PCB pressing method and PCB pressing device

Abstract

This invention discloses a PCB board lamination method and PCB board lamination equipment. The lamination method includes: S1: Sequentially placing a second sheet and a third sheet on a first sheet, with a first prepreg placed between the first and second sheets and between the second and third sheets; hot-pressing the first, second, and third sheets to form a symmetrical portion; S2: Placing a fourth sheet on one side of the symmetrical portion and a symmetrical sheet on the other side, with a second prepreg placed between the fourth sheet and the symmetrical portion, and between the symmetrical sheet and the symmetrical portion; hot-pressing the fourth sheet, the symmetrical portion, and the symmetrical sheet to form a symmetrical laminated structure; S3: Separating the symmetrical sheets in the symmetrical laminated structure, leaving the finished board. This application can reduce the warpage of the finished PCB board and lower the PCB board production defect rate.

Description

Technical Field

[0001] This invention relates to the field of PCB manufacturing technology, and in particular to a PCB board lamination method and PCB board lamination equipment. Background Technology

[0002] When manufacturing PCBs with four or more layers of asymmetric stacked structure, the PCBs need to be subjected to multiple high-temperature pressing processes. During pressing, the shrinkage of the prepreg can cause the PCB to warp and deform to one side. When the PCB warps severely, it can easily cause equipment jamming and damage during the manufacturing process, seriously affecting normal production. Therefore, there is an urgent need for a manufacturing method and equipment that can reduce the warping phenomenon in the production of asymmetric stacked PCBs. Summary of the Invention

[0003] The purpose of this invention is to provide a PCB board lamination method and PCB board lamination equipment to solve one or more technical problems existing in the prior art, and at least provide a beneficial option or create conditions.

[0004] The solution to the technical problem of this invention is:

[0005] S1: A second sheet and a third sheet are sequentially arranged above a first sheet. A first semi-cured sheet is arranged between the first sheet and the second sheet, and between the second sheet and the third sheet. The first sheet, the second sheet and the third sheet are hot-pressed with the second sheet as the center of symmetry. The first sheet, the second sheet and the third sheet are formed into a symmetrical part after hot pressing.

[0006] S2: An overlay layer is provided on one side of the symmetrical portion, the overlay layer including a fourth sheet, and a dummy layer is provided on the other side, the dummy layer including a symmetrical sheet, a second semi-cured sheet is provided between the fourth sheet and the symmetrical portion, and a second semi-cured sheet is provided between the symmetrical sheet and the symmetrical portion, and the overlay layer, the symmetrical portion and the dummy layer are hot-pressed to form a symmetrical laminated structure;

[0007] S3: Separate the dummy layer in the symmetrical stacked structure, and the remaining part is the finished board.

[0008] The technical solution has at least the following beneficial effects: In S1, when the first sheet, the second sheet and the third sheet are hot-pressed, the first semi-cured sheet between the first sheet and the second sheet is deformed by heat, and the first semi-cured sheet between the second sheet and the third sheet is deformed by heat. While the first sheet, the second sheet and the third sheet are bonded and fixed, the two first semi-cured sheets deform symmetrically with the second sheet as the center of symmetry. The two first semi-cured sheets generate bending moments of similar magnitude and opposite direction. The two bending moments cancel each other out, thereby greatly reducing the resultant moment on the entire symmetrical part itself, and thus reducing the degree of warping of the symmetrical part under the action of the resultant moment.

[0009] Meanwhile, the required second semi-cured sheet and fourth sheet are further superimposed on the symmetrical part, and the second semi-cured sheet and symmetrical sheet are placed on the other side of the symmetrical part away from the fourth sheet. During hot pressing, the second semi-cured sheets on both sides also generate torques of similar magnitude but opposite direction. The two cancel each other out, greatly reducing the resultant torque on the finished board formed by the combination of the symmetrical part and the fourth sheet, thereby reducing the degree of warping of the finished board.

[0010] In addition, the PCB board in this application needs to be laminated multiple times. Even if there is warping after the first lamination, if it is not controlled, a new unbalanced torque will be added when the sheets are stacked again for hot pressing. Therefore, by setting symmetrical sheets, it is equivalent to re-establishing a symmetrical environment each time hot pressing, so that the warping of the finished board after each lamination can be effectively controlled. In this way, the accumulation of warping can be effectively reduced and the yield of the finished board can be improved.

[0011] As a further improvement to the above technical solution, the superimposed layer includes a plurality of fourth sheets, the dummy layer includes a plurality of symmetrical sheets, and the method of S2 further includes: sequentially setting the second semi-cured sheet and the fourth sheet on one side of the symmetrical portion, sequentially setting the second semi-cured sheet and the symmetrical sheet on the other side of the symmetrical portion, and performing hot pressing, repeating the above actions until a symmetrical stacked structure with a predetermined number of layers is obtained.

