Surface profile detection method and device, electronic equipment and storage medium

Abstract

Embodiments of the present application provide a surface profile detection method and device, electronic equipment and storage medium, which belong to the field of precision measurement. The method is applied to a surface profile detection system, which comprises a light source module, a beam splitter for beam splitting processing of a laser beam emitted by the light source module, a beam compensation module for beam compensation of a reference beam and projection to a reference mirror, a beam deflection module for beam deflection of a sample beam and projection to a device to be measured, and a spectrometer for interference signal generation of the reflected sample beam and the reference beam. The method comprises peak value detection of a plurality of wave peaks of the interference signal to obtain wavelength parameters of each wave peak, interval detection of wavelength parameters corresponding to any two adjacent wave peaks to obtain a plurality of wavelength intervals, and depth mapping of the plurality of wavelength intervals to obtain surface profile information of the device to be measured. The embodiments of the present application can improve the efficiency and accuracy of surface profile detection.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of precision measurement, and particularly relates to a surface profile detection method and device, an electronic device and a storage medium. BACKGROUND

[0002] With the rapid development of science and technology, high-precision devices have become a key component of modern industry and are widely used in many key fields such as semiconductor manufacturing, optical element processing and micro-electro-mechanical systems. For example, in semiconductor manufacturing, the flatness and microstructure of the wafer surface need to reach nanometer-level precision for the manufacturing of high-performance chips.

[0003] At present, in the process of manufacturing high-precision devices, such as high-precision optical instruments, the device needs to be adjusted step by step according to the profile information of the surface of the device, so that the manufactured device meets the expected precision requirement. Therefore, real-time surface profile detection of the device is needed to optimize the manufacturing process of the high-precision device according to the detected surface profile information.

[0004] However, the efficiency and accuracy of the surface profile detection in the prior art are low. SUMMARY

[0005] The main purpose of the embodiments of the present application is to provide a surface profile detection method and device, an electronic device and a storage medium, which aims to improve the efficiency and accuracy of surface profile detection.

[0006] To achieve the above purpose, a first aspect of the embodiments of the present application provides a surface profile detection method, which is applied to a surface profile detection system, the surface profile detection system comprising a light source module, a beam splitter, a beam compensation module, a beam deflection module, a spectrometer and a reference mirror; wherein the light source module is configured to emit a laser beam; the beam splitter is coupled to the light source module and configured to split the laser beam to obtain a reference beam and a sample beam; the beam compensation module is coupled to the beam splitter and configured to compensate the reference beam and project the compensated reference beam to the reference mirror; the beam deflection module is coupled to the beam splitter and configured to deflect the sample beam and project the deflected sample beam to a device to be measured; and the spectrometer is coupled to the beam splitter and configured to receive the reference beam reflected by the reference mirror and the sample beam reflected by the device to be measured, and generate an interference signal based on the received reference beam and sample beam.

[0007] The surface profile detection method comprises the following steps:

[0008] obtaining an interference signal generated by the spectrometer, wherein the interference signal comprises a plurality of wave peaks.

[0009] performing peak detection on the plurality of wave crests to obtain a wavelength parameter corresponding to each of the wave crests;

[0010] performing interval detection on the wavelength parameters corresponding to any two adjacent wave crests to obtain a plurality of wavelength intervals;

[0011] performing depth mapping on the plurality of wavelength intervals to obtain surface profile information of the device under test.

[0012] In some embodiments, the performing interval detection on the wavelength parameters corresponding to any two adjacent wave crests to obtain a plurality of wavelength intervals comprises:

[0013] for each of the wave crests, determining the wavelength parameter corresponding to the wave crest as a first wavelength parameter, and determining the wavelength parameter corresponding to the wave crest adjacent to the wave crest as a second wavelength parameter;

[0014] determining a difference between the second wavelength parameter and the first wavelength parameter as a wavelength interval between the wave crest and the wave crest adjacent to the wave crest.

[0015] In some embodiments, the performing depth mapping on the plurality of wavelength intervals to obtain surface profile information of the device under test comprises:

[0016] for each of the wavelength intervals, obtaining the first wavelength parameter and the second wavelength parameter used to determine the wavelength interval, and determining a product of the first wavelength parameter and the second wavelength parameter as a wavelength characteristic value of the wavelength interval;

[0017] for each of the wavelength intervals, performing parameter adjustment on the wavelength interval according to the wavelength characteristic value to obtain an optical path difference value corresponding to the wavelength interval;

[0018] performing depth mapping on the optical path difference values corresponding to the plurality of wavelength intervals to obtain surface profile information of the device under test.

[0019] In some embodiments, the performing peak detection on the plurality of wave crests to obtain a wavelength parameter corresponding to each of the wave crests comprises:

[0020] for each of the wave crests, performing interpolation processing on the wave crest to obtain an interpolated fitting wave crest;

[0021] performing peak detection on the interpolated fitting wave crest to obtain a wavelength parameter corresponding to the interpolated fitting wave crest.

[0022] In some embodiments, the light beam deflection module comprises:

[0023] A first collimator, coupled to the beam splitter, is used to collimate the sample beam.

[0024] A galvanometer module, which is coupled to the first collimator, is used to deflect the sample beam that has been collimated according to a preset deflection focal length and the focal position parameters of the device under test.

[0025] The first focusing module, coupled to the galvanometer module, is used to focus the deflected sample beam and project the focused sample beam onto the device under test.

[0026] In some embodiments, the spectrometer includes:

[0027] The second collimator, coupled to the beam splitter, is used to receive the reference beam reflected back from the reference mirror and the sample beam reflected back from the device under test, and to collimate the reflected reference beam and the reflected sample beam.

[0028] A diffraction grating, coupled to the second collimator, is used to perform spatial dispersion processing on the collimated sample beam and the collimated reference beam;

[0029] The second focusing module is coupled to the diffraction grating and is used to focus the sample beam and the reference beam that have undergone spatial dispersion processing.

[0030] A linear array detector, coupled to the second focusing module, is used to generate interference signals for the focused sample beam and the focused reference beam.

[0031] In some embodiments, the beam compensation module includes:

[0032] A third collimator, coupled to the beam splitter, is used to collimate the reference beam.

[0033] A beam compensator, which is coupled to the third collimator, is used to perform beam compensation on the reference beam for collimation processing.

[0034] The third focusing module, coupled to the beam compensator, is used to focus the beam-compensated reference beam and project the focused reference beam onto the reference mirror.

[0035] To achieve the above objectives, a second aspect of this application provides a surface profile detection device applied to a surface profile detection system. The surface profile detection system includes a light source module, a beam splitter, a beam compensation module, a beam deflection module, a spectrometer, and a reference mirror. The light source module emits a laser beam. The beam splitter is coupled to the light source module and splits the laser beam to obtain a reference beam and a sample beam. The beam compensation module is coupled to the beam splitter and compensates the reference beam, projecting the compensated reference beam onto the reference mirror. The beam deflection module is coupled to the beam splitter and deflects the sample beam, projecting the deflected sample beam onto the device under test (DUT). The spectrometer is coupled to the beam splitter and receives the reference beam reflected from the reference mirror and the sample beam reflected from the DUT, generating an interference signal between the reflected reference beam and the reflected sample beam.

