Wide-voltage-input multi-output adaptive power panel

Abstract

The invention relates to the technical field of power panels, and particularly discloses a wide-voltage-input multi-output adaptive power panel which comprises a power mainboard, the power mainboard comprises a first printed board layer, a middle board layer and a second printed board layer from top to bottom, a wide-voltage-input circuit module is arranged on the first printed board layer, and a wide-voltage-output circuit module is arranged on the middle board layer. A multi-path output circuit module is arranged on the second printed board layer, and the multi-path output circuit module is electrically connected with the wide voltage input circuit module; soaking guide plates which are in contact with the wide voltage input circuit module and the multi-path output circuit module are respectively arranged in the first printed board layer and the second printed board layer, and a heat dissipation unit is also arranged in the middle board layer; the electromagnetic interference is reduced by physical isolation, and the voltage conversion precision is improved; and meanwhile, by combining the synergistic effect of the soaking guide plates and the heat dissipation units, heat is rapidly transferred to the phase change material of the middle plate layer through the heat conduction columns, and efficient heat diffusion and temperature balance are achieved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of power supply board, and particularly discloses a wide voltage input multi-output adaptive power supply board. BACKGROUND

[0002] In modern electronic equipment and industrial automation scenarios, the power supply of the device operating environment has large voltage fluctuation and requires multi-path differentiated power supply inside the device, which puts high requirements on the wide voltage input and multi-output performance of the power supply board. For example, in field operation equipment, due to the unstable power supply of the generator, the power supply needs to adapt to wide voltage input, and at the same time provide stable output for multiple modules such as lighting and communication.

[0003] At present, the circuit layout of the common power supply board often mixes the wide voltage input circuit and the multi-output circuit, which causes serious signal interference, not only affects the voltage conversion efficiency, but also makes it difficult to realize precise regulation and control of multi-output. At the same time, in the aspect of heat dissipation design, the traditional power supply board usually uses a single cooling fin or fan for passive cooling, which cannot quickly remove the large amount of heat generated during the operation of the power supply board. Especially under high load operation, the components are prone to overheating, which reduces the stability and service life of the power supply board. In addition, its packaging structure usually adopts rigid connection and lacks buffering mechanism. Under complex working conditions such as vibration and impact, the internal power supply mainboard is prone to displacement with the shell, which causes the circuit connection to be loose and affects the normal operation of the equipment. SUMMARY

[0004] The present application aims to provide a wide voltage input multi-output adaptive power supply board to solve one of the above technical problems in the prior art.

[0005] Specifically, the present application realizes the following technical scheme:

[0006] A wide voltage input multi-output adaptive power supply board, comprising a power supply mainboard, the power supply mainboard comprises from top to bottom: a first printed board layer, an intermediate board layer and a second printed board layer, a wide voltage input circuit module is arranged on the first printed board layer, a multi-output circuit module is arranged on the second printed board layer, and the multi-output circuit module is electrically connected with the wide voltage input circuit module;

[0007] A heat conduction plate is arranged in the first printed board layer and the second printed board layer respectively and in contact with the wide voltage input circuit module and the multi-output circuit module, and a heat dissipation unit is further arranged in the intermediate board layer, the heat dissipation unit comprises a plurality of heat dissipation substrates arranged at intervals, and the plurality of heat dissipation substrates are connected with the heat conduction plate through heat conduction columns;

[0008] Each of the aforementioned heat dissipation substrates has a heat dissipation cavity inside, the heat dissipation cavity is filled with a phase change material layer, a number of thermal expansion members are embedded inside the phase change material layer, the exterior of the thermal expansion members is connected to the heat conduction pillar, and a number of protruding inserts are also provided on the exterior of the thermal expansion members.

[0009] Based on the above solutions, this application effectively reduces electromagnetic interference between wide voltage input and multi-output circuits, and improves voltage conversion accuracy; through the structural synergy between the phase change material layer and the thermal expansion component, it significantly improves heat dissipation efficiency and balances temperature distribution; and the design of the distributed heat dissipation substrate avoids component performance degradation caused by local high temperature, and enhances the operating stability of the power board under wide voltage input and high load conditions.

[0010] Furthermore, an array of irregularly spaced microgrooves is provided at the top and bottom of the heat dissipation cavity.

[0011] This solution forms a three-dimensional heat dissipation interface by arraying microgrooves, which increases the contact area between the phase change material and the cavity. At the same time, the geometric differences of the grooves promote multi-directional heat flow. This solves the problem of low heat dissipation efficiency caused by insufficient contact area inside the heat dissipation cavity, makes the heat transfer between the phase change material and the cavity more uniform, reduces local overheating, and maintains stable contact between the material and the cavity during long-term use.

[0012] Preferably, the thermal expansion member is made of shape memory alloy material, which expands in volume when heated and the temperature rises. The thermal expansion member is a hollow tubular structure. One end of the heat-conducting column penetrates into the heat dissipation cavity and is inserted into the thermal expansion member. A plurality of the protruding inserts are distributed circumferentially along the outer tube wall of the thermal expansion member.

[0013] Based on the above solution, this application realizes dynamic adjustment of the contact area between the thermal expansion component and the phase change material layer, which significantly improves the heat transfer efficiency under high temperature conditions. At the same time, the insertion action of the protruding rod breaks the solidified layer on the surface of the phase change material, promotes the convection circulation of the internal liquid phase change material, and avoids the phase change material layer from affecting the heat absorption efficiency due to the boundary effect during phase change heat absorption, thereby further improving the heat dissipation efficiency of the heat dissipation unit.

