Quartz nozzle preparation method

Abstract

The invention relates to the technical field of chip processing equipment, in particular to a preparation method of a quartz nozzle used for a chip manufacturing process, and the preparation method comprises the following steps: S1, cutting a cylindrical hollow raw material to form a semi-finished product with the blanking thickness of the semi-finished product; s2, the two end faces of the semi-finished product are ground, and the grinding thickness is 1 mm; s3, the ground semi-finished product is machined; s4, performing primary cleaning treatment on the machined semi-finished product; s5, the cleaned semi-finished product is polished; s6, the polished semi-finished product is subjected to secondary cleaning treatment, and the semi-finished product forms a finished product; and S7, packaging the finished product with qualified appearance. Wherein mm is the single-face thickness grinding amount, the polishing allowance and the finished product thickness.

Description

Technical Field

[0001] This invention relates to the field of chip processing equipment technology, and more specifically, to a method for preparing a quartz nozzle for chip manufacturing processes. Background Technology

[0002] With the rapid development of my country's integrated circuit industry, the market demand for quartz nozzles used in chip manufacturing processes is also expanding. Quartz nozzles are core components in chip manufacturing equipment, used to deliver specific process media, such as etching gases, deposition gases, and cleaning solutions, to the reaction chambers or wafer surfaces during chip manufacturing.

[0003] Because chip manufacturing processes demand extremely high uniformity and stability in media delivery, the structural design of quartz nozzles (such as deep holes and flow channels) must ensure that the media acts precisely on the wafer surface at a preset flow rate, pressure, and direction. This guarantees the uniformity of etching, deposition, and other processes, directly affecting the pattern accuracy and performance consistency of the chip. Therefore, during the fabrication of quartz nozzles, parameters such as product dimensional accuracy, appearance quality, surface metal impurity content, and surface particulate matter are crucial and directly impact chip manufacturing processes.

[0004] Traditional quartz nozzle manufacturing processes have at least the following problems: (1) Quartz is a hard and brittle material. Unlike the machining methods used for cutting metal materials, quartz products are machined by grinding with cutting tools. This machining method has low processing efficiency and high cost. Especially for quartz nozzles, the product is tall and has many deep small holes. The machining method of grinding with cutting tools layer by layer requires a longer processing time, resulting in extremely low processing efficiency and high cost, which cannot meet market demand. (2) The width of the dovetail groove is not easy to control, resulting in a low yield. (3) The cleaning process is unstable. After cleaning, the content of metal impurities on the surface of the product exceeds the standard or is unstable, which cannot meet the requirements of advanced manufacturing processes.

[0005] To solve the above-mentioned technical problems, it is necessary to improve the traditional preparation methods. Summary of the Invention

[0006] The main objective of this invention is to propose a method for preparing quartz nozzles.

[0007] To address the aforementioned technical problems, this invention proposes a method for preparing a quartz nozzle, the steps of which are as follows: S1. Cut the cylindrical hollow raw material to form a semi-finished product with a blank thickness of [missing information]. ; S2. Grind both ends of the semi-finished product to a thickness of [thickness value missing]. ; S3. Machining the ground semi-finished product; S4. Perform a one-time cleaning treatment on the semi-finished products after machining; S5. Polish the washed semi-finished product; S6. The polished semi-finished product undergoes a second cleaning process to form the finished product. S7. Pack the finished products that meet the appearance requirements; in, mm, This refers to the single-sided thickness grinding amount. This refers to the thickness of the finished product.

[0008] In the above technical solution, further, in step S2, the upper and lower surfaces are first rough ground using a metal tool with a grit size of 200#-325#; then the upper and lower surfaces are finely ground using a resin tool with a grit size of 400#-600#.

[0009] In any of the above technical solutions, further, step S3 includes: machining the inner and outer diameters, which is performed as follows: First, use a metal or electro-coated tool with a grit size of 100#-300# to perform rough machining on the inner and outer diameter sides of the product along the radial direction using a horizontal spiral machining path. Then, use a resin tool with a grit size of 400#-600# to perform finish machining on the inner and outer diameter sides of the product along the radial direction using a horizontal spiral machining path.