[0036] The surface contour detection device includes:

[0037] A signal acquisition unit is used to acquire the interference signal generated by the spectrometer, the interference signal including multiple peaks;

[0038] A peak detection unit is used to perform peak detection on the plurality of peaks to obtain the wavelength parameter corresponding to each peak.

[0039] The spacing detection unit is used to detect the spacing between the wavelength parameters corresponding to any two adjacent wave peaks to obtain multiple wavelength spacings.

[0040] A depth mapping unit is used to perform depth mapping on the multiple wavelength spacings to obtain the surface contour information of the device under test.

[0041] To achieve the above objectives, a third aspect of this application provides an electronic device, which includes a memory and a processor. The memory stores a computer program, and the processor executes the computer program to implement the method described in the first aspect.

[0042] To achieve the above objectives, a fourth aspect of the present application provides a computer-readable storage medium storing a computer program that, when executed by a processor, implements the method described in the first aspect.

[0043] The surface profile detection method, apparatus, electronic device, and storage medium proposed in this application are applied to a surface profile detection system. This system includes a light source module, a beam splitter, a beam compensation module, a beam deflection module, a spectrometer, and a reference mirror. The light source module emits a laser beam. The beam splitter is coupled to the light source module and is used to split the laser beam to obtain a reference beam and a sample beam. The beam compensation module is coupled to the beam splitter and is used to compensate the reference beam and project the compensated reference beam onto the reference mirror. The beam deflection module is coupled to the beam splitter and is used to deflect the sample beam and project the deflected sample beam onto the device under test. The spectrometer is coupled to the beam splitter and is used to receive the reference beam reflected back from the reference mirror and the sample beam reflected back from the device under test, and to generate an interference signal from the reflected reference beam and the reflected sample beam. This method acquires an interference signal generated by a spectrometer, which includes multiple peaks; then, it performs peak detection on the multiple peaks to obtain the wavelength parameter corresponding to each peak; further, it performs spacing detection on the wavelength parameters corresponding to any two adjacent peaks to obtain multiple wavelength spacings; finally, it performs depth mapping on the multiple wavelength spacings to obtain the surface contour information of the device under test.

[0044] This application constructs a surface profile detection system comprising a light source module, a beam splitter, a beam compensation module, a beam deflection module, a spectrometer, and a reference mirror. The beam splitter divides the laser beam emitted by the light source module into a reference beam and a sample beam. The beam deflection module then deflects the sample beam onto the surface of the device under test (DUT). The beam compensation module projects the compensated reference beam onto the reference mirror. The spectrometer generates an interference signal based on the reflected sample beam and the reflected reference beam. Furthermore, peak detection is performed on multiple peaks in the interference signal, and the wavelength spacing between any two adjacent peaks is detected. Finally, depth mapping is performed on the detected wavelength spacings to obtain the surface profile information of the DUT. This allows for the acquisition of the wavelength parameters corresponding to peaks and the wavelength spacing between adjacent peaks through simple extreme value detection, reducing algorithm complexity. By establishing a depth mapping relationship between wavelength spacing and surface profile information, detection errors caused by spectral leakage risk are reduced. Therefore, this application can improve the efficiency and accuracy of surface profile detection. Attached Figure Description

[0045] Figure 1 This is a flowchart of a surface contour detection method provided in an embodiment of this application;

[0046] Figure 2 This is a schematic diagram of a surface contour detection system provided in an embodiment of this application;

[0047] Figure 3 This is a schematic diagram of the beam deflection module provided in an embodiment of this application;

[0048] Figure 4 This is a schematic diagram of the structure of a spectrometer provided in an embodiment of this application;

[0049] Figure 5 This is a schematic diagram of the beam compensation module provided in an embodiment of this application;

[0050] Figure 6 This is another structural schematic diagram of the surface contour detection system provided in the embodiments of this application;

[0051] Figure 7 This is a schematic diagram illustrating the composition of the interference signal provided in an embodiment of this application;

[0052] Figure 8 This is a spectral domain oscillation mode diagram of the interference signal provided in the embodiments of this application;

[0053] Figure 9 This is a flowchart of obtaining the surface contour information of the device under test provided in an embodiment of this application;

[0054] Figure 10 This is a schematic diagram of the surface contour detection device provided in an embodiment of this application;

[0055] Figure 11 This is a schematic diagram of the hardware structure of an electronic device provided in an embodiment of this application. Detailed Implementation

[0056] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0057] It should be noted that although functional modules are divided in the device schematic diagram and a logical order is shown in the flowchart, in some cases, the steps shown or described may be performed in a different order than the module division in the device or the order in the flowchart. The terms "first," "second," etc., in the specification, claims, and the aforementioned drawings are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0058] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing embodiments of this application only and is not intended to limit this application.

[0059] The widespread application of surface profile detection methods has provided crucial support for improving the production efficiency and quality control of high-precision devices, significantly enhancing the manufacturing efficiency and reliability of these devices. However, existing surface profile detection methods still have significant shortcomings in practical applications. For example, current technologies typically employ laser interferometers (such as Michelson and Fizeau types) to perform laser scanning on the device under test (DUT) to obtain its surface profile information. However, this method relies on the mechanical translation of a reference mirror to adjust the optical path difference, and the mechanical hysteresis limits the scanning speed, reducing surface profile detection efficiency. Furthermore, this method suffers from phase drift due to environmental vibrations, requiring complex algorithms for compensation, leading to high costs. Alternatively, related technologies also employ white light interferometry to obtain the surface profile information of the DUT. Although this method can achieve sub-nanometer vertical resolution, the lateral resolution is limited by the numerical aperture (NA) of the objective lens, affecting the accuracy of surface profile detection and making it impossible to detect sub-micron level defects (such as EUV photoresist residue). Moreover, this method is not suitable for multilayer measurements of transparent thin films. Alternatively, related technologies employ confocal microscopy to acquire the surface contour information of the device under test. However, this method is based on point scanning, resulting in slow imaging speed and difficulty in meeting online inspection requirements. In the semiconductor manufacturing field, related technologies also use contact probes (such as profilometers) to measure the wafer surface to obtain its contour information. However, this method, being contact-based, carries the risk of scratching the thin film, and its inspection speed is also relatively slow.