[0014] Specifically, the end of the protruding insert has an inclined cut surface, which faces the expansion direction of the thermal expansion member.

[0015] This solution utilizes the inclined guide effect of the protruding insert to convert the expansion force into an effective cutting driving force, facilitating its rapid insertion into the deep layers of the phase change material layer. This forms a uniformly deep heat conduction channel within the phase change material layer, improving the heat absorption efficiency of the phase change material, while simultaneously preventing localized material accumulation caused by the movement of the insert.

[0016] Furthermore, a cooling channel is provided between any two adjacent heat dissipation substrates, and the cooling channel is arranged along the length of the intermediate plate layer, with both ends penetrating the intermediate plate layer.

[0017] Based on the above solution, this application effectively solves the problem of reduced heat dissipation efficiency caused by heat accumulation between adjacent heat dissipation substrates, and the forced convection path formed by the cooling channel accelerates the exhaust of hot air, ensuring uniform temperature distribution between heat dissipation substrates and avoiding the impact of local overheating on the stability of the power board.

[0018] Furthermore, the heat dissipation substrate is provided with a plurality of heat dissipation fins extending into the cooling channel on the side near the cooling channel, and the heat dissipation fins on both sides of the cooling channel are arranged alternately.

[0019] Based on the above solution, this application can effectively improve the turbulence intensity of airflow in the cooling channel, enhance the heat exchange capacity between the heat dissipation substrate and the cooling medium, solve the problem of insufficient heat dissipation efficiency caused by laminar flow effect in traditional heat dissipation structures, and at the same time, the staggered heat dissipation fin layout ensures that the airflow is fully diffused in the cooling channel, eliminates local overheating areas, and improves heat dissipation uniformity.

[0020] More preferably, the heat dissipation fins and the heat dissipation substrate are slidably connected by a telescopic movable member. The telescopic movable member includes a sliding groove formed on the side of the heat dissipation substrate and communicating with the heat dissipation cavity. A flexible sheet is also provided inside the heat dissipation cavity at the position corresponding to the sliding groove. The flexible sheet is connected to the heat dissipation cavity on all sides and is used to cover the sliding groove. The flexible sheet is arc-shaped and protrudes inside the heat dissipation cavity. One end of the heat dissipation fin passes through the sliding groove and is connected to the flexible sheet.

[0021] Based on the above solution, this application achieves dynamic adjustment of the extension length of the heat dissipation fins through telescopic movable parts, which enhances the contact efficiency between the heat dissipation fins and the cooling airflow, thereby maintaining stable heat dissipation performance under high temperature conditions and optimizing heat dissipation efficiency. At the same time, to a certain extent, it effectively avoids the stress concentration problem caused by thermal expansion and contraction at the connection between the heat dissipation fins and the heat dissipation substrate, and avoids the stress concentration at the connection, which may lead to structural fatigue and breakage damage after long-term use.

[0022] Specifically, it also includes a package shell fitted over the power supply motherboard. The interior of the package shell is installed with the power supply motherboard via an elastic positioning member. The elastic positioning member includes positioning posts located at the four corners of the interior of the package shell, a fixing pad fixedly fitted over the positioning posts, and a clamping pad threadedly fitted over the positioning posts and located above the fixing pad. The four corners of the middle plate of the power supply motherboard are provided with arc-shaped notches that are adapted to the outer surface of the positioning posts, and a connecting clip is provided in the arc-shaped notch. When the connecting clip is placed on the fixing pad, the clamping pad is rotated, causing the clamping pad to rotate and slide down on the positioning posts and press against the fixing pad to clamp the connecting clip.

[0023] Based on the above solution, it solves the problem of substrate displacement caused by rigid connection under vibration or impact. The elastic positioning component absorbs mechanical impact energy through buffering and self-locking mechanism to maintain the relative position stability of the substrate and the shell. The curved surface of the connecting clip and the arc notch disperses the clamping pressure and avoids local deformation or breakage, thereby ensuring the reliability of circuit connection and extending the service life of power board.

[0024] More specifically, air inlets corresponding to the cooling channels are provided at both ends of the length direction of the encapsulation shell. An inwardly protruding guide shroud is provided on the side of the air inlet near the cooling channel. The air inlet is connected to the cooling channel through the guide shroud. A dust filter is also provided inside the air inlet, and a convection fan is installed on the inner side of one of the dust filters. The convection fan is connected to the air inlet through a sliding mechanism, which drives the convection fan to move laterally back and forth within the air inlet.

[0025] Based on the above scheme, this application forms a forced convection path and optimizes the airflow distribution, thereby improving the heat release efficiency of the phase change material in the heat dissipation cavity. At the same time, by dynamically adjusting the fan position, heat dissipation blind spots are eliminated, avoiding the degradation of circuit performance caused by local overheating. The dust filter can prevent dust from entering the cooling channel and accumulating, thus affecting the heat dissipation efficiency.

[0026] Furthermore, the sliding mechanism includes a linear guide rail arranged along the length of the air inlet, a moving platform slidably mounted on the linear guide rail for supporting the convection fan, a driving device for driving the moving platform to reciprocate on the linear guide rail at one end along the length of the linear guide rail, a connecting rod at one end of the moving platform corresponding to the dust filter, and a cleaning component for cleaning the dust filter connected to the end of the connecting rod.

[0027] Based on the above solution, it effectively solves the problem of reduced heat dissipation efficiency caused by dust accumulation and clogging of the dust filter. It maintains unobstructed heat dissipation channels through the synergistic effect of dynamic cleaning and airflow disturbance, while avoiding unidirectional wear of the cleaning components and extending the service life of the cleaning components.

