Vibration damping device and manufacturing method

Abstract

The invention provides a vibration damping device and a manufacturing method. The vibration damping device comprises a supporting barrel, the supporting barrel is provided with a near side end and a far side end which are separated in the axial direction, a near side opening is formed in the near side end, a far side opening is formed in the far side end, and the supporting barrel is further provided with an inner surface limiting an inner cavity; an end cap coupled to the proximal end of the support barrel to close the proximal opening; the damping pads are made of elastic materials and stacked together in the axial direction, the damping pads comprise the near-side damping pad and the far-side damping pad, the near-side damping pad is contained in the inner cavity of the supporting cylinder and abuts against the end cover, and the far-side damping pad is contained in the outer cavity of the supporting cylinder and abuts against the end cover. And the far-side anti-vibration pad penetrates through the far-side opening from the inner cavity of the supporting barrel and protrudes out of the supporting barrel. The manufacturing method is used for manufacturing the damping device.

Description

Technical Field

[0001] This disclosure relates to the field of vibration control technology, and more specifically, to a vibration damping device for isolating and controlling vibrations and a method for manufacturing the vibration damping device. Background Technology

[0002] Vibration isolation is indispensable in semiconductor manufacturing and high-precision equipment, directly affecting chip yield and equipment lifespan. For example, high-precision measurement tools, wafer / chip processing equipment, and even extreme ultraviolet lithography (EUV) systems all require vibration control at the 0.1 nanometer level. In existing technologies, vibration isolation is generally achieved through mechanisms such as air springs, hydraulic isolators, and active control systems. However, in practice, these mechanisms have been found to have the following defects: (1) Insufficient vibration isolation performance: Semiconductor equipment has a complex working environment. Although it has a low natural vibration frequency, the natural vibration frequencies of other equipment on the production line are distributed over a wide frequency band. Existing vibration isolation equipment cannot effectively isolate vibrations over a wide frequency band; (2) Difficult adjustment after installation: If engineers find that the vibration is too large after the equipment is installed, they will need to spend a long time reinstalling the equipment, which will increase the downtime and recalibration costs; (3) Cleanroom contamination risk: Hydraulic systems inevitably release tiny oil droplets and organic vapors, which not only violates the ISO Class 1 particle limit but also increases the wafer / chip defect rate; (4) High maintenance costs: Gas pressure leakage or valve (such as height control valve) failure requires professional technicians and equipment downtime; Air spring / hydraulic isolators have a high maintenance frequency and require more equipment downtime; Active control systems have complex control systems, and maintenance needs to be performed by professionals.

[0003] Therefore, there is an urgent need in the field for a vibration isolation technology that is flexible and customizable, easy to install, has low maintenance / manufacturing costs, good cleanroom compatibility, and can achieve excellent vibration isolation effects over a wide frequency band. Summary of the Invention

[0004] To address the problems in the prior art, this disclosure proposes an improved vibration damping device comprising: a support cylinder having a proximal end and a distal end separated axially, and having a proximal opening at the proximal end and a distal opening at the distal end, the support cylinder further having an inner surface defining an internal chamber; an end cap coupled to the proximal end of the support cylinder to close the proximal opening; and a plurality of damping pads made of an elastic material and stacked axially, the plurality of damping pads including a proximal damping pad and a distal damping pad, the proximal damping pad being accommodated in the internal chamber of the support cylinder and abutting against the end cap, and the distal damping pad protruding from the internal chamber of the support cylinder through the distal opening to the outside of the support cylinder.

[0005] According to an alternative embodiment of this disclosure, the distal damping pad has a head housed in an internal cavity of the support cylinder, a base located outside the support cylinder, and a neck extending from the head through a distal opening in the support cylinder to the base.

[0006] According to an alternative embodiment of this disclosure, the head of the distal damping pad has a proximal surface and a distal surface that are opposite in direction along the axial direction, and a side surface that connects the proximal surface and the distal surface.

[0007] According to an alternative embodiment of this disclosure, the support cylinder has a stop flange that projects radially inward from the distal end, the distal opening being defined by the stop flange such that the stop flange surrounds the neck of the distal damping pad, and the distal surface of the head of the distal damping pad abuts against the stop flange.

[0008] According to an alternative embodiment of this disclosure, the stop flange of the support cylinder abuts against the neck of the distal damping pad.

[0009] According to one alternative embodiment of this disclosure, the inner surface of the support cylinder abuts against the side surface of the head of the distal damping pad.

[0010] According to an optional embodiment of this disclosure, the distal end of the support cylinder is axially spaced from the base of the distal damping pad, and the radial dimension of the base of the distal damping pad is greater than the radial dimension of the distal end of the support cylinder.

[0011] According to an optional embodiment of this disclosure, the plurality of damping pads further include one or more intermediate damping pads disposed between the proximal damping pad and the distal damping pad.

[0012] According to an alternative embodiment of this disclosure, the proximal damping pad and each intermediate damping pad have a proximal surface and a distal surface opposite in the axial direction, and a side surface connecting the proximal surface and the distal surface.

[0013] According to an alternative embodiment of this disclosure, the inner surface of the support cylinder abuts against the side surfaces of the proximal damping pad and each intermediate damping pad.

