Circuit board potting mold and potting method

Abstract

The invention provides a circuit board potting mold and a potting method. The circuit board potting mold comprises a shell, an upper cover plate, at least one plugging block and at least one adjusting assembly, a mounting cavity is formed in the shell, an upper cover plate is arranged on one side of the shell, the upper cover plate is used for sealing the shell, a plurality of through holes are formed in the upper cover plate, and the through holes are communicated with the mounting cavity; the at least one plugging block is slidably arranged in the mounting cavity, the outer side edge of the plugging block abuts against the side wall of the mounting cavity and the upper cover plate, and an encapsulation space is formed among the plugging block, the upper cover plate and the side wall of the mounting cavity; the adjusting assembly is used for driving the plugging block to slide in the mounting cavity; the bottom of the encapsulation space is provided with at least two circuit board foot pad assemblies. According to the scheme, the plugging blocks are arranged to define the matched potting spaces for the circuit boards with different sizes, so that the potting mold can perform glue sealing on various circuit boards, the utilization rate of the potting mold is improved, and the production cost is saved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of potting molds, in particular to a circuit board potting mold and a potting method. BACKGROUND

[0002] In the oil drilling industry, downhole instruments usually have to withstand high temperature, high pressure and high vibration in the harsh downhole environment. If the circuit board of the downhole instrument is not specially protected, the inductors and capacitors on the circuit board will easily fall off, resulting in the failure of the circuit board.

[0003] At present, the industry usually adopts the method of potting two-component polyurethane sealant to protect the circuit board. When potting, the commonly used potting mold is used by placing the circuit board in the potting mold, then injecting sealant into the potting mold, and after the sealant solidifies, the potting mold is disassembled and the circuit board is taken out.

[0004] However, the existing potting mold can usually only adapt to a certain type of circuit board, and different lengths of circuit boards need to be configured with different specifications of molds. The top surface of the mold is usually provided with a protruding part, which is provided for the reserved expansion space. When the height of the components of the circuit board changes, the mechanical protrusion may conflict with the components. At the same time, the mechanical protrusion is fixed, which means that the reserved expansion space is fixed. When replacing potting glue with different expansion coefficients, the circuit board may be subjected to mechanical stress, which is easy to damage. SUMMARY

[0005] Therefore, it is necessary to provide a circuit board potting mold and a potting method in view of the above technical problems.

[0006] In a first aspect, the present application provides a circuit board potting mold, and the invention is specifically as follows.

[0007] A circuit board potting mold, comprising: a shell and an upper cover plate, the shell is provided with a mounting cavity inside, one side of the shell is provided with a mounting port in communication with the mounting cavity, the upper cover plate is connected to the side wall of the mounting port and closes the mounting port, the upper cover plate is provided with a plurality of through holes, each through hole is in communication with the mounting cavity, and a potting space is formed between the side wall of the mounting cavity and the upper cover plate.

[0008] The upper cover plate is provided with a plurality of through holes, each through hole is in communication with the mounting cavity, the side wall of the through hole is provided with an internal thread at the end away from the mounting cavity, the through hole is provided with an adjusting rod, the upper part of the adjusting rod is provided with a second thread matched with the internal thread, and one end of the adjusting rod is used to pass out from the side of the upper cover plate facing the potting space, so that a recessed space is formed on the body of the demolding sealant, and the recessed space is a reserved expansion space of the sealant.

[0009] The beneficial effects of the present scheme are: the adjusting rod protrudes from one side of the inner wall of the upper cover plate after adjustment, and finally a recess appears on the sealed glue block, which is the reserved expansion space. When the circuit board works in a high-temperature environment underground, the potting glue expands under heat, and the expanded part enters the reserved expansion space, thereby reducing the mechanical stress on the components. Reserving the expansion space in advance can reduce the longitudinal stress on the components, and the grid-shaped reserved expansion space can also reduce the transverse stress on the components.

[0010] The up and down adjustment of the adjusting rod can adapt to components of different heights, and the upward adjustment can avoid conflict with higher components and adapt to different circuit boards; the downward adjustment can reserve enough glue expansion space for shorter components. Finally, the regionalization of the glue reserved expansion space can be adjusted, and the mechanical stress generated after the expansion of the glue can be maximized. Thus, the problem that the circuit board may bear mechanical stress and be easily damaged when the potting glue with different expansion coefficients is replaced in the prior art is improved.

[0011] Preferably, it further comprises at least one sealing block and at least one adjusting assembly.

[0012] The at least one sealing block is slidingly arranged in the mounting cavity, and the outer side edges of the sealing block abut against the side walls of the mounting cavity and the upper cover plate respectively, and the sealing block, the upper cover plate and the side walls of the mounting cavity form the potting space therebetween, and / or the sealing space is formed between the two oppositely arranged sealing blocks and the upper cover plate and the side walls of the mounting cavity.

[0013] Each adjusting assembly is connected with a sealing block, and the adjusting assembly is used to drive the sealing block to slide in the mounting cavity.

[0014] The side wall away from the upper cover plate of the potting space is provided with at least two circuit board foot assemblies.

[0015] The beneficial effects of the present scheme are: when potting, first install the circuit board to be potted on the circuit board foot assembly, then adjust the adjusting assembly to drive at least one sealing block to slide, so that the distance between the sealing block and the inner wall of the shell matches the length of the circuit board, and / or the distance between the two sealing blocks matches the length of the circuit board, so that the adjusted potting space meets the potting standard of the circuit board; next, install the upper cover plate at the mounting port, inject the potting glue into the potting space through the through hole, and gradually cover the circuit board with the potting glue, thereby completing the potting process. The present scheme sets the sealing block to surround the matching potting space for circuit boards of different sizes, so that the potting mold can pot glue for multiple circuit boards, improving the utilization rate of the potting mold and improving the problem that the mold must be re-made when the length of the circuit board changes in the prior art, which easily causes waste of resources and time.

