Apparatus, method of cleaning template, and method of forming apparatus

Abstract

The present application provides an apparatus for cleaning a template. The template comprises at least one cavity in a first surface of the template and a plurality of openings extending within the template, and the apparatus comprises: a carrier; a support member attached to the carrier and including a base portion and at least one cleaning portion protruding from the base portion, where each of the at least one cleaning portion matches and is receivable within one of the at least one cavities of the template; the device comprises a template, a supporting member arranged on the template, and a wiping piece detachably arranged on the supporting member, and the wiping piece is configured to be pressed against the template by the supporting member when the template is placed on the device, so that residues in the open hole are removed through direct contact between the wiping piece and the residues.

Description

TECHNICAL FIELD

[0001] The present application relates generally to semiconductor technology, and more particularly, to an apparatus for cleaning a stencil, a method of forming the apparatus, and a method of cleaning a stencil. BACKGROUND

[0002] A widely used method of manufacturing a circuit is to apply solder paste to selected areas of a printed circuit board, and then mount electronic components on the applied solder paste. A reflow soldering process is then performed on the solder paste to melt and re-shape the solder paste, thereby bonding the electronic components to the printed circuit board and forming the circuit.

[0003] During the solder paste printing process, the solder paste is applied through a stencil having openings whose positions correspond to the areas where the electronic components are to be connected to the printed circuit board. The solder paste is applied to the top surface of the stencil, and a portion of the solder paste flows down through the stencil openings and adheres to the printed circuit board. In some cases, cavities can be formed within the stencil based on the layout of the circuit to be formed.

[0004] In order to form reliable solder bumps with the stencil, it is important that the residue remaining within the openings of the stencil be sufficiently removed after the solder paste printing process, so that in subsequent solder paste printing processes using the same stencil, the residue does not adversely affect the solder bumps formed.

[0005] Therefore, there is a need for an apparatus for cleaning a stencil with improved cleaning effect. SUMMARY

[0006] It is an object of the present application to provide an apparatus for cleaning a stencil with improved cleaning effect.

[0007] According to an aspect of the present application, there is provided an apparatus for cleaning a stencil. The stencil includes at least one cavity at a first surface thereof, and a plurality of openings extending within the stencil between the at least one cavity and a second surface of the stencil, the second surface being opposite to the first surface, wherein the apparatus comprises: a carrier; a support member attached on the carrier, and the support member includes a base and at least one cleaning portion protruding from the base, wherein each of the at least one cleaning portion is matched with and receivable within one of the at least one cavity of the stencil; and a wiper member detachably disposed on the support member, wherein the wiper member is configured to be pressed against the stencil by the support member when the stencil is placed on the apparatus to remove residues within the plurality of openings by direct contact between the wiper member and the residues.

[0008] According to another aspect of the present application, a method for manufacturing an apparatus for cleaning a template is provided. Wherein the template includes at least one cavity at a first surface thereof, and a plurality of apertures extending within the template between the at least one cavity and a second surface of the template, the second surface being opposite to the first surface. The method includes: providing a carrier; attaching a support material on the carrier; patterning the support material to form a support member according to the template, the support member including a base and at least one cleaning portion protruding from the base, wherein each of the at least one cleaning portion matches one of the at least one cavity of the template and is receivable within the one cavity; and placing a wiper on the support member.

[0009] According to another aspect of the present application, a method for cleaning a template is provided. Wherein the template includes at least one cavity at a first surface thereof, and a plurality of apertures extending within the template between the at least one cavity and a second surface of the template, the second surface being opposite to the first surface. The method includes: providing a template cleaning apparatus, wherein the template cleaning apparatus includes a carrier; a support member attached on the carrier and including a base and at least one cleaning portion protruding from the base, and a wiper detachably disposed on the support member; mounting the template on the template cleaning apparatus to receive each of the at least one cleaning portion within one of the at least one cavity of the template, and to press the wiper against the template; and moving the template cleaning apparatus relative to the template to remove residues within the plurality of apertures of the template by direct contact between the wiper and the residues.

