High-flux evaporation equipment

Abstract

The invention discloses high-flux evaporation equipment, and relates to the field of vacuum coating equipment, the high-flux evaporation equipment comprises a coating chamber and a coating machine rack, the coating chamber is internally provided with a multi-layer sample rack, the multi-layer sample rack is composed of a substrate rack upper plate and two substrate rack side plates, and the two substrate rack side plates are each provided with seven layers of substrate supports; a substrate baffle body is arranged on one side of the multi-layer sample frame, an evaporation source and a film thickness probe are arranged at the bottom of the film coating cavity, the substrate baffle rotation driving mechanism is connected with the substrate baffle body, and the output end of the electric magnetic transmission rod is connected with a sample fork. The multiple layers of sample racks are vertically arranged, the internal space of the coating chamber is fully utilized, the occupied area of the equipment is reduced, and the vacuum evaporation coating device is applied to vacuum evaporation coating of small-batch continuous production, and the multiple layers of clamps are integrated in the vacuum coating chamber and used for storing multiple substrates, so that the production efficiency is improved, and the production cost is reduced. And the purpose of continuous production of multiple chips can be achieved through automatic chip conveying control.

Description

Technical Field

[0001] This invention relates to the field of vacuum coating equipment technology, specifically to a high-throughput evaporation equipment. Background Technology

[0002] Vacuum coating is a device that uses physical vapor deposition (PVD) to heat solid materials to evaporate or sublimate them in a vacuum environment, forming gaseous atoms or molecules, which are then deposited onto the surface of a substrate to form a thin film.

[0003] Existing single-cavity vapor deposition equipment can only perform coating on one substrate at a time, and cannot perform continuous coating operations. After each substrate is finished, it needs to be removed and replaced. When customers conduct small-batch trial production, single-cavity vapor deposition equipment cannot meet the requirements of continuous production.

[0004] Therefore, it is necessary to invent a high-throughput evaporation equipment to solve the above problems. Summary of the Invention

[0005] The purpose of this invention is to provide a high-throughput vapor deposition equipment to solve the problem that single-cavity vapor deposition equipment in the technology cannot perform continuous coating operations and cannot meet the requirements of continuous production.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a high-throughput vapor deposition apparatus, comprising a deposition chamber and a deposition machine frame, wherein the deposition chamber is located above the deposition machine frame, a Z-axis displacement adjustment mechanism is provided at the top of the deposition chamber, a substrate rotation mechanism is provided on one side of the Z-axis displacement adjustment mechanism, a film thickness controller is provided on the front wall of the deposition machine frame, and a multi-layer sample holder is provided inside the deposition chamber, the multi-layer sample holder consisting of a substrate holder upper plate and two substrate holder side plates, wherein both substrate holder side plates have The sample holder has 7 layers of substrate holders. The upper plate of the substrate holder is connected to an external Z-axis displacement adjustment mechanism and a substrate rotation mechanism. The top of the coating chamber is equipped with a substrate baffle rotation drive mechanism. An electric magnetic transmission rod is set on one side of the coating chamber. A substrate baffle body is set on one side of the multi-layer sample holder. An evaporation source and a film thickness probe are set at the bottom of the coating chamber. The film thickness probe is electrically connected to an external film thickness controller. The substrate baffle rotation drive mechanism is connected to the substrate baffle body. The output end of the electric magnetic transmission rod is connected to a sample fork.

[0007] Furthermore, the top surface of the coating chamber is provided with an illumination window, and the rear side of the coating chamber is provided with a maintenance door panel. The purpose of these features is to provide illumination to the interior of the chamber, so that operators can observe the vapor deposition process in real time, including the condition of the substrate, the growth of the thin film, and the operating status of the equipment. The maintenance door panel facilitates the daily maintenance, repair, and replacement of internal components of the equipment.

