Stable high-speed integrated circuit heat dissipation device

Abstract

A stable high-speed integrated circuit heat dissipation device comprises a heat dissipation frame and threaded holes, the threaded holes are machined in the lower end of the heat dissipation frame, the heat dissipation frame is fixedly connected with a baffle through bolts, clamping grooves are machined in the inner wall of the heat dissipation frame, the heat dissipation frame is fixedly connected with a cover plate through bolts, and the outer wall of the heat dissipation frame is connected with an adjusting mechanism. The heat dissipation plate and the extension strips are made of high-heat-conduction materials, heat generated by the integrated circuit can be rapidly absorbed and dispersed, the fan operates to generate airflow exhausted outwards, external airflow can enter the heat dissipation frame through the through holes, flowing of air around the heat dissipation plate is accelerated, and the heat dissipation efficiency is improved. Meanwhile, the output end of an electric telescopic rod pushes a connecting block to extend outwards, the connecting block pushes the lower end of an adjusting plate to deflect outwards, an opening is formed by a heat dissipation frame and the adjusting plate, and the flow speed of external airflow entering the bottom of the heat dissipation frame is increased; the heat generated actually can be quickly discharged, and the heat discharging speed is increased.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation device technology, and in particular to a stable high-speed integrated circuit heat dissipation device. Background Technology

[0002] With the development of high speed, high density, and high performance of microelectronic chips, thermal management has become a very important issue in microsystem packaging. Therefore, heat dissipation in integrated circuits is very important in many computer applications.

[0003] For example, the heat dissipation device for an integrated circuit disclosed in publication number "CN206610803U" solves the problems of low lifespan and high cost of existing integrated circuit heat dissipation devices. It uses multiple heat dissipation structures assembled in a linear shape to dissipate heat from the integrated circuit layer by layer. This manufacturing method not only improves the working efficiency of the heat dissipation device but also significantly reduces its space occupancy. Adsorption plates are installed to provide secondary reinforcement after the heat dissipation device is connected and installed. However, existing integrated circuit heat dissipation devices, with multiple heat dissipation structures assembled in a linear shape to dissipate heat from the integrated circuit layer by layer, have a fixed outward heat flow rate. This means that the heat cannot be quickly dissipated according to the actual heat generated, and the heat flow still needs time to achieve heat dissipation, easily leading to a low heat dissipation rate. Summary of the Invention

[0004] The present invention aims to solve the problems existing in the prior art by providing a stable high-speed integrated circuit heat dissipation device that can quickly dissipate the heat generated, thereby improving the heat dissipation speed.

[0005] The technical solution adopted by this invention to solve its technical problem is as follows: Design a stable high-speed integrated circuit heat dissipation device, including a heat sink and threaded holes. The lower end of the heat sink is machined with threaded holes. The heat sink is fixedly connected to a baffle by bolts. The inner wall of the heat sink is machined with a slot. The heat sink is fixedly connected to a cover plate by bolts. An adjustment mechanism is connected to the outer wall of the heat sink.

[0006] Further improvements include an electric telescopic rod, the outer wall of which is fixedly connected to a heat sink, the output end of which is rotatably connected to a connecting block, and the end of which is fixedly connected to an adjustment plate.

[0007] Further improvements include: the upper end of the adjustment plate is rotatably connected to the heat sink, the inner wall of the cover plate is fixedly connected to the mounting cylinder, and the inner wall of the slot is connected to a heat dissipation mechanism.

[0008] Further improvements include a heat dissipation mechanism comprising a heat dissipation plate, the side end of which abuts against a slot, the lower end of which is fixedly connected to an extension strip, and the upper end of which is machined with a notch.

[0009] To further improve the design, a fan is installed on the inner wall of the mounting cylinder, and the upper end of the mounting cylinder is fixedly connected to the wire mesh.

[0010] Further improvements include ensuring that the lower end of the mounting cylinder abuts against the notch.

[0011] To further improve the design, the outer wall of the heat sink is machined with through holes.