[0028] Compared with the prior art, the present invention has the following advantages and beneficial effects:

[0029] 1. Through the layered printed circuit board structure design, the wide voltage input circuit module and the multi-output circuit module are respectively arranged on the first printed circuit board layer and the second printed circuit board layer. Physical isolation is used to reduce electromagnetic interference and improve voltage conversion accuracy. At the same time, combined with the synergistic effect of the heat dissipation plate and the heat dissipation unit, heat is quickly transferred to the phase change material of the middle plate layer through the heat conduction pillars to achieve efficient heat diffusion and temperature balance.

[0030] 2. This invention utilizes a dynamic cooperation mechanism between the phase change material layer and the thermal expansion component. When the temperature rises, the thermal expansion component drives the protruding insert to penetrate the phase change material, thereby disrupting the boundary effect and promoting convection circulation, significantly improving heat dissipation efficiency. At the same time, the micro-groove array design increases the contact area between the phase change material and the heat dissipation cavity, optimizes the heat conduction path, and solves the problem of local overheating caused by insufficient contact in traditional heat dissipation structures.

[0031] 3. The present invention utilizes the ingenious layout of distributed heat dissipation substrate and staggered heat dissipation fins, combined with cooling channels to form forced convection, thereby enhancing heat exchange capacity; at the same time, the telescopic movable parts dynamically adjust the extension length of the heat dissipation fins according to the temperature, avoiding laminar flow effect and eliminating stress concentration, thus ensuring heat dissipation stability under wide voltage input and high load conditions.

[0032] 4. This invention achieves a flexible connection between the package shell and the power motherboard through the curved surface cooperation of the elastic positioning component and the arc-shaped connecting clip, effectively absorbing mechanical vibration and impact energy, avoiding substrate displacement and circuit damage caused by rigid connection. At the same time, through the sliding cooperation of the convection fan and the sliding mechanism, and the mechanical synergy of the dust filter and the cleaning component, dust is prevented from accumulating in the cooling channel, thereby maintaining the heat dissipation channel unobstructed, extending the service life of the power board, and ensuring the long-term reliable operation of the power board in complex environments. Attached Figure Description

[0033] The accompanying drawings, which are included to provide a further understanding of embodiments of the invention and form part of this application, do not constitute a limitation thereof. In the drawings:

[0034] Figure 1 This is a schematic cross-sectional view of the power supply motherboard of the present invention;

[0035] Figure 2 For the present invention Figure 1The enlarged schematic diagram of a portion of the heat dissipation substrate is intended to show the specific structure of its internal heat dissipation cavity.

[0036] Figure 3 This is a schematic diagram of the overall structure of the power supply motherboard and the packaging shell of the present invention;

[0037] Figure 4 This is a schematic diagram of the internal structure of the power supply motherboard and the package housing of the present invention, intended to show the specific structure of the cooling channel and the air intake hole;

[0038] Figure 5 This is a partial side view of the power supply motherboard and the package shell of the present invention, intended to illustrate the specific structure of the elastic positioning component;

[0039] Figure 6 For the present invention Figure 4 The diagram shows a partially enlarged view of the sliding mechanism, intended to illustrate the specific structure of the sliding mechanism and the convection fan.

[0040] The reference numerals in the attached figures represent: 1. Power supply mainboard; 11. Intermediate board layer; 12. First printed circuit board layer; 13. Second printed circuit board layer; 2. Heat dissipation plate; 31. Heat dissipation substrate; 311. Heat dissipation cavity; 312. Phase change material layer; 313. Thermal expansion component; 3131. Protruding insert; 32. Heat conduction pillar; 33. Cooling channel; 34. Heat dissipation fins; 351. Sliding groove; 352. Flexible sheet; 4. Encapsulation shell; 41. Positioning post; 42. Fixing pad; 43. Clamping pad; 44. Connecting clip; 51. Air inlet; 52. Air guide shroud; 53. Dust filter; 54. Sliding mechanism; 541. Linear guide rail; 542. Drive device; 543. Moving platform; 544. Connecting rod; 545. Cleaning component; 55. Convection fan. Detailed Implementation

[0041] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to embodiments and accompanying drawings. The illustrative embodiments and descriptions of this invention are for illustrative purposes only and are not intended to limit the invention. It should be noted that this invention is already in the actual research and development stage.

[0042] In existing technologies, electronic devices and industrial automation applications often face the need for power boards with wide voltage input and multiple outputs. However, traditional solutions suffer from problems such as signal interference and low heat dissipation efficiency due to messy circuit layouts. For example, field equipment requires wide voltage input due to unstable power supply and needs to power multiple modules simultaneously. Traditional power boards mix input and output circuits, causing electromagnetic interference that affects conversion accuracy. Furthermore, using a single heatsink or fan makes it difficult to quickly dissipate the heat generated by high loads, leading to decreased component overheating stability. Therefore, to solve the above problems, the applicant proposes a wide voltage input and multiple output power board, as described in the following embodiments.

[0043] Example

[0044] Please see Figures 1 to 6 As shown, this embodiment discloses a wide voltage input multi-output adaptive power board, including a power main board 1. The power main board 1 includes, from top to bottom: a first printed circuit board layer 12, an intermediate board layer 11, and a second printed circuit board layer 13. A wide voltage input circuit module is arranged on the first printed circuit board layer 12, and a multi-output circuit module is arranged on the second printed circuit board layer 13. The multi-output circuit module is electrically connected to the wide voltage input circuit module.

