Integrated degumming and cleaning system for silicon wafer and degumming and cleaning process of integrated degumming and cleaning system

Abstract

The invention relates to an integrated degumming and cleaning system for a silicon wafer and a degumming and cleaning process of the integrated degumming and cleaning system. Comprising a wafer receiving frame, a first aeration device, a gutter channel, wafer moving mechanisms oppositely arranged in the gutter channel, a wafer overturning mechanism for overturning silicon wafers and an air blowing mechanism for drying the silicon wafers, wherein a medium in the water flowing groove flows in one direction, and the first aeration device acts on the silicon wafer, falls to the wafer receiving frame and pushes the silicon wafer out of the wafer receiving frame; the wafer moving mechanisms are close to each other at the flowing tail end of the medium and clamp the silicon wafer to move relative to the flowing direction of the medium; the wafer moving mechanisms are separated from each other at a medium flowing initial end and push the silicon wafers to move into the wafer turning mechanism; and the blowing mechanism is oppositely arranged at the tail end of the sheet turning mechanism. The problem that the working efficiency of the degumming and cleaning steps is low due to the fact that manual transfer is adopted between silicon wafer degumming and wafer insertion in an existing scheme and silicon wafers can be cleaned only after being inserted into a flower basket is solved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of silicon wafer processing equipment, in particular to a silicon wafer integrated degumming and cleaning system and a degumming and cleaning process thereof. BACKGROUND

[0002] Degumming and cleaning of the silicon wafer is carried out in three steps, the crystal holder is first hoisted to the degumming machine and immersed in the degumming medium, the silicon wafer is collected and transported to the wafer inserting machine after the silicon wafer is peeled off, the wafer inserting machine inserts the silicon wafer into the flower basket, the cleaning machine moves the flower basket into the water tank for cleaning, and the cleaning is completed by switching between different water tanks, the silicon wafer is removed from the flower basket after the flower basket is taken out and dried, and then the silicon wafer is sorted.

[0003] Manual transportation is used between the degumming machine and the wafer inserting machine, the silicon wafer needs to be inserted into the flower basket before being cleaned, and the silicon wafer needs to be taken out of the flower basket after cleaning, so that the sorting step can be carried out, which reduces the working efficiency of the degumming and cleaning steps.

[0004] It should be noted that the information disclosed in the above background section is only used to strengthen the understanding of the background of the present disclosure, and therefore can include information that does not constitute prior art known to those of ordinary skill in the art. SUMMARY

[0005] In view of the above-mentioned defects of the prior art, the purpose of the present application is to provide a silicon wafer integrated degumming and cleaning system and a degumming and cleaning process thereof, so as to solve the problem that manual transportation is used between the degumming and wafer inserting of the silicon wafer in the prior art, the silicon wafer needs to be inserted into the flower basket before being cleaned, which reduces the working efficiency of the degumming and cleaning steps.

[0006] To achieve the above-mentioned purpose, the technical scheme of the present application is as follows: A silicon wafer integrated degumming and cleaning system; It comprises a wafer receiving frame, a first aeration device, a water flow tank, a wafer moving mechanism oppositely arranged in the water flow tank, a wafer turning mechanism and a wafer drying mechanism; wherein the medium in the water flow tank flows in one direction, the first aeration device acts on the silicon wafer, the silicon wafer falls into the wafer receiving frame and is pushed out of the wafer receiving frame; the wafer moving mechanism moves the silicon wafer relative to the medium flow direction at the end of the medium flow; the wafer moving mechanism moves the silicon wafer into the wafer turning mechanism at the beginning of the medium flow; and the wafer drying mechanism is oppositely arranged at the end of the wafer turning mechanism.

[0007] Further technical solutions are that an adjusting rod is rotatably arranged around the wafer receiving frame on the water flow tank, and the first aeration device is arranged side by side on the adjusting rod; an openable and closable flow guide frame is movably arranged at the outlet of the wafer receiving frame; the first aeration device acts on the silicon wafer on the flow guide frame and moves the silicon wafer into the wafer moving mechanism.

[0008] A further technical solution is that the wafer transfer mechanism includes: a moving belt, moving wheels distributed along the silicon wafer moving direction, a first tensioning wheel that tensions the moving belt outward, and a cleaning wheel that rolls in contact with the first tensioning wheel; wherein the moving wheels, the first tensioning wheel, and the cleaning wheel are rotatably arranged in the water tank; a cleaning block is formed around the cleaning wheel, and the cleaning block acts on the moving belt.

[0009] A further technical solution is that the flipping mechanism includes a flipping belt, flipping wheels distributed along the silicon wafer moving direction, and a second tensioning wheel that tensions the flipping belt outward; wherein, the flipping wheels transition from a horizontal to a vertical state along the silicon wafer moving direction; and the flipping belt is wound between adjacent flipping wheels.

