Chip mass production test method and device, storage medium and electronic equipment

Abstract

The application discloses a chip mass production test method and device, a storage medium and an electronic equipment. The chip mass production test method comprises the following steps: defining a test interval, wherein the test interval comprises at least one sub-test interval; selecting a plurality of chips from a chip set of the same batch and belonging to the same corner as observation samples, and taking the remaining chips as test objects; reading temperature digital code values of temperature sensors of the observation samples at the start point and the end point of the sub-test interval respectively to obtain start point code and end point code; obtaining a first temperature change amount according to the start point code and the end point code; calculating a reference value and a deviation threshold value based on the first temperature change amount; obtaining a second temperature change amount of each test object at the start point code and the end point code of the sub-test interval; calculating the deviation of the second temperature change amount and the reference value, and determining whether the test object is qualified according to the comparison between the deviation and the deviation threshold value. The application can improve the efficiency of chip production test.

Description

Technical Field

[0001] This application relates to the field of chip temperature testing technology, specifically to a chip mass production testing method, apparatus, storage medium, and electronic device. Background Technology

[0002] As chip integration density and operating frequency continue to increase, the heat generated during chip operation gradually increases, and temperature changes significantly impact chip performance and reliability. To monitor and dynamically adjust the internal temperature of chips, temperature sensors have become common built-in functional modules. The accuracy of chip temperature sensors directly affects the reliability of functions such as temperature compensation, dynamic power management, and overheat protection. Therefore, during the chip production and testing phase, chips with abnormal temperature sensor measurement performance are typically rejected.

[0003] Currently, temperature sensor testing mainly relies on external temperature control equipment (such as hot plates, temperature control chambers, etc.) to establish temperature profiles by measuring the output values ​​of the temperature sensor at multiple set temperature points. However, external temperature control devices require heating or cooling times of tens of seconds or even minutes to achieve temperature changes, resulting in low production line efficiency. Summary of the Invention

[0004] This application provides a chip mass production testing method, apparatus, storage medium, and electronic device, which can improve the efficiency of chip mass production testing.

[0005] In a first aspect, embodiments of this application provide a chip mass production testing method, including:

[0006] Define a test interval, which includes at least one sub-test interval, and the sub-test interval corresponds to the interval where the temperature changes significantly during chip production testing;

[0007] Several chips were selected from the same batch of chips belonging to the same corner as observation samples, and the remaining chips were used as test objects.

[0008] The temperature digital code values ​​of the temperature sensor of the observed sample are read at the beginning and end of the sub-test interval respectively to obtain the start code and end code, and then the first temperature change is obtained.

[0009] Calculate the reference value and deviation threshold based on the first temperature change;

[0010] The temperature digital code values ​​of the temperature sensor of the test object are read at the beginning and end of the sub-test interval respectively to obtain the start code and end code, and then the second temperature change is obtained.

[0011] The test object is deemed qualified based on the reference value, the deviation threshold, and the second temperature change.

[0012] In the chip mass production testing method provided in this application embodiment, the step of calculating the reference value and deviation threshold based on the first temperature change includes:

[0013] Calculate the reference value based on the first temperature change;

[0014] The deviation threshold is calculated based on the first temperature change and the reference value.

[0015] In the chip mass production testing method provided in this application embodiment, the step of calculating the reference value based on the first temperature change includes:

[0016] By removing the maximum and minimum values ​​from several of the first temperature changes, a set of standard change values ​​is obtained;

[0017] Obtain the average value of the standard set of change values ​​and use it as a reference value.

[0018] In the chip mass production testing method provided in this application embodiment, the step of calculating the deviation threshold based on the first temperature change and the reference value includes:

[0019] Calculate the deviation value of each observed sample relative to the reference value based on the first temperature change;

[0020] The deviation threshold is obtained by taking the arithmetic mean of several deviation values.

[0021] In the chip mass production testing method provided in this application embodiment, when the test interval includes a sub-test interval, determining whether the chip is qualified based on the reference value, the deviation threshold, and the second temperature change includes:

[0022] Calculate the absolute value of the difference between the second temperature change and the reference value;

[0023] When the absolute value of the difference is greater than or equal to the deviation threshold, the chip is determined to be defective.

