Composite-structure high-power-density power supply module with electromagnetic shielding and heat dissipation functions

Abstract

The invention belongs to the technical field of power supplies, and relates to a composite-structure high-power-density power supply module with electromagnetic shielding and heat dissipation, which comprises a top plate, a middle layer and a bottom plate which are sequentially arranged at intervals, the top plate is composed of a metal electromagnetic shielding layer and a first heat dissipation layer, and the bottom plate is a second heat dissipation layer; two heat conduction layers; and a plurality of metal strips. The top plate, the middle layer and the bottom plate form the three-dimensional structure, the utilization rate of the power module in the three-dimensional space is increased, power can flow in the three-dimensional structure, heat is prevented from being locally accumulated, meanwhile, the multiple metal strips are matched with the two heat conduction layers, the first heat dissipation layer and the second heat dissipation layer for heat dissipation, and the heat dissipation efficiency is improved. In addition, the plurality of metal strips are matched with the metal electromagnetic shielding layer to form a Faraday cage for electromagnetic shielding, so that electromagnetic interference can be shielded, the stability of system operation is improved, and normal operation of other equipment is ensured.

Description

TECHNICAL FIELD

[0001] The application belongs to the technical field of power supply, and relates to a high-power-density power supply module with a composite structure of electromagnetic shielding and heat dissipation. BACKGROUND

[0002] The high-power-density power supply module has become a core component of modern electronic systems, and its technical evolution mainly embodies three aspects of semiconductor material innovation, packaging process breakthrough and system architecture optimization, which jointly promote the continuous improvement of the performance of the power supply module. Although the high-power-density power supply module technology has made significant progress, it still faces many technical bottlenecks in actual application. The EMC problem caused by high switching frequency and compact layout is increasingly prominent, and the concentrated heat dissipation risk caused by too small heat dissipation area has become another challenge for the design of high-power-density power supply. For example, the high-power power supply module produced by Vicor Company has a more compact layout compared with the traditional discrete power supply module. The integrated design of the high-power-density power supply module greatly reduces the volume, does not need to occupy a large amount of circuit board space, and has a power density of 5 times that of the traditional discrete scheme and a lighter weight.

[0003] However, although the high-power-density power supply module with integrated design has the advantages of small volume, high power density and high efficiency, it still has some defects. Firstly, the existing high-power-density power supply module adopts a flat and long planar structure, so that the internal components of the module are densely arranged, heat is easily concentrated in a local area, heat dissipation is difficult, and the stability of system operation is reduced. On the other hand, the close arrangement of components in the planar structure shortens the electromagnetic coupling path between different functional units, and electromagnetic interference is easily generated, which affects the normal operation of other devices. SUMMARY

[0004] The purpose of the application is to provide a high-power-density power supply module with a composite structure of electromagnetic shielding and heat dissipation, which can improve the heat dissipation effect, shield electromagnetic interference, thereby improving the stability of system operation and ensuring the normal operation of other devices.

[0005] To achieve the above purpose, the technical scheme provided by the application is as follows: A high-power-density power supply module with a composite structure of electromagnetic shielding and heat dissipation comprises: A top plate, an intermediate layer and a bottom plate are sequentially and spacedly arranged. The top plate is composed of a metal electromagnetic shielding layer and a first heat dissipation layer. The bottom plate is a second heat dissipation layer. The surface of the first heat dissipation layer away from the metal electromagnetic shielding layer is used for mounting components of control circuit and driving circuit. The intermediate layer is used for mounting planar transformers and peripheral components of the transformers. The surface of the second heat dissipation layer close to the intermediate layer is used for mounting components on the input side and the output side. Two heat-conducting layers are arranged between the top plate and the intermediate layer and between the intermediate layer and the bottom plate, respectively. A plurality of metal strips are arranged on the side of the top plate and are evenly arranged around the top plate, each metal strip is connected with the metal electromagnetic shielding layer, the intermediate layer, the bottom plate, and the two heat-conducting layers, the plurality of metal strips cooperate with the two heat-conducting layers, the first heat-dissipating layer, and the second heat-dissipating layer to dissipate heat, and the plurality of metal strips cooperate with the metal electromagnetic shielding layer to form a Faraday cage for electromagnetic shielding.

[0006] The application also has the characteristics that: The first heat-dissipating layer and the second heat-dissipating layer are made of ceramic material.

[0007] Each metal strip is made of copper material.

[0008] Each heat-conducting layer is made of heat-conducting adhesive material.

[0009] The positions of the top plate, the intermediate layer, and the bottom plate near each metal strip are respectively provided with a solder pad, and the solder pad is fixedly connected with the corresponding metal strip.

[0010] The metal strips are twelve in number.

[0011] The thickness of each metal strip is 0.2mm-0.5mm, and the thickness of the metal electromagnetic shielding layer is 0.2mm-0.5mm.