[0010] A further technical solution is that the wafer flipping mechanism further includes rollers and a roller belt wound around the rollers; wherein the silicon wafer is placed on the roller belt; the roller belt extends beyond the surface of the medium liquid.

[0011] A further technical solution is that the blowing pressure of the upper blowing mechanism is greater than the blowing pressure of the lower blowing mechanism.

[0012] A further technical solution includes a second aeration device and a spraying device installed on the water tank; the second aeration device sprays gas onto both sides of the silicon wafer; the spraying device washes the silicon wafer after it has been flipped.

[0013] A debinding and cleaning process for an integrated debinding and cleaning system for silicon wafers includes the following steps: Debonding process: The wafer holder is hoisted above the water tank and immersed in the medium; the first aeration device is directed towards the adhesive position between the silicon wafer and the wafer holder, and the silicon wafer falls off and into the bonding frame; First moving cleaning step: The first aeration device faces the silicon wafer and acts between adjacent silicon wafers; the silicon wafer moves out from the wafer frame outlet, and the first aeration device acts on the silicon wafer to push the silicon wafer into the wafer transfer mechanism; The second moving cleaning step: The moving belt clamps the silicon wafer, the moving wheels rotate to drive the moving belt to move, and the moving belt drives the silicon wafer to move along the water tank and approach the flipping mechanism; the dielectric unidirectional flow action is applied to the silicon wafer; The flipping cleaning process involves: a flipping belt holding a silicon wafer, a rotating flipping wheel driving the flipping belt to move, and the flipping belt flipping the silicon wafer as it moves. The dielectric flows in one direction to the silicon wafer. Drying steps: The silicon wafer is placed on the roller belt, the roller rotates and drives the roller belt to move, causing the silicon wafer to be lifted off the surface of the dielectric liquid; the air blowing mechanism blows gas onto the silicon wafer.

[0014] A further technical solution is characterized in that, in the second moving cleaning step: the degumming cleaning medium flows unidirectionally onto the silicon wafer, and the second aeration device acts on both sides of the silicon wafer; in the drying step: the spraying device sprays the medium onto the silicon wafer.

[0015] Compared with the prior art, the beneficial technical effects of the present invention are as follows: (1) The first aeration device sprays bubbles to act on the silicon wafer and the adhesive position of the crystal holder. The bubbles break and vibrate at the adhesive position, which accelerates the detachment of the silicon wafer; the medium in the water tank flows from right to left, and the movement of the silicon wafer and the medium is relatively downward, so that the medium flows quickly along the surface of the silicon wafer, and completes the rapid cleaning of the surface of the silicon wafer; the blowing mechanism is set at the end of the flipping mechanism; so that the blowing mechanism acts on the upper and lower surfaces of the silicon wafer at the same time; the blowing mechanism located above starts first to blow out gas to act on the upper surface of the silicon wafer, so that the gas continuously presses down on the silicon wafer, preventing the silicon wafer from detaching from the end of the flipping mechanism; The silicon wafers are debonded and cleaned for the first time by the first aeration device. The second cleaning is completed as the wafer transfer mechanism moves the wafers. Finally, the wafers are cleaned for the third time by the flipping mechanism, resulting in a good cleaning effect. At the same time, the second and third cleanings are completed during the wafer movement, which improves the cleaning efficiency of the wafers.

[0016] (2) With the cooperation of the first aeration device, the silicon wafers are brought close to the outlet of the wafer receiving frame in sequence. The silicon wafers can be moved out by opening and closing the outlet of the wafer receiving frame through the guide frame. The silicon wafers are sent into the wafer transfer mechanism by the first aeration device, so that the arranged silicon wafers are continuously transported to the wafer transfer mechanism in sequence.

[0017] (3) A groove is formed along the moving belt to reduce the contact area between the moving belt and the silicon wafer. The edges on both sides of the groove contact the silicon wafer, ensuring the stability of the contact between the moving belt and the silicon wafer. The rotation of the first tensioning wheel drives the cleaning wheel to rotate. The cleaning block acts on the moving belt and then acts on the impurities in the groove in sequence to clean the impurities and avoid wear on the silicon wafer. The flipping mechanism moves the silicon wafer from a vertical state to a horizontal state and moves it out of the dielectric liquid surface, which is convenient for subsequent spraying and drying. The moving mechanism and the flipping mechanism move the silicon wafer relative to the direction of the dielectric. The dielectric washes the surface of the silicon wafer, completing the cleaning of the silicon wafer. The moving mechanism and the flipping mechanism can adjust the moving speed of the silicon wafer. The greater the moving speed of the silicon wafer, the greater the force of the dielectric washing the silicon wafer, and the better the cleaning effect of the silicon wafer.