[0010] It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application. Further, the accompanying drawings which are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description, serve to explain the principles of the application. BRIEF DESCRIPTION OF DRAWINGS

[0011] The drawings incorporated in and forming a part of the specification, illustrate embodiments of the present application and, together with the description, serve to explain the principles of the present application.

[0012] Figure 1A A perspective view showing a template and an apparatus for cleaning the template according to a first embodiment of the present application is shown, which is a perspective view as viewed from the top of the template.

[0013] Figure 1B A perspective view of the template is shown from the bottom of the template. Figure 1A A perspective view of the template is shown from the bottom of the template.

[0014] Figure 1C A perspective view of the template is shown from the bottom of the template. Figure 1A A cross-sectional view of the template along line AA' is shown.

[0015] Figure 1D A perspective view of the template is shown from the bottom of the template. Figure 1A A cross-sectional view of the apparatus for cleaning a template along line BB' is shown.

[0016] Figures 2A to 2D Various steps of a method for cleaning a template according to a second embodiment of the present application are shown.

[0017] Throughout the drawings, identical reference numerals will be used to designate identical or similar parts. DETAILED DESCRIPTION

[0018] The following detailed description of exemplary embodiments of the application references the accompanying drawings that form a part thereof. The drawings illustrate particular exemplary embodiments of the application. The detailed description includes specific details for the purpose of providing a thorough understanding of the application. Those skilled in the art will understand that the application may be practiced without these specific details. Further, the described embodiments are not intended to limit the scope of the application, as claimed, but merely to provide examples of the same.

[0019] In this application, the use of the singular includes the plural, unless specifically stated otherwise. In this application, the use of "or" means "and / or" unless stated otherwise. Furthermore, the use of the term "including", as well as other forms of the term, such as "include", is not limiting. Also, terms such as "element" or "component" encompass both elements and components comprising a single unit and elements and components that comprise more than one subunit unless specifically stated otherwise. Further, the section headings used herein are for organizational purposes only and are not meant to be used as limiting the subject matter described.

[0020] As used herein, spatially relative terms, such as "beneath", "below", "above", "above", "on", "upper", "lower", "left", "right", "vertical", "horizontal", "side", and the like, can be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. The spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The devices can be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly. It will be understood that, when an element is referred to as being "connected to" or "coupled to" another element, it can be directly connected or coupled to the other element or one or more intervening elements can be present.

[0021] As mentioned above, during the solder paste printing process, the solder paste is applied through a stencil having openings whose positions correspond to the areas where the electronic components will be connected to the printed circuit board. The solder paste is applied to the top surface of the stencil, and a portion of the solder paste flows down through the stencil openings and adheres to the printed circuit board. In order to form a reliable circuit with the stencil, it is crucial that the residues remaining in the openings of the stencil be sufficiently removed after the solder paste printing process so that they do not adversely affect the solder paste printing process using the same stencil in the subsequent process.

[0022] In some cases, a plurality of cavities can be formed within the stencil, with openings extending between the plurality of cavities and the top surface of the stencil. However, it is difficult to remove the residues in the cavities, especially the solder paste residues in the openings within such cavities, using conventional stencil cleaning tools. To address this problem, the present application provides a novel apparatus for cleaning the stencil. The apparatus includes a support member having at least one cleaning portion protruding from a base, each of the at least one cleaning portion matching and being receivable within one of the cavities of the stencil. A wiper is also provided on the support member, which can be used to remove the residues by direct contact between the wiper and the residues within the openings. Thus, the novel apparatus can improve the cleaning effect on the stencil having an uneven surface.

[0023] Figures 1A to 1D A stencil and an apparatus for cleaning the stencil according to a first embodiment of the present application are shown. More specifically, Figure 1A A perspective view of the stencil and the apparatus for cleaning the stencil when viewed from the top of the stencil is shown, Figure 1B A perspective view of the stencil when viewed from the bottom of the stencil is shown, Figure 1C A perspective view of Figure 1A A cross-sectional view of the stencil along line AA' is shown, and Figure 1D A perspective view of Figure 1AA cross-sectional view of the apparatus for cleaning the stencil along line BB'.