[0016] Preferably, the adjusting assembly comprises a control rod rotationally connected to the blocking block at one end, the shell is provided with a first screw hole, the control rod is provided with a first thread threadedly matched with the first screw hole, and the end of the control rod away from the blocking block at least partially penetrates out of the first screw hole and is exposed to the mounting cavity, and the rotation axis of the control rod is parallel to the sliding direction of the blocking block in the mounting cavity.

[0017] The scheme has the beneficial effect that: since the control rod is rotationally connected to the blocking block, the control rod can be driven to rotate by an external force, and when the control rod rotates, the control rod will move in a straight line in the first screw hole, thereby pushing the blocking block to slide in the mounting cavity. The scheme uses a relatively simple structure to achieve the function of driving the blocking block to slide, thereby improving the practicability of the pouring and sealing mold.

[0018] Preferably, the side wall of the pouring and sealing space away from the upper cover plate is provided with a sliding groove, and the bottom of at least one blocking block is provided with a protruding part slidably matched with the sliding groove, and the protruding part is slidably arranged in the sliding groove.

[0019] The scheme has the beneficial effect that: by matching the bottom of the blocking block with the sliding groove for sliding, the linear sliding of the blocking block can be ensured, and the stability of the sliding of the blocking block is increased.

[0020] Preferably, the circuit board supporting foot assembly comprises a supporting part slidably arranged on the side wall of the mounting cavity away from the upper cover plate and used for supporting the circuit board, and a limiting part connected with the supporting part and used for abutting against the edge of the circuit board.

[0021] The scheme has the beneficial effect that: when the size of the circuit board changes, the supporting part is slid and the limiting part abuts against the edge of the circuit board, so that circuit boards of different sizes can be fixed and limited.

[0022] Preferably, the supporting part comprises a bottom part slidably arranged in the sliding groove, and an adjusting part arranged on the bottom part, the limiting part is connected with the bottom part, the adjusting part is used for supporting the circuit board, and the height of the adjusting part is adjustable.

[0023] The scheme has the beneficial effect that: by arranging the height-adjustable adjusting part, the requirements of pouring and sealing thicknesses of different circuit board bottoms can be met, and the applicability of the pouring and sealing mold is further increased.

[0024] Preferably, the adjusting member comprises an outer pin, an inner pin and a knob, the outer pin is connected to the bottom part and is provided with a sliding hole, the sliding hole is arranged perpendicularly to the side wall of the side of the potting space away from the upper cover plate, the inner pin is slidably arranged in the sliding hole and is used for supporting the circuit board, the side of the outer pin is provided with a second screw hole, the second screw hole is communicated with the sliding hole, the knob is provided with external threads, the knob is screwed with the side wall of the second screw hole, and the end of the knob is movably abutted against the inner pin.

[0025] The beneficial effects of the scheme are that when the thickness of the bottom potting glue of the circuit board needs to be adjusted, the knob is loosened, the inner pin is adjusted to the target height, the knob is tightened to abut against the inner pin, the distance between the circuit board and the lower cover plate is changed, and the thickness of the bottom potting glue of the circuit board is adjusted. The scheme has simple structure and low cost, and the maintenance cost of the subsequent mold is lower.

[0026] In the second aspect, the application provides a circuit board potting method, and the invention content is specifically as follows.

[0027] A circuit board potting method comprises the following steps.

[0028] A housing, an upper cover plate, at least one sealing block and at least one adjusting assembly are provided, the housing and the upper cover plate are provided with a mounting cavity, the upper cover plate is provided with a plurality of through holes communicated with the mounting cavity, at least one sealing block is slidably arranged in the mounting cavity, the outer side edges of the sealing blocks are respectively abutted against the side walls of the mounting cavity and the upper cover plate, the sealing blocks, the upper cover plate and the side walls of the mounting cavity form a potting space, and / or the sealing blocks arranged oppositely and the upper cover plate and the side walls of the mounting cavity form a potting space, each adjusting assembly is connected with a sealing block, and the adjusting assembly is used for driving the sealing block to slide in the mounting cavity.

[0029] The circuit board to be glued is fixed in the potting space through a circuit board foot assembly, and the height of the circuit board foot assembly is adjustable.

[0030] The size of the potting space is adjusted through the adjusting assembly, and the bottom height of the circuit board is adjusted through the circuit board foot assembly.

[0031] The expansion space of the top of the circuit board is determined according to the distance between the top of the circuit board and the upper cover plate, and the expansion space is used for reducing the mechanical stress generated by the expansion of the potting glue on the components of the circuit board.

[0032] The potting glue is injected into the potting space through the through holes.

[0033] The beneficial effects of the scheme are: the sealing block is arranged to enclose a matching pouring space for circuit boards of different sizes, and the bottom glue thickness of the circuit board is adjusted by the circuit board foot assembly, so that the pouring mold can glue multiple circuit boards, improving the utilization rate of the pouring mold, and improving the problem that in the prior art, when the length of the circuit board changes, the mold can only be re-made, which easily causes waste of resources and time.

[0034] On the other hand, in actual use, when the poured circuit board is taken out and installed on a tool to work, for example, installed on a downhole exploration tool, because the temperature in the downhole is high, the pouring glue will usually continue to expand, and the pouring glue corresponding to the top of the shorter component is more, at this time, it will be easier to cause mechanical stress to the components on the circuit board, resulting in damage to the components.

[0035] Therefore, by reserving an expansion space for components of different heights, conflicts with higher components can be avoided, and sufficient glue expansion space can be reserved for shorter components, ultimately realizing regional adjustment of the glue expansion space, and maximizing the reduction of mechanical stress generated after the glue expands.

