Micro LED chip stripping device

Abstract

The invention relates to the technical field of Micro LED chip stripping, and particularly discloses a Micro LED chip stripping device, which comprises a stripping equipment main body, a placement platform and a laser emission head, and further comprises a laser device, a pumping source, a gain medium and a wavelength adjusting assembly are arranged in the laser device, and the wavelength adjusting assembly is positioned on the outer side of an output mirror. An image of a stripping area is shot in real time through the industrial camera, the laser wavelength is monitored in an auxiliary mode through the arranged wavelength adjusting assembly, after the laser wavelength shifts, the wavelength adjusting assembly adjusts the distance between the total reflection mirror and the output mirror, it is ensured that laser energy is accurately matched with the absorption characteristic of a Micro LED interface layer, and when the industrial camera shoots that stripping is incomplete, the laser energy is accurately matched with the absorption characteristic of the Micro LED interface layer. The heat dissipation assembly enhances heat dissipation of the surface of the laser, the heat dissipation assembly controls a mechanical counting structure of the alarm assembly to work once every time the heat dissipation assembly enhances heat dissipation, and therefore an alarm is given out in time when multiple times of stripping are abnormal, and continuous production of defective products is avoided.

Description

Technical Field

[0001] This invention relates to the field of Micro LED chip stripping technology, specifically to a Micro LED chip stripping device. Background Technology

[0002] Micro LED chip stripping equipment is a specialized device used in the manufacturing process of Micro LED display devices to separate Micro LED chips grown on substrates (such as sapphire, silicon, GaN, etc.) from the original substrate.

[0003] The core structure of a Micro LED chip (such as epitaxial layers and light-emitting layers) usually needs to be grown on a specific substrate (for example, gallium nitride-based Micro LEDs are mostly grown on sapphire substrates). However, the chip ultimately needs to be separated from the substrate before it can be transferred to a driving substrate (such as CMOS, glass, etc.) for packaging and display panel assembly.

[0004] Currently, laser lift-off equipment is commonly used for separation. This equipment includes a high-power laser (such as an ultraviolet laser), a precision positioning platform, and an optical focusing system. The principle is as follows: the laser shines through a transparent substrate (such as sapphire) onto the interface between the substrate and the epitaxial layer (such as the interface between GaN and sapphire). The interface material (such as GaN) absorbs the laser energy and decomposes into gas, thereby achieving the separation of the chip from the substrate.

[0005] The wavelength stability of the laser is crucial for successful stripping. However, the pump source (such as a semiconductor laser) and gain medium (such as a laser crystal) inside the laser will generate heat due to continuous operation, causing a slight change in the length of the resonant cavity due to thermal expansion and contraction. Furthermore, the increase in temperature will also change the refractive index of the gain medium (such as the thermo-optic effect of the crystal), thereby changing the resonant frequency of the resonant cavity and ultimately causing a wavelength shift in the output laser.

[0006] The absorption of laser by the interface layer material exhibits wavelength selectivity (i.e., the absorption efficiency is highest only for specific wavelengths of laser light). If the wavelength shift exceeds the material's "strong absorption window," the laser energy absorbed by the interface layer will decrease significantly, which may not reach the peeling threshold, resulting in incomplete separation of the chip from the substrate (i.e., "incomplete peeling"). Furthermore, the shifted laser light may be over-absorbed by the chip's light-emitting layer or the substrate, leading to chip damage (such as burnt-out light-emitting layer) or substrate cracking, directly reducing the yield. To address this, we propose a Micro LED chip peeling device. Summary of the Invention

[0007] The purpose of this invention is to provide a Micro LED chip stripping device to solve the problem mentioned in the background art that if the wavelength shift exceeds the "strong absorption window" of the material, the laser energy absorbed by the interface layer will decrease significantly, which may not be able to reach the stripping threshold, resulting in incomplete separation of the chip from the substrate (i.e., "incomplete stripping"). Furthermore, the shifted laser may be excessively absorbed by the chip's light-emitting layer or the substrate, leading to chip damage (such as burnt light-emitting layer) or substrate cracking, directly reducing the yield.