[0012] The thickness of the first heat-dissipating layer is 0.4mm-0.7mm, the thickness of the intermediate layer is 0.4mm-6.4mm, and the thickness of the second heat-dissipating layer is 0.6mm-1mm.

[0013] The high-power-density power module with electromagnetic shielding and heat dissipation has the following advantages: The top plate, the intermediate layer, and the bottom plate form a three-dimensional structure, increasing the utilization rate of the power module in the three-dimensional space, so that the power can flow in the three-dimensional structure, avoiding the accumulation of heat in a local area, and at the same time, the plurality of metal strips cooperate with the two heat-conducting layers, the first heat-dissipating layer, and the second heat-dissipating layer to dissipate heat, increasing the heat transfer path and further improving the heat dissipation effect, in addition, the plurality of metal strips cooperate with the metal electromagnetic shielding layer to form a Faraday cage for electromagnetic shielding, so that electromagnetic interference can be shielded, thereby improving the stability of system operation and ensuring the normal operation of other equipment. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 It is an explosive structure diagram of the application.

[0015] Figure 2 It is a structure diagram of the bottom plate in the application.

[0016] Figure 3This is a schematic diagram of the structure of the intermediate layer in this invention.

[0017] Figure 4 This is a schematic diagram of the top plate structure in this invention.

[0018] Figure 5 This is a schematic diagram of the working state of the present invention.

[0019] Figure 6 This is a schematic diagram of the overall structure of the present invention.

[0020] Figure 7 This is a bottom view of the bottom plate structure in this invention.

[0021] Figure 8 This is the main circuit schematic diagram of the power supply module in this invention.

[0022] Figure label: 1. Top plate, 2. Middle layer, 3. Bottom plate, 4. Metal strip, 5. Pad, 6. Input filter inductor, 7. Input filter capacitor, 8. MOSFET, 9. Voltage divider capacitor, 10. Diode, 11. Output filter capacitor, 12. Input resonant inductor, 13. Resonant capacitor, 14. Planar transformer, 15. MOSFET driver chip, 16. Capacitors and resistors of the control chip peripheral circuit, 17. Main control chip, 18. Capacitors and resistors of the driver peripheral circuit. Detailed Implementation

[0023] The technical solutions of the present invention will now be described clearly and in detail with reference to the accompanying drawings. In the description of the embodiments of the present invention, unless otherwise stated, " / " indicates "or," for example, A / B can mean A or B. "And / or" in the text is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, and B alone. Furthermore, in the description of the embodiments of the present invention, "multiple" refers to two or more. The terms "first" and "second" are used for descriptive purposes only and should not be construed as implying or suggesting relative importance or implicitly indicating the number of indicated technical features. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature.

[0024] like Figure 1As shown, this invention provides a high-power-density power supply module with a composite structure featuring electromagnetic shielding and heat dissipation. It includes a top plate 1, a middle layer 2, a bottom plate 3, two heat-conducting layers, and multiple metal strips 4. The top plate 1, middle layer 2, and bottom plate 3 are arranged sequentially at intervals. The top plate 1 consists of a metal electromagnetic shielding layer and a first heat dissipation layer. The bottom plate 3 is a second heat dissipation layer. The side of the first heat dissipation layer away from the metal electromagnetic shielding layer is used to mount components for the control and drive circuits. The middle layer 2 is used to mount a planar transformer and its peripheral components. The side of the second heat dissipation layer near the middle layer 2 is used to mount input and output components. The two heat-conducting layers are respectively positioned between the top plate 1 and the middle layer 2, and between the middle layer 2 and the bottom plate 3. Multiple metal strips 4 are arranged on the side of the top plate 1, uniformly surrounding it. Each metal strip 4 is connected to the metal electromagnetic shielding layer. The invention comprises a top plate 1, an intermediate layer 2, a bottom plate 3, and two heat-conducting layers connected together. Multiple metal strips 4, in conjunction with the two heat-conducting layers, a first heat dissipation layer, and a second heat dissipation layer, are used for heat dissipation. These metal strips 4, in conjunction with a metal electromagnetic shielding layer, form a Faraday cage for electromagnetic shielding. This invention utilizes the top plate 1, intermediate layer 2, and bottom plate 3 to form a three-dimensional structure, increasing the utilization rate of the power module in the three-dimensional space. This allows power to flow within the three-dimensional structure, preventing localized heat accumulation. Furthermore, the combination of multiple metal strips 4 with the two heat-conducting layers, the first heat dissipation layer, and the second heat dissipation layer increases the heat transfer path, further improving the heat dissipation effect. In addition, the Faraday cage formed by the multiple metal strips 4 and the metal electromagnetic shielding layer provides electromagnetic shielding, thereby improving the stability of the system and ensuring the normal operation of other devices.

