A silicon carbide ceramic heating disc with uniform heat conduction

Abstract

The application discloses a silicon carbide ceramic heating disc with uniform heat conduction, and relates to the technical field of wafer processing. The heating disc is arranged on the upper end of the control seat and is electrically connected with the control seat; three groups of telescopic supporting rods are fixedly connected to the bottom end of the inside of the heating disc; the upper end of the telescopic supporting rod located at the central position is fixedly connected with a first bearing table; the upper end of the remaining two groups of telescopic supporting rods is fixedly connected with a second bearing table; the upper end of the first bearing table is fixedly connected with a first electric heating wire; the upper end of the second bearing table is fixedly connected with a second electric heating wire; the diameter of the wafer is smaller than that of the first ceramic sheet; only the first ceramic sheet is pressed downward, the first bearing table and the first electric heating wire are driven to move upward, and the first ceramic sheet is separately attached to the heat-locked groove; the diameter of the wafer is larger than that of the first ceramic sheet; the first and second ceramic sheets are synchronously pressed downward, the two groups of bearing tables and the electric heating wires are driven to move upward, and the corresponding ceramic sheets are respectively attached to the heat-locked grooves.

Description

Technical Field

[0001] This invention relates to the field of wafer processing technology, specifically to a silicon carbide ceramic heating plate with uniform thermal conductivity. Background Technology

[0002] When preparing thin films (such as metal electrode films and insulating dielectric films) by physical vapor deposition (PVD) or chemical vapor deposition (CVD), the wafer needs to be heated to a specific constant temperature (usually 200-800℃) to ensure the adhesion and uniformity of the film. Therefore, a silicon carbide ceramic heating plate is needed to heat it. The core of the silicon carbide ceramic heating plate is to utilize the semiconductor properties and high thermal conductivity of silicon carbide ceramics. By passing an electric current through the silicon carbide material, Joule heating is generated. The heat is quickly and evenly transferred to the entire plate surface by relying on its excellent thermal conductivity, so as to achieve stable heating.

[0003] A search revealed that Chinese patent CN220858441U discloses a silicon carbide ceramic heating plate based on a Fermat spiral heating wire layout. The plate includes a lower placement plate with a heating wire placement groove on its surface. A heating wire is held inside the groove. An internal threaded groove is formed on the outer side of the top surface of the lower placement plate, and a threaded collar is threaded into the groove. An upper plate is fixedly connected to the top of the threaded collar. This silicon carbide ceramic heating plate based on the Fermat spiral heating wire layout, through the bottom heat dissipation component, allows the heat from the heating wire to be transferred to the lower placement plate during operation. The lower placement plate, through the upper and lower rings forming a hollow heat-insulating environment, blocks heat transfer to the bottom, preventing heat from reaching the bottom and protecting objects at the bottom of the heating plate, thus improving safety during the heating process.

[0004] The above invention has the following problems:

[0005] 1. Although the aforementioned ceramic heating plate can perform heating operations, it lacks the ability to adaptively adjust heating based on the wafer diameter. This type of heating plate adopts a fixed diameter design, and its heating area cannot be dynamically adjusted according to the wafer size. This results in the heating system needing to constantly activate the heating wires across the entire area to achieve heating operations. When the diameter of the wafer to be heated is significantly smaller than the inherent diameter of the heating plate, the heating wires in the non-effectively covered areas of the heating plate are still in operation, causing ineffective dissipation of heating energy and leading to low energy utilization. This does not meet the technical requirements for energy consumption optimization and precise heating in semiconductor manufacturing processes, and increases the energy cost of the wafer heat treatment process.