[0060] Furthermore, existing technologies have disclosed a piezoelectric ceramic micro-displacement actuator and its surface interferometer. This method uses piezoelectric ceramics (PZT) to drive the mechanical displacement of a reference mirror, thereby changing the optical path difference and detecting the surface contour information of the device under test (DUT). This is a contact-type mechanical adjustment. However, this method suffers from electromechanical coupling nonlinearities (such as hysteresis and creep), affecting the accuracy of DUT detection. Additionally, the mechanical inertia of PZT may lead to a decrease in response frequency, introducing displacement hysteresis errors during high-speed scanning, requiring closed-loop feedback compensation. This necessitates the integration of the PZT actuator, displacement sensor, and feedback circuit, significantly increasing system complexity and cost. Existing technologies also disclose a multi-wavelength interferometry method for defect classification, employing a synthetic wavelength unwrapping technique using a multi-wavelength light source module. Phase ambiguity is eliminated through interference fringes of different wavelengths, making it suitable for measuring large step heights. However, this method requires multiple exposures to obtain multi-wavelength interferograms, leading to complex data processing (such as the need for Fourier transform demodulation). Furthermore, while multi-wavelength light sources offer advantages in penetrating power for transparent thin films and multilayer structures, they are susceptible to medium dispersion. Meanwhile, this method also requires complex algorithms such as multi-wavelength phase unwrapping and dispersion compensation, which greatly increases the consumption of computational resources. Based on this, embodiments of this application provide a surface contour detection method and apparatus, electronic device, and storage medium, aiming to improve the efficiency and accuracy of surface contour detection.

[0061] The surface contour detection method provided in this application relates to the field of precision measurement technology. The surface contour detection method provided in this application can be applied to a terminal, a server, or software running on either a terminal or a server. In some embodiments, the terminal can be a smartphone, tablet, laptop, desktop computer, etc.; the server can be configured as an independent physical server, a server cluster or distributed system composed of multiple physical servers, or a cloud server providing basic cloud computing services such as cloud services, cloud databases, cloud computing, cloud functions, cloud storage, network services, cloud communication, middleware services, domain name services, security services, CDN, and big data and artificial intelligence platforms; the software can be an application implementing the surface contour detection method, but is not limited to the above forms.

[0062] This application can be used in a wide variety of general-purpose or special-purpose computer system environments or configurations. Examples include: personal computers, server computers, handheld or portable devices, tablet devices, multiprocessor systems, microprocessor-based systems, set-top boxes, programmable consumer electronics, network PCs, minicomputers, mainframe computers, and distributed computing environments including any of the above systems or devices. This application can be described in the general context of computer-executable instructions executed by a computer, such as program modules. Generally, program modules include routines, programs, objects, components, data structures, etc., that perform specific tasks or implement specific abstract data types. This application can also be practiced in distributed computing environments where tasks are performed by remote processing devices connected via a communication network. In distributed computing environments, program modules can reside in local and remote computer storage media, including storage devices.

[0063] Figure 1 This is an optional flowchart of the surface contour detection method provided in the embodiments of this application. Figure 1 The method described above is applied to a surface profile detection system, which includes a light source module, a beam splitter, a beam compensation module, a beam deflection module, a spectrometer, and a reference mirror. The light source module emits a laser beam. The beam splitter, coupled to the light source module, splits the laser beam to obtain a reference beam and a sample beam. The beam compensation module, coupled to the beam splitter, compensates for the reference beam and projects the compensated reference beam onto the reference mirror. The beam deflection module, coupled to the beam splitter, deflects the sample beam and projects the deflected sample beam onto the device under test (DUT). The spectrometer, coupled to the beam splitter, receives the reference beam reflected from the reference mirror and the sample beam reflected from the DUT, and generates interference signals from the reflected reference beam and the reflected sample beam. Figure 1 The method may include, but is not limited to, steps S101 to S104:

[0064] Step S101: Obtain the interference signal generated by the spectrometer. The interference signal includes multiple peaks.

[0065] Step S102: Perform peak detection on multiple peaks to obtain the wavelength parameters corresponding to each peak;

[0066] Step S103: Detect the spacing between the wavelength parameters corresponding to any two adjacent wave peaks to obtain multiple wavelength spacings;

[0067] Step S104: Perform depth mapping on multiple wavelength spacings to obtain the surface contour information of the device under test.

[0068] Steps S101 to S104 of this embodiment involve constructing a surface profile detection system including a light source module, a beam splitter, a beam compensation module, a beam deflection module, a spectrometer, and a reference mirror. The beam splitter divides the laser beam emitted by the light source module into a reference beam and a sample beam. The beam deflection module then deflects the sample beam onto the surface of the device under test (DUT). The beam compensation module projects the compensated reference beam onto the reference mirror. The spectrometer generates an interference signal based on the reflected sample beam and the reflected reference beam. Further, peak detection is performed on the multiple peaks in the interference signal, and the wavelength spacing between any two adjacent peaks is detected. Finally, depth mapping is performed on the detected wavelength spacings to obtain the surface profile information of the DUT. This allows for the acquisition of the wavelength parameters corresponding to peaks and the wavelength spacing between adjacent peaks through simple extreme value detection, reducing algorithm complexity. Furthermore, by establishing a depth mapping relationship between wavelength spacing and surface profile information, detection errors caused by spectral leakage risk are reduced. Therefore, this application can improve the efficiency and accuracy of surface profile detection.

[0069] In step S101 of some embodiments, the interference signal refers to an optical signal generated by a spectrometer that contains multiple peaks. A peak can refer to the location where the intensity or amplitude of the signal in the interference signal reaches a maximum value.

[0070] It should be noted that you should refer to [link / reference]. Figure 2 , Figure 2 This is a schematic diagram of a surface contour detection system provided in an embodiment of this application. Figure 2 As shown, the surface profile detection system includes a light source module, a beam splitter, a beam compensation module, a beam deflection module, a spectrometer, and a reference mirror. The light source module can be the component in the surface profile detection system used to emit a laser beam. For example, the light source module can be a semiconductor laser or a solid-state laser, without specific limitations. The beam splitter is coupled to the light source module and can refer to the component in the surface profile detection system used to split the laser beam emitted by the light source module into a reference beam and a sample beam. For example, the beam splitter can be a polarizing beam splitter prism or a non-polarizing beam splitter prism, without specific limitations. The reference beam can refer to the beam used to provide an optical reference signal; the sample beam can refer to the beam projected onto the surface of the device under test. It is understood that since the reference beam and sample beam are obtained by splitting a single laser beam, they have the same wavelength and phase relationship and maintain high coherence.

[0071] The beam compensation module is coupled to the beam splitter. In a surface profile detection system, the beam compensation module is a component used to compensate for the reference beam and project the compensated reference beam onto a reference mirror. Beam compensation refers to adjusting the optical path or phase of the reference beam to compensate for losses during propagation. The beam deflection module is also coupled to the beam splitter. In a surface profile detection system, the beam deflection module is a component used to deflect the sample beam and project the deflected sample beam onto the device under test. Beam deflection refers to adjusting the propagation direction of the sample beam to deflect it onto the surface of the device under test.