[0036] Preferably, the expansion space on the top of the circuit board is determined according to the distance between the circuit board and the upper cover plate, comprising:

[0037] The part of the upper cover plate in contact with the pouring space is divided into a plurality of grids;

[0038] The through holes in the plurality of grids are divided into glue injection holes, exhaust holes and adjustment holes, the exhaust holes are the through holes that are not completely communicated with the pouring space, the number of glue injection holes is two, and they are respectively located on the opposite two side edges of the upper cover plate, and the remaining through holes communicated with the pouring space are the adjustment holes, an adjustment rod is movably arranged in the adjustment hole, one end of the adjustment rod is used to pass out from the side of the upper cover plate facing the pouring space, so that a recessed space is formed on the poured glue body, and the recessed space is a reserved glue expansion space;

[0039] The space volume between the lower cover plate and the components of the circuit board in the grid corresponding to each adjustment hole is calculated;

[0040] The expansion space value in each adjustment hole is calculated according to the space volume;

[0041] The adjustment rod is adjusted according to the expansion space value.

[0042] The beneficial effects of the scheme are: corresponding expansion spaces are reserved for components of different heights, realizing regional adjustment of the glue expansion space, and maximizing the reduction of mechanical stress generated after the glue expands.

[0043] Preferably, the method further comprises:

[0044] Correcting the expansion space value corresponding to the target component in the grid, the target component including a cylindrical component and a square component.

[0045] The beneficial effects of the present scheme are: more accurate estimation of the space volume, determination of the glue filling amount and reserved space, and reduction of the mechanical stress borne by the components.

[0046] In summary, the beneficial effects of the present application at least include the following:

[0047] 1. The present scheme sets a blocking block to enclose a matching encapsulation space for circuit boards of different sizes, so that the encapsulation mold can encapsulate multiple circuit boards, improving the utilization rate of the encapsulation mold and solving the problem in the prior art that when the length of the circuit board changes, the mold has to be re-made, which easily causes waste of resources and time.

[0048] 2. The height-adjustable adjusting member can meet the requirements of different encapsulation thicknesses at the bottom of the circuit board, further increasing the applicability of the encapsulation mold.

[0049] 3. The adjusting rod can be adjusted up and down to adapt to components of different heights, upward adjustment can avoid conflict with higher components and adapt to different circuit boards, and downward adjustment can reserve enough space for lower components. Ultimately, the region of the glue body reserved for expansion can be adjusted, and the mechanical stress generated after the expansion of the glue body is maximized.

[0050] 4. The lower part of the glue injection hole is threadless, so that when the hole is used as a glue injection hole, the glue body can be easily demolded after expanding into the glue injection hole. BRIEF DESCRIPTION OF DRAWINGS

[0051] Figure 1 It is a schematic diagram of the overall structure of an embodiment;

[0052] Figure 2 It is a schematic diagram of the overall explosion of the glue encapsulation mold in an embodiment;

[0053] Figure 3 It is Figure 2 an enlarged view of part A in the middle;

[0054] Figure 4 It is Figure 2 an enlarged view of part B in the middle.

[0055] Figure 5 It is a schematic diagram of the flow of the circuit board encapsulation method of an embodiment.

[0056] Figure 6 It is a schematic diagram of step 540 in the circuit board encapsulation method of an embodiment.

[0057] Figure 7 The schematic diagram of the upper cover plate through hole division in the circuit board potting method of an embodiment.

[0058] The figure mark explanation: 100, the shell; 110, the shell body; 120, the lower cover plate; 200, the upper cover plate; 300, the blocking block; 400, the adjusting assembly; 410, the control rod; 101, the installation cavity; 102, the installation port; 210, the through hole; 500, the potting space; 600, the circuit board foot assembly; 610, the support part; 611, the outer layer pin; 612, the inner layer pin; 613, the bolt; 620, the limiting part; 103, the first screw hole; 411, the first thread; 121, the sliding groove; 301, the convex part; 302, the limiting column; 611a, the second screw hole; 211, the internal thread; 212, the adjusting rod; 122, the sealing ring. DETAILED DESCRIPTION

[0059] In order to make the purpose, technical scheme and advantages of the present application more clear, the present application is further described in detail below in combination with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and not to limit the present application.

[0060] Embodiment one

[0061] Referring to the drawings Figure 1 and the drawings Figure 2 , a circuit board potting mold, comprising:

[0062] The shell 100, the upper cover plate 200, at least one blocking block 300 and at least one adjusting assembly 400, wherein:

[0063] The shell 100 is arranged in a rectangular shape and has an installation cavity 101 inside. The top of the shell 100 is provided with a rectangular installation port 102 that communicates with the installation cavity 101. The upper cover plate 200 can be fixed to the side wall of the installation port 102 by screws to close the installation port 102, or a clamping hole can be provided in the side wall of the installation port 102, and the upper cover plate is connected with a clamping column that is clamped and matched with the clamping hole to realize the closure of the installation port 102 by the upper cover plate 200. There are various fixing methods, which are not described here.

[0064] The upper cover plate 200 is provided with a plurality of through holes 210, and each through hole 210 communicates with the installation cavity 101. In this embodiment, the through holes 210 are arrayed on the upper cover plate 200. In addition, the through holes can also be relatively densely arranged in the middle part of the upper cover plate 200, or relatively densely arranged on both sides of the upper cover plate 200. The specific arrangement method is determined according to the actual glue injection requirement, which is not limited here.

[0065] Referring to the drawings Figure 2The lower cover plate 120 is provided with a sliding groove 121, and the bottom of the at least one blocking block 300 is provided with a protruding portion 301 which is in sliding cooperation with the sliding groove 121. The protruding portion 301 is slidingly arranged in the sliding groove 121, so as to further limit the sliding track of the blocking block 300 and make the sliding process of the blocking block 300 more stable.

