PCB automatic film pasting device and film pasting control method thereof

Abstract

The application relates to the technical field of PCB (Printed Circuit Board) film pasting control, in particular to a kind of automatic film pasting device of PCB and its film pasting control method, the method comprises the following steps: obtaining the temperature of PCB surface film pasting and the temperature and humidity of film pasting environment in the film pasting process; analyzing the singular value characteristics of PCB surface film pasting temperature to obtain singular distribution characteristic value, and then obtaining the cooperative interference influence degree of each collection time; obtaining the response adjustment strength through the change trend of cooperative interference influence degree, combining the abnormal situation of PCB surface film pasting temperature at each position, and the heating temperature of the heater in the hot-press film pasting machine, obtaining the response heating temperature of the heater in the hot-press film pasting machine at each collection time, and combining the PID controller to regulate the heating temperature of the heater in the hot-press film pasting machine. The application can improve the film pasting quality of PCB surface.

Description

An automated PCB board film application device and its film application control method Technical Field

[0001] This application relates to the field of PCB circuit board film application control technology, specifically to an automated PCB circuit board film application device and its film application control method. Background Technology

[0002] With the continuous advancement of electronic information technology, the requirements for PCB circuit board processing precision are constantly increasing. During the PCB manufacturing process, a protective dry film is typically applied to the surface of the PCB to effectively protect it from dust, moisture corrosion, and other environmental factors. Simultaneously, temperature is a key parameter in the film application process. Accurate control and adjustment of the heating temperature within the film application device are necessary to avoid adverse effects from excessively high or low temperatures, thus ensuring the PCB's performance and extending its lifespan.

[0003] In the process of applying film to PCB circuit boards, most existing film application devices adjust the heating temperature of the heater based on the temperature differences on the PCB surface to ensure uniform film application temperature and prevent defects caused by excessively high local temperatures. However, the film application process is significantly affected by ambient temperature and humidity, and existing technologies cannot fully account for these factors to accurately control the heater temperature. This results in an inability to meet the actual temperature requirements during film application and effectively solve the problem of film application defects on the PCB surface. Summary of the Invention

[0004] To address the aforementioned technical problems, the purpose of this application is to provide an automated PCB board film application device and its film application control method. The specific technical solution adopted is as follows:

[0005] This application provides an automated film application control method for PCB circuit boards, including the following steps:

[0006] The film application temperature at various locations on the PCB circuit board surface and the temperature and humidity of the film application environment were obtained during the film application process.

[0007] The singular values ​​of the film temperature on the PCB circuit board surface at each acquisition time are obtained by using SVD singular value decomposition. The singular distribution characteristic values ​​at each acquisition time are obtained by the degree of difference between the singular values ​​and the average level of the singular value distribution.

[0008] The correlation between all singular distribution characteristic values ​​and ambient temperature and humidity within a preset time period before each collection time is analyzed, and the cooperative interference influence degree at each collection time is obtained by combining the average level of all singular distribution characteristic values ​​within the preset time period.

[0009] By observing the changing trends of all collaborative interference influence within a preset time period before each acquisition time, the response adjustment intensity during the film application process is obtained. Combined with the abnormal conditions of film application temperature at various locations on the PCB circuit board surface and the heating temperature of the heater inside the hot press film application machine at the previous acquisition time, the response heating temperature of the heater inside the hot press film application machine at each acquisition time is obtained.

[0010] The heating temperature of the heater inside the hot press laminating machine is adjusted by using a PID controller based on the deviation between the response heating temperature and the actual heating temperature.

[0011] Preferably, the method for calculating the singular distribution characteristic values ​​at each acquisition time is as follows:

[0012] ;

[0013] In the formula, Let be the singular distribution characteristic value at the t-th acquisition time during the film application process. Let be the mean of the singularity change vector at the t-th acquisition time. Let be the number of elements in the singularity change vector at the t-th acquisition time. and The j-th and j-th singularity change vectors at the t-th acquisition time are respectively... Each element.

[0014] Preferably, the determination of the gloss disturbance index includes:

[0015] The film temperature at each location on the PCB circuit board surface at each acquisition time forms the film temperature matrix at each acquisition time. Singular value decomposition is then performed on the film temperature matrix, and all the singular values ​​of the film temperature matrix at each acquisition time are arranged in ascending order to form the singularity change vector at each acquisition time.