[0072] A reference mirror can refer to a component in a surface profile inspection system used to reflect a reference beam. For example, a reference mirror can be a planar reference mirror or a curved reference mirror; the specific type is not limited. It is understood that, as... Figure 2 As shown, the reference mirror can reflect the reference beam back to the beam compensation module, and then the beam compensation module will project the reference beam back to the beam splitter so that the spectrometer coupled to the beam splitter can receive the reference beam reflected back by the reference mirror.

[0073] The device under test (DUT) can refer to a device that requires surface profile inspection. For example, the DUT could be a semiconductor wafer or an optical lens; the specific type is not limited. It is understood that, such as... Figure 2 As shown, the device under test (DUT) can reflect the sample beam back to the beam deflection module, which then projects the sample beam back to the beam splitter, allowing the spectrometer, coupled to the beam splitter, to receive the reflected sample beam. The spectrometer, coupled to the beam splitter, is a component in the surface profile detection system used to receive the reference beam reflected from the reference mirror and the sample beam reflected from the DUT, and to generate an interference signal based on the reflected reference beam and the reflected sample beam.

[0074] In steps S102 to S104 of some embodiments, peak detection can refer to the process of identifying the maximum light intensity point of the corresponding peak in the interference signal using a specific algorithm. Wavelength parameter can refer to the physical quantity used to indicate the center wavelength of the corresponding peak after peak detection for each peak. Spacing detection can refer to the process of determining the difference between wavelength parameters corresponding to adjacent peaks using a specific algorithm. Wavelength spacing can refer to the numerical difference in wavelength parameters between adjacent peaks obtained after spacing detection of the wavelength parameters corresponding to any two adjacent peaks. Depth mapping can refer to the process of converting wavelength spacing into surface height information of the device under test (DUT) using a specific mapping algorithm. Surface contour information can refer to the surface height information of the DUT corresponding to each wavelength spacing obtained after depth mapping of multiple wavelength spacings, and the data obtained by combining these height information. For example, surface contour information can be a topographic map of the DUT or a thickness distribution measurement result.

[0075] In some embodiments, peak detection is performed on multiple peaks to obtain the wavelength parameter corresponding to each peak, including:

[0076] For each peak, interpolation is performed to obtain the interpolated fitted peak.

[0077] Peak detection is performed on the interpolation fitting peak to obtain the wavelength parameters corresponding to the interpolation fitting peak.

[0078] In this embodiment, interpolation is a process of generating new data points between existing data points using a specific algorithm to make the data smoother and more continuous. An interpolation fitting peak can refer to a physical quantity obtained after interpolating each peak, indicating a smoother and more accurate corresponding peak. For example, an interpolation fitting peak can be obtained by fitting a smooth curve between the original data points of the peak using a polynomial interpolation method, and then calculating the derivative based on the fitted curve; alternatively, an interpolation fitting peak can also be obtained by constructing a piecewise smooth curve between the original data points of the peak using the interpolation fitting peak method, and then calculating the derivative based on the smooth curve. It is understood that this embodiment does not limit the method of generating the interpolation fitting peak. Peak detection can refer to the process of identifying the maximum light intensity point of the corresponding interpolation fitting peak in the interference signal using a specific algorithm. Wavelength parameters can refer to a physical quantity obtained after peak detection of each interpolation fitting peak, indicating the center wavelength of the corresponding interpolation fitting peak.

[0079] It is understood that the embodiments of this application first perform interpolation processing on each peak, and then perform peak detection on the interpolated fitted peaks to obtain the wavelength parameters corresponding to the interpolated fitted peaks. In this way, the wavelength parameters corresponding to each peak can be directly determined based on the smooth curve, reducing the risk of wavelength parameter loss due to signal distortion, improving the accuracy of peak detection, providing more accurate data support for subsequent steps, and thus improving the accuracy of surface contour detection.

[0080] It should be noted that, in the embodiments of this application, the interference signal can also be preprocessed, such as by noise reduction, to correct and optimize the signal quality of the interference signal, and then the multiple peaks included in the preprocessed interference signal can be interpolated to further improve the accuracy of peak detection.

[0081] In some embodiments, the wavelength parameters corresponding to any two adjacent peaks are detected to obtain multiple wavelength intervals, including:

[0082] For each wave peak, the wavelength parameter corresponding to the wave peak is determined as the first wavelength parameter, and the wavelength parameter corresponding to the wave peak adjacent to the wave peak is determined as the second wavelength parameter.

[0083] The difference between the second wavelength parameter and the first wavelength parameter is determined as the wavelength spacing between adjacent peaks.

[0084] In this embodiment, the first wavelength parameter can refer to the wavelength parameter corresponding to a specific peak. The second wavelength parameter can refer to the wavelength parameter corresponding to the next peak adjacent to the specific peak. The wavelength spacing between the specific peak and its adjacent peaks can be determined by a quantized value obtained from the difference between the second wavelength parameter and the first wavelength parameter. For example, if the interference signal includes five peaks, the wavelength parameters corresponding to the five consecutive adjacent peaks are respectively... , , , and Determine one peak from the five peaks, if the first wavelength parameter is... The second wavelength parameter corresponding to the adjacent peak is... Then the wavelength spacing between two adjacent wave peaks can be expressed as It is understandable that, following the same logic, the wavelength spacing between any two adjacent wave peaks can be obtained, which can be expressed as follows: , , , .

[0085] It is understood that this application directly calculates the difference between the wavelength parameters corresponding to any two adjacent peaks, and directly determines the quantized value obtained from the difference calculation as the wavelength spacing between the two adjacent peaks. In this way, the calculation steps for the wavelength spacing can be simplified, complex analysis and additional calculations can be reduced, thereby improving the efficiency of surface profile detection.

[0086] In some embodiments, depth mapping is performed on multiple wavelength spacings to obtain the surface contour information of the device under test, including:

[0087] For each wavelength spacing, a first wavelength parameter and a second wavelength parameter are obtained to determine the wavelength spacing, and the product of the first wavelength parameter and the second wavelength parameter is determined as the wavelength characteristic value of the wavelength spacing.

[0088] For each wavelength spacing, the parameters of the wavelength spacing are adjusted according to the wavelength characteristic value to obtain the optical path difference corresponding to the wavelength spacing;

[0089] Depth mapping is performed on the optical path difference corresponding to multiple wavelength intervals to obtain the surface contour information of the device under test.

[0090] In this embodiment, the wavelength characteristic value can refer to a feature value that reflects the optical characteristics of the wavelength spacing, calculated based on the product of a first wavelength parameter and a second wavelength parameter. For example, if the first wavelength parameter is... The second wavelength parameter is Then the wavelength characteristic value can be expressed as (“ "" represents a product. Parameter adjustment refers to the process of optimizing and transforming the wavelength spacing based on wavelength characteristic values ​​to determine the optical path difference. The optical path difference can be defined as a quantitative value used to describe the difference in light propagation along different paths, obtained after adjusting the wavelength spacing parameters based on wavelength characteristic values. For example, the calculation principle of the optical path difference is as follows:

[0091] First, the interference intensity between the reference beam and the sample beam can be expressed as shown in the following formula (1):

[0092]

[0093] in, It is the spectral intensity of the interference signal. It is the signal strength of the interference signal. It is the reflectivity of the reference beam. It is the reflectivity of the sample beam. It is a function for finding the square root. () is the cosine function. It is the wave number. It is the optical path difference.