[0045] Heat dissipation plates 2 that are in contact with the wide voltage input circuit module and the multi-output circuit module are respectively provided inside the first printed circuit layer 12 and the second printed circuit layer 13. Heat dissipation unit is also provided inside the intermediate board layer 11. The heat dissipation unit includes multiple heat dissipation substrates 31 arranged at intervals, and the multiple heat dissipation substrates 31 are all connected to the heat dissipation plate 2 through heat conduction pillars 32.

[0046] Each heat dissipation substrate 31 has a heat dissipation cavity 311 inside, and the heat dissipation cavity 311 is filled with a phase change material layer 312. Several thermal expansion members 313 are embedded inside the phase change material layer 312. The exterior of the thermal expansion members 313 is connected to the heat conduction pillar 32, and several protruding inserts 3131 are also provided on the exterior of the thermal expansion members 313.

[0047] It should be noted that in the above embodiment, the power supply motherboard 1 is cleverly set as a layered structure, and the circuit modules are divided into different printed circuit board layers according to their functions. This allows the wide voltage input circuit and the multi-output circuit to be arranged separately. The electromagnetic interference between the circuit modules is reduced by physical isolation, avoiding signal interference caused by the traditional mixed arrangement, effectively improving the voltage conversion efficiency, and also providing a basis for the precise control of the multi-output.

[0048] The heat dissipation plate 2 is preferably made of copper alloy and is embedded in the first printed circuit board layer 12 and the second printed circuit board layer 13 to directly contact the relevant circuit modules, thereby achieving rapid heat conduction. At the same time, combined with the heat dissipation substrate 31 included in the heat dissipation unit, the phase change material filled inside undergoes a solid-liquid phase change after absorbing heat, which slows down the rate of temperature rise and makes the overall temperature fluctuation of the substrate material smooth. When the temperature reaches the threshold, the thermal expansion member 313 expands and deforms due to heat, which drives the protruding insert 3131 to penetrate into the phase change material layer 312, thereby destroying the internal crystal structure of the phase change material and accelerating the phase change reaction (achieving the boundary effect of destroying the phase change material during phase change heat absorption), so as to further improve the heat absorption efficiency of the phase change material. Furthermore, the heat dissipation substrates 31 arranged at intervals form distributed heat dissipation nodes, and heat diffuses to the middle layer through multiple paths, avoiding local overheating.

[0049] For example, when the power board generates heat, the heat is first transferred to the heat spreader 2. After the heat spreader 2 evenly distributes the heat, it is transferred to the heat dissipation substrate 31 through the heat conduction pillars 32. Since the heat dissipation cavity 311 inside the heat dissipation substrate 31 is filled with a phase change material layer 312, when the phase change material layer 312 absorbs heat and reaches the phase change temperature, it will change from a solid to a liquid state to absorb a large amount of heat, thereby efficiently absorbing and storing heat to delay the temperature rise. It should be understood that the phase change material can be a paraffin-based composite material, which is initially a solid powder. During the heat absorption phase change, it will gradually change to a liquid state. When it changes from a solid powder state to a liquid state, it is very easy for its own gravity to produce a boundary effect, that is, the liquid gradually settles, resulting in uneven distribution of the phase change material. The presence of voids and layered thermal resistance that hinder heat absorption significantly reduces the heat dissipation effect. Therefore, this solution further embeds a thermal expansion member 313 in the phase change material layer 312. When the phase change material layer 312 absorbs heat and undergoes phase change, the thermal expansion member 313 expands and deforms, thereby driving its external insert to gradually penetrate deeper into the phase change material layer 312. This disrupts the layered structure caused by sedimentation, fills the voids, and allows the originally unevenly distributed liquid phase change material due to boundary effects to be remixed uniformly, restoring a good heat absorption state. At the same time, the protruding insert 3131 increases the contact area between the thermal expansion member 313 and the phase change material, accelerating the heat transfer rate and enabling the phase change material to absorb and store heat more efficiently. Furthermore, the thermal expansion component 313 is connected to the heat-conducting column 32, and its expansion process can also apply a certain pressure to the heat-conducting column 32, making the contact between the heat-conducting column 32 and the heat dissipation plate 2 and the heat dissipation substrate 31 closer, reducing thermal resistance, further improving the heat conduction efficiency of the entire heat dissipation system, ensuring that the heat generated by the power board during operation can be dissipated in a timely and effective manner, avoiding heat dissipation failure caused by the boundary effect of phase change materials, thereby ensuring the stable operation of the power board and extending its service life.

[0050] Based on the above embodiments, the specific circuit structure and working principle of the wide voltage input circuit module and the multi-output circuit module are illustrated below:

[0051] The wide voltage input circuit module uses an EMI filter circuit to filter out grid interference and converts AC power into pulsating DC power through a rectifier bridge. The PFC pre-regulator circuit drives the power MOSFET through a control IC and uses a boost inductor to boost the voltage to a stable value and store it in an energy storage capacitor to achieve high power factor correction. The LLC resonant conversion circuit uses a control IC to drive a pair of half-bridge MOSFETs and achieves soft switching through a resonant network and a high-frequency transformer to reduce switching losses.

[0052] The multi-output circuit module improves efficiency through synchronous rectification technology, with secondary rectification achieved by a control IC driving rectifier MOSFETs. The output voltage regulator circuit adopts a multi-channel independent design, with each output voltage achieving stable output through a corresponding control IC, energy storage inductor, and filter capacitor. Each output voltage forms a closed-loop feedback with a precision reference source and optocoupler to ensure that the output accuracy is within a reasonable range.

