Electricity utilization protector for strong heat dissipation

Abstract

The invention relates to the technical field of power utilization protector devices, and discloses a power utilization protector for strong heat dissipation, which comprises a circuit board and a switch electronic device, the switch electronic device is arranged on the circuit board, heat dissipation plates are vertically arranged on the two sides of the circuit board, the switch electronic device is arranged on the outer sides of the heat dissipation plates, and fans are arranged at the two ends of the heat dissipation plates. Fins are vertically arrayed on the side, away from the switch electronic device, of the heat dissipation plate to form a channel for airflow to flow, the fins are perpendicular to the heat dissipation plate, turbulent flow columns are arranged in the fins, the turbulent flow columns are perpendicular to the fins, when airflow passes through the turbulent flow columns, vortexes which fall off periodically are formed, and a high-speed area of the vortexes makes contact with the heat dissipation plate.

Description

Technical Field

[0001] This invention relates to the field of electrical protection device technology, specifically to an electrical protection device for strong heat dissipation. Background Technology

[0002] Electrical protection devices, as electrical safety devices, are typically installed in the main distribution box or switch cabinet at the entrance of a household or industrial power supply system, and are also deployed on critical branch circuits. Their fundamental function is to automatically disconnect the power supply to the circuit at millisecond speeds when abnormal conditions are detected in the electrical system (such as overload, short circuit, ground fault, or leakage current). Their core purpose is to effectively prevent electric shock injuries from contact with live parts, avoid electrical fires caused by overheating or arcing of lines, and protect downstream electrical equipment from damage caused by overcurrent or overvoltage. Current limiting devices are an important category of electrical protection devices, focusing on handling the most severe short-circuit fault scenarios. Their design goal is to proactively limit and ultimately completely disconnect the current generated by the short circuit, which far exceeds the normal operating current, in the initial stage of the fault (usually before the current reaches its first peak value), with an extremely high response speed. This technology can detect fault currents that are several times or even tens of times larger than the fault current, thereby minimizing the severe thermal stress and electrodynamic impact damage caused by short-circuit currents to electrical circuit conductors, insulation layers, connection terminals, and expensive electrical equipment, thus preserving the integrity of the electrical system. Solid-state current limiters are a type of current-limiting protection device. They utilize the microsecond-level high-speed turn-on and turn-off capabilities of power electronic switching devices (such as IGBTs, SCRs, and MOSFETs). Upon detecting a short-circuit fault, a fast control strategy precisely inserts a preset current-limiting impedance (such as an inductor or resistor) into the fault current path, forcibly suppressing the current amplitude and then completely cutting off the fault circuit. This semiconductor-based switching technology makes it particularly suitable for applications requiring extremely fast response times, frequent operation, and low power ratings (such as 1000V). Applications in the range of AC or below 1500V DC and small to medium power, such as internal protection of precision electronic equipment, output protection of switching power supplies, uninterruptible power supply (UPS) systems, battery management system (BMS) protection circuits of battery energy storage systems (BESS), and data center rack power distribution units (PDUs).

[0003] Solid-state current limiters require higher heat dissipation due to their high power when limiting current. Traditional equipment usually uses air cooling, but the efficiency of air cooling is related to the heat dissipation area and air velocity. Increasing the heat dissipation area or increasing the air velocity will greatly increase the manufacturing and use costs of the equipment. Increasing the heat dissipation area will increase the size of the equipment, which is not conducive to production and customer use. Summary of the Invention

[0004] (a) Technical problems to be solved

[0005] In view of the shortcomings of the prior art, the present invention provides a power protection device for strong heat dissipation, which has the advantage of efficient heat dissipation and solves the problem of the conflict between heat dissipation efficiency and equipment size.

[0006] (II) Technical Solution

[0007] To achieve the aforementioned goal of efficient heat dissipation, the present invention provides the following technical solution: a power protection device for strong heat dissipation, comprising a circuit board and a switching electronic device. The switching electronic device is disposed on the circuit board, and heat sinks are vertically disposed on both sides of the circuit board. The switching electronic device is disposed on the outside of the heat sinks, and fans are provided at both ends of the heat sinks. The heat sinks have fins arranged vertically on the side away from the switching electronic device, forming a channel for airflow. The fins are perpendicular to the heat sinks, and turbulence columns are provided in the fins. When the airflow passes through the turbulence columns, periodically falling vortices are formed, and the high-speed zone of the vortex contacts the heat sinks.