[0024] When the absolute value of the difference is less than the deviation threshold, the chip is determined to be qualified.

[0025] In the chip mass production testing method provided in this application embodiment, when the test interval includes at least two sub-test intervals, determining whether the chip is qualified based on the reference value, the deviation threshold, and the second temperature change includes:

[0026] Calculate the absolute value of the difference between the second temperature change and the reference value;

[0027] The absolute value of the difference is compared with the deviation threshold, and the test mark of the chip in each sub-test interval is determined based on the comparison result;

[0028] When the first mark in the test marks is greater than a preset number, the chip is determined to be defective.

[0029] In the chip mass production testing method provided in this application embodiment, determining the test marker of the chip in each of the sub-test intervals based on the comparison results includes:

[0030] When the absolute value of the difference is greater than or equal to the deviation threshold, the test mark of the chip in the corresponding sub-test interval is determined as the first mark;

[0031] When the absolute value of the difference is less than the deviation threshold, the test mark of the chip in the corresponding sub-test interval is determined as the second mark.

[0032] Secondly, embodiments of this application provide a chip mass production testing apparatus, comprising:

[0033] A definition unit is used to define a test interval, which includes at least one sub-test interval, and the sub-test interval corresponds to the interval where the temperature changes significantly during chip production testing;

[0034] The selection unit is used to select a number of chips as observation samples from a chip set that is from the same batch and belongs to the same corner, while the remaining chips are used as test objects.

[0035] The reading unit is used to read the temperature digital code value of the temperature sensor of the observed sample at the start and end of the sub-test interval respectively, to obtain the start code and end code, and then to obtain the first temperature change.

[0036] The calculation unit is used to calculate a reference value and a deviation threshold based on the first temperature change.

[0037] The acquisition unit is used to read the temperature digital code value of the temperature sensor of the test object at the start and end of the sub-test interval respectively, to obtain the start code and end code, and then to obtain the second temperature change amount;

[0038] The determining unit is used to determine whether the test object is qualified based on the reference value, the deviation threshold and the second temperature change.

[0039] Thirdly, this application provides a storage medium storing a plurality of instructions adapted for loading by a processor to execute any of the chip mass production testing methods described above.

[0040] Fourthly, this application provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement the chip mass production testing method described in any of the above claims.

[0041] In summary, the chip mass production testing method provided in this application includes defining a test interval, which includes at least one sub-test interval, corresponding to the interval where the temperature changes significantly during chip mass production testing; selecting several chips from a set of chips in the same batch and belonging to the same corner as observation samples, and the remaining chips as test objects; reading the temperature digital code values ​​of the temperature sensors of the observation samples at the start and end points of the sub-test intervals to obtain start code and end code, thereby obtaining a first temperature change; calculating a reference value and a deviation threshold based on the first temperature change; reading the temperature digital code values ​​of the temperature sensors of the test objects at the start and end points of the sub-test intervals to obtain start code and end code, thereby obtaining a second temperature change; and determining whether the test object is qualified based on the reference value, the deviation threshold, and the second temperature change. This application utilizes the self-heating during chip mass production testing as a temperature sensor measurement condition to eliminate chips with abnormal temperature sensors, thereby improving the efficiency of chip mass production testing. Attached Figure Description

[0042] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0043] Figure 1 This is a flowchart illustrating the chip mass production testing method provided in the embodiments of this application.

[0044] Figure 2 This is a schematic diagram of the chip mass production testing device provided in the embodiments of this application.

[0045] Figure 3 This is a schematic diagram of the structure of the electronic device provided in the embodiments of this application. Detailed Implementation

[0046] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0047] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Furthermore, components, features, and elements with the same names in different embodiments of this application may have the same meaning or different meanings, the specific meaning of which must be determined by its interpretation in that specific embodiment or further in conjunction with the context of that specific embodiment.