[0094] Understandably, the main modulation term is The wavenumbers of two adjacent peaks satisfy the following equation:

[0095]

[0096] in, Indicates the wave number of two adjacent peaks. Pi is a constant.

[0097] Due to wave number ( ) and wavelength parameters ( )satisfy Simplifying the above equation, we can obtain the formula for calculating the optical path difference, as shown in formula (2) below:

[0098]

[0099] in, Represented as The corresponding wavelength parameters, Represented as The corresponding wavelength parameters, It is represented by a division sign.

[0100] Depth mapping refers to the process of mapping optical path differences corresponding to multiple wavelength intervals to corresponding height values ​​using a specific mapping algorithm or model, and finally integrating all height values ​​to form complete surface profile information. Surface profile information refers to the quantitative information obtained after depth mapping multiple optical path differences, used to indicate the surface morphological characteristics of the device under test. For example, surface profile information can be obtained by mapping each optical path difference to a corresponding height value using a pre-calibrated relationship model between optical path difference and height, ultimately forming surface profile information.

[0101] Understandably, this application determines the wavelength characteristic value of the wavelength spacing by multiplying the first wavelength parameter and the second wavelength parameter, and adjusts the wavelength spacing parameters using the wavelength characteristic value. This allows for depth mapping of the optical path difference values ​​corresponding to the multiple wavelength spacings obtained after parameter adjustment, thus acquiring the surface contour information of the device under test. In this way, by establishing a data relationship between the optical path difference and the wavelength parameter, the optical path difference can be directly mapped to a surface height value, simplifying the conversion process from optical path difference to height value and improving the efficiency of surface contour detection.

[0102] In some embodiments, please refer to Figure 3 , Figure 3 This is a schematic diagram of a beam deflection module provided in an embodiment of this application. Figure 3The beam deflection module includes a first collimator, a galvanometer module, and a first focusing module. The first collimator is coupled to the beam splitter. The first collimator can refer to the component in the beam deflection module used to collimate the sample beam. For example, the first collimator can be a convex lens, a mirror, or other optical element with collimation function; no specific limitation is made. The galvanometer module is coupled to the first collimator. The galvanometer module can refer to the component in the beam deflection module used to deflect the sample beam after collimation according to a preset deflection focal length and the focal position parameters of the device under test (DUT). For example, the galvanometer module can be a mirror or a refractometer; no specific limitation is made. It should be noted that the preset deflection focal length can refer to a pre-set focal length parameter used to determine the focusing position of the beam after deflection. The focal position parameters of the DUT can refer to the coordinate information of a specific point on the surface of the DUT relative to the focal position of the surface profile detection system. The first focusing module is coupled to the galvanometer module. The first focusing module can refer to the component in the beam deflection module used to focus the sample beam deflected by the beam and to project the focused sample beam onto the device under test. For example, the first focusing module can be a convex lens or a focusing lens group, and the specific design is not limited.

[0103] It is understood that the embodiments of this application construct a first collimator, a galvanometer module coupled to the first collimator, and a beam deflection module of a first focusing module coupled to the galvanometer module. The first collimator collimates the diverging sample beam into a parallel beam. After the galvanometer module deflects the beam according to preset parameters, the first focusing module focuses the deflected parallel beam and projects it onto the surface of the device under test (DUT). In this way, the required beam angle for each surface of the DUT can be pre-calculated based on the focal length parameters of the DUT and the surface profile detection system. The galvanometer module then quickly deflects the beam according to the required beam angle for each surface, completing a comprehensive scan of the DUT. This allows the subsequent spectrometer to quickly obtain the reflected sample beam used for interference signal generation, improving the efficiency of surface profile detection.

[0104] In some embodiments, please refer to Figure 4 , Figure 4 This is a schematic diagram of the structure of a spectrometer provided in an embodiment of this application. Figure 4The spectrometer in the image includes a second collimator, a diffraction grating, a second focusing module, and a linear array detector. The second collimator is coupled to the beam splitter. The second collimator can refer to the component in the spectrometer used to receive the reference beam reflected from the reference mirror and the sample beam reflected from the device under test, and used to collimate the reflected reference beam and the reflected sample beam. For example, the second collimator can be a convex lens, a mirror, or other optical element with collimation function; no specific limitation is made. The diffraction grating is coupled to the second collimator. The diffraction grating can refer to the component in the spectrometer used to perform spatial dispersion processing on the collimated sample beam and the collimated reference beam. For example, the diffraction grating can be a planar grating, a concave grating, or a transmission grating; no specific limitation is made. It should be noted that spatial dispersion processing refers to the spectral splitting of the collimated sample beam and reference beam to achieve spatial expansion and separation of the spectrum.

[0105] The second focusing module is coupled to the diffraction grating. The second focusing module can refer to a component in the spectrometer used to focus the sample beam and the reference beam for spatial dispersion processing. For example, the second focusing module can be a convex lens or a focusing lens group, without specific limitations. A linear array detector is coupled to the second focusing module. The linear array detector can refer to a component in the spectrometer used to generate interference signals from the focused sample beam and the focused reference beam. For example, the linear array detector can be a Fourier transform infrared spectrometer or a matrix photodetector, without specific limitations.

[0106] Understandably, the quality of the second collimator directly affects the parallelism of the beam and the system sensitivity, the linear density of the diffraction grating determines the spectral resolution, the aberrations of the second focusing module affect spectral broadening, and the pixel density and dynamic range of the linear array detector determine the system's axial resolution and detection depth. Therefore, the entire spectrometer, through precise optical design, can achieve nanometer-level spectral resolution, providing a crucial interference signal generation function for surface profile detection.

[0107] It is understood that the spectrometer in this application, which constructs a second collimator, a diffraction grating coupled to the second collimator, a second focusing module coupled to the diffraction grating, and a linear array detector coupled to the second focusing module, uses the second collimator to collimate the reflected reference beam and sample beam. Then, after spatial dispersion processing of the collimated reference beam and sample beam by the diffraction grating, the second focusing module focuses the dispersed reference beam and sample beam. Finally, the linear array detector generates an interference signal based on the focused reference beam and sample beam. This allows the spectrometer to acquire more precise reference and sample beams, providing a more accurate interference signal for subsequent surface contour detection, thereby improving the accuracy of surface contour detection.