[0053] Furthermore, regarding circuit connections, the wide-voltage input circuit module and the multi-output circuit module are electrically isolated via a high-frequency transformer. The common-mode inductor input is connected to the AC input interface, the rectifier bridge output is connected to the PFC circuit, and the LLC resonant circuit output is coupled to the secondary synchronous rectifier circuit via a transformer. The main output communicates with the primary-side control circuit via an optocoupler. Additionally, it should be noted that the heat dissipation plate 2 uses a high thermal conductivity material and is tightly bonded to heat-generating components such as the power MOSFET and transformer via thermally conductive silicone pads, rapidly conducting heat to the heat dissipation unit. It should be further noted that the above is merely an illustrative example; the specific component parameters and circuit topology can be adjusted according to actual needs. Moreover, the circuit design is not within the scope of this application, therefore, this application does not further specify it.

[0054] Furthermore, such as Figure 2 As shown in the above embodiment, the top and bottom of the heat dissipation cavity 311 are respectively provided with an array of irregularly spaced micro-grooves.

[0055] Combined with appendix Figure 1 and Figure 2The irregular microgroove array refers to a non-uniform arrangement structure formed by grooves of varying depths and widths on the surface of the heat dissipation cavity 311. The irregular groove distribution forms a multi-directional three-dimensional contact surface, which allows the phase change material to fully fill the groove gaps when heated and expands, and increases the effective contact area between the phase change material layer 312 and the heat dissipation cavity 311, thus achieving rapid heat conduction. Specifically, when the phase change material undergoes a phase change due to heat, the thermal expansion component 313 is simultaneously heated and expands, generating a squeezing force that diffuses in all directions, forcing it into the deep area of ​​the groove and forming multi-directional diffusion paths at the top and bottom of the heat dissipation cavity 311, avoiding local heat accumulation and accelerating heat conduction.

[0056] Based on the above embodiments, the thermal expansion member 313 is made of shape memory alloy material, which expands in volume when heated and the temperature rises. The thermal expansion member 313 is a hollow tubular structure. One end of the heat-conducting column 32 penetrates into the heat dissipation cavity 311 and is installed inside the thermal expansion member 313. Multiple protruding inserts 3131 are distributed circumferentially along the outer tube wall of the thermal expansion member 313.

[0057] Specifically, the thermal expansion component 313 is preferably made of nickel-titanium shape memory alloy, while the protruding inserts 3131 refer to the protruding structures distributed on the surface of the thermal expansion component 313, which are used to disrupt the crystal structure of the phase change material and prevent the formation of delamination gaps due to boundary effects during phase transition (from solid to liquid). In specific implementation, when the power board is working, heat is transferred to the interior of the thermal expansion component 313 through the heat-conducting pillars 32 (because the nickel-titanium shape memory alloy expands and deforms when the temperature rises, causing the hollow tubular structure to expand radially). This causes the phase change material to expand and deform radially when heated, thereby driving the protruding inserts 3131 distributed circumferentially on its outside to penetrate into the phase change material layer 312 and apply compressive stress. This also destroys the thermal resistance layer generated by the phase change material layer 312 during the heat absorption phase change, thereby enabling the convection circulation of the liquid phase change material to a certain extent and forming a through heat dissipation channel. At the same time, the compressive stress applied to the phase change material layer 312 eliminates the void structure caused by the uneven sedimentation of the phase change material layer 312 (solid and liquid), thus ensuring the heat absorption efficiency of the phase change material layer 312.

[0058] In some preferred embodiments, in Figure 2As shown in the diagram, the end of the protruding insert 3131 has an inclined cut surface facing the expansion direction of the thermal expansion member 313. In specific implementation, when the thermal expansion member 313 is heated and extends axially, the contact surface between the inclined cut surface and the phase change material layer 312 forms a wedge-shaped effect, allowing the expansion force to be decomposed into a vertical component through the inclined surface. This causes the protruding insert 3131 to cut into the phase change material layer 312 along the inclined direction of the cut surface, forming an inclined through channel inside the phase change material. Compared with the vertical insertion method, the inclined channel can increase the effective contact area between the insert and the phase change material. At the same time, the direction of the cut surface is consistent with the direction of expansion displacement, avoiding the transverse shear force generated between the protruding insert 3131 and the phase change material layer 312 when the protruding insert 3131 moves, ensuring the linear advancement of the protruding insert 3131 during the cutting process, forming a uniformly distributed heat conduction network within the phase change material layer 312, and effectively improving the heat conduction efficiency.

[0059] Based on the above embodiments, Figure 1 As clearly shown, a cooling channel 33 is provided between any two adjacent heat dissipation substrates 31, and the cooling channel 33 is arranged along the length of the intermediate plate layer, with both ends penetrating the intermediate plate layer.

[0060] It is understood that the cooling channel 33 in this embodiment refers to the through airflow path set between adjacent heat dissipation substrates 31. Specifically, a cavity structure can be formed inside the intermediate plate layer by mechanical processing or molding process to guide the flow of external air.

[0061] Furthermore, the cooling channel 33 extends along the length of the intermediate plate to form a continuous airflow channel, and the openings at both ends of the intermediate plate allow air to form natural convection within the channel. When the heat dissipation substrate 31 generates heat due to operation, the hot air between adjacent substrates enters the cooling channel 33 and is discharged outward through convection within the cooling channel 33, thereby establishing a through-flow airflow path, eliminating the heat stagnation area between adjacent heat dissipation units in the traditional heat dissipation structure, and avoiding the temperature rise of the power supply motherboard 1 due to the accumulation of hot air.