[0012] As a further improvement to the above technical solution, a resist film is provided between the first sheet and the symmetrical sheet. The specific method of S2 further includes: providing a third semi-cured sheet between the second semi-cured sheet and the first sheet, opening an installation channel on the third semi-cured sheet, installing the resist film in the installation channel, with one side of the resist film abutting against the first sheet and the other side abutting against the symmetrical sheet.

[0013] As a further improvement to the above technical solution, the method between S2 and S3 further includes: screwing the symmetrical stacked structure, wherein the projection of the screwing path on the horizontal plane is located within the projection of the adhesive resist film on the same plane.

[0014] Secondly, this application provides a PCB board laminating apparatus, which is applied in a PCB board laminating method as provided in the first aspect, comprising:

[0015] frame;

[0016] The clamping mechanism is provided on both sides of the frame along the vertical direction. Each clamping mechanism has a clamping end. The two clamping ends can move in the vertical direction in a direction away from or close to each other, and a clamping space is formed between the two clamping ends.

[0017] The pressing mechanism is provided on both sides of the frame along the left-right direction. Each pressing mechanism includes a mounting frame, a telescopic platform, a hinge frame, and a pair of hot press rollers. The mounting frame is installed on the frame and located on the side of the clamping mechanism along the left-right direction. The telescopic platform can move and be positioned on the mounting frame along a direction parallel to the left-right direction, moving towards or away from the clamping space. The telescopic platform can move into or out of the clamping space. The hinge frame includes a pair of first forks and a pair of second forks. The two first forks are respectively installed on both sides of the telescopic platform along the front-back direction, and the two second forks are respectively installed on... On both sides of the telescopic platform along the front-rear direction, the first fork arm and the second fork arm on the same side of the front-rear direction intersect and are hinged to each other. The ends of the first fork arm and the second fork arm on the same side away from the clamping space are both installed on the telescopic platform and can move and be positioned in the vertical direction toward or away from each other. The ends of the two first fork arms near the clamping space are respectively connected to the two ends of one of the hot press rollers, and the ends of the two second fork arms near the clamping space are respectively connected to the two ends of the other hot press roller. A pressing space is formed between the two hot press rollers of the same pressing mechanism.

[0018] This technical solution has at least the following beneficial effects: In this application, the clamping space is used to clamp the plate to be pressed. The plate to be pressed can be a symmetrical part or a symmetrically stacked structure. When pressing the plate to be pressed, the clamping mechanism is first moved to expand the clamping space, and then the stacked plates to be pressed are placed in the clamping space, and the clamping ends are moved back towards each other to reduce the clamping space and clamp the plate to be pressed. Subsequently, the ends of the first fork and the second fork on each pressing mechanism that are away from the clamping space move away from each other, and the ends of the first fork and the second fork that are close to the clamping space move towards each other, driving the hot pressure rollers on a pair of first fork arms and a pair of second fork arms to move towards each other until another hot pressure roller on the same pressing mechanism, thereby clamping the plate to be pressed in the clamping space and starting heating. Then the extension of the two pressing mechanisms The telescopic platforms move away from each other, and the hot press rollers simultaneously heat and flatten the board to be pressed during the clamping process, ensuring uniform heating throughout the board. This results in uniform shrinkage deformation of the prepreg on both sides, reducing PCB warping caused by uneven prepreg deformation during single-sided pressing. Furthermore, the hot press rollers on the two synchronously moving telescopic platforms can level the board during movement, correcting any unevenness and reducing warping. The interlocking first and second forks provide stable support for the board, ensuring stable correction during the movement of the hot press rollers. In summary, this PCB pressing equipment achieves simultaneous heating of both sides of the board through movable hot press rollers, reducing board warping caused by prepreg deformation and inherent unevenness of the board itself.

[0019] As a further improvement to the above technical solution, the clamping mechanism includes a telescopic rod and a hot-pressing strip. The telescopic rod extends in the vertical axial direction. The hot-pressing strip in one of the clamping mechanisms is installed at one end of the telescopic rod near the other clamping mechanism. The end of the hot-pressing strip away from the telescopic rod is the clamping end.

[0020] As a further improvement to the above technical solution, the hot pressing strip includes a hot pressing part and a guide part. The guide part is provided on both sides of the hot pressing part in the left-right direction. Both the hot pressing part and the guide part extend in the front-back direction. The side of the guide part away from the hot pressing part gradually moves away from the hot pressing part in the direction from approaching to moving away from the other clamping mechanism. Each of the hot pressing rollers can move to abut against the side of the guide part away from the hot pressing part on that side. The hot pressing strip can move in the up-down direction on the telescopic rod.

[0021] As a further improvement to the above technical solution, the length of the hot pressing section in the left-right direction is no greater than the diameter of one of the hot pressing rollers.

[0022] As a further improvement to the above technical solution, the hot-pressing part is elastically connected to the telescopic rod.