[0014] According to an optional embodiment of this disclosure, the proximal damping pad and each intermediate damping pad are provided with a positioning flange that protrudes radially outward from the side surface, and the support cylinder is provided with a plurality of positioning grooves recessed from the inner surface, with each positioning flange being accommodated in a corresponding positioning groove.

[0015] According to one alternative embodiment of this disclosure, each positioning flange is dovetail-shaped, and each positioning groove has a shape complementary to the corresponding positioning flange.

[0016] According to an alternative embodiment of this disclosure, the vibration damping device further includes a positioning pin that extends axially through the end cap, the proximal damping pad, and each intermediate damping pad and is inserted into the distal damping pad.

[0017] According to an optional embodiment of this disclosure, the positioning pin includes a fixed end fixed to the end cap and a free end inserted into a blind hole in the distal damping pad, the free end being spaced apart from the bottom of the blind hole.

[0018] Similarly, to address the problems in the prior art described above, this disclosure also proposes a manufacturing method for manufacturing a vibration damping device as described herein, the vibration damping device being configured to support a target device, the manufacturing method comprising the following steps:

[0019] Frequency determination step: Determine the dominant vibration frequency f of the target device. i , where i = 1, ..., n;

[0020] Stiffness determination steps: Based on the i-th dominant vibration frequency f i Determine the stiffness k of the i-th damping pad. i ,in,

[0021]

[0022] And among them, m i It is the effective mass of the target device borne by the i-th vibration damping pad;

[0023] Steps for determining the elastic modulus: Based on the stiffness k of the i-th damping pad i Determine the elastic modulus E of the i-th damping pad. i ,in,

[0024]

[0025] And among them, h i A is the predetermined height of the i-th vibration damping pad. i is the predetermined contact area between the i-th damping pad and the adjacent damping pad, and d is the predetermined dynamic coefficient of the material category to which each damping pad belongs;

[0026] Strain determination steps: Based on the elastic modulus E of the i-th damping pad i Determine the strain ε of the i-th damping pad i ;

[0027] Strain verification steps: The strain ε of the i-th damping pad...i With the predetermined strain threshold ε THR Compare, if ε i ≥ε THR Then the elastic modulus E is corrected. i and return to the strain determination step; if ε i <ε THR Then, according to the elastic modulus E i Choose the material for the i-th damping pad;

[0028] Device verification steps: Determine the overall strength and damping efficiency of the vibration damping device based on the selected material. If the overall strength and damping efficiency meet the predetermined standards, process each damping pad using the selected material. If the overall strength or damping efficiency does not meet the predetermined standards, adjust the elastic modulus of one or more or each damping pad, and return to the strain determination step; and

[0029] Device assembly steps: Provide the support cylinder and end cap of the vibration damping device, and assemble the support cylinder, the end cap and each vibration damping pad into the vibration damping device.

[0030] This disclosure may be embodied in the illustrative embodiments shown in the accompanying drawings. However, it should be noted that the drawings are merely illustrative, and any variations contemplated under the teachings of this disclosure should be considered to be included within the scope of this disclosure. Attached Figure Description

[0031] The accompanying drawings illustrate exemplary embodiments of this disclosure. These drawings should not be construed as necessarily limiting the scope of this disclosure, wherein:

[0032] Figure 1 This is a schematic assembly perspective view of a vibration damping device according to one embodiment of the present disclosure;

[0033] Figure 2 yes Figure 1 A schematic exploded perspective view of the housing of the vibration damping device shown;

[0034] Figure 3 yes Figure 1 A schematic exploded perspective view of the vibration damping pad of the vibration damping device shown;

[0035] Figure 4 yes Figure 1 A schematic cross-sectional view of the vibration damping device shown;

[0036] Figure 5 This is a schematic cross-sectional view of a vibration damping device according to another embodiment of the present disclosure; and

[0037] Figure 6 This is a schematic flowchart of a manufacturing method for a vibration damping device according to one embodiment of the present disclosure. Detailed Implementation

[0038] Further features and advantages of this disclosure will become more apparent from the following description with reference to the accompanying drawings. Exemplary embodiments of this disclosure are shown in the drawings, and the drawings are not necessarily drawn to scale. However, this disclosure can be implemented in many different forms and should not be construed as necessarily limited to the exemplary embodiments shown herein. Rather, these exemplary embodiments are provided merely to illustrate this disclosure and to convey the spirit and essence of this disclosure to those skilled in the art.

[0039] This disclosure aims to provide a vibration damping device with a novel design and a method for manufacturing the same. Compared to existing vibration damping devices, the vibration damping device according to this disclosure has higher adaptability due to its novel design, and therefore can absorb vibrations over a wider frequency range. This allows the vibration damping device to effectively help isolate vibrations in target equipment, even in production lines where equipment vibrations exhibit wide-bandwidth and complex characteristics, thereby improving the yield of the target equipment. Therefore, the vibration damping device according to this disclosure is particularly suitable for target equipment with high requirements for vibration control precision, such as chip manufacturing equipment, chip measurement equipment, and chip processing equipment. In particular, the novel design of the vibration damping device according to this disclosure also makes it adjustable, thereby enabling it to absorb vibrations in different frequency ranges. In addition, the vibration damping device according to this disclosure also has many advantages due to its novel design, such as lower manufacturing / maintenance costs, good cleanroom compatibility, and a longer service life. The above-mentioned advantages of the vibration damping device according to this disclosure, as well as other advantages not explicitly mentioned, will become apparent from the detailed description below.