[0108] In some embodiments, please refer to 5. Figure 5 This is a schematic diagram of the beam compensation module provided in an embodiment of this application. Figure 5 The beam compensation module includes a third collimator, a beam compensator, and a third focusing module. The third collimator can refer to the component in the beam compensation module used to collimate the reference beam. For example, the third collimator is coupled to a beam splitter and can be a convex lens, a mirror, or other optical element with collimation function; no specific limitation is made. The beam compensator is coupled to the third collimator and can refer to the component in the beam compensation module used to compensate for the collimated reference beam. For example, the beam compensator can be a tunable filter or a light intensity modulator; no specific limitation is made. The third focusing module is coupled to the beam compensator and can refer to the component in the beam compensation module used to focus the reference beam for beam compensation and to project the focused reference beam onto a reference mirror. For example, the third focusing module can be a convex lens or a focusing lens group; no specific limitation is made.

[0109] It is understood that the embodiments of this application construct a beam compensation module consisting of a third collimator, a beam compensator coupled to the third collimator, and a third focusing module coupled to the beam compensator. The third collimator collimates the reference beam, and then the beam compensator adjusts the intensity or spectral characteristics of the collimated reference beam to achieve beam compensation. The third focusing module then focuses the beam-compensated reference beam and projects it onto a reference mirror. This allows for precise compensation of the reference beam, which is then accurately returned to the spectrometer along its original optical path via a mirror. This high-quality and stable reference beam enhances the quality and stability of the interference signal, thereby improving the accuracy of surface profile detection.

[0110] Please see Figure 6 , Figure 6This is another structural schematic diagram of the surface contour detection system provided in this application embodiment, specifically including: a light source module, a beam splitter, a first collimator, a galvanometer module, a first focusing module, a third collimator, a beam compensator, a third focusing module, a reference mirror, and a spectrometer. The light source module and the beam splitter are coupled together; the beam splitter is coupled together with both the first and third collimators; the first collimator is coupled together with the galvanometer module; the galvanometer module is coupled together with the first focusing module; the third collimator is coupled together with the beam compensator; the beam compensator is coupled together with the third focusing module; and the spectrometer is coupled together with the beam splitter. The system first emits a laser beam through the light source module, and then the beam splitter splits the laser beam into two coherent beams, a reference beam and a sample beam. Since the laser beam is uniformly split into the reference beam and the sample beam, it can be ensured that the reference beam and the sample beam have the same light intensity and frequency, thereby achieving coherence. Next, the reference beam enters the third collimator, which makes the diverging beam of the reference beam parallel, ensuring that the beam remains stable during transmission and reducing measurement errors caused by diffusion. Furthermore, after the reference beam is reflected by the beam compensator and the third focusing module to the reference mirror, it returns to the beam splitter along the original optical path. The beam compensator adjusts the intensity of the reference beam to ensure its stability over a long period, reducing measurement errors caused by intensity variations. The third focusing module focuses the reference beam onto the reference mirror, ensuring the focusing accuracy and stability of the reference beam before reflection. The reflecting mirror reflects the reference beam back, ensuring its return to the fiber beam splitter while maintaining consistent optical path length, achieving repeatability of the interference conditions. Simultaneously, the sample beam, after passing through the first collimator, galvanometer module, and first focusing module, reaches the device under test (DUT) and returns to the beam splitter along the original optical path. The first collimator also parallelizes the sample beam, ensuring its stability during transmission and reducing measurement errors caused by diffusion. The galvanometer module controls the angle deflection of the sample beam, rapidly deflecting it to precisely project it onto the DUT, achieving high-precision beam positioning. The DUT reflects the sample beam, which returns to the beam splitter along the original optical path, ensuring consistency in intensity and direction. Finally, the spectrometer receives the reflected sample beam and the reflected reference beam, causing them to interfere within the spectrometer, thereby generating a corresponding interference signal. For example, please refer to [link to relevant documentation]. Figure 7 and Figure 8 , Figure 7 This is a schematic diagram illustrating the composition of the interference signal provided in an embodiment of this application. Figure 8 This is a spectral domain oscillation mode diagram of the interference signal provided in an embodiment of this application. From... Figure 7 As can be seen, the light source spectrum of the interference signal (labeled "S(k)", with units of spectral intensity) changes with wavelength (lambda, with units of...) The light intensity (in nanometers) initially increases gradually, reaches a peak, and then gradually decreases, forming a typical symmetrical or asymmetrical spectral curve. This indicates that the light source has a concentrated intensity distribution within a specific wavelength range, contributing significantly to optical interference near the center wavelength. Figure 8 This shows that the ideal interference signal (labeled as "I(k)", in units of signal intensity) under different optical path differences (labeled as "dZ") varies with wavelength (lambda, in units of As the optical path difference increases, the oscillation frequency of the interference signal gradually decreases, and the amplitude change becomes more gradual. This indicates that the optical path difference has a significant impact on the characteristics of the interference signal and can be used for subsequent optical path difference calculations and surface profile detection.

[0111] It is understood that this application embodiment constructs a surface profile detection system to generate interference signals based on the sample beam reflected back from the device under test (DUT) and the reference beam reflected back from the reference mirror. This provides data support for subsequent surface detection of the DUT, obtaining its surface profile information. The test is completed using a modular optical path design compatible with both diffuse reflection (metal) and specular reflection (optical glass), avoiding reliance on an active vibration isolation platform. It also suppresses measurement errors introduced by environmental vibrations, improving the accuracy and efficiency of subsequent surface profile measurements. Furthermore, this application embodiment achieves optical path modulation through non-contact angular deflection of the reference light by the galvanometer module. This modulation method relies solely on changes in the mirror angle, thus avoiding mechanical friction losses. Because the galvanometer module has extremely low deflection inertia, it can achieve kHz-level high-frequency modulation, making it highly suitable for dynamic surface detection. Simultaneously, combined with the optical leverage effect, nanometer-level equivalent optical path difference resolution can be achieved without backlash error. In addition, this application embodiment continuously modulates the reference light phase through the galvanometer module, directly obtaining the phase difference between adjacent fringes, thereby retrieving the surface profile and avoiding multi-wavelength dispersion calibration problems.

[0112] Please see Figure 9 , Figure 9This is a flowchart illustrating the acquisition of surface contour information of a device under test (DUT) according to an embodiment of this application. Specifically, it includes: broadband light source emission, interference signal generation, spectral dispersion detection, signal preprocessing, peak detection, wavelength spacing detection, distance calculation, depth mapping, and output results. Broadband light source emission can be achieved by emitting a laser beam through a light source module, which splits the laser beam into two coherent beams: a reference beam and a sample beam. Interference signal generation can be achieved through the coordinated operation of a beam compensation module, a beam deflection module, and a reference mirror. The reference beam is propagated to the reference mirror via the beam compensation module, then reflected back to the beam splitter along the original optical path. Simultaneously, the sample beam is precisely deflected by the beam deflection module and projected onto the surface of the DUT. The sample beam is reflected back to the beam splitter along the original optical path by the DUT, and then the reflected reference beam and sample beam are received by a spectrometer to generate an interference signal. Spectroscopic dispersion detection refers to the progressive processing of the received reflected reference beam and sample beam by a second collimator, diffraction grating, second focusing module, and linear array detector included in the spectrometer to obtain the final interference signal used for subsequent surface contour detection. First, a second collimator collimates the received and reflected reference and sample beams, converting them into parallel beams. Then, a diffraction grating spatially disperses the collimated beams according to their wavelength components, achieving spectral dispersion. Next, a second focusing lens converges the dispersed beams of different wavelengths onto different pixel positions of the linear array detector, forming a spatial distribution of the interference spectrum. Finally, the linear array detector converts the optical signal into an electrical signal, which is the final interference signal.