[0018] (4) The spraying device sprays pure water to clean the silicon wafer, and the blowing mechanism blows the surface of the silicon wafer dry. The upper spraying device sprays the upper surface of the silicon wafer first, and the lower spraying device sprays the lower surface of the silicon wafer later. This makes the upper spraying device exert downward pressure on the silicon wafer during the spraying process, so as to prevent the silicon wafer from falling off the roller. The blowing pressure of the upper blowing mechanism is greater than that of the lower blowing mechanism, so the blowing mechanism can continuously blow air to exert downward pressure on the silicon wafer, thus preventing the silicon wafer from falling off the roller. Attached Figure Description

[0019] Figure 1 The diagram shows a front view of the integrated degumming and cleaning system for silicon wafers according to the first embodiment of the present invention.

[0020] Figure 2 A top view of the splice frame according to the first embodiment of the present invention is shown.

[0021] Figure 3 The diagram shows a front view of the air guide frame according to the first embodiment of the present invention.

[0022] Figure 4 The diagram shows a front view of the adjusting rod and the first aeration device according to a first embodiment of the present invention.

[0023] Figure 5 A top view of the plate-shifting mechanism according to the first embodiment of the present invention is shown.

[0024] Figure 6 The diagram shows a left-side view of the moving belt, the first tensioning wheel, and the cleaning wheel according to a first embodiment of the present invention.

[0025] Figure 7 The diagram shows a left-side view of the flipping belt and flipping wheel according to the first embodiment of the present invention.

[0026] Figure 8 A partial structural schematic diagram of the adjustment mechanism according to the first embodiment of the present invention is shown.

[0027] Figure 9 It shows Figure 8 A top view of the adjustment mechanism.

[0028] The attached diagram is labeled as follows: 1. Water trough; 11. Adjusting rod; 2. Plate receiving frame; 21. Flow guide frame; 211. Flow guide groove; 3. First aeration device; 4. Plate shifting mechanism; 41. Moving wheel; 42. Moving belt; 421. Belt groove; 43. First tensioning wheel; 431. Tensioning groove; 44. Cleaning wheel; 441. Side ring; 45. Cleaning block; 5. Spraying device; 51. Roller; 52. Rolling belt; 6. Plate turning mechanism; 61. Turning belt; 62. Turning wheel; 621. Wheel groove; 63. Second tensioning wheel; 7. Air blowing mechanism; 8. Second aeration device; 81. Adjusting mechanism; 811. First rod; 812. First plate; 813. Second rod; 814. Second plate. Detailed Implementation

[0029] To further illustrate the technical means and effects of the present invention in achieving its intended purpose, the following detailed description of the specific implementation methods, structures, features, and effects of the present invention, in conjunction with the accompanying drawings and preferred embodiments, is provided below.

[0030] Figure 1 The diagram shows a front view of the integrated degumming and cleaning system for silicon wafers according to the first embodiment of the present invention. Figure 2 A top view of the splice frame according to the first embodiment of the present invention is shown. Figure 3 The diagram shows a front view of the air guide frame according to the first embodiment of the present invention. Figure 4 A front view structural diagram of the adjusting rod and the first aeration device according to a first embodiment of the present invention is shown. (In conjunction with...) Figures 1-4 As shown, the present invention discloses an integrated degumming and cleaning system for silicon wafers, comprising: a wafer receiving frame 2, a first aeration device 3, a water tank 1 for storing medium, a wafer transfer mechanism 4 disposed opposite to each other in the water tank 1, a wafer flipping mechanism 6 for flipping silicon wafers, and an air blowing mechanism 7 for drying silicon wafers.

[0031] The flow tank 1 is positioned on both sides, with the wafer receiving frame 2 and the first aeration device 3 located on the left side of the flow tank 1. The medium in the flow tank 1 flows unidirectionally, and the first aeration device 3 acts on the silicon wafers, causing them to fall onto the wafer receiving frame 2. Silicon rods are glued to the wafer holders. A slicing machine cuts the silicon rods into several silicon wafers, which are then glued back to the wafer holders. The wafer holders are lifted above the wafer receiving frame 2 by a special crane. The wafer holders and wafers are immersed in the medium, and under the influence of the medium, the silicon wafer castings detach. The first aeration device 3 sprays air bubbles that act on the glued area between the silicon wafers and the wafer holders. The bubbles burst at the glued area, generating vibrations that accelerate the detachment of the silicon wafers.

[0032] Silicon wafers are arranged within the wafer receiving frame 2. The first aeration device 3 acts on the silicon wafers, loosening their arrangement and pushing them out of the wafer receiving frame 2. After the silicon wafers are pushed out, the first aeration device 3 sprays air bubbles onto the silicon wafers, propelling them into the wafer transfer mechanism 4.

[0033] The wafer transfer mechanisms 4 approach each other at the end of the dielectric flow, clamping the silicon wafer and moving it relative to the dielectric flow direction. The wafer transfer mechanisms 4 clamp the silicon wafer and drive it to move from left to right, while the dielectric in the water tank 1 flows from right to left. The movement of the silicon wafer and the dielectric is in opposite directions, which makes the dielectric flow rapidly along the surface of the silicon wafer, completing the rapid cleaning of the silicon wafer surface.