[0040] Various alternative, but non-limiting, embodiments of the vibration damping device according to this disclosure are described in detail below with reference to the accompanying drawings.

[0041] refer to Figures 1-3 ,in, Figure 1 A schematic assembly perspective view of a vibration damping device according to one embodiment of the present disclosure is shown. Figure 2 It shows Figure 1 A schematic exploded perspective view of the housing of the vibration damping device shown, and Figure 3 It shows Figure 1 An exploded perspective view of the vibration damping pad of the vibration damping device shown. (See diagram below.) Figures 1-3 As shown, the vibration damping device 10 generally comprises a housing made of a metallic material such as a manganese copper damping alloy and a damping pad made of an elastic material such as rubber.

[0042] like Figure 2As shown, the housing generally includes a support cylinder 100 and an end cap 200 joined together. The support cylinder 100 and the end cap 200 can be separate components manufactured separately and joined together, or they can be integrally manufactured components. The support cylinder 100 includes a proximal end 110 and a distal end 120 separated along the axial direction XX'. The proximal end 110 can be considered as the end of the support cylinder 100 closer to the target device after the vibration damping device 10 is assembled to the target device, while the distal end 120 can be considered as the end of the support cylinder 100 farther from the target device after the vibration damping device 10 is assembled to the target device. The support cylinder 100 has a proximal opening 111 at the proximal end 110 and a distal opening 121 at the distal end 120, which are opposite each other along the axial direction XX'. The support cylinder 100 also has an inner surface 130 defining an internal chamber 101, which opens to the outside of the support cylinder 100 through a proximal opening 111 and a distal opening 121 on opposite sides along the axial direction XX'. Additionally, an end cap 200 is attached (e.g., by bolting, bonding, welding, integral manufacturing, etc.) to the proximal end 110 of the support cylinder 100, thereby closing the proximal opening 111 so that the internal chamber 101 can only open to the outside of the support cylinder 100 through the distal opening 121, and not through the proximal opening 111.

[0043] like Figure 3 As shown, the vibration damping device 100 also includes a plurality of damping pads stacked together along the axial direction XX' (i.e., arranged along the axial direction XX' and abutting each other). These plurality of damping pads include a proximal damping pad 310 and a distal damping pad 320. The proximal damping pad 310 can be considered as the damping pad closest to the target device among the plurality of damping pads after the vibration damping device 10 is assembled to the target device, and the distal damping pad 320 can be considered as the damping pad furthest from the target device among the plurality of damping pads after the vibration damping device 10 is assembled to the target device. Preferably, as... Figure 4 As shown, it illustrates Figure 1 The schematic cross-sectional view of the vibration damping device shows that the proximal damping pad 310 is completely housed within the internal cavity 101 of the support cylinder 100, while the distal damping pad 320 is partially housed within the internal cavity 101 of the support cylinder 100. Specifically, the proximal damping pad 310 is entirely surrounded by the support cylinder 100 and abuts against the end cap 200 within the internal cavity 101, while the distal damping pad 320 is only partially surrounded by the support cylinder 100 and protrudes from the internal cavity 101 through the distal opening 121 to the outside of the support cylinder 100. In particular, as shown... Figure 3 and Figure 4As shown, the plurality of damping pads also include one or more (two shown in the figure) intermediate damping pads 330 disposed between the proximal damping pad 310 and the distal damping pad 320. Similar to the proximal damping pad 310, the intermediate damping pad 330 is also completely contained within the internal cavity 101 of the support cylinder 100, thereby being entirely surrounded by the support cylinder 100. Specifically, if the damping device 10 includes one intermediate damping pad 310, then the intermediate damping pad 310 abuts against the proximal damping pad 310 and the distal damping pad 320 on opposite sides along the axial direction XX', respectively; if the damping device 10 includes a plurality of intermediate damping pads 310, then the plurality of intermediate damping pads 310 abut against each other and are arranged in a stack along the axial direction XX', while the two intermediate damping pads 330 located at both ends of the stack abut against the proximal damping pad 310 and the distal damping pad 320, respectively. Of course, the above embodiments are merely exemplary and not limiting. In embodiments not shown, the vibration damping device 10 may also not include any intermediate vibration damping pad 330. Therefore, in this embodiment, the proximal vibration damping pad 310 and the distal vibration damping pad 320 abut against each other.