[0016] Preferably, the method for calculating the cooperative interference impact at each acquisition time is as follows:

[0017] ;

[0018] In the formula, Let $t$ be the degree of cooperative interference at the $t$-th data acquisition time during the film application process. Let be the mean of the elements in the singular distribution eigenvector at the t-th acquisition time. and These represent the first correlation degree and the second correlation degree at the t-th data collection time. To avoid constants with a denominator of 0.

[0019] Preferably, the singular distribution feature values, ambient temperature and humidity within a preset time period before each collection time are arranged in chronological order to form the singular distribution feature vector, ambient temperature vector and ambient humidity vector for each collection time. The correlation between the singular distribution feature vector and the ambient temperature vector and ambient humidity vector are calculated and used as the first correlation and second correlation for each collection time.

[0020] Preferably, the method for calculating the response adjustment force during the film application process is as follows:

[0021] ;

[0022] In the formula, The response adjustment level at the current acquisition moment. It is an exponential function with the natural constant as its base. This represents the ratio of the number of positive elements in the first-order difference vector of the cooperative interference vector at the current acquisition time to the total number of elements. It is the mean of all positive elements in the first-order difference vector.

[0023] Preferably, the method for obtaining the cooperative interference vector further includes arranging all cooperative interference influence degrees within a preset time period before the current acquisition time in chronological order to form the cooperative interference vector at the current acquisition time.

[0024] Preferably, the method for calculating the response heating temperature of the heater inside the hot press laminating machine at each sampling time is as follows:

[0025] ;

[0026] In the formula, This represents the response heating temperature of the heater inside the hot press laminator at the current data acquisition moment. This represents the heating temperature of the heater inside the hot press laminator at the previous data acquisition time. The direction determination function is obtained by assessing the degree of temperature anomaly in the surface film temperature of the PCB circuit board. The value of the direction determination function is 1 when... The value of the direction determination function is -1. This is the temperature regulation threshold.

[0027] Preferably, the method for obtaining the direction determination function is as follows: In the formula, m is the mean of all abnormal temperature data in the film temperature of the PCB circuit board surface, and n is the mean of the film temperature at all positions on the PCB circuit board surface. Abnormal temperature data in the film temperature at all positions on the PCB circuit board surface are obtained through an anomaly detection algorithm.

[0028] This application also provides an automated PCB board film application device, including a memory, a processor, and a computer program stored in the memory and running on the processor. When the processor executes the computer program, it implements the steps of any of the above-described automated PCB board film application control methods.

[0029] As can be seen from the above, the PCB circuit board automated film application device and its film application control method provided in this application have at least the following beneficial effects:

[0030] This application analyzes the singularity characteristics of the film-applying temperature on the surface of a PCB circuit board, and based on the singularity changes of the film-applying temperature on the PCB circuit board surface, it more accurately measures the singular distribution characteristics of the film-applying temperature on the PCB circuit board. This is beneficial for subsequent accurate analysis of the synergistic interference effect of temperature and humidity in the film-applying environment on the film-applying temperature, thereby enabling accurate control and adjustment of the heating temperature of the heater inside the hot press film applicator.

[0031] Furthermore, this application utilizes GRA grey relational analysis to fully explore the correlation between singular distribution characteristics and ambient temperature and humidity. Combined with the significance of the singular distribution characteristics of film-applied temperature on the PCB circuit board surface, it accurately analyzes the synergistic interference of temperature and humidity in the film-applied environment on the film-applied temperature on the PCB circuit board. This is beneficial for subsequent more accurate analysis of the severity of the synergistic interference of temperature and humidity in the film-applied environment on the film-applied temperature, thereby more accurately determining the response adjustment level of the heater inside the hot press film applicator.