[0010] In any of the above technical solutions, further, step S3 includes: deep hole machining; the deep hole machining is as follows: Rotate the semi-finished product and open a guide hole on the end face of the semi-finished product; then use a hollow tool to drill into the guide hole to form a deep hole, wherein the hollow tool drills from top to bottom along the axial direction of the semi-finished product.

[0011] In any of the above technical solutions, the guide hole is further characterized by a flared structure that is wider at the top and narrower at the bottom.

[0012] In any of the above technical solutions, further, step S3 also includes: dovetail groove machining, the dovetail groove machining is as follows: Rotate the semi-finished product and open a dovetail groove on the end face of the semi-finished product; The cutting tool used to machine the dovetail groove is a tapered tool with a smaller upper end and a larger lower end, and the taper D° of the tapered tool is less than the angle C° of the dovetail groove. In any of the above technical solutions, further, step S4 includes: Degreasing and cleaning: Apply cleaning solution to the surface of the machined semi-finished product, then rinse with water and blow dry. Repeat the above steps until the surface of the semi-finished product is clean. Boiling and washing: Place the degreased and washed semi-finished product into a heating tank for high-temperature boiling and washing. After a certain period of time, take out the semi-finished product, rinse it with water, and then blow it dry. Engineering inspection: Inspect the semi-finished products according to the size and appearance inspection standards. Qualified semi-finished products will proceed to the next process. Engineering cleaning: Engineering cleaning is performed on qualified semi-finished products.

[0013] In any of the above technical solutions, the further engineering cleaning steps are as follows: Wipe the entire surface of the product with degreasing solution, then rinse with pure water to ensure no degreasing solution residue remains; immerse the product in a nitric acid bath, then rinse in a pure water bath to ensure no nitric acid solution residue remains; immerse the product in a hydrofluoric acid bath, then rinse and immerse in a pure water bath; finally rinse with pure water.

[0014] In any of the above technical solutions, further, step S5 includes: 1) Flame polishing: Flame polishing of the product surface using an oxyhydrogen flame; 2) Annealing: Place the product in an annealing furnace for annealing; 3) Mechanical polishing: Use a 300-500# resin cutter to cut off the deformed part of the sealing surface; then put polishing fixture one and polishing fixture two on the inner and outer diameters of the product respectively, add polishing liquid between polishing fixture one and polishing fixture two, and use polishing cutter to polish the sealing surface in a spiral processing method.

[0015] In any of the above technical solutions, further, step S6 includes: Degreasing and cleaning: Apply cleaning solution to the surface of the polished semi-finished product, then rinse with water and blow dry. Repeat the above steps until the surface of the semi-finished product is clean. Boiling and washing: Place the degreased and washed semi-finished product into a heating tank for high-temperature boiling and washing. After a certain period of time, take out the semi-finished product, rinse it with water, and then blow it dry. Final inspection: Inspect the semi-finished products according to the size and appearance inspection standards. Qualified semi-finished products will proceed to the next process. Final cleaning: Wipe the entire product surface with degreasing solution, then rinse with pure water to ensure no degreasing solution residue remains; immerse the product in a nitric acid bath, then rinse in a pure water bath to ensure no nitric acid solution residue remains; immerse the product in a hydrofluoric acid bath, then rinse and immerse in a pure water bath; finally rinse with pure water and dry.

[0016] Beneficial effects: Compared with existing technologies, During the machining process, radial spiral machining is used to process the inner and outer diameters, which effectively shortens the machining path of the inner and outer diameters; the opening of guide holes and the use of hollow tools for drilling instead of traditional grinding significantly improve the efficiency of deep hole machining; the reserved straight edge and chamfer design of the dovetail groove, combined with the optimization of the tool angle, can ensure that the groove width tolerance after fire polishing is stable within ±0.03mm.