[0048] It should be understood that the specific embodiments described herein are merely illustrative of this application and are not intended to limit this application.

[0049] In the following description, the use of suffixes such as "module," "part," or "unit" to denote elements is solely for the purpose of illustrative purposes and has no specific meaning in itself. Therefore, "module," "part," or "unit" may be used interchangeably.

[0050] In the description of this application, it should be noted that the terms "upper," "lower," "left," "right," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. In addition, terms such as "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0051] Currently, temperature sensor testing mainly relies on external temperature control equipment (such as hot plates, temperature control chambers, etc.) to establish temperature profiles by measuring the output code values ​​of the temperature sensor at multiple set temperature points. However, differences in temperature response delay and thermal coupling between different devices or fixtures can introduce systematic errors, resulting in lower accuracy of temperature sensor test results.

[0052] In addition, this type of method has high requirements for the testing environment, high equipment costs, and long testing cycles, which is not conducive to large-scale implementation in the mass production stage.

[0053] Based on this, embodiments of this application provide a chip mass production testing method, apparatus, storage medium, and electronic device. Specifically, the chip mass production testing apparatus can be integrated into an electronic device, which can be a server or a terminal, etc. The terminal can include mobile phones, wearable smart devices, tablet computers, laptops, and personal computers (PCs), etc. The server can be a single server or a server cluster composed of multiple servers, and can be a physical server or a virtual server.

[0054] The technical solutions shown in this application will be described in detail below through specific embodiments. It should be noted that the order of description of the following embodiments is not intended to limit the priority of the embodiments.

[0055] Please see Figure 1 , Figure 1 This is a flowchart illustrating the chip mass production testing method provided in this application embodiment. The specific flow of this chip mass production testing method can be as follows:

[0056] 101. Define a test interval, which includes at least one sub-test interval, and the sub-test interval corresponds to the interval where the temperature changes significantly during the chip production test.

[0057] In this embodiment, the test interval is used to determine the time range for temperature acquisition during chip mass production testing. By defining this test interval, a stable and repeatable temperature change process can be obtained during the chip's self-heating process, thereby avoiding interference from external temperature control equipment. Significant temperature change refers to a noticeable change in the chip's surface or internal temperature within a short period during chip production testing, with the magnitude or rate of change exceeding a preset threshold.

[0058] When the test interval includes a sub-test interval, the sub-test interval can start at the chip's power-on time or a predetermined start event and end at a predetermined termination event. Specifically, the predetermined start event can be an identifiable state such as chip power-on, system reset, startup completion, or entry into a specific test mode. The predetermined termination event can be the chip reaching a stable workload, completing a specific test task, or running for a preset time threshold.

[0059] It should be noted that the start and end points can be automatically identified and recorded by the test control system, or they can be configured through external test scripts.

[0060] In some embodiments, the sub-test interval can be preset in length based on the chip's thermal profile or power consumption model, such as 5 seconds, 10 seconds, or other adjustable times, to ensure that the chip temperature can produce an observable increase within the sub-test interval. Each sub-test interval corresponds to a time period or stage (interval) during chip production testing where temperature changes are significant. For example, during the chip power-on startup, entering a high-power test mode, or performing a specific computational load, the increased internal power consumption causes a rapid temperature rise; such intervals can be divided into sub-test intervals. By observing within these representative temperature change intervals, the thermal response characteristics of the chip under typical workloads can be more accurately reflected.

[0061] When the test interval includes at least two sub-test intervals, each sub-test interval can correspond to a time period or functional stage in the chip's operation, such as the startup stage, power-on stage, or load stabilization stage. By performing temperature acquisition and calculation separately in multiple sub-test intervals, multi-dimensional information on chip temperature changes can be obtained, thereby more accurately evaluating the response consistency of the temperature sensor under different thermal conditions.

[0062] In another embodiment, to avoid time errors caused by manual operation, the starting point of the sub-test interval can be triggered by an automatic timing control module. For example, after the chip is powered on, the test controller can automatically time the test, send a sampling signal at a preset time point, and read the temperature digital code value from the temperature sensor. This automatic control method can ensure that the test time windows of different chips are strictly consistent, thereby improving the comparability between samples.

