Loading and unloading device of a polishing apparatus and polishing apparatus

Abstract

The application discloses a feeding and discharging device of a polishing equipment and the polishing equipment. The feeding and discharging device of the polishing equipment comprises a polishing head, a bottom plate, a lifting driving element selectively driving the bottom plate to lift, a bearing plate arranged between the bottom plate and the polishing head and connected with the bottom plate, and a plurality of wafer detection sensors arranged on the upper side of the bearing plate and circumferentially spaced on the edge of the bearing plate. Thus, the wafer can be quickly and directly fed and discharged by the synchronous lifting of the bottom plate and the bearing plate to be close to or away from the polishing head. The wafer guiding column and the wafer detection sensor are integrated on the bearing plate, so that the feeding and discharging speed of the wafer can be further improved, the wafer transmission time can be effectively shortened, and the process yield can be improved. In addition, the wall thickness of the bearing ring is set to be smaller within a reasonable range, so that the contact area of the bearing plate and the wafer can be reduced, and the indentation of the polishing liquid on the wafer surface can be reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor, in particular to a loading and unloading device of a polishing equipment and the polishing equipment. BACKGROUND

[0002] In the chemical mechanical polishing (CMP) process, the wafer loading and unloading unit can directly affect the wafer transmission time and the polishing time, and even the wafer surface quality. Therefore, the wafer loading and unloading unit is very important.

[0003] In the prior art, the wafer loading and unloading unit takes a long time to complete the wafer loading and unloading action, thereby affecting the overall process time and further adversely affecting the polishing quality of the wafer. Further, when the wafer is transferred to the wafer loading and unloading unit, the contact area between the wafer loading and unloading unit and the wafer is relatively large, which can cause defects such as indentation and surface scratch of the wafer surface. SUMMARY

[0004] The present application aims to at least solve one of the problems in the prior art. To this end, one object of the present application is to provide a loading and unloading device of a polishing equipment, which can not only improve the loading and unloading time, but also reduce the indentation and scratch on the wafer surface.

[0005] The present application further provides a polishing equipment.

[0006] The loading and unloading device of the polishing equipment according to the present application comprises: a polishing head; a bottom plate arranged below the polishing head and provided with a lifting drive member on the lower side, the lifting drive member selectively driving the bottom plate to lift and lower; a bearing plate arranged between the bottom plate and the polishing head and connected with the bottom plate, the bearing plate being movable up and down relative to the bottom plate and provided with an elastic buffer member between the bearing plate and the bottom plate; the bearing plate comprising a bearing main plate and a wafer bearing ring, the bearing main plate being arranged opposite to the polishing head and provided with a through hole in the middle, the wafer bearing ring being arranged around the circumferential edge of the through hole and at least partially protruding upward relative to the bearing main plate, the wafer bearing ring being adapted to place a wafer thereon, the radial wall thickness of the wafer bearing ring being set as D, D satisfying the relationship: 2.9mm < D < 3.1mm; the upper side of the bearing main plate being provided with a plurality of wafer guide columns and a plurality of wafer detection sensors, the plurality of wafer guide columns being arranged adjacent to the wafer bearing ring and circumferentially spaced apart outside the edge of the wafer bearing ring, the plurality of wafer guide columns being adapted to guide and cooperate with the circumferential edge of the wafer, and the plurality of wafer detection sensors being circumferentially spaced apart on the edge of the bearing main plate.

[0007] Thus, by synchronous lifting of the bottom plate and the bearing plate, the wafer can be quickly and directly loaded and unloaded by approaching or moving away from the polishing head. The wafer guiding column and the wafer detection sensor are integrated on the bearing main plate, which can further improve the speed of wafer loading and unloading, effectively shorten the wafer transmission time, improve the process yield, and further, the elastic buffer can elastically buffer the polishing head when the bearing plate and the polishing head abut, improving the stability of loading and unloading. In addition, when the wafer is placed on the bearing plate, the bearing ring contacts the bearing wafer, and the wall thickness of the bearing ring is set to be smaller within a reasonable range, which can reduce the contact area of the bearing plate and the wafer, thereby reducing the indentation of the polishing liquid on the wafer surface.