[0032] This application fully considers the interference of ambient temperature and humidity during the film application process. By understanding the severity of the combined interference of temperature and humidity in the film application environment on the film application temperature of the PCB circuit board, it more accurately determines the response adjustment level of the heater inside the hot press film application machine and achieves more accurate response adjustment of the heating temperature of the heater inside the hot press film application machine. This meets the actual needs of the film application temperature during the film application process and effectively solves the problem of film application quality defects caused by excessively high local temperatures on the surface of the PCB circuit board. Attached Figure Description

[0033] To more clearly illustrate the technical solutions and advantages in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0034] Figure 1 is a flowchart of the steps of an automated film application control method for PCB circuit boards provided in this application. Detailed Implementation

[0035] To further illustrate the technical means and effects adopted by this application to achieve the intended purpose of the invention, the following, in conjunction with the accompanying drawings and preferred embodiments, details the specific implementation, structure, features, and effects of an automated PCB circuit board film application device and its film application control method proposed in this application. In the following description, different "one embodiment" or "another embodiment" do not necessarily refer to the same embodiment. Furthermore, specific features, structures, or characteristics in one or more embodiments can be combined in any suitable form.

[0036] Unless otherwise specified and limited, terms such as “comprising,” “including,” or any other variations thereof are intended to cover a non-exclusive inclusion, such that a circuit structure, article, or device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such an article or device. Without further limitation, an element defined by the phrase “comprising one…” does not exclude the presence of other identical elements in the article or device that includes said element. Furthermore, the term “and / or” as used herein includes any and all combinations of one or more of the associated listed items. All technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0037] The following description, in conjunction with the accompanying drawings, details the specific scheme of the PCB circuit board automated film application device and its film application control method provided in this application.

[0038] Please refer to Figure 1, which shows a flowchart of the steps of an automated film application control method for PCB circuit boards according to an embodiment of this application, including the following steps:

[0039] Step 1: Obtain the film application temperature at various locations on the PCB circuit board surface and the temperature and humidity of the film application environment during the film application process.

[0040] During the manufacturing process of PCB circuit boards, an automated film-applying device applies a protective dry film to the surface of the PCB circuit board to protect it from dust, moisture corrosion, and other environmental factors.

[0041] In this embodiment, the automated PCB board film application device includes a film supply mechanism, a film application mechanism, a PCB conveyor belt, a nitrogen supply box, a dust removal roller, and a fixed base. The film supply mechanism includes a film supply box, a film storage box, a film supply trough, and a positioning trough. The film application mechanism includes a hot press film application machine, a loading chamber, a film application trough, a film application chamber, a unloading chamber, a temperature and humidity sensor, and a PID controller. The hot press film application machine is equipped with an infrared thermal imager and a heater, which can monitor the film application temperature on the PCB board surface in real time.

[0042] During the film application process on the PCB circuit board, an infrared thermal imager inside the hot press film application machine collects the film application temperature at various locations on the PCB circuit board surface. It should be noted that the locations for film application temperature collection on the PCB circuit board surface are selected and set by the implementer. Simultaneously, a temperature and humidity sensor collects the ambient temperature and humidity of the film application environment, obtaining the film application temperature, ambient temperature, and ambient humidity at various locations on the PCB circuit board surface at different collection times during the film application process. In this embodiment, the data acquisition frequency is 10Hz, but the implementer can adaptively set the acquisition frequency according to actual conditions.

[0043] Step 2: Use SVD singular value decomposition to obtain the singular values ​​of the film temperature on the PCB circuit board surface at each acquisition time, and obtain the singular distribution characteristic values ​​at each acquisition time by the degree of difference between the singular values ​​and the average level of the singular value distribution.

[0044] Generally, the process of applying film to PCB circuit boards is affected by the temperature and humidity of the environment. This causes varying degrees of abnormal interference in the film temperature at different locations on the PCB surface. Most existing film application devices adjust the heater temperature based on the temperature differences of the film on the PCB surface, neglecting the influence of ambient temperature and humidity. This leads to inaccurate temperature control of the heater, failing to meet the actual temperature requirements during film application and easily causing defects in the film quality. Therefore, it is necessary to analyze the impact of ambient temperature and humidity on the film application temperature during the application process in order to accurately control and adjust the heating temperature of the heater inside the hot press film application machine.

[0045] Furthermore, to reflect the singularity characteristics of the film temperature on the PCB circuit board surface, in this embodiment, for ease of understanding and description, the film temperature at each location on the PCB circuit board surface at each acquisition time is used to form a film temperature matrix for each acquisition time. For each acquisition time, the film temperature matrix at each acquisition time is input into Singular Value Decomposition (SVD). SVD is used to obtain the singular values ​​of all eigenvectors in the film temperature matrix at each acquisition time. The singular values ​​can reflect the singularity characteristics of the film temperature at different locations on the PCB circuit board surface. The larger the singular value, the greater the influence of the film temperature on the film application environment temperature and humidity at the corresponding location, making the singularity characteristics of the film temperature at that location more significant. SVD is a well-known technique and will not be elaborated further.