[0023] As a further improvement to the above technical solution, the mounting frame is capable of rotating around the left and right axis. A gravity sensor and a controller are provided on the frame. The controller is used to control the rotation of the mounting frame. When the gravity sensor detects that the hot press roller is not in a horizontal state, the controller controls the mounting frame to rotate until the hot press roller is in a horizontal state. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly explained below. Obviously, the described drawings are only a part of the embodiments of the present invention, and not all of them. Those skilled in the art can obtain other design schemes and drawings based on these drawings without creative effort.

[0025] Figure 1 This is a schematic diagram of the symmetrical part in this invention;

[0026] Figure 2 This is a schematic diagram of the structure of the present invention when a fourth sheet and a symmetrical sheet are superimposed on the symmetrical part;

[0027] Figure 3 This is a schematic diagram of the structure of the present invention when multiple fourth sheets and multiple symmetrical sheets are superimposed on the symmetrical part;

[0028] Figure 4 This is a schematic diagram of the structure when the symmetrical layered structure is grooved in this invention;

[0029] Figure 5 This is a schematic diagram of the structure when the finished board is separated from multiple symmetrical sheets;

[0030] Figure 6 This is a schematic diagram of the overall structure of the pressing equipment in this invention;

[0031] Figure 7 This is a front view of the pressing device in the present invention from the perspective of the front-to-back direction;

[0032] Figure 8 This is a partial structural cross-sectional view of the end of the clamping mechanism in this invention. Detailed Implementation

[0033] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0034] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0035] In the description of this invention, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0036] In the description of this invention, unless otherwise explicitly defined, terms such as "set up," "install," and "connect" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this invention in conjunction with the specific content of the technical solution.

[0037] In a first aspect, this application provides a PCB board lamination method, which includes:

[0038] S1: Reference Figure 1 A second sheet 120 and a third sheet 130 are sequentially arranged above the first sheet 110. A first semi-cured sheet 140 is arranged between the first sheet 110 and the second sheet 120, and between the second sheet 120 and the third sheet 130. The first sheet 110, the second sheet 120 and the third sheet 130 are hot-pressed with the second sheet 120 as the center of symmetry. The first sheet 110, the second sheet 120 and the third sheet 130 are hot-pressed to form a symmetrical part 100.

[0039] S2: Reference Figures 2 to 4 An overlay layer is provided on one side of the symmetrical portion 100, the overlay layer including a fourth sheet 200, and a dummy layer is provided on the other side, the dummy layer including a symmetrical sheet 300. A second semi-cured sheet 400 is provided between the fourth sheet 200 and the symmetrical portion 100, and a second semi-cured sheet 400 is provided between the symmetrical sheet 300 and the symmetrical portion 100. The overlay layer, the symmetrical portion 100 and the dummy layer are hot-pressed to form a symmetrical laminated structure.

[0040] S3: Reference Figure 5 The false layers in the symmetrical stacked structure are separated, and the remaining part is the finished board.

[0041] As can be seen from the above, in S1, when the first sheet 110, the second sheet 120 and the third sheet 130 are hot-pressed, the first semi-cured sheet 140 between the first sheet 110 and the second sheet 120 is deformed by heat, and the first semi-cured sheet 140 between the second sheet 120 and the third sheet 130 is deformed by heat. While the first sheet 110, the second sheet 120 and the third sheet 130 are bonded and fixed, the two first semi-cured sheets 140 deform symmetrically with the second sheet 120 as the center of symmetry. The two first semi-cured sheets 140 generate bending moments of similar magnitude and opposite direction. The two bending moments cancel each other out, thereby greatly reducing the resultant moment on the entire symmetrical part 100 itself, and thus reducing the degree of warping of the symmetrical part 100 under the action of the resultant moment.

[0042] Simultaneously, the required second semi-cured sheet 400 and fourth sheet 200 are further superimposed on the symmetrical portion 100, and the second semi-cured sheet 400 and symmetrical sheet 300 are placed on the other side of the symmetrical portion 100 away from the fourth sheet 200. During hot pressing, with the symmetrical portion 100 as the second center of symmetry, the second semi-cured sheets 400 on both sides generate torques of similar magnitude but opposite directions. The two torques cancel each other out, greatly reducing the resultant torque on the finished board formed by the combination of the symmetrical portion 100 and the fourth sheet 200, thereby reducing the weight of the finished board. The degree of warpage is such that, when manufacturing a PCB board including four layers of copper foil, the second sheet 120 in the middle is used to form a center of symmetry to stack the symmetrical part 100, and then an additional symmetrical sheet 300 is added to achieve the stacking of the fourth sheet 200. That is, when stacking a four-layer PCB board, only one additional symmetrical sheet 300 needs to be added. There is no need to use the first sheet 110 as the center of symmetry and add the second sheet 120, the third sheet 130 and the two corresponding symmetrical sheets 300 in sequence, thereby reducing the consumption of raw materials.