[0025] like Figure 2 , Figure 3 , Figure 4 As shown, the components mounted on the base plate 3 for the input and output sides include: input filter inductor 6, input filter capacitor 7, MOSFET 8, voltage divider capacitor 9, diode 10, and output filter capacitor 11. Among them, MOSFET 8 is located on the input side of the half-bridge LLC and is connected in parallel in groups of three. Voltage divider capacitor 9 is connected in parallel with MOSFET 8. Diode 10 is the diode on the output side and is connected in parallel in groups of four. The planar transformer mounted on the intermediate layer 2 and the components surrounding the transformer include: input resonant inductor 12, resonant capacitor 13, and planar transformer 14. The components mounted on the top plate 1 for the control circuit and drive circuit include: capacitors and resistors 16 of the control chip peripheral circuit, main control chip 17, capacitors and resistors 18 of the drive peripheral circuit, and MOSFET driver chip 15. The main control chip 17 is responsible for controlling the LLC.

[0026] like Figure 8As shown, the positive terminal of the DC input voltage is connected to one end of the input filter inductor 6, the other end of the input filter inductor 6 is connected to one end of the input filter capacitor 7, and the other end of the input filter capacitor 7 is connected to the negative terminal of the DC input voltage. There are two sets of MOSFETs 8, each set consisting of three MOSFETs connected in parallel. The drain of one set of MOSFETs 8 is connected to one end of the input filter inductor 6, and the source of the other set of MOSFETs 8 is connected to the other end of the input filter inductor 6 and grounded. The drain of each set of MOSFETs 8 is connected to one end of the voltage divider capacitor 9, and the source of each set of MOSFETs 8 is connected to the other end of the voltage divider capacitor 9. The source of one set of MOSFETs 8 is connected to the other set of MOSFETs 8... The drain of the capacitor is connected and the connection point is connected to one end of the resonant capacitor 13. The other end of the resonant capacitor 13 is connected to one end of the primary side of the planar transformer 14. The other end of the primary side of the planar transformer 14 is connected to the other end of the input filter capacitor 7. One end of the secondary side of the planar transformer 14 is connected to the anode of one of the diodes 10. The cathode of the diode 10 is connected to one end of the output filter capacitor 11 and one end of the load resistor. The other end of the secondary side of the planar transformer 14 is grounded and connected to one end of the output filter capacitor 11 through another diode 10. The other end of the output filter capacitor 11 is connected to the other end of the load resistor and grounded. The two ends of the load resistor serve as the output voltage. The input filter inductor 6 and the input filter capacitor 7 form an input filter circuit and are connected to a half-bridge circuit consisting of three parallel MOSFETs 8 and parallel voltage divider capacitors 9. The half-bridge circuit is connected to the planar transformer in the intermediate layer 2. The output terminal of the planar transformer 14 is connected to an output rectifier filter circuit consisting of four parallel diodes 10 and an output filter capacitor 11. The input resonant inductor 12, the resonant capacitor 13, and the primary side of the planar transformer 14 form an LLC resonant cavity. The main control chip 17 and the peripheral capacitors and resistors 16 of the control chip form a control circuit. Its output is connected to a drive circuit consisting of a drive peripheral capacitor and resistor 18 and a MOSFET driver chip 15. The output terminal of the drive circuit is connected to the gates of the two sets of MOSFETs 8 on the base plate 3. The input DC is filtered by the base plate and then inverted into high-frequency AC by the half-bridge circuit. The energy is transferred through the LLC resonant cavity in the intermediate layer 2, and the secondary side is rectified and filtered to output DC. The entire process is regulated by the control drive circuit on the top plate 1 to achieve stable and efficient power supply.

[0027] The first and second heat dissipation layers are made of ceramic materials.

[0028] Among them, the middle layer 2 is a multilayer PCB board, which serves as the winding of the planar transformer.

[0029] Each metal strip 4 is made of copper.

[0030] Each thermally conductive layer is made of thermally conductive adhesive material, which increases the heat transfer path and further improves the heat dissipation effect.

[0031] likeFigure 1 , Figure 2 , Figure 3 , Figure 4 As shown, pads 5 are respectively provided on the top plate 1 near each metal strip 4, on the middle layer 2 near each metal strip 4, and on the bottom plate 3 near each metal strip 4. The pads 5 are fixedly connected to the corresponding metal strip 4. Each metal strip 4 is connected to each pad 5 by welding. The pads 4 have no electrical connection.

[0032] like Figure 5 The diagram shows the power flow in the high power density power module designed in this scheme. The left side is the input, the right side is the output, and the middle shows the power flow in the three-dimensional structure of the power module. It can be seen that the power is input from the base plate 3, passes through the input filter inductor 6, the input filter capacitor 7, and the MOSFET 8, and is transmitted to the primary side of the planar transformer through the side metal strip 4. Then it flows out from the secondary side of the transformer, is transmitted to the base plate 3 through the side metal strip 4, and finally is output to the load through the diode 10 and the output filter capacitor 11.