[0063] Furthermore, sub-test intervals can be integrated with existing functional test items in the production testing process, such as "power-on test," "current consumption test," and "logic function verification." By reusing the time windows of these stages for temperature sensor sampling, there is no need to extend the test cycle, thus achieving efficient integration of the testing process.

[0064] By implementing the above settings, not only is the temperature sampling time window standardized, but consistency in test conditions, heating states, and sampling timing is also ensured across different chips. This consistency forms the basis for subsequent calculations of reference values ​​and deviation thresholds, thus guaranteeing the accuracy and repeatability of temperature sensor test results.

[0065] 102. Select a number of chips from the same batch and belonging to the same corner as observation samples, and use the remaining chips as test objects.

[0066] To establish a statistical model of temperature changes, a number of chips need to be selected from the chip set under test as observation samples, while the remaining chips are used as test objects. The chip set should come from the same production batch and belong to the same corner, that is, under the same combination of process parameters, voltage, and temperature conditions, to ensure that the measured temperature characteristics can reflect the true chip performance without being interfered with by process or environmental deviations.

[0067] It should be noted that the number of observation samples should be no less than 1 / 10 of the number of chips in the batch to ensure the representativeness of the statistical results. The selection of observation samples can be carried out by random sampling or equal sampling according to the wafer distribution to ensure that the samples can cover the overall characteristics of the batch.

[0068] Understandably, since the observed samples and the test objects belong to the same batch, the same corner, and the same test interval, a reliable statistical reference can be obtained by using the average performance of the observed samples, effectively eliminating the influence of process and environmental factors on single-chip data.

[0069] 103. Read the temperature digital code values ​​of the temperature sensor of the observed sample at the start and end points of the sub-test interval respectively to obtain the start code and end code, and then obtain the first temperature change.

[0070] In this embodiment, the temperature digital code value of the temperature sensor of each observed sample chip can be read at the beginning and end of each sub-test interval. This temperature digital code value is the digital measurement result output by the internal temperature sensor of the chip, and can be read through the on-chip register interface or an external test machine.

[0071] To ensure consistent sampling time points, the sampling process is triggered by an automatic timer or test control module. The system can start timing after the chip is powered on and automatically execute sampling commands at each preset time point. Sampling data can be uploaded to a host computer or production test server in real time for recording.

[0072] It is important to note that during temperature acquisition, the test environment should be kept stable, ensuring that all observed samples are under the same operating conditions. For example, the test power supply voltage, clock frequency, and load should all remain consistent. By standardizing the sampling timing and environmental conditions, data fluctuations caused by non-temperature factors can be minimized, providing highly consistent raw data for subsequent calculations.

[0073] After obtaining the starting and ending codes, the first temperature change can be obtained. Specifically, this can be determined based on the starting code. and the destination code Calculate the temperature change for each observed sample. ,Right now .

[0074] 104. Calculate the reference value and deviation threshold based on the first temperature change.

[0075] Specifically, it can be based on the first temperature change. Calculate the reference value; based on the first temperature change. and reference value Calculate the deviation threshold .

[0076] In some embodiments, the maximum and minimum values ​​of several first temperature changes can be removed first to obtain a standard set of change values; then the average value of the standard set of change values ​​can be obtained and used as a reference value.

[0077] In some embodiments, the deviation value of each observed sample relative to a reference value can be calculated based on the first temperature change; the arithmetic mean of several deviation values ​​can be taken to obtain a deviation threshold.

[0078] In addition, the sample standard deviation of the deviation value can be calculated to assess the degree of dispersion. When the sample standard deviation or the mean deviation exceeds the preset range, the corresponding abnormal observation sample can be removed, and the reference value and deviation threshold can be recalculated based on the remaining observation sample.

[0079] The arithmetic mean of several deviation values ​​is used to obtain the deviation threshold, as shown below:

[0080] .

[0081] The sample standard deviation of the deviation values ​​can be calculated as follows:

[0082] .