[0008] The fins are provided with an array of waist-shaped holes, and the baffle columns pass through the waist-shaped holes so that the airflow in each airflow channel passes through the same baffle column.

[0009] An adjustment component is provided above the heat sink, which can control the displacement of the turbulence column in the waist-shaped hole.

[0010] The adjustment assembly contains a thermosensitive cavity and a spring, and provides space for the movement of the turbulence column. The upper end of the turbulence column has a head, one end of which is located in the thermosensitive cavity, and the other end is connected to the spring. The thermosensitive cavity contains a volatile liquid. When the temperature rises, the liquid in the thermosensitive cavity evaporates, pushing the turbulence column to move towards the side where the spring is located.

[0011] The thermal cavity is arranged in an alternating pattern of being close to the heat sink and away from the heat sink.

[0012] The fin has a track on the side of the lowest fin, the diameter of the track is larger than the waist-shaped hole, and a base is provided in the track. The lower end of the turbulence column is set in the base through a sleeve structure.

[0013] Both ends of the fins are equipped with heat dissipation plates, making the airflow channel interface a closed rectangle.

[0014] The turbulence column is teardrop-shaped with its pointed end facing the air intake side.

[0015] (III) Beneficial Effects

[0016] Compared with the prior art, the present invention provides a power protection device for strong heat dissipation, which has the following features:

[0017] Beneficial effects:

[0018] 1. This high-efficiency heat dissipation power protector utilizes a vertical heat sink and dense fin array to create a highly efficient directional airflow channel. Fans at both ends drive airflow longitudinally throughout the entire heat dissipation area. Its core innovation lies in the vertically arranged turbulence columns between the fins. When airflow passes through, each turbulence column induces the Karman vortex street effect, periodically generating high-speed rotating vortices that rhythmically and continuously strip away the thermal boundary layer on the heat sink surface, ensuring that the high-temperature area is always in direct contact with fresh, cool air. These rotating vortices, like micro-turbines, achieve deep turbulent mixing of hot and cold air at the millimeter scale, completely eliminating localized turbulent mixing. The hot spot, at the same time, the vertical layout of the turbulence column transforms laminar flow into high-intensity three-dimensional turbulence while minimizing wind resistance, significantly improving the heat exchange intensity in the fin gaps. The double-sided heat sink design forms a synergistic heat dissipation airflow channel, making the airflow evenly distributed in the lateral space. The active flushing effect of the vortex delays dust accumulation and maintains long-term heat dissipation stability. The high-frequency vortex shedding characteristics reduce aerodynamic noise. The compact vertical architecture greatly saves equipment space. And the "fluid micro-cutting" effect of the continuous vortex renewal can achieve an exponential increase in effective heat dissipation area at the same wind speed compared to traditional planar fins.

[0019] 2. This high-performance heat dissipation device features an adjustable component that drives the overall offset of the turbulence column cluster via an oblong hole. At low temperatures, it maintains a centered position for efficient heat dissipation with low resistance; at high temperatures, it precisely guides the airflow to the heat source side. The displacement of the turbulence columns "wedges" the high-speed airflow into the high-temperature region, forcibly thinning the thermal boundary layer and automatically increasing the heat transfer coefficient with temperature rise. This resolves the contradiction of overcooling or overheating in traditional radiators under varying operating conditions. The offset of the turbulence columns simultaneously alters the spatial distribution of the Karman vortex street, allowing the high-speed vortex zone to actively track the hot spot area of ​​the heat sink. The dynamic adjustment of the contact position between the vortex core and the wall surface avoids dust accumulation in the fixed low-speed zone and achieves a self-cleaning effect on the fin surface through vortex migration, avoiding the flow field imbalance of traditional radiators where "insufficient airflow on the high-temperature side and excessive heat dissipation on the low-temperature side." Dynamic flow resistance management reduces fan energy consumption in low-temperature conditions. The vortex street spatial offset mechanism prevents dust from accumulating in the fixed low-speed zone, extending maintenance cycles. The adjustable component only requires micro-displacement to achieve global flow field reconstruction, resulting in extremely high mechanical reliability.