[0033] like Figure 6 , Figure 7 As shown, there are twelve metal strips 4. This number is sufficient to meet the performance requirements for electromagnetic shielding and heat dissipation. like Figure 6 As shown, the portion of the top plate 1 and bottom plate 3 surrounding and located within multiple metal strips 4 is plastic-sealed.

[0034] The thickness of each metal strip 4 is 0.2mm to 0.5mm, and the thickness of the metal electromagnetic shielding layer is 0.2mm to 0.5mm. This range covers the shielding requirements from high frequency to low frequency and leaves a certain margin for mechanical strength.

[0035] The thickness of the first heat dissipation layer is 0.4mm to 0.7mm. Since the first heat dissipation layer is not part of the main power part, its thickness can be appropriately reduced to improve the overall power density. The thickness of the middle layer 2 is 0.4mm to 6.4mm. The specific thickness can be determined according to the number of turns and layers of the planar transformer winding. The advantage of selecting the thickness of the middle layer 2 is that it can realize the flattening of magnetic components and improve the power density of the module. The thickness of the second heat dissipation layer is 0.6mm to 1mm, which can ensure a high current carrying capacity and resist high temperature deformation.

[0036] It is understood that this invention has been described through some embodiments, and those skilled in the art will recognize that various changes or equivalent substitutions can be made to these features and embodiments without departing from the spirit and scope of this invention. Furthermore, under the teachings of this invention, these features and embodiments can be modified to adapt to specific situations and materials without departing from the spirit and scope of this invention. Therefore, this invention is not limited to the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of this invention are within the protection scope of this invention.

Claims

1. A high-power-density power supply module with a composite structure featuring electromagnetic shielding and heat dissipation, characterized in that, include: The top plate (1), the middle layer (2) and the bottom plate (3) are arranged in sequence at intervals. The top plate (1) is composed of a metal electromagnetic shielding layer and a first heat dissipation layer. The bottom plate (3) is a second heat dissipation layer. The side of the first heat dissipation layer away from the metal electromagnetic shielding layer is used to install components of the control circuit and the drive circuit. The middle layer (2) is used to install the planar transformer and the components around the transformer. The side of the second heat dissipation layer close to the middle layer (2) is used to install the input side and the output side components. Two heat-conducting layers are respectively set between the top plate (1) and the middle layer (2) and between the middle layer (2) and the bottom plate (3); Multiple metal strips (4) are set on the side of the top plate (1) and are evenly arranged around the top plate (1). Each metal strip (4) is connected to the metal electromagnetic shielding layer, the intermediate layer (2), the bottom plate (3), and the two heat-conducting layers respectively. The multiple metal strips (4) cooperate with the two heat-conducting layers, the first heat dissipation layer, and the second heat dissipation layer for heat dissipation. The multiple metal strips (4) cooperate with the metal electromagnetic shielding layer to form a Faraday cage for electromagnetic shielding.

2. The high-power-density power supply module with a composite structure featuring electromagnetic shielding and heat dissipation according to claim 1, characterized in that, The first heat dissipation layer and the second heat dissipation layer are made of ceramic material.

3. The high-power-density power supply module with a composite structure featuring electromagnetic shielding and heat dissipation according to claim 1, characterized in that, Each of the metal strips (4) is made of copper.

4. A high-power-density power supply module with a composite structure featuring electromagnetic shielding and heat dissipation according to claim 1, characterized in that, Each of the thermally conductive layers is made of a thermally conductive adhesive material.

5. A high-power-density power supply module with a composite structure featuring electromagnetic shielding and heat dissipation according to claim 1, characterized in that, The top plate (1) is provided with pads (5) near each metal strip (4), the middle layer (2) is provided with pads (5) near each metal strip (4), and the bottom plate (3) is provided with pads (5) near each metal strip (4). The pads (5) are fixedly connected to the corresponding metal strips (4).

6. A high-power-density power supply module with a composite structure featuring electromagnetic shielding and heat dissipation according to claim 1, characterized in that, There are twelve metal strips (4).

7. A high-power-density power supply module with a composite structure featuring electromagnetic shielding and heat dissipation according to claim 1, characterized in that, The thickness of each metal strip (4) is 0.2mm~0.5mm, and the thickness of the metal electromagnetic shielding layer is 0.2mm~0.5mm.

8. A high-power-density power supply module with a composite structure featuring electromagnetic shielding and heat dissipation according to claim 1, characterized in that, The thickness of the first heat dissipation layer is 0.4mm~0.7mm, the thickness of the intermediate layer (2) is 0.4mm~6.4mm, and the thickness of the second heat dissipation layer is 0.6mm~1mm.

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