[0034] After the integrated debinding and cleaning system for silicon wafers, the wafers enter the sorting machine for sorting. The wafers need to be moved horizontally into the sorting machine. Under the clamping of the wafer transfer mechanism 4, the wafers are in a vertical position. The wafer flipping mechanism 6 flips the wafers to a horizontal position, causing the wafers to detach from the dielectric liquid surface.

[0035] The air blowing mechanism 7 is positioned opposite the end of the flipping mechanism 6. This allows the air blowing mechanism 7 to act on both the upper and lower surfaces of the silicon wafer simultaneously. The upper air blowing mechanism 7 activates first, blowing gas onto the upper surface of the silicon wafer, continuously pressing the wafer down and preventing it from detaching from the end of the flipping mechanism 6. The end of the flipping mechanism 6 leads to the sorting machine, where the silicon wafers undergo subsequent sorting steps.

[0036] The silicon wafers undergo a first cleaning process, including debinding and initial cleaning via the first aeration device 3. A second cleaning is completed as the wafer transfer mechanism 4 moves the wafer. Finally, the wafer undergoes a third cleaning under the action of the flipping mechanism 6, resulting in a high-quality cleaning effect. Furthermore, the second and third cleaning processes are both completed during wafer movement, further enhancing the cleaning efficiency.

[0037] The medium in the water tank 1 exists in two states: the medium near the plate shifting mechanism 4 and the plate flipping mechanism 6 in the water tank 1 is the cleaning medium, and the medium near the plate receiving frame 2 in the water tank 1 is the degumming cleaning medium.

[0038] The cleaning medium flows into the right end of the water tank 1, and the degumming medium flows into the middle of the water tank 1. The cleaning medium and the degumming medium mix to form a degumming cleaning medium. The degumming cleaning medium is discharged from the left end of the water tank 1, so that the medium in the water tank 1 flows in one direction.

[0039] The flow rate of the medium in water tank 1 is controlled by adjusting the amount of medium flowing in and out of the water tank 1. The faster the medium flow rate, the better the rinsing and cleaning effect on the silicon wafers. By continuously introducing new cleaning and debinding media and discharging debinding and cleaning media containing impurities, the medium always maintains good debinding and cleaning capabilities.

[0040] The water flow tank 1 has two sets of inlets for the flow of cleaning medium and debonding medium, respectively. One set of inlets is located on the right side of the water flow tank 1 for the flow of cleaning medium. The other set of inlets is located near the wafer frame 2 in the water flow tank 1 for the flow of debonding medium. When the silicon wafer cleaning effect decreases, the flow rate of cleaning medium is increased. When the silicon wafer debonding effect decreases, the flow rate of debonding medium is increased.

[0041] The turbidity of the medium is related to the amount of medium flowing into and out of the water tank 1. A detection device is installed inside the water tank 1 to detect the turbidity of the medium. The more turbid the medium, the more impurities it contains, and the more the amount of medium flowing into and out of the water tank 1 needs to be increased. The clearer the medium, the less impurities it contains, and the less the amount of medium flowing into and out of the water tank 1 needs to be decreased.

[0042] An adjusting rod 11 is rotatably mounted on the water tank 1 around the receiving frame 2. The adjusting rod 11 is rotatably mounted on the water tank 1 in the front-to-back direction. Sealing rings are installed at the rotating positions of the adjusting rod 11 and the water tank 1 to prevent leakage of the cleaning medium due to adhesive delamination.

[0043] The first aeration device 3 is arranged side by side on the adjusting rod 11, which is driven to rotate by a motor. The adjusting rod 11 causes the first aeration device 3 to swing, so that the first aeration device 3 sprays bubbles to act on different positions of the silicon wafer.

[0044] When the silicon wafer is debonded, the outlet of the first aeration device 3 is directed towards the adhesive position of the silicon wafer and the crystal holder. The debonding cleaning medium causes the adhesive to lose its stickiness, and the bursting of bubbles causes the silicon wafer to vibrate, causing the silicon wafer to fall off into the bonding frame 2.

[0045] When the silicon wafer is completely detached and placed in the wafer frame 2, the outlet of the first aeration device 3 faces the space between adjacent silicon wafers, and the bubbles burst between the adjacent silicon wafers to clean them.

[0046] The lower part of the front end of the wafer frame 2 is the outlet of the wafer frame 2. After the silicon wafer is cleaned, the first aeration device 3 is activated from back to front to spray bubbles, so that the silicon wafer moves forward and is removed from the outlet of the wafer frame 2.

[0047] The outlet of the receiving frame 2 is equipped with an opening and closing guide frame 21. For example, the guide frame 21 has a 90° bend. The upper end of the guide frame 21 is slidably connected to the receiving frame 2, and the guide frame 21 is driven to move up and down by an electric push rod. When the guide frame 21 moves upward, it closes the outlet of the receiving frame 2. When the guide frame 21 moves downward, it opens the outlet of the receiving frame 2.