[0046] Simultaneously, all singular values ​​in the film-applying temperature matrix at each acquisition time are arranged in ascending order to form a singularity change vector at each acquisition time. The singularity change vector reflects the singularity change of the film-applying temperature on the PCB circuit board surface during the film-applying process. The higher the difference in the singularity change of the film-applying temperature on the PCB circuit board surface, and the more significant the singularity characteristics of the film-applying temperature on the PCB circuit board surface, the more it reflects the singular distribution characteristics of the film-applying temperature on the PCB circuit board under the influence of the film-applying environment temperature and humidity. At this time, it is necessary to accurately control and adjust the heating temperature of the heater inside the hot press film-applying machine to reduce the adverse effects of the film-applying environment temperature and humidity on the film-applying of the PCB circuit board, thereby meeting the actual requirements of the film-applying temperature during the film-applying process.

[0047] Based on the above analysis, the singular distribution characteristic values ​​of the film-applying temperature on the PCB circuit board during the film-applying process are calculated:

[0048] ;

[0049] In the formula, Let be the singular distribution characteristic value at the t-th acquisition time during the film application process. Let be the mean of the singularity change vector at the t-th acquisition time. Let be the number of elements in the singularity change vector at the t-th acquisition time. and The j-th and j-th singularity change vectors at the t-th acquisition time are respectively... Each element.

[0050] The singular distribution eigenvalue reflects the singular distribution characteristics of the film-applying temperature under the influence of ambient temperature and humidity during the film-applying process. The larger the singular distribution eigenvalue, the greater the influence of ambient temperature and humidity on the film-applying temperature on the PCB circuit board, resulting in a more significant singular distribution characteristic of the film-applying temperature on the PCB circuit board. At this time, it is necessary to accurately control and adjust the heating temperature of the heater inside the hot press film-applying machine to reduce the adverse effects of ambient temperature and humidity on the film-applying of the PCB circuit board.

[0051] Step 3: Analyze the correlation between all singular distribution feature values ​​and ambient temperature and humidity within the preset time period before each collection time, and combine the average level of all singular distribution feature values ​​within the preset time period to obtain the cooperative interference influence degree at each collection time.

[0052] Generally, the film application temperature on a PCB is simultaneously affected by ambient temperature and humidity. The stronger the correlation between the anomaly distribution characteristics of the film application temperature on the PCB and the ambient temperature and humidity, and the more significant the anomaly distribution characteristics of the film application temperature on the PCB, the greater the influence of the ambient temperature and humidity on the film application temperature. In this case, it is more necessary to accurately control and adjust the heating temperature of the heater inside the hot press film application machine in a timely manner to avoid affecting the film application quality on the PCB surface.

[0053] Furthermore, the correlation between all singular distribution feature values ​​and ambient temperature and humidity within a preset time period prior to each collection moment is analyzed. In this embodiment, preferably, the preset time period is 1 minute, that is, the singular distribution feature values, ambient temperature, and ambient humidity within one minute prior to each collection moment are arranged in chronological order to form the singular distribution feature vector, ambient temperature vector, and ambient humidity vector for each collection moment, and the correlation degree between the singular distribution feature vector and the ambient temperature vector and ambient humidity vector is calculated. Preferably, in this embodiment, the singular distribution feature vector, ambient temperature vector, and ambient humidity vector are input into GRA grey relational analysis. GRA grey relational analysis is used to obtain the correlation degree between the singular distribution feature vector and the ambient temperature vector and ambient humidity vector, respectively, which are used as the first correlation degree and the second correlation degree for each collection moment. The first correlation degree and the second correlation degree reflect the correlation between the singular distribution feature and ambient temperature and ambient humidity during the film application process, respectively. The specific process of GRA grey relational analysis is a well-known technology and will not be described in detail in this embodiment.