[0006] 2. The existing ceramic heating plate adopts a manual on / off control mode. The start and stop of its heating wire requires manual intervention by the operator before and after the operation. The control process is significantly dependent on human intervention. This control method not only increases the complexity of the operator's process and reduces the efficiency of wafer heating operation, but also poses a risk of human error. If the operator forgets to start the operation before the heating operation, it will cause the heating process to be delayed. If the switch is not turned off after the operation, it is easy to cause the heating plate to burn dry, which may cause equipment overheating and damage, and even have a potential impact on the safety of the surrounding production environment. This does not meet the development trend of automation and unmanned operation in semiconductor manufacturing and the safety requirements of equipment operation.

[0007] Therefore, those skilled in the art have provided a silicon carbide ceramic heating plate with uniform thermal conductivity to solve the problems mentioned above. Summary of the Invention

[0008] The purpose of this invention is to provide a silicon carbide ceramic heating plate with uniform thermal conductivity to solve the problems mentioned in the background art.

[0009] To achieve the above objectives, the present invention provides the following technical solution:

[0010] A uniformly thermally conductive silicon carbide ceramic heating plate includes a control base and a heating plate. The heating plate is disposed on the upper end of the control base and electrically connected to it. The control base provides power to the heating plate and controls its operation. The heating plate integrates various components. A first ceramic plate and a second ceramic plate are disposed on the upper surface of the heating plate, with the first ceramic plate located inside the second ceramic plate. The first and second ceramic plates conduct heat through their own materials. A heating mechanism is disposed within the heating plate. The heating mechanism includes a telescopic support rod, a first support platform, a first heating wire, a second support platform, and a second heating wire. The bottom of the heating plate is fixedly connected to... The device has three sets of telescopic support rods. The upper end of the telescopic support rod located at the center is fixedly connected to a first support platform, and the upper ends of the remaining two sets of telescopic support rods are fixedly connected to second support platforms. A first heating wire is fixedly connected to the upper end of the first support platform, and a second heating wire is fixedly connected to the upper end of the second support platform. Both the first and second heating wires are electrically connected to a control base. The heating mechanism is used to control the temperature rise of the first and second ceramic plates. A gravity adjustment mechanism is located on the heating plate and the upper ends of the first and second ceramic plates. The gravity adjustment mechanism is used to adjust the contact between the heating mechanism and the first and second ceramic plates for heating.

[0011] As a further embodiment of the present invention: a first rack is fixedly connected to both the left and right ends of the lower end face of the first ceramic sheet, a second rack is fixedly connected to both the left and right ends of the lower end face of the first support platform, a third rack is fixedly connected to both the left and right ends of the lower end face of the second ceramic sheet, and a fourth rack is fixedly connected to both the left and right ends of the lower end face of the second support platform.

[0012] As a further embodiment of the present invention: a first gear is provided between adjacent first and second racks, and a second gear is provided between adjacent third and fourth racks. A limiting seat is connected to the outer wall of both the first and second racks, and the limiting seat is fixed to the bottom of the heating plate. Both the first and second racks mesh with the adjacent first gear, and both the third and fourth racks mesh with the adjacent second gear. A damping spring is fixedly connected to the bottom of both the first and third racks, and the other end of the damping spring is fixedly connected to the bottom of the heating plate.

[0013] As a further embodiment of the present invention: the control mechanism is located at the bottom of the heating plate, and the control mechanism is used to control the opening and closing of the first heating wire and the second heating wire. Two sets of control boards are fixedly connected to the bottom of the heating plate. Each set of control boards is equipped with a control switch at its upper end. The control board and control switch located near the center of the heating plate are electrically connected to the first heating wire, and the control board and control switch located away from the center of the heating plate are electrically connected to the second heating wire. The outer walls of the first rack and the third rack near the two sets of control boards are fixedly connected with extrusion blocks, and the outer walls of the extrusion blocks are provided with wedge-shaped surfaces.