[0008] In some examples of the present application, the elastic buffer is a plurality of elastic buffers, and the plurality of elastic buffers are circumferentially spaced between the bottom plate and the bearing plate.

[0009] In some examples of the present application, the loading and unloading device of the polishing equipment further comprises a bellows protective cover connected between the bottom plate and the bearing plate, and the bellows protective cover is adapted to protect the corresponding components inside.

[0010] In some examples of the present application, the loading and unloading device of the polishing equipment further comprises a wafer cleaning member, which is arranged below the bearing plate and is spaced between the bearing plate and the bottom plate, and the wafer cleaning member is provided with a liquid outlet nozzle corresponding to the through hole.

[0011] In some examples of the present application, the loading and unloading device of the polishing equipment further comprises a polishing head cleaning member, the wafer bearing ring is at least partially provided with a avoiding opening, the polishing head cleaning member is arranged in the avoiding opening, the polishing head comprises a gas film and a retaining ring, the retaining ring is arranged on the outer side of the gas film, the gap between the gas film and the polishing head body in the radial direction corresponds to the polishing head cleaning member, and the gap between the gas film and the polishing head body in the radial direction corresponds to the polishing head cleaning member.

[0012] In some examples of the present application, the upper side of the bearing body is further provided with a plurality of polishing head guiding columns, and the plurality of polishing head guiding columns are circumferentially spaced, and the polishing head guiding columns are more radially away from the through hole than the wafer guiding column, and the plurality of polishing head guiding columns are guided and matched with the circumferential edge of the polishing head.

[0013] In some examples of the present application, the upper side of the bearing main plate is further provided with a buffer limiting column, which is radially spaced between the wafer guiding column and the polishing head guiding column and selectively buffers and limits the polishing head.

[0014] In some examples of the present application, the lower side of the bottom plate is provided with a first guide rod extending in the up-down direction, the first guide rod guiding the bottom plate, and a second guide rod extending in the up-down direction is arranged between the bottom plate and the carrier plate, the carrier plate guiding the second guide rod.

[0015] In some examples of the present application, a water baffle is arranged around the edge of the carrier main plate in the circumferential direction, the water baffle being arranged upwardly protruding relative to the carrier plate.

[0016] The polishing apparatus according to the present application comprises the feeding and discharging device of the polishing apparatus as described above.

[0017] Additional aspects and advantages of the present application will be in part apparent and in part pointed out hereinafter. BRIEF DESCRIPTION OF DRAWINGS

[0018] The above and / or additional aspects and advantages of the present application will become apparent and be readily understood from the following description, taken in conjunction with the accompanying drawings, in which:

[0019] Figure 1 is a schematic view of a feeding and discharging device of a polishing apparatus according to an embodiment of the present application;

[0020] Figure 2 is a partial schematic view of a feeding and discharging device of a polishing apparatus according to an embodiment of the present application;

[0021] Figure 3 is a sectional view of a polishing head according to an embodiment of the present application.

[0022] REFERENCE NUMERALS:

[0023] 100, feeding and discharging device;

[0024] 10, bottom plate; 11, lifting driving member; 12, drainage hole;

[0025] 20, carrier plate; 21, tee joint; 22, carrier main plate; 221, through hole; 222, water baffle; 23, wafer carrier ring; 231, avoiding opening; 24, wafer guide column; 25, wafer detection sensor; 26, polishing head guide column; 27, buffer limiting column; 28, first guide rod; 29, second guide rod;

[0026] 30, elastic buffer member;

[0027] 40, bellows protective cover;

[0028] 50, wafer cleaning member; 51, liquid outlet nozzle; 52, polishing head cleaning member;

[0029] 60, polishing head; 61, air film; 62, retaining ring. DETAILED DESCRIPTION

[0030] Embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0031] The following detailed description of the application is made with reference to the accompanying drawings. Figures 1-3 The feeding and discharging device 100 of the polishing apparatus according to the embodiments of the present application is described below.

