrate carrier segment, etc. Some characteristics of the substrate carrier segment may be time-dependent and change over time (e.g., due to thermal load). Similarly, tolerances (manufacturing and / or assembly tolerances) can cause differences in positional parameters. This can be analogized to the relationship between mounting bases.

[0121] As a result of positional parameter differences, for example, even if the mounting base and substrate carrier segments are precisely manufactured and assembled, the positions of several substrate carrier segments relative to a reference plane (e.g., the position of the substrate support surface 106a) will still differ (also known as positional differences). This positional difference can be reduced, for example, by adjusting the alignment angle A. To do this, the alignment member can be activated and / or the alignment angle A can be adjusted according to the specifications indicating the target position of the substrate carrier segment.

[0122] Similarly, the presence of support contours helps reduce positional discrepancies. Various implementations of support contours are explained below.

[0123] Figure 5A and Figure 5BSchematic cross-sectional views of substrate carrier segments 500a and 500b (preferably configured according to Example 1 and / or Example 2) viewed along radial direction 105 are shown, according to various embodiments (preferably configured according to any one of Examples 100a to 400b). Direction 501 (also referred to as insertion direction 501), for example, is indicated in the figure, either in the same direction as or opposite to the transport direction 101.

[0124] Two support edges 102a, 102b (e.g., the first support edge 102a) may have a first support profile 502a. Two support edges 102a, 102b (e.g., the second support edge 102b) may have a second support profile 502b, which is complementary to the first support profile 502a. The first support profile 502a and the second support profile 502b may, for example, be configured to engage with each other (also known as mutual profile engagement) and / or be opposed to each other. The support profiles allow two directly opposing substrate carrier segments of the substrate carrier to engage with each other with their support profiles, thereby aligning (also known as centering) and supporting each other.

[0125] This will suppress positional differences.

[0126] In one embodiment, the first support profile 502a (preferably according to Example 11) is achieved by a (e.g., stepped) protrusion that, for example, protrudes away from the substrate holding mechanism 106 along the insertion direction 501. The protrusion may, for example, have a wedge-shaped section 502k and / or at least partially narrow along the insertion direction 501, which enhances the centering effect. Alternatively or additionally, the protrusion may have a tenon-shaped section 502z (also known as a tenon 502z, for example, providing a tongue) and / or extend to a wedge-shaped section 502k (also known as a centering wedge 502k, for example, protruding therefrom along the insertion direction 501).

[0127] In one embodiment, the second support profile 502b is achieved by a groove (e.g., a stepped groove) with an opening facing away from the substrate holding mechanism 106 direction (i.e., the reverse insertion direction 501). The groove may, for example, have a funnel-shaped section 502v (also known as a centering funnel) and / or at least partially narrow towards the substrate holding mechanism 106 (and / or the reverse insertion direction 501), which enhances the centering effect. Alternatively or additionally, the groove may have a mortise-shaped section 502n (also known as a mortise 502n), for example, providing a tenon and / or continuing the tapered section 502v (e.g., along the insertion direction 501).

[0128] The first support profile 502a and the second support profile 502b can be configured, for example, to interlock. During interlocking, the tenon 502z can be inserted, for example, into the centering mortise 502v (e.g., sliding in along its inner wall), and then into the mortise 502n (e.g., sliding in along its inner wall).

[0129] In one embodiment, the tenon 502z and / or mortise 502n are configured such that the gap between them (e.g., transverse to the insertion direction 501) is less than 10 mm in the mating state. -g cm (cm), where g≥0, e.g. g≥1, e.g. g≥2.

[0130] In one embodiment, the centering wedge 502k and / or the centering bucket 502v are configured such that the gap between them (e.g., transverse to the insertion direction 501) is less than 10 mm in the plugged-in state. -g cm (cm), where g≥0, e.g. g≥1, e.g. g≥2.

[0131] Figure 5C A schematic top view 500c and a partial enlarged view 500d of a substrate carrier (preferably configured according to Example 18) viewed along the rotation axis 201 according to various embodiments (preferably configured according to any one of Embodiments 100a to 500b).