[0008] To achieve the above objectives, the present invention provides the following technical solution: a Micro LED chip stripping device, comprising a stripping device body, a placement platform and a laser emitting head, the laser emitting head being located above the placement platform; it also includes a laser, the laser being located inside the laser emitting head, the laser having a pump source and a gain medium inside, and a total reflection mirror and an output mirror respectively disposed on both sides of the gain medium; The wavelength adjustment component is located outside the output mirror. The wavelength adjustment component detects whether the laser wavelength output by the output mirror is deviated, and adjusts the distance between the output mirror and the total reflection mirror when the laser wavelength is deviated. An industrial camera, located outside the laser emitter, detects the degree of chip stripping on the placement platform. The heat dissipation component is located outside the laser. It dissipates heat from the laser surface and accelerates the heat dissipation of the laser when the industrial camera detects that the chip is not completely peeled off. An alarm component is connected to a heat dissipation component. When the heat dissipation component repeatedly accelerates the heat dissipation rate of the laser, the alarm component issues a warning.

[0009] The wavelength adjustment component includes a piezoelectric ceramic connected to the output mirror. A fiber Bragg grating is installed inside the laser, and a microring resonator is located outside the fiber Bragg grating. The microring resonator is installed inside the laser, and the laser light passing through the output mirror enters the microring resonator after passing through the fiber Bragg grating.

[0010] The heat dissipation component includes a cooling pipe filled with coolant, which is spirally coiled around the outside of the laser. A miniature centrifugal pump is installed on the inner wall of the laser emitter and is connected to the cooling pipe. A cooling chamber is fixedly connected to the outside of the laser emitter, and cooling water is installed inside the cooling chamber. The cooling pipe passes through the cooling chamber, and a cooling component is installed on the outside of the cooling chamber to reduce the temperature of the cooling water inside.

[0011] The cooling component includes a storage tower containing a coolant. A connecting element is provided between the storage tower and the cooling chamber, and the connecting element is connected to an industrial camera. When the industrial camera detects that the chip is not completely stripped, the connecting element controls the connection between the storage tower and the cooling chamber.

[0012] The connecting component includes a connecting box with a through hole in its inner wall, which connects to the bottom of the storage tower and the top of the cooling chamber. A sliding plate is slidably connected to the inner wall of the connecting box, and a sealing plate is fixedly connected to the outer side of the sliding plate. A mating hole is provided on the surface of the sealing plate, which is slidably and sealingly connected to the inner wall of the connecting box. A connecting rod is fixedly connected to the end of the sliding plate away from the sealing plate, and an iron block is fixedly connected to the end of the connecting rod away from the sliding plate. An electromagnet is installed on the inner wall of the connecting box, and a controller is installed on the outer side of the electromagnet. The controller is connected to an industrial camera and the electromagnet.

[0013] The connecting rod is fitted with a return spring on its outer side. One end of the return spring is fixed to the sliding plate, and the other end of the return spring is fixed to the inner wall of the connecting box.

[0014] The alarm component includes a warning box fixedly connected to the top of the connecting box, a buzzer alarm fixedly connected to the top of the warning box, a limit switch installed on the inner wall of the warning box, the limit switch connected to the buzzer alarm, and a trigger on the inner wall of the warning box. Every time the iron block moves a preset number of times, the trigger triggers the limit switch once, and the limit switch controls the buzzer alarm to sound an alarm.

[0015] The triggering component includes a transmission screw that is rotatably connected to the inner wall of the warning box. A trigger plate is threadedly connected to the outer side of the transmission screw. A limit rod is fixedly connected to the inner wall of the warning box. The trigger plate is slidably connected to the limit rod. One end of the transmission screw passes through the warning box and is fixedly connected to a reset knob. The other end of the transmission screw is provided with a one-way transmission component, which is connected to an iron block.

[0016] The one-way transmission component includes a transmission gear fixedly connected to the end of the transmission screw away from the reset knob. A transmission gear ring is provided on the outside of the transmission gear. The transmission gear ring is rotatably connected to the inner wall of the warning box. A transmission rod is fixedly connected to the top of the iron block. The transmission rod is slidably connected to the inner wall of the connecting box. A toothed plate is fixedly connected to the top of the transmission rod. The toothed plate meshes with the transmission gear ring. Multiple silicone teeth are fixedly connected to the inner side of the transmission gear ring.

[0017] The silicone teeth are arranged in an arc shape, and the silicone teeth include a concave arc end and a convex arc end.

