Circuit board surface treatment device and method

Abstract

The invention relates to the technical field of circuit board processing, in particular to a circuit board surface treatment device and method.The circuit board surface treatment device comprises a workbench, a leveling assembly and a feeding assembly; the feeding assembly comprises a feeding plate, a moving rod, a rotating rod, a connecting rod, a limiting plate, a lifting component and a driving component, the multiple circuit boards to be machined are placed in the containing grooves correspondingly, the lifting component is started to drive the feeding plate to descend, in the descending process of the feeding plate, the driving component drives the moving rod to move, the moving rod drives the rotating rod to move, and the rotating rod drives the limiting plate to move; the movement of a rotating rod drives a connecting rod and limiting plates to move, so that the limiting plates on the two sides of a placement groove can extend out, the circuit board in the placement groove is limited, finally, a lifting component drives a feeding plate to descend to a discharging position, at the moment, a driving component drives a moving rod to reset, and then the rotating rod, the connecting rod and the limiting plates are reset. And the limiting plate is recollected into the inner side of the feeding plate, so that an operator can conveniently take out the circuit board subjected to surface treatment.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of circuit board processing, and in particular to a circuit board surface treatment device and method. BACKGROUND

[0002] Flexible circuit boards need to be immersed in silver during processing to achieve sub-micron pure silver coating through displacement reaction, prevent silver corrosion and eliminate silver migration problems. The traditional way is to directly place the circuit board in the reaction tank, and then take it out of the reaction tank after the surface of the circuit board is coated with silver. This not only has low efficiency, but also uneven thickness of silver on the surface of the circuit board.

[0003] The prior art CN111988922B discloses a flexible circuit board surface treatment device. A sliding groove is formed on the side wall of the vertical plate of the L-shaped stand, and a sliding block and an L-shaped connecting rod are fixed to the support plate. After the circuit board is fixed on the support plate by the fixing mechanism on the upper end of the support plate, the support plate is moved up and down in the immersion tank by the fixed plate, rotating handle and gear cooperating with the rack to control the vibration immersion. The oscillation of the immersion liquid promotes its full contact with the circuit board and accelerates the immersion efficiency. The fixing mechanism is arranged on the port edge of the upper end of the object slot. The limiting plate is arranged by cooperating the shell, the mounting groove, the spring, the movable block and the connecting rod. The circuit board is fixed in the object slot by the limiting plate to prevent it from being separated from the object slot during oscillation immersion, ensuring its stability. The fixing and loosening of the limiting plate to the circuit board are realized by controlling the movable block by the push-pull rod, which is simple to operate.

[0004] The above device can improve the processing efficiency of the circuit board, but the fixing and loosening of the limiting plate to the circuit board are realized by controlling the movable block by the push-pull rod. Each circuit board needs to be operated separately when fixed and taken down, which is not convenient for the taking and placing operation of the circuit board. SUMMARY

[0005] The present application aims to provide a circuit board surface treatment device and method, which solves the problem of the prior art that the fixing and loosening of the limiting plate to the circuit board are realized by controlling the movable block by the push-pull rod, and each circuit board needs to be operated separately when fixed and taken down, which is not convenient for the taking and placing operation of the circuit board.

[0006] In order to achieve the above object, the application provides a circuit board surface treatment device and method, which comprises a workbench and a leveling assembly, the leveling assembly is arranged on the workbench, and further comprises a feeding assembly; the feeding assembly comprises a feeding plate, a moving rod, a rotating rod, a connecting rod, a limiting plate, a lifting component and a driving component, the lifting component is arranged on the workbench, the feeding plate is slidably connected with the workbench through the lifting component, the moving rod is slidably connected with the feeding plate and located inside the feeding plate, the connecting rod is slidably connected with the feeding plate and located inside the feeding plate, the two ends of the rotating rod are rotatably connected with the moving rod and the connecting rod respectively, the limiting plate is fixedly connected with the connecting rod and located at one end of the connecting rod, and the driving component is arranged on the workbench and used for driving the moving rod to move.

[0007] The driving component comprises a moving frame, a reset spring and a driving seat, the moving frame is slidably connected with the feeding plate and movably connected with the moving rod, the two ends of the reset spring are connected with the moving frame and the feeding plate respectively, and the driving seat is fixedly connected with the workbench and located on the side of the workbench close to the moving frame.

[0008] The driving seat is provided with a release groove, and the release groove is arranged on the side of the driving seat close to the moving frame.

[0009] The lifting component comprises a threaded rod and a threaded seat, the threaded rod is rotatably connected with the workbench and arranged on the workbench, the threaded seat is threadedly connected with the threaded rod and fixedly connected with the feeding plate, and is sleeved on the threaded rod.

[0010] The lifting component further comprises a guide rod and a guide seat, the guide rod is fixedly connected with the workbench and arranged on the workbench, and the guide seat is slidably connected with the guide rod and fixedly connected with the feeding plate and sleeved on the guide rod.

[0011] The leveling assembly comprises a translation component, a blowing seat, a scraper and a gas supply component, the translation component is arranged on the workbench, the blowing seat is slidably connected with the workbench through the translation component, the scraper is fixedly connected with the blowing seat and arranged on the blowing seat, and the gas supply component is arranged on the workbench and used for supplying air to the blowing seat.

[0012] The application further comprises a circuit board surface treatment method, which adopts the circuit board surface treatment device and comprises the following steps: The lifting component is started to drive the feeding plate to move downward to a feeding position, the limiting plate is driven into the feeding plate by the reset spring, and a plurality of circuit boards are placed in the placing groove. Subsequently, the lifting member drives the feeding plate to descend into the leaching tank; During the descending of the feeding plate, the driving member drives the moving rod to move, so that the moving rod drives the rotating rod to move, and the rotating rod drives the connecting rod and the limiting plate to move, so that the limiting plate extends to limit the circuit board placed in the placing groove; After the circuit board enters the leaching tank, the lifting member drives the feeding plate to reciprocate in the groove, so as to accelerate the reaction between the silver ion solution and the circuit board and complete the deposition of the silver layer; After the leaching is completed, the feeding plate is lifted to the flattening assembly, and the flattening assembly flattens the silver layer to ensure the uniform thickness; The lifting member drives the feeding plate to descend to the discharging position again, the limiting plate is retracted, and the operator takes out the processed circuit board for subsequent washing and passivation processes.

[0013] The circuit board surface treatment device provided by the application is used to place a plurality of circuit boards to be processed in the placing grooves, and then the lifting member drives the feeding plate to descend, so that the feeding plate and the circuit boards fall into the leaching tank. During the descending of the feeding plate, the driving member drives the moving rod to move, so that the moving rod drives the rotating rod to move, and the movement of the rotating rod drives the connecting rod and the limiting plate to move, so that the limiting plates on both sides of the placing groove can extend to limit the circuit boards in the placing groove, so that the circuit boards are prevented from moving out of the placing groove during the leaching process. After the lifting member drives the feeding plate to move into the leaching tank, the lifting member drives the feeding plate to reciprocate up and down, so as to agitate the silver ion solution, improve the contact frequency and flowability of the solution with the surface of the circuit board, and accelerate the deposition rate of the silver ion on the surface of the circuit board. After the leaching is completed, the lifting member lifts the feeding plate to the flattening assembly, and the flattening assembly flattens the silver layer on the surface of the circuit board to ensure the uniform thickness of the silver layer. Finally, the lifting member drives the feeding plate to descend to the discharging position, the driving member drives the moving rod to reset, so that the rotating rod, the connecting rod and the limiting plate are reset, the limiting plates are retracted into the inner side of the feeding plate, the operator takes out the circuit board which has completed the surface treatment, and subsequent washing, passivation and other post-processing processes are performed, so that the operator can conveniently take and place the circuit board and the processing efficiency is improved. BRIEF DESCRIPTION OF DRAWINGS

[0014] In order to more clearly illustrate the technical solutions in the embodiments of the application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced.

[0015] Figure 1is the overall structural schematic view of the circuit board surface treatment device of the first embodiment of the present application.

[0016] Figure 2 is the structural schematic view of the driving member of the first embodiment of the present application.

[0017] Figure 3 is the mounting structural schematic view of the roller of the first embodiment of the present application.

[0018] Figure 4 is the mounting structural schematic view of the rotating rod of the first embodiment of the present application.

[0019] Figure 5 is the structural schematic view of the air supply member of the second embodiment of the present application.

[0020] Figure 6 is the flow chart of the circuit board surface treatment method of the third embodiment of the present application.

[0021] In the figure: 101-workbench, 102-leveling assembly, 103-feeding assembly, 104-feeding plate, 105-moving rod, 106-rotating rod, 107-connecting rod, 108-limiting plate, 109-lifting member, 110-driving member, 111-soaking groove, 112-placing groove, 113-moving frame, 114-return spring, 115-driving seat, 116-releasing groove, 117-frame body, 118-roller, 119-limiting protruding column, 201-threaded rod, 202-threaded seat, 203-guiding rod, 204-guiding seat, 205-translation member, 206-blowing seat, 207-air supply member, 208-air pump, 209-connecting pipe. DETAILED DESCRIPTION

[0022] The embodiments of the present application are described in detail below, examples of which are shown in the accompanying drawings, the embodiments described below by referring to the accompanying drawings are exemplary, and are intended to explain the present application, and cannot be understood as a limitation of the present application.

[0023] First embodiment: Please refer to Figures 1 to 4 , wherein Figure 1 is the overall structural schematic view of the circuit board surface treatment device, Figure 2 is the structural schematic view of the driving member, Figure 3 is the mounting structural schematic view of the roller, Figure 4 is the mounting structural schematic view of the rotating rod.

[0024] The application provides a circuit board surface treatment device and method, which comprises a workbench 101, a leveling assembly 102 and a feeding assembly 103, the feeding assembly 103 comprises a feeding plate 104, a moving rod 105, a rotating rod 106, a connecting rod 107, a limiting plate 108, a lifting component 109 and a driving component 110, the driving component 110 comprises a moving frame 113, a return spring 114 and a driving seat 115, the driving seat 115 is provided with a release groove 116, the moving rod 105 is driven to move by the driving component 110, and then the rotating rod 106 is driven to move, the connecting rod 107 and the limiting plate 108 are driven to move by the rotating rod 106, so that the limiting plate 108 can move out of or into the feeding plate 104, thereby limiting the circuit board in the placing groove 112, and the purpose of conveniently taking and placing the circuit board is achieved, and it can be understood that the foregoing scheme can be used to improve the processing efficiency of the circuit board.

[0025] For the specific embodiment, the leveling assembly 102 is arranged on the workbench 101, the leveling assembly 102 is used for scraping the silver layer on the circuit board, the workbench 101 is provided with a leaching groove 111, the leaching groove 111 is used for containing silver ion solution, the leaching groove 111 is provided with a temperature sensor and a heating pipe (not shown in the figure), the heating pipe is used for heating the silver ion solution in the leaching groove 111, and the temperature sensor is used for monitoring the solution temperature in real time and controlling the solution temperature in a suitable working range.

[0026] The lifting component 109 is arranged on the workbench 101, the feeding plate 104 is slidably connected with the workbench 101 through the lifting component 109, the moving rod 105 is slidably connected with the feeding plate 104 and located in the feeding plate 104, the connecting rod 107 is slidably connected with the feeding plate 104 and located in the feeding plate 104, the two ends of the rotating rod 106 are rotatably connected with the moving rod 105 and the rotating rod 106 respectively, the limiting plate 108 is fixedly connected with the connecting rod 107 and located at one end of the connecting rod 107, and the driving component 110 is arranged on the workbench 101 and used for driving the moving rod 105 to move. The feeding plate 104 is provided with a placing groove 112, the placing groove 112 is provided with a through hole (not shown in the figure) for allowing the silver ion solution to flow, the lifting component 109 is used for driving the feeding plate 104 to lift, the moving rod 105 is provided with two, two rotating rods 106, two connecting rods 107 and two limiting plates 108 are arranged at each placing groove 112, and the driving component 110 is used for driving the moving rod 105 to move.

[0027] In use, a plurality of circuit boards to be processed are placed in the placing grooves 112 respectively, and the lifting member 109 is started to drive the feeding plate 104 to descend, so that the feeding plate 104 and the circuit boards fall into the soaking grooves 111. In the process of descending of the feeding plate 104, the driving member 110 drives the moving rod 105 to move, the moving rod 105 drives the rotating rod 106 to move, the movement of the rotating rod 106 drives the connecting rod 107 and the limiting plate 108 to move, so that the limiting plate 108 on both sides of the placing groove 112 can extend out, thereby limiting the circuit boards in the placing groove 112, avoiding the circuit boards from moving out of the placing groove 112 in the soaking process. When the lifting member 109 drives the feeding plate 104 to move into the soaking grooves 111, the lifting member 109 drives the feeding plate 104 to move up and down reciprocally, thereby stirring the silver ion solution, improving the contact frequency and flowability of the solution with the surface of the circuit board, and accelerating the deposition rate of silver ions on the surface of the circuit board. After soaking is completed, the lifting member 109 lifts the feeding plate 104 to the flattening assembly 102, the silver layer on the surface of the circuit board is flattened by the flattening assembly 102, so as to ensure that the thickness of the silver layer is uniform and consistent. Finally, the lifting member 109 drives the feeding plate 104 to descend to a discharging position, at this time, the driving member 110 drives the moving rod 105 to reset, thereby resetting the rotating rod 106, the connecting rod 107 and the limiting plate 108, so that the limiting plate 108 is retracted into the inside of the feeding plate 104, and the operator takes out the circuit board whose surface treatment is completed, and performs subsequent post-processing procedures such as washing and passivation, so as to realize that the staff can conveniently take and place the circuit board, and improve the processing efficiency.

[0028] Secondly, the moving frame 113 is slidably connected with the feeding plate 104 and movably connected with the moving rod 105; the two ends of the reset spring 114 are connected with the moving frame 113 and the feeding plate 104 respectively; the driving seat 115 is fixedly connected with the workbench 101 and located on the side of the workbench 101 close to the moving frame 113.

[0029] Meanwhile, the release groove 116 is arranged on the side of the driving seat 115 close to the moving frame 113.

[0030] The release groove 116 corresponds to the unloading position, the reset spring 114 is a compression spring, the mobile frame 113 is driven to move by the elasticity of the reset spring 114, so that the mobile frame 113 always contacts the surface of the driving seat 115, when the feeding plate 104 is in the unloading position, the mobile frame 113 is located at the release groove 116, at this time, the mobile frame 113 extends into the release groove 116 under the elastic action of the reset spring 114, at this time, the limiting plate 108 is received in the feeding plate 104, which is convenient for workers to take and place the circuit board; when the feeding plate 104 is lowered to the leaching groove 111 or raised to the leveling assembly 102, the mobile frame 113 is synchronously moved out of the release groove 116, at this time, the mobile frame 113 extrudes the reset spring 114 and drives the moving rod 105 to move, so that the rotating rod 106 moves, the connecting rod 107 drives the limiting plate 108 to extend out, thereby limiting the circuit board in the placing groove 112, and the purpose of automatically driving the moving rod 105 to move is achieved.

[0031] In addition, the frame body 117 is in sliding connection with the feeding plate 104, is in fixed connection with the moving rod 105, and is connected with the reset spring 114; the roller 118 is in rotary connection with the frame body 117 and is in contact with the driving seat 115; through the rotation of the roller 118, the friction between the mobile frame 113 and the driving seat 115 is reduced.

[0032] Finally, the limiting protruding column 119 is arranged on one side of the frame body 117 close to the reset spring 114, and is located inside the reset spring 114; through the limiting of the elasticity of the reset spring 114 by the limiting protruding column 119, the reset of the mobile frame 113 is avoided from being affected by the deviation of the reset spring 114.

[0033] When the circuit board surface treatment device of the embodiment is used, the lifting member 109 first drives the feeding plate 104 to move to a discharging position, at this time, the moving frame 113 is located in the release groove 116, the moving frame 113 is driven to move by the elasticity of the reset spring 114, the moving frame 113 drives the moving rod 105 to move, the moving rod 105 drives the rotating rod 106 to move, the rotating rod 106 drives the connecting rod 107 and the limiting plate 108 to move, so that the limiting plate 108 is received in the feeding plate 104, at this time, the circuit board is conveniently placed in the placing groove 112; after the circuit board is placed in place, the feeding plate 104 is driven to descend by the lifting member 109, so that the feeding plate 104 drives the circuit board thereon to enter the immersion tank 111, at this time, the feeding plate 104 is driven to reciprocate up and down by the lifting member 109, so as to agitate the silver ion solution, improve the contact frequency and flowability of the solution with the surface of the circuit board, and accelerate the deposition rate of silver ions on the surface of the circuit board; when the immersion is completed, the feeding plate 104 is moved to the leveling assembly 102 by the lifting member 109, the silver layer on the surface of the circuit board is leveled by the leveling assembly 102, so as to ensure that the thickness of the silver layer is uniform; finally, the feeding plate 104 is driven to return to the discharging position by the lifting member 109, at this time, the moving frame 113 extends into the release groove 116 under the elastic action of the reset spring 114, so that the rotating rod 106 drives the connecting rod 107 and the limiting plate 108 to reset, at this time, the circuit board in the placing groove 112 is conveniently taken out, so as to realize the purpose of conveniently feeding and discharging the circuit board and improving the processing efficiency.

[0034] Second embodiment: On the basis of the first embodiment, please refer to Figure 5 The structure diagram of the air supply member, the lifting member 109 of the embodiment comprises a threaded rod 201 and a threaded seat 202, the lifting member 109 further comprises a guide rod 203 and a guide seat 204, and the leveling assembly 102 comprises a translation member 205, a blowing seat 206 and an air supply member 207.

[0035] For the specific embodiment, the threaded rod 201 is rotationally connected with the workbench 101 and is arranged on the workbench 101; the threaded seat 202 is threadedly connected with the threaded rod 201 and is fixedly connected with the feeding plate 104 and is sleeved on the threaded rod 201; a motor is further installed on the workbench 101, an output end of the motor is connected with the threaded rod 201, the threaded rod 201 is driven to rotate by the motor, the threaded rod 201 drives the threaded sleeve to ascend and descend, and the feeding plate 104 is further driven to ascend and descend.

[0036] The guide rod 203 is fixedly connected with the workbench 101 and arranged on the workbench 101; the guide seat 204 is slidably connected with the guide rod 203 and fixedly connected with the feeding plate 104 and sleeved on the guide rod 203; the lifting of the guide seat 204 is guided by the guide rod 203, and then the lifting of the feeding plate 104 is guided, so that the stability of the lifting of the feeding plate 104 is improved.

[0037] Secondly, the translation component 205 is arranged on the workbench 101; the air blowing seat 206 is slidably connected with the workbench 101 through the translation component 205; the air supply component 207 is arranged on the workbench 101 and supplies air to the air blowing seat 206; the translation component 205 drives the air blowing seat 206 to move in the form of screw driving, the air supply component 207 comprises a gas pump 208 and a connecting pipe 209, the gas pump 208 is installed on the workbench 101, the connecting pipe 209 is respectively communicated with the output end of the gas pump 208 and the air blowing seat 206, and the connecting pipe 209 reserves sufficient length according to the movement of the air blowing seat 206; air is supplied to the connecting pipe 209 by the gas pump 208, and then the air blowing seat 206 blows air to blow the surface of the leached circuit board, at the same time, the translation component 205 drives the air blowing seat 206 to move horizontally, so that the air blowing seat 206 further flattens the surface of all the circuit boards, so that the flatness and uniformity of the surface of the circuit board are sufficiently ensured, and the production quality of the product is improved.

[0038] Third embodiment: The application also comprises a circuit board surface treatment method, which adopts the circuit board surface treatment device and comprises the following steps. S101: the lifting component 109 is started to drive the feeding plate 104 to move downwards to a feeding position, the reset spring 114 is driven to drive the limiting plate 108 to be received in the feeding plate 104, and a plurality of circuit boards are placed in the placing groove 112; S102: then the lifting component 109 drives the feeding plate 104 to descend to the leaching groove 111; S103: during the descending process of the feeding plate 104, the driving component 110 drives the moving rod 105 to move, so that the moving rod 105 drives the rotating rod 106 to move, the rotating rod 106 drives the connecting rod 107 and the limiting plate 108 to move, and the limiting plate 108 is extended to limit the circuit boards in the placing groove 112; S104: after the circuit boards enter the leaching groove 111, the lifting component 109 drives the feeding plate 104 to reciprocatingly move in the groove, so that the reaction of the silver ion solution and the circuit boards is accelerated, and the silver layer deposition is completed; S105: After the leaching is completed, the feeding plate 104 is lifted to the leveling assembly 102, the leveling assembly 102 levels the silver layer to ensure uniform thickness; S106: The lifting member 109 drives the feeding plate 104 to descend to the discharging position again, and the limiting plate 108 is retracted, and the operator takes out the processed circuit board for subsequent washing and passivation processes.

[0039] The above only discloses one or more preferred embodiments of the present application, and cannot limit the scope of the rights of the present application. Those skilled in the art can understand that all or part of the above-mentioned embodiments can be implemented, and equivalent changes made according to the claims of the present application still fall within the scope of the present application.

Claims

1. A circuit board surface treatment apparatus, comprising a worktable and a leveling assembly, wherein the leveling assembly is disposed on the worktable, characterized in that, It also includes the feeding components; The feeding assembly includes a feeding plate, a moving rod, a rotating rod, a connecting rod, a limiting plate, a lifting component, and a driving component. The lifting component is disposed on the worktable. The feeding plate is slidably connected to the worktable via the lifting component. The moving rod is slidably connected to the feeding plate and located inside the feeding plate. The connecting rod is slidably connected to the feeding plate and located inside the feeding plate. The two ends of the rotating rod are rotatably connected to the moving rod and the rotating rod, respectively. The limiting plate is fixedly connected to the connecting rod and located at one end of the connecting rod. The driving component is disposed on the worktable and is used to drive the moving rod to move.

2. The circuit board surface treatment apparatus as described in claim 1, characterized in that, The driving component includes a movable frame, a return spring, and a driving seat. The movable frame is slidably connected to the loading plate and movably connected to the movable rod. The two ends of the return spring are respectively connected to the movable frame and the loading plate. The driving seat is fixedly connected to the worktable and is located on the side of the worktable close to the movable frame.

3. The circuit board surface treatment apparatus as described in claim 2, characterized in that, The drive seat has a release groove, which is located on the side of the drive seat near the movable frame.

4. The circuit board surface treatment apparatus as described in claim 1, characterized in that, The lifting component includes a threaded rod and a threaded seat. The threaded rod is rotatably connected to the worktable and is disposed on the worktable. The threaded seat is threadedly connected to the threaded rod and fixedly connected to the loading plate, and is sleeved on the threaded rod.

5. The circuit board surface treatment apparatus as described in claim 4, characterized in that, The lifting component further includes a guide rod and a guide seat. The guide rod is fixedly connected to the worktable and is disposed on the worktable. The guide seat is slidably connected to the guide rod and fixedly connected to the loading plate, and is sleeved on the guide rod.

6. The circuit board surface treatment apparatus as described in claim 1, characterized in that, The leveling assembly includes a translation component, an air blowing seat, and an air supply component. The translation component is disposed on the worktable; the air blowing seat is slidably connected to the worktable via the translation component; and the air supply component is disposed on the worktable and supplies air to the air blowing seat.

7. A method for surface treatment of a circuit board, employing the circuit board surface treatment apparatus as described in any one of claims 1-6, characterized in that, Includes the following steps: The lifting component is activated to move the loading plate down to the unloading position. The reset spring drives the limiting plate to retract into the loading plate, and multiple circuit boards are placed in the placement slot. The lifting component then drives the loading plate to descend into the immersion tank; During the descent of the feeding plate, the driving component drives the moving rod to move, which in turn drives the rotating rod to move. The rotating rod then drives the connecting rod and the limiting plate to move, causing the limiting plate to extend and limit the circuit board in the placement slot. After the circuit board enters the immersion tank, the lifting component drives the feeding plate to move up and down repeatedly in the tank, accelerating the reaction between the silver ion solution and the circuit board, and completing the silver layer deposition. After the leaching is completed, the feeding plate is lifted to the leveling component, which levels the silver layer to ensure uniform thickness. The lifting component drives the loading plate to the unloading position again, the limiting plate retracts, and the operator takes out the processed circuit board for subsequent washing and passivation processes.

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