[0024] As Figure 1A shown, a stencil 100 having a plurality of apertures 102a is provided. The stencil 100 is used to implement a solder paste printing process in which solder paste is applied through the plurality of apertures 102a of the stencil 100 to form electrical connections between a printed circuit board and at least one electronic component mounted thereon. After the solder paste printing process, a thorough cleaning process should be implemented to remove solder paste residue within the plurality of apertures 102a of the stencil 100. As Figure 1B and 1C shown, the stencil 100 further includes at least one cavity 103 on a first surface of the stencil 100, such as a bottom surface 101b of the stencil 100. The at least one cavity 103 extends from an interior of the stencil 100 to the bottom surface 101b of the stencil 100.

[0025] The plurality of apertures 102a are arranged at a second surface of the stencil 100, such as a top surface 101a of the stencil 100, which is opposite the first surface. The plurality of apertures 102a extend within the stencil 100 from the second surface 101a to the at least one cavity 103, and are thereby in fluid connection with the at least one cavity 103. The plurality of apertures 102a and the cavity 103, which are in communication with each other, form respective channels extending through the stencil 100 that allow solder paste to pass through the stencil 100. In some embodiments, each of the at least one cavity 103 has a rectangular layout, and each of the at least one cavity 103 is connected with a set of apertures 102a arranged in parallel lines in a length direction Y of the stencil 100. In some other embodiments, the cavity 103 can have different layouts, such as circular, hexagonal, or octagonal. In some embodiments, the stencil 100 further includes a plurality of additional apertures 102b extending through the stencil 100 between its top surface 101a and bottom surface 101b, which are not connected with the cavity. The additional apertures 102b can also be arranged in sets similar to the sets of apertures 102a, such that each set of additional apertures 102b is arranged adjacent to a set of apertures 102a. However, it should be appreciated that the apertures 102a and 102b can have different arrangements based on a desired layout of solder bumps to be formed on a printed circuit board or other similar substrate. In some embodiments, the stencil 100 can be made of stainless steel, nickel, brass, or other suitable materials. The stencil 100 can be pre-formed according to solder paste printing requirements.

[0026] As Figure 1A and 1DAs shown, an apparatus 110 is provided for cleaning a stencil 100. After the solder paste printing process, the apparatus 110 is used to remove solder paste residue within openings 102a and 102b of the stencil 100, or to clean other areas of the stencil 100. The apparatus 110 includes a carrier 111 having an optional intermediate layer on its top surface, the intermediate layer serving as a platform for placing cleaning elements. A support member 112 is attached to the carrier 111 via the intermediate layer. The support member 112 includes a base 114 and at least one cleaning portion 113 projecting from the base 114. In an embodiment, each of the at least one cleaning portion 113 mates with one of the at least one cavity 103 of the stencil 100, such that the at least one cleaning portion 113 can be accommodated within one of the at least one cavity 103. In other words, each of the at least one cleaning portion 113 has similar dimensions (e.g., substantially the same or slightly smaller) to each of the at least one cavity 103 in the width direction X and height direction Z of the stencil 100. Furthermore, the outer surface of at least one cleaning section 113 also matches the inner surface of at least one cavity 103 in configuration or contour, so that when the template 100 is placed on the device 110, at least one cleaning section 113 and the template 100 are in direct or indirect contact within at least one cavity 103. This contact between the cleaning section 113 and the template 100 (particularly within the cavity 103) can generate friction that helps remove residues from the template 100.

[0027] like Figure 1D As shown, the device 110 also includes a wiping member 120 detachably disposed on the support member 112. When the template 100 is placed on the device 110, the wiping member 120 is disposed between the template 100 and the support member 112, so that it can be pressed against the template 100 by the support member 112 in all areas of at least one cleaning portion 113 and the base 114. Thus, the wiping member 120 can directly contact the residue remaining on the template 100 to effectively remove the residue. In some embodiments, the wiping member 120 comprises polypropylene or cotton. It should be understood that the wiping member 120 may include other materials suitable for cleaning, such as fabric materials.