[0043] In addition, the PCB board in this application needs to be laminated multiple times. Even if there is warping after the first lamination, if it is not controlled, a new unbalanced torque will be added when the sheets are stacked again for hot pressing. Therefore, by setting symmetrical sheets 300, it is equivalent to re-establishing a symmetrical environment each time hot pressing, so that the warping of the finished board after each lamination can be effectively controlled. In this way, the accumulation of warping can be effectively reduced and the yield of the finished board can be improved.

[0044] Furthermore, in this application, since the production is assisted by the addition of symmetrical sheets 300 and a second prepreg, the first sheet 110, the second sheet 120, the third sheet 130, the fourth sheet 200, the first prepreg 140, and the second prepreg 400 of the finished PCB board can all be customized according to requirements to adapt to the size of the customer's equipment without any changes.

[0045] In S1, the specific method for "sequentially arranging the second sheet 120 and the third sheet 130 above the first sheet 110" includes:

[0046] A metal module slot is formed on the first semi-cured sheet 140 between the first sheet 110 and the second sheet 120. The metal module is placed in the first semi-cured sheet 140 and connected to the first sheet 110 and the second sheet 120. Then, the first semi-cured sheet 140 and the third sheet 130 are placed on the second sheet 120 in sequence. In this way, each component can be processed separately before connecting the first sheet 110, the second sheet 120 and the third sheet 130.

[0047] In S1, the first sheet 110, the second sheet 120 and the third sheet 130 are hot-pressed from the top and bottom sides. By hot-pressing the top and bottom sides simultaneously, the first semi-cured sheet 140 on the top and bottom sides is heated to a similar degree, which makes their deformation and shrinkage similar. The resulting bending moments are closer, which reduces the magnitude of the resultant moment after mutual cancellation, and further reduces warping.

[0048] In S1, after the hot pressing of the symmetrical part 100 is completed, the specific pressing method also includes opening blind holes, filling copper in blind holes and etching pattern routes between the first sheet 110 and the second sheet 120 and / or between the third sheet 130 and the second sheet 120. Through this scheme, it is easy to open preset blind holes between the layers of the PCB board. As long as the hot pressing is completed, the blind holes can be opened smoothly in the PCB board.

[0049] In some embodiments, as shown in the figure, taking a six-layer PCB board as an example, the overlay layer includes a plurality of fourth sheets 200, the dummy layer includes a plurality of symmetrical sheets 300, and step S2 includes the following steps:

[0050] S21: A second pre-cured sheet 400 and a first fourth sheet 200 are placed sequentially above the symmetrical portion 100, and a second pre-cured sheet 400 and a first symmetrical sheet 300 are arranged sequentially below the symmetrical portion 100.

[0051] S22: A second pre-cured sheet 400 and a second fourth sheet 200 are sequentially arranged above the first fourth sheet 200, and a second pre-cured sheet 400 and a second symmetrical sheet 300 are sequentially placed below the first symmetrical sheet 300.

[0052] S23: Hot-press the symmetrical portion 100, the fourth sheet 200, and the symmetrical sheet 300 obtained in S21 or S22;

[0053] S24: Repeat the operation of stacking the fourth sheet 200 in S22 and the hot pressing operation in S23 until a six-layer PCB board is obtained.

[0054] As can be seen from the above, when manufacturing a six-layer PCB, by stacking multiple fourth sheets 200 on the upper side of the symmetrical part 100 to form a superimposed layer and stacking multiple symmetrical sheets 300 on the lower side of the symmetrical part 100 to form a dummy layer, the second semi-cured sheets 400 on both the upper and lower sides of the symmetrical part 100 generate torques of opposite directions and similar magnitudes after being heated and contracted during each hot pressing process. After the two torques on the upper and lower sides of the symmetrical part 100 cancel each other out, the resultant torque on the symmetrical stacked structure is greatly reduced, thereby reducing the degree of bending of each part of the symmetrical stacked structure.

[0055] In S23 and S24, the superimposed layer, the symmetrical part 100 and the dummy layer are hot-pressed from the top and bottom sides. By hot-pressing simultaneously from the top and bottom sides, the second semi-cured sheet 400 on the top and bottom sides is heated to a similar degree, so that their deformation and shrinkage are similar and the resulting bending moments are closer. This reduces the magnitude of the resultant moment after they cancel each other out, and further reduces warping.

[0056] As a further embodiment of the above embodiments, the number of first semi-cured sheets 140 between the first sheet 110 and the second sheet 120 and between the second sheet 120 and the third sheet 130 are equal and have the same thickness; the number of second semi-cured sheets 400 between the fourth sheet 200 and the symmetrical portion 100 and between the symmetrical portion 100 and the fourth sheet 200 are equal and have the same thickness.

[0057] By controlling the specifications of the first prepreg 140 and the second prepreg 400 and their quantities at various locations, the torques generated between the first prepreg 140 and the second prepreg 400 with the symmetry part 100 as the center of symmetry are made more numerically similar, thereby reducing PCB warpage better after they cancel each other out.