[0018] This invention has at least the following beneficial effects: 1. When this application is used, an industrial camera is used to capture images of the peeling area in real time to determine the chip peeling status. A wavelength adjustment component is used to assist in monitoring the laser wavelength. The two detection methods verify each other, reduce the false judgment rate of single detection, and assist staff in troubleshooting the causes of incomplete peeling.

[0019] 2. When the laser wavelength shifts, the wavelength adjustment component adjusts the distance between the total reflection mirror and the output mirror to stabilize the laser wavelength, ensuring that the laser energy accurately matches the absorption characteristics of the Micro LED interface layer. The heat dissipation component is connected to the industrial camera. When the industrial camera captures incomplete peeling, the heat dissipation component enhances the heat dissipation of the laser surface. The heat dissipation component adopts a two-stage heat dissipation structure of spiral cooling pipe and cooling chamber, combined with a controllable low-temperature coolant replenishment structure, to achieve dynamic adjustment of heat dissipation efficiency and stabilize the laser operating temperature in the optimal range of 25-35℃, avoiding wavelength shift caused by temperature drift.

[0020] 3. The alarm component adopts a mechanical counting alarm triggering mechanism. Each time the heat dissipation component enhances heat dissipation, it controls the mechanical counting structure of the alarm component to work once, so as to issue a timely warning when there are multiple abnormalities in the stripping and avoid continuous production of defective products. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the laser emitter head of the present invention. Figure 3 This is a side cross-sectional view of the laser emitter head of the present invention; Figure 4 This is a schematic diagram of the main cross-section of the laser of the present invention; Figure 5 This is a schematic diagram of the heat dissipation component structure of the present invention; Figure 6 This is a schematic diagram of the main sectional view of the communicating box of the present invention; Figure 7 This is a top sectional view of the warning box of the present invention; Figure 8 This is a schematic diagram of the reset knob structure of the present invention; Figure 9 This is a schematic diagram showing the connection relationship between the iron block and the toothed plate in this invention; Figure 10 This is a schematic diagram of the unidirectional transmission component of the present invention.

[0022] In the diagram: 1. Main body of the stripping equipment; 2. Placement platform; 3. Laser emitter; 4. Laser; 40. Pump source; 41. Gain medium; 42. Total reflection mirror; 43. Output mirror; 5. Wavelength adjustment component; 50. Piezoelectric ceramic; 51. Fiber Bragg grating; 52. Micro-ring resonator; 6. Industrial camera; 7. Heat dissipation component; 70. Cooling pipe; 71. Miniature centrifugal pump; 72. Cooling chamber; 73. Cooling component; 74. Storage tower; 75. Connecting component; 76. Connecting box; 77. Through hole; 78. Sliding plate; 79. Seal 710. Plate; 711. Docking hole; 712. Connecting rod; 713. Iron block; 714. Electromagnet; 715. Controller; 716. Return spring; 8. Alarm assembly; 80. Warning box; 81. Buzzer alarm; 82. Limit switch; 83. Trigger; 84. Drive screw; 85. Trigger plate; 86. Limit rod; 87. Reset knob; 88. One-way transmission component; 89. Transmission gear; 810. Transmission gear ring; 811. Transmission rod; 812. Gear plate; 813. Silicone tooth; 814. Concave arc end; 815. Protruding end. Detailed Implementation

[0023] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0024] Please see Figures 1 to 10 This invention provides a technical solution: a Micro LED chip stripping device, comprising a stripping device body 1, a placement platform 2, and a laser emitting head 3, the laser emitting head 3 being located above the placement platform 2; it also includes a laser 4, located inside the laser emitting head 3, the laser 4 containing a pump source 40 and a gain medium 41, the gain medium 41 being an Nd:YAG crystal, with a total reflection mirror 42 and an output mirror 43 respectively located on both sides of the gain medium 41; and a wavelength adjustment component 5, located outside the output mirror 43, the wavelength adjustment component 5 detecting whether the laser wavelength output by the output mirror 43 is deviated, and adjusting the wavelength accordingly. When the wavelength shifts, the distance between the output mirror 43 and the total reflection mirror 42 is adjusted; an industrial camera 6 is located outside the laser emitter 3, and the industrial camera 6 detects the degree of chip stripping on the placement platform 2; a heat dissipation component 7 is located outside the laser 4, and the heat dissipation component 7 dissipates heat from the surface of the laser 4, and when the industrial camera 6 detects that the chip stripping is incomplete, the heat dissipation component 7 accelerates the heat dissipation speed of the laser 4; an alarm component 8 is connected to the heat dissipation component 7, and when the heat dissipation component 7 repeatedly accelerates the heat dissipation speed of the laser 4, the alarm component 8 issues an alarm.