[0017] The use of gradient cleaning (degreasing + nitric acid + hydrofluoric acid) in the primary and secondary cleaning processes can effectively improve the cleanliness of the product. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the structure of the present invention for wire cutting of raw materials; Figure 2 This is a schematic diagram of the structure for machining the inner and outer diameters of the present invention; Figure 3 This is a schematic diagram of the structure marked with machining allowances during the machining of the inner and outer diameters of the present invention; Figure 4 This is a schematic diagram of the existing technology that uses axial machining of the inner and outer diameters; Figure 5 This is a schematic diagram of the structure during the processing of the guide hole in this invention; Figure 6 yes Figure 5 Enlarged view of point A in the middle; Figure 7 This is a schematic diagram of the structure during deep hole processing according to the present invention; Figure 8 This is a schematic diagram of the structure during the processing of the dovetail groove according to the present invention; Figure 9 This is an enlarged view of the dovetail groove and dovetail groove cutting tool of the present invention; Figure 10 The dovetail groove structure is produced by the dovetail groove tool before fire polishing according to the present invention; Figure 11 This is the structure of the dovetail groove after fire polishing in this invention; Figure 12 This is a schematic diagram of the chamfering and deburring structure of the present invention; Figure 13 This is a schematic diagram of the structure of the semi-finished product of the present invention, showing the chamfering and deburring on the reverse side; Figure 14This is an exploded structural diagram of the annealing plate and the semi-finished product of the present invention; Figure 15 This is a schematic diagram of the structure of the semi-finished product of the present invention with annealing plates at both ends; Figure 16 This is a schematic diagram of the structure of the semi-finished product of the present invention with annealing plates at both ends; Figure 17 These are microscopic photographs of the product surface before and after fire polishing according to the present invention.

[0020] The annotations in the attached figures are explained as follows: 1. Cylindrical hollow raw material; 2. Semi-finished product; 21. Deep hole; 22. Guide hole; 23. Dovetail groove; 3. Fixture; 4. Hollow cutting tool; 5. Dovetail groove cutting tool; 6. Annealing plate; 7. Polishing fixture one; 8. Polishing fixture two; 91. Tool handle; 92. Wool felt. Detailed Implementation

[0021] Hereinafter, exemplary embodiments according to this application will be described in detail with reference to the accompanying drawings. Obviously, the described embodiments are merely a part of the embodiments of this application, and not all of the embodiments of this application. It should be understood that this application is not limited to the exemplary embodiments described herein. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without inventive effort are within the scope of protection of this invention.

[0022] It should be noted that, as shown in this application and claims, unless the context clearly indicates otherwise, the words "a," "an," "an," and / or "the" do not specifically refer to the singular and may also include the plural. Generally speaking, the terms "comprising" and "including" only indicate the inclusion of explicitly identified steps and elements, and these steps and elements do not constitute an exclusive list; the method or apparatus may also include other steps or elements.

[0023] If the embodiments of the present invention involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0024] In this invention, unless otherwise explicitly specified and limited, the terms "connection," "fixed," etc., should be interpreted broadly. For example, "fixed" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0025] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the meaning of "and / or" throughout the text includes three parallel solutions; for example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0026] The following embodiments will provide a detailed description of the quartz nozzle preparation method of this application.

[0027] This embodiment proposes a method for preparing a quartz nozzle, the steps of which are as follows: S1. Cut the cylindrical hollow raw material 1 to form the semi-finished product 2, with a blank thickness of [missing information]. ; S2. Grind both ends of semi-finished product 2 to a thickness of [missing information]. ; S3. Machining the ground semi-finished product 2; S4. Perform a one-time cleaning treatment on the semi-finished product 2 after machining; S5. Polish the washed semi-finished product 2; S6. The polished semi-finished product 2 is washed a second time, and semi-finished product 2 becomes the finished product; S7. Pack the finished products that meet the appearance requirements; in, mm, This refers to the single-sided thickness grinding amount. This is the polishing allowance. This refers to the thickness of the finished product.

