Chip multilayer ceramic capacitor and infiltration test method thereof

Abstract

The invention relates to the technical field of capacitor test jigs, and discloses a chip multilayer ceramic capacitor and an infiltration test method thereof.The chip multilayer ceramic capacitor comprises a placing frame, a high-temperature-resistant adhesive tape, a capacitor body, a clamping jig and a tin furnace, the high-temperature-resistant adhesive tape is pasted to the rear surface of the placing frame, the capacitor body is placed in the placing frame, and the clamping jig is arranged in the placing frame; the capacitor body is adhered to the adhering surface of the high-temperature-resistant adhesive tape, the clamping jig is clamped on the surface of the high-temperature-resistant adhesive tape, the tin furnace is arranged below the clamping jig, a covering device is arranged on the surface of the placing frame, and the covering device comprises a guide rail. According to the invention, through the arrangement of the covering device, the capacitor body can be pressed on the high-temperature-resistant adhesive tape along the specified direction, so that the accuracy of pressing the capacitor body is improved, the problem of low efficiency caused by the fact that a user uses tweezers for clamping for an infiltration test is reduced, and the detection efficiency of the ceramic capacitor is improved.

Description

Technical Field

[0001] This invention relates to the field of capacitor testing fixture technology, specifically to multilayer ceramic chip capacitors and their wetting test methods. Background Technology

[0002] Multilayer ceramic chip capacitors are passive electronic components formed by sintering multiple alternating electrodes made of ceramic material as dielectric. They are characterized by small size, wide capacitance range, good high-frequency characteristics, high reliability, and low cost.

[0003] The wetting test for multilayer ceramic capacitors (MLCCs) is an important test item for evaluating their soldering performance and packaging reliability. It mainly tests the bonding strength between the MLCC electrode and the ceramic substrate and the wettability of the coating by simulating the soldering environment. The test usually involves immersing the MLCC sample in molten solder (such as tin-lead alloy or lead-free solder, at a temperature of about 230-260℃), wetting it for a standard time (usually 2-5 seconds), and then taking it out to observe the solder coverage area of ​​the terminal electrode, the uniformity of wetting, and whether there are defects such as ceramic substrate exposure, terminal electrode peeling or delamination.

[0004] In the wetting test of multilayer ceramic chip capacitors, traditional wetting tests rely on tweezers for clamping. Due to the small size of these capacitors, the contact area between the clamping end of the tweezers and the capacitor is only a few tenths of a square millimeter, resulting in poor clamping stability. Furthermore, to improve the success rate of clamping, operators need to repeatedly adjust the angle and force of the tweezers to ensure that the clamping point accurately lands on both ends of the capacitor. This results in a clamping time of 3-5 seconds for a single capacitor, leading to reduced clamping efficiency and interfering with the capacitor's testing efficiency. Therefore, we propose a wetting test method for multilayer ceramic chip capacitors. Summary of the Invention

[0005] (a) Technical problems to be solved

[0006] To address the shortcomings of existing technologies, this invention provides a multilayer ceramic chip capacitor and its immersion test method. This solves the problem that in existing capacitor testing, to improve the clamping success rate, operators need to repeatedly adjust the angle and force of the tweezers to ensure that the clamping point accurately falls on both ends of the capacitor. This results in a clamping time of 3-5 seconds for a single capacitor, leading to reduced clamping efficiency and interference with the capacitor testing efficiency.

[0007] (II) Technical Solution

[0008] To achieve the above objectives, the present invention provides the following technical solution: a multilayer ceramic chip capacitor and its immersion test method. The multilayer ceramic chip capacitor includes a placement frame, a high-temperature resistant tape, a capacitor body, a clamping fixture, and a solder pot. The high-temperature resistant tape is adhered to the rear surface of the placement frame, the capacitor body is placed inside the placement frame, and the capacitor body is adhered to the adhesive surface of the high-temperature resistant tape. The clamping fixture clamps the surface of the high-temperature resistant tape, the solder pot is located below the clamping fixture, and a covering device is provided on the surface of the placement frame.

[0009] The covering device includes a guide rail, which is fixedly connected to the surface of the placement frame. A limit frame is slidably connected to the inner wall of the guide rail. A slider is slidably connected to the surface of the guide rail. A buckle is fixedly connected to the upper surface of the slider. A connecting plate is slidably connected to the inner wall of the buckle. An adsorption magnetic plate is fixedly connected to the surface of the connecting plate. A plastic ruler is fixedly connected to the front side of the connecting plate.