[0132] In one embodiment, the substrate carrier forming method includes conveying (also known as segment addition) a substrate carrier segment 150, for example, along its radial direction 105 (pointing towards the rotation axis 201), to a region 571 (also known as a segmented region), which is formed between two adjacent substrate carrier segments of a substrate carrier segment group 572 (also known as a segment group 572), for example, toward the rotation axis 201. When adding segments, insertion can be accomplished, for example, by inserting a first shape-fitting profile 502a of the substrate carrier segment 150 into a second shape-fitting profile 502b of the segment group 572 adjacent to the segmented region. For example, a tenon 502z of the substrate carrier segment 150 can be introduced into a centering slot 502v of the segment group 572 adjacent to the segmented region (e.g., sliding along its inner wall), and then into a mortise 502n of the continuation centering slot 502v of the segment group 572 (e.g., sliding along its inner wall). When inserted, the substrate carrier segment 150 can be aligned (also known as aligning) with the segment group 572.

[0133] For example, when segments are added, the receiving mechanism (not shown in the figure) of the substrate carrier holding mechanism can also receive the mounting mechanism 104 (e.g., through the receiving gap).

[0134] The above method may also include: mounting the substrate carrier segment 150 onto the substrate carrier holding mechanism (e.g., its mounting base) via the mounting mechanism 104 (also referred to as mounting the substrate carrier segment) and / or aligning it (also referred to as aligning the substrate carrier segment).

[0135] In one embodiment, the alignment substrate carrier segment 150 includes: activating a first actuator to adjust the angle between the substrate support surface 106a of the substrate carrier segment 150 and the rotation axis 201. Optionally, the alignment substrate carrier segment 150 may include: activating a locking mechanism to lock the angle change between the substrate support surface 106a of the substrate carrier segment 150 and the rotation axis 201.

[0136] In one embodiment, the mounting substrate carrier segment includes: activating a second actuator to establish a form-fitting and / or force-fitting connection between the mounting mechanism 104 and a mounting base (not shown). As described herein, the second actuator may, for example, be configured to transmit a force to the grippers to trigger the grippers to move toward each other and / or clamp the mounting mechanism 104 by means of the grippers.

[0137] It is understood that the above method can be optionally or otherwise performed in reverse order to remove the substrate carrier segment from the substrate carrier.

[0138] It is understood that the above methods may generally involve segmented replacement. For example, segmented replacement may include replacing a first substrate carrier segment of the substrate carrier with a second substrate carrier segment. Alternatively, segmented replacement may include removing the first substrate carrier segment of the substrate carrier, replacing the substrate therewith with another substrate, and reinstalling the first substrate carrier segment.

[0139] For example, segment replacement can be accomplished using a conveying device (also known as a segment conveyor or robotic arm), such as an end effector of the segment conveyor. For instance, an end effector can be attached to a substrate carrier segment before it is removed from the substrate carrier.

[0140] Figure 6A A schematic side view 600a of a substrate carrier segment (preferably according to Example 17) according to various embodiments (preferably configured according to any one of Embodiments 100a to 500c) is shown; Figure 6B Here is a magnified view of a portion of it, 600b.

[0141] In one embodiment, the outer side 153 of the substrate carrier segment has two connection recesses 602 through which a connection mechanism is realized. The connection recesses 602 can be configured to receive an end effector inserted into the connection recesses 602. The end effector can be used, for example, when changing segments, to remove or add the substrate carrier segment from the substrate carrier.

[0142] In one embodiment, for example for each coupling notch of the substrate carrier segment, the end effector has a complementary coupling mechanism, for example in the form of coupling shoes, into which the end effector can engage its coupling shoes.

[0143] In one embodiment, each of the aforementioned or individual coupling recesses 602 is angled (e.g., along or against the transport direction 102) to facilitate locking the connection (e.g., form-fit connection) between the end effector (which engages in the recess 602) and the substrate carrier segment. For example, the angular directions of the multiple coupling recesses are aligned, so that locking can be triggered by the rotational movement of the substrate carrier holding mechanism.