[0048] A flow guide groove 211 is formed on the flow guide frame 21. The silicon wafer is placed in the flow guide groove 211, which restricts the silicon wafer and prevents it from tipping over. The first aeration device 3 sprays air bubbles that act on the silicon wafer on the flow guide frame 21. The silicon wafer slides along the flow guide groove 211 and moves out of the flow guide frame 21, and then moves into the wafer transfer mechanism 4.

[0049] With the cooperation of the first aeration device 3, the silicon wafers are brought close to the outlet of the wafer receiving frame 2 in sequence. The silicon wafers can be moved out in sequence by opening and closing the outlet of the wafer receiving frame 21. The first aeration device 3 sprays air bubbles to send the silicon wafers into the wafer transfer mechanism 4. Through the close cooperation of each component, the closely arranged silicon wafers are separated and moved out of the wafer receiving frame 2 in sequence, and then continuously transported into the wafer transfer mechanism 4.

[0050] Figure 5 A top view of the plate-shifting mechanism according to the first embodiment of the present invention is shown. Figure 6 A left-side structural view of the moving belt, first tensioning wheel, and cleaning wheel according to a first embodiment of the present invention is shown. (In conjunction with...) Figures 1-6 As shown, the wafer transfer mechanism 4 includes: a moving belt 42, moving wheels 41 distributed along the silicon wafer moving direction, a first tensioning wheel 43 that tensions the moving belt 42 outward, and a cleaning wheel 44 that rolls in contact with the first tensioning wheel 43.

[0051] The wafer transfer mechanisms 4 are arranged in several groups, with the silicon wafers positioned between them. The moving belts 42 of each wafer transfer mechanism 4 contact the wafers, clamping them in place. These groups of opposing wafer transfer mechanisms 4 are located at different heights in the water tank 1, allowing the wafers to be clamped at different positions during movement, thus avoiding blind spots in the cleaning process.

[0052] A groove 421 is formed along the moving belt 42 to reduce the contact area between the moving belt 42 and the silicon wafer. The edges on both sides of the groove 421 contact the silicon wafer, ensuring the stability of the contact between the moving belt 42 and the silicon wafer.

[0053] The moving wheel 41, the first tensioning wheel 43, and the cleaning wheel 44 are rotatably arranged within the flow channel 1. The moving wheel 41 is driven to rotate by a motor. A tension groove 431 is formed around the first tensioning wheel 43, which accommodates the moving belt 42. Side rings 441 are formed around the upper and lower ends of the cleaning wheel 44. The first tensioning wheel 43 contacts the side rings 441, and a cleaning block 45 is formed around the cleaning wheel 44, which is placed within the belt groove 421. The rotation of the first tensioning wheel 43 drives the cleaning wheel 44 to rotate, and the cleaning block 45 acts on the moving belt 42. The cleaning block 45 sequentially acts on impurities within the belt groove 421, cleaning the impurities and preventing wear on the silicon wafer.

[0054] Figure 7 A left-side structural view of the flipping belt and flipping wheel according to the first embodiment of the present invention is shown. (In conjunction with...) Figures 1-7 As shown, the flipping mechanism 6 includes a flipping belt 61, flipping wheels 62 distributed along the silicon wafer moving direction, and a second tensioning wheel 63 that tensions the flipping belt 61 outward. In order to prevent the flipping belt 61 from detaching from the flipping wheel 62, a wheel groove 621 is formed around the flipping wheel 62, and the flipping belt 61 is placed in the wheel groove 621.

[0055] The wafer shifting mechanism 4 moves the silicon wafer linearly, while the wafer flipping mechanism 6 requires changing the wafer's flipping motion during the shifting process. Unlike the moving belt 42, the flipping belt 61 has a circular cross-section. The distance from the center to the edge of the circle is the same, so even if the flipping belt 61 undergoes torsional deformation during the wafer flipping process, it will not detach from the wafer, allowing it to continuously hold and flip the wafer. The single-position holding of the wafer by the flipping belt 61 reduces the restriction it places on the wafer during the flipping process.

[0056] The wafer flipping mechanism 6 also includes rollers 51 and a belt 52 wound around the rollers 51. For example, there are two sets of rollers 51 and belts 52. The silicon wafer can be placed smoothly on the belts 52. The mounting height of the rollers 51 gradually increases from left to right, causing the belts 52 to extend beyond the surface of the dielectric liquid.

[0057] After the silicon wafer is placed on the roller 52, the roller 51 rotates and drives the roller 52 to move, and the roller 52 drives the silicon wafer out of the dielectric liquid surface.