[0032] In combination Figures 1-3 As shown in the drawings, the feeding and discharging device 100 of the polishing apparatus according to the present application can mainly include a polishing head 60, a base plate 10 and a carrier plate 20, wherein the base plate 10 is arranged below the polishing head 60 and has a lifting drive 11 arranged on the lower side, the lifting drive 11 selectively drives the base plate 10 to lift, the carrier plate 20 is arranged between the base plate 10 and the polishing head 60 and is connected with the base plate 10, the carrier plate 20 is movable up and down relative to the base plate 10 and is provided with an elastic buffer 21 between the base plate 10, the carrier plate 20 includes a carrier main plate 22 and a wafer carrier ring 23, the carrier main plate 22 is arranged opposite to the polishing head 60 and has a through hole 221 arranged in the middle, the wafer carrier ring 23 is arranged around the circumferential edge of the through hole 221 and is at least partially protruding upward relative to the carrier main plate 22, the wafer carrier ring 23 is adapted to place a wafer thereon, the radial wall thickness of the wafer carrier ring 23 is set as D, D satisfies the relationship: 2.9mm < D < 3.1mm, the upper side of the carrier main plate 22 is provided with a plurality of wafer guide columns 24 and a plurality of wafer detection sensors 25, the plurality of wafer guide columns 24 are arranged adjacent to the wafer carrier ring 23 and are circumferentially spaced apart outside the edge of the wafer carrier ring 23, the plurality of wafer guide columns 24 are adapted to guide and cooperate with the circumferential edge of the wafer, and the plurality of wafer detection sensors 25 are circumferentially spaced apart on the edge of the carrier main plate 22.

[0033] Specifically, the base plate 10 is arranged below the polishing head 60 and has a lifting drive 11 arranged on the lower side, the lifting drive 11 selectively drives the base plate 10 to lift, the carrier plate 20 is arranged between the base plate 10 and the polishing head 60 and is connected with the base plate 10, when the lifting drive 11 drives the base plate 10 to lift, the base plate 10 will drive the carrier plate 20 to lift together, so that the carrier plate 20 is close to or away from the polishing head 60 in the up-down direction, thereby realizing the feeding and discharging of the wafer on the polishing head 60, for example, when the feeding and discharging device 100 of the polishing apparatus feeds, the lifting drive 11 can drive the base plate 10 and the carrier plate 20 to move upward, close to the polishing head 60, the polishing head 60 presses the carrier plate 20, and the polishing head 60 can adsorb the wafer on the carrier plate 20 for polishing, after the polishing head 60 adsorbs the wafer on the carrier plate 20, the lifting drive 11 can drive the base plate 10 and the carrier plate 20 to reset.

[0034] When the feeding and discharging device 100 of the polishing equipment discharges, the lifting driver 11 can first drive the bottom plate 10 and the bearing plate 20 to move upwards, close to the polishing head 60, the polishing head 60 presses the bearing plate 20 downwards, and after the polishing head 60 places the wafer on the bearing plate 20, the lifting driver 11 drives the bottom plate 10 and the bearing plate 20 to move downwards, thereby achieving the discharging.

[0035] In this way, the feeding and discharging of the wafer can be quickly and directly realized through the synchronous lifting of the bottom plate 10 and the bearing plate 20, the feeding and discharging speed of the wafer can be further improved, the wafer transmission time can be effectively shortened, and the process yield can be improved.

[0036] Further, by arranging the elastic buffer 21 between the bearing plate 20 and the bottom plate 10, when the polishing head 60 and the bearing plate 20 abut and the polishing head 60 presses the bearing plate 20 downwards, the elastic buffer 21 can buffer the polishing head 60.

[0037] In some embodiments of the present application, the wafer bearing ring 23 is adapted to place the wafer, and by setting the radial wall thickness D of the wafer bearing ring 23 to be between 2.9mm and 3.1mm, the radial wall thickness D of the wafer bearing ring 23 can be small, the contact area of the wafer and the wafer bearing ring 23 can be reduced, thereby effectively reducing the indentation of the polishing liquid on the wafer surface, improving the yield of the wafer, and further improving the structural reliability of the feeding and discharging device 100 of the polishing equipment.