[0028] In the preparation of a thickness of When making quartz nozzles, cylindrical hollow quartz material is used. Specifically, for example... Figure 1 As shown, the raw material is first placed on the workbench, then cut into multiple semi-finished products using a wire cutting machine. Each semi-finished product must have a thickness of at least [missing information]. The semi-finished product is then ground, followed by machining, such as... Figures 2-13As shown, it is shaped, then washed, polished, and washed a second time. Finally, the qualified finished product is packaged to complete the production of the quartz nozzle.

[0029] To improve processing efficiency during the manufacturing process, the above steps were optimized.

[0030] Specifically, in step S2, regarding the grinding amount For a thickness of 0.3mm-0.6mm, first use a metal tool with a grit size of 200#-325# to coarsely grind the upper and lower surfaces, leaving an allowance of about 0.1mm for fine grinding; then use a resin tool with a grit size of 400#-600# to finely grind the upper and lower surfaces, removing the 0.1mm allowance.

[0031] Step S3 includes: machining the inner and outer diameters, that is, cutting the inner and outer diameters of the semi-finished product to meet the requirements. The machining of the inner and outer diameters is as follows: The inner and outer diameters of the product are machined using a machining center platform.

[0032] like Figure 2 As shown, the semi-finished product 2 is adhered to the fixture 3 using wax, and the fixture 3 is rotated to make the product rotate synchronously. Then, using a metal or electro-optical cutting tool with a grit size of 100#-300#, a horizontal spiral machining path is used along the radial direction of the product to perform rough machining on the inner and outer diameter sides, leaving a 0.1mm margin on each side for finishing. Subsequently, using a resin cutting tool with a grit size of 400#-600#, a horizontal spiral machining path is used along the radial direction of the product to perform finish machining on the inner and outer diameter sides.

[0033] This tool-assisted machining method, compared to the traditional method of machining from top to bottom along the product's axial direction, reduces the machining path and effectively improves machining efficiency.

[0034] It should be noted that, as Figure 3 As shown, machining in the radial direction has a tool path length of 21mm, while axial machining, as... Figure 4 As shown, the tool path length is 2Lmm. Obviously, 2L>2l, so the radial machining path is shorter than the axial machining path, thus improving efficiency.

[0035] After the inner and outer diameter cutting, step S3 also includes: deep hole machining, machining several required deep holes 21 on the product; the deep hole machining is as follows: like Figure 5 and Figure 6 As shown, a guide hole 22 is made on the end face of the semi-finished product; as Figure 7 As shown, a hollow tool 4 is then used to drill into the guide hole to form a deep hole, wherein the hollow tool 4 drills from top to bottom along the axial direction of the semi-finished product.

[0036] Because quartz is a hard and brittle material, directly using a long cutting tool (whose length is much greater than the hole diameter and has relatively weak rigidity) to drill deep holes during machining will cause the following problems: When the tool initially contacts the quartz surface, due to the "insufficient rigidity of the long tool holder," radial oscillation (i.e., "vibration") is easily generated. Vibration will cause the contact position between the cutting edge of the tool and the quartz hole opening to be unstable, and the head of the machined deep hole is prone to forming a "flared taper" (larger at the top and smaller at the bottom) (instead of a vertical circular hole). Therefore, in this step, a guide hole is first opened using a small tool, and then the deep hole is drilled in the guide hole, effectively avoiding vibration generated when the tool is machining the deep hole characteristics. Specifically, after the guide hole is machined, an internally cooled long cutting tool is used to machine the deep hole. The internally cooled long cutting tool is a hollow tool, and its machining path is from top to bottom. Because the tool is long, its rotation speed needs to be controlled between 3500-4000 rpm, and the feed rate F needs to be controlled between 1-5 mmpm to reduce the oscillation amplitude of the tool during machining.