[0044] In use, the vibration damping device 10 can be mounted on the legs of the target equipment, so that the legs of the target equipment are supported on the end cap 200 of the vibration damping device 10, while the distal damping pad 320 of the vibration damping device 10 can be supported on the floor. That is, the vibration damping device 10 can be arranged between the legs of the target equipment and the floor. In this configuration, the vibration in the axial direction XX' generated by the target equipment during operation can be transmitted through the end cap 200 of the vibration damping device 10 to the proximal damping pad 310, and the proximal damping pad 320 can directly (if there is no intermediate damping pad 330) or indirectly (if there is an intermediate damping pad 330) transmit the vibration to the distal damping pad 320. During the transmission process, these vibrations will be converted into the internal energy of each damping pad due to the viscoelasticity of each damping pad, and thus absorbed by each damping pad, thereby preventing these vibrations from being transmitted to the floor. Based on the same principle, vibrations in the axial direction XX' of the floor caused by other equipment on the production line during operation can also be absorbed by the individual damping pads of the vibration damping device 10, thereby preventing these vibrations from being transmitted to the target equipment. Therefore, the vibration damping device 10 with the above configuration can effectively isolate and control vibrations in the axial direction XX' between the target equipment and the floor, which helps improve the yield rate of the target equipment and extend its service life. Furthermore, since each damping pad exists independently, by selecting the material of each damping pad, each damping pad can have a specific (possibly different) modulus of elasticity. This allows each damping pad to absorb vibrations in different frequency ranges, thereby broadening the frequency band of vibrations that the vibration damping device 10 can absorb. This enables the vibration damping device 10 to effectively isolate and control vibrations between the target equipment and the floor even when the vibration exhibits broadband and complex characteristics. Furthermore, the independent existence of each damping pad allows for the replacement of any one or more damping pads with different elastic moduli, thereby adjusting the frequency band of vibrations that the damping device 10 can absorb, thus giving the damping device 10 adjustability and enabling it to have a wider range of applications. It is also worth mentioning that, since the distal damping pad 320 protrudes from the support cylinder 100, the distal damping pad 320 can prevent the support cylinder 100 from contacting the floor. This allows the support cylinder 100 to be used only to limit the deformation of each damping pad, enabling each damping pad to more reliably absorb vibrations in the axial direction XX' without interfering with the absorption of vibrations by each damping pad. In addition, it should be noted that although the above only describes the absorption of vibration in the axial direction XX' by each damping pad, this is not limiting. Since each damping pad abuts against each other, each damping pad can absorb vibration in the radial direction by friction between them in the direction transverse to the axial direction XX' (i.e., the radial direction, also known as the transverse direction). In other words, although the damping device 10 is designed to isolate and control vibration in the axial direction XX', it also helps to isolate and control vibration in the radial direction.

[0045] like Figures 2-4 As shown, the distal damping pad 320 includes a head 321, a base 322, and a neck 323 located between the head 321 and the base 322 to connect the two. The head 321 is completely contained within the internal cavity 101 of the support cylinder 100 and is configured to abut against an adjacent damping pad (i.e., the proximal damping pad 310 or the intermediate damping pad 330). The base 322 is located outside the support cylinder 100 and is configured to abut against the floor for supporting the damping device 10. The neck 323 extends along the axial direction XX' from the internal cavity 101 of the support cylinder 100 through the distal opening 121 of the support cylinder 100 to the outside of the support cylinder 100. Specifically, the radial dimension of the neck 323 of the distal damping pad 320 is smaller than the radial dimensions of both the head 321 and the base 322, so that when cut along the axial direction XX', the distal damping pad 320 generally has an H-shaped cross-section (in the orientation shown in the figure, this H-shape is transverse). Specifically, the support cylinder 100 has a stop flange 140 at the distal end 120 that projects radially inward from the distal end 120, and the distal opening 121 is defined by this stop flange 140, such that the radial dimension of the distal opening 121 is smaller than the radial dimensions of the internal cavity 101 and the proximal opening 111, and the stop flange 140 surrounds and specifically abuts against the neck 323 of the distal damping pad 320. Furthermore, preferably as... Figure 4 As shown, the head 321 of the distal damping pad 320 is positioned against the stop flange 140 of the support cylinder 100 on the side facing the base 322. That is, the head 321 of the distal damping pad 320 is supported on the stop flange 140 of the support cylinder 100. Since the stop flange 140 of the support cylinder 100 can provide support for the head 321 of the distal damping pad 320 in the axial direction XX', the proximal damping pad 310, the head 321 of the distal damping pad 320, and each intermediate damping pad 330 (if present) can be clamped between the end cap 200 and the stop flange 140 of the support cylinder 100 in the axial direction XX'. In the above configuration, the stop flange 140 of the support cylinder 100 can prevent the head 321 of the distal damping pad 320 from passing through the distal opening 121 and leaving the internal cavity 101, thereby preventing the distal damping pad 320 from accidentally detaching from the support cylinder 100. Since the proximal damping pad 310, the head 321 of the distal damping pad 320 and each intermediate damping pad 330 are clamped between the end cap 200 and the stop flange 140 of the support cylinder 100 in the axial direction XX', it can more reliably ensure that each damping pad is in contact with each other. This ensures that each damping pad can reliably absorb vibration in the axial direction XX' through its own viscoelasticity, and also ensures that each damping pad can reliably absorb vibration in the radial direction through friction between them.