[0062] Compared with existing technologies, traditional heat dissipation structures do not have a through airflow channel between adjacent heat dissipation units and rely solely on the heat sink for passive heat conduction, resulting in heat accumulation in narrow gaps. In contrast, this solution actively guides airflow circulation through a through cooling channel 33, using air convection to directly remove accumulated heat, thus breaking through the limitations of traditional heat dissipation structures on heat exchange efficiency.

[0063] Furthermore, in some preferred embodiments, such as Figure 1 , Figure 2 and Figure 4As shown, the heat dissipation substrate 31 is also provided with a plurality of heat dissipation fins 34 that penetrate into the cooling channel 33 on the side near the cooling channel 33, and the heat dissipation fins 34 located on both sides of the cooling channel 33 are arranged alternately.

[0064] In the above embodiments, the heat dissipation fins 34 are staggered, meaning that the projection positions of the heat dissipation fins 34 on both sides of the cooling channel 33 in the vertical airflow direction do not completely overlap, forming an asymmetrical arrangement. The arrangement of the heat dissipation fins 34 facilitates the timely conduction and dissipation of heat from the heat dissipation substrate 31 into the cooling channel 33. At the same time, when the cooling airflow flows through the cooling channel 33, the staggered heat dissipation fins 34 can block and divert the airflow multiple times, disrupting the laminar flow state and causing the airflow to form turbulence in the channel. In the turbulent state, the contact frequency between the airflow and the fin surface increases, and the efficiency of heat transfer from the fins to the airflow is improved. Meanwhile, the staggered arrangement of the fins extends the flow path of the airflow in the channel, preventing the airflow from directly penetrating the channel and causing insufficient heat dissipation in local areas. Furthermore, the asymmetrical layout causes the airflow to generate vortices in the cooling channel 33, further enhancing the heat exchange process between the airflow and the heat dissipation fins 34.

[0065] Based on the above embodiments, as a further preferred embodiment, please refer to... Figure 2 The heat dissipation fins 34 and the heat dissipation substrate 31 are slidably connected by a telescopic movable member. The telescopic movable member includes a sliding groove 351 that is formed on the side of the heat dissipation substrate 31 and communicates with the heat dissipation cavity 311. A flexible sheet 352 is provided inside the heat dissipation cavity 311 at the position corresponding to the sliding groove 351. The flexible sheet 352 is connected to the heat dissipation cavity 311 on all sides and is used to cover the sliding groove 351. The flexible sheet 352 is arc-shaped and protrudes inside the heat dissipation cavity 311. One end of the heat dissipation fins 34 passes through the sliding groove 351 and is connected to the flexible sheet 352.

[0066] As should be understood, the sliding groove 351 refers to the strip-shaped channel opened along the side of the heat dissipation substrate 31. Its function is to provide axial displacement space for the heat dissipation fins 34, allowing the heat dissipation fins 34 to move along the sliding groove 351 under the action of thermal expansion.

[0067] The flexible sheet 352 is a sheet-like structure made of elastic material, specifically silicone or rubber. Its perimeter is sealed to the heat dissipation cavity 311. While blocking the sliding groove 351, it absorbs the pressure changes inside the heat dissipation cavity 311 through its own deformation, thus preventing the leakage of phase change material.

[0068] In this embodiment, it should be noted that when the heat dissipation substrate 31 generates heat due to high load operation, the phase change material layer 312 absorbs heat and undergoes a phase change. At the same time, the thermal expansion member 313 expands due to heat, causing the internal pressure of the heat dissipation cavity 311 to increase, thereby squeezing the flexible sheet 352 and forcing the flexible sheet 352 to deform, so as to push the heat dissipation fins 34 to slide outward along the sliding groove 351, thereby increasing the area of ​​the heat dissipation fins 34 exposed in the cooling channel 33. When the temperature of the heat dissipation substrate 31 decreases, the flexible sheet 352 can return to its original shape and drive the heat dissipation fins 34 to retract to the initial position, thereby realizing the dynamic adjustment of the heat dissipation area. At the same time, the elastic deformation of the flexible sheet 352 can buffer the stress caused by thermal expansion and prevent the heat dissipation fins 34 from breaking at the connection between the heat dissipation substrate 31 and the heat dissipation fins 34.

[0069] Based on the above embodiments, this embodiment further proposes a wide voltage input multi-output adaptive power supply board. Please refer to [link to relevant documentation]. Figure 3 , Figure 4 and Figure 5 It also includes a casing 4 fitted over the power supply motherboard 1, with the casing 4 internally mounted to the power supply motherboard 1 via elastic positioning members. The elastic positioning members include positioning posts 41 located around the perimeter of the casing 4, fixing pads 42 fixedly fitted over the positioning posts 41, and clamping pads 43 threadedly fitted over the positioning posts 41 and located above the fixing pads 42. The perimeter of the middle plate of the power supply motherboard 1 has arc-shaped notches corresponding to the positions of the positioning posts 41, and connecting clips 44 are provided within these arc-shaped notches. When the connecting clips 44 are placed on the fixing pads 42, rotating the clamping pads 43 causes them to slide down the positioning posts 41 and press against the fixing pads 42, thus clamping the connecting clips 44.