[0014] As a further embodiment of the present invention: the locking mechanism is located above the first ceramic plate and the second ceramic plate, as well as the first support platform and the second support platform. The locking mechanism is used to lock the position of the first support platform and the second support platform. The bottom end of the first ceramic plate and the second ceramic plate is provided with a heat-locking groove. Locking grooves are provided at both ends of the two sets of heat-locking grooves. The upper surface of the first support platform and the second support platform is provided with L-shaped locking rods at both ends. The L-shaped locking rods are used in conjunction with the corresponding locking grooves. The internal shape of the locking groove is L-shaped. A first return spring is fixedly connected to one end of the locking groove. A limit block is fixedly connected to the other end of the first return spring. The limit block and the first return spring are used to limit the L-shaped locking rod after it enters the locking groove. A slider is fixedly connected to the bottom end of the L-shaped locking rod. The upper surface of the first support platform and the second support platform is provided with a sliding groove that cooperates with the slider. A second return spring is fixedly connected between the sliding groove and the corresponding slider.

[0015] As a further embodiment of the present invention: a wafer is placed on the upper end of the first ceramic sheet and the second ceramic sheet.

[0016] Compared with the prior art, the beneficial effects of the present invention are:

[0017] 1. Because of the gravity adjustment mechanism, when the wafer diameter is smaller than the first ceramic sheet, only the first ceramic sheet is pressed down, which moves the first support platform and the first heating wire upward to individually fit the heat-locking groove of the first ceramic sheet; when the wafer diameter is larger than the first ceramic sheet, the first and second ceramic sheets are pressed down simultaneously, which moves the two sets of support platforms and heating wires upward to fit the corresponding heat-locking grooves of the ceramic sheets respectively. No manual adjustment is required, which can adapt to the heating requirements of wafers of different sizes and improve the compatibility of the equipment with products of multiple specifications.

[0018] The heat-locking groove adopts a ring-shaped structure, which can physically wrap the first and second heating wires, effectively preventing heat from diffusing to the outside and concentrating the heat in the contact area between the ceramic plate and the wafer. This not only avoids heat waste but also ensures that the temperature in the heating area is more concentrated and uniform, thus guaranteeing the quality of wafer heating.

[0019] After the wafer is removed, the ceramic plate automatically resets via the energy stored in the bottom damping spring, simultaneously driving the rack and gear to reverse, causing the support platform and heating wire to return to their initial positions. This eliminates the need for manual operation of the reset mechanism, reducing work steps and human intervention costs, while also preventing errors in the next operation due to forgetting to reset.

[0020] 2. Because it is equipped with a control mechanism, it completely replaces the traditional manual switch control. The start and stop of the heating wire are automatically triggered by the movement and reset of the ceramic plate. No manual operation is required. This eliminates the problem of the heating plate burning dry due to forgetting to turn off the switch after operation, avoids equipment damage due to overheating, and eliminates potential safety risks such as fire and high temperature baking to the surrounding production environment caused by dry burning.

[0021] The outer wall of the extrusion block adopts a wedge-shaped surface design, which can more smoothly and stably extrude the press-type control switch compared to flat contact, avoiding switch trigger failure or damage caused by insufficient contact area or uneven force.

[0022] 3. Because of the locking mechanism, the L-shaped locking rod can move synchronously and adaptively with the lifting and lowering of the first and second ceramic plates through the slider, the slide groove and the second return spring, without the need for additional manual adjustment. This ensures that the locking action is precisely matched with the position of the ceramic plate. When locking, the protrusion of the L-shaped locking rod is engaged with the groove of the locking groove, and at the same time, the first return spring drives the limiting block to abut against the outer wall of the locking rod, forming a double limit of mechanical engagement and elastic abutment. This prevents loosening after locking and ensures that the positions of the first and second support platforms are stable during heating, without affecting the wafer heating accuracy.

[0023] The L-shaped locking lever can automatically engage and disengage from the locking slot as the ceramic plate rises and falls, eliminating the need for manual intervention in the locking or unlocking process. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of a silicon carbide ceramic heating plate with uniform thermal conductivity.

[0025] Figure 2 This is a schematic diagram of the internal heating mechanism of a silicon carbide ceramic heating plate with uniform thermal conductivity.