[0058] Reference Figure 3A resist film 500 is disposed between the first sheet 110 and the symmetrical sheet 300. The specific method of s2 includes: disposing of a third semi-cured sheet 600 between the second semi-cured sheet 400 and the first sheet 110; creating an installation channel on the third semi-cured sheet 600; and installing the resist film 500 in the installation channel, with one side of the resist film 500 abutting against the first sheet 110 and the other side abutting against the symmetrical sheet 300.

[0059] The method between S2 and S3 includes: spruing the symmetrical laminated structure, wherein the projection of the sprue cutting path on the horizontal plane is located within the projection of the resist film 500 on the same plane.

[0060] By adopting the above technical solution, because the second semi-cured sheet 400 does not contact the first sheet 110 at this location under the action of the resist film 500, after hot pressing, the second semi-cured sheet 400 will only be connected to the side of the resist film 500 away from the first sheet 110, while the third semi-cured sheet 600 will be connected to the first sheet 110 after being heated, thereby maintaining the connection between the second semi-cured sheet 400 and the first sheet 110. When the board is being rolled, the portion of the third semi-cured sheet 600 outside the resist film 500 is cut off. At this time, only the resist film 500 is set between the first sheet 110 and the second semi-cured sheet 400. The finished board can be directly removed to achieve its separation from multiple symmetrical sheets 300, reducing the difficulty of separation.

[0061] Furthermore, after the s3 process, once a finished board with a predetermined number of layers is obtained, perforations can be made from the outermost fourth sheet 200 or the first sheet 110 of the finished board, thereby creating through holes or buried holes on the finished board, and then copper filling is performed on the through holes or buried holes.

[0062] Secondly, referring to Figures 6 to 8 This application also provides a PCB board pressing device for hot-pressing and stacking of boards to be pressed. The boards to be pressed can be symmetrical portions 100 or symmetrical stacked structures. After hot pressing, the prepregs on the symmetrical portions 100 or symmetrical stacked structures are heated and melted, thereby connecting the individual sheets of the boards to be pressed. The PCB board pressing device includes a frame, a clamping mechanism 700 installed in the frame, and a pressing mechanism 800. The clamping mechanism 700 can clamp the boards to be pressed placed in the frame, and the pressing mechanism 800 can hot-press and stack the boards to be pressed clamped by the clamping mechanism 700.

[0063] Specifically, refer to Figure 7The machine frame is equipped with clamping mechanisms 700 on both the upper and lower sides. Each clamping mechanism 700 has a clamping end 721. The two clamping ends 721 can move in the vertical direction away from or towards each other. A clamping space 702 is formed between the two clamping ends 721. The plate to be pressed is clamped by the movable clamping ends 721, and the plate to be pressed is positioned on the machine frame.

[0064] Specifically, pressing mechanisms 800 are provided on both side walls along the left and right directions inside the frame. Each pressing mechanism 800 includes a mounting frame 810, a telescopic platform 820, a hinge frame 830, and a pair of hot press rollers 840. The mounting frame 810 is mounted on the frame and located on the left and right side of the clamping space 702. The telescopic platform 820 can move and be positioned towards or away from the clamping space 702 in a direction parallel to the left and right. The telescopic platform 820 can move into or out of the clamping space 702. The hinge frame 830 includes a pair of first forks 831 and a pair of second forks 832. The two first forks 831 are respectively mounted on both sides of the telescopic platform 820 in the front and back directions. Arms 832 are respectively installed on both sides of the telescopic platform 820 in the front-to-back direction. The first fork arm 831 and the second fork arm 832 on the same side in the front-to-back direction cross each other and are hinged to each other. The ends of the first fork arm 831 and the second fork arm 832 on the same side away from the clamping space 702 are both installed on the telescopic platform 820 and can move and be positioned in the vertical direction toward or away from each other. The ends of the two first fork arms 831 near the clamping space 702 are respectively connected to the two ends of one of the hot press rollers 840, and the ends of the two second fork arms 832 near the clamping space 702 are respectively connected to the two ends of the other hot press roller 840. A pressing space is formed between the two hot press rollers 840 of the same pressing mechanism 800.

[0065] As described above, when pressing the plates to be pressed, the clamping mechanism 700 is first moved to expand the clamping space 702, and then the stacked plates to be pressed are placed in the clamping space 702, and the clamping ends 721 are moved back towards each other to reduce the clamping space 702 and clamp the plates to be pressed. Subsequently, the ends of the first fork arm 831 and the second fork arm 832 on each pressing mechanism 800 that are away from the clamping space 702 are moved away from each other, and the ends of the first fork arm 831 and the second fork arm 832 that are close to the clamping space 702 are moved towards each other, driving the hot pressure rollers 840 on the pair of first fork arms 831 and the pair of second fork arms 832 to move towards each other until another hot pressure roller 840 on the same pressing mechanism 800 is reached, thereby clamping the plates to be pressed in the clamping space 702 and starting heating. Then the telescopic platforms 820 on the two pressing mechanisms 800 move away from each other.