[0083] The above method can automatically filter out abnormal points, ensuring that the obtained reference values ​​and thresholds accurately reflect the temperature rise characteristics of normal chips.

[0084] 105. Read the temperature digital code value of the temperature sensor of the test object at the start and end of the sub-test interval respectively to obtain the start code and end code, and then obtain the second temperature change.

[0085] For each test object, the temperature sensor's digital code value can be read at the start and end points of the corresponding sub-test interval, and the difference between the two values ​​can be calculated to obtain the second temperature change of each test object in the sub-test interval.

[0086] 106. Determine whether the test object is qualified based on the reference value, the deviation threshold, and the second temperature change.

[0087] In some embodiments, when the test interval includes a sub-test interval, the absolute value of the difference between the second temperature change and the reference value can be calculated first; when the absolute value of the difference is greater than or equal to the deviation threshold, the chip is determined to be unqualified; when the absolute value of the difference is less than the deviation threshold, the chip is determined to be qualified.

[0088] In another embodiment, when the test interval includes at least two sub-test intervals, the absolute value of the difference between the second temperature change and the reference value can be calculated first; then the absolute value of the difference can be compared with the deviation threshold, and the test mark of the chip in each sub-test interval can be determined according to the comparison result; when the first mark in the test mark is greater than a preset number, the chip is determined to be unqualified.

[0089] Specifically, when the absolute value of the difference is greater than or equal to the deviation threshold, the test mark of the chip in the corresponding sub-test interval is determined as the first mark; when the absolute value of the difference is less than the deviation threshold, the test mark of the chip in the corresponding sub-test interval is determined as the second mark.

[0090] In some embodiments, the theoretical temperature rise of the chip within a specific test range can be directly obtained based on laboratory simulation or theoretical analysis. This theoretical value can be used as a reference value for subsequent chip temperature rise determination. Similarly, when the theoretical temperature rise is used as a reference value, the deviation threshold is no longer obtained through statistical analysis of observed samples, but is determined through process experience, theoretical model error, or safety margin. Since the reference value comes from the theoretical model, there is no need to calculate the average value and deviation threshold through observed samples, so steps 102, 103, and 104 in the original process can be omitted.

[0091] In summary, the chip mass production testing method provided in this application includes defining a test interval, which includes at least one sub-test interval, corresponding to the interval where the temperature changes significantly during chip production testing; selecting several chips from a set of chips in the same batch and belonging to the same corner as observation samples, and the remaining chips as test objects; reading the temperature digital code values ​​of the temperature sensors of the observation samples at the start and end points of the sub-test intervals to obtain the start code and end code, thereby obtaining a first temperature change; calculating a reference value and a deviation threshold based on the first temperature change; reading the temperature digital code values ​​of the temperature sensors of the test objects at the start and end points of the sub-test intervals to obtain the start code and end code, thereby obtaining a second temperature change; and determining whether the test object is qualified based on the reference value, the deviation threshold, and the second temperature change. This application embodiment, by defining a unified test interval during the chip's self-heating process and collecting the temperature digital code values ​​at the start and end points on chips in the same batch and belonging to the same corner, and using statistical methods to calculate the reference value and deviation threshold, achieves dynamic evaluation of the consistency of temperature sensor output. Because the test intervals are fixed, the sample sources are consistent, and the calculations use a combination of mean and standard deviation, the impact of differences in the test environment, process fluctuations, and human error is effectively reduced. Therefore, the calculation of reference values ​​and deviation thresholds is stable and reliable. Since the selection of sub-test intervals reuses other test items on the chip production line, no additional test time or external temperature environment change times at the second or even minute level are required. Therefore, the testing efficiency of chip temperature sensors can be improved without increasing additional testing costs, thereby improving the efficiency of chip mass production testing.

[0092] To facilitate better implementation of the chip mass production testing method provided in this application, this application also provides a chip mass production testing apparatus. The meanings of the terms used are the same as in the chip mass production testing method described above, and specific implementation details can be found in the descriptions within the method embodiments.