[0008] Furthermore, an ionization vacuum gauge and a resistance vacuum gauge are provided on one side of the coating chamber, and a gate valve connected to the molecular pump is provided below the ionization vacuum gauge and the resistance vacuum gauge. By simultaneously setting the ionization vacuum gauge and the resistance vacuum gauge, comprehensive and accurate monitoring of the vacuum level of the chamber can be achieved, ensuring that the vapor deposition process is carried out in the required vacuum environment. The gate valve is used to control the connection and isolation between the molecular pump and the coating chamber.

[0009] Furthermore, an inflation valve is provided on the front side of the coating chamber, and a sliding door opening mechanism is provided at the opening end of the coating chamber. The inflation valve is used to fill the coating chamber with gas to quickly break the vacuum and facilitate opening the sliding door mechanism to remove the substrate.

[0010] Furthermore, a film thickness controller is installed on the front wall of the coating machine frame, and a computer display screen is installed on one side of the coating machine frame. The film thickness controller is used to monitor and control the thickness of the film in real time, and the computer display screen is used to display the operating status of the equipment, process parameters, and real-time data.

[0011] Furthermore, a viewing window baffle is provided on the front side of the multi-layer sample holder. The main function of the viewing window baffle is to prevent material splashing or volatiles from contaminating the lighting window during the vapor deposition process, ensuring the clarity of observation, and at the same time protecting the internal environment without opening the chamber.

[0012] Furthermore, the substrate holder is provided with an anti-fouling plate and a substrate. The anti-fouling plate is located at the bottom of the multi-layer sample holder and above the substrate. It is used to support the substrate to be coated and is the direct target of the vapor deposition process.

[0013] Furthermore, the film thickness probe is a quartz crystal oscillator, which forms a closed-loop control with the evaporation source. The response time of the closed-loop control is <100ms. The film thickness probe and the evaporation source form a closed-loop control, which can provide real-time feedback of film thickness information and automatically adjust the evaporation rate of the evaporation source according to preset values ​​to ensure that the film thickness meets the process requirements.

[0014] The technical effects and advantages provided by the present invention in the above technical solution are as follows:

[0015] The multi-layer sample rack with vertical layout in this invention makes full use of the internal space of the coating chamber and reduces the equipment footprint. It is intended to be used for vacuum evaporation coating in small-batch continuous production. By integrating multi-layer clips inside the vacuum coating chamber, multiple substrates can be stored. Automated wafer transfer control can achieve the goal of continuous production of multiple wafers.

[0016] In summary, the single-cavity coating of the present invention can process multiple substrates in a single evaporation process, and the single-cavity coating equipment has low cost, small footprint, and does not require a complex automated control system for multiple cavities. Attached Figure Description

[0017] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the overall three-dimensional structure of the device in this invention;

[0019] Figure 2 This is a schematic cross-sectional view of the device in this invention;

[0020] Figure 3 This is a schematic diagram of the moving three-dimensional structure of the sliding door opening mechanism in this invention.

[0021] Figure 4 This is a schematic diagram of the axial three-dimensional structure of the multi-layer sample holder in this invention.

[0022] Explanation of reference numerals in the attached figures:

[0023] 1. Z-axis displacement adjustment mechanism; 2. Substrate rotation mechanism; 3. Illumination window; 4. Maintenance door panel; 5. Ionization vacuum gauge; 6. Resistance vacuum gauge; 7. Insert valve; 8. Molecular pump; 9. Gas filling valve; 10. Coating chamber; 11. Sliding door opening mechanism; 12. Coating machine frame; 13. Film thickness controller; 14. Computer display screen; 15. Substrate baffle rotation drive mechanism; 16. Electric magnetic transmission rod; 17. Multi-layer sample rack; 18. Substrate baffle body; 19. Viewing window baffle; 20. Evaporation source; 21. Film thickness probe; 22. Sample fork; 23. Anti-fouling plate; 24. Substrate; 25. Substrate holder; 26. Substrate holder upper plate; 27. Substrate holder side plate. Detailed Implementation

[0024] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0025] The components of the embodiments of the invention described and shown in the accompanying drawings can typically be arranged and designed in a variety of different configurations. Therefore, the following detailed description of the embodiments of the invention provided in the drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention.