[0066] During the clamping process, the hot press roller 840 simultaneously heats and flattens the plate to be pressed, ensuring uniform heating on both sides of the plate. This results in uniform shrinkage and deformation of the prepreg on both sides, reducing PCB warping caused by uneven prepreg deformation during single-sided pressing. Furthermore, the hot press rollers 840 on the two synchronously moving telescopic platforms 820 can level the plate during movement, correcting any unevenness and reducing warping. The interlocking first and second forks 831 and 832 provide stable support for the plate, ensuring stable correction during the movement of the hot press roller 840. In summary, this PCB pressing equipment achieves simultaneous heating of both sides of the plate through the movable hot press roller 840, reducing warping caused by prepreg deformation and inherent unevenness of the plate.

[0067] Furthermore, in order to enable the first fork arm 831 and the second fork arm 832 on the same side to rotate synchronously and stably clamp the plate to be pressed located in the middle, in this embodiment, each pressing mechanism 800 is provided with a vertical drive component 821 on its telescopic platform 820. The vertical drive component 821 includes a vertical drive motor, a bidirectional threaded rod, and two vertical drive plates. The vertical drive motor is mounted on the telescopic platform 820, and the bidirectional threaded rod is rotatably mounted on the telescopic platform 820 and rotates linearly around the vertical direction. The two ends of the bidirectional threaded rod protrude from the telescopic platform 820 and are located on both sides of the telescopic platform 820 along the vertical direction. The ends of a pair of first fork arms 831 away from the clamping space 702 are rotatably connected to the two ends of one of the vertical drive plates. The ends of a pair of second fork arms 832 away from the clamping space 702 on the same pressing mechanism 800 are rotatably connected to the two ends of another vertical drive plate. The two ends of the bidirectional threaded rod are threaded to the two vertical drive plates, thereby driving the ends of the pair of first fork arms 831 and the pair of second fork arms 832 away from the clamping space 702 to move toward each other or away from each other, so that the ends of the pair of first fork arms 831 and the pair of second fork arms 832 near the clamping space 702 move toward each other or away from each other.

[0068] Furthermore, a horizontal linear drive component is provided on the mounting bracket 810, and the output end of the horizontal linear drive component is fixedly connected to the telescopic platform 820. In this embodiment, the horizontal linear drive component can be a linear drive mechanism such as a cylinder or a screw motor linear drive component, and this application embodiment does not specifically limit it.

[0069] Furthermore, the mounting frame 810 has a sliding groove that extends horizontally and opens towards one end near another pressing mechanism 800. The inner wall of the sliding groove is provided with a dovetail block that extends in the left and right direction. The telescopic platform 820 is slidably installed in the sliding groove. The telescopic platform 820 has a dovetail groove, and the dovetail block is slidably installed in the dovetail groove. Through the sliding groove and the dovetail groove, the telescopic platform 820 can slide smoothly on the mounting frame 810.

[0070] To improve the automation level of the pressing equipment in this application, the clamping mechanism 700 includes a telescopic rod 710 and a hot pressing strip 720. The telescopic rods 710 of the two clamping mechanisms 700 are respectively installed on two inner walls along the vertical direction inside the frame. The hot pressing strip 720 of one clamping mechanism 700 is installed at one end of the telescopic rod 710 of the same clamping mechanism 700 near the other clamping mechanism 700. The hot pressing strip 720 extends in the front-back direction, and a clamping space 702 is formed between the two hot pressing strips 720. When hot pressing and stacking the plates to be pressed, the hot pressing strip 720 always abuts against the plates to be pressed and heats that part. As can be seen from the above, the telescopic rod 710 can automatically clamp the plates to be pressed, improving the automation level of the equipment. The worker only needs to lift the plate to the predetermined position (i.e., the upper surface of the hot pressing strip 720 below). At this time, the hot pressing strip 720 can carry the plates to be pressed. Then, by moving the upper and lower telescopic rods 710, the plates to be pressed are clamped, reducing the workload of the worker.

[0071] During the hot pressing process, the pressing equipment mainly uses the hot pressing rollers 840 of the two pressing mechanisms 800 to press the plate to be pressed. Since the projections of the parts of the two hot pressing rollers 840 that contact the plate to be pressed on the horizontal plane never actually contact each other, there are always areas on the plate to be pressed that are fully heated when the hot pressing rollers 840 are used to press it. Therefore, in this embodiment, referring to... Figure 8 The hot pressing strip 720 includes a hot pressing part 722 and a guide part 723. Both the hot pressing part 722 and the guide part 723 extend in the front-back direction. The hot pressing part 722 is provided with guide parts 723 on both sides in the left-right direction. The guide part 723 gradually moves away from the hot pressing part 722 in the direction of approaching to moving away from another clamping mechanism 700. Each hot pressing roller 840 can move to abut against the side of the guide part 723 away from the hot pressing part 722. The hot pressing strip 720 can move in the up-down direction on the telescopic rod 710.