[0070] Specifically, in Figure 3 and Figure 5 As shown, the power board 1 engages with the positioning post 41 through the arc-shaped notches around its perimeter. The connecting clip 44 is embedded in the notches and fits against the surface of the positioning post 41. When the clamping pad 43 is screwed into the positioning post 41 by the thread, its lower end face contacts and compresses the fixing pad 42 to generate radial clamping force. Since the connecting clip 44 is arc-shaped, the clamping force is evenly distributed along the circumference of the positioning post 41, which can effectively avoid local stress concentration. When external vibration or impact is transmitted to the package shell 4, the elastic deformation of the fixing pad 42 can absorb some of the energy. The threaded self-locking structure can maintain the stability of the clamping force, prevent relative displacement between the power board 1 and the shell, and further limit the lateral movement of the connecting clip 44, ensuring the reliability of the power board clamping and installation, and extending the service life of the power board.

[0071] Based on the above embodiments, a further preferred embodiment is, as follows: Figure 4An air inlet 51 corresponding to the cooling channel 33 is opened at both ends of the encapsulation shell 4 along its length. An inwardly protruding guide shroud 52 is provided on the side of the air inlet 51 near the cooling channel 33. The air inlet 51 is connected to the cooling channel 33 through the guide shroud 52. A dust filter 53 is provided inside the air inlet 51, and a convection fan 55 is installed inside one of the dust filters 53. The convection fan 55 is connected to the air inlet 51 through a sliding mechanism 54. The sliding mechanism 54 drives the convection fan 55 to move laterally back and forth inside the air inlet 51.

[0072] As shown in the attached diagram, when the convection fan 55 is started, the outside air is filtered by the dust filter 53 and then accelerated into the cooling channel 33 through the guide shroud 52. The tapered structure of the guide shroud 52 concentrates the airflow into the cooling channel 33 between the heat dissipation substrates 31. As the convection fan 55 moves laterally and reciprocally through the sliding mechanism 54, the cooling airflow covers different cooling channels 33, realizing the moving ventilation and heat dissipation of multiple cooling channels 33. This avoids insufficient heat dissipation in local areas caused by fixed-position air supply. At the same time, during the movement of the convection fan 55, the airflow impact direction changes with the position, causing turbulence to form on the surface of the heat dissipation fins 34, enhancing the heat exchange efficiency between the heat dissipation fins 34 and the air.

[0073] In addition, in the above embodiments, it is expected that the dust filter 53, as a multi-layer filter medium installed on the outside of the air inlet 51, is used to intercept external dust particles from entering the cooling channel 33. However, the dust filter located on the same side as the convection fan 55 will inevitably have dust adsorbed onto it during use due to the airflow from the convection fan 55, resulting in insufficient airflow efficiency and thus affecting cooling efficiency. In view of this, please refer to... Figure 6 This embodiment further proposes:

[0074] The sliding mechanism 54 includes a linear guide rail 541 arranged along the length of the air inlet 51, a moving platform 543 slidably mounted on the linear guide rail 541 for supporting the convection fan 55, a driving device 542 for driving the moving platform 543 to reciprocate at one end of the linear guide rail 541 along the length, a connecting rod 544 at one end of the moving platform 543 corresponding to the dust filter 53, and a cleaning component 545 for cleaning the dust filter 53 connected to the end of the connecting rod 544.

[0075] It can be understood that the linear guide 541 refers to the guide rail extending along the length of the air intake 51. Specifically, it can be implemented using a ball linear guide 541 or a slider guide, providing a precise lateral movement path for the moving platform 543.

[0076] The mobile platform 543 refers to the support structure that carries the convection fan 55 and slides along the linear guide rail 541. Specifically, it can be achieved by a combination of an aluminum alloy frame and a roller assembly to ensure stable translation on the guide rail.

[0077] The drive device 542 refers to the power source that controls the reciprocating motion of the mobile platform 543. Specifically, it can be implemented by using a stepper motor in conjunction with a synchronous belt drive mechanism to achieve periodic forward and reverse rotation control.

[0078] The cleaning component 545 refers to the cleaning component that comes into contact with the surface of the dust filter 53. Specifically, it can be implemented by using a flexible silicone scraper or an array of nylon bristles to remove dust from the surface of the filter through mechanical scraping.

[0079] Therefore, as an example, when the drive device 542 moves laterally along the linear guide rail 541 by traction of the moving platform 543 via the synchronous belt, and drives the convection fan 55 to move to force ventilation and heat dissipation of different cooling channels 33, it can further drive the cleaning component 545 to move on the dust filter 53 via the connecting rod 544. Thus, by moving the cleaning component 545 on the dust filter 53, the dust particles attached to the dust filter 53 can be cleaned and removed, thereby avoiding dust accumulation and clogging of the dust filter 53 and affecting its ventilation and heat dissipation efficiency.

[0080] The above specific embodiments further illustrate the purpose, technical solution, and beneficial effects of the present invention. It should be understood that the above are merely specific embodiments of the present invention and are not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

[0081] It should be noted that the structures, proportions, sizes, etc., illustrated in the accompanying drawings are all schematic diagrams, intended only to complement the content disclosed in the specification and to facilitate understanding and reading by those skilled in the art. They are not intended to limit the conditions under which the invention can be implemented and therefore have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to the size, without affecting the effects and objectives achieved by the invention, should still fall within the scope of the technical content disclosed in the invention. Furthermore, the terms such as "upper," "lower," "left," "right," and "middle" used in this specification are merely for clarity of description and are not intended to limit the scope of the invention. Changes or adjustments to their relative relationships, without substantially altering the technical content, should also be considered within the scope of the invention's implementation.