[0037] It should be noted that the guide hole 22 has a flared shape, wider at the top and narrower at the bottom. This "gradually shrinking structure" (transitioning from large to small) of the guide hole gradually limits the radial movement of the tool shank during the downward feed, acting like a "guide sleeve" to constrain tool oscillation until the tool is fully centered when it enters the deep hole machining section. This suppresses tool vibration and ensures that the deep hole head is free of taper defects. Furthermore, the "gradually sloped surface" of the guide hole changes the contact between the tool edge and the quartz from "point contact" to "line contact" (gradually cutting along the slope), and the cutting force changes from "instantaneous concentration" to "gradual release," preventing the cutting edge from chipping due to sudden excessive force and extending tool life.

[0038] It should be noted that traditional quartz deep hole machining using solid tools is impossible due to the high hardness and brittleness of quartz, making direct drilling impossible. Instead, a "layer-by-layer thread grinding" method (similar to gradually grinding away material with a grinding wheel to form a deep hole) is used. This method requires repeated grinding, resulting in a long machining path (e.g., for a 20mm deep hole, a solid tool needs to grind along a spiral path dozens of times), leading to extremely long processing time and very low efficiency. Therefore, hollow tools are used. Hollow tools enable drilling, and they also reduce weight (preventing sag and wobbling during machining). Furthermore, the hollow channels of the tool create chip removal channels, allowing quartz powder to escape upwards along the inner wall of the deep hole, preventing powder from being compressed and forming tool marks on the hole wall.

[0039] It should be noted that when machining deep holes, to avoid the hollow tool cutting into the surface of the fixture and affecting the machining of the next product, the hollow tool is drilled to the bottom of the product. Stop drilling when the product reaches a certain depth (mm). Afterwards, polish the product after flipping it over to remove impurities. mm.

[0040] like Figure 12 , Figure 13 As shown, after the deep hole machining is completed, the deep hole and the inner and outer diameter ends of the product need to be chamfered and deburred; where, the chamfer value = final product chamfer value + polishing allowance. .

[0041] Using an electrostatic chamfering tool with a grit size of 200#-400#, C0.3 chamfering and deburring are performed at both ends of the deep hole. After chamfering one side, the product is flipped over and attached to a fixture, and the chamfering and deburring are performed again using the same method.

[0042] Step S3 also includes: dovetail groove machining, whereby the dovetail groove 23 is used to install the sealing ring and to seal the product. The dovetail groove machining is as follows: like Figure 8 , Figure 9 As shown, the jig is rotated to make the semi-finished product rotate, and a dovetail groove 23 is opened on the end face of the semi-finished product. Among them, the dovetail groove tool 5 for machining the dovetail groove 23 is a tapered tool with a smaller upper end and a larger lower end, and the taper D° of the tapered tool is less than the angle C° of the dovetail groove 23. Because quartz is a hard and brittle material, processing it generates a large amount of fine quartz powder (a loose, broken layer). If this powder is squeezed between the tool and the workpiece surface, it easily forms "tool marks" or "scratches" on the inner wall of the dovetail groove. Since the dovetail groove is the sealing part of the quartz nozzle (requiring a sealing ring), these tool marks directly damage the smoothness of the sealing surface, leading to subsequent leaks. Therefore, setting the tool angle smaller than the dovetail groove angle changes the contact between the tool and the workpiece from "surface contact" to "line contact." In line contact, the tool edge cuts along a single line with the quartz surface. The quartz powder in the cutting area flows smoothly out through the gap between the tool and the workpiece, preventing it from being squeezed onto the groove wall. Compared to "surface contact tools" (where powder easily gets trapped between the contact surfaces, forming indentations), line contact completely avoids tool marks, significantly reducing the initial surface roughness of the dovetail groove's inner wall and thus ensuring the product's appearance quality.