[0020] 3. The power protection device for this strong heat dissipation uses the micro-explosive vaporization of volatile substances in the thermistor cavity at the temperature threshold to drive the cluster of turbulence columns to shift synchronously; when condensing, the spring resets, forming a closed-loop temperature control loop. It does not require sensors or external energy. The alternating arrangement of thermistor cavities forms a pressure wave front in the high-temperature area of ​​the heat sink, causing the turbulence columns to exhibit a wave-shaped displacement topology. This creates a sinusoidal distribution of acceleration zone and vortex core in the flow field. The alternating displacement causes the high-speed airflow to form a zigzag sweeping path on the surface of the heat sink, improving the coverage of the peak area of ​​the heat transfer coefficient. Attached Figure Description

[0021] Figure 1This is a schematic diagram of the structure of the present invention. Figure 1 ;

[0022] Figure 2 This is a schematic diagram of the fin structure of the present invention;

[0023] Figure 3 This is a schematic diagram showing the details of the fins in this invention;

[0024] Figure 4 This is a schematic diagram of the structure of the present invention. Figure 2 ;

[0025] Figure 5 This is a schematic diagram of vortex flow in the present invention. Figure 1 ;

[0026] Figure 6 This is a schematic diagram of vortex flow in the present invention. Figure 2 ;

[0027] Figure 7 This is a schematic diagram of the adjustment component structure of the present invention.

[0028] In the diagram: 1. Circuit board; 2. Switching electronic device; 3. Heat sink; 4. Adjustment component; 5. Fan; 31. Fin; 32. Baffle column; 41. Thermistor cavity; 311. Waist-shaped hole; 312. Track; 321. Base; 322. End. Detailed Implementation

[0029] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0030] Please see Figure 1-4 A power protection device for strong heat dissipation includes a circuit board 1 and a switching electronic device 2. The switching electronic device 2 is mounted on the circuit board 1. Heat sinks 3 are vertically arranged on both sides of the circuit board 1. The switching electronic device 2 is located outside the heat sinks 3, and fans 5 are provided at both ends of the heat sinks 3. The heat sinks 3 have fins 31 arranged vertically on the side away from the switching electronic device 2, forming a channel for airflow. The fins 31 are perpendicular to the heat sinks 3 and are fixed to the heat sinks 3 by welding, ensuring heat transfer while fixing. A baffle column 32 is provided in the fins 31, which is perpendicular to the fins 31. The baffle column 32 obstructs the airflow in the flow channel. When the airflow passes through the baffle column 32, [refer to...]. Figure 5 This forms a periodically shedding vortex, and the high-speed zone of the vortex comes into contact with the heat sink 3.

[0031] The switching electronic device 2 is typically an IGBT or thyristor, which has fast switching characteristics and inserts a current-limiting impedance in case of failure. It generates heat during operation, which is conducted through the heat sink 3 in contact with it. When airflow from the fan 5 passes through the turbulence columns 32 set in the fins 31, the turbulence columns 32 impede the fluid flow. During the fluid flow, two symmetrical vortices are formed on both sides of the object. These two vortices rotate in opposite directions. This is because when the fluid flows through the object, the flow velocity slows down and the pressure increases, forming a high-pressure zone. On both sides of the object, the fluid accelerates, forming a low-pressure zone. Due to the pressure difference, the fluid in the high-pressure zone flows to the low-pressure zone, forming vortices. As the fluid continues to flow, these two vortices gradually increase in size and move backward along both sides of the object, forming a Karman vortex street, creating a flow velocity difference between the inner and outer sides. Vortex shearing disrupts the thermal boundary layer, increasing the convective heat transfer coefficient and effectively improving heat dissipation efficiency. When air flows over a heating surface, a relatively stationary or low-velocity thin layer of air forms close to the surface, called the "thermal boundary layer." This layer of air mainly relies on thermal conduction to slowly transfer heat, exhibiting poor thermal conductivity and forming the main thermal resistance. High-speed airflow has stronger shear force, significantly thinning this low-velocity, stagnant air layer (thermal boundary layer). A thinner thermal boundary layer means a shorter path and less resistance for heat conduction from the solid surface to the moving fluid, making it easier for heat to be carried away by the airflow. Vortex shearing increases the flow velocity of the outer airflow, effectively increasing heat exchange between the airflow and the heat sink 3. Simultaneously, the high-speed airflow rapidly carries away heat, preventing excessive heat accumulation and temperature rise near the heat source, thus maintaining a high driving temperature difference and further promoting continuous heat transfer. Furthermore, the forced mixing of hot and cold fluids reduces local temperature differences.