[0058] The installation direction of several rotating wheels 62 along the silicon wafer moving direction transitions from horizontal to vertical. The rotating belt 61 is wound between adjacent rotating wheels 62. Since the degree of transition from horizontal to vertical between adjacent rotating wheels 62 is small, the degree of twisting of the rotating belt 61 during movement is small, thus extending the service life of the rotating belt 61.

[0059] During movement, the silicon wafer rotates according to the installation direction of the flipping roller 62, changing from a vertical to a horizontal position. The wafer is then stably placed on the conveyor belt 52 for transport. The flipping mechanism 6 moves the wafer from a vertical to a horizontal position, removing it from the liquid medium surface. This facilitates subsequent spraying and drying.

[0060] The wafer shifting mechanism 4 and the wafer flipping mechanism 6 move the silicon wafer relative to the dielectric material, causing the dielectric to scour the surface of the silicon wafer, thus completing the wafer cleaning process. The wafer shifting mechanism 4 and the wafer flipping mechanism 6 can adjust the moving speed of the silicon wafer. The greater the moving speed of the silicon wafer, the greater the force of the dielectric scour on the silicon wafer, and the better the cleaning effect.

[0061] A spray device 5 is installed on the water tank 1 and sprays the silicon wafer after it has been flipped. The spray device 5 sprays pure water onto the upper and lower surfaces of the silicon wafer. The spray device 5 is located on the upper and lower sides of the silicon wafer. The spray devices 5 are staggered, with the upper spray device 5 positioned slightly to the left and the lower spray device 5 slightly to the right. This ensures that as the silicon wafer moves from left to right, the upper spray device 5 sprays the upper surface of the silicon wafer first, followed by the lower spray device 5 spraying the lower surface. This creates downward pressure on the silicon wafer from the upper spray device 5 during the spraying process, preventing the silicon wafer from detaching from the roller 52.

[0062] Silicon wafers are continuously fed onto the conveyor belt 52, arranged at intervals. An upper spray device 5 continuously sprays pure water for cleaning, while a lower spray device 5 reciprocates by spraying pure water for cleaning. When the upper spray device 5 contacts the silicon wafer, the lower spray device 5 begins spraying. When the upper spray device 5 detaches from the silicon wafer, the lower spray device 5 stops spraying. This prevents the lower spray device 5 from detaching the silicon wafer from the conveyor belt 52 without downward pressure.

[0063] The air blowing mechanism 7 blows air in the direction the silicon wafer is moving in, forming an angle between the air blowing mechanism 7 and the silicon wafer, allowing the gas to scrape away any residual dielectric material on the silicon wafer. The gas needs to completely remove the residual dielectric material from the silicon wafer. The air blowing mechanisms 7, positioned vertically, are installed opposite each other and cannot be misaligned. The gas blown by the air blowing mechanism 7 acts on both the top and bottom surfaces of the silicon wafer simultaneously, preventing dielectric material from splashing from one side to the other.

[0064] The blowing pressure of the upper blowing mechanism 7 is greater than that of the lower blowing mechanism 7. The blowing mechanism 7 can continuously blow air to create downward pressure on the silicon wafer, preventing the silicon wafer from detaching from the roller 52.

[0065] The integrated debinding and cleaning system for silicon wafers also includes a second aeration device 8 installed within the flow tank 1. The second aeration device 8 is installed on the front and rear sides of the silicon wafer on the wafer transfer mechanism 4 within the flow tank 1, and also on the front, rear, and top and bottom sides of the silicon wafer on the wafer flipping mechanism 6 within the flow tank 1. The second aeration device 8 generates bubbles that act on both sides of the silicon wafer. When the bubbles contact the silicon wafer surface, they burst, causing impurities adhering to the silicon wafer surface to vibrate and fall off. The vibration generated by the bubbles enhances the cleaning effect of the cleaning medium.

[0066] Figure 8 A partial structural schematic diagram of the adjustment mechanism according to the first embodiment of the present invention is shown. Figure 9 It shows Figure 8 A top-view structural diagram of the adjustment mechanism. (Combined with...) Figures 1-9 As shown, the second aeration device 8 swings through the adjustment mechanism 81, so that the bubble flow direction generated by the second aeration device 8 is applied to the silicon wafer at a certain angle to adapt to different cleaning conditions.

[0067] When impurities on the silicon wafer have a certain degree of adhesion, the direction of bubble flow forms an acute angle with the silicon wafer surface. Some bubbles can act on the impurities from the side, causing the impurities to detach from the silicon wafer. The smaller the acute angle, the more bubbles act on the impurities from the side, and the stronger the force of the bubbles on the impurities. The angle of the second aeration device 8 can be adjusted to deal with impurities with different adhesion properties.

[0068] When the adhesion of impurities on the silicon wafer is weak, the flow direction of the bubbles acts on the surface of the silicon wafer at a perpendicular angle. The bubbles act directly on the impurities with a large impact force, causing the impurities to detach from the silicon wafer.