[0026] Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0027] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0028] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0029] This invention provides, for example Figure 1-4 The high-throughput vapor deposition equipment shown includes a coating chamber 10 and a coating machine frame 12. The coating chamber 10 is located above the coating machine frame 12. A Z-axis displacement adjustment mechanism 1 is provided at the top of the coating chamber 10, and a substrate rotation mechanism 2 is provided on one side of the Z-axis displacement adjustment mechanism 1. A film thickness controller 13 is provided on the front wall of the coating machine frame 12. A multi-layer sample holder 17 is provided inside the coating chamber 10. The multi-layer sample holder 17 is composed of a substrate holder upper plate 26 and two substrate holder side plates 27, and each of the two substrate holder side plates 27 is provided with 7 layers of substrate supports 25. The upper plate 26 is connected to the external Z-axis displacement adjustment mechanism 1 and substrate rotation mechanism 2. The top of the coating chamber 10 is provided with a substrate baffle rotation drive mechanism 15. An electric magnetic transmission rod 16 is provided on one side of the coating chamber 10. A substrate baffle body 18 is provided on one side of the multilayer sample holder 17. An evaporation source 20 and a film thickness probe 21 are provided at the bottom of the coating chamber 10. The film thickness probe 21 is electrically connected to the external film thickness controller 13. The substrate baffle rotation drive mechanism 15 is connected to the substrate baffle body 18. The output end of the electric magnetic transmission rod 16 is connected to a sample fork 22.

[0030] In this embodiment, the multi-layer sample holder 17 design significantly increases the number of substrates 24 that can be deposited in a single evaporation, making it suitable for small-batch continuous production needs. The Z-axis displacement adjustment mechanism 1 precisely adjusts the position of the multi-layer sample holder 17 in the Z-axis direction, thereby changing the distance between the substrate and the evaporation source 20. Furthermore, the substrate rotation mechanism 2 ensures uniform rotation of the substrate during the coating process, guaranteeing that the coating material received by each part of the substrate surface is uniform, resulting in a coating layer of uniform thickness. The film thickness probe 21 monitors the coating thickness on the substrate surface in real time during the coating process and transmits the data to the film thickness controller 13. The film thickness controller 13 precisely controls the evaporation rate and coating time of the evaporation source 20 according to preset coating thickness parameters, achieving precise control of the coating thickness and meeting the coating thickness requirements of different products. Simultaneously, the substrate holder upper plate 26 is connected to the Z-axis displacement adjustment mechanism 1 and the substrate rotation mechanism 2, realizing the displacement adjustment of the multi-layer sample holder 17 in the Z-axis direction and the rotation of the substrate. The substrate baffle rotation drive mechanism 15 can precisely control the rotation of the substrate baffle body 18. By rotating the substrate baffle body 18, the coating area can be controlled. For example, before coating, the substrate baffle body 18 can be rotated to the shielding position to prevent the coating material from being deposited in areas where coating is not needed. When coating is needed, the substrate baffle body 18 can be rotated to the appropriate position so that the coating material can be accurately deposited on the substrate surface. Finally, the electric magnetic transmission rod 16 realizes the automatic picking and placing of the substrate through the sample fork 22, reducing the interference of manual operation on the vacuum environment in the coating chamber 10, and improving production efficiency and operational accuracy.

[0031] The top surface of the coating chamber 10 is provided with an illumination window 3. The rear side of the coating chamber 10 is provided with a maintenance door panel 4. An ionization vacuum gauge 5 and a resistance vacuum gauge 6 are provided on the outside of one side of the coating chamber 10. Below the ionization vacuum gauge 5 and the resistance vacuum gauge 6, a slide valve 7 connected to a molecular pump 8 is provided. An inflation valve 9 is provided on the front side of the coating chamber 10. A sliding door opening mechanism 11 is provided at the opening end of the coating chamber 10. A film thickness controller 13 is provided on the front wall of the coating machine frame 12. A computer display screen 14 is provided on one side of the coating machine frame 12.