[0010] A mounting bracket is fixedly connected to the surface of the plastic ruler. A buckle is rotatably connected to the inner wall of the mounting bracket. A spring is fixedly connected to the upper surface of the mounting bracket, and the spring is fixedly connected to the lower surface of the buckle.

[0011] Preferably, the upper surface of the slider is provided with an insertion hole, and a fixing bolt is inserted into the inner wall of the insertion hole. The fixing bolt is threaded to the inner wall of the limiting frame. The fixing bolt can be used to connect the slider and the limiting frame to ensure the cooperation between the limiting frame and the guide rail, and to constrain the movement distance of the slider.

[0012] Preferably, the upper surface of the buckle is provided with a groove, the buckle is inserted into the inner wall of the groove, and the side of the buckle near the slider is provided with a chamfer. By using the cooperation between the buckle and the groove, the position of the plastic ruler can be locked, thereby ensuring the stability of the plastic ruler in the working state.

[0013] Preferably, a placement device is provided on the left side of the placement frame. The placement device includes a support frame, which is fixedly connected to the left side of the placement frame. A constraint shaft is inserted into the inner wall of the support frame. A tape roller is mounted on the surface of the constraint shaft. A threaded sleeve is threadedly connected to the upper end of the constraint shaft. A guide frame is fixedly connected to the side of the connecting plate near the adsorption magnetic plate. A connecting frame is slidably connected to the inner wall of the guide frame. A cutter is bolted to the inner wall of the connecting frame. The position of the constraint shaft can be locked using the threaded sleeve, thereby ensuring that the constraint shaft restricts the position of the tape roller to a specified area.

[0014] Preferably, the threaded sleeve abuts against the upper surface of the support frame, the guide frame is fixedly connected to the side surface of the adsorption magnetic plate, and the connecting frame is magnetically attracted to the adsorption magnetic plate. The guide frame can guide the movement direction of the connecting frame to ensure the stability of the connecting frame in the moving state and reduce the probability of the connecting frame deviating.

[0015] Preferably, the cutter has blades on both the upper and lower sides, and can be used to cut the unfolded end of the tape roller while in motion, thereby disconnecting the connection between the high-temperature resistant tape and the tape roller.

[0016] Preferably, the surface of the placement frame is provided with a support device, the support device includes a connecting crossbar, the connecting crossbar is fixedly connected to the right side of the placement frame, a first support leg is fixedly connected to the rear of the connecting crossbar, a first pad is fixedly connected to the end of the first support leg away from the connecting crossbar, and the first support leg is fixedly connected to the surface of the placement frame.

[0017] A second support leg is fixedly connected to the surface of the support frame. A second pad is fixedly connected to the side of the second support leg away from the support frame. A reinforcing rib is fixedly connected to the surface of the second support leg. The reinforcing rib is fixedly connected to the surface of the support frame. The reinforcing rib can increase the structural strength of the connection between the second support leg and the support frame, thereby improving the stability of the second support leg.

[0018] Preferably, the height of the first support leg is equal to the height of the second support leg, and the height of the first pad is equal to the height of the second pad. Through the cooperation of the first support leg and the second support leg, the placement frame can be replaced to contact the tabletop, while facilitating the user's operation of the covering device.

[0019] Preferably, when performing an immersion test on ceramic capacitors, high-temperature resistant tape is pasted on the back of the placement frame. After pasting, the side with the high-temperature resistant tape is placed on the table. At the same time, the first support leg, the second support leg, the first pad, and the second pad cause the placement frame to contact the table. Then, multiple capacitor bodies are sprinkled on top of the placement frame.

[0020] After completing the operation, push the plastic ruler from top to bottom. The plastic ruler pushes the connecting plate and, together with the mounting bracket, pushes the buckle. The connecting plate pushes the magnetic plate. As the buckle moves, it approaches the buckle frame. When the buckle contacts the buckle frame, the buckle rotates in the specified direction and compresses the spring under the action of its inclined surface. The spring is compressed and deformed. When the plastic ruler moves to the maximum distance, the buckle coincides with the groove above the buckle frame. At the same time, the buckle loses the pressure applied to the spring. The spring loses the pressure and rebounds, pushing the buckle back to its original position. The buckle resets and locks into the groove to lock the position of the plastic ruler.