[0144] The angled connection notch 602 can be configured, for example, as a zigzag channel that widens at its end, thereby further simplifying the locking mechanism.

[0145] In one embodiment, each of the above-described or connected recesses 602 has a section that narrows toward the mounting mechanism (adjacent to the outer side 153), which facilitates the insertion of the end effector into the connected recess 602.

[0146] In one embodiment, each of the above-described or connected recesses 602 has a tortuous channel, i.e., a section that narrows toward the mounting mechanism (adjacent to the outer side 153), which facilitates the insertion of the end effector into the connected recess 602.

[0147] As described regarding positional parameters, the manufacturing process of the substrate carrier segment may affect certain positional parameters, such as curvature under no-load conditions and / or the mechanical stiffness of the substrate carrier segment. According to various embodiments, the present invention provides aspects of substrate carrier segment manufacturing that can reduce variations in positional parameters, as detailed below.

[0148] According to various embodiments, the substrate carrier segment can be manufactured by a heat treatment process, such as a thermal ablation process. Therefore, referring to an example heat treatment process performed by a laser (e.g., a laser ablation process), this description is analogous to any other heat treatment process. The heat treatment process can be performed according to a process pattern, which will be illustrated below.

[0149] Figure 7A A schematic diagram of a first type of process pattern 700a (e.g., according to Example 33) is shown according to various embodiments (preferably configured according to Embodiments 100a to 600b), according to which multiple substrate carrier segments can be manufactured.

[0150] In one embodiment, the first type of process pattern (also known as a layout pattern) includes one or more rows of irradiated regions 702b (also known in this example as ablation regions 702b) arranged sequentially along direction 701 (also known as arrangement direction 701), wherein each ablation region 702b is used to form a substrate carrier segment therefrom. For example, the layout pattern may have multiple rows of 704, 706 (also known as multiple rows of patterns) arranged side by side. Each row may, for example, have R sequentially arranged ablation regions 702b, wherein R is greater than 1, for example R≥3, for example R≥4, for example R≥6, for example R≥8, for example R≥10.

[0151] In one embodiment, the alignment direction 701 (preferably according to Example 16) is parallel to the direction of the rolled metal sheet (also known as the rolling direction), thereby enabling the formation of a substrate carrier segment. This takes into account the anisotropic crystal structure of the rolled metal and its preferred orientation along the rolling direction, as well as the fact that the stiffness and / or deformation of the substrate carrier segment may exhibit the same anisotropy, for example, the metal sheet may be hot-rolled. Similarly, the crystal structure near the edge of the metal sheet (also known as the rolled edge) may also vary.

[0152] In one embodiment, the multiple rows of patterns have exactly two rows, which are arranged adjacently along axis 703 and / or symmetrically about axis 703. Preferably, axis 703 is along the arrangement direction 701, the rolling direction, and / or the rolling edge. For example, the ablation regions 702b may be arranged symmetrically about axis 703.

[0153] In one embodiment, each ablation region 702 includes a (e.g., digital) characterization (also known as a geometric characterization) of the substrate carrier segment to be fabricated, such as the geometry of the substrate carrier segment and / or one or more contours of the substrate carrier segment to be fabricated. Thus, the arrangement pattern can have a geometric characterization of each ablation region 702. For example, the geometric characterization can be represented as the trajectory of a guiding laser beam.

[0154] In one embodiment, the geometric representations are arranged symmetrically about the arrangement direction 701, axis 703, rolling direction, and / or rolling edge. In the case of multiple rows of patterns, the geometric representations may be arranged symmetrically about axis 703.

[0155] In one embodiment, the laser ablation process includes irradiating a metal plate with a laser according to a pattern (e.g., according to each geometric representation of the pattern). In this case, each ablation region 702 can be divided into multiple parts by laser segmentation (also known as a laser slicing process), one of which is configured and processed into a substrate carrier segment according to the geometric representation.