[0032] In this embodiment, the illumination window 3 provides illumination to the interior of the chamber, allowing operators to observe the vapor deposition process in real time, including the substrate status, film growth, and equipment operating status. The maintenance door 4 is designed to be openable, facilitating operator access to the coating chamber 10 for maintenance. The ionization vacuum gauge 5 is suitable for high vacuum measurements, while the resistance vacuum gauge 6 is suitable for low vacuum measurements. Below both gauges, a gate valve 7 connects to the molecular pump 8, controlling the connection and isolation between the molecular pump 8 and the coating chamber 10. Thus, the combined monitoring of the ionization vacuum gauge 5 and the resistance vacuum gauge 6 enables accurate measurements from low to high vacuum, ensuring the vapor deposition process is conducted in a stable vacuum environment. The gas filling valve 9 quickly fills the coating chamber 10 with gas, shortening the vacuum breaking time. The sliding door opening mechanism 11 facilitates quick opening and closing of the chamber, reducing manual operation difficulty and time costs. Simultaneously, the film thickness controller 13 monitors the film thickness in real time and integrates equipment operating status and process parameter monitoring functions through the computer display screen 14, allowing operators to adjust process parameters promptly.

[0033] A viewing window baffle 19 is provided on the front side of the multi-layer sample holder 17. A dirt-proof plate 23 and a substrate 24 are provided on the substrate holder 25. The dirt-proof plate 23 is located at the bottom of the multi-layer sample holder 17 and above the substrate 24. The film thickness probe 21 is a quartz crystal oscillator, which forms a closed-loop control with the evaporation source 20. The response time of the closed-loop control is <100ms.

[0034] In this embodiment, during the coating process, the operator can observe the general situation inside the coating chamber 10 through the viewing window baffle 19 to understand the coating progress and equipment operating status. The viewing window baffle 19 can also block some of the coating material from splashing, preventing it from splashing into the observation area and avoiding contamination of observation equipment such as cameras. It also protects the operator's view from interference. Furthermore, the quartz crystal oscillator, as the film thickness probe 21, has high precision and high sensitivity, and can monitor the coating thickness in real time and accurately, providing reliable data support for the closed-loop control system. When the coating thickness is close to the preset value, the control system can reduce the evaporation rate in time to avoid the coating being too thick; when the coating thickness is insufficient, it can increase the evaporation rate in time to ensure that the coating thickness accurately meets the preset requirements, thereby improving the stability and consistency of the coating quality.

[0035] Working principle of this invention:

[0036] Refer to the instruction manual appendix Figure 1-4 When using this invention, firstly: a) open the coating chamber 10, place the substrate 24 to be coated on the first layer of the multi-layer sample holder 17, and place the anti-fouling plate 23 on the second layer of the multi-layer sample holder 17, referring to... Figure 3Layers 3-7 are designated as storage areas, ensuring that at least one layer is empty for subsequent storage of coated substrates.

[0037] b. After the first substrate has completed the coating process, the sample fork 22 is driven by the electric magnetic transmission rod 16 to remove the current first substrate 24. After removal, it retracts back into the circular tube. Then, the multi-layer sample holder 17 descends to the empty height position of the 3rd to 7th layers, the sample fork 22 extends, and the coated substrate is placed into the empty slot.

[0038] c. After step b is completed, the sample fork 22 retracts, controls the multi-layer sample holder 17 to move to the new substrate slot to be processed, the sample fork 22 takes out the new substrate, retracts after taking it out, the multi-layer sample holder 17 moves to the first layer position again, the sample fork 22 puts in the new substrate and retracts, thus completing the action of putting in the new substrate.

[0039] d. When the coating chamber 10 is working, the interior is in a high vacuum state. The chamber is evacuated by the molecular pump 8. The ionization vacuum gauge 5 and the resistance vacuum gauge 6 can detect the vacuum level inside the chamber. The vacuum level inside the chamber can usually reach 5×10-5Pa.

[0040] e. The evaporation source 20 is installed at the bottom of the chamber. During operation, the substrate rotation mechanism 2 is started, causing the multi-layer sample holder 17 to rotate as a whole, ensuring that the substrate can uniformly receive the coating material during the coating process. The evaporation source 20 is started to heat the coating material inside it. The evaporated coating material is uniformly deposited on the substrate 24 to form a coating layer. The crystal oscillator inside the film thickness probe 21 can detect the evaporation rate online and transmit the data to the film thickness controller 13 in real time. The film thickness controller 13 adjusts the power of the power supply used by the evaporation source 20 precisely through the closed-loop control system according to the preset coating rate parameters, thereby controlling the coating rate and ensuring that the coating thickness and quality meet the requirements, thus achieving the purpose of controlling the coating rate.

[0041] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0042] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A high-throughput vapor deposition apparatus, comprising a deposition chamber (10) and a deposition machine frame (12), characterized in that: The coating chamber (10) is located above the coating machine frame (12). A Z-axis displacement adjustment mechanism (1) is provided at the top of the coating chamber (10). A substrate rotation mechanism (2) is provided on one side of the Z-axis displacement adjustment mechanism (1). A film thickness controller (13) is provided on the front wall of the coating machine frame (12). A multi-layer sample rack (17) is provided inside the coating chamber (10). The multi-layer sample rack (17) consists of a substrate rack upper plate (26) and two substrate rack side plates (27). Each of the two substrate rack side plates (27) is provided with 7 layers of substrate holders (25). The substrate rack upper plate (26) is connected to the external Z-axis displacement adjustment mechanism. The entire mechanism (1) and the substrate rotation mechanism (2) are provided. The top of the coating chamber (10) is provided with a substrate baffle rotation drive mechanism (15). An electric magnetic transmission rod (16) is provided on one side of the coating chamber (10). A substrate baffle body (18) is provided on one side of the multilayer sample holder (17). An evaporation source (20) and a film thickness probe (21) are provided at the bottom of the coating chamber (10). The film thickness probe (21) is electrically connected to an external film thickness controller (13). The substrate baffle rotation drive mechanism (15) is connected to the substrate baffle body (18). The output end of the electric magnetic transmission rod (16) is connected to a sample fork (22).

2. The high-throughput evaporation equipment according to claim 1, characterized in that: The top surface of the coating chamber (10) is provided with an illumination window (3), and the rear side of the coating chamber (10) is provided with a maintenance door panel (4).

3. The high-throughput evaporation equipment according to claim 2, characterized in that: An ionization vacuum gauge (5) and a resistance vacuum gauge (6) are provided on one side of the coating chamber (10), and a gate valve (7) connected to a molecular pump (8) is provided below the ionization vacuum gauge (5) and the resistance vacuum gauge (6).

4. The high-throughput evaporation equipment according to claim 3, characterized in that: An air valve (9) is provided on the front side of the coating chamber (10), and a sliding door opening mechanism (11) is provided at the opening end of the coating chamber (10).

5. The high-throughput evaporation equipment according to claim 1, characterized in that: A film thickness controller (13) is provided on the front wall of the coating machine frame (12), and a computer display screen (14) is provided on one side of the coating machine frame (12).

6. The high-throughput evaporation equipment according to claim 1, characterized in that: A viewing window baffle (19) is provided on the front side of the multi-layer sample rack (17).

7. The high-throughput evaporation equipment according to claim 1, characterized in that: The substrate holder (25) is provided with a dirt-proof plate (23) and a substrate (24). The dirt-proof plate (23) is located at the bottom of the multi-layer sample holder (17) and above the substrate (24).

8. The high-throughput evaporation equipment according to claim 1, characterized in that: The film thickness probe (21) is a quartz crystal oscillator, which forms a closed-loop control with the evaporation source (20), and the response time of the closed-loop control is <100ms.

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