[0038] In combination Figure 2 As shown, by arranging the plurality of wafer guide columns 24 adjacent to the wafer bearing ring 23 and circumferentially spaced outside the edge of the wafer bearing ring 23, when the polishing head 60 places the wafer on the bearing plate 20, the plurality of wafer guide columns 24 guide the wafer, thereby improving the accuracy and reliability of the wafer placed on the wafer bearing ring 23.

[0039] Further, by circumferentially spacing the plurality of wafer detection sensors 25 on the edge of the bearing main plate 22, the wafer detection sensor 25 can detect whether there is a wafer on the wafer bearing ring 23, which can prevent the wafer from being missing during the wafer feeding and discharging process, thereby ensuring the reliability of the wafer feeding and discharging.

[0040] In addition, the plurality of wafer detection sensors 25 are integrated on the bearing main plate 22, which can not only improve the accuracy of the detection of the presence or absence of the wafer, but also does not need to increase other operation steps and equipment, thereby further simplifying the stability and reliability of the feeding and discharging device 100 of the polishing equipment.

[0041] In some embodiments of the present application, the wafer detection sensor is a mechanical sensor.

[0042] In combinationFigure 1 and Figure 2 As shown in

[0043] Specifically, by setting the elastic buffer 21 as multiple, and circumferentially spacing the multiple elastic buffers 21 between the bottom plate 10 and the carrier plate 20, not only the uniformity of the buffer to the polishing head 60 can be improved, but also the buffer effect to the polishing head 60 can be improved.

[0044] In combination with Figure 1 and Figure 2 As shown in

[0045] Specifically, by connecting the bellows protective cover 40 between the bottom plate 10 and the carrier plate 20, there are some structures between the bottom plate 10 and the carrier plate 20 that cannot be subjected to anti-rust or other protective treatment, and these structures can be between the bellows protective cover 40. The bellows protective cover 40 has a certain elasticity, which not only does not affect the up and down movement of the carrier plate 20 relative to the bottom plate 10 under the premise of ensuring the stable connection of the bottom plate 10 and the carrier plate 20, but also protects the structures between the bottom plate 10 and the carrier plate 20, which can further improve the structural reliability of the polishing equipment.

[0046] In combination with Figure 2 As shown in

[0047] Specifically, by setting the wafer cleaning piece 50 below the carrier plate 20 and between the carrier plate 20 and the bottom plate 10, and by setting the liquid outlet nozzle 51 on the wafer cleaning piece 50, the liquid outlet nozzle 51 can correspond to the through hole 221, so that the wafer cleaning piece 50 cleans the lower surface of the wafer through the liquid outlet nozzle 51.

[0048] In combination with Figure 2 As shown in

[0049] Specifically, by arranging the polishing head cleaning piece 52 at the avoiding opening 231 arranged on the wafer bearing ring 23, when the polishing head 60 presses the bearing plate 20, the polishing head cleaning piece 52 can correspond to the gap between the air film 61 and the retaining ring 62 on the polishing head 60, and clean the gap between the air film 61 and the retaining ring 62 on the polishing head 60, so as to prevent the gap between the air film 61 and the retaining ring 62 on the polishing head 60 from remaining polishing liquid, and further reduce the indentation on the wafer, so as to further improve the reliability of the wafer, and further improve the yield of the wafer.

[0050] In combination Figure 2 As shown, the upper side of the bearing body is further provided with a plurality of polishing head guide columns 26, which are arranged at intervals in the circumferential direction, and the polishing head guide column 26 is farther away from the through hole 221 in the radial direction compared with the wafer guide column 24, and the plurality of polishing head guide columns 26 are guided in cooperation with the circumferential edge of the polishing head 60.

[0051] Specifically, the plurality of polishing head guide columns 26 are arranged at intervals in the circumferential direction, and the polishing head guide column 26 is farther away from the through hole 221 in the radial direction compared with the wafer guide column 24, so that the polishing head guide column 26 can guide the circumferential edge of the polishing head 60, and the polishing head 60 can be placed on the wafer bearing ring 23 more accurately.