[0046] like Figures 2-4 As shown, the support cylinder 100 and the distal damping pad 320 are positioned such that the distal end 120 of the support cylinder 100 is spaced apart from the base 322 of the distal damping pad 320 along the axial direction XX', and the radial dimension of the base 322 of the distal damping pad 320 is larger than the radial dimension of the distal end 120 of the support cylinder 100. In this configuration, under normal conditions, the distal end 120 of the support cylinder 100 does not contact the base 322 of the distal damping pad 320. This prevents the support cylinder 100 from directly transmitting vibrations in the axial direction XX' to the distal damping pad 320, thus preventing the support cylinder 100 from forming a bypass path for vibration transmission. This ensures that vibrations in the axial direction XX' can only be transmitted to the distal damping pad 320 through the individual damping pads and not through other paths, thereby ensuring that each damping pad can reliably absorb vibrations in the axial direction XX' through its own viscoelasticity. However, in the event of excessive vibration amplitude of the target equipment in the axial direction XX', resulting in excessive deformation of each vibration damping pad, the distal end 120 of the support cylinder 100 can be supported on the base 322 of the distal vibration damping pad 320, so that the base 322 of the distal vibration damping pad 320 can prevent the target equipment from rigidly contacting the floor through the end cap 200 and the support cylinder 100, thereby ensuring the safety of the target equipment.

[0047] like Figure 3 and Figure 4 As shown, the head 321 of the proximal damping pad 310, the distal damping pad 320, and each intermediate damping pad 330 (if present) have a proximal surface 341 and a distal surface 342 opposite to each other along the axial direction XX', and a side surface 343 located between the proximal surface 341 and the distal surface 342 to connect the proximal surface 341 and the distal surface 342. The proximal surface 341 of the proximal damping pad 310 is intended to abut against the end cap 200, and the distal surface of the head 321 of the distal damping pad 320... Surface 342 is intended to abut against the stop flange 140 of the support cylinder 100, while the respective proximal surfaces 341 (provided by the head 321 of the distal damping pad 320 and the respective intermediate damping pads 330) and the respective distal surfaces 342 (provided by the proximal surface 341 of the distal damping pad 310 and the respective intermediate damping pads 330) located between the proximal surface 341 of the proximal damping pad 310 and the distal surface 342 of the head 321 of the distal damping pad 320 are intended to contact each other such that the respective damping pads are stacked together along the axial direction XX'. In particular, the respective proximal surfaces 341 and the respective distal surfaces 342 have the same area such that the respective damping pads contact each other on the same area. In particular, as Figure 4As shown, the heads 321 of the proximal damping pad 310 and the distal damping pad 320, as well as each intermediate damping pad 330 (if present), are arranged in the internal cavity 101 of the support cylinder 100 such that the inner surface 130 of the support cylinder 100 abuts against the heads 321 of the proximal damping pad 310 and the distal damping pad 320, and the side surfaces 343 of each intermediate damping pad 330. In this configuration, the support cylinder 100 can more reliably limit the deformation of each damping pad, thereby ensuring that each damping pad can absorb vibration more effectively. Specifically, as... Figure 3 As shown, the proximal damping pad 310 and each intermediate damping pad 330 (if present) are respectively provided with positioning flanges 344 protruding radially outward from their respective side surfaces 343, and as Figure 2 and Figure 4 As shown, the support cylinder 100 has a plurality of positioning grooves 134 recessed from the inner surface 130 and spaced apart from each other along the axial direction XX' on its inner surface 130. The positioning flanges 344 of the proximal damping pad 310 and each intermediate damping pad 330 are accommodated in the corresponding positioning grooves 134. With this configuration, the support cylinder 100 can more reliably hold the respective damping pads, thereby more effectively suppressing the deformation of each damping pad and ensuring that each damping pad can more effectively absorb vibration. Of course, the above embodiment is merely exemplary. In embodiments where the vibration damping device 10 does not include the intermediate damping pads 330, the support cylinder 100 may have only one positioning groove 134 on its inner surface 130 for holding the positioning flange 344 of the proximal damping pad 310.