[0069] The adjustment mechanism 81 includes a first rod 811 rotatably mounted on the water tank 1, a first plate 812 connected to one end of the first rod 811, a second rod 813 connected to the adjacent first plate 812, and a second plate 814 rotatably connected to the water tank 1. A second aeration device 8 is mounted on the first rod 811. The end of the second plate 814 away from the rotation position is connected to the second rod 813. The second plate 814 is driven to rotate by a motor. When the second plate 814 swings at a certain angle, it pulls the second rod 813 to move. The second rod 813 pulls the first plate 812 to swing at the same angle. The first plate 812 then drives the first rod 811 and the second aeration device 8 to rotate at the same angle, thereby changing the angle between the bubble flow direction and the silicon wafer.

[0070] Second embodiment: The debinding and cleaning process of the integrated debinding and cleaning system for silicon wafers includes the following steps: Debonding step: The wafer holder is hoisted above the water tank 1 and immersed in the debonding cleaning medium. The adjusting rod 11 is rotated at a certain angle so that the first aeration device 3 sprays bubbles toward the adhesive position between the silicon wafer and the wafer holder. After being soaked in the debonding cleaning medium and vibrating due to the bursting of bubbles, the silicon wafer falls off and onto the bonding frame 2.

[0071] First moving cleaning step: The adjusting rod 11 continues to rotate at a certain angle so that the first aeration device 3 faces the silicon wafer and sprays bubbles that act between adjacent silicon wafers. The silicon wafers falling into the wafer frame 2 are arranged closely together, and the bubbles disperse the silicon wafers, allowing impurities between them to be discharged. The bubbles act between adjacent silicon wafers, performing preliminary cleaning on the surface of the silicon wafers. After completion, the first aeration device 3 stops spraying bubbles.

[0072] The silicon wafer needs to be removed from the outlet of the bonding frame 2, which is located below the front end of the bonding frame 2. The first aeration device 3 sequentially sprays bubbles from back to front, pushing the silicon wafer forward. The silicon wafer is placed in the guide groove 211 of the guide frame 21, and the first aeration device 3 stops spraying bubbles. The guide groove 211 moves downward, opening the outlet of the bonding frame 2 and removing the silicon wafer from the bonding frame 2. Bubbles sprayed by the first aeration device 3 near the outlet of the bonding frame 2 act on the silicon wafer, pushing it out of the guide groove 211 and into the space between the wafer transfer mechanisms 4. The guide groove 211 moves upward, closing the outlet of the bonding frame 2, and the first aeration device 3 resumes spraying bubbles sequentially from back to front, repeating this cycle to move the silicon wafer out of the bonding frame 2 and into the space between the wafer transfer mechanisms 4.

[0073] The second moving cleaning step: The moving belt 42 clamps the silicon wafer, the moving wheel 41 rotates to drive the moving belt 42 to move, and the moving belt 42 drives the silicon wafer to move along the water tank 1 and approach the flipping mechanism 6.

[0074] The moving belt 42 drives the first tensioning wheel 43 to rotate, the first tensioning wheel 43 drives the cleaning wheel 44 to rotate, and the cleaning wheel 44 drives the cleaning block 45 to clean the impurities in the groove 421.

[0075] The second aeration device 8 sprays bubbles onto the silicon wafer. The bubbles burst on the wafer surface, generating vibrations that cause impurities to fall off. The cleaning medium flows unidirectionally onto the silicon wafer, washing its surface to complete the cleaning process.

[0076] Flipping and cleaning steps: Flipping belt 61 clamps the silicon wafer, flipping wheel 62 rotates to drive flipping belt 61 to move, flipping belt 61 drives silicon wafer to flip during the movement, and dielectric unidirectional flow action is applied to silicon wafer.

[0077] Because of the angular change between adjacent rotating rollers 62, the rotating rollers 62 transition from a horizontal to a vertical state. During the movement of the rotating belt 61, the silicon wafer moves and rotates. During the rotation process, the second aeration device 8 sprays bubbles from different angles onto the silicon wafer, and the cleaning medium flows unidirectionally onto the silicon wafer, ensuring the cleaning effect.

[0078] Drying Steps: The silicon wafer is removed from the flipping belt 61 and placed on the roller belt 52. The roller 51 rotates, driving the roller belt 52 to move and lifting the silicon wafer off the surface of the dielectric liquid. The spray device 5 sprays the dielectric liquid onto the silicon wafer, completing the cleaning of the upper and lower surfaces of the silicon wafer and preventing cleaning medium residue from remaining on the silicon wafer. The air blowing mechanism 7 blows gas onto the silicon wafer, completing the drying of the upper and lower surfaces of the silicon wafer.

[0079] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present invention. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present invention without departing from the scope of the present invention shall still fall within the scope of the present invention.