[0156] Figure 7B A schematic diagram of a layout pattern 700b according to various embodiments (preferably configured according to the embodiments described above) is shown in form. Multiple substrate carrier segments can be manufactured according to this layout pattern. For ease of understanding, each geometric feature 752 is marked with reference numerals for the substrate carrier segment to be manufactured.

[0157] In one embodiment, the multi-row pattern includes multiple pairs of ablation regions 702b, which are arranged sequentially along the arrangement direction and / or each pair of ablation regions has two geometric representations that are symmetrically arranged about the axis 703 (also known as the axis of symmetry) of the pattern arrangement. For example, these geometric representations face each other with their outer sides 153.

[0158] Figure 8AA schematic diagram of a second type of process pattern 800a (e.g., according to Example 33) according to various embodiments (preferably configured according to Embodiments 100a to 700b) is shown, according to which multiple substrate carrier segments can be manufactured; Figure 8B A magnified view of the modified area is shown in 800b.

[0159] In one embodiment, the method based on a second type of process pattern (also known as a modification pattern) includes irradiating an intermediate product of a laser cutting process (e.g., a substrate carrier segment in its precursor stage) with a laser according to the modification pattern. Irradiation with a laser according to the modification pattern can be configured to alter the surface of the intermediate product of the laser cutting process, for example, increasing its roughness (also known as roughening) and / or enhancing its adhesion. Laser roughening can significantly promote the adhesion of the coating to the substrate carrier segment, thereby reducing the frequency of cleaning the substrate carrier segment.

[0160] In one embodiment, laser roughening is configured to increase roughness, for example, by 10. r The multiple, where r≥0, for example r≥1, for example r≥2.

[0161] In one embodiment, the modification pattern implements a timing sequence (also known as modification timing) and / or includes multiple pairs of irradiated regions (also known as modification regions in this example), which are indexed by tuples (xy), where x represents the region pair number and y represents the irradiation order of the two modification regions in the region pair. For example, the modification pattern may include one or more rows of modification regions 804, 806, which are arranged sequentially along a transport direction 101 (also known as an arrangement direction 101), wherein each row includes multiple pairs of modification regions. Each row may, for example, have R sequentially arranged modification regions, where R is greater than 1, for example R≥3, for example R≥4, for example R≥6, for example R≥8, for example R≥10.

[0162] In one embodiment, each pair of x-modified regions has two modified regions x-1 and x-2 symmetrically arranged about an axis 803. The axis 803 may, for example, be parallel to the radial direction 105, transverse to the transport direction 101, and / or serve as the bisector of the angle W.

[0163] In one embodiment, the modification timing has one or more time sequences for performing irradiation, such as a first time sequence and a second time sequence. The first time sequence is based on index x, ensuring that region pairs are processed sequentially according to their index x. For each pair of modified regions, the first time sequence is based on the index y of that region pair, ensuring that the modified regions of that region pair are processed sequentially according to their index y. For example, the modified regions are processed sequentially in the following order: 1-1, 1-2, 2-1, 2-2, 3-1, 3-2, 4-1, 4-2, 5-1, 5-2, etc., which ensures as symmetrical processing of the substrate carrier segments as possible.

[0164] In one embodiment, each modified region (see also partial enlarged view 800b) implements one or more irradiation trajectories 810. For example, the trajectory 810 may have multiple side-by-side and / or linear segments or at least multiple rows of successively arranged irradiation positions (to which the laser beam is directed).

[0165] In one embodiment, the trajectory 810 has one or more segments that extend linearly along axis 803 and / or radial direction 105, which improves machining symmetry and thus reduces deformation.

[0166] Figure 9A A schematic cross-sectional view of a vacuum apparatus 900a (e.g., according to Example 27) according to various embodiments (preferably configured according to Examples 100a to 800b) is shown, in which a substrate carrier holding mechanism and a substrate carrier are arranged. In one embodiment, the vacuum apparatus (preferably according to Example 28) includes one or more plating devices 902 in a vacuum chamber 802 configured to eject plating material onto a transport path 911 of a substrate carrier segment 150 for transporting the substrate carrier.