[0054] Based on the above analysis, the cooperative interference effect of ambient temperature and humidity on the film application temperature on the PCB circuit board during the film application process is calculated:

[0055] ;

[0056] In the formula, Let $t$ be the degree of cooperative interference at the $t$-th data acquisition time during the film application process. Let be the mean of the elements in the singular distribution eigenvector at the t-th acquisition time. and These represent the first correlation degree and the second correlation degree at the t-th data collection time. To avoid constants with a denominator of 0, the value range is (0.01, 0.05), and in this embodiment, the value is 0.05.

[0057] The degree of cooperative interference reflects the cooperative interference effect of ambient temperature and humidity on the film application temperature on the PCB circuit board during the film application process. The greater the degree of cooperative interference, the greater the cooperative interference effect of ambient temperature and humidity on the film application temperature on the PCB circuit board, and the easier it is to affect the consistency of the film application temperature on the PCB circuit board surface. It is necessary to accurately control and adjust the heating temperature of the heater in the hot press film application machine to avoid adverse effects on the film application quality on the PCB circuit board surface.

[0058] Step 4: By observing the changing trends of all collaborative interference influences within the preset time period before each acquisition time, the response adjustment intensity during the film application process is obtained. Combined with the abnormal conditions of the film application temperature at various locations on the PCB circuit board surface, and the heating temperature of the heater inside the hot press film application machine at the previous acquisition time, the response heating temperature of the heater inside the hot press film application machine at each acquisition time is obtained.

[0059] Generally, if the combined interference of ambient temperature and humidity on the film application temperature on the PCB circuit board increases in the short period before the current data collection time, the greater the adjustment of the film application temperature on the PCB circuit board is required to fully eliminate the adverse effects of temperature and humidity in the coating environment on the film application, in order to meet the actual temperature requirements of the film application process.

[0060] Therefore, preferably, in this embodiment, for the current acquisition time, all cooperative interference influence degrees within a preset time period prior to the current acquisition time are arranged in chronological order to form the cooperative interference vector for the current acquisition time. Furthermore, the first-order difference vector of the cooperative interference vector is calculated, and the first-order difference vector reflects the trend change characteristics of the cooperative interference influence. In this embodiment, the preset time period is 1 minute.

[0061] Furthermore, the ratio of the number of positive elements in the first-order difference vector to the total number of elements is calculated. And calculate the mean of all positive elements in the first-order difference vector. The ratio Larger and mean The larger the value, the greater the synergistic interference of ambient temperature and humidity on the film-applying temperature on the PCB circuit board. This indicates that the synergistic interference of ambient temperature and humidity in the short period before the current data collection time is more severe, and therefore the greater the adjustment of the heating temperature of the heater inside the hot press film applicator.

[0062] Based on the above analysis, the response adjustment intensity at the current acquisition moment during the film application process is calculated:

[0063] ;

[0064] In the formula, The response adjustment level at the current acquisition moment. It is an exponential function with the natural constant as the base.

[0065] The response adjustment strength ranges from (0,1). The closer the response adjustment strength is to 1, the greater the adjustment of the heating temperature of the heater inside the hot press laminating machine. Conversely, the closer the response adjustment strength is to 0, the smaller the adjustment of the heating temperature of the heater inside the hot press laminating machine.

[0066] To accurately determine the direction of temperature adjustment for the heater inside the hot press laminator, and thus more accurately control and adjust its temperature, this embodiment inputs the lamination temperature at all locations on the PCB board surface at the current acquisition time into an anomaly detection algorithm. The anomaly detection algorithm can be either the LOF anomaly detection algorithm or the HBOS anomaly detection algorithm. This embodiment uses the LOF anomaly detection algorithm to detect anomalies in the lamination temperature at all locations on the PCB board surface, obtaining all abnormal temperature data related to the lamination temperature on the PCB board surface. The LOF anomaly detection algorithm is a well-known technology and will not be elaborated further.

[0067] Furthermore, calculate the mean value m of all abnormal temperature data in the film application temperature data on the PCB circuit board surface, and calculate the mean value n of the film application temperature at all locations on the PCB circuit board surface. If m > n, it indicates that the film application temperature on the PCB circuit board is locally overheated, and the film application temperature on the PCB circuit board should be reduced. Conversely, if m < n, it indicates that the film application temperature on the PCB circuit board is not locally overheated, and in order to improve the adhesion of the film when applying it to the PCB circuit board, the film application temperature on the PCB circuit board should be increased.