Claims

1. An integrated debinding and cleaning system for silicon wafers, characterized in that, include: The wafer receiving frame (2), the first aeration device (3), the water flow tank (1), the wafer transfer mechanism (4) arranged opposite to each other in the water flow tank (1), the wafer flipping mechanism (6) for flipping silicon wafers, and the air blowing mechanism (7) for drying silicon wafers; wherein, the medium in the water flow tank (1) flows in one direction, the first aeration device (3) acts on the silicon wafer, falls to the wafer receiving frame (2), and pushes the silicon wafer out of the wafer receiving frame (2); the wafer transfer mechanism (4) approaches each other at the end of the medium flow and clamps the silicon wafer to move relative to the medium flow direction; the wafer transfer mechanism (4) separates from each other at the beginning of the medium flow and pushes the silicon wafer into the wafer flipping mechanism (6); the air blowing mechanism (7) is arranged opposite to each other at the end of the wafer flipping mechanism (6).

2. The integrated debinding and cleaning system for silicon wafers as described in claim 1, characterized in that, An adjusting rod (11) is rotatably arranged around the receiving frame (2) on the water tank (1), and the first aeration device (3) is arranged in parallel on the adjusting rod (11); the outlet of the receiving frame (2) is provided with an opening and closing guide frame (21); the first aeration device (3) acts on the silicon wafer on the guide frame (21) and moves into the space between the wafer transfer mechanism (4).

3. The integrated debinding and cleaning system for silicon wafers as described in claim 2, characterized in that, The wafer transfer mechanism (4) includes: a moving belt (42), moving wheels (41) distributed along the silicon wafer moving direction, a first tensioning wheel (43) that tensions the moving belt (42) outward, and a cleaning wheel (44) that rolls in contact with the first tensioning wheel (43); wherein the moving wheels (41), the first tensioning wheel (43), and the cleaning wheel (44) are rotatably arranged in the water tank (1); a cleaning block (45) is formed around the cleaning wheel (44), and the cleaning block (45) acts on the moving belt (42).

4. The integrated debinding and cleaning system for silicon wafers as described in claim 2, characterized in that, The wafer flipping mechanism (6) includes a flipping belt (61), flipping wheels (62) distributed along the silicon wafer moving direction, and a second tensioning wheel (63) that tensions the flipping belt (61) outward; wherein, the flipping wheels (62) along the silicon wafer moving direction transition from a horizontal to a vertical state; the flipping belt (61) is wound between adjacent flipping wheels (62).

5. The integrated debinding and cleaning system for silicon wafers as described in claim 4, characterized in that, The wafer flipping mechanism (6) further includes a roller (51) and a roller belt (52) wound around the roller (51); wherein the silicon wafer is placed on the roller belt (52); the roller belt (52) extends out of the medium liquid surface.

6. The integrated debinding and cleaning system for silicon wafers as described in claim 2, characterized in that, The blowing pressure of the upper blowing mechanism (7) is greater than that of the lower blowing mechanism (7).

7. The integrated debonding and cleaning system for silicon wafers as described in claim 2, characterized in that, It also includes a second aeration device (8) and a spray device (5) installed on the water tank (1); the second aeration device (8) sprays gas onto both sides of the silicon wafer; the spray device (5) washes the silicon wafer after it has been flipped.

8. A debinding and cleaning process for an integrated debinding and cleaning system for silicon wafers, characterized in that, Includes the following steps: Debonding step: The crystal tray is hoisted above the water tank (1) and immersed in the medium; the first aeration device (3) is directed towards the adhesive position between the silicon wafer and the crystal tray, and the silicon wafer falls off and falls to the bonding frame (2). First moving cleaning step: The first aeration device (3) faces the silicon wafer and acts between adjacent silicon wafers; the silicon wafer moves out from the outlet of the wafer frame (2), and the first aeration device (3) acts on the silicon wafer to push the silicon wafer into the wafer transfer mechanism (4); Second moving cleaning step: The moving belt (42) clamps the silicon wafer, the moving wheel (41) rotates to drive the moving belt (42) to move, the moving belt (42) drives the silicon wafer to move along the water tank (1) and approach the flipping mechanism (6); the dielectric unidirectional flow action is applied to the silicon wafer; Flipping cleaning steps: The flipping belt (61) clamps the silicon wafer, the flipping wheel (62) rotates and drives the flipping belt (61) to move. During the process of the flipping belt (61) driving the silicon wafer to move, the silicon wafer flips. The dielectric unidirectional flow action is applied to the silicon wafer. Drying steps: The silicon wafer is placed on the roller (52), the roller (51) rotates and drives the roller (52) to move, causing the silicon wafer to detach from the dielectric liquid surface; the blowing mechanism (7) blows out gas to act on the silicon wafer.

9. The debinding and cleaning process of the integrated debinding and cleaning system for silicon wafers as described in claim 8, characterized in that, In the second moving cleaning step: the degumming cleaning medium flows unidirectionally onto the silicon wafer, and the second aeration device (8) acts on both sides of the silicon wafer; in the drying step: The spray device (5) sprays the medium onto the silicon wafer.

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