[0113] Signal preprocessing refers to preprocessing the interference signal, such as performing signal denoising or linear interpolation, which can optimize and correct the interference signal. Peak detection refers to detecting the wavelength parameters corresponding to multiple peaks included in the preprocessed interference signal. For example, peaks can be obtained through linear regression or FFT spectral analysis. Figure 8 The relationship between wavelength and optical path difference shown is obtained by reading... Figure 8 The wavelength parameter of each peak can be directly read from the value corresponding to the horizontal axis. Wavelength spacing detection refers to calculating the difference between the wavelength parameters of any two adjacent peaks to obtain the wavelength spacing between any two adjacent peaks. Distance calculation refers to mapping the calculated wavelength spacing to the corresponding optical path difference. For example, the wavelength spacing can be directly mapped to the corresponding optical path difference using formula (2). Depth mapping refers to the process of reconstructing the surface morphology or internal structure of the device under test based on the optical path difference, thereby generating surface contour detection information. Output results refer to displaying the surface contour detection information through devices such as a display.

[0114] It is understood that the embodiments of this application, by directly utilizing the peak spacing to resolve the distance, require only simple extreme value detection and linear operations (such as interpolation and fitting), simplifying the algorithm complexity and improving the calculation speed. This makes it particularly suitable for embedded systems and online industrial inspection, meeting real-time requirements. Simultaneously, by establishing a direct correlation between wavelength spacing and optical path difference, the spectral leakage problem of Fourier transform is avoided. Furthermore, combined with preprocessing techniques such as moving average and wavelet denoising, high-frequency noise is further suppressed, enhancing anti-interference capabilities and improving the signal-to-noise ratio. It also exhibits robustness against environmental interference such as spectral inhomogeneity of the light source and mechanical vibration. In addition, this application reduces hardware requirements, lowers system costs, and achieves a good balance between resolution and measurement range, making it suitable for various inspection scenarios.

[0115] Please see Figure 10 This application also provides a surface contour detection device that can implement the above-mentioned surface contour detection method. The surface contour detection system includes a light source module, a beam splitter, a beam compensation module, a beam deflection module, a spectrometer, and a reference mirror. The light source module emits a laser beam. The beam splitter is coupled to the light source module and is used to split the laser beam to obtain a reference beam and a sample beam. The beam compensation module is coupled to the beam splitter and is used to compensate the reference beam and project the compensated reference beam onto the reference mirror. The beam deflection module is coupled to the beam splitter and is used to deflect the sample beam and project the deflected sample beam onto the device under test. The spectrometer is coupled to the beam splitter and is used to receive the reference beam reflected back from the reference mirror and the sample beam reflected back from the device under test, and to generate an interference signal from the reflected reference beam and the reflected sample beam. The surface contour detection device includes:

[0116] The signal acquisition unit 1001 is used to acquire the interference signal generated by the spectrometer, which includes multiple peaks.

[0117] The peak detection unit 1002 is used to perform peak detection on multiple peaks and obtain the wavelength parameters corresponding to each peak.

[0118] The spacing detection unit 1003 is used to detect the spacing between any two adjacent wave peaks and obtain multiple wavelength spacings.

[0119] The depth mapping unit 1004 is used to perform depth mapping on multiple wavelength spacings to obtain the surface contour information of the device under test.

[0120] The specific implementation of this surface contour detection device is basically the same as the specific embodiment of the surface contour detection method described above, and will not be repeated here.

[0121] This application also provides an electronic device, which includes a memory and a processor. The memory stores a computer program, and the processor executes the computer program to implement the above-described surface contour detection method. This electronic device can be any smart terminal, including tablet computers, in-vehicle computers, etc.

[0122] Please see Figure 11 , Figure 11 The hardware structure of an electronic device according to another embodiment is illustrated. The electronic device includes:

[0123] The processor 1101 can be implemented using a general-purpose central processing unit (CPU), microprocessor, application specific integrated circuit (ASIC), or one or more integrated circuits, and is used to execute relevant programs to implement the technical solutions provided in the embodiments of this application.

[0124] The memory 1102 can be implemented as a read-only memory (ROM), static storage device, dynamic storage device, or random access memory (RAM). The memory 1102 can store the operating system and other applications. When the technical solutions provided in the embodiments of this specification are implemented through software or firmware, the relevant program code is stored in the memory 1102 and called and executed by the processor 1101 to execute the surface contour detection method of the embodiments of this application.

[0125] Input / output interface 1103 is used to implement information input and output;

[0126] The communication interface 1104 is used to enable communication and interaction between this device and other devices. Communication can be achieved through wired means (such as USB, network cable, etc.) or wireless means (such as mobile network, WIFI, Bluetooth, etc.).

[0127] Bus 1105 transmits information between various components of the device (e.g., processor 1101, memory 1102, input / output interface 1103, and communication interface 1104);

[0128] The processor 1101, memory 1102, input / output interface 1103 and communication interface 1104 are connected to each other within the device via bus 1105.

[0129] This application also provides a computer-readable storage medium storing a computer program that, when executed by a processor, implements the above-described surface contour detection method.

[0130] Memory, as a non-transitory computer-readable storage medium, can be used to store non-transitory software programs and non-transitory computer-executable programs. Furthermore, memory may include high-speed random access memory, and may also include non-transitory memory, such as at least one disk storage device, flash memory device, or other non-transitory solid-state storage device. In some embodiments, memory may optionally include memory remotely located relative to the processor, and these remote memories can be connected to the processor via a network. Examples of such networks include, but are not limited to, the Internet, intranets, local area networks, mobile communication networks, and combinations thereof.

[0131] The embodiments described in this application are for the purpose of more clearly illustrating the technical solutions of the embodiments of this application, and do not constitute a limitation on the technical solutions provided by the embodiments of this application. As those skilled in the art will know, with the evolution of technology and the emergence of new application scenarios, the technical solutions provided by the embodiments of this application are also applicable to similar technical problems.

[0132] Those skilled in the art will understand that the technical solutions shown in the figures do not constitute a limitation on the embodiments of this application, and may include more or fewer steps than shown, or combine certain steps, or different steps.

[0133] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs.

[0134] The terms “first,” “second,” “third,” “fourth,” etc. (if present) in the specification and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms “comprising” and “having,” and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0135] It should be understood that in this application, "at least one (item)" means one or more, and "more than" means two or more. "And / or" is used to describe the relationship between related objects, indicating that three relationships can exist. For example, "A and / or B" can represent three cases: only A exists, only B exists, and both A and B exist simultaneously, where A and B can be singular or plural. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship. "At least one (item) of the following" or similar expressions refer to any combination of these items, including any combination of single or plural items. For example, at least one (item) of a, b, or c can represent: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, and c can be single or multiple.

[0136] In the several embodiments provided in this application, it should be understood that the disclosed apparatus and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of the units described above is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between apparatuses or units may be electrical, mechanical, or other forms.

[0137] The units described above as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0138] Furthermore, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

[0139] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes multiple instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods of the various embodiments of this application. The aforementioned storage medium includes various media capable of storing programs, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0140] The preferred embodiments of the present application have been described above with reference to the accompanying drawings, but this does not limit the scope of the claims of the present application. Any modifications, equivalent substitutions, and improvements made by those skilled in the art without departing from the scope and substance of the embodiments of the present application shall be within the scope of the claims of the present application.

Claims

1. A surface contour detection method, characterized in that, The surface profile detection method is applied to a surface profile detection system, which includes a light source module, a beam splitter, a beam compensation module, a beam deflection module, a spectrometer, and a reference mirror. The light source module emits a laser beam. The beam splitter, coupled to the light source module, splits the laser beam to obtain a reference beam and a sample beam. The beam compensation module, coupled to the beam splitter, compensates for the reference beam and projects the compensated reference beam onto the reference mirror. The beam deflection module, coupled to the beam splitter, deflects the sample beam and projects the deflected sample beam onto the device under test (DUT). The spectrometer, coupled to the beam splitter, receives the reference beam reflected from the reference mirror and the sample beam reflected from the DUT, and generates an interference signal between the reflected reference beam and the reflected sample beam. The surface contour detection method includes: Acquire the interference signal generated by the spectrometer, the interference signal including multiple peaks; Peak detection is performed on the multiple peaks to obtain the wavelength parameter corresponding to each peak. For each of the wave peaks, the wavelength parameter corresponding to the wave peak is determined as the first wavelength parameter, and the wavelength parameter corresponding to the wave peak adjacent to the wave peak is determined as the second wavelength parameter; The difference between the second wavelength parameter and the first wavelength parameter is determined as the wavelength spacing between the wave crest and its adjacent wave crests. For each wavelength spacing, the first wavelength parameter and the second wavelength parameter used to determine the wavelength spacing are obtained, and the product of the first wavelength parameter and the second wavelength parameter is determined as the wavelength characteristic value of the wavelength spacing; For each wavelength spacing, the wavelength spacing is adjusted according to the wavelength characteristic value to obtain the optical path difference corresponding to the wavelength spacing; Depth mapping is performed on the optical path difference corresponding to the multiple wavelength spacings to obtain the surface contour information of the device under test.

2. The method according to claim 1, characterized in that, The step of performing peak detection on the plurality of peaks to obtain the wavelength parameter corresponding to each peak includes: For each of the aforementioned peaks, interpolation is performed on the peaks to obtain interpolated fitted peaks; Peak detection is performed on the interpolated fitting peak to obtain the wavelength parameter corresponding to the interpolated fitting peak.

3. The method according to claim 1, characterized in that, The beam deflection module includes: A first collimator, coupled to the beam splitter, is used to collimate the sample beam. A galvanometer module, which is coupled to the first collimator, is used to deflect the sample beam that has been collimated according to a preset deflection focal length and the focal position parameters of the device under test. The first focusing module, coupled to the galvanometer module, is used to focus the deflected sample beam and project the focused sample beam onto the device under test.

4. The method according to claim 1, characterized in that, The spectrometer includes: The second collimator, coupled to the beam splitter, is used to receive the reference beam reflected back from the reference mirror and the sample beam reflected back from the device under test, and to collimate the reflected reference beam and the reflected sample beam. A diffraction grating, coupled to the second collimator, is used to perform spatial dispersion processing on the collimated sample beam and the collimated reference beam; The second focusing module is coupled to the diffraction grating and is used to focus the sample beam and the reference beam that have undergone spatial dispersion processing. A linear array detector, coupled to the second focusing module, is used to generate interference signals for the focused sample beam and the focused reference beam.

5. The method according to claim 1, characterized in that, The beam compensation module includes: A third collimator, coupled to the beam splitter, is used to collimate the reference beam. A beam compensator, which is coupled to the third collimator, is used to perform beam compensation on the reference beam for collimation processing. The third focusing module, coupled to the beam compensator, is used to focus the beam-compensated reference beam and project the focused reference beam onto the reference mirror.

6. A surface contour detection device, characterized in that, The surface profile detection device is applied to a surface profile detection system, which includes a light source module, a beam splitter, a beam compensation module, a beam deflection module, a spectrometer, and a reference mirror. The light source module emits a laser beam. The beam splitter, coupled to the light source module, splits the laser beam to obtain a reference beam and a sample beam. The beam compensation module, coupled to the beam splitter, compensates for the reference beam and projects the compensated reference beam onto the reference mirror. The beam deflection module, coupled to the beam splitter, deflects the sample beam and projects the deflected sample beam onto the device under test (DUT). The spectrometer, coupled to the beam splitter, receives the reference beam reflected from the reference mirror and the sample beam reflected from the DUT, and generates an interference signal between the reflected reference beam and the reflected sample beam. The surface contour detection device includes: A signal acquisition unit is used to acquire the interference signal generated by the spectrometer, the interference signal including multiple peaks; A peak detection unit is used to perform peak detection on the plurality of peaks to obtain the wavelength parameter corresponding to each peak. The spacing detection unit is used to determine the wavelength parameter corresponding to each wave peak as a first wavelength parameter, determine the wavelength parameter corresponding to the wave peak adjacent to the wave peak as a second wavelength parameter, and determine the difference between the second wavelength parameter and the first wavelength parameter as the wavelength spacing between the wave peak and the adjacent wave peak. The depth mapping unit is used to acquire, for each wavelength spacing, a first wavelength parameter and a second wavelength parameter for determining the wavelength spacing, and to determine the wavelength characteristic value of the wavelength spacing by multiplying the first wavelength parameter and the second wavelength parameter, to adjust the wavelength spacing parameters according to the wavelength characteristic value, to obtain the optical path difference value corresponding to the wavelength spacing, and to perform depth mapping on the optical path difference values ​​corresponding to the multiple wavelength spacings to obtain the surface contour information of the device under test.

7. An electronic device, characterized in that, The electronic device includes a memory and a processor, the memory storing a computer program, and the processor executing the computer program to implement the surface contour detection method according to any one of claims 1 to 5.

8. A computer-readable storage medium storing a computer program, characterized in that, When the computer program is executed by the processor, it implements the surface contour detection method according to any one of claims 1 to 5.

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