[0026] Figure 3 This is an exploded structural diagram of the heating mechanism in a silicon carbide ceramic heating plate with uniform thermal conductivity.

[0027] Figure 4 for Figure 2 A magnified structural diagram of point A in the middle.

[0028] Figure 5 This is a schematic diagram of the internal structure of a silicon carbide ceramic heating plate with uniform thermal conductivity.

[0029] Figure 6 This is a schematic diagram of the heat-locking groove in a silicon carbide ceramic heating plate with uniform thermal conductivity.

[0030] Figure 7 This is a frontal cross-sectional view of a silicon carbide ceramic heating plate with uniform thermal conductivity under different conditions.

[0031] Figure 8 for Figure 7 A magnified structural diagram at point B in the middle.

[0032] In the diagram: 1. Control base; 2. Heating plate; 3. First ceramic plate; 4. Second ceramic plate; 5. Heating mechanism; 501. Telescopic support rod; 502. First support platform; 503. First heating wire; 504. Second support platform; 505. Second heating wire; 6. Gravity adjustment mechanism; 601. First rack; 602. Second rack; 603. Third rack; 604. Fourth rack; 605. First gear; 606. Second gear; 607. Limiting seat; 608. Damping spring; 7. Control mechanism; 701. Control board; 702. Control switch; 703. Extrusion block; 8. Locking mechanism; 801. Heat-locking groove; 802. Locking groove; 803. L-shaped locking rod; 804. First return spring; 805. Limiting block; 806. Slide groove; 807. Slider; 808. Second return spring; 9. Wafer. Detailed Implementation

[0033] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0034] Reference Figures 1-8A silicon carbide ceramic heating plate 2 with uniform heat conduction is provided, including a control base 1 and a heating plate 2. The heating plate 2 is disposed on the upper end of the control base 1 and electrically connected to it. The control base 1 is used to provide power to the heating plate 2 and control it. The heating plate 2 is used to integrate various components. A first ceramic plate 3 and a second ceramic plate 4 are disposed on the upper surface of the heating plate 2. The first ceramic plate 3 is disposed inside the second ceramic plate 4. The first ceramic plate 3 and the second ceramic plate 4 have a heat conduction effect through their own materials. A heating mechanism 5 is disposed inside the heating plate 2. The heating mechanism 5 includes a telescopic support rod 501, a first support platform 502, a first heating wire 503, a second support platform 504, and a second heating wire 505. Three [other components] are fixedly connected to the bottom of the heating plate 2. A set of telescopic support rods 501, the upper end of which is fixedly connected to a first support platform 502, and the upper ends of the remaining two sets of telescopic support rods 501 are fixedly connected to second support platforms 504. The upper end of the first support platform 502 is fixedly connected to a first heating wire 503, and the upper end of the second support platform 504 is fixedly connected to a second heating wire 505. Both the first heating wire 503 and the second heating wire 505 are electrically connected to the control base 1. The heating mechanism 5 is used to control the temperature rise of the first ceramic plate 3 and the second ceramic plate 4. A gravity adjustment mechanism 6 is provided on the heating plate 2 and the upper ends of the first ceramic plate 3 and the second ceramic plate 4. The gravity adjustment mechanism 6 is used to adjust the contact between the heating mechanism 5 and the first ceramic plate 3 and the second ceramic plate 4 for heating.

[0035] Reference Figures 2-5 as well as Figure 7 The first ceramic plate 3 has a first rack 601 fixedly connected to both ends of its lower end face; the first support platform 502 has a second rack 602 fixedly connected to both ends of its lower end face; the second ceramic plate 4 has a third rack 603 fixedly connected to both ends of its lower end face; and the second support platform 504 has a fourth rack 604 fixedly connected to both ends of its lower end face. A first gear 605 is provided between adjacent first racks 601 and second racks 602, and a second gear 605 is provided between adjacent third racks 603 and fourth racks 604. Gear 606, first rack 601 and second gear 606 are both connected to limit seats 607 on their outer walls, and the limit seats 607 are fixed to the bottom of the heating plate 2. First rack 601 and second rack 602 are both meshed with the adjacent first gear 605. Third rack 603 and fourth rack 604 are both meshed with the adjacent second gear 606. Damping springs 608 are fixedly connected to the bottom of first rack 601 and third rack 603, and the other end of damping springs 608 is fixedly connected to the bottom of heating plate 2.