[0032] The fins 31 are provided with an array of waist-shaped holes 311. The waist-shaped holes 311 can be completed by stamping before welding, which reduces the processing difficulty. The baffle columns 32 pass through the waist-shaped holes 311 so that the airflow in each airflow channel passes through the same baffle column 32. An adjustment component 4 is provided above the heat sink 3. The adjustment component 4 can control the displacement of the baffle columns 32 in the waist-shaped holes 311.

[0033] At low temperatures, the turbulence column is located in the middle position. At low temperatures, the airflow density is high and the central mainstream wind speed is high. The central turbulence column 32 can effectively disrupt the central laminar boundary layer. At the same time, the heat load on both sides is low, and no additional diversion is required. The pressure drop is minimal at the central position. When the temperature rises, the turbulence column 32 moves towards the high-temperature side (i.e., heat sink 3). After shifting, the turbulence column 32 squeezes the central high-speed airflow towards the high-temperature side, increasing the wind speed on the high-temperature side, reducing the thickness of the boundary layer on the high-temperature side, and increasing the heat transfer coefficient. Furthermore, due to the movement of the turbulence column 32, the vortex generated by the vortex street shifts, and the high-speed and low-speed regions of the airflow on the surface of the fins 31 also change, effectively preventing dust deposition in the low-speed region.

[0034] See Figure 7 The adjustment assembly 4 is equipped with a thermistor cavity 41 and a spring, and has space for the turbulence column 32 to move. The upper end of the turbulence column 32 is provided with a head 322. One end of the head 322 is located in the thermistor cavity 41, and the other end is connected to the spring. The thermistor cavity 41 contains a volatile liquid (such as alcohol). When the temperature rises, the liquid in the thermistor cavity 41 evaporates, changes from liquid to gas, and increases in volume, pushing the turbulence column 32 to move towards the side with the spring, compressing the spring. When the temperature drops, the gas in the thermistor cavity 41 begins to condense. At the same time, under the influence of the pressure applied by the spring, it rapidly liquefies and decreases in volume, causing the turbulence column 32 to return to the middle position.

[0035] See Figure 6 The thermistor cavity 41 is arranged alternately on the side close to the heat sink 3 and the side away from the heat sink 3, so that the turbulence column 32 can form a larger vortex street area at high temperature, generating two independent Karman vortex streets in a limited space, thereby improving the heat exchange efficiency of the heat zones on both sides simultaneously.

[0036] See Figure 3 The fin 31 has a track 312 on the side of the lowest fin 31. The diameter of the track 312 is larger than that of the waist-shaped hole 311, and a base 321 is provided in the track 312. The lower end of the turbulence column 32 is set in the base 321 through a sleeve structure, so that the lower end of the turbulence column 32 is not tilted due to insufficient movement during the movement.

[0037] The fins 31 are provided with heat dissipation plates 3 at both ends, so that the airflow channel interface is a closed rectangle, which effectively increases the heat dissipation area and allows it to contact and exchange heat with the high-speed vortex flow zone on the other side.

[0038] The turbulence column 32 is teardrop-shaped with its pointed end facing the air inlet side, which effectively increases the edge wind speed, enhances heat exchange, and optimizes the pressure drop.