[0066] Referring to the drawings Figure 2 In one embodiment, the shell 100 comprises a shell body 110 and a lower cover plate 120. The shell body 110 is provided with a connecting port at one end away from the upper cover plate 200. The lower cover plate 120 is connected with the side wall of the connecting port and closes the connecting port. The sliding groove 121 is arranged on the lower cover plate 120.

[0067] By arranging the detachable lower cover plate 120, the efficiency of demolding is improved, and the cleaning and maintenance of the mold in the later stage are facilitated.

[0068] Referring to the drawings Figure 2 In one embodiment, the lower cover plate 120 is circumferentially sleeved with a sealing ring 122. When the lower cover plate 120 is fixed to the side wall of the connecting port, the sealing ring 122 helps to reduce the loss of the potting glue to the outside of the mounting cavity 101, and ensures the quality after the glue is sealed.

[0069] Referring to the drawings Figure 2 The at least one blocking block 300 is slidingly arranged in the mounting cavity 101, and the outer side edges of the blocking block 300 abut against the side wall of the mounting cavity 101 and the upper cover plate 200, respectively. The blocking block 300, the upper cover plate 200 and the side wall of the mounting cavity 101 form a potting space 500, and / or the two oppositely arranged blocking blocks 300 and the upper cover plate 200 and the side wall of the mounting cavity 101 form the potting space 500.

[0070] Referring to the drawings Figure 2 Each adjusting assembly 400 is connected with a blocking block 300, and the adjusting assembly 400 is used to drive the blocking block 300 to slide in the mounting cavity 101. The side wall of the side of the potting space 500 away from the upper cover plate 200 is provided with at least two circuit board foot assemblies 600.

[0071] Referring to the drawings Figure 2 Specifically, in the embodiment, the number of the blocking blocks 300 is two, and the bottom of each of the two blocking blocks 300 is integrally formed with a protruding portion 301 which is in sliding cooperation with the sliding groove 121. The number of the sliding grooves 121 is two, and correspondingly, the number of the protruding portions 301 on the bottom of the blocking block 300 is also two. In other possible embodiments, the number of the sliding grooves 121 can also be two, three or five. The plurality of sliding grooves 121 are arranged in parallel with each other, and the number of the sliding grooves 121 is not limited here.

[0072] Referring to the drawings Figure 2The number of the adjusting assembly 400 is two, each adjusting assembly 400 comprises a control rod 410 rotatably connected with the blocking block 300, the shell 100 is provided with a first screw hole 103, the control rod 410 is provided with a first thread 411 threadedly matched with the first screw hole 103, the end of the control rod 410 away from the blocking block 300 at least partially penetrates out of the first screw hole 103 and is exposed to the mounting cavity 101, and the rotation axis of the control rod 410 is parallel to the sliding direction of the blocking block 300 in the mounting cavity 101.

[0073] When the blocking block 300 is adjusted, the control rod 410 is rotatably connected with the blocking block 300, so that the control rod 410 can be driven to rotate by an external force, when the control rod 410 rotates, the control rod 410 moves in a straight line in the first screw hole 103, thereby pushing the blocking block 300 to slide in the mounting cavity 101.

[0074] Referring to the accompanying drawings Figure 3 In the embodiment, the space formed between the two blocking blocks 300, the upper cover plate 200 and the side wall of the mounting cavity 101 is taken as the pouring space 500, and four circuit board supporting leg assemblies 600 are slidingly arranged in the pouring space 500.

[0075] Referring to the accompanying drawings Figure 3 The circuit board supporting leg assembly 600 comprises an integrally formed supporting part 610 and a limiting part 620, the supporting part 610 is slidingly arranged in the sliding groove 121, the limiting part 620 is provided in an "L" shape in cross section, and the four limiting parts 620 are respectively used for abutting to the four corners of the rectangular circuit board to limit the displacement of the circuit board. The supporting part 610 comprises a bottom part slidingly arranged in the sliding groove 121 and an adjusting part vertically fixed to the bottom part, the limiting part 620 is connected with the bottom part, the adjusting part is used for supporting the circuit board, and the height of the adjusting part is adjustable, so that the height of the adjusting part is adjusted to meet the thickness requirement of the bottom glue of different circuit boards.

[0076] Referring to the accompanying drawings Figure 2 Further, the adjusting part comprises an outer pin 611, an inner pin 612 and a knob 613, the outer pin 611 is provided with a sliding hole, the sliding hole is provided in a direction perpendicular to the lower cover plate 120, the inner pin 612 is slidingly arranged in the sliding hole, the side surface of the outer pin 611 is provided with a second screw hole 611a, the second screw hole 611a is communicated with the sliding hole, the knob 613 is provided with an outer thread, the knob 613 is screwed with the side wall of the second screw hole 611a, and the end of the knob 613 movably abuts to the inner pin 612.

[0077] When the thickness of the bottom sealant needs to be adjusted, the bolt 613 is loosened to adjust the height of the inner layer pin 612 exposed to the outer layer pin 611, so that the distance between the circuit board placed on the top of the inner layer pin 612 and the lower cover plate 120 changes, thereby meeting the bottom sealant requirements of different circuit boards.

[0078] In another possible embodiment, the inner wall of the outer layer pin 611 can also be provided with a third thread, and the surface of the inner layer pin 612 is provided with a fourth thread matched with the second thread. The height of the inner layer pin 612 exposed to the outer layer pin 611 is adjusted by screwing the inner layer pin 612, so that the height of the bottom of the circuit board changes, thereby meeting the thickness requirements of the bottom sealant of different circuit boards.