[0036] The wafer 9 is placed at the center of the first ceramic sheet 3. The wafer 9 is positioned above the first ceramic sheet 3 and the second ceramic sheet 4 according to its own size (diameter), and presses down on the first ceramic sheet 3 or the first ceramic sheet 3 and the second ceramic sheet 4 according to its own mass.

[0037] It should be added that if the size (diameter) of wafer 9 is larger than the diameter of the first ceramic sheet 3, the first ceramic sheet 3 and the second ceramic sheet 4 will be pressed down simultaneously; if the size (diameter) of wafer 9 is smaller than the diameter of the first ceramic sheet 3, the first ceramic sheet 3 will be pressed down alone.

[0038] When the first ceramic plate 3 moves downwards alone, it drives the first racks 601 at both ends of the bottom to move downwards and compresses the damping springs 608 at the bottom of the first racks 601, causing the damping springs 608 to tighten and store energy. Following the downward movement of the first racks 601, the first gear 605 meshes with it and rotates. The rotation of the first gear 605 meshes with the second rack 602 at the other end, causing the second rack 602 to move in the opposite direction to the first rack 601. This causes the two sets of second racks 602 to rise upwards, so that the first support platform 502 and the first heating wire 503 at the top move upwards. At this time, the telescopic support rod 501 at the bottom of the first support plate will extend and retract synchronously, so that the first support platform 502 and the first heating wire 503 at the top are completely in contact with the heat-locking groove 801 opened at the bottom of the first ceramic plate 3.

[0039] It should be added that the state of the first ceramic piece 3 before and after being pressed down and moved is visible. Figure 7 ;

[0040] When the first ceramic plate 3 and the second ceramic plate 4 move downwards simultaneously, the first rack 601 and the third rack 603 at the bottom of the first ceramic plate 3 and the second ceramic plate 4 move downwards synchronously and move in the same way as described above, so that the first heating wire 503 and the second heating wire 505 at the top of the first support platform 502 and the second support platform 504 respectively abut against the heat-locking groove 801 at the bottom of the first ceramic plate 3 and the second ceramic plate 4.

[0041] It should be added that the heat-locking groove 801 is ring-shaped, which can prevent the heat from the first heating wire 503 and the second heating wire 505 from dissipating and affecting the heating effect;

[0042] When wafer 9 is no longer on the top of the first ceramic plate 3 or the second ceramic plate 4, the first ceramic plate 3 and the second ceramic plate 4 are automatically reset by the damping spring 608 at the bottom, thereby driving each rack and gear to reverse and automatically reset to the initial position.

[0043] It should be added that when the wafer 9 presses down on the first ceramic sheet 3 or the first ceramic sheet 3 and the second ceramic sheet 4 by its own mass, the downward movement distance of the first ceramic sheet 3 or the first ceramic sheet 3 and the second ceramic sheet 4 is limited. (When the first ceramic sheet 3 or the first ceramic sheet 3 and the second ceramic sheet 4 move downward, the gravity control mechanism 6 set at the bottom drives the first support platform 502 and the second support platform 504 to rise synchronously, and the first heating wire 503 and the second heating wire 505 are both in contact with the corresponding heat-locking groove 801.) Therefore, no matter how much mass the wafer 9 has, it will not affect the downward movement length of the first ceramic sheet 3 or the first ceramic sheet 3 and the second ceramic sheet 4, and can ensure that the first heating wire 503 and the second heating wire 505 are in contact with the corresponding heat-locking groove 801.