[0025] In use, the Micro LED wafer to be peeled is fixed through the vacuum adsorption hole of the placement platform 2, so that the wafer is located below the laser emitting head 3. When peeling begins, the pump source 40 inputs energy into the gain medium 41 (such as Nd:YAG crystal; the gain medium 41 of the commonly used ultraviolet laser for Micro LED peeling) to excite the medium particles to a high energy level. The high-energy particles produce a small number of spontaneous emission photons. These photons enter the resonant cavity composed of the total reflection mirror 42 and the output mirror 43. The photons reflect back and forth in the resonant cavity, continuously triggering stimulated emission (producing more photons of the same frequency and direction), and the light intensity is continuously amplified. When the light intensity reaches the "laser threshold", part of the light is emitted from the output mirror 43 to form a stable laser (such as Micro LED wafers). The 266nm ultraviolet laser required for LED peeling is emitted from the output mirror 43 and enters the wavelength adjustment component 5. The wavelength adjustment component 5 monitors the laser wavelength in real time. The laser after passing through the wavelength adjustment component 5 is finally output by the laser 4 to other areas of the laser emitting head 3. After being processed by the beam expander and galvanometer scanning system in the laser emitting head 3, the laser irradiates the wafer surface according to the preset path, realizing the peeling of the chip from the substrate.

[0026] At the start of the stripping process, the heat dissipation component 7 provides basic heat dissipation for the laser 4, and the industrial camera 6 captures images of the stripping area in real time. The industrial camera 6 includes an image capture module and an analysis module. The analysis module has a built-in processor to compare the photos captured by the industrial camera 6 with images in the image library to determine the chip stripping status. If the stripping is complete (no residue, no damage), the stripping equipment body 1 continues to strip according to the original parameters. If incomplete stripping is detected (such as chip residue), the processor built into the analysis module sends a signal to the heat dissipation component 7. The heat dissipation component 7 enhances the heat dissipation of the laser 4 surface. The heat dissipation component 7 adopts a two-stage heat dissipation structure of spiral cooling pipe 70 and cooling chamber 72, combined with a controllable low-temperature coolant replenishment structure, to achieve dynamic adjustment of heat dissipation efficiency and stabilize the laser 4 operating temperature in the optimal range of 25-35℃, avoiding wavelength shift caused by temperature drift. Furthermore, the wavelength adjustment component 5 also assists in monitoring the laser wavelength. The two detection methods verify each other, reducing the false judgment rate of single detection and assisting staff in troubleshooting the cause of incomplete peeling. If the industrial camera 6 detects poor peeling, but the wavelength adjustment component 5 shows that the wavelength is normal, it may be due to insufficient laser energy density or wafer problems. Staff can switch to adjusting the power of the pump source 40 instead of adjusting the wavelength to avoid blind operation. When the laser wavelength shifts, the wavelength adjustment component 5 adjusts the distance between the total reflection mirror 42 and the output mirror 43 to stabilize the laser wavelength and ensure that the laser energy is precisely matched to the absorption characteristics of the Micro LED interface layer. The alarm component 8 adopts a mechanical counting alarm triggering mechanism. Each time the heat dissipation component 7 enhances heat dissipation, it controls the mechanical counting structure of the alarm component 8 to work once, so as to issue a timely warning when there are multiple peeling abnormalities and avoid continuous production of defective products.

[0027] After the entire wafer is stripped, the laser emission automatically stops, and the heat dissipation component 7 continues to work for 5-10 minutes. Once the temperature of the laser 4 drops to near room temperature, it automatically shuts off, completing the entire stripping process.