[0093] Please see Figure 2 , Figure 2 This is a schematic diagram of the chip mass production testing apparatus provided in an embodiment of this application. The chip mass production testing apparatus may include a definition unit 201, a selection unit 202, a reading unit 203, a calculation unit 204, an acquisition unit 205, and a determination unit 206.

[0094] Definition unit 201 is used to define a test interval, which includes at least one sub-test interval, and the sub-test interval corresponds to the interval where the temperature changes significantly during chip production testing.

[0095] The selection unit 202 is used to select a number of chips as observation samples from a chip set that is from the same batch and belongs to the same corner, and the remaining chips as test objects.

[0096] The reading unit 203 is used to read the temperature digital code value of the temperature sensor of the observed sample at the start and end of the sub-test interval, respectively, to obtain the start code and end code, and then to obtain the first temperature change.

[0097] Calculation unit 204 is used to calculate a reference value and a deviation threshold based on the first temperature change.

[0098] The acquisition unit 205 is used to read the temperature digital code value of the temperature sensor of the test object at the start and end of the sub-test interval respectively, to obtain the start code and end code, and then to obtain the second temperature change amount;

[0099] The determination unit 206 is used to determine whether the test object is qualified based on the reference value, the deviation threshold, and the second temperature change.

[0100] For specific implementation methods of each of the above units, please refer to the embodiments of the chip mass production testing method described above, which will not be repeated here.

[0101] In summary, the chip mass production testing apparatus provided in this application embodiment can define a test interval through the definition unit 201. The test interval includes at least one sub-test interval, which corresponds to the interval where the temperature changes significantly during chip production testing. The selection unit 202 selects several chips from a set of chips in the same batch and belonging to the same corner as observation samples, and the remaining chips as test objects. The reading unit 203 reads the temperature digital code values ​​of the temperature sensors of the observation samples at the start and end points of the sub-test intervals to obtain the start code and end code, thereby obtaining the first temperature change. The calculation unit 204 calculates a reference value and a deviation threshold based on the first temperature change. The acquisition unit 205 reads the temperature digital code values ​​of the temperature sensors of the test objects at the start and end points of the sub-test intervals to obtain the start code and end code, thereby obtaining the second temperature change. The determination unit 206 determines whether the test object is qualified based on the reference value, the deviation threshold, and the second temperature change. This application's embodiments define a unified test interval during the chip's self-heating process and collect temperature digital codes at the start and end points from chips in the same batch and at the same corner. Statistical methods are used to calculate reference values ​​and deviation thresholds, achieving dynamic evaluation of the temperature sensor's output consistency. Because the test interval is fixed, the sample source is consistent, and the calculation uses a combination of mean and standard deviation, the impact of differences in the testing environment, process fluctuations, and human error is effectively reduced. Therefore, the calculation of reference values ​​and deviation thresholds is stable and reliable. Since the selection of sub-test intervals reuses other test items on the chip production line, no additional testing time or external temperature environment change times at the second or even minute level are required. Therefore, the testing efficiency of the chip temperature sensor can be improved without increasing additional testing costs, thereby improving the efficiency of chip mass production testing.

[0102] This application also provides an electronic device that may integrate the chip mass production testing device of this application, such as... Figure 3 As shown, it illustrates a structural schematic diagram of the electronic device involved in the embodiments of this application, specifically:

[0103] The electronic device may include components such as a processor 301 with one or more processing cores and a memory 302 with one or more computer-readable storage media. Those skilled in the art will understand that... Figure 3 The electronic device structure shown does not constitute a limitation on the electronic device and may include more or fewer components than shown, or combine certain components, or have different component arrangements. Wherein:

[0104] The processor 301 is the control center of the electronic device. It connects various parts of the electronic device via various interfaces and lines. By running or executing software programs stored in the memory 302 and / or this application, and by calling data stored in the memory 302, it performs various functions and processes data, thereby providing overall monitoring of the electronic device. Optionally, the processor 301 may include one or more processing cores; preferably, the processor 301 may integrate an application processor and a modem processor, wherein the application processor mainly handles the operation of the storage medium, user interface, and application programs, while the modem processor mainly handles wireless communication. It is understood that the modem processor may not be integrated into the processor 301.