[0028] Still referencing Figures 1A to 1DThe at least one cavity 103 and the at least one cleaning portion 113 are each arranged along a width direction X of the template 100. In a length direction Y of the template 100, each of the at least one cleaning portion 113 has a size smaller than a size of a corresponding one of the at least one cavity 103. In some embodiments, the carrier 111 can be moved relative to the template 100 in the length direction Y of the template 100 when the apparatus 110 cleans the template 100. Accordingly, the support member 112 attached to the carrier 111 can be moved with the carrier 111. In some embodiments, the carrier 111 is shaped as a roller, and a driver can be coupled to the carrier 111 to cyclically roll the carrier 111 relative to the template 100 when the apparatus 110 cleans the template 100. In some other embodiments, the carrier 111 can be shaped as a plate or other similar planar structure, and can be placed on the template 100 and moved cyclically along the template 100 when the apparatus 110 cleans the template 100.

[0029] More specifically, each of the at least one cleaning portion 113 is moved within one of the at least one cavity 103 along the length direction Y of the template 100. During this process, the wiper 120 disposed on the support member 112 can wipe the bottom surface 101b of the template 100 and the inner surface of the at least one cavity 103 with the movement of the support member 112. As the template includes the aperture 102a and the additional aperture 102b, the apparatus 110 can simultaneously remove residues within the aperture 102a and the additional aperture 102b. In addition, as shown in FIG. 1C, the support member 112 can be shaped as a rectangular bar, and the wiper 120 can be disposed on the support member 112. The wiper 120 can be made of a material that is soft and flexible, such as a sponge or a cloth. The wiper 120 can be attached to the support member 112 by a fastener, such as a clamp or a screw. In some embodiments, the wiper 120 can be made of a material that is hard and rigid, such as a plastic or a metal. In some embodiments, the wiper 120 can be made of a material that is soft and flexible, such as a sponge or a cloth. In some embodiments, the wiper 120 can be made of a material that is hard and rigid, such as a plastic or a metal. Figure 1A and 1D As shown, the base 114 can be a rectangular bar having a size similar to a width size of the template 100 in the width direction X of the template 100. Accordingly, when the support member 112 is moved relative to the template 100 in the length direction Y of the template 100, the wiper 120 disposed on the support member 112 can be in direct contact with almost all areas of the bottom surface 101b of the template 100 and the inner surface of the at least one cavity 103. As a result, residues within the aperture 102a and the additional aperture 102b can be thoroughly removed. It can also be appreciated that the support member 112 can be configured such that the wiper 120 is in direct contact with residues within the aperture 102a, but a small gap between the wiper 120 and the surface of the template 100 is allowed. In some embodiments, more than one support member 112 can be respectively attached to the carrier 111 to further improve the cleaning efficiency. The support member 112 can be integrated on an optional intermediate layer that can be disposed on the carrier 111.

[0030] In some other embodiments, the support member 112 can also include at least one protrusion on the edge of the support member 112. Correspondingly, the template 100 can include at least one slot configured to accommodate the at least one protrusion such that each of the at least one protrusion can move within one of the at least one slot when the support member 112 moves relative to the template 100. In this way, displacement between the template 100 and the support member 112 can be avoided, which can achieve a uniform and thorough cleaning effect. It should also be appreciated that the at least one protrusion can be formed on the edge region of the carrier 111 to be accommodated within the at least one slot.

[0031] It should be noted that additional openings 102b in Figure 1C are omitted in Figure 1A for simplicity, and a portion of the template 100 corresponding to the additional openings 102b of the template 100 is also omitted in 1B for simplicity. In other words, Figure 1D a portion of the apparatus 110 for cleaning the template 100 corresponding to the portion of the template 100 having the openings 102a is exemplarily shown, and Figure 1C a cross-sectional view of the portion of the template 100 having the openings 102a shown in Figure 1A and 1B is shown, and Figure 1D a portion of the apparatus 110 for cleaning the template 100 corresponding to the portion of the template 100 having the openings 102a is shown.

[0032] In another aspect of the present application, a method of manufacturing an apparatus for cleaning a template is provided. The template and the apparatus can be similar to the template 100 and the apparatus 110 shown in Figures 1A to 1D .