[0028] The wavelength adjustment component 5 includes a piezoelectric ceramic 50, which is connected to the output mirror 43. A fiber Bragg grating 51 is installed inside the laser 4. A micro-ring resonator 52 is provided on the outside of the fiber Bragg grating 51. The micro-ring resonator 52 is installed inside the laser 4. The laser light passing through the output mirror 43 enters the micro-ring resonator 52 after passing through the fiber Bragg grating 51.

[0029] The piezoelectric ceramic 50, fiber Bragg grating 51, and microring resonator 52 are all commercially available mature devices. The piezoelectric ceramic 50 can realize the mutual conversion between electrical energy and mechanical energy. When a voltage is applied to it, its shape will undergo minute and precise elongation or contraction. The fiber Bragg grating 51 achieves the screening and monitoring of light of specific wavelengths through Bragg reflection. The microring resonator 52 achieves high-precision wavelength screening and modulation through resonance effect.

[0030] When the pump source 40 operates for an extended period and generates heat, the heat is conducted to the gain medium 41 and the resonant cavity. The resonant cavity consists of a total reflection mirror 42 and an output mirror 43, which causes the gain medium 41 to expand and contract due to thermal changes (changing the refractive index n) and the distance between the total reflection mirror 42 and the output mirror 43 (cavity length L) to increase slightly. According to the laser wavelength formula: λ = 2nL / m (m is the order of the longitudinal mode, which is fixed). λ "redshifts" (wavelength increases) as n and L increase, exceeding the material's "strong absorption window" (such as 265-267nm for GaN).

[0031] The laser output from the output mirror 43 first enters the fiber Bragg grating 51. The fiber Bragg grating 51 only reflects laser light close to the target wavelength, eliminating stray light with excessive deviation. That is, the fiber Bragg grating 51 performs coarse screening on the laser output from the output mirror 43. The laser light reflected by the fiber Bragg grating 51 enters the subsequent micro-ring resonator 52. If the laser wavelength has deviated, the resonance condition of the micro-ring in the micro-ring resonator 52 is not met, resulting in a significant decrease in the light intensity output by the micro-ring. The photodetector in the micro-ring resonator 52 converts the light intensity change into an electrical signal. The micro-ring resonator 52 is connected to the controller 714 of the piezoelectric ceramic 50. The micro-ring resonator 52 outputs an electrical signal to the piezoelectric ceramic 50. Since the piezoelectric ceramic 50 is integrated on the output mirror 43, the controller 714 of the piezoelectric ceramic 50 applies a voltage to the piezoelectric ceramic 50. The piezoelectric ceramic 50 deforms along the axial direction, causing the output mirror 43 to move towards the total reflection mirror 42. The length L of the resonant cavity decreases accordingly. After L decreases, the laser wavelength λ in the resonant cavity is lowered (according to the above laser wavelength formula). The micro-ring resonator 52 monitors again. If λ returns to the target accuracy, the adjustment stops. If there is still a slight deviation, repeat the above steps until the wavelength is stable.

[0032] The heat dissipation assembly 7 includes a cooling pipe 70 filled with a 50% ethylene glycol aqueous solution. The cooling pipe 70 is spirally coiled around the outside of the laser 4. A miniature centrifugal pump 71 is installed on the inner wall of the laser emitter head 3 and is connected to the cooling pipe 70. A cooling chamber 72 is fixedly connected to the outside of the laser emitter head 3. Cooling water is installed in the cooling chamber 72. The cooling pipe 70 passes through the cooling chamber 72. A cooling component 73 is provided on the outside of the cooling chamber 72 to reduce the temperature of the cooling water inside the cooling chamber 72.

[0033] When the main body 1 of the stripping equipment is working normally, the micro centrifugal pump 71 drives the coolant to flow in the cooling pipe 70. The cooling pipe 70 is spirally coiled around the outside of the laser 4, thereby providing basic heat dissipation for the laser 4. When the coolant flows over the surface of the laser 4, it absorbs the heat from the surface of the laser 4 through heat exchange, thereby reducing the operating temperature of the laser 4. The coolant flowing over the surface of the laser 4 will pass through the cooling chamber 72, where the cooling water in the cooling chamber 72 will exchange heat with the coolant, thereby reducing the temperature of the coolant in the cooling pipe 70.