[0043] It should be noted that the product needs to be flame-polished in the subsequent step S5. Since the feature size of the "RX" part of the product is relatively small, it will deform under the high temperature of the flame polishing, which may cause the width dimension L of the dovetail groove (tolerance requirement ±0.03mm) to exceed the tolerance. Therefore, when processing the dovetail groove, it is necessary to reserve the deformation amount so that the final product size can be achieved after flame polishing.

[0044] Specifically, such as Figure 10 , Figure 11As shown, a straight edge X with the same angle value as RX is reserved, and the two straight edges of the groove are chamfered at C0.2 / R0.2 to remove burrs. The C0.2 / R0.2 chamfer deburring can prevent the dovetail groove opening from protruding after fire polishing.

[0045] Step S4 includes: Degreasing and cleaning: Use a clean sponge to apply some cleaning solution from the prepared cleaning solution tank. Wipe the entire surface of the product with the sponge, then rinse the product with water. After rinsing, blow the product dry with an air gun. Check the product surface for any oil stains or wax. If there are any, repeat the above two steps until the product surface is visibly clean.

[0046] Boiling and washing: Place the product to be washed into the rinsing tank, use a special sponge soaked in cleaning solution to wipe the product all over, and rinse it with water. Place the wiped product into the heating tank and boil it at a high temperature of 90℃ or above for 10-20 minutes. Then remove the product, rinse it with water, and finally dry it with an air gun.

[0047] Engineering inspection: Inspect the semi-finished products according to the size and appearance inspection standards. Qualified semi-finished products will proceed to the next process.

[0048] Engineering cleaning: Engineering cleaning is performed on qualified semi-finished products.

[0049] The cleaning process is as follows: degreasing cleaning → rinsing with pure water → nitric acid cleaning → rinsing with pure water → hydrofluoric acid cleaning → rinsing with pure water → soaking in pure water → rinsing with pure water.

[0050] Specifically, the entire product surface is wiped with degreasing solution (except for the sealing surface, to avoid scratching the sealing polished surface), and then rinsed with pure water for more than 1 minute to ensure that no degreasing solution residue remains; the product is immersed in a nitric acid bath at a solution temperature of about 30°C for more than 20 minutes, and then rinsed in a pure water bath for about 30 seconds to ensure that no nitric acid solution residue remains; the product is then immersed in a hydrofluoric acid bath at a solution temperature of about 30°C for more than 10 minutes, and then rinsed in a pure water bath for about 30 seconds, and then immersed for more than 20 minutes; finally, it is rinsed with pure water.

[0051] Step S5 includes: 1) Flame polishing: Flame polishing of the product surface using an oxyhydrogen flame; 2) Annealing: Place the product in an annealing furnace for annealing; 3) Mechanical polishing: Use a 300-500# resin cutter to cut off the deformed part of the sealing surface; then put polishing fixture one and polishing fixture two on the inner and outer diameters of the product respectively, add polishing liquid between polishing fixture one and polishing fixture two, and use polishing cutter to polish the sealing surface in a spiral processing method.

[0052] Specifically, the product surface is first flame-polished using an oxyhydrogen flame. After flame polishing, the fractured layer on the product surface becomes transparent. Flame polishing removes particles from the product surface (after machining, a loose layer of quartz powder forms on the surface), preventing these particles from affecting the chip manufacturing process. Microscopic images of the product before and after flame polishing are shown below. Figure 17 As shown.

[0053] like Figure 14 , Figure 15 As shown, prepare two annealing plates 6, both made of quartz, with a flatness and parallelism requirement of less than 0.03. First, place the product on one of the annealing plates, then place the other annealing plate on top of the product. Push the product and the annealing plates together into the annealing furnace and anneal at 1150℃ for 1 hour. It should be noted that placing the product between the two plates reduces deformation of the upper and lower surfaces during the high-temperature annealing process.