[0021] After the plastic ruler is locked, push the plastic ruler along the direction of the guide rail. The plastic ruler, together with the connecting plate, buckle and slider, drives the magnetic plate to move. The magnetic plate moves along the horizontal direction of the placement frame and attracts the capacitor body on the surface of the placement frame. Under the action of the magnetic plate, the capacitor body falls into the placement cavity of the placement frame one by one and is pressed by the plastic ruler that moves over it, so that the capacitor body is firmly attached to the high temperature resistant tape. At the same time, the plastic ruler will push the excess capacitor body away from the placement frame. After the capacitor body is attached, peel off the high temperature resistant tape with the capacitor body attached.

[0022] The high-temperature resistant tape with the capacitor body attached is torn off and clamped onto the clamping fixture. After clamping, the moving mechanism is controlled. The moving mechanism can use existing common structures, which will not be described in detail here. The moving mechanism moves the clamping fixture, and the clamping fixture drives the high-temperature resistant tape to be immersed in the flux and the solder pot in sequence to realize the immersion tinning operation, and the capacitor body is tested by immersion tinning.

[0023] When subsequent batches need to be tested after the first batch of testing is completed, pull the movable end of the tape roller to pull out the high-temperature resistant tape. After the tape is pulled out to the appropriate length, press the tape firmly onto the placement frame, and then reset the covering device. The covering device drives the cutter to reset. After the cutter resets, move the connecting frame. The connecting frame, in conjunction with the guide frame, moves the cutter. The cutter moves in the specified direction and cuts the high-temperature resistant tape pulled out from the tape roller to complete the application of the high-temperature resistant tape. After the tape on the tape roller is used up, rotate the threaded sleeve to remove it from the constraint shaft. After disassembly, remove the constraint shaft and replace the tape roller on the constraint shaft. After replacement, use the threaded sleeve to fix the constraint shaft again.

[0024] In summary, the technical effects and advantages of this invention are as follows:

[0025] 1. In this invention, by setting a covering device, the capacitor body can be pressed onto the high-temperature resistant tape in a specified direction, thereby increasing the accuracy of pressing the capacitor body and reducing the problem of low efficiency caused by users using tweezers to hold the capacitor for immersion testing, thus improving the testing efficiency of ceramic capacitors.

[0026] 2. In this invention, by setting up a laying device, after the high-temperature resistant tape used in the previous batch is torn off, the subsequent high-temperature resistant tape can be quickly pasted onto the placement frame, further improving the efficiency of the impregnation operation.

[0027] 3. In this invention, by setting a support device, the height between the placement frame and the table can be increased to facilitate the user's subsequent operation of covering the device. Attached Figure Description

[0028] Figure 1This is a schematic diagram of the overall structure of the chip-type multilayer ceramic capacitor and its wetting test method according to the present invention.

[0029] Figure 2 This invention relates to a chip-type multilayer ceramic capacitor and its wetting test method. Figure 1 Rear view;

[0030] Figure 3 This invention relates to a chip-type multilayer ceramic capacitor and its wetting test method. Figure 1 The right view;

[0031] Figure 4 This is a schematic diagram of the clamping structure of the chip multilayer ceramic capacitor and its wetting test method according to the present invention.

[0032] Figure 5 This is a schematic diagram of the wetted state structure of the chip multilayer ceramic capacitor and its wettability test method according to the present invention.

[0033] Figure 6 This is a schematic diagram of the covering device structure for the chip-type multilayer ceramic capacitor and its wetting test method of the present invention.

[0034] Figure 7 This invention relates to a chip-type multilayer ceramic capacitor and its wetting test method. Figure 6 Schematic diagram of the structure at point A in the middle;

[0035] Figure 8 This is a schematic diagram of the covering device of the chip multilayer ceramic capacitor and its wetting test method of the present invention.

[0036] Figure 9 This is a schematic diagram of the layout device for the chip-type multilayer ceramic capacitor and its wetting test method according to the present invention.

[0037] Figure 10 This is a bottom view of the layout device for the chip-type multilayer ceramic capacitor and its wetting test method of the present invention.