Claims

1. A wide-voltage input multi-output adaptive power supply board, comprising a power supply main board (1), characterized in that, The power supply motherboard (1) includes, from top to bottom: a first printed circuit board layer (12), an intermediate board layer (11), and a second printed circuit board layer (13). A wide voltage input circuit module is arranged on the first printed circuit board layer (12), and a multi-output circuit module is arranged on the second printed circuit board layer (13). The multi-output circuit module is electrically connected to the wide voltage input circuit module. Heat dissipation plates (2) that are in contact with the wide voltage input circuit module and the multi-output circuit module are respectively provided inside the first printed circuit board layer (12) and the second printed circuit board layer (13). Heat dissipation unit is also provided inside the intermediate board layer (11). The heat dissipation unit includes a plurality of heat dissipation substrates (31) arranged at intervals, and the plurality of heat dissipation substrates (31) are connected to the heat dissipation plate (2) through heat conduction pillars (32). A heat dissipation cavity (311) is provided inside each of the heat dissipation substrates (31). The heat dissipation cavity (311) is filled with a phase change material layer (312). Several thermal expansion members (313) are embedded inside the phase change material layer (312). The exterior of the thermal expansion member (313) is connected to the heat conduction column (32). Several protruding inserts (3131) are also provided on the exterior of the thermal expansion member (313).

2. The wide voltage input multi-output adaptive power supply board according to claim 1, characterized in that, The top and bottom of the heat dissipation cavity (311) are respectively provided with an array of irregular micro-grooves.

3. The wide voltage input multi-output adaptive power supply board according to claim 1, characterized in that, The thermal expansion member (313) is made of shape memory alloy material, which expands in volume when heated. The thermal expansion member (313) is a hollow tubular structure. One end of the heat-conducting column (32) penetrates into the heat dissipation cavity (311) and is inserted into the thermal expansion member (313). A plurality of protruding inserts (3131) are distributed circumferentially along the outer tube wall of the thermal expansion member (313).

4. A wide voltage input multi-output adaptive power supply board according to claim 3, characterized in that, The end of the protruding insert (3131) is provided with an inclined cut surface, which faces the expansion direction of the thermal expansion member (313).

5. A wide voltage input multi-output adaptive power supply board according to claim 1, characterized in that, A cooling channel (33) is provided between any two adjacent heat dissipation substrates (31), and the cooling channel (33) is arranged along the length of the intermediate plate layer, and both ends of the channel penetrate the intermediate plate layer.

6. A wide voltage input multi-output adaptive power supply board according to claim 5, characterized in that, The heat dissipation substrate (31) is provided with a plurality of heat dissipation fins (34) that penetrate into the cooling channel (33) on the side near the cooling channel (33), and the heat dissipation fins (34) located on both sides of the cooling channel (33) are arranged alternately.

7. A wide voltage input multi-output adaptive power supply board according to claim 6, characterized in that, The heat dissipation fins (34) and the heat dissipation substrate (31) are slidably connected by a telescopic movable member. The telescopic movable member includes a sliding groove (351) formed on the side of the heat dissipation substrate (31) and communicating with the heat dissipation cavity (311). A flexible sheet (352) is also provided inside the heat dissipation cavity (311) at the position corresponding to the sliding groove (351). The flexible sheet (352) is connected to the heat dissipation cavity (311) around its perimeter and is used to cover the sliding groove (351). The flexible sheet (352) is arc-shaped and protrudes inside the heat dissipation cavity (311). One end of the heat dissipation fins (34) passes through the sliding groove (351) and is connected to the flexible sheet (352).

8. A wide voltage input multi-output adaptive power supply board according to claim 7, characterized in that, It also includes an encapsulation shell (4) sleeved on the outside of the power supply motherboard (1). The inside of the encapsulation shell (4) is installed with the power supply motherboard (1) through an elastic positioning member. The elastic positioning member includes positioning posts (41) located at the four sides of the inside of the encapsulation shell (4), a fixing pad (42) fixedly sleeved on the outside of the positioning posts (41), and a clamping pad (43) threaded on the outside of the positioning posts (41) and located above the fixing pad (42). The middle plate of the power supply motherboard (1) has an arc-shaped notch at the position corresponding to the positioning posts (41) that matches the outer surface of the positioning posts (41). A connecting clip (44) is provided in the arc-shaped notch. When the connecting clip (44) is placed on the fixing pad (42), the clamping pad (43) is rotated so that the clamping pad (43) rotates and slides down on the positioning posts (41) and abuts against the fixing pad (42) to clamp the connecting clip (44).

9. A wide voltage input multi-output adaptive power supply board according to claim 8, characterized in that, At both ends of the encapsulation shell (4) along the length direction, there are air inlets (51) corresponding to the cooling channel (33). The side of the air inlet (51) near the cooling channel (33) is provided with an inwardly protruding guide shroud (52). The air inlet (51) is connected to the cooling channel (33) through the guide shroud (52). The inside of the air inlet (51) is also provided with a dust filter (53). A convection fan (55) is installed on the inner side of one of the dust filters (53). The convection fan (55) is connected to the air inlet (51) through a sliding mechanism (54). The sliding mechanism (54) drives the convection fan (55) to move laterally back and forth in the air inlet (51).

10. A wide voltage input multi-output adaptive power supply board according to claim 9, characterized in that, The sliding mechanism (54) includes a linear guide rail (541) arranged along the length of the air inlet (51), a moving platform (543) slidably mounted on the linear guide rail (541) for carrying the convection fan (55), a driving device (542) for driving the moving platform (543) to reciprocate on the linear guide rail (541) at one end along the length of the linear guide rail (541), a connecting rod (544) is provided at one end of the moving platform (543) corresponding to the dust filter (53), and a cleaning component (545) for cleaning the dust filter (53) is connected to the end of the connecting rod (544).

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