[0072] As described above, when the telescopic platform 820 moves the hot pressing rollers 840 on both sides, the hot pressing rollers 840 first move to the guide part 723 that abuts against the hot pressing strip 720, and then continue to move towards the hot pressing part 722. Through the guiding action of the outer side of the guide part 723, the hot pressing strip 720 as a whole moves away from the other hot pressing strip 720 in the vertical direction until the hot pressing rollers 840 on both sides abut against each other in the left and right direction. At this time, the area that the hot pressing rollers 840 can perform hot pressing on the plate to be pressed reaches the maximum, and this area and the projection of the hot pressing area of ​​the hot pressing strip 720 on the plate to be pressed on the horizontal plane at least partially overlap. Then, the telescopic platforms 820 on both sides move away from each other, driving the hot pressing rollers 840 to move on the plate to be pressed, completing the pressing of the entire plate to be pressed, and improving the integrity of the hot pressing and stacking.

[0073] Furthermore, the length of the hot pressing section 722 in the left-right direction is no greater than the diameter of one hot pressing roller 840. As can be seen from the above, when the hot pressing rollers 840 on both sides in the left-right direction move to abut against each other, it is only necessary to control the length of the hot pressing strip 720 in the left-right direction to be no less than the diameter of the hot pressing roller 840, so that the hot pressing strip 720 can always hot press the area not covered by the hot pressing roller 840.

[0074] Furthermore, the length of the hot pressing strip 720 is greater than the length of the plate to be hot-pressed in the front-back direction. In this way, the hot pressing strip 720 can always make complete contact with the contact part of the plate to be hot-pressed, thereby hot-pressing that part and improving the integrity of the hot pressing of the plate to be hot-pressed.

[0075] The heat-pressing strip 720 can move vertically on the telescopic rod 710. In some embodiments, the heat-pressing strip 720 is elastically connected to the telescopic rod 710. Specifically, refer to... Figure 8 The telescopic rod 710 has a sliding groove at its end, and a guide rod 711 is slidably installed in the sliding groove. The hot pressing strip 720 is fixedly connected to the guide rod 711 and extends out of the telescopic rod 710. An elastic element 712 is sleeved on the guide rod 711. One end of the elastic element 712 is fixedly connected to the guide rod 711, and the other end is fixedly connected to the inner wall of the sliding groove away from the hot pressing strip 720. The elastic element 712 enables the hot pressing part 722 to automatically retract when it comes into contact with the hot pressing roller 840, and automatically return to contact the plate to be pressed after the hot pressing roller 840 leaves, acting synchronously with the hot pressing roller 840 at this time, thereby improving the overall clamping stability of the frame for the plate to be pressed.

[0076] Furthermore, the mounting frame 810 can rotate around its left and right axes. A gravity sensor and a controller are installed on the frame. The controller controls the rotation of the mounting frame 810. When the gravity sensor detects that the hot press roller 840 is not horizontal, the controller controls the mounting frame 810 to rotate until the hot press roller 840 is horizontal. Through this technical solution, during hot pressing, the prepreg may partially move due to heat, resulting in a higher proportion of prepreg in that area and greater influence from gravity. Therefore, after the hot press roller 840 clamps the workpiece to be pressed, the gravity sensor starts working, detecting the angle between the axis of the hot press roller 840 and the horizontal plane. When there is an angle greater than 0 between the axis of the hot press roller 840 and the horizontal plane, the controller controls the mounting frame 810 to rotate until the hot press roller 840 is horizontal, reducing the influence of gravity on the prepreg.

[0077] The preferred embodiments of the present invention have been described in detail above, but the present invention is not limited to the embodiments described. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present invention, and these equivalent modifications or substitutions are all included within the scope defined by the claims of this application.