[0038] Figure 11 This invention relates to a chip-type multilayer ceramic capacitor and its wetting test method. Figure 10 Schematic diagram of the structure at point B;

[0039] Figure 12 This is a schematic diagram of the support device structure for the chip multilayer ceramic capacitor and its wetting test method of the present invention.

[0040] In the diagram: 1. Placement frame; 2. High-temperature resistant tape; 3. Capacitor body;

[0041] 4. Covering device; 41. Guide rail; 42. Limiting bracket; 43. Slider; 44. Fixing bolt; 45. Buckle; 46. Connecting plate; 47. Adsorption magnetic plate; 48. Plastic ruler; 49. Mounting bracket; 410. Buckle; 411. Spring;

[0042] 5. Laying device; 51. Support frame; 52. Constraint shaft; 53. Belt roller; 54. Threaded sleeve; 55. Guide frame; 56. Connecting frame; 57. Cutting knife;

[0043] 6. Support device; 61. Connecting crossbar; 62. First support leg; 63. First washer; 64. Second support leg; 65. Second washer; 66. Reinforcing rib;

[0044] 7. Clamping jig; 8. Tin furnace. Detailed Implementation

[0045] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0046] refer to Figures 1-12 The multilayer ceramic chip capacitor and its wetting test method shown include a placement frame 1, a high-temperature resistant tape 2, a capacitor body 3, a clamping fixture 7, and a solder pot 8. The high-temperature resistant tape 2 is pasted on the rear surface of the placement frame 1, the capacitor body 3 is placed inside the placement frame 1, and the capacitor body 3 is pasted with the pasting surface of the high-temperature resistant tape 2. The clamping fixture 7 is clamped on the surface of the high-temperature resistant tape 2, the solder pot 8 is set below the clamping fixture 7, and a covering device 4 is provided on the surface of the placement frame 1.

[0047] The covering device 4 includes a guide rail 41, which is fixedly connected to the surface of the placement frame 1. A limit frame 42 is slidably connected to the inner wall of the guide rail 41. A slider 43 is slidably connected to the surface of the guide rail 41. A buckle 45 is fixedly connected to the upper surface of the slider 43. A connecting plate 46 is slidably connected to the inner wall of the buckle 45. An adsorption magnetic plate 47 is fixedly connected to the surface of the connecting plate 46. A plastic ruler 48 is fixedly connected to the front side of the connecting plate 46.

[0048] A mounting bracket 49 is fixedly connected to the surface of the plastic ruler 48. A buckle 410 is rotatably connected to the inner wall of the mounting bracket 49. A spring 411 is fixedly connected to the upper surface of the mounting bracket 49. The spring 411 is fixedly connected to the lower surface of the buckle 410.

[0049] The upper surface of the slider 43 is provided with an insertion hole, and a fixing bolt 44 is inserted into the inner wall of the insertion hole. The fixing bolt 44 is threadedly connected to the inner wall of the limiting frame 42. The fixing bolt 44 can be used to connect the slider 43 and the limiting frame 42 to ensure the cooperation between the limiting frame 42 and the guide rail 41, and to constrain the movement distance of the slider 43.

[0050] The upper surface of the buckle 45 has a groove, and the buckle 410 is inserted into the inner wall of the groove. The buckle 410 has a chamfer on the side near the slider 43. By using the cooperation between the buckle 410 and the groove, the position of the plastic ruler 48 can be locked, thereby ensuring the stability of the plastic ruler 48 in the working state.

[0051] The placement frame 1 has a placement device 5 on its left side. The placement device 5 includes a support frame 51, which is fixedly connected to the left side of the placement frame 1. A constraint shaft 52 is inserted into the inner wall of the support frame 51. A tape roller 53 is mounted on the surface of the constraint shaft 52. A threaded sleeve 54 is threadedly connected to the upper end of the constraint shaft 52. A guide frame 55 is fixedly connected to the side of the connecting plate 46 near the magnetic adsorption plate 47. A connecting frame 56 is slidably connected to the inner wall of the guide frame 55. A cutter 57 is bolted to the inner wall of the connecting frame 56. The position of the constraint shaft 52 can be locked by the threaded sleeve 54, thereby ensuring that the constraint shaft 52 restricts the position of the tape roller 53 to a specified area.