[0079] Referring to the drawings Figure 3 and the drawings Figure 2 To further avoid the displacement of the circuit board foot assembly 600 under the action of the flowing sealant during the sealant process, and to avoid the circuit board from being offset or falling during the process, two limiting columns 302 are fixed on each of the two blocking blocks 300. One end of the limiting column 302 is screwed with the blocking block 300, and the other end is used to abut against the limiting portion 620 to block the movement of the circuit board foot assembly 600 away from the circuit board, thereby ensuring the quality of the sealant.

[0080] In addition, the limiting column 302 also increases the gap between the circuit board and the blocking block 300, making it easier for the sealant to flow into the bottom of the circuit board from the gap, thereby improving the efficiency of the sealant.

[0081] Referring to the drawings Figure 4 and the drawings Figure 4 Further, the side wall of the through hole 210 away from the mounting cavity 101 is provided with an inner thread 211, and the surface of the side wall close to the mounting cavity 101 is smooth. An adjusting rod 212 is arranged in the through hole 210. The upper part of the adjusting rod 212 is provided with a second thread matched with the inner thread 211, and the lower part of the adjusting rod 212 is smooth. The end of the smooth part of the adjusting rod 212 is provided with a circular arc transition. One end of the adjusting rod 212 is used to pass out from the side of the upper cover plate 200 facing the pouring space 500, so that a recess space is formed on the demolded pouring glue body. The recess space is a reserved expansion space of the glue body.

[0082] After the adjusting rod 212 is adjusted, it will protrude from the inner wall of the upper cover plate 200, and finally a recess will appear on the sealed pouring glue body. The recess is a reserved expansion space. When the circuit board works in a high-temperature environment underground, the pouring glue expands under heat, and the expanded part enters the reserved expansion space, thereby reducing the mechanical stress on the components. Reserving the expansion space in advance can reduce the longitudinal stress on the components, and the grid-shaped reserved expansion space can also reduce the transverse stress on the components.

[0083] Adjusting the adjusting rod up and down can adapt to different height components, and upward adjustment can avoid conflict with higher components, and adapt to different circuit boards; downward adjustment can reserve enough space for the expansion of the gel for lower components. Finally, the reserved expansion space area of the gel is realized to be adjustable, and the mechanical stress generated after the expansion of the gel is maximized.

[0084] In one embodiment, a plurality of sliding grooves 121 can be formed on the bottom of the lower cover plate 120, for example, three sliding grooves 121 are formed, and a protrusion is formed between the sliding grooves 121, which can provide a bottom reserved expansion space for the bottom of the circuit board. By reserving expansion space above and below the circuit board, the damage rate of the circuit board is further reduced.

[0085] Referring to the drawings Figure 5 In addition, by setting the end of the adjusting rod 212 close to the circuit board as a circular arc transition, the stress generated by the expansion of the potting gel to the abutment with the end of the adjusting rod 212 on the components of the circuit board can be further dispersed, which helps to protect the components from being damaged.

[0086] By setting the through hole 210 as a structure with threads in the upper half and smooth in the lower half, the expanded potting gel can enter the smooth part of the through hole 210, so that it is easier to demold after the potting gel solidifies.

[0087] In order to better understand the whole structure of the present embodiment, the use of the potting mold is described as follows:

[0088] Step 1. Adjust the length of the potting glue and place the circuit board.

[0089] First, roughly adjust the four circuit board foot assemblies 600, and then place the circuit board on the circuit board foot assembly 600, and then finely adjust the four circuit board foot assemblies 600, so that the four limiting portions 620 abut the four top corner edges of the circuit board, respectively, that is, the length adjustment of the potting space 500 is completed.

[0090] Adjusting the circuit board foot assembly 600 can push the blocking block 300 to slide by rotating the control rod 410, and then push the four circuit board foot assemblies 600 to slide by the blocking block 300.

[0091] Step 2. Adjust the thickness of the top and bottom potting glue of the circuit board.

[0092] This step is to adjust the distance between the bottom of the circuit board and the lower cover plate 120, which is realized by adjusting the height of the inner layer pin 612. When adjusting, according to the thickness requirement of the potting glue, adjust the four inner layer pins 612 to the same height in turn.

[0093] Step 3. Adjust the expansion space.

[0094] Step 301, divide the different purposes of glue injection holes 210.

[0095] In the device of the present application, the glue injection holes 210 have multiple purposes, not only for glue injection, but also for exhaust holes and adjustment holes for adjusting the reserved expansion space. By default, each glue injection hole 210 is provided with an adjustment rod 212, which is adjusted according to the divided situation.

[0096] The method of dividing the glue injection holes 210 is as follows:

[0097] The glue injection holes 210 in contact with the glue body part of the upper cover plate 200 are used as effective holes, and the incomplete glue injection holes 210 in contact with the glue body part are divided into auxiliary holes. The auxiliary holes with a contact area greater than half are used as exhaust holes, and the adjustment rod 212 needs to be screwed out; the adjustment rod 212 in the auxiliary hole with a contact area greater than half can not be adjusted because it is at the edge of the glue block, and the circuit board is not distributed or the components are less distributed, so there is no need to reserve the expansion space, so the adjustment rod 212 in the auxiliary hole can not be adjusted.

[0098] The two complete glue injection holes 210 closest to the two sealing blocks 300 in the remaining effective holes are used for glue injection, and the remaining glue injection holes 210 are divided into adjustment holes, and the adjustment rod 212 in the adjustment hole needs to be adjusted according to the height of the circuit board components.

[0099] Step 302. Adjust the depth of the adjustment rod 212 inserted into the adjustment hole:

[0100] The components of the circuit board usually have different heights, and the adjustment rod 212 is adjusted according to different components. The adjustment rod 212 corresponding to the higher components is more prominent than the adjustment rod 212 corresponding to the lower components.