[0054] After the quartz nozzle undergoes flame polishing (high-temperature treatment with an oxyhydrogen flame) and annealing (high-temperature holding at 1150℃), although the overall deformation is reduced by the double quartz annealing plate, the sealing surface may still experience minor deformations due to localized thermal stress (such as slight protrusions, depressions, or unevenness). If the flatness is not up to standard, it will lead to a loose seal and leakage of the process medium. Therefore, a 300-500# resin tool is needed to remove 0.1mm from the sealing surface to make it smooth and facilitate subsequent mechanical polishing. It should be noted that the resin tool has moderate hardness and can completely remove the minor deformed layer of the sealing surface through "micro-cutting" (removing 0.1mm thickness).

[0055] like Figure 16 As shown, PVC polishing fixture 7 and PVC polishing fixture 8 are fitted onto the inner and outer diameters of the product. The fixtures are secured to the inner and outer diameters of the product by chamfering. Polishing fluid is then added between the inner and outer diameter fixtures, and the sealing surface is polished using a polishing tool in a spiral processing method (to achieve a glossy finish). The polishing tool consists of a handle 91 and a felt 92, which can be replaced when worn.

[0056] Because wool felt is soft and has a certain polishing ability, when used with polishing liquid (such as SiO2 nano polishing liquid), the fine scratches left by resin tools can be gradually removed through "physical friction + chemical action" without scratching the product surface. In addition, the spiral processing path, compared with the reciprocating straight path, can make the polishing marks more uniform and non-directional, ultimately forming a "glossy state".

[0057] Step S6 includes: Degreasing and cleaning: Apply cleaning solution to the surface of the polished semi-finished product, then rinse with water and blow dry. Repeat the above steps until the surface of the semi-finished product is clean. Boiling and washing: Place the degreased and washed semi-finished product into a heating tank for high-temperature boiling and washing. After a certain period of time, take out the semi-finished product, rinse it with water, and then blow it dry. Final inspection: Inspect the semi-finished products according to the size and appearance inspection standards. Qualified semi-finished products will proceed to the next process. Final cleaning: Wipe the entire product surface with degreasing solution, then rinse with pure water to ensure no degreasing solution residue remains; immerse the product in a nitric acid bath, then rinse in a pure water bath to ensure no nitric acid solution residue remains; immerse the product in a hydrofluoric acid bath, then rinse and immerse in a pure water bath; finally rinse with pure water and dry.

[0058] The specific operation methods for degreasing and boiling in step S6 are the same as those for degreasing and boiling in step S4. The final cleaning steps are the same as the engineering cleaning steps, so each cleaning step will not be described further.

[0059] In step S7, the product is inner-packaged in a cleanroom of at least Class 1000 to ensure the cleanliness of the quartz nozzle.

[0060] The various embodiments of this disclosure have been described above. These descriptions are exemplary and not exhaustive, nor are they limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is chosen to best explain the principles, practical application, or improvement of the technology in the market, or to enable others skilled in the art to understand the embodiments disclosed herein.

Claims

1. A method for preparing a quartz nozzle, characterized in that, The preparation method steps are as follows: S1. Cut the cylindrical hollow raw material to form a semi-finished product with a blank thickness of [missing information]. ; S2. Grind both ends of the semi-finished product to a thickness of [thickness value missing]. ; S3. Machining the ground semi-finished product; S4. Perform a one-time cleaning treatment on the semi-finished products after machining; S5. Polish the washed semi-finished product; S6. The polished semi-finished product undergoes a second cleaning process to form the finished product. S7. Pack the finished products that meet the appearance requirements; in, mm, This refers to the single-sided thickness grinding amount. This refers to the thickness of the finished product.

2. The method for preparing a quartz nozzle as described in claim 1, characterized in that, In step S2, the upper and lower surfaces are first rough-ground using a metal tool with a grit size of 200#-325#; then, the upper and lower surfaces are fine-ground using a resin tool with a grit size of 400#-600#.