[0105] The memory 302 can be used to store software programs and this application. The processor 301 executes various functional applications and data processing by running the software programs and this application stored in the memory 302. The memory 302 may mainly include a program storage area and a data storage area. The program storage area may store applications required for operating the storage medium and at least one function; the data storage area may store data created based on the use of the electronic device. In addition, the memory 302 may include high-speed random access memory and may also include non-volatile memory, such as at least one disk storage device, flash memory device, or other volatile solid-state storage device. Accordingly, the memory 302 may also include a memory controller to provide the processor 301 with access to the memory 302.

[0106] Although not shown, the electronic device may also include a display unit, an input unit, and a power supply, etc., which will not be described in detail here. Specifically, in this embodiment, the processor 301 in the electronic device loads the executable files corresponding to the processes of one or more application programs into the memory 302 according to the following instructions, and the processor 301 runs the application programs stored in the memory 302 to realize various functions, as follows:

[0107] Define a test interval, which includes at least one sub-test interval. The sub-test interval corresponds to the interval where the temperature changes significantly during chip production testing.

[0108] Several chips were selected from the same batch of chips belonging to the same corner as observation samples, and the remaining chips were used as test objects.

[0109] The temperature digital code values ​​of the temperature sensor of the observed sample are read at the beginning and end of the sub-test interval respectively to obtain the start code and end code, and then the first temperature change is obtained.

[0110] Calculate the reference value and deviation threshold based on the first temperature change;

[0111] The temperature digital code values ​​of the temperature sensor of the test object are read at the beginning and end of the sub-test interval respectively to obtain the start code and end code, and then the second temperature change is obtained.

[0112] The suitability of the test object is determined based on the reference value, the deviation threshold, and the second temperature change.

[0113] Those skilled in the art will understand that all or part of the steps in the various methods of the above embodiments can be performed by instructions, or by instructions controlling related hardware. These instructions can be stored in a computer-readable storage medium and loaded and executed by a processor.

[0114] Therefore, embodiments of this application provide a storage medium storing a plurality of instructions that can be loaded by a processor to execute steps in any of the methods provided in embodiments of this application. For example, the instructions can execute the following steps:

[0115] Define a test interval, which includes at least one sub-test interval. The sub-test interval corresponds to the interval where the temperature changes significantly during chip production testing.

[0116] Several chips were selected from the same batch of chips belonging to the same corner as observation samples, and the remaining chips were used as test objects.

[0117] The temperature digital code values ​​of the temperature sensor of the observed sample are read at the beginning and end of the sub-test interval respectively to obtain the start code and end code, and then the first temperature change is obtained.

[0118] Calculate the reference value and deviation threshold based on the first temperature change;

[0119] The temperature digital code values ​​of the temperature sensor of the test object are read at the beginning and end of the sub-test interval respectively to obtain the start code and end code, and then the second temperature change is obtained.

[0120] The suitability of the test object is determined based on the reference value, the deviation threshold, and the second temperature change.

[0121] For details on the implementation of each of the above operations, please refer to the previous examples, which will not be repeated here.

[0122] The storage medium may include: read-only memory (ROM), random access memory (RAM), disk or optical disk, etc.

[0123] Since the instructions stored in the storage medium can execute the steps of any method provided in the embodiments of this application, the beneficial effects that any method provided in the embodiments of this application can achieve can be realized. For details, please refer to the previous embodiments, which will not be repeated here.