[0034] When the industrial camera 6 detects that the chip is not completely removed, the cooling component 73 actively cools the cooling chamber 72 once, thereby reducing the temperature of the cooling water in the cooling chamber 72, improving the cooling efficiency of the coolant in the cooling pipe 70, accelerating the heat dissipation of the laser 4, and causing the temperature to drop back to the optimal range quickly. Furthermore, the cooling component 73 will actively cool the cooling chamber 72 once every time the industrial camera 6 detects that the chip is not completely removed.

[0035] The cooling component 73 includes a storage tower 74, which contains a coolant. The coolant is ammonium nitrate granules. During the dissolution of solid ammonium nitrate with water, ammonium nitrate absorbs heat from the water, causing a significant drop in solution temperature. This is a common endothermic phenomenon and is often used in instant ice packs or coolants. A connecting component 75 is provided between the storage tower 74 and the cooling chamber 72. The connecting component 75 is connected to the industrial camera 6. When the industrial camera 6 detects incomplete chip stripping, the connecting component 75 controls the connection between the storage tower 74 and the cooling chamber 72.

[0036] When the industrial camera 6 detects that the chip is not completely stripped, the connector 75 controls the connection between the storage tower 74 and the cooling chamber 72 for a fixed duration, so that the coolant in the storage tower 74 falls along the channel between the storage tower 74 and the cooling chamber 72. After entering the cooling chamber 72, the coolant dissolves in the water, thereby reducing the temperature of the cooling water. Since the connector 75 controls the connection between the storage tower 74 and the cooling chamber 72 for the same duration each time, the coolant entering the cooling chamber 72 is also basically the same.

[0037] The connecting component 75 includes a connecting box 76. The inner wall of the connecting box 76 has a through hole 77, which communicates with the bottom of the storage tower 74 and the top of the cooling chamber 72. A sliding plate 78 is slidably connected to the inner wall of the connecting box 76. A sealing plate 79 is fixedly connected to the outer side of the sliding plate 78. A mating hole 710 is opened on the surface of the sealing plate 79. The sealing plate 79 is slidably and sealingly connected to the inner wall of the connecting box 76. A connecting rod 711 is fixedly connected to the end of the sliding plate 78 away from the sealing plate 79. An iron block 712 is fixedly connected to the end of the connecting rod 711 away from the sliding plate 78. An electromagnet 713 is installed on the inner wall of the connecting box 76. A controller 714 is installed on the outer side of the electromagnet 713. The controller 714 is connected to the industrial camera 6 and the electromagnet 713. A return spring 715 is sleeved on the outer side of the connecting rod 711. One end of the return spring 715 is fixed to the sliding plate 78, and the other end of the return spring 715 is fixed to the inner wall of the connecting box 76.

[0038] When the industrial camera 6 captures images of incomplete chip stripping, the processor inside the industrial camera 6 sends a signal to the controller 714. The controller 714 controls the electromagnet 713 to be energized. The energized electromagnet 713 generates a magnetic force that attracts the iron block 712. The iron block 712 drives the connecting rod 711 to move. The connecting rod 711 and the sliding plate 78 move. The sliding plate 78 moves and compresses the reset spring 715. At the same time, the sealing plate 79 moves with the sliding plate 78, aligning the docking hole 710 with the through hole 77. The coolant in the storage tower 74 flows into the cooling chamber 72.

[0039] The controller 714 controls the electromagnet 713 to be energized for a fixed duration each time. After the electromagnet 713 is energized for the preset duration, the electromagnet 713 is de-energized, the reset spring 715 pushes the sliding plate 78 to reset, and the sliding plate 78 drives the sealing plate 79 to reset, so that the sealing plate 79 blocks the through hole 77 and stops the coolant injection.

[0040] The alarm component 8 includes an alarm box 80 fixedly connected to the top of the connecting box 76. A buzzer alarm 81 is fixedly connected to the top of the alarm box 80. A limit switch 82 is installed on the inner wall of the alarm box 80. The limit switch 82 is connected to the buzzer alarm 81. A trigger 83 is provided on the inner wall of the alarm box 80. Every time the iron block 712 moves a preset number of times, the trigger 83 triggers the limit switch 82 once. The limit switch 82 controls the buzzer alarm 81 to sound an alarm.