[0167] Figure 9B A schematic cross-sectional view of a vacuum apparatus 900b (e.g., according to Example 27) according to various embodiments (preferably configured according to embodiments 100a to 900a) is shown, in which a substrate carrier holding mechanism and a substrate carrier are arranged. In one embodiment, the vacuum apparatus includes a segmented transfer device 952 configured to transfer a substrate carrier segment 150 back and forth to the substrate carrier holding mechanism 250. For example, segmented replacement can be performed by the segmented transfer device 952. The segmented transfer device 952 may, for example, be arranged in an additional vacuum chamber 852 adjacent to the vacuum chamber 802.

[0168] The following describes various embodiments relating to the above description and the accompanying drawings.

[0169] Example 1: A vacuum device configured as a rotary coating system.

[0170] Example 2: A multi-segment turntable includes a set of multiple annular segmented substrate carrier segments (e.g., fan-shaped). Additionally, a hub is provided to accommodate the substrate carrier segments.

[0171] Example 3: Improve the positional accuracy of the substrate carrier relative to the coating source and / or reduce cost and complexity.

[0172] Example 4: Simplified assembly of each substrate carrier segment. The substrate carrier holding mechanism has a hub and grippers (attached to the hub) for each substrate carrier segment for mounting and aligning the substrate carrier segments. For example, the grippers are rotatably positioned (e.g., via a pivot with a shaft). The pivot facilitates tilting and / or lifting of the substrate carrier, or more generally, alignment of the substrate carrier. Additionally, extra screws may be provided to lock the pivot in its final position.

[0173] Example 5: A substrate carrier segment is guided between two grippers by a ball bearing. Additionally, multiple springs are provided between the grippers to push them apart. The substrate carrier segment (e.g., its mounting mechanism) has recesses complementary to the ball bearings, into which the ball bearings and / or clamping screws can engage.

[0174] Example 6: The grippers and substrate carrier segment engage perpendicularly, which inhibits movement of the substrate carrier segment relative to the grippers and promotes alignment. For example, they can engage with each other in a form-fit manner. A circular profile helps correct potential misalignments.

[0175] Example 7: An improved substrate carrier segment geometry has angled elongated holes as connection ports for a robotic arm to grasp. By rotating a turntable, a form-fit connection between the substrate carrier segment and the robotic arm can be established or disengaged. The two elongated holes in each substrate carrier segment can each be angled in the same direction.

[0176] Example 8: Establishing a mortise and tenon connection between adjacent substrate carrier segments. Wedge-shaped protrusions facilitate the alignment of adjacent substrate carrier segments. Additional tenons (e.g., bosses) at the wedge-shaped protrusions are arranged on the outer periphery of the substrate carrier, allowing the substrate carrier segments to be leveled by engaging the protrusions with recesses. For example, the mortise and tenon connection only creates an external connection, making it easier to change the position of the substrate carrier segments via a first actuator.

[0177] Example 9: Symmetrical processing of the substrate carrier segment will suppress subsequent deformation of the carrier due to mechanical stress.

[0178] Example 10: A substrate holding mechanism can accommodate multiple substrates, such as a stack of multiple substrates. For this purpose, the substrate holding mechanism may include, for example, (frame-like) spacers (also called gaskets) arranged between two substrates in a stack.

[0179] Example 11: Provide multiple substrate carriers, each substrate carrier having multiple substrate carrier segments, which are spliced ​​together to form a substrate carrier, wherein at least two substrate carriers are different from each other, for example, in terms of the geometry (e.g., size, shape, type) of the substrate carrier segments and / or the substrate holding mechanism.