[0044] Reference Figure 5 and Figure 7 The control mechanism 7 is located at the bottom of the heating plate 2. The control mechanism 7 is used to control the opening and closing of the first heating wire 503 and the second heating wire 505. Two sets of control plates 701 are fixedly connected to the bottom of the heating plate 2. Each set of control plates 701 is equipped with a control switch 702. The control plate 701 and control switch 702 located near the center of the heating plate 2 are electrically connected to the first heating wire 503. The control plate 701 and control switch 702 located away from the center of the heating plate 2 are electrically connected to the second heating wire 505. The outer walls of the first rack 601 and the third rack 603 near the two sets of control plates 701 are fixedly connected to the extrusion block 703. The outer wall of the extrusion block 703 is provided with a wedge-shaped surface.

[0045] The existing ceramic heating plate 2 adopts a manual intervention switch control mode. The start and stop operation of its heating wire requires manual intervention by the staff before and after operation. The control process has obvious human dependence. If the switch is not turned off after operation, the heating plate 2 is prone to dry burning, which may cause overheating and loss of equipment, and even have a potential impact on the safety of the surrounding production environment.

[0046] When the first ceramic plate 3 moves downward (details have been described above), it drives the corresponding first rack 601 to move downward. The first rack 601 is pressed downward by the pressing block 703 on the outer wall and presses the control switch 702 on the upper end of the corresponding control plate 701, triggering the control switch 702, thereby starting the first heating wire 503.

[0047] Similarly, when the second ceramic plate 4 and the first ceramic plate 3 move downwards simultaneously, the first rack 601 and the third rack 603 move downwards, and the first rack 601 and the third rack 603 are pressed downwards by the pressing block 703 on the outer wall, and press the control switch 702 at the upper end of the corresponding control plate 701, and trigger the control switch 702 to start the first and second heating wires 505.

[0048] It should be added that the control switch 702 is a push-button switch;

[0049] It should be added that both the control board 701 and the control switch 702 are electrically connected to the control base 1;

[0050] It should be added that the outer wall of the extrusion block 703 adopts a wedge-shaped surface design, which can better compress the control switch 702 and trigger it;

[0051] When the first ceramic plate 3 and the second ceramic plate 4 are reset, the pressing block 703 will contact the control switch 702 again, thereby controlling the first heating wire 503 and the second heating wire 505 to turn off.

[0052] Reference Figures 6-8 The locking mechanism 8 is located above the first ceramic plate 3 and the second ceramic plate 4, as well as the first support platform 502 and the second support platform 504. The locking mechanism 8 is used to lock the positions of the first support platform 502 and the second support platform 504. The bottom ends of the first ceramic plate 3 and the second ceramic plate 4 are each provided with a heat-locking groove 801. Locking grooves 802 are provided at both ends of the two sets of heat-locking grooves 801. L-shaped locking rods 803 are provided at both ends of the upper surfaces of the first support platform 502 and the second support platform 504. The L-shaped locking rods 803 cooperate with the corresponding locking grooves 802. The internal shape of 02 is L-shaped. A first return spring 804 is fixedly connected to one end of the locking groove 802. A limit block 805 is fixedly connected to the other end of the first return spring 804. The limit block 805 and the first return spring 804 are used to limit the L-shaped locking rod 803 after it enters the locking groove 802. A slider 807 is fixedly connected to the bottom end of the L-shaped locking rod 803. The upper surfaces of the first support platform 502 and the second support platform 504 are provided with a sliding groove 806 that cooperates with the slider 807. A second return spring 808 is fixedly connected between the sliding groove 806 and the corresponding slider 807.

[0053] During the heating process, the heating wire is prone to displacement and stacking, resulting in inconsistent contact area with the ceramic plate. This can lead to situations where some areas are too hot (far exceeding the set value) and some areas have no heat, making it impossible to output the rated power stably.