[0124] The chip mass production testing method, apparatus, storage medium, and electronic device provided in this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the above embodiments are only for the purpose of helping to understand the core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A method of mass testing of chips, characterized by, The method comprises the following steps: defining a test interval, wherein the test interval comprises at least one sub-test interval, and the sub-test interval corresponds to an interval with significant temperature change in a chip production process; selecting a plurality of chips from a chip set of the same batch and belonging to the same corner as observation samples, and the rest of the chips as test objects; reading temperature digital code values of temperature sensors of the observation samples at the start point and the end point of the sub-test interval respectively, obtaining start point code and end point code, and further obtaining a first temperature change amount; calculating a reference value and a deviation threshold value based on the first temperature change amount; reading temperature digital code values of temperature sensors of the test objects at the start point and the end point of the sub-test interval respectively, obtaining start point code and end point code, and further obtaining a second temperature change amount; determining whether the test object is qualified according to the reference value, the deviation threshold value and the second temperature change amount.

2. The chip production test method according to Claim 1, wherein The method of calculating a reference value and a deviation threshold value based on the first temperature change amount comprises the following steps: calculating a reference value according to the first temperature change amount; calculating a deviation threshold value according to the first temperature change amount and the reference value.

3. The chip production test method according to Claim 2, wherein The method of calculating a reference value according to the first temperature change amount comprises the following steps: removing the maximum value and the minimum value from a plurality of the first temperature change amounts to obtain a standard change value set; obtaining the average value of the standard change value set as the reference value.

4. The chip mass production test method according to Claim 2, wherein The method of calculating a deviation threshold value according to the first temperature change amount and the reference value comprises the following steps: calculating the deviation value of each observation sample relative to the reference value according to the first temperature change amount; performing arithmetic average on a plurality of the deviation values to obtain the deviation threshold value.

5. The chip production test method according to Claim 1, wherein When the test interval comprises one sub-test interval, the method of determining whether the chip is qualified according to the reference value, the deviation threshold value and the second temperature change amount comprises the following steps: calculating the absolute value of the difference between the second temperature change amount and the reference value; when the absolute value of the difference is greater than or equal to the deviation threshold value, determining that the chip is unqualified; when the absolute value of the difference is less than the deviation threshold value, determining that the chip is qualified.

6. The chip production test method according to Claim 1, wherein When the test interval comprises at least two sub-test intervals, the method of determining whether the chip is qualified according to the reference value, the deviation threshold value and the second temperature change amount comprises the following steps: calculating the absolute value of the difference between the second temperature change amount and the reference value; comparing the absolute value of the difference with the deviation threshold value, and determining the test mark of the chip in each sub-test interval according to the comparison result; when the first mark in the test mark is greater than a preset number, determining that the chip is unqualified.

7. The chip production test method according to Claim 6, wherein The method of determining the test mark of the chip in each sub-test interval according to the comparison result comprises the following steps: when the absolute value of the difference is greater than or equal to the deviation threshold value, determining the test mark of the chip in the corresponding sub-test interval as a first mark; when the absolute value of the difference is less than the deviation threshold value, determining the test mark of the chip in the corresponding sub-test interval as a second mark.

8. A chip mass production testing apparatus characterized by comprising: The method comprises the following steps: The definition unit is configured to define a test interval, the test interval including at least one sub-test interval, the sub-test interval corresponding to an interval with significant temperature change in a chip production test process; The selection unit is configured to select a plurality of chips as observation samples from a chip set of the same batch and belonging to the same corner, and the rest of the chips as test objects; The reading unit is configured to read temperature digital code values of temperature sensors of the observation samples at a start point and an end point of the sub-test interval respectively, to obtain start point code and end point code, and to further obtain a first temperature change amount; The calculation unit is configured to calculate a reference value and a deviation threshold based on the first temperature change amount; The acquisition unit is configured to read temperature digital code values of temperature sensors of the test objects at the start point and the end point of the sub-test interval respectively, to obtain start point code and end point code, and to further obtain a second temperature change amount; The determination unit is configured to determine whether the test objects are qualified according to the reference value, the deviation threshold and the second temperature change amount.

9. A storage medium, characterized by The storage medium stores a plurality of instructions, the instructions being adapted to be loaded by the processor to execute the chip mass production test method of any one of claims 1-7.

10. An electronic device, comprising: The computer program is stored in the memory and executable on the processor, and when the processor executes the computer program, the chip mass production test method of any one of claims 1-7 is implemented.

Images