[0033] More specifically, a carrier is provided, which serves as a platform for placing cleaning elements. Next, a support material is attached on the carrier. In some embodiments, the support material can include silicone rubber or other materials that can be etched to change its shape. A support template having through-going openings is placed on the support material. The openings of the support template are formed to correspond to the layout and configuration of the at least one cavity of the template so as to pattern the support material and form at least one cleaning portion, e.g. Figure 1A and 1Dthe base 114 and the cleaning portion 113 shown in FIGS. 1 1 1, 1 12, and 1 13. In this way, the support member is formed. In some other embodiments, a mask layer having through openings can be formed on the top surface of the support material instead of using a support template to form the at least one cleaning portion. The mask layer can include a photoresist material or other etch-resistant material to pattern the support material during the etching process. Figure 1A and 1D the base 114 and the cleaning portion 113 shown in FIGS. 1 1 1, 1 12, and 1 13. In this way, the support member is formed. In some other embodiments, a mask layer having through openings can be formed on the top surface of the support material instead of using a support template to form the at least one cleaning portion. The mask layer can include a photoresist material or other etch-resistant material to pattern the support material during the etching process.

[0034] In some other embodiments, the support material includes a flexible material that is deformable upon application of an external force. Additionally, in some embodiments, the flexible material can be solidified after being deformed by a heating process, thereby solidifying the support material into a desired shape. More specifically, a template is placed on the flexible material, which can be pressed against a carrier with the template. During the pressing step, a portion of the flexible material can be extruded into at least one cavity of the template, thereby forming at least one cleaning portion corresponding to the at least one cavity of the template. Thus, the at least one cleaning portion can be formed in a low-cost and simple manner to match one of the at least one cavities of the template and can be accommodated in the one cavity. Next, the support material is solidified by a heating process to form the support member. In some embodiments, the flexible material can include silicone, rubber, and other deformable materials. In some embodiments, the support material can shrink after being solidified, thereby providing a space and thickness on which a wiper can be disposed. In some embodiments, the flexible material includes a thermoset material. The thermoset material can be first heated to a certain temperature to increase its flexibility before the template is placed on the thermoset material. In some other embodiments, the flexible material includes a thermoplastic material, which can be deformed again by a heating process after being solidified, thereby can be recycled for use in support materials used in equipment for cleaning different templates.

[0035] Next, a wiper is placed on the support member (e.g., by an adhesive or the like). In this way, the equipment can be formed.

[0036] More details of the template and the equipment for cleaning the template can be similar to the template 100 and the equipment 1 10 shown in FIGS. 1 and 2, which will not be elaborated in detail here for simplicity. Figures 1A to 1D

[0037] ​Figures 2A to 2D The various steps of the method for cleaning a stencil according to the second embodiment of the present application are shown.

[0038] As shown in Figure 2A , a stencil 200 that has been used in a previous solder paste printing process is provided. During the solder paste printing process, solder paste residue 230 can remain within the apertures 202a of the stencil 200, which needs to be removed from the stencil 200. The stencil 200 having at least one cavity 203 can be similar to the stencil 100 shown in Figures 1A to 1C , which will not be elaborated in detail here for simplicity.

[0039] As shown in Figure 2B , a stencil cleaning apparatus 210 is provided. The stencil cleaning apparatus 210 includes a carrier 211, a support member 212 attached on the carrier 211, and a wiper 220 detachably disposed on the support member 212. The support member 212 includes a base 214 and at least one cleaning portion 213 protruding from the base 214. The stencil cleaning apparatus 210 can be similar to the apparatus 110 for cleaning a stencil 100 shown in Figure 1A and 1D , which will not be elaborated in detail here for simplicity.

[0040] Next, the stencil 200 is mounted on the stencil cleaning apparatus 210 to accommodate each of the at least one cleaning portion 213 within one of the at least one cavity 203 of the stencil 200. In embodiments, in the length direction Y of the stencil 200, the size of each of the at least one cleaning portion 213 is smaller than the size of the corresponding one of the at least one cavity 203. The at least one cleaning portion 213 can be placed at the front side of the cavity 203.