[0052] The threaded sleeve 54 abuts against the upper surface of the support frame 51, the guide frame 55 is fixedly connected to the side surface of the magnetic adsorption plate 47, and the connecting frame 56 is magnetically attracted to the magnetic adsorption plate 47. The guide frame 55 can guide the movement direction of the connecting frame 56 to ensure the stability of the connecting frame 56 in the moving state and reduce the probability of the connecting frame 56 deviating.

[0053] The cutter 57 has blades on both the upper and lower sides. The cutter 57 can be used to cut the unfolded end of the tape roller 53 while it is in motion, thereby disconnecting the connection between the high-temperature resistant tape 2 and the tape roller 53.

[0054] The surface of the placement frame 1 is provided with a support device 6. The support device 6 includes a connecting crossbar 61, which is fixedly connected to the right side of the placement frame 1. A first support leg 62 is fixedly connected to the rear of the connecting crossbar 61. A first pad 63 is fixedly connected to the end of the first support leg 62 away from the connecting crossbar 61. The first support leg 62 is fixedly connected to the surface of the placement frame 1.

[0055] A second support leg 64 is fixedly connected to the surface of the support frame 51. A second pad 65 is fixedly connected to the side of the second support leg 64 away from the support frame 51. A reinforcing rib 66 is fixedly connected to the surface of the second support leg 64. The reinforcing rib 66 is fixedly connected to the surface of the support frame 51. The reinforcing rib 66 can increase the structural strength of the connection between the second support leg 64 and the support frame 51, thereby improving the stability of the second support leg 64.

[0056] The height of the first support leg 62 is equal to the height of the second support leg 64, and the height of the first pad 63 is equal to the height of the second pad 65. Through the cooperation of the first support leg 62 and the second support leg 64, the placement frame 1 can be replaced to contact the table, and at the same time, it is convenient for the user to operate the covering device 4.

[0057] The working principle of this invention is as follows: When performing an immersion test on ceramic capacitors, high-temperature resistant tape 2 is pasted on the back of the placement frame 1. After pasting, the side with the high-temperature resistant tape 2 is placed on the table. At the same time, the first support leg 62, the second support leg 64, the first pad 63, and the second pad 65 drive the placement frame 1 to contact the table. Then, multiple capacitor bodies 3 are sprinkled on top of the placement frame 1. By setting the support device 6, the height between the placement frame 1 and the table can be raised to facilitate the user's subsequent operation of the covering device 4.

[0058] After the operation is completed, push the plastic ruler 48 from top to bottom. The plastic ruler 48 pushes the connecting plate 46 and, together with the mounting bracket 49, pushes the buckle 410. The connecting plate 46 pushes the magnetic adsorption plate 47. During the movement, the buckle 410 approaches the buckle bracket 45. When the buckle 410 contacts the buckle bracket 45, the buckle 410 rotates in the specified direction under the action of its inclined surface and squeezes the spring 411. The spring 411 is squeezed and deformed. When the plastic ruler 48 moves to the maximum distance, the buckle 410 coincides with the groove above the buckle bracket 45. At the same time, the buckle 410 loses the pressure applied to the spring 411. The spring 411 loses the pressure and rebounds, pushing the buckle 410 to reset. The buckle 410 resets and snaps into the groove to lock the position of the plastic ruler 48.

[0059] After the plastic ruler 48 is locked, it is pushed along the direction of the guide rail 41. The plastic ruler 48, together with the connecting plate 46, the buckle 45 and the slider 43, drives the magnetic adsorption plate 47 to move. The magnetic adsorption plate 47 moves along the horizontal direction of the placement frame 1 and adsorbs the capacitor body 3 on the surface of the placement frame 1. Under the action of the magnetic adsorption plate 47, the capacitor body 3 falls into the placement cavity of the placement frame 1 one by one and is pressed by the plastic ruler 48 that moves through it, so that the capacitor body 3 is firmly attached to the high temperature resistant tape 2. At the same time, the plastic ruler 48 will push the excess capacitor body 3 away from the placement frame 1. After the attachment of the capacitor body 3 is completed, the high temperature resistant tape 2 with the capacitor body 3 attached is peeled off. By setting the covering device 4, the capacitor body 3 can be pressed onto the high temperature resistant tape 2 in a specified direction to increase the accuracy of pressing the capacitor body 3 and reduce the problem of low efficiency caused by the user using tweezers to hold the immersion test, so as to improve the detection efficiency of ceramic capacitors.