[0101] Step 4. Inject glue into the divided glue injection holes 210.

[0102] When injecting glue, manual or machine injection can be used to inject glue at a stable injection speed to ensure stable gas flow during injection and ensure the uniformity of the injection.

[0103] Step 5. Demolding.

[0104] When demolding, the upper cover plate 200 and the lower cover plate 120 can be detached, and then the sealed circuit board can be pushed out of the shell body 110.

[0105] The implementation principle of the present embodiment is as follows:

[0106] The adjusting rod 212 is adjusted to protrude from the inner wall of the upper cover plate 200, and finally a recess is formed on the sealed glue block, and the recess is the reserved expansion space. When the circuit board works in a high-temperature environment underground, the potting glue expands under heat, and the expansion part enters the reserved expansion space, thereby reducing the mechanical stress on the components. Reserving the expansion space in advance can reduce the longitudinal stress on the components, and the grid-shaped reserved expansion space can also reduce the transverse stress on the components.

[0107] The adjusting rod 212 can be adjusted up and down to adapt to components of different heights, and upward adjustment can avoid collision with higher components and adapt to different circuit boards; downward adjustment can reserve sufficient glue expansion space for shorter components. Finally, the regionization of the glue reserved expansion space can be adjusted, and the mechanical stress generated after the glue expands can be maximized. Thus, the problem that the circuit board may be subjected to mechanical stress and easily damaged when the potting glue of different expansion coefficients is replaced in the prior art is improved.

[0108] When the glue is poured, the circuit board to be poured with glue is first installed on the circuit board foot pad assembly 600, and then the adjusting assembly 400 is adjusted to drive the two blocking blocks 300 to slide, so that the distance between the two blocking blocks 300 matches the length of the circuit board, so that the adjusted potting space 500 meets the potting standard of the circuit board; next, the upper cover plate 200 is installed at the mounting port 102, and the potting glue is injected into the potting space 500 through the through hole 210, and the potting glue gradually covers the circuit board, thereby completing the potting process. The present application sets the blocking block 300 to surround the matching potting space 500 for circuit boards of different sizes, so that the potting mold can pot glue for various circuit boards, improve the utilization rate of the potting mold, and improve the problem that the mold must be re-made when the length of the circuit board changes in the prior art, which easily causes waste of resources and time.

[0109] Embodiment Two

[0110] In this embodiment, the structure of the potting mold is different from that of embodiment one in that one of the two blocking blocks is fixedly arranged, the other is slidably arranged, and only the blocking block arranged to slide is connected with the adjusting assembly. When adjusting the potting space, only the blocking block on one side needs to be adjusted, and the adjustment is simpler.

[0111] Embodiment Three

[0112] In this embodiment, the structure of the potting mold is different from that of embodiment one in that only one blocking block and one adjusting assembly are arranged, and the remaining structures are similar.

[0113] When potting glue, the adjustment assembly is adjusted to drive the blocking blocks to move, so that the side of the blocking blocks away from the adjustment rod forms a potting space with the inner wall of the upper cover plate and the shell, and the circuit board in the potting space is injected with glue.

[0114] The specific glue injection method and the bottom glue thickness adjustment manner are similar to those of the first embodiment, and details are not described here to avoid repetition.

[0115] The structure of the embodiment is more simplified than that of the first embodiment, which helps to further reduce the cost.

[0116] Embodiment four

[0117] In the embodiment, the structure of the potting mold is different from that of the first embodiment, the structure of the adjustment assembly is different, and two potting spaces are provided, and a circuit board foot assembly is arranged in each potting space. The rest of the structure is similar.

[0118] Specifically, two through grooves are formed on the surface of the upper cover plate in the sliding direction of the blocking blocks, and the top of each of the two blocking blocks is integrally formed with a sliding part, the sliding part is arranged in the through groove and protrudes from the upper cover body, and the sliding part and the through groove are in sliding cooperation.

[0119] The side of the two blocking blocks away from each other forms a potting space with the inner wall of the shell and the upper cover body, respectively, which are the first potting space and the second potting space.

[0120] Four circuit board foot assemblies are slidably arranged in the first potting space for placing and potting the first circuit board; four circuit board foot assemblies are also slidably arranged in the second potting space for placing and potting the second circuit board.

[0121] When adjusting the potting space, the part of the sliding part protruding from the upper cover body is actuated to drive the blocking blocks to move, so that the length of the first potting space and the second potting space can be adjusted.

[0122] The glue injection method and the bottom glue thickness adjustment manner of the first potting space and the second potting space are similar to those of the first embodiment, and details are not described here to avoid repetition.

[0123] The structure of the embodiment can simultaneously perform batch potting treatment on multiple circuit boards of different or same sizes, further increasing the practicability of the potting mold and improving the efficiency of the potting treatment.

[0124] The technical features of the above embodiments can be combined arbitrarily, and to make the description concise, not all possible combinations of the technical features in the above embodiments are described, however, as long as the combinations of the technical features do not exist contradictory, it should be considered as the scope of the present application.

[0125] Embodiment 5, refer to the attached drawings Figure 6 The present embodiment provides a circuit board potting method, comprising steps 510-550.

[0126] Step 510, provide a housing, an upper cover plate, at least one sealing block and at least one adjusting assembly.

[0127] In the present embodiment, a mounting cavity is arranged between the housing and the upper cover plate, the upper cover plate is provided with a plurality of through holes communicating with the mounting cavity, the at least one sealing block is slidingly arranged in the mounting cavity, the outer side edges of the sealing block abut against the side walls of the mounting cavity and the upper cover plate, respectively, a potting space is formed between the sealing block, the upper cover plate and the side walls of the mounting cavity, and / or a potting space is formed between the two oppositely arranged sealing blocks and the upper cover plate and the side walls of the mounting cavity, each adjusting assembly is connected with a sealing block, and the adjusting assembly is used to drive the sealing block to slide in the mounting cavity.