[0012] The beneficial effects of this invention are as follows: The heat sink and extension strip are made of highly thermally conductive materials, enabling rapid absorption and dispersion of heat generated by integrated circuits. The operation of the fan generates outward airflow, which enters the heat sink frame through the through-holes, accelerating the airflow around the heat sink and carrying away heat through the mesh at the top of the mounting cylinder. Simultaneously, the output end of the electric telescopic rod pushes the connecting block outward, and the connecting block pushes the lower end of the adjusting plate outward, creating an opening between the heat sink frame and the adjusting plate. This increases the flow rate of external airflow into the bottom of the heat sink frame, achieving rapid heat dissipation based on the actual heat generated and improving the heat dissipation speed. Attached Figure Description

[0013] Figure 1 This is a three-dimensional schematic diagram of the present invention; Figure 2 for Figure 1 A cross-sectional view of the heat sink. Figure 3 for Figure 2 A schematic diagram of the heat sink; Figure 4 for Figure 2 Enlarged schematic diagram of the middle cover plate: Figure 5 for Figure 3 Schematic diagram of the central regulating mechanism: Figure 6 for Figure 1 Schematic diagram of the heat dissipation mechanism; Figure 7 for Figure 4 Enlarged schematic diagram of the middle mounting cylinder.

[0014] Explanation of reference numerals in the attached drawings: 1. Heat sink bracket, 2. Threaded hole, 3. Baffle, 4. Slot, 5. Cover plate, 6. Adjustment mechanism, 601. Electric telescopic rod, 602. Connecting block, 603. Adjustment plate, 7. Mounting cylinder, 8. Heat dissipation mechanism, 801. Heat dissipation plate, 802. Extension strip, 803. Notch, 9. Fan, 10. Wire mesh, 11. Through hole. Detailed Implementation

[0015] The present invention will be further described below with reference to the accompanying drawings: See attached document Figure 1-7 In this embodiment, a stable high-speed integrated circuit heat dissipation device includes a heat sink 1 and a threaded hole 2. The lower end of the heat sink 1 is machined with a threaded hole 2. The heat sink 1 is fixedly connected to a baffle 3 by bolts. The inner wall of the heat sink 1 is machined with a slot 4. The heat sink 1 is fixedly connected to a cover plate 5 by bolts. An adjustment mechanism 6 is connected to the outer wall of the heat sink 1.

[0016] The adjustment mechanism 6 includes an electric telescopic rod 601. The output end of the electric telescopic rod 601 pushes the connecting block 602 to extend outward. The connecting block 602 pushes the lower end of the adjustment plate 603 to deflect outward, thereby adjusting the angle between the heat sink 1 and the adjustment plate 602. The outer wall of the electric telescopic rod 601 is fixedly connected to the heat sink 1. The output end of the electric telescopic rod 601 is rotatably connected to the connecting block 602. The end of the connecting block 602 is fixedly connected to the adjustment plate 603.

[0017] The upper end of the adjusting plate 603 is rotatably connected to the heat sink 1, the inner wall of the cover plate 5 is fixedly connected to the mounting cylinder 7, and the inner wall of the slot 4 is connected to the heat dissipation mechanism 8. The heat sink 801 and the extension strip 802 are made of high thermal conductivity materials, which can quickly absorb and disperse the heat generated by the integrated circuit, ensuring that the heat can be efficiently transferred to the outside. The heat dissipation mechanism 8 includes a heat sink 801, the side end of the heat sink 801 is pressed against the slot 4, the lower end of the heat sink 801 is fixedly connected to the extension strip 802, and the upper end of the heat sink 801 is machined with a notch 803. The heat sink 801 and extension bar 802 are made of high thermal conductivity material, which can quickly absorb and disperse the heat generated by the integrated circuit. The operation of the fan 9 can generate an outward airflow. The external airflow will enter the heat sink 1 through the through hole 11, accelerate the airflow around the heat sink 801, and thus carry away the heat and discharge it from the wire mesh 10 at the upper end of the mounting cylinder 7. At the same time, the output end of the electric telescopic rod 601 pushes the connecting block 602 to extend outward. The connecting block 602 pushes the lower end of the adjusting plate 603 to deflect outward, so that the heat sink 1 and the adjusting plate 602 form an opening, increasing the flow rate of the external airflow into the bottom of the heat sink 1, so as to quickly discharge the heat according to the actual heat generated and improve the heat discharge speed.

[0018] A fan 9 is installed on the inner wall of the mounting cylinder 7. The upper end of the mounting cylinder 7 is fixedly connected to the wire mesh 10, and the lower end of the mounting cylinder 7 is pressed against the notch 803. A through hole 11 is machined on the outer wall of the heat sink 1.