[0048] refer to Figure 5 A schematic cross-sectional view of a vibration damping device according to another embodiment of the present disclosure is shown. Figure 5 The embodiments shown are the same as Figures 1-4 The difference in the illustrated embodiment lies in the fact that the positioning flanges 344 of the proximal damping pad 310 and each intermediate damping pad 330 (if present) are wedge-shaped or dovetail-shaped. That is, when cut along the axial direction XX', the positioning flanges 344 of the proximal damping pad 310 and each intermediate damping pad 330 have a wedge-shaped or dovetail-shaped cross-section. Correspondingly, each positioning groove 134 of the support cylinder 100 has a shape complementary to the corresponding positioning flange 344; that is, when cut along the axial direction XX', each positioning groove 134 of the support cylinder 100 also has a wedge-shaped or dovetail-shaped cross-section. With this configuration, the support cylinder 100 can more reliably hold the individual damping pads together and more effectively suppress the deformation of the individual damping pads, thereby ensuring that the individual damping pads can absorb vibrations more effectively. Furthermore, Figure 5 The embodiments shown are the same as Figures 1-4The difference in the illustrated embodiment lies in that the vibration damping device 10 further includes a positioning pin 400, which extends along the axial direction XX' through the end cap 200, the proximal damping pad 310, and each intermediate damping pad 330 (if present) and inserts into the distal damping pad 320. That is, the end cap 200, the proximal damping pad 310, and each intermediate damping pad 330 are each provided with through holes for the positioning pin 400 to pass through, while the distal damping pad 320 is provided with a blind hole 324 for the positioning pin 400 to be inserted. In this configuration, the support cylinder 100, together with the positioning pin 400, can more reliably hold the damping pads together and more effectively suppress the deformation of the damping pads, thereby ensuring that the damping pads can absorb vibrations more effectively. Specifically, the locating pin 400 has a fixed end 410 fixed to the end cap 200 and a free end 420 spaced apart from the fixed end 410 along the axial direction XX' and inserted into the blind hole 324 of the distal damping pad 320. The free end 420 is spaced apart from the bottom of the blind hole 324 along the axial direction XX'. In this configuration, since the free end 420 of the locating pin 400 is spaced apart from the bottom of the blind hole 324 of the distal damping pad 320, the locating pin 400 can avoid directly transmitting vibrations in the axial direction XX' to the distal damping pad 320. This prevents the locating pin 400 from forming a bypass path for vibration transmission. This ensures that vibrations in the axial direction XX' can only be transmitted to the distal damping pad 320 through the individual damping pads and not through other paths. This ensures that each damping pad can reliably absorb vibrations in the axial direction XX' through its own viscoelasticity. Specifically, the positioning pin 400 has a limiting flange 411 protruding radially outward from the fixed end 410, and the end cover 200 has a limiting step 211 in the through hole 210. The limiting flange 411 of the positioning pin 400 abuts against the limiting step 211 of the end cover 200, so that the fixed end 410 of the positioning pin 400 is positioned in a position recessed from the surface of the end cover 200. In this configuration, since the fixed end 410 of the positioning pin 400 is positioned in a position recessed from the surface of the end cover 200, the positioning pin 400 can be prevented from contacting the target equipment after the vibration damping device 10 is assembled to the target equipment. This allows the positioning pin 400 to be used only to hold the various vibration damping pads together and suppress their deformation, without transmitting vibration in the axial direction XX'. This also helps to ensure that each vibration damping pad can reliably absorb vibration in the axial direction XX' through its own viscoelasticity.

[0049] As mentioned above, in addition to the vibration damping device 10, this disclosure also provides a method for manufacturing the vibration damping device 10. (See reference...) Figure 6 The diagram illustrates a schematic flowchart of a method for manufacturing a vibration damping device according to one embodiment of the present disclosure. Figure 6 As shown, the manufacturing method includes the following steps:

[0050] Frequency determination step S100: Determine the dominant vibration frequency f of the target equipment. i , where i = 1, ..., n. For example, the vibration data of the target device can be measured by an accelerometer installed on the target device, and the vibration spectrum of the target device can be determined based on the vibration data. The n vibration frequencies with the largest amplitude in the vibration spectrum are taken as the main vibration frequencies of the target device.

[0051] Stiffness determination step S200: Based on the target equipment's dominant vibration frequency f i The number of vibration damping pads in the vibration damping device 10 is determined by the number of vibration damping pads, and is based on the i-th dominant vibration frequency f. i Determine the stiffness k of the i-th damping pad. i ,in,

[0052]

[0053] And among them, m i It is the effective mass of the target equipment borne by the i-th vibration damping pad, and i = 1, ..., n;

[0054] Elastic modulus determination step S300: Based on the stiffness k of the i-th damping pad i Determine the elastic modulus E of the i-th damping pad. i ,in,

[0055]

[0056] And among them, h i A is the predetermined height of the i-th vibration damping pad. i Let h be the predetermined contact area between the i-th damping pad and its adjacent damping pad, and d be the predetermined dynamic coefficient of the material category of each damping pad, where i = 1, ..., n. For example, each damping pad can have the same height and can contact its adjacent damping pad on the same area, such that h i and A i It has a constant value. Furthermore, after selecting the material type for processing each damping pad, for example, if rubber is chosen, then each damping pad will have the same dynamic coefficient, which will not change due to the more specific material of each damping pad. Additionally, as mentioned earlier, by changing the size of the i-th damping pad, the predetermined height h of that damping pad can be changed. i and the predetermined contact area A i Furthermore, by changing the material type of the i-th damping pad, the predetermined dynamic coefficient d of the damping pad can be changed, and any change in the above parameters can change the elastic modulus E of the i-th damping pad. i ;

[0057] Strain determination step S400: Based on the elastic modulus E of the i-th damping pad i Determine the strain ε of the i-th damping pad i Where i = 1, ..., n. For example, the predetermined height h of the i-th vibration damping pad can be used as a reference. i , predetermined contact area A i and elastic modulus E i Establish a finite element model of the i-th vibration damping pad, and determine the strain ε of the i-th vibration damping pad through finite element analysis. i ;