[0180] Example 12: An improved method for manufacturing substrate carrier segments is provided. For this purpose, the substrate carrier segments can be roughened using a roughening laser, wherein the laser roughening is performed according to a pattern (e.g., a processing area), the pattern being symmetrical about the curvature of the target carrier retained after laser roughening. Alternatively or additionally, multiple substrate carrier segments can be cut from the sheet material using laser cutting, with their edge regions (clearly exhibiting rolled edges) remaining unchanged. The microstructure of the edge regions differs from the rest of the sheet material. Laser cutting can be performed symmetrically about the rolling direction.

[0181] Example 13: Provide a process pattern with an axis of symmetry that passes through the center of gravity, such as the centroid and / or centroid.

[0182] Example 14: Provide the axis of symmetry for the substrate support surface, and the process pattern is symmetrical about this axis of symmetry.

Claims

1. A substrate carrier segment (150), comprising: • Carrier frame (102); • A substrate holding mechanism (106) for holding the substrate is at least partially integrated into or mounted on the carrier frame (102); • A mounting mechanism (104) for mounting a substrate carrier segment is adjacent to the carrier frame (102), and the carrier frame (102) narrows toward the mounting mechanism (104); • Two shape-matching profiles (502a, 502b) are configured to complement each other and the outer sides of the carrier frame (102) and the mounting mechanism (104) are arranged between them.

2. The substrate carrier segment (150) according to claim 1, wherein, The carrier frame (102) has two opposing end faces, which are configured to narrow toward the mounting mechanism (104).

3. The substrate carrier segment (150) according to any one of claims 1 to 2, wherein, The two shape-fitting profiles (502a, 502b) are configured to be centered by mutual meshing.

4. The substrate carrier segment (150) according to any one of claims 1 to 3, wherein, One of the shape-fitting contours (502a, 502b) is at least partially wedge-shaped.

5. The substrate carrier segment (150) according to any one of claims 1 to 4, wherein, The shape-fitting contour also includes a tenon-shaped interlocking mechanism.

6. The substrate carrier segment (150) according to any one of claims 1 to 5 further comprises: The roughening pattern of the substrate carrier segment is symmetrical about the axis of symmetry (803); and / or the rolling direction of the substrate carrier segment extends transversely to the axis of symmetry (803).

7. The substrate carrier segment (150) according to any one of claims 1 to 6 further comprises: • The outer side (153) away from the mounting mechanism (104); and • An angled notch on the outer side (153).

8. A substrate carrier holding mechanism (250), comprising: • Rotation axis (201); • A plurality of mounting bases (204) arranged in a pattern around the rotation axis (201), wherein each mounting base (204) includes: • Receiving mechanism (302) for receiving the substrate carrier segment (150); • The receiving mechanism is movably supported by the pivot (402); • The first actuator is configured to adjust the angle between the rotating shaft (201) and the receiving mechanism (302).

9. The substrate carrier holding mechanism according to claim 8, wherein, The receiving mechanism (302) has two relatively movable grippers (354a, 354b) with a receiving gap between them.

10. The vacuum device according to claim 9, wherein, The mounting base (104) has a second actuator for transmitting force to the gripper.

11. Use of forming a substrate carrier segment (150) by a thermal irradiation process, said thermal irradiation process being performed according to a process pattern symmetrical about the axis of symmetry of said substrate carrier segment (150).

12. The use according to claim 11, wherein, The thermal irradiation process is performed using a laser.

13. The use according to claim 11 or 12, wherein, The process pattern implements multiple pairs of irradiation areas, wherein a pair of irradiation areas are symmetrical about the axis of symmetry and are exposed to the irradiation process sequentially.

14. The use according to any one of claims 11 to 13, wherein, The process pattern: • Symmetrical with respect to the rolling direction of the substrate carrier segment (150) or at least symmetrical with respect to the rolling direction of the blank forming the substrate carrier segment (150); and / or • Symmetrical with respect to the rolled edge of the substrate carrier segment (150) or at least symmetrical with respect to the rolled edge of the blank.

15. A method comprising: • Control the heat irradiation process according to the process pattern; • A substrate carrier segment (150) is formed through the heat irradiation process, wherein the process pattern is symmetrical about the axis of symmetry of the substrate carrier segment (150).

Images