[0060] The high-temperature resistant tape 2 with the capacitor body 3 attached is torn off and clamped onto the clamping fixture 7. After clamping is completed, the moving mechanism is controlled. The moving mechanism can use existing common structures, which will not be described in detail here. The moving mechanism moves the clamping fixture 7, and the clamping fixture 7 drives the high-temperature resistant tape 2 to be immersed in the flux and the solder pot 8 in sequence to realize the immersion tinning operation, and the capacitor body 3 is tested by immersion tinning.

[0061] When subsequent batches need to be tested after the first batch of testing is completed, the movable end of the tape roller 53 is pulled, and the high-temperature resistant tape 2 on the tape roller 53 is pulled out. After the tape is pulled out to the appropriate length, the tape is pressed firmly onto the placement frame 1, and then the covering device 4 is reset. The covering device 4 drives the cutter 57 to reset. After the cutter 57 is reset, the connecting frame 56 is moved. The connecting frame 56, in conjunction with the guide frame 55, moves the cutter 57. The cutter 57 moves in the specified direction and cuts the high-temperature resistant tape 2 pulled out from the tape roller 53 to complete the high-temperature resistant tape test. Applying high-temperature tape 2: After the tape on the tape roller 53 is used up, rotate the threaded sleeve 54 to remove the threaded sleeve 54 from the constraint shaft 52. After disassembly, remove the constraint shaft 52 and replace the tape roller 53 on the constraint shaft 52. After replacement, use the threaded sleeve 54 to fix the constraint shaft 52 again. By setting the laying device 5, after tearing off the previous batch of high-temperature tape 2, the subsequent high-temperature tape 2 can be quickly applied to the placement frame 1, further improving the efficiency of the impregnation operation.

[0062] All electrical components mentioned in this article are connected to an external main controller and 220V AC mains power, and the main controller can be a conventional known device such as a computer that can control it.

[0063] Finally, it should be noted that the above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A multilayer ceramic chip capacitor, comprising a placement frame (1), high-temperature resistant tape (2), a capacitor body (3), a clamping fixture (7), and a solder pot (8), characterized in that: The high-temperature resistant tape (2) is pasted on the rear surface of the placement frame (1), the capacitor body (3) is placed inside the placement frame (1), the capacitor body (3) is pasted with the pasting surface of the high-temperature resistant tape (2), the clamping fixture (7) is clamped on the surface of the high-temperature resistant tape (2), the solder pot (8) is set below the clamping fixture (7), and the surface of the placement frame (1) is provided with a covering device (4). The covering device (4) includes a guide rail (41), which is fixedly connected to the surface of the placement frame (1). A limit frame (42) is slidably connected to the inner wall of the guide rail (41). A slider (43) is slidably connected to the surface of the guide rail (41). A buckle (45) is fixedly connected to the upper surface of the slider (43). A connecting plate (46) is slidably connected to the inner wall of the buckle (45). An adsorption magnetic plate (47) is fixedly connected to the surface of the connecting plate (46). A plastic ruler (48) is fixedly connected to the front side of the connecting plate (46). The surface of the plastic ruler (48) is fixedly connected to a mounting bracket (49), the inner wall of the mounting bracket (49) is rotatably connected to a buckle (410), the upper surface of the mounting bracket (49) is fixedly connected to a spring (411), and the spring (411) is fixedly connected to the lower surface of the buckle (410). The surface of the placement frame (1) is also provided with a placement device (5) consisting of a support frame (51), a constraint shaft (52), a tape roller (53), a threaded sleeve (54), and other structures.

2. The multilayer ceramic chip capacitor according to claim 1, characterized in that: The upper surface of the slider (43) is provided with an insertion hole, and a fixing bolt (44) is inserted into the inner wall of the insertion hole of the slider (43). The fixing bolt (44) is threadedly connected to the inner wall of the limiting frame (42).

3. The multilayer ceramic chip capacitor according to claim 1, characterized in that: The upper surface of the buckle (45) is provided with a groove, and the buckle (410) is inserted into the inner wall of the groove. The buckle (410) has a chamfer on the side near the slider (43).