[0041] The trigger 83 includes a transmission screw 84 rotatably connected to the inner wall of the warning box 80. A trigger plate 85 is threadedly connected to the outer side of the transmission screw 84. A limit rod 86 is fixedly connected to the inner wall of the warning box 80. The trigger plate 85 is slidably connected to the limit rod 86. One end of the transmission screw 84 extends out of the warning box 80 and is fixedly connected to a reset knob 87. The other end of the transmission screw 84 is provided with a one-way transmission component 88, which is connected to the iron block 712.

[0042] The one-way transmission component 88 includes a transmission gear 89 fixedly connected to the end of the transmission screw 84 away from the reset knob 87. A transmission gear ring 810 is provided on the outer side of the transmission gear 89. The transmission gear ring 810 is rotatably connected to the inner wall of the warning box 80. A transmission rod 811 is fixedly connected to the top of the iron block 712. The transmission rod 811 is slidably connected to the inner wall of the connecting box 76. A toothed plate 812 is fixedly connected to the top of the transmission rod 811. The toothed plate 812 meshes with the transmission gear ring 810. Multiple silicone teeth 813 are fixedly connected to the inner side of the transmission gear ring 810. The silicone teeth 813 are arc-shaped and include a concave arc end 814 and a convex end 815.

[0043] Each time the iron block 712 approaches the electromagnet 713, the iron block 712 drives the transmission rod 811 to move, the transmission rod 811 drives the toothed plate 812 to move, and the toothed plate 812 drives the transmission gear ring 810 to rotate; the concave arc end 814 of the silicone tooth 813 on the inner side of the transmission gear ring 810 engages with the tooth groove of the transmission gear 89, thereby hooking the transmission gear 89 to rotate, the transmission gear 89 drives the transmission screw 84 to rotate, causing the trigger plate 85 to move along the limit rod 86 towards the limit switch 82.

[0044] When the electromagnet 713 is de-energized, the return spring 715 pulls the iron block 712 to reset. The iron block 712 drives the transmission rod 811 to reset, and the transmission rod 811 drives the toothed plate 812 to reset. The toothed plate 812 drives the transmission gear ring 810 to rotate in the opposite direction, so that the protruding end 815 of the silicone tooth 813 on the inner side of the transmission gear ring 810 abuts against the tooth groove of the transmission gear 89. The squeezing force between the protruding end 815 and the tooth groove of the transmission gear 89 causes the protruding end 815 to deform, so that the transmission gear ring 810 cannot drive the transmission gear 89 to reverse when it reverses.

[0045] Thus, each time the electromagnet 713 is energized and de-energized, the trigger plate 85 moves a fixed distance along the limit rod 86 toward the limit switch 82. When the electromagnet 713 is energized and de-energized multiple times, the trigger plate 85 triggers the limit switch 82, which closes. The buzzer alarm 81 sounds an alarm, reminding the staff that multiple instances of incomplete chip removal have occurred during this chip removal process. The staff needs to stop the machine to troubleshoot the fault and avoid continuous production of defective products. After the operator has dealt with the fault, they rotate the reset knob 87 to reverse the rotation of the transmission screw 84, reset the trigger plate 85, and clear the alarm.

[0046] When the transmission screw 84 rotates in the reverse direction, the transmission screw 84 drives the transmission gear 89 to rotate in the reverse direction. Since the silicone teeth 813 on the inner side of the transmission gear ring 810 are made of silicone and have good flexibility, the squeezing force between the tooth groove of the transmission gear 89 and the silicone teeth 813 causes the transmission gear 89 to rotate relative to each other inside the transmission gear ring 810.

[0047] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0048] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A Micro LED chip stripping device, comprising: The main body of the equipment, the placement platform, and the laser emitting head are separated, with the laser emitting head located above the placement platform; Its features include: a laser, which is located inside a laser emitting head, and the laser has a pump source and a gain medium inside, with a total reflection mirror and an output mirror respectively on both sides of the gain medium; A wavelength adjustment component is located outside the output mirror. The wavelength adjustment component detects whether the laser wavelength output by the output mirror is deviated, and adjusts the distance between the output mirror and the total reflection mirror when the laser wavelength is deviated. An industrial camera, located outside the laser emitter, is used to detect the degree of chip stripping on the placement platform. A heat dissipation component is located outside the laser. The heat dissipation component dissipates heat from the surface of the laser and accelerates the heat dissipation speed of the laser when the industrial camera detects that the chip is not completely peeled off. An alarm component is connected to a heat dissipation component, which issues an alarm when the heat dissipation component repeatedly accelerates the heat dissipation rate of the laser.