[0054] When the corresponding L-shaped locking rod 803 contacts the locking groove 802 of the heat-locking groove 801 (as described above, after the wafer 9 is placed on the upper end of the first ceramic sheet 3 and the second ceramic sheet 4), the top end of the L-shaped locking rod 803 will contact the limiting block 805 in the locking groove 802. The limiting block 805 moves backward and squeezes the first return spring 804 at the rear end to retract, so that the L-shaped locking rod 803 enters the locking groove 802, and the protrusion at the top end of the L-shaped locking rod 803 enters the groove of the locking groove 802. The limiting block 805 loses the limitation of external force, the first return spring 804 automatically resets, and drives the limiting block 805 to abut against the outer wall of the L-shaped locking rod 803 to limit the L-shaped locking rod 803.

[0055] It should be added that the L-shaped locking lever 803 will move adaptively through the bottom slider 807, the groove 806 and the second return spring 808;

[0056] It should be added that wedge-shaped surfaces are provided at both ends of the limiting block 805, so that when the L-shaped locking rod 803 enters and exits the locking groove 802 (it will contact and squeeze the limiting block 805 when entering and exiting the locking groove 802), it will not get stuck with the limiting block 805, thus affecting the overall effect of the locking mechanism 8.

[0057] It should be added that the L-shaped locking rod 803 moves synchronously according to the lifting and lowering of the first ceramic plate 3 and the second ceramic plate 4. After being lifted and lowered to the designated position, it automatically engages or disengages from the locking groove 802, thereby locking the position of the first support platform 502 or the second support platform 504 during heating.

[0058] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0059] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A silicon carbide ceramic heating disc having uniform heat conduction, characterized by, Include: Control seat (1) and heating disc (2), the heating disc (2) is arranged on the upper end of control seat (1) and is electrically connected with it, the control seat (1) is used to provide power supply and control for heating disc (2), and the heating disc (2) is used to integrate various components; First ceramic sheet (3) and second ceramic sheet (4) are arranged on the upper surface of the heating disc (2), the first ceramic sheet (3) is arranged on the inner side of the second ceramic sheet (4), and the first ceramic sheet (3) and the second ceramic sheet (4) play a heat conduction effect through their own material quality; Heating mechanism (5) is arranged in the heating disc (2), the heating mechanism (5) includes telescopic support rod (501), first bearing table (502), first electric heating wire (503), second bearing table (504) and second electric heating wire (505), the bottom end of the heating disc (2) is fixedly connected with three groups of telescopic support rods (501), the upper end of the telescopic support rod (501) located at the center position is fixedly connected with the first bearing table (502), the upper end of the remaining two groups of telescopic support rods (501) is fixedly connected with the second bearing table (504), the upper end of the first bearing table (502) is fixedly connected with the first electric heating wire (503), the upper end of the second bearing table (504) is fixedly connected with the second electric heating wire (505), the first electric heating wire (503) and the second electric heating wire (505) are electrically connected with the control seat (1), and the heating mechanism (5) is used to control the first ceramic sheet (3) and the second ceramic sheet (4) to heat up; Gravity adjusting mechanism (6) is arranged on the heating disc (2) and the first ceramic sheet (3) and the second ceramic sheet (4), and the gravity adjusting mechanism (6) is used to adjust the contact between the heating mechanism (5) and the first ceramic sheet (3) and the second ceramic sheet (4) and heat.

2. The silicon carbide ceramic heating disc with uniform heat conduction according to claim 1, characterized in that, The gravity adjusting mechanism (6) includes first rack (601), second rack (602), third rack (603), fourth rack (604), first gear (605), second gear (606), limit seat (607) and damping spring (608), the lower end surface of the first ceramic sheet (3) is fixedly connected with the first rack (601) on both ends, the lower end surface of the first bearing table (502) is fixedly connected with the second rack (602) on both ends, the lower end surface of the second ceramic sheet (4) is fixedly connected with the third rack (603) on both ends, and the lower end surface of the second bearing table (504) is fixedly connected with the fourth rack (604) on both ends.