[0039] Working Principle: Heat sinks 3 are vertically arranged on both sides of the circuit board 1. The switching electronic device 2 is located outside the heat sink 3, and fans 5 are located at both ends of the heat sink 3. Fins 31 are vertically arrayed on the side of the heat sink 3 away from the switching electronic device 2, forming a channel for airflow. The fins 31 are perpendicular to the heat sink 3, and turbulence columns 32 are provided within the fins 31. When airflow passes through the turbulence columns 32, it forms periodically falling vortices. The high-speed area of ​​the vortex contacts the heat sink 3. The switching electronic device 2 is typically an IGBT, thyristor, etc., with fast switching characteristics and a current-limiting impedance inserted in case of fault. During operation, it generates heat, which is conducted through the heat sink 3 in contact with it, and the airflow... When the fan 5 flows through the turbulence columns 32 set in the fins 31, the turbulence columns 32 will obstruct the fluid. During the flow of the fluid, two symmetrical vortices will be formed on both sides of the object. The two vortices rotate in opposite directions. This is because when the fluid flows through the object, it is obstructed by the object, the flow velocity will slow down, the pressure will increase, and a high-pressure zone will be formed. On both sides of the object, the fluid will accelerate and form a low-pressure zone. Due to the pressure difference, the fluid in the high-pressure zone will flow to the low-pressure zone and form vortices. As the fluid continues to flow, the two vortices will gradually increase and move backward along both sides of the object, thus forming a Karman vortex street. The vortex street destroys the thermal boundary layer, increases the convective heat transfer coefficient, and effectively improves the heat dissipation efficiency. At the same time, the hot and cold fluids are forcibly mixed, reducing the local temperature difference.

[0040] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0041] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A power protection device for strong heat dissipation, comprising a circuit board (1) and a switching electronic device (2), wherein the switching electronic device (2) is disposed on the circuit board (1), and heat sinks (3) are vertically disposed on both sides of the circuit board (1), the switching electronic device (2) is disposed on the outside of the heat sinks (3), and fans (5) are provided at both ends of the heat sinks (3), characterized in that: The heat sink (3) has fins (31) arranged vertically on the side away from the switching electronic device (2) to form a channel for airflow. The fins (31) are arranged perpendicularly to the heat sink (3). The fins (31) are provided with turbulence columns (32). The turbulence columns (32) are arranged perpendicularly to the fins (31). When the airflow passes through the turbulence columns (32), it forms a periodically falling vortex. The high-speed area of ​​the vortex contacts the heat sink (3).

2. The power protection device for strong heat dissipation according to claim 1, characterized in that: The fin (31) is provided with an array of waist-shaped holes (311), and the baffle column (32) passes through the waist-shaped holes (311) so that the airflow in each airflow channel passes through the same baffle column (32).

3. The power protection device for strong heat dissipation according to claim 2, characterized in that: An adjustment component (4) is provided above the heat sink (3), and the adjustment component (4) can control the displacement of the turbulence column (32) in the waist-shaped hole (311).

4. The power protection device for strong heat dissipation according to claim 3, characterized in that: The adjustment assembly (4) is provided with a thermal cavity (41) and a spring, and has space for the movement of the turbulence column (32). The upper end of the turbulence column (32) is provided with an end (322). One end of the end (322) is located in the thermal cavity (41), and the other end is connected to the spring. The thermal cavity (41) is provided with a volatile liquid. When the temperature rises, the liquid in the thermal cavity (41) evaporates, pushing the turbulence column (32) to move towards the side where the spring is located.

5. The power protection device for strong heat dissipation according to claim 4, characterized in that: The thermal cavity (41) is arranged alternately on the side close to the heat sink (3) and the side away from the heat sink (3).

6. The power protection device for strong heat dissipation according to claim 4, characterized in that: The fin (31) has a track (312) on the side of the lowest fin (31). The diameter of the track (312) is larger than that of the waist-shaped hole (311), and a base (321) is provided in the track (312). The lower end of the turbulence column (32) is set in the base (321) through a sleeve structure.

7. A power protection device for strong heat dissipation according to any one of claims 1-6, characterized in that: The fins (31) are provided with heat dissipation plates (3) at both ends, so that the airflow channel interface is a closed rectangle.

8. A power protection device for strong heat dissipation according to any one of claims 1-6, characterized in that: The turbulence column (32) is teardrop-shaped with its pointed end facing the air intake side.

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