[0041] Next, the wiper 220 is pressed against the stencil 200 to enable direct contact between the wiper 220 and the residue 230. In some embodiments, the wiper 220 is in direct contact with the inner surface of the at least one cavity 203 and the bottom surface 201b of the stencil 200, for example, as shown in Figure 2B . In some other embodiments, the wiper 220 is in direct contact with the residue 230 within the aperture 202a, while there can be a slight gap between the wiper 220 and the surface of the stencil 200. Next, a cleaning agent can be applied between the wiper 220 and the stencil 200 to improve the cleaning efficiency. In some embodiments, the cleaning agent includes isopropyl alcohol.

[0042] As shown in Figure 2CAs shown, the carrier 211 can be moved relative to the template 200 along the length direction Y of the template 200 by a driver coupled to the carrier 211. The support member 212 attached on the carrier 211 can move relative to the template 200 along with the movement of the carrier 211. More specifically, each of the at least one cleaning portion 213 moves within one of the at least one cavity 203 along the length direction Y of the template 200, specifically, from the front side of the cavity 203 to the back side of the cavity 203. During this process, the wiper 220 disposed on the support member 212 can wipe the surface of the template 200 along with the movement of the support member 212. For example, the portion of the wiper 220 disposed on the cleaning portion 213 can wipe the inner surface of the at least one cavity 203 by direct contact with the residue 230 within the aperture 202a above the cavity 203. In addition, the portion of the wiper 220 disposed on the top surface of the base portion 214 can be used to wipe the bottom surface of the template 200 where the cavity 203 does not extend to the bottom surface mentioned above, which can be the bottom surface of the portion of the template 200 having the additional aperture 202b. Thus, although there is a height difference between the aperture 202a and the additional aperture 202b, the residue 230 within both the aperture 202a and the additional aperture 202b can be removed simultaneously, thereby improving the cleaning efficiency and effectiveness.

[0043] In some embodiments, the cleaning process of the template 200 can include multiple cleaning cycles in which the template cleaning apparatus 210 moves relative to the template 200. During a first cleaning cycle, the carrier 211 moves such that each of the at least one cleaning portion 213 moves within one of the at least one cavity 203, specifically, from the front side of the cavity 203 to the back side of the cavity 203, as shown by the direction Y1 in Figure 2C Once the at least one cleaning portion 213 reaches the back side of the at least one cavity 203, the carrier 211 can move in the opposite direction such that each of the at least one cleaning portion 213 can move from the back side of the cavity 203 to the front side of the cavity 203, as shown by the direction Y2 in Figure 2CIn some embodiments, the cleaning process can include more than two cleaning cycles, and the carrier 211 has opposite moving direction in every two consecutive cleaning cycles, for example, Y1 and Y2. In other words, the template cleaning apparatus 210 moves relative to the template 200, specifically, moves back and forth between the front side and the back side of the template 200 cyclically. Thus, the residue 230 in the openings 202a and the additional openings 202b can be removed more thoroughly due to the back and forth wiping of the wiping member 220 towards the surface of the template 200. In some embodiments, the template 200 can include multiple modules, and each cleaning cycle can be used to clean a different module. The carrier 211 can also be moved by the driver along the width direction X or other arbitrary direction to move the support member 212 to match to other modules of the template 200 during different cleaning cycles. In some embodiments, the carrier 211 is in the shape of a roller, the driver can be coupled to the carrier 211, and the driver is configured to roll the carrier 211 cyclically relative to the template 200 when the template cleaning apparatus 210 cleans the template 200.

[0044] Next, the template cleaning apparatus 210 is removed from the template 200. As shown in FIG. 2B, the residue 230 in the openings 202a and the additional openings 202b of the template 200 can be removed thoroughly. Figure 2D

[0045] Although the exemplary apparatus and method for cleaning a template of the present application have been described in conjunction with the corresponding drawings, it is to be understood that modifications and alterations can occur to those skilled in the art upon reading this description.