3. The silicon carbide ceramic heating disc with uniform heat conduction according to claim 2, characterized in that, First gear (605) is arranged between adjacent first rack (601) and second rack (602), second gear (606) is arranged between adjacent third rack (603) and fourth rack (604), limit seat (607) is connected to the outer wall of first rack (601) and second gear (606), and the limit seat (607) is fixed to the bottom end of the heating disc (2).

4. The silicon carbide ceramic heating disc with uniform heat conduction according to claim 3, characterized in that, The first rack (601) and the second rack (602) are engaged with the adjacent first gear (605), and the third rack (603) and the fourth rack (604) are engaged with the adjacent second gear (606).

5. The silicon carbide ceramic heating disc of uniform heat conduction according to claim 3, characterized in that, The first rack (601) and the third rack (603) are fixedly connected with the damping spring (608) at the bottom end, and the other end of the damping spring (608) is fixedly connected with the bottom end of the heating disc (2).

6. The SiC ceramic heating disc with uniform heat conduction according to claim 1, characterized in that, The bottom end of the heating disc (2) is provided with a control mechanism (7), the control mechanism (7) comprises a control panel (701), a control switch (702) and an extrusion block (703), and the control mechanism (7) is used for controlling the opening and closing of the first electric heating wire (503) and the second electric heating wire (505).

7. The silicon carbide ceramic heating disc of uniform heat conduction according to claim 6, characterized in that, The bottom end of the heating disc (2) is fixedly connected with two groups of control panels (701), and the upper end of the two groups of control panels (701) is provided with a control switch (702), the control panel (701) arranged near the center of the heating disc (2) is electrically connected with the control switch (702) and the first electric heating wire (503), the control panel (701) arranged away from the center of the heating disc (2) is electrically connected with the control switch (702) and the second electric heating wire (505), the first rack (601) and the third rack (603) near the two groups of control panels (701) are fixedly connected with the extrusion block (703), and the outer wall of the extrusion block (703) is provided with a wedge surface.

8. The silicon carbide ceramic heating disc of uniform heat conduction according to claim 1, characterized in that, The first ceramic sheet (3) and the second ceramic sheet (4) and the first bearing table (502) and the second bearing table (504) are provided with a locking mechanism (8) above, the locking mechanism (8) comprises a locking groove (801), a locking groove (802), an L-shaped locking rod (803), a first reset spring (804), a limiting block (805), a sliding groove (806), a sliding block (807) and a second reset spring (808), the locking mechanism (8) is used for locking the position of the first bearing table (502) and the second bearing table (504), the bottom end of the first ceramic sheet (3) and the second ceramic sheet (4) is provided with a locking groove (801), the left and right ends of the two locking grooves (801) are provided with a locking groove (802), the upper end faces of the first bearing table (502) and the second bearing table (504) are provided with an L-shaped locking rod (803), and the L-shaped locking rod (803) is used in cooperation with the corresponding locking groove (802).

9. The silicon carbide ceramic heating disc of uniform heat conduction according to claim 8, characterized in that, The inner shape of the locking groove (802) is L-shaped, one end of the locking groove (802) is fixedly connected with a first reset spring (804), the other end of the first reset spring (804) is fixedly connected with a limiting block (805), the limiting block (805) and the first reset spring (804) are used for limiting the L-shaped locking rod (803) after entering the locking groove (802), the bottom end of the L-shaped locking rod (803) is fixedly connected with a sliding block (807), the upper end faces of the first bearing table (502) and the second bearing table (504) are provided with a sliding groove (806) matched with the sliding block (807), and the sliding groove (806) and the corresponding sliding block (807) are fixedly connected with a second reset spring (808).

10. The silicon carbide ceramic heating disc of uniform heat conduction according to claim 1, characterized in that, The first ceramic sheet (3) and the second ceramic sheet (4) are provided with a wafer (9) on the upper end.

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