3. The method for preparing a quartz nozzle as described in claim 1, characterized in that, Step S3 includes: machining the inner and outer diameters, wherein the machining of the inner and outer diameters is as follows: First, use a metal or electro-coated tool with a grit size of 100#-300# to perform rough machining on the inner and outer diameter sides of the product along the radial direction using a horizontal spiral machining path. Then, use a resin tool with a grit size of 400#-600# to perform finish machining on the inner and outer diameter sides of the product along the radial direction using a horizontal spiral machining path.

4. The method for preparing a quartz nozzle as described in claim 1, characterized in that, Step S3 further includes: deep hole machining; the deep hole machining is as follows: Rotate the semi-finished product and open a guide hole on the end face of the semi-finished product; then use a hollow tool to drill into the guide hole to form a deep hole, wherein the hollow tool drills from top to bottom along the axial direction of the semi-finished product.

5. The method for preparing a quartz nozzle as described in claim 4, characterized in that, The guide hole has a funnel-shaped structure that is wider at the top and narrower at the bottom.

6. The method for preparing a quartz nozzle as described in claim 1, characterized in that, Step S3 further includes: dovetail groove machining, wherein the dovetail groove machining is as follows: Rotate the semi-finished product and open a dovetail groove on the end face of the semi-finished product; Among them, the tool used to process the dovetail groove is a tapered tool with a smaller upper end and a larger lower end, and the taper D° of the tapered tool is less than the angle C° of the dovetail groove.

7. The method for preparing a quartz nozzle as described in claim 1, characterized in that, Step S4 includes: Degreasing and cleaning: Apply cleaning solution to the surface of the machined semi-finished product, then rinse with water and blow dry. Repeat the above steps until the surface of the semi-finished product is clean. Boiling and washing: Place the degreased and washed semi-finished product into a heating tank for high-temperature boiling and washing. After a certain period of time, take out the semi-finished product, rinse it with water, and then blow it dry. Engineering inspection: Inspect the semi-finished products according to the size and appearance inspection standards. Qualified semi-finished products will proceed to the next process. Engineering cleaning: Engineering cleaning is performed on qualified semi-finished products.

8. The method for preparing a quartz nozzle as described in claim 7, characterized in that, The cleaning process is as follows: Wipe the entire surface of the product with degreasing solution, then rinse with pure water to ensure no degreasing solution residue remains; immerse the product in a nitric acid bath, then rinse in a pure water bath to ensure no nitric acid solution residue remains; immerse the product in a hydrofluoric acid bath, then rinse and immerse in a pure water bath; finally rinse with pure water and dry.

9. The method for preparing a quartz nozzle as described in claim 1, characterized in that, Step S5 includes: 1) Flame polishing: Flame polishing of the product surface using an oxyhydrogen flame; 2) Annealing: Place the product in an annealing furnace for annealing; 3) Mechanical polishing: Use a 300-500# resin cutter to cut off the deformed part of the sealing surface; then put polishing fixture one and polishing fixture two on the inner and outer diameters of the product respectively, add polishing liquid between polishing fixture one and polishing fixture two, and use polishing cutter to polish the sealing surface in a spiral processing method.

10. The method for preparing a quartz nozzle as described in claim 1, characterized in that, Step S6 includes: Degreasing and cleaning: Apply cleaning solution to the surface of the polished semi-finished product, then rinse with water and blow dry. Repeat the above steps until the surface of the semi-finished product is clean. Boiling and washing: Place the degreased and washed semi-finished product into a heating tank for high-temperature boiling and washing. After a certain period of time, take out the semi-finished product, rinse it with water, and then blow it dry. Final inspection: Inspect the semi-finished products according to the size and appearance inspection standards. Qualified semi-finished products will proceed to the next process. Final cleaning: Wipe the entire product surface with degreasing solution, then rinse with pure water to ensure no degreasing solution residue remains; immerse the product in a nitric acid bath, then rinse in a pure water bath to ensure no nitric acid solution residue remains; immerse the product in a hydrofluoric acid bath, then rinse and immerse in a pure water bath; finally rinse with pure water and dry.

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