Claims

1. A PCB board laminating device, characterized in that, include: frame; The clamping mechanism (700) is provided on both sides of the frame along the vertical direction. Each clamping mechanism (700) has a clamping end (721). The two clamping ends (721) can move in the vertical direction away from each other or close to each other, and a clamping space (702) is formed between the two clamping ends (721). A pressing mechanism (800) is provided on both sides of the frame along the left-right direction. Each pressing mechanism (800) includes a mounting frame (810), a telescopic platform (820), a hinge frame (830), and a pair of hot press rollers (840). The mounting frame (810) is mounted on the frame and located on the side of the clamping mechanism (700) along the left-right direction. The telescopic platform (820) can move and be positioned on the mounting frame (810) in a direction parallel to the left-right direction toward or away from the clamping space (702). The telescopic platform (820) can move to enter or exit the clamping space (702). The hinge frame (830) includes a pair of first forks (831) and a pair of second forks (832). The two first forks (831) are respectively mounted on both sides of the telescopic platform (820) along the front-back direction. The second fork arms (832) are respectively installed on both sides of the telescopic platform (820) in the front-back direction. The first fork arms (831) and the second fork arms (832) on the same side in the front-back direction cross each other and are hinged to each other. The ends of the first fork arms (831) and the second fork arms (832) on the same side away from the clamping space (702) are both installed on the telescopic platform (820) and can move and be positioned in the up-down direction towards each other or away from each other. The ends of the two first fork arms (831) near the clamping space (702) are respectively connected to the two ends of one of the hot press rollers (840), and the ends of the two second fork arms (832) near the clamping space (702) are respectively connected to the two ends of the other hot press roller (840). A pressing space is formed between the two hot press rollers (840) of the same pressing mechanism (800). The clamping mechanism (700) includes a telescopic rod (710) and a hot-pressing strip (720). The telescopic rod (710) extends along the vertical axial direction. The hot-pressing strip (720) in one clamping mechanism (700) is installed at one end of the telescopic rod (710) near the other clamping mechanism (700). The end of the hot-pressing strip (720) away from the telescopic rod (710) is the clamping end (721). The hot pressing strip (720) includes a hot pressing part (722) and a guide part (723). The guide part (723) is provided on both sides of the hot pressing part (722) in the left-right direction. The hot pressing part (722) and the guide part (723) both extend in the front-back direction. The side of the guide part (723) away from the hot pressing part (722) gradually moves away from the hot pressing part (722) in the direction of approaching to moving away from another clamping mechanism (700). Each hot pressing roller (840) can move to abut against the side of the guide part (723) away from the hot pressing part (722). The hot pressing strip (720) can move in the up-down direction on the telescopic rod (710). The length of the hot pressing section (722) in a straight line in the left-right direction is no greater than the diameter of one of the hot pressing rollers (840).

2. The PCB board laminating equipment according to claim 1, characterized in that, The hot-pressing part (722) is elastically connected to the telescopic rod (710).

3. The PCB board laminating equipment according to claim 1, characterized in that, The mounting frame (810) is rotatable around the left and right axis. The frame is equipped with a gravity sensor and a controller. The controller is used to control the rotation of the mounting frame (810). When the gravity sensor detects that the hot press roller (840) is not horizontal, the controller controls the mounting frame (810) to rotate until the hot press roller (840) is horizontal.

4. A PCB board lamination method, characterized in that, It is applied in a PCB board laminating device according to any one of claims 1-3, wherein the PCB board laminating method includes: S1: A second sheet (120) and a third sheet (130) are sequentially arranged above the first sheet (110). A first semi-cured sheet (140) is arranged between the first sheet (110) and the second sheet (120) and between the second sheet (120) and the third sheet (130). The first sheet (110), the second sheet (120) and the third sheet (130) are hot-pressed with the second sheet (120) as the center of symmetry. The first sheet (110), the second sheet (120) and the third sheet (130) are hot-pressed to form a symmetrical part (100). S2: A superimposed layer is provided on one side of the symmetrical portion (100), the superimposed layer including a fourth sheet (200), and a dummy layer is provided on the other side, the dummy layer including a symmetrical sheet (300). A second semi-cured sheet (400) is provided between the fourth sheet (200) and the symmetrical portion (100). The second semi-cured sheet (400) is provided between the symmetrical sheet (300) and the symmetrical portion (100). The superimposed layer, the symmetrical portion (100) and the dummy layer are hot-pressed to form a symmetrical laminated structure. S3: Separate the dummy layer in the symmetrical stacked structure, and the remaining part is the finished board.

5. A PCB board lamination method according to claim 4, characterized in that, The superimposed layer includes a plurality of fourth sheets (200), the dummy layer includes a plurality of symmetrical sheets (300), and the method of S2 further includes: sequentially setting the second semi-cured sheet (400) and the fourth sheet (200) on one side of the symmetrical portion (100), sequentially setting the second semi-cured sheet (400) and the symmetrical sheet (300) on the other side of the symmetrical portion (100), and performing hot pressing, repeating the above actions until a symmetrical stacked structure with a predetermined number of layers is obtained.

6. A PCB board lamination method according to claim 5, characterized in that, A resist film (500) is disposed between the first sheet (110) and the symmetrical sheet (300). The specific method of S2 further includes: disposing a third semi-cured sheet (600) between the second semi-cured sheet (400) and the first sheet (110), opening an installation channel on the third semi-cured sheet (600), and installing the resist film (500) in the installation channel, with one side of the resist film (500) abutting against the first sheet (110) and the other side abutting against the symmetrical sheet (300).

7. A PCB board lamination method according to claim 6, characterized in that, The method between S2 and S3 further includes: screwing the symmetrical stacked structure, wherein the projection of the screwing path on the horizontal plane is located within the projection of the adhesive resist film (500) on the same plane.

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