4. The multilayer ceramic chip capacitor according to claim 1, characterized in that: A laying device (5) is provided on the left side of the placement frame (1). The laying device (5) includes a support frame (51). The support frame (51) is fixedly connected to the left side of the placement frame (1). A constraint shaft (52) is inserted into the inner wall of the support frame (51). A tape roller (53) is installed on the surface of the constraint shaft (52). A threaded sleeve (54) is threadedly connected to the upper end of the constraint shaft (52). A guide frame (55) is fixedly connected to the side of the connecting plate (46) near the adsorption magnetic plate (47). A connecting frame (56) is slidably connected to the inner wall of the guide frame (55). A cutter (57) is bolted to the inner wall of the connecting frame (56).

5. The multilayer ceramic chip capacitor according to claim 4, characterized in that: The threaded sleeve (54) abuts against the upper surface of the support frame (51), the guide frame (55) is fixedly connected to the side surface of the adsorption magnetic plate (47), and the connecting frame (56) is magnetically attracted to the adsorption magnetic plate (47).

6. The multilayer ceramic chip capacitor according to claim 4, characterized in that: The cutting blade (57) has blades on both the upper and lower sides.

7. The multilayer ceramic chip capacitor according to claim 1, characterized in that: The surface of the placement frame (1) is provided with a support device (6), the support device (6) includes a connecting crossbar (61), the connecting crossbar (61) is fixedly connected to the right side of the placement frame (1), a first support leg (62) is fixedly connected to the rear of the connecting crossbar (61), a first pad (63) is fixedly connected to the end of the first support leg (62) away from the connecting crossbar (61), and the first support leg (62) is fixedly connected to the surface of the placement frame (1); The surface of the support frame (51) is fixedly connected to a second support leg (64), and a second pad (65) is fixedly connected to the side of the second support leg (64) away from the support frame (51). A reinforcing rib (66) is fixedly connected to the surface of the second support leg (64), and the reinforcing rib (66) is fixedly connected to the surface of the support frame (51).

8. The multilayer ceramic chip capacitor according to claim 7, characterized in that: The height of the first support leg (62) is equal to the height of the second support leg (64), and the height of the first pad (63) is equal to the height of the second pad (65).

9. The wetting test method for a multilayer ceramic chip capacitor according to any one of claims 1-8, characterized in that, Includes the following steps: S1. When performing the immersion test on the ceramic capacitor, the high-temperature resistant tape (2) is pasted on the back of the placement frame (1). After pasting, the side with the high-temperature resistant tape (2) is placed on the table. At the same time, the first support leg (62), the second support leg (64), the first pad (63), and the second pad (65) drive the placement frame (1) to contact the table. Then, multiple capacitor bodies (3) are sprinkled on the top of the placement frame (1). S2. After completing the operation, push the plastic ruler (48) from top to bottom. The plastic ruler (48) pushes the connecting plate (46) under force, and cooperates with the mounting bracket (49) to push the buckle (410). The connecting plate (46) pushes the magnetic adsorption plate (47) under force. The buckle (410) moves closer to the buckle frame (45) during the movement. When the buckle (410) contacts the buckle frame (45), the buckle (410) rotates in the specified direction and squeezes the spring (411) under the action of its inclined surface. The spring (411) is squeezed and deformed. When the plastic ruler (48) moves to the maximum distance, the buckle (410) coincides with the groove above the buckle frame (45). At the same time, the buckle (410) loses the pressure applied to the spring (411). The spring (411) loses the pressure and rebounds, pushing the buckle (410) to reset. The buckle (410) resets and snaps into the groove to lock the position of the plastic ruler (48). After the plastic ruler (48) is locked, push the plastic ruler (48) along the direction of the guide rail (41). The plastic ruler (48) works with the connecting plate (46), the buckle (45) and the slider (43) to move the magnetic adsorption plate (47). The magnetic adsorption plate (47) moves along the horizontal direction of the placement frame (1) and adsorbs the capacitor body (3) on the surface of the placement frame (1). Under the action of the magnetic adsorption plate (47), the capacitor body (3) falls into the placement cavity of the placement frame (1) one by one, and is pressed by the plastic ruler (48) that moves through later, so that the capacitor body (3) is firmly attached to the high temperature resