Golden finger suspended gold length measuring method

Abstract

The invention belongs to the field of PCB (printed circuit board) detection, and particularly relates to a gold finger suspended gold length measuring method, which comprises the following steps of: detecting a copper thickness value of a non-suspended gold area of a gold finger by using a copper thickness gauge, and driving the copper thickness gauge to move towards the suspended gold area in a direction from the head of the gold finger to the root of the gold finger; when the difference value between the copper thickness value acquired in real time and the previous copper thickness value is greater than or equal to a set threshold value, recording the difference value as a length measurement starting point, driving the copper thickness gauge to continuously move until the detected copper thickness value is zero, and recording the difference value as a length measurement ending point; and calculating the distance between the starting point and the ending point as the gold suspending length of the golden finger. The method can accurately detect the length of the suspended gold of the golden finger on the premise of not damaging the PCB, and has the advantages of being easy to operate, high in efficiency and high in universality.

Description

TECHNICAL FIELD

[0001] The present application belongs to the field of PCB detection, and particularly relates to a method for measuring the suspension gold length of a gold finger. BACKGROUND

[0002] In the field of PCB manufacturing, as a key component for realizing electrical connection, the root suspension gold length of a gold finger is a core parameter affecting the plugging quality. Figure 4 5 Currently, the industry generally adopts a method of destructive micro-sectioning combined with microscope observation to measure the suspension gold length of a gold finger: after the etching of the first piece of product is completed, the product needs to be sectioned and sampled, and the suspension gold length is measured by observing the section under a microscope; if the measurement result is unqualified, the etching parameters need to be adjusted and the above-mentioned destructive measurement process needs to be repeated until the requirements are met, and then batch production is carried out.

[0003] CN202311422632.2 discloses a suspension gold length detection device and method, in which a light emitter irradiates a light surface with a known length range to the lower bottom surface of the suspension gold area, and the suspension gold layer produces a shielding effect on the light beam, and then the suspension gold length is measured by an optical shielding measurement method. However, this scheme still has some deficiencies: it is necessary to insert the light emitter into the lower bottom surface of the suspension gold area, and since the light emitter has a certain thickness, the space below the suspension gold area is determined by the thickness of the non-suspension gold area copper strip, which has a high precision requirement for the emitter, otherwise the emitter cannot be inserted into the lower part of the suspension gold area; and even if the emitter has high precision, when the space below the suspension gold area is too small, the emitter cannot be inserted into the lower part of the suspension gold area, so the detection method of this patent has low universality and high requirements for the instrument. SUMMARY

[0004] To solve the problems of destructive detection or complex structure and high cost of detection devices in the existing suspension gold length measurement technology, the present application provides a method for measuring the suspension gold length of a gold finger, which can accurately detect the suspension gold length of a gold finger without damaging the PCB, and has the advantages of easy operation, high efficiency and strong universality.

[0005] To achieve the purpose of the application, the following technical solutions are provided:

[0006] A method for measuring the suspension gold length of a gold finger is provided, the gold finger (2) includes a non-suspension gold area (21) and a suspension gold area (22), the non-suspension gold area (21) is a gold-nickel layer located on the upper surface of the copper strip, and the suspension gold area (22) is a gold-nickel layer extending to the outside of the copper strip, and the method comprises:

[0007] ​The copper thickness value of the non-overhanging gold area (21) of the gold finger (2) is detected by using the copper thickness gauge (1), the copper thickness gauge (1) is driven to move to the overhanging gold area (22), the moving direction is the direction that the head of the gold finger (2) points to the root of the gold finger (2),

[0008] When the difference between the real-time copper thickness value and the previous copper thickness value is greater than or equal to the set threshold value, the starting point of the length measurement is recorded, and the copper thickness gauge (1) is continuously driven to move until the detected copper thickness value is zero and the end point of the length measurement is recorded.

[0009] The distance between the starting point and the end point is calculated as the overhanging gold length of the gold finger (2).

[0010] In some embodiments, the copper thickness gauge is further connected with a control unit (6), the control unit (6) is connected with the copper thickness gauge (1),

[0011] The copper thickness gauge (1) transmits the copper thickness value to the control unit (6), the control unit (6) is used to calculate the difference between the real-time detected copper thickness value and the previous copper thickness value, judge whether the difference is greater than or equal to the set threshold value, and output the starting point,

[0012] The control unit (6) is also used to output the end point based on the signal that the copper thickness value is zero, stop the movement of the copper thickness gauge (1), and calculate the distance between the starting point and the end point.

[0013] In some embodiments, the copper thickness gauge (1) includes at least two probe assemblies (11), when measuring, the copper thickness gauge (1) has at least two probe assemblies (11) entering the non-overhanging gold area (21) in turn,

[0014] When the difference between the copper thickness values obtained by the two probe assemblies (11) and the copper thickness values obtained in front of them is greater than or equal to the set threshold value continuously, it is determined that the copper thickness gauge (1) enters the non-overhanging gold area (21),

[0015] When the copper thickness values obtained by the two probe assemblies (11) are zero continuously, it is determined that the copper thickness gauge (1) reaches the end point, and the signal that the copper thickness value is zero for the first time is taken as the end point.

[0016] In some embodiments, the at least two probe assemblies (11) are arranged side by side, the length of the straight line where the at least two probe assemblies (11) are arranged is less than the length of the non-overhanging gold area (21), so that the copper thickness gauge (1) can completely fall into the overhanging gold area (22), and the movement from the non-overhanging gold area (21) to the overhanging gold area (22) is realized,

[0017] The length of the straight line where the at least two probe assemblies are arranged is greater than the length of the overhanging gold area (22), so that the probe assembly (11) located in the non-overhanging gold area (21) supports the probe assembly (11) located in the overhanging gold area (22).

[0018] In some embodiments, the control unit (6) collects the copper thickness values and calculates the average value of the collected copper thicknesses, and records the starting point when the difference between the real-time copper thickness value and the average value of the copper thickness is greater than or equal to a set threshold value.

[0019] In some embodiments, the probe assembly (11) comprises a probe (111), a buffer spring and a bracket, the head of the probe (111) contacts the non-suspended gold area (21) and / or the suspended gold area (22), and the tail of the probe (111) is connected to the bracket through the buffer spring.

[0020] In some embodiments, the probe (111) is connected with a receiver (114), which transmits the copper thickness value to the control unit (6).

[0021] In some embodiments, the probe assembly (11) further comprises a connecting sleeve (113), the tail of the probe (111) is slidingly inserted into the connecting sleeve (113), and the buffer spring (112) is arranged in the connecting sleeve (113) and connected to the tail end of the probe (111).

[0022] In some embodiments, the probe (111) of each probe assembly (11) is fixedly connected to the same bracket (115), the bracket (115) is fixedly connected to the rack (3), the length extension direction of the rack (3) is the same as the linear arrangement direction of the plurality of probe assemblies (11), the side of the rack (3) away from the bracket (115) is engaged with a gear (4), the axis of the gear (4) is connected with the output shaft of the motor (5), the motor (5) is connected with the control unit (6),

[0023] When calculating the distance of the linear movement of the copper thickness gauge (1),

[0024] The motor (5) drives the gear (4) to rotate, the gear (4) drives the rack (3) to move, so that the probe assembly (11) moves in the suspended gold area (22) and the non-suspended gold area (21), the control unit (6) transmits the starting point signal and the ending point signal to the motor (5), and the control unit (6) calculates the length D between the starting point and the ending point through the rotating speed of the motor (5), and the calculation formula is as follows:

[0025] D = n × p

[0026] n is the rotating speed of the motor (5)

[0027] p is the moving distance per revolution.

[0028] In some embodiments, the distance between adjacent probes (111) is 0.03 mm.

[0029] The beneficial effects of the invention are that:

[0030] The copper thickness gauge is first used to obtain the non-suspended gold area of the gold finger, and the copper thickness gauge is driven to move to the suspended gold area. Since the copper thickness of the non-suspended gold area includes the copper strip and the gold-nickel layer located on the copper strip, and the suspended gold area is the gold-nickel layer extending to the outside of the copper strip, there is a significant difference in the copper thickness between the non-suspended gold area and the suspended gold area of the gold finger. In this case, when the copper thickness gauge moves from the suspended gold area to the non-suspended gold area, a sudden change in copper thickness occurs. At this time, when the difference between the real-time copper thickness value and the copper thickness value obtained before is greater than or equal to the set threshold value, the starting point is recorded. The starting point indicates the entry into the suspended gold area and can be used as the starting point for measuring the suspended gold area. The copper thickness gauge continues to move until the copper thickness value is zero, indicating that the suspended gold area is left. The end point is recorded. The distance between the starting point and the end point is the suspended gold length of the gold finger. The measurement method can quickly and automatically determine the non-suspended gold area by using the difference between the suspended gold area and the non-suspended gold area of the gold finger. Then, by identifying the copper thickness value of the non-suspended gold area, it can be determined whether it is in the non-suspended gold area and the length of the non-suspended gold area can be quickly calculated. The operation is simple, the suspended gold length can be measured without damaging the PCB gold finger, and the copper thickness gauge with stable measurement is used for detection, which is not easily affected by the external environment, has the advantages of high automation and high accuracy, and avoids the problems of traditional slicing sampling and cross-section measurement of suspended gold length, such as complicated operation, damage to gold finger and inaccurate detection.

[0031] In addition, the detection process of the present application is not affected by the structure of the gold finger, and can be applied to the detection of various types of gold fingers, overcoming the poor universality problem of traditional light irradiation detection. BRIEF DESCRIPTION OF DRAWINGS

[0032] Figure 1 A schematic diagram of the connection of the control unit with the copper thickness gauge and the motor;

[0033] Figure 2 A working state diagram of the copper thickness gauge, the motor, the bracket and the rack;

[0034] Figure 3 A probe assembly part enlarged view in the front view of the copper thickness gauge.

[0035] Figure 4 A physical diagram of the gold finger;

[0036] Figure 5 A side view of the gold finger;

[0037] Figure 6 A process diagram of the suspended gold length measurement method of the gold finger.

[0038] REFERENCE SIGNS:

[0039] Copper thickness gauge 1, probe assembly 11, probe 111, buffer spring 112, connecting sleeve 113, receiver 114, bracket 115, PCB gold finger 2, non-suspended gold area 21, suspended gold area 22, rack 3, gear 4, motor 5, control unit 6. DETAILED DESCRIPTION

[0040] The preferred embodiments of the present application will be described in detail below with reference to the drawings, and it should be noted that the following embodiments are only used to explain the present application and should not be regarded as a limitation of the present application.

[0041] In the prior art, the gold finger of the PCB can be divided into a non-suspended gold area and a suspended gold area, wherein the non-suspended gold area is a gold-nickel layer located on the upper surface of the copper strip, and the suspended gold area is a gold-nickel layer extending to the outside of the copper strip. The present application provides a measurement method for the suspended gold length of the gold finger, which is applied to measure the length of the suspended gold area of the gold finger, as shown in FIG. 6, and the specific measurement process includes: Figures 1-3

[0042] S101: Use the copper thickness gauge 1 to obtain the copper thickness value of the non-suspended gold area 21 of the gold finger, and drive the copper thickness gauge 1 to move towards the suspended gold area 22, the moving direction being the direction in which the head of the gold finger points to the root of the gold finger, to ensure that the copper thickness gauge 1 can detect the maximum length of the suspended gold area of the gold finger.

[0043] The copper thickness of the non-suspended gold area 21 and the suspended gold area 22 of the gold finger is used as the basis for judgment in the present application, wherein the non-suspended gold area 21 includes a copper strip and a gold-nickel layer located on the upper surface of the copper strip, so the copper thickness of the non-suspended gold area 21 is several times greater than the copper thickness of the suspended gold area 22. Therefore, the copper thickness can be used to distinguish the non-suspended gold area 21 and the suspended gold area 22 of the gold finger, and the copper thickness gauge 1 is driven to move from the non-suspended gold area to the suspended gold area to find the signal of the sudden change in copper thickness, and then move towards the suspended gold area 22 to measure the length of the suspended gold area 22.

[0044] S102: When the difference between the real-time obtained copper thickness value and the copper thickness value obtained before is greater than or equal to the set threshold value, record it as the starting point, and continue to move the copper thickness gauge 1 until the copper thickness value is zero and record it as the end point, and the distance between the starting point and the end point is the suspended gold length of the gold finger.

[0045] Based on the difference in copper thickness values of the non-suspended gold area 21, the suspended gold area 22 and the non-gold finger area of the gold finger, a set threshold value is established, which is the difference threshold value of the copper thickness values of the non-suspended gold area 21 and the suspended gold area 22 of the gold finger. When the difference between the copper thickness value detected by the copper thickness gauge 1 during the movement towards the suspended gold area 22 and the copper thickness value of the non-suspended gold area 21 is greater than or equal to the set threshold value, the point is set as the starting point of the measurement of the suspended gold length, and the copper thickness gauge 1 is driven to continue moving in the original moving direction. When the copper thickness value detected by the copper thickness gauge 1 during the movement towards the suspended gold area 22 is zero, record this point as the end point of the measurement of the suspended gold length, and the distance from the starting point to the end point of the copper thickness gauge 1 is taken as the suspended gold length of the gold finger.​

[0046] To better realize the embodiment of the present application, based on the step S102, when the difference between the real-time acquired copper thickness value and the copper thickness value acquired in front is greater than or equal to the set threshold value, the copper thickness gauge 1 continues to move, the copper thickness value is zero and is recorded as the endpoint;

[0047] The present application also includes a control unit 6 connected to the copper thickness gauge 1, which specifically includes:

[0048] S201: The copper thickness gauge 1 transmits the copper thickness value to the control unit 6, the control unit 6 calculates the difference between the real-time copper thickness value and the copper thickness value in front, judges whether the difference is greater than or equal to the set threshold value, and outputs the starting point.

[0049] The embodiment of the present application measures the copper thickness of the gold finger while the copper thickness gauge 1 moves from the non-suspended gold area 21 to the suspended gold area 22, and transmits the measured copper thickness value to the control unit 6. The copper thickness value of the non-suspended gold area 21 of the gold finger is used as the judgment reference, the control unit 6 calculates the copper thickness value acquired during the movement of the copper thickness gauge 1 in real time, and when the difference between the latest measured copper thickness value and the copper thickness value of the non-suspended gold area 21 is greater than or equal to the set threshold value, the control unit 6 outputs the point of the latest measured copper thickness value as the starting point.

[0050] S202: The control unit 6 outputs the endpoint based on the signal of the copper thickness value being zero, instructs the copper thickness gauge 1 to end the movement, and the control unit 6 calculates the distance between the starting point and the endpoint.

[0051] The embodiment of the present application measures the copper thickness of the gold finger while the copper thickness gauge 1 moves from the non-suspended gold area 21 to the suspended gold area 22, and transmits the measured copper thickness value to the control unit 6. The copper thickness value of the non-suspended gold area 21 of the gold finger is used as the judgment reference, the control unit 6 calculates the copper thickness value acquired during the movement of the copper thickness gauge 1 in real time, and when the latest measured copper thickness value is zero, the control unit 6 outputs the point of the latest measured zero as the endpoint, and gives an instruction to the copper thickness gauge 1 to end the movement. The control unit 6 calculates the distance between the starting point and the endpoint as the suspended gold length.

[0052] To better realize the embodiment of the present application, as shown in Figure 3 The copper thickness gauge 1 in the embodiment of the present application includes at least two probe assemblies 11, and the at least two probe assemblies 11 enter the non-suspended gold area 21 in sequence, which specifically includes:

[0053] S301: When the difference between the copper thickness value acquired by the two probe assemblies 11 and the copper thickness value acquired in front is continuously greater than or equal to the set threshold value, it is determined that the copper thickness gauge 1 enters the non-suspended gold area 21.

[0054] The gold suspension area 22 of the gold finger is a gold-nickel layer extending to the outside of the copper strip, which is extremely thin and may have errors in the measurement process. If a single probe assembly 11 is used for measurement, it may fail to detect, which greatly affects the measurement result of the final gold suspension length. In the embodiment of the present application, at least two probe assemblies 11 are provided. When the difference between the copper thickness values measured by the two probe assemblies 11 during movement towards the gold suspension area 22 and the copper thickness value of the non-gold suspension area 21 is continuously greater than or equal to a set threshold value, it is determined that the copper thickness gauge 1 enters the non-gold suspension area 21. In this way, errors can be reduced to some extent, and it is ensured that the copper thickness gauge 1 accurately enters the gold suspension area before calculating the length of the non-gold suspension area, thereby improving the measurement accuracy.

[0055] When at least two probe assemblies 11 are provided, the copper thickness gauge 1 can be determined to enter the non-gold suspension area 21 when the difference between the copper thickness values measured by more than two probe assemblies 11 during movement towards the gold suspension area 22 and the copper thickness value of the non-gold suspension area 21 is continuously greater than or equal to a set threshold value.

[0056] S302: When the copper thickness values obtained by the two probe assemblies 11 are continuously zero, it is determined that the copper thickness gauge 1 reaches the end point, and the movement distance of the probe assembly 11 located at the first end in the movement direction is taken as the length of the gold suspension area 22.

[0057] In the embodiment of the present application, at least two probe assemblies 11 are provided. When the copper thickness values measured by the two probe assemblies 11 during movement towards the gold suspension area 22 are continuously zero, it is determined that the measurement is completed, and the movement distance of the probe assembly 11 located at the first end in the movement direction from the measurement starting point to the measurement end point is taken as the length of the gold suspension area 22.

[0058] When at least two probe assemblies 11 are provided, the movement distance of each probe assembly 11 from the measurement starting point to the measurement end point can be collected, and the average value of the length of the gold suspension area 22 is calculated based on the movement distance measured by each probe assembly, which can reduce measurement errors to some extent.

[0059] Since the gold suspension area is thin and the lower part of the gold suspension area has no support, when the probe assemblies all fall into the gold suspension area, the downward pressure of the probe assemblies contacting the gold suspension area is easy to damage the gold suspension area. To better implement the embodiment of the present application, as shown in Figure 3 At least two probe assemblies 11 in the copper thickness gauge 1 are arranged side by side, and the straight line length of the at least two probe assemblies 11 arranged side by side is less than the length of the non-gold suspension area 21, so that the copper thickness gauge 1 can completely fall into the gold suspension area 22 and move from the non-gold suspension area 21 to the gold suspension area 22.

[0060] The linear length of the at least two probe assemblies 11 arranged side by side is greater than the length of the suspension gold area 22, so that during the detection of the suspension gold area, the probe assemblies are not all in the suspension gold area, and the probe assemblies in the non-suspension gold area can limit the excessive downward pressing of the probe assemblies in the suspension gold area, so that the probe assemblies 11 in the non-suspension gold area 21 can support the probe assemblies 11 in the suspension gold area 22, and damage to the suspension gold area is avoided.

[0061] To better realize the embodiment of the present application, in the embodiment of the present application, the copper thickness gauge 1 collects and obtains the copper thickness value and calculates the average value of the collected copper thickness. When the difference between the copper thickness value obtained by the copper thickness gauge 1 and the average value of the copper thickness is greater than or equal to the set threshold value, it is recorded as the starting point.

[0062] To better realize the embodiment of the present application, as shown in Figure 3 In the embodiment of the present application, the probe assembly 11 includes a probe 111, wherein the head of the probe 111 is a detection part for contacting the non-suspension gold area 21 and / or the suspension gold area 22, the tail of the probe 111 is connected with a buffer spring 112, and the probe 111 is connected to the bracket 115 through the buffer spring 112.

[0063] During the measurement, the head of the probe 111 directly contacts the non-suspension gold area 21 and / or the suspension gold area 22 of the gold finger. When the pressure applied by the contacting probe 111 to the gold finger is too large and during the movement of the measurement, the gold finger may be peeled off by the probe 111 and damaged. The embodiment of the present application can reduce the pressure applied by the head of the probe 111 to the gold finger, thereby reducing the risk of damage to the gold finger during the measurement.

[0064] To better realize the embodiment of the present application, as shown in Figure 3 In the embodiment of the present application, the probe 111 further includes a receiver 114, and the detection part transmits the measured copper thickness value to the control unit 6 through the receiver 114.

[0065] To better realize the embodiment of the present application, as shown in Figure 3 In the embodiment of the present application, the probe assembly 11 further includes a connecting sleeve 113, the tail of the probe assembly 11 is slidingly inserted into the connecting sleeve 113, and the buffer spring 112 is arranged in the connecting sleeve 113 and connected to the tail end of the probe assembly 11.

[0066] The tail of the probe 111 is connected with the buffer spring 112, the head of the probe 111 directly contacts the gold finger and moves to the suspended gold area 22 during the measurement, the probe 111 can be inclined during the movement, and the measurement accuracy is affected, the connecting sleeve 113 is arranged, the buffer spring 112 is arranged in the connecting sleeve 113, the tail of the probe 111 is inserted into the connecting sleeve 113 and connected with the buffer spring 112, and the movement of the buffer spring 112 and the probe 111 except the longitudinal expansion is limited through the connecting sleeve 113.

[0067] To better realize the embodiment of the application, as shown in Figure 2 The probe assembly 11 is fixed to the rack 3 through the support 115, the length extension direction of the rack 3 is the same as the linear arrangement direction of the probe assembly 11, the gear 4 is engaged on the side of the rack 3 away from the support 115, the axis of the gear 4 is connected with the output shaft of the motor 5, the motor 5 is connected with the control unit 6,

[0068] During the measurement, the motor 5 drives the gear 4 to rotate, the gear 4 drives the rack 3 to move, so that the probe assembly 11 moves in the suspended gold area 22 and the non-suspended gold area 21, the support 115 and the rack 3 limit the movement direction of the probe assembly to the direction in which the head of the gold finger points to the root of the gold finger, the control unit 6 transmits the start point signal and the end point signal to the motor 5, and the control unit 6 calculates the length D between the start point and the end point through the rotating speed of the motor 5, and the calculation formula is as follows:

[0069] D = n x p, wherein n is the rotating speed of the motor 5, and p is the moving distance per revolution.

[0070] To better realize the embodiment of the application, the distance between the adjacent probes 111 of the at least two probe assemblies 11 is 0.03 mm, so that the linear length of the at least two probe assemblies 11 arranged side by side is less than the length of the non-suspended gold area 21, so that the copper thickness gauge 1 can completely fall into the suspended gold area 22 and move from the non-suspended gold area 21 to the suspended gold area 22, and the linear length of the at least two probe assemblies 11 arranged side by side is greater than the length of the suspended gold area 22, so that the probe assembly 11 located in the non-suspended gold area 21 can support the probe assembly 11 located in the suspended gold area 22.

[0071] The precision of the gear 4 and the rack 3 is ≤0.01 mm, and the moving distance of one revolution of the gear 4 is recommended to be ≤0.01 mm, that is, the moving distance of one quarter of a revolution is 0.0025 mm, and the smaller the moving distance of one revolution of the screw thread, the higher the precision of the suspended gold detection.

[0072] The above merely provides the preferred embodiments of the present application, and is not used to limit the present application. For those skilled in the art, the present application can have various modifications and changes. Any modifications, equivalent replacements, improvements, etc. made within the principles and technical scope of the present application shall fall into the scope of the present application.

Claims

1. A method for measuring the length of gold-plated finger suspension, wherein the gold finger (2) comprises a non-suspended gold area (21) and a suspended gold area (22), wherein the non-suspended gold area (21) is a gold-nickel layer located on the upper surface of a copper strip, and the suspended gold area (22) is a gold-nickel layer extending to the outside of the copper strip, characterized in that, The measurement method includes: The copper thickness of the non-suspended gold area (21) of the gold finger (2) is detected using a copper thickness gauge (1). The copper thickness gauge (1) is then moved toward the suspended gold area (22) in the direction that the head of the gold finger (2) points toward the root of the gold finger (2). When the difference between the real-time copper thickness value and the previous copper thickness value is greater than or equal to the set threshold, it is recorded as the starting point of the length measurement, and the copper thickness gauge (1) is driven to continue moving until the detected copper thickness value is zero and is recorded as the end point of the length measurement. The distance between the starting point and the ending point is calculated as the length of the gold finger (2).

2. The method for measuring the length of the gold finger suspension according to claim 1, characterized in that, The copper thickness gauge is also connected to a control unit (6), which is connected to the copper thickness gauge (1). The copper thickness gauge (1) transmits the copper thickness value to the control unit (6). The control unit (6) calculates the difference between the real-time detected copper thickness value and its previous copper thickness value, determines whether the difference is greater than or equal to a set threshold, and outputs the starting point. The control unit (6) is also used to output the endpoint based on the signal that the copper thickness is zero, and to stop the movement of the copper thickness gauge (1), and to calculate the distance between the starting point and the endpoint.

3. The method for measuring the length of the gold finger suspension according to claim 2, characterized in that, The copper thickness gauge (1) includes at least two probe assemblies (11). During measurement, at least two probe assemblies (11) of the copper thickness gauge (1) sequentially enter the non-suspended gold zone (21). When the difference between the copper thickness values ​​obtained by the two probe components (11) and the previously obtained copper thickness values ​​is continuously greater than or equal to a set threshold, it is determined that the copper thickness gauge (1) has entered the non-suspended gold zone (21). When the copper thickness values ​​obtained by the two probe assemblies (11) are continuously zero, it is determined that the copper thickness gauge (1) has reached the endpoint, and the first signal to obtain a copper thickness value of zero is taken as the endpoint.

4. The method for measuring the length of the gold finger suspension according to claim 3, characterized in that, The at least two probe assemblies (11) are arranged side by side, and the straight line length of the at least two probe assemblies is less than the length of the non-suspended gold zone (21), so that the copper thickness gauge (1) can fall completely into the suspended gold zone (22) and move from the non-suspended gold zone (21) to the suspended gold zone (22). The length of the straight line where at least two probe assemblies are located is greater than the length of the gold-suspended area (22), so that the probe assembly (11) located in the non-gold-suspended area (21) supports the probe assembly (11) located in the gold-suspended area (22).

5. The method for measuring the length of the gold finger suspension according to claim 4, characterized in that, The control unit (6) collects copper thickness values ​​and calculates the average value of the collected copper thickness. When the difference between the real-time copper thickness value and the average copper thickness value is greater than or equal to the set threshold, it is recorded as the starting point.

6. The method for measuring the length of the gold finger suspension according to claim 3, characterized in that, The probe assembly (11) includes a probe (111), a buffer spring (112) and a bracket. The head of the probe (111) contacts the non-gold-suspension area (21) and / or the gold-suspension area (22), and the tail of the probe (111) is connected to the bracket via the buffer spring.

7. The method for measuring the length of the gold finger suspension according to claim 6, characterized in that, The probe (111) is connected to a receiver (114), which transmits the copper thickness value to the control unit (6).

8. The method for measuring the length of the gold finger suspension according to claim 6, characterized in that, The probe assembly (11) also includes a connecting sleeve (113), the tail of the probe (111) is slidably inserted into the connecting sleeve (113), and the buffer spring (112) is disposed in the connecting sleeve (113) and connected to the tail of the probe (111).

9. The method for measuring the length of the gold finger suspension according to claim 6, characterized in that, The probes (111) of each probe assembly (11) are all fixed to the same bracket (115), which is fixed to a rack (3). The length extension direction of the rack (3) is the same as the straight-line arrangement direction of the probe assemblies (11). A gear (4) meshes with the side of the rack (3) facing away from the bracket (115). The axis of the gear (4) is connected to the output shaft of the motor (5). The motor (5) is connected to the control unit (6). When calculating the distance traveled by the copper thickness gauge (1) in a straight line, The motor (5) drives the gear (4) to rotate, and the gear (4) drives the rack (3) to move, thereby moving the probe assembly (11) in the suspended gold area (22) and the non-suspended gold area (21). The control unit (6) transmits the starting point signal and the ending point signal to the motor (5). The control unit (6) calculates the length D between the starting point and the ending point based on the rotational speed of the motor (5). The calculation formula is as follows: D = n × p n is the speed of motor (5) p represents the distance traveled per revolution.

10. The method for measuring the length of the gold finger suspension according to claim 9, characterized in that, The distance between adjacent probes (111) is 0.03 mm.

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