[0052] In combination Figure 2 As shown, the upper side of the bearing plate 22 is further provided with a buffer limiting column 27, which is arranged at intervals in the radial direction between the wafer guide column 24 and the polishing head guide column 26 and selectively buffers and limits the polishing head 60.

[0053] Specifically, by arranging the buffer limiting column 27 on the upper side of the bearing plate 22, when the polishing head 60 presses the bearing plate 20, not only the elastic buffer 21 on the lower side of the bearing plate 22 can buffer the polishing head 60, but also the buffer limiting column 27 on the upper side of the bearing plate 22 can buffer the polishing head 60, so as to further improve the stability of the polishing head 60 pressing the bearing plate 20, and prevent the impact force of the polishing head 60 pressing the bearing plate 20 from damaging the wafer, and improve the yield of wafer feeding and discharging.

[0054] In combination Figure 2 As shown, the lower side of the bottom plate 10 is provided with a first guide rod 28 extending in the up-down direction, the first guide rod 28 is guided in cooperation with the bottom plate 10, and the second guide rod 29 extending in the up-down direction is arranged between the bottom plate 10 and the bearing plate 20, and the bearing plate 20 is guided in cooperation with the second guide rod 29.

[0055] Specifically, by arranging the first guide rod 28 extending in the up-down direction on the lower side of the bottom plate 10, when the lifting driving member 11 drives the bottom plate 10 and the carrier plate 20 to move up and down, the bottom plate 10 and the first guide rod 28 guide each other in the up-down direction, which can improve the stability and reliability of the up-down movement of the bottom plate 10 and the carrier plate 20, prevent the movement of the bottom plate 10 and the carrier plate 20 from deviating in the up-down direction, and cause the wafer loading and unloading to be incorrect, and can improve the structural reliability of the loading and unloading device 100 of the polishing equipment.

[0056] Further, when the carrier plate 20 is pressed down by the polishing head 60, the elastic buffer 21 and the buffer limiting column 27 have universal deformation, which can cause the carrier plate 20 to deviate relative to the bottom plate 10 during the up-down movement, therefore, by arranging the second guide rod 29 extending in the up-down direction between the bottom plate 10 and the carrier plate 20, the carrier plate 20 and the second guide rod 29 guide each other in the up-down direction, which can ensure that the carrier plate 20 always moves in the up-down direction and will not deviate, which can further improve the stability and reliability of the loading and unloading of the loading and unloading device 100 of the polishing equipment.

[0057] As shown in Figure 1 and Figure 2 As shown, the edge of the carrier main plate 22 is circumferentially surrounded by the water baffle 222, and the water baffle 222 is upwardly protruding relative to the carrier plate 20.

[0058] Specifically, when the polishing head cleaning member 52 and the wafer cleaning member 50 clean the polishing head 60 and the wafer respectively, the cleaning liquid can splash, by circumferentially surrounding the edge of the carrier main plate 22 with the water baffle 222, and making the water baffle 222 protrude upward relative to the carrier plate 20, the water baffle can block the splashing cleaning liquid, and prevent a large amount of cleaning liquid from splashing out of the carrier plate 20.

[0059] In some embodiments of the present application, as shown in Figure 2 As shown, a three-way joint 21 is further arranged between the carrier plate 20 and the bottom plate 10, and the three-way joint 21 can also clean the polishing head 60 and the carrier plate 20.

[0060] In some embodiments of the present application, as shown in Figure 2 As shown, a plurality of drainage holes 12 are arranged on the bottom plate 10, and the plurality of drainage holes 12 are circumferentially spaced apart on the bottom plate 10.

[0061] The polishing equipment according to the present application can mainly include the above-mentioned loading and unloading device 100 of the polishing equipment, and the loading and unloading device 100 of the polishing equipment is arranged in the polishing equipment, which can effectively shorten the wafer transmission time and improve the process yield by reducing the loading and unloading time.