[0068] The heating temperature of the heater inside the hot press laminator is monitored in real time by a temperature sensor, and the response heating temperature of the heater inside the hot press laminator at the current acquisition time is calculated:

[0069] ;

[0070] in, ;

[0071] In the formula, This represents the response heating temperature of the heater inside the hot press laminator at the current data acquisition moment. This represents the heating temperature of the heater inside the hot press laminator at the previous data acquisition time. Let m be the mean of all abnormal temperature data in the film-coated temperature data on the PCB circuit board surface, and n be the mean of the film-coated temperature at all locations on the PCB circuit board surface. When... The value of the direction determination function is 1 when... The value of the direction determination function is -1. To prevent the heating temperature from being set too high and affecting the stability of the film application temperature, the temperature adjustment threshold in this embodiment is set to 10.

[0072] Based on the direction judgment function and the magnitude of the response adjustment force, the direction and force of adjusting the heating temperature of the heater inside the hot press laminating machine are determined respectively, so as to more accurately adjust the heating temperature of the heater inside the hot press laminating machine and obtain the response heating temperature. This response heating temperature can meet the actual temperature requirements of the laminating process and can effectively solve the problem of laminating quality defects.

[0073] Step 5: Use a PID controller to adjust the heating temperature of the heater inside the hot press laminating machine based on the deviation between the response heating temperature and the actual heating temperature.

[0074] To control and regulate the heating temperature of the heater inside the hot press laminating machine, the response heating temperature and the actual heating temperature at the current acquisition moment are transmitted to a PID controller. The PID controller calculates the temperature error between the response heating temperature and the actual heating temperature and adjusts the heater's heating temperature accordingly. The PID controller outputs a control signal for the heating temperature, which is transmitted and applied to the heater inside the hot press laminating machine. This controls the actual heating temperature of the heater to approach the controlled response heating temperature, thereby achieving more accurate control and regulation of the heater's heating temperature. It should be noted that the specific process of temperature control by the PID controller is prior art known to those skilled in the art and will not be elaborated upon in this embodiment. Furthermore, implementers can use other existing control methods combined with the deviation between the response heating temperature and the actual heating temperature to regulate the heating temperature of the heater inside the hot press laminating machine.

[0075] Based on the same inventive concept as the above method, this application embodiment also provides an automated PCB circuit board film application device, including a memory, a processor, and a computer program stored in the memory and running on the processor. When the processor executes the computer program, it implements the steps in any of the above-described automated PCB circuit board film application control methods.

[0076] In addition, in this embodiment, the automated PCB circuit board film application device also includes a film supply mechanism, a film application mechanism, a circuit board conveyor belt, a nitrogen supply box, a dust removal roller, and a fixed base; the film supply mechanism includes a film supply box, a film supply storage box, a film supply trough, and a positioning trough; the film application mechanism includes a hot press film application machine, a loading chamber, a film application trough, a film application chamber, a loading chamber, a temperature and humidity sensor, and a PID controller. The hot press film application machine is equipped with an infrared thermal imager and a heater, and the film application temperature on the surface of the PCB circuit board can be monitored in real time through the infrared thermal imager.

[0077] It is understood that the order of the embodiments described above is merely for descriptive purposes and does not represent the superiority or inferiority of the embodiments. Furthermore, the above description focuses on specific embodiments of this specification. Additionally, the processes depicted in the accompanying drawings do not necessarily require a specific or sequential order to achieve the desired results. In some implementations, multitasking and parallel processing are possible or may be advantageous.

[0078] The various embodiments in this specification are described in a progressive manner. The same or similar parts between the various embodiments can be referred to each other. Each embodiment focuses on describing the differences from other embodiments.

[0079] The above description is merely an embodiment of this application and is not intended to limit the scope of this application. Any equivalent structural or procedural transformations made based on the description and drawings of this application, or direct or indirect applications in other related technical fields, are similarly included within the protection scope of this application.

Claims

1. An automated film application control method for PCB circuit boards, characterized in that, Includes the following steps: The following steps are taken: First, the film-applying temperature at various locations on the PCB board surface and the temperature and humidity of the film-applying environment are acquired during the film-applying process. Then, singular values ​​of the film-applying temperature on the PCB board surface at each acquisition time are obtained using SVD (Singular Value Decomposition). The singular distribution characteristic values ​​at each acquisition time are obtained by analyzing the degree of difference between singular values ​​and the average level of the singular value distribution. The correlation between all singular distribution characteristic values ​​and the ambient temperature and humidity within a preset time period before each acquisition time is analyzed. Combined with the average level of all singular distribution characteristic values ​​within the preset time period, the degree of cooperative interference at each acquisition time is obtained. The change trend of all cooperative interference influences within the preset time period before each acquisition time is used to obtain the response adjustment strength during the film-applying process. Combined with the abnormal conditions of the film-applying temperature at various locations on the PCB board surface and the heating temperature of the heater inside the hot press film applicator at the previous acquisition time, the response heating temperature of the heater inside the hot press film applicator at each acquisition time is obtained. Finally, a PID controller is used to adjust the heating temperature of the heater inside the hot press film applicator based on the deviation between the response heating temperature and the actual heating temperature. The calculation method for the response heating temperature of the heater inside the hot press film applicator at each acquisition time is as follows: In the formula, This represents the response heating temperature of the heater inside the hot press laminator at the current data acquisition moment. This represents the heating temperature of the heater inside the hot press laminator at the previous data acquisition time. The direction determination function is obtained by assessing the degree of temperature anomaly in the surface film temperature of the PCB circuit board. The value of the direction determination function is 1 when... The value of the direction determination function is -1. The temperature adjustment threshold is used; the method for obtaining the direction determination function is as follows: In the formula, m is the mean of all abnormal temperature data in the film temperature of the PCB circuit board surface, and n is the mean of the film temperature at all positions on the PCB circuit board surface. Abnormal temperature data in the film temperature at all positions on the PCB circuit board surface are obtained through an anomaly detection algorithm.

2. The PCB circuit board automated film application control method as described in claim 1, characterized in that, The method for calculating the singular distribution characteristic values ​​at each acquisition time is as follows: In the formula, Let be the singular distribution characteristic value at the t-th acquisition time during the film application process. Let be the mean of the singularity change vector at the t-th acquisition time. Let be the number of elements in the singularity change vector at the t-th acquisition time. and These are the j-th and (j-1)-th elements in the singularity change vector at the t-th acquisition time, respectively.

3. The PCB circuit board automated film application control method as described in claim 2, characterized in that, The determination of the singularity change vector includes: the film temperature at each position on the PCB circuit board surface at each acquisition time is used to form the film temperature matrix at each acquisition time, and singular value decomposition is performed on the film temperature matrix. All singular values ​​of the film temperature matrix at each acquisition time are arranged in ascending order to form the singularity change vector at each acquisition time.

4. The PCB circuit board automated film application control method as described in claim 1, characterized in that, The method for calculating the cooperative interference impact at each acquisition time is as follows: In the formula, Let $t$ be the degree of cooperative interference at the $t$-th data acquisition time during the film application process. Let be the mean of the elements in the singular distribution eigenvector at the t-th acquisition time. and These represent the first correlation degree and the second correlation degree at the t-th data collection time. To avoid constants with a denominator of 0.

5. The PCB circuit board automated film application control method as described in claim 4, characterized in that, The singular distribution feature values, ambient temperature, and humidity within a preset time period prior to each acquisition time are arranged chronologically to form the singular distribution feature vector, ambient temperature vector, and ambient humidity vector for each acquisition time. The correlation between the singular distribution feature vector and the ambient temperature vector and ambient humidity vector are calculated and used as the first correlation and second correlation for each acquisition time.

6. The PCB circuit board automated film application control method as described in claim 1, characterized in that, The calculation method for the response adjustment force during the film application process is as follows: In the formula, The response adjustment level at the current acquisition moment. It is an exponential function with the natural constant as its base. This represents the ratio of the number of positive elements in the first-order difference vector of the cooperative interference vector at the current acquisition time to the total number of elements. It is the mean of all positive elements in the first-order difference vector.

7. The PCB circuit board automated film application control method as described in claim 6, characterized in that, The method for obtaining the cooperative interference vector further includes arranging all cooperative interference influence degrees within a preset time period before the current acquisition time in chronological order to form the cooperative interference vector at the current acquisition time.

8. An automated PCB board film application device, comprising a memory, a processor, and a computer program stored in the memory and running on the processor, characterized in that, When the processor executes the computer program, it implements the steps of the PCB circuit board automated film application control method as described in any one of claims 1-7.

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