[0046] Various embodiments have been described herein with reference to the drawings. It will be apparent, however, that modifications and changes can be suggested by those skilled in the art, and that the present application is not limited to the precise examples set forth. Furthermore, it is intended that the appended claims be construed to include alternative embodiments. In addition, it is intended that each definition in the claims be understood not to be limited to the precise embodiments disclosed, but rather to encompass any such modifications and alterations.​

Claims

1. A device for cleaning templates, characterized in that, The template includes at least one cavity at its first surface and a plurality of openings extending within the template between the at least one cavity and a second surface opposite to the first surface, wherein the device includes: carrier; A support member, attached to the carrier, comprising a base and at least one cleaning portion protruding from the base, wherein each of the at least one cleaning portion mates with and is accommodated within one of the at least one cavities of the template; and A wiping element, detachably mounted on the support member, wherein the wiping element is configured such that when the template is placed on the device, the wiping element is pressed against the template by the support member to remove the residue through direct contact between the wiping element and the residue within the plurality of openings.

2. The device according to claim 1, characterized in that, The at least one cavity is arranged along the width direction of the template, and in the length direction of the template, the size of each of the at least one cleaning part is smaller than the size of a corresponding cavity in the at least one cavity. The carrier is movable relative to the template in the length direction of the template, such that when the device cleans the template, each of the at least one cleaning part moves within a cavity in the at least one cavity.

3. The device according to claim 1, characterized in that, The support component includes silicone rubber.

4. The device according to claim 1, characterized in that, The supporting component comprises a flexible material cured by a heating process.

5. The device according to claim 4, characterized in that, The supporting components include thermosetting materials or thermoplastic materials.

6. The device according to claim 1, characterized in that, The wiping component may be made of polypropylene or cotton.

7. The device according to claim 1, characterized in that, The carrier is shaped like a roller.

8. The device according to claim 7, characterized in that, Also includes: A driver, coupled to the carrier, is configured to cyclically roll the carrier relative to the template while the device is cleaning the template.

9. A method for manufacturing equipment for cleaning templates, characterized in that, The template includes at least one cavity at its first surface and a plurality of openings extending within the template between the at least one cavity and a second surface opposite to the first surface, and wherein the method includes: Provide a carrier; Attach the support material to the carrier; According to the template, the support material is patterned to form a support member, the support member including a base and at least one clean portion protruding from the base, wherein each of the at least one clean portion mates with and is accommodated within one of the at least one cavities of the template; and Place the wiping device on the support member.

10. The method according to claim 9, characterized in that, The process of patterning the support material includes: Based on the at least one cavity of the template, at least a portion of the support material is etched accordingly to form the at least one cleaning section.

11. The method according to claim 9, characterized in that, The support material includes a flexible material that can be cured by a heating process, wherein the process of patterning the support material includes: Place the template on the supporting material; The template is used to press the support material against the carrier to form at least one cleaning section corresponding to at least one cavity of the template; and The support material is cured by a heating process to form the support member.

12. A method for cleaning templates, characterized in that, The template includes at least one cavity at its first surface and a plurality of openings extending within the template between the at least one cavity and a second surface opposite to the first surface, wherein the method includes: A template cleaning device is provided, wherein the template cleaning device includes a carrier, a support member attached to the carrier and the support member including a base and at least one cleaning part protruding from the base, and a wiping element detachably disposed on the support member; The template is installed on the template cleaning device such that each of the at least one cleaning part is accommodated within one of the at least one cavities of the template, and the wiping member is pressed against the template; and The template cleaning device is moved relative to the template to remove the residue through direct contact between the wiping element and the residue within the plurality of openings in the template.

13. The method according to claim 12, characterized in that, The at least one cavity is arranged along the width direction of the template, and in the length direction of the template, the size of each of the at least one cleaning part is smaller than the size of a corresponding cavity in the at least one cavity. The process of moving the template cleaning device relative to the template includes: moving the carrier relative to the template in the length direction of the template, such that each of the at least one cleaning part moves within a cavity in the at least one cavity.

14. The method according to claim 13, characterized in that, The process of moving the template cleaning device relative to the template includes multiple cleaning cycles, and each cleaning cycle includes: The template cleaning device is moved back and forth cyclically between the front and rear sides of the template relative to the template.

15. The method according to claim 12, characterized in that, Before moving the template cleaning device relative to the template, the method further includes applying a cleaning agent between the wiping element and the template.

16. The method according to claim 15, characterized in that, The cleaning agent includes isopropanol.

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