[0062] In the description of the application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like are used to indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0063] In the description of the present application, the description of the terms "one embodiment", "some embodiments", "illustrative embodiment", "example", "specific example", or "some examples" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example.

[0064] Although embodiments of the present application have been shown and described, those skilled in the art can understand that various changes, modifications, replacements and variations can be made to these embodiments without departing from the principles and spirit of the present application, and the scope of the present application is defined by the claims and their equivalents.

Claims

1. A loading and unloading device for a polishing equipment, comprising: Throwing one's head; A base plate is disposed below the throwing head and a lifting drive component is disposed on its lower side, the lifting drive component selectively driving the base plate to rise and fall; A support plate is disposed between the base plate and the throwing head and is connected to the base plate. The support plate is movable up and down relative to the base plate and is provided with an elastic buffer between it and the base plate. The carrier plate includes a carrier main board and a wafer carrier ring. The carrier main board is disposed opposite to the polishing head and has a through hole in the middle. The wafer carrier ring is disposed around the circumferential edge of the through hole and at least partially protrudes upward relative to the carrier main board. The wafer carrier ring is suitable for placing a wafer. The radial wall thickness of the wafer carrier ring is set as D, and D satisfies the relationship: 2.9mm < D < 3.1mm. The upper side of the carrier motherboard is provided with a plurality of wafer guide posts and a plurality of wafer detection sensors. The plurality of wafer guide posts are disposed adjacent to the wafer carrier ring and are circumferentially spaced on the outer side of the edge of the wafer carrier ring. The plurality of wafer guide posts are adapted to guide and cooperate with the circumferential edge of the wafer. The plurality of wafer detection sensors are circumferentially spaced on the edge of the carrier motherboard.

2. The loading and unloading device of the polishing equipment according to claim 1, characterized in that, There are multiple elastic buffers, which are circumferentially spaced between the base plate and the support plate.

3. The loading and unloading device of the polishing equipment according to claim 1, characterized in that, It also includes a corrugated pipe protective cover, which is connected between the base plate and the support plate, and the corrugated pipe protective cover is adapted to protect the corresponding internal components.

4. The loading and unloading device of the polishing equipment according to claim 1, characterized in that, It also includes a wafer cleaning component, which is disposed below the support plate and spaced between the support plate and the base plate. The wafer cleaning component is provided with a liquid outlet, which corresponds to the through hole.

5. The loading and unloading device of the polishing equipment according to claim 1, characterized in that, It also includes a polishing head cleaning component, wherein the wafer carrier ring has at least a partial clearance opening, the polishing head cleaning component is disposed in the clearance opening, the polishing head includes a gas film and a retaining ring, the retaining ring is disposed around the outside of the gas film, the radial gap between the gas film and the polishing head body corresponds to the polishing head cleaning component, and the radial gap between the gas film and the polishing head body corresponds to the polishing head cleaning component.

6. The loading and unloading device of the polishing equipment according to claim 1, characterized in that, The upper side of the main board is also provided with a plurality of blasting head guide posts, which are spaced apart in the circumferential direction. Compared with the wafer guide posts, the blasting head guide posts are further away from the through hole in the radial direction, and the plurality of blasting head guide posts are guided and cooperated with the circumferential edge of the blasting head.

7. The loading and unloading device of the polishing equipment according to claim 6, characterized in that, The upper side of the carrier motherboard is also provided with buffer limiting posts, which are radially spaced between the wafer guide posts and the polishing head guide posts and selectively buffer and limit the polishing head.

8. The loading and unloading device of the polishing equipment according to claim 1, characterized in that, A first guide rod extending in the vertical direction is provided on the lower side of the base plate, and the first guide rod is guided and engaged with the base plate. A second guide rod extending in the vertical direction is provided between the base plate and the bearing plate, and the bearing plate is guided and engaged with the second guide rod.

9. The loading and unloading device of the polishing equipment according to claim 1, characterized in that, A water baffle is provided around the edge of the main support plate, and the water baffle protrudes upward relative to the main support plate.

10. A polishing device, characterized in that, include: The loading and unloading device of the polishing equipment according to any one of claims 1-9.

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