2. The Micro LED chip stripping device according to claim 1, characterized in that: The wavelength adjustment component includes a piezoelectric ceramic connected to the output mirror. A fiber Bragg grating is installed inside the laser, and a microring resonator is provided on the outside of the fiber Bragg grating. The microring resonator is installed inside the laser, and the laser light passing through the output mirror enters the microring resonator after passing through the fiber Bragg grating.

3. The Micro LED chip stripping device according to claim 1, characterized in that: The heat dissipation assembly includes a cooling pipe filled with coolant. The cooling pipe is spirally coiled around the outside of the laser. A miniature centrifugal pump is installed on the inner wall of the laser emitter and is connected to the cooling pipe. A cooling chamber is fixedly connected to the outside of the laser emitter and contains cooling water. The cooling pipe passes through the cooling chamber. A cooling component is provided on the outside of the cooling chamber to reduce the temperature of the cooling water inside the cooling chamber.

4. The Micro LED chip stripping device according to claim 3, characterized in that: The cooling component includes a storage tower containing a coolant. A connecting element is provided between the storage tower and the cooling chamber, and the connecting element is connected to an industrial camera. When the industrial camera detects that the chip is not completely stripped, the connecting element controls the connection between the storage tower and the cooling chamber.

5. The Micro LED chip stripping device according to claim 4, characterized in that: The connecting component includes a connecting box with a through hole in its inner wall, which communicates with the bottom of the storage tower and the top of the cooling chamber. A sliding plate is slidably connected to the inner wall of the connecting box, and a sealing plate is fixedly connected to the outer side of the sliding plate. A mating hole is provided on the surface of the sealing plate, which is slidably and sealingly connected to the inner wall of the connecting box. A connecting rod is fixedly connected to the end of the sliding plate away from the sealing plate, and an iron block is fixedly connected to the end of the connecting rod away from the sliding plate. An electromagnet is installed on the inner wall of the connecting box, and a controller is installed on the outer side of the electromagnet. The controller is connected to an industrial camera and the electromagnet.

6. The Micro LED chip stripping device according to claim 5, characterized in that: A reset spring is sleeved on the outside of the connecting rod. One end of the reset spring is fixed to the sliding plate, and the other end of the reset spring is fixed to the inner wall of the connecting box.

7. The Micro LED chip stripping device according to claim 5, characterized in that: The alarm assembly includes a warning box fixedly connected to the top of the connecting box, a buzzer alarm fixedly connected to the top of the warning box, a limit switch installed on the inner wall of the warning box, the limit switch being connected to the buzzer alarm, and a trigger element provided on the inner wall of the warning box. Every time the iron block moves a preset number of times, the trigger element triggers the limit switch once, and the limit switch controls the buzzer alarm to sound an alarm.

8. The Micro LED chip stripping device according to claim 7, characterized in that: The triggering element includes a transmission screw rotatably connected to the inner wall of the warning box, a trigger plate threadedly connected to the outer side of the transmission screw, a limit rod fixedly connected to the inner wall of the warning box, the trigger plate slidably connected to the limit rod, one end of the transmission screw passing through the warning box and fixedly connected to a reset knob, and the other end of the transmission screw being provided with a one-way transmission component, which is connected to an iron block.

9. The Micro LED chip stripping device according to claim 8, characterized in that: The one-way transmission component includes a transmission gear fixedly connected to the end of the transmission screw away from the reset knob. A transmission gear ring is provided on the outer side of the transmission gear. The transmission gear ring is rotatably connected to the inner wall of the warning box. A transmission rod is fixedly connected to the top of the iron block. The transmission rod is slidably connected to the inner wall of the connecting box. A toothed plate is fixedly connected to the top of the transmission rod. The toothed plate meshes with the transmission gear ring. Multiple silicone teeth are fixedly connected to the inner side of the transmission gear ring.

10. The Micro LED chip stripping device according to claim 9, characterized in that: The silicone teeth are arranged in an arc shape, and the silicone teeth include a concave arc end and a convex end.

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