[0058] Strain verification step S500: Measure the strain ε of the i-th damping pad. i With the predetermined strain threshold ε THR Compare, if ε i ≥ε THR Then the elastic modulus E is corrected. i and return to strain determination step S400; if ε i <ε THR Then, according to the elastic modulus E i Choose the material for the i-th damping pad, where i = 1, ..., n. Specifically, predetermine the strain threshold ε. THR A value of 15% can be taken. As mentioned above, the strain determination step S400 and the strain verification step S500 involve determining whether the elastic modulus E of each damping pad determined in the elastic modulus determination step S300 would cause its strain ε to exceed the predetermined strain threshold ε. THR If ε exceeds ε THR If ε is not exceeded, then the elastic modulus E of the corresponding damping pad is considered unreasonable and the elastic modulus E is corrected; otherwise, if ε does not exceed ε THR If the elastic modulus E is considered reasonable, then the material of the corresponding damping pad is selected based on the elastic modulus E. Specifically, this can be achieved by changing the predetermined height h of the i-th damping pad. i , predetermined contact area A i The elastic modulus E of the i-th damping pad is changed by one, two, or all three parameters of the predetermined dynamic coefficient d. i Until the strain ε of the damping pad i Less than the predetermined strain threshold ε THRFor example, if the design space of the vibration damping device 10 is limited, resulting in the dimensions of each damping pad being almost impossible to change (meaning that the predetermined height and predetermined contact area of ​​the damping pad are constant values), then the dynamic modulus of the damping pad can be changed by changing the material type of the damping pad (meaning changing the predetermined dynamic coefficient of the damping pad); conversely, if the design space of the vibration damping device 10 is sufficient, but the material type of the damping pad cannot be changed (meaning that the predetermined dynamic coefficient of the damping pad is constant values), then the dynamic modulus of the damping pad can be changed by changing the dimensions of the damping pad (meaning changing the predetermined height and predetermined contact area of ​​the damping pad).

[0059] Device verification step S600: Determine the overall strength and vibration reduction efficiency of the vibration damping device 10 based on the selected material. If the overall strength and vibration reduction efficiency meet the predetermined standard, process each vibration damping pad using the selected material. If the overall strength or vibration reduction efficiency does not meet the predetermined standard, correct the elastic modulus of one or more or each vibration damping pad, and return to strain determination step S400. As mentioned above, device verification step S600 involves determining whether the combination of each vibration damping pad can enable the vibration damping device 10 to have an overall strength and vibration reduction efficiency that meets the predetermined standard. If both the overall strength and vibration reduction efficiency of the vibration damping device 10 meet the predetermined standard, process the vibration damping pad according to the material of each vibration damping pad. Conversely, if either the overall strength or vibration reduction efficiency of the vibration damping device 10 does not meet the predetermined standard, correct the elastic modulus of one or more or each vibration damping pad, and return to strain determination step S400. This process can be repeated from strain determination step S400 to device verification step S600 until both the overall strength and vibration reduction efficiency of the vibration damping device 10 meet the predetermined standard. For example, a finite element model of the vibration damping device 10 can be established based on the material of each damping pad, and the overall strength and damping efficiency of the vibration damping device 10 can be determined through finite element analysis; and

[0060] Device assembly step S700: Provide support cylinder 100 and end cap 200, and assemble support cylinder 100, end cap 200 and each damping pad into damping device 10.

[0061] In the above configuration, the number of vibration damping pads is set to be the same as the number of dominant vibration frequencies of the target equipment, and the material of each vibration damping pad is selected such that each pad can effectively absorb the vibration of the target equipment at a corresponding dominant vibration frequency. This allows the combined vibration damping pads to effectively absorb the vibration of the target equipment at each dominant vibration frequency, thereby giving the vibration damping device 10 the overall strength and damping efficiency that meet the standards. Therefore, the vibration damping device manufactured according to the manufacturing method of this disclosure can effectively help isolate and control vibration in the target equipment, thereby significantly improving the yield of the target equipment.

[0062] The accompanying drawings have described in detail optional, but not limiting, embodiments of the vibration damping device and manufacturing method according to this disclosure. Modifications and additions to the technology and structure, as well as recombinations of features in the various embodiments, will be readily apparent to those skilled in the art without departing from the spirit and essence of this disclosure and should be considered within its scope. Therefore, such modifications and additions conceivable under the teachings of this disclosure should be considered part of this disclosure. The scope of this disclosure includes equivalent technologies known at the filing date of this disclosure and equivalent technologies not yet foreseen.

Claims

1. A vibration damping device, comprising: A support cylinder (100) having a proximal end (110) and a distal end (120) spaced apart from each other along an axial direction (XX'), and having a proximal opening (111) at the proximal end (110) and a distal opening (121) at the distal end (120), the support cylinder (100) also having an inner surface (130) defining an internal chamber (101); End cap (200), said end cap (200) is coupled to the proximal end (110) of said support cylinder (100) to close said proximal opening (111); as well as Multiple damping pads made of elastic material and stacked together along the axial direction (XX'), the multiple damping pads including a proximal damping pad (310) and a distal damping pad (320), the proximal damping pad (310) being housed in the internal cavity (101) of the support cylinder (100) and abutting against the end cap (200), and the distal damping pad (320) protruding from the internal cavity (101) of the support cylinder (100) through the distal opening (121) to the outside of the support cylinder (100).

2. The vibration damping device according to claim 1, wherein, The distal damping pad (320) has a head (321) housed in an internal cavity (101) of the support cylinder (100), a base (322) located outside the support cylinder (100), and a neck (323) extending from the head (321) through a distal opening (121) of the support cylinder (100) to the base (322).

3. The vibration damping device according to claim 2, wherein, The head (321) of the distal damping pad (320) has a proximal surface (341) and a distal surface (342) opposite in the axial direction (XX') and a side surface (343) connecting the proximal surface (341) and the distal surface (342).

4. The vibration damping device according to claim 3, wherein, The support cylinder (100) is provided with a stop flange (140) that projects radially inward from the distal end (120), the distal opening (121) being defined by the stop flange (140) such that the stop flange (140) surrounds the neck (323) of the distal damping pad (320), and the distal surface (342) of the head (321) of the distal damping pad (320) abuts against the stop flange (140).

5. The vibration damping device according to claim 4, wherein, The stop flange (140) of the support cylinder (100) abuts against the neck (323) of the distal damping pad (320).

6. The vibration damping device according to any one of claims 3-5, wherein, The inner surface (130) of the support cylinder (100) abuts against the side surface (343) of the head (321) of the distal damping pad (320).

7. The vibration damping device according to any one of claims 2-6, wherein, The distal end (120) of the support cylinder (100) is spaced apart from the base (322) of the distal damping pad (320) along the axial direction (XX'), and the radial dimension of the base (322) of the distal damping pad (320) is greater than the radial dimension of the distal end (120) of the support cylinder (100).

8. The vibration damping device according to any one of claims 1-7, wherein, The plurality of damping pads also include one or more intermediate damping pads (330) disposed between the proximal damping pad (310) and the distal damping pad (320).

9. The vibration damping device according to claim 8, wherein, The proximal damping pad (310) and each intermediate damping pad (330) have a proximal surface (341) and a distal surface (342) opposite in the axial direction (XX') and a side surface (343) connecting the proximal surface (341) and the distal surface (342).

10. The vibration damping device according to claim 9, wherein, The inner surface (130) of the support cylinder (100) abuts against the side surface (343) of the proximal damping pad (310) and each intermediate damping pad (330).

11. The vibration damping device according to claim 9 or 10, wherein, The proximal damping pad (310) and each intermediate damping pad (330) are provided with a positioning flange (344) that protrudes radially outward from the side surface (343), and the support cylinder (100) is provided with a plurality of positioning grooves (134) that are recessed from the inner surface (130), and each positioning flange (344) is accommodated in a corresponding positioning groove (134).

12. The vibration damping device according to claim 11, wherein, Each positioning flange (344) is dovetail shaped, and each positioning groove (134) has a shape complementary to the corresponding positioning flange (344).

13. The vibration damping device according to any one of claims 8-12 further includes a positioning pin (400) extending axially (XX') through the end cap (200), the proximal damping pad (310) and each intermediate damping pad (330) and inserted into the distal damping pad (320).

14. The vibration damping device according to claim 13, wherein, The positioning pin (400) includes a fixed end (410) fixed to the end cap (200) and a free end (420) inserted into a blind hole (324) of the distal damping pad (320), the free end (420) being spaced apart from the bottom of the blind hole (324).

15. A manufacturing method for manufacturing a vibration damping device according to any one of claims 1-14, the vibration damping device being configured to support a target device, the manufacturing method comprising the steps of: Frequency determination step (S100): Determine the dominant vibration frequency f of the target device. i Where i = 1, ..., n; Stiffness determination step (S200): Based on the i-th dominant vibration frequency f i Determine the stiffness k of the i-th damping pad. i ,in, And among them, m i It is the effective mass of the target device borne by the i-th vibration damping pad; Elastic modulus determination step (S300): Based on the stiffness k of the i-th damping pad i Determine the elastic modulus E of the i-th damping pad. i ,in, And among them, h i A is the predetermined height of the i-th vibration damping pad. i is the predetermined contact area between the i-th damping pad and the adjacent damping pad, and d is the predetermined dynamic coefficient of the material category to which each damping pad belongs; Strain determination step (S400): Based on the elastic modulus E of the i-th damping pad i Determine the strain ε of the i-th damping pad i ; Strain verification step (S500): The strain ε of the i-th damping pad is... i With the predetermined strain threshold ε THR Compare, if ε i ≥ε THR Then the elastic modulus E is corrected. i And return to the strain determination step (S400); if ε i <ε THR Then, according to the elastic modulus E i Choose the material for the i-th damping pad; Device verification step (S600): Determine the overall strength and vibration reduction efficiency of the vibration damping device based on the selected material. If the overall strength and vibration reduction efficiency meet the predetermined standards, process each vibration damping pad using the selected material. If the overall strength or vibration reduction efficiency does not meet the predetermined standards, adjust the elastic modulus of one or more or each vibration damping pad, and return to the strain determination step (S400); and Device assembly step (S700): Provide the support cylinder (100) and end cap (200) of the vibration damping device, and assemble the support cylinder (100), the end cap (200) and each vibration damping pad into the vibration damping device.

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