[0128] The specific structure of the housing and the structure of the adjusting assembly are similar to those in the above-mentioned embodiment 1, and details are not repeated here.

[0129] Step 520, fix the circuit board to be sealed with glue in the potting space through a circuit board foot assembly, and the height of the circuit board foot assembly is adjustable.

[0130] Step 530, adjust the size of the potting space through the adjusting assembly, and adjust the bottom height of the circuit board through the circuit board foot assembly.

[0131] In the present embodiment, the structure of the circuit board foot assembly in steps 220-230 and the height adjusting mode are similar to those in embodiment 1, and details are not repeated here.

[0132] Step 540, determine the expansion space of the top of the circuit board according to the spacing between the top of the circuit board and the bottom surface of the upper cover plate, and the expansion space is used to reduce the mechanical stress generated by the expansion of the potting glue on the components of the circuit board.

[0133] Refer to the attached drawings Figure 7 Specifically, the specific steps of reserving the expansion space for the circuit board according to the spacing between the top of the circuit board and the bottom surface of the upper cover plate comprise steps 541-545.

[0134] Step 541, divide the part of the upper cover plate in contact with the potting space into a plurality of grids.

[0135] Refer to the attached drawings Figure 7 When dividing the grids, the part of the upper cover plate in contact with the mounting cavity can be uniformly divided, and the area of each grid is S. The through holes of the part not in contact with the potting space can not be processed.

[0136] Step 542, the through holes in the plurality of grids are divided into glue injection holes, exhaust holes and adjusting holes.

[0137] Referring to the drawings ​ The exhaust holes can be through holes that are not completely communicated with the potting space, the number of glue injection holes can be two, which are respectively located at opposite side edges of the upper cover plate, and the remaining through holes communicated with the potting space are adjusting holes, an adjusting rod is movably arranged in the adjusting hole, and an end of the adjusting rod and a side wall of the glue injection hole form an adjustable expansion space for expansion of the potting glue.

[0138] The structure and cooperation mode of the through hole and the adjusting rod are similar to those of the above-mentioned embodiment 1, and will not be described here.

[0139] Step 543, the space volume between the upper cover plate and the components of the circuit board in each adjusting hole corresponding grid is calculated.

[0140] In this embodiment, the way to calculate the space volume can be to uniformly divide a single grid into n sub-grids, and each sub-grid is taken as a scanning point, and the scanning depth of each scanning point, i.e. the distance from the bottom surface of the upper cover plate to the top surface of each component of the circuit board, is obtained by the depth scanning device.

[0141] The scanning depth of the i-th scanning point is defined as hi (i = 1, 2, 3, …, n), and the space volume V of the adjusting grid can be obtained.

[0142]

[0143] Through the above-mentioned way, when the components are large and the surface is uneven, the larger the value of n is set, the more accurate the space volume V of the adjusting grid obtained is.

[0144] Step 544, the expansion space value in each adjusting hole is calculated according to the space volume.

[0145] In addition to knowing the space volume, the expansion space value also needs to be calculated in combination with the model of the potting glue used and the temperature resistance upper limit of the circuit board.

[0146] For example, the expansion coefficient e of the glue, the highest working temperature tm of the circuit, and the expansion space of the glue reserved according to the expansion amount of the glue when the circuit board is at the temperature resistance upper limit, then the reserved expansion space of the glue Ve = f (e, tm, V).

[0147] Further, after obtaining the value of the expansion space Ve, the expansion space Ve can be further corrected.

[0148] When the cylindrical device is deeply scanned, it is equivalent to several rectangular parallelopipeds and sets close to the surface of the circuit board, but in fact, the bottom of the cylindrical device is not all close to the circuit board, so the space correction is needed for the cylindrical device such as the straight-in type resistance and capacitance, so as to accurately estimate the space volume, determine the glue filling amount and the reserved space, and reduce the mechanical stress of the component.

[0149] For example, the diameter of the cylindrical device is r, and the length is L, so the correction amount of the cylindrical horizontal component is ΔV=(r 2 -πr 2 / 4)*L.

[0150] For another example, the bottom surface length of the square component is a, the width is b, and the distance from the circuit board is h, so the correction amount of the square component is ΔV=a*b*h.

[0151] The patch type does not need to be corrected because the height is low.

[0152] Through the above calculation, the correction amount ΔV is subtracted from the expansion space Ve corresponding to each grid, so as to further accurately estimate the space volume, determine the glue filling amount and the reserved space, and reduce the mechanical stress of the component.

[0153] Step 545, adjust the adjusting rod according to the expansion space value.

[0154] For example, when the component height is high, the calculated corrected expansion space Ve value is small, and the corrected expansion space Ve value is converted into the adjusting height of the adjusting rod, and the adjusting rod is adjusted to expose the adjusting hole to the target adjusting height.

[0155] When the component height is low, the calculated corrected expansion space Ve value is large, and the corrected expansion space Ve value is converted into the adjusting height of the adjusting rod, and the adjusting rod is adjusted to be more inserted into the adjusting hole to the target adjusting height.

[0156] Step 550, inject glue into the encapsulation space through the through hole.

[0157] When injecting glue, manual injection or machine injection can be used to inject glue at a stable injection speed, so as to ensure stable gas flow during injection and ensure the uniformity of injection.

[0158] When demolding, the upper cover plate and the lower cover plate can be respectively disassembled, and then the encapsulated circuit board can be taken out from the shell body.

[0159] The above-described embodiments are merely illustrative of several embodiments of the present application, which are described in more detail and in a specific and detailed manner, but should not be construed as limiting the scope of the patent. It should be noted that for those skilled in the art, several modifications and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application should be subject to the appended claims.

Claims

1. A circuit board potting mold, characterized in that, include: The housing and the top cover plate are provided. The housing has an installation cavity, and one side of the housing has an installation port that communicates with the installation cavity. The top cover plate is connected to the side wall of the installation port and closes the installation port. The top cover plate has multiple through holes, each of which communicates with the installation cavity. A potting space is formed between the side wall of the installation cavity and the top cover plate. The upper cover plate has multiple through holes, each of which communicates with the mounting cavity. The side wall of each through hole away from the mounting cavity is provided with an internal thread. An adjusting rod is provided in the through hole. The upper part of the adjusting rod is provided with a second thread that matches the internal thread. One end of the adjusting rod is used to pass through the side of the upper cover plate facing the potting space, so that a recessed space is formed on the potting colloid after demolding. The recessed space is a reserved expansion space for the colloid.

2. The circuit board potting mold according to claim 1, characterized in that, Also includes: At least one plugging block and at least one regulating component; At least one of the sealing blocks is slidably disposed within the mounting cavity, with the outer edges of the sealing blocks abutting against the sidewall of the mounting cavity and the upper cover plate, respectively. The sealing space is formed between the sealing blocks, the upper cover plate, and the sidewall of the mounting cavity, and / or the sealing space is formed between two oppositely disposed sealing blocks and the upper cover plate and the sidewall of the mounting cavity. Each of the adjustment components is connected to one of the sealing blocks, and the adjustment component is used to drive the sealing block to slide within the mounting cavity; At least two circuit board foot assemblies are provided on the side wall of the potting space away from the top cover plate.

3. The circuit board potting mold according to claim 2, characterized in that, The adjustment assembly includes a control rod with one end rotatably connected to the sealing block. The housing has a first screw hole, and the control rod has a first thread that engages with the first screw hole. At least one end of the control rod away from the sealing block extends out of the first screw hole and is exposed in the mounting cavity. The axis of rotation of the control rod is parallel to the sliding direction of the sealing block in the mounting cavity.

4. The circuit board potting mold according to claim 2, characterized in that, A groove is provided on the side wall of the filling space away from the upper cover plate, and at least one of the sealing blocks has a protrusion at the bottom that slides and cooperates with the groove, and the protrusion is slidably disposed in the groove.

5. The circuit board potting mold according to any one of claims 4, characterized in that, The circuit board foot assembly includes a support portion slidably disposed on the side wall of the mounting cavity away from the upper cover plate for supporting the circuit board, and a limiting portion connected to the support portion for abutting the edge of the circuit board.

6. The circuit board potting mold according to claim 5, characterized in that, The support includes a bottom component slidably disposed in the groove, and an adjusting member disposed on the bottom component. The limiting part is connected to the bottom component, and the adjusting member is used to support the circuit board. The height of the adjusting member is adjustable.

7. The circuit board potting mold according to claim 6, characterized in that, The adjusting component includes an outer pin, an inner pin, and a knob. The outer pin is connected to the bottom component and has a sliding hole. The sliding hole is perpendicular to the side wall of the potting space away from the top cover plate. The inner pin is slidably disposed in the sliding hole and is used to support the circuit board. The outer pin has a second screw hole on its side, which communicates with the sliding hole. The knob has an external thread and is screwed to the side wall of the second screw hole. The end of the knob moves against the inner pin.

8. A circuit board potting method, characterized in that, include: The system provides a housing, a top cover, at least one sealing block, and at least one adjusting assembly. An installation cavity is provided between the housing and the top cover. The top cover has multiple through holes communicating with the installation cavity. At least one sealing block is slidably disposed within the installation cavity. The outer edges of the sealing block abut against the sidewall of the installation cavity and the top cover. A filling space is formed between the sealing block, the top cover, and the sidewall of the installation cavity, and / or between two opposing sealing blocks and the top cover and the sidewall of the installation cavity. Each adjusting assembly is connected to one sealing block, and the adjusting assembly is used to drive the sealing block to slide within the installation cavity. The circuit board to be encapsulated is fixed in the potting space by the circuit board foot assembly, the height of which is adjustable; The size of the potting space is adjusted by the adjustment component, and the bottom height of the circuit board is adjusted by the circuit board foot assembly; The expansion space at the top of the circuit board is determined based on the distance between the top of the circuit board and the upper cover plate. The expansion space is used to reduce the mechanical stress on the components of the circuit board after the potting compound expands. Adhesive is injected into the potting space through the through-hole.

9. A circuit board potting method according to claim 8, characterized in that, The step of determining the expansion space at the top of the circuit board based on the distance between the circuit board and the upper cover plate includes: The portion of the upper cover plate that contacts the filling space is divided into multiple grids; The through holes within the multiple grids are divided into injection holes, venting holes, and adjustment holes. The venting holes are through holes that are not fully connected to the potting space. There are two injection holes, located on opposite sides of the upper cover plate. The remaining through holes that are connected to the potting space are the adjustment holes. An adjustment rod is movably installed in the adjustment hole. One end of the adjustment rod is used to pass through the side of the upper cover plate facing the potting space, so that a recessed space is formed on the potting colloid after demolding. The recessed space is a reserved expansion space for the colloid. Calculate the spatial volume between the lower cover plate and the components of the circuit board within the grid corresponding to each adjustment hole; Calculate the expansion space value within each of the adjustment holes based on the space volume; Adjust the adjusting rod according to the expansion space value.

10. A circuit board potting method according to claim 9, characterized in that, The method further includes: The expansion space value corresponding to the target component within the grid is corrected. The target component includes cylindrical components and square components.

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