[0019] Working principle: First, the heat sink 1 is threadedly connected to the external integrated circuit board using the threaded hole 2 on the heat sink bracket 1. Multiple heat sinks 801 are then evenly inserted into the slot 4, with the side end of the heat sink 801 tightly fitted into the slot 4 until the extension strip 802 at the lower end of the heat sink 801 is attached to the surface of the integrated circuit board. Bolts are then threadedly connected between the cover plate 5 and the heat sink bracket 1, so that the lower end of the mounting cylinder 7 on the cover plate 5 abuts against the upper end of the heat sink 801, thus ensuring the stability of the heat sink 801 on the heat sink bracket 1.

[0020] The heat sink 801 and extension strip 802 are made of high thermal conductivity materials, which can quickly absorb and disperse the heat generated by the integrated circuit, ensuring that the heat can be efficiently transferred to the outside. The lower end of the heat sink 801 is fixedly connected to the extension strip 802. The design of the extension strip 802 increases the heat dissipation area and further improves the heat dissipation efficiency. The upper end of the heat sink 801 is machined with a notch 803, which facilitates air circulation and accelerates heat dissipation. In addition, a fan 9 is installed on the inner wall of the mounting cylinder 7. The operation of the fan 9 can generate an outward airflow. The external airflow enters the heat sink 1 through the through hole 11, accelerating the airflow around the heat sink 801, thereby carrying away heat and dissipating it through the wire mesh 10 at the upper end of the mounting cylinder 7. The wire mesh 10 not only prevents dust and other debris from entering the heat sink 1, but also plays a certain role in equalizing the flow, making the airflow flow outward more smoothly. At the same time, when the external detection shows that the heat generated by the integrated circuit is too large, the fan blades of the fan 9 accelerate to rotate, connecting the external power supply of the electric telescopic rod 601. The output end of the electric telescopic rod 601 pushes the connecting block 602 to extend outward. The connecting block 602 pushes the lower end of the adjusting plate 603 to deflect outward, so that the heat sink 1 and the adjusting plate 602 form an opening, increasing the flow rate of the external airflow into the bottom of the heat sink 1. This ensures that the airflow generated by the fan 9 can accelerate to contact the heat sink 801, absorb the heat on the surface of the heat sink 801 and dissipate it outward, thus improving the heat dissipation efficiency.

[0021] Although the present invention has been illustrated and described with reference to preferred embodiments, those skilled in the art will understand that various changes in form and detail are possible within the scope of the claims.

Claims

1. A stable high-speed integrated circuit heat dissipation device, comprising a heat sink (1) and a threaded hole (2), wherein the lower end of the heat sink (1) is machined with a threaded hole (2), characterized in that: The heat sink (1) is fixedly connected to the baffle (3) by bolts. The inner wall of the heat sink (1) is machined with a slot (4). The heat sink (1) is fixedly connected to the cover plate (5) by bolts. The outer wall of the heat sink (1) is connected with an adjustment mechanism (6).

2. The stable high-speed integrated circuit heat dissipation device according to claim 1, characterized in that: The adjustment mechanism (6) includes an electric telescopic rod (601), the outer wall of which is fixedly connected to the heat sink (1), the output end of which is rotatably connected to the connecting block (602), and the end of the connecting block (602) is fixedly connected to the adjustment plate (603).

3. The stable high-speed integrated circuit heat dissipation device according to claim 2, characterized in that: The upper end of the adjusting plate (603) is rotatably connected to the heat sink (1), the inner wall of the cover plate (5) is fixedly connected to the mounting cylinder (7), and the inner wall of the slot (4) is connected to the heat dissipation mechanism (8).

4. The stable high-speed integrated circuit heat dissipation device according to claim 3, characterized in that: The heat dissipation mechanism (8) includes a heat dissipation plate (801), the side end of the heat dissipation plate (801) abuts against the slot (4), the lower end of the heat dissipation plate (801) is fixedly connected to the extension strip (802), and the upper end of the heat dissipation plate (801) is machined with a notch (803).

5. The stable high-speed integrated circuit heat dissipation device according to claim 3, characterized in that: A fan (9) is installed on the inner wall of the mounting cylinder (7), and the upper end of the mounting cylinder (7) is fixedly connected to the wire mesh (10).

6. The stable high-speed integrated circuit heat dissipation device according to claim 5, characterized in that: The lower end of the mounting cylinder (7) is pressed against the notch (803).

7. The stable high-speed integrated circuit heat dissipation device according to claim 1, characterized in that: The outer wall of the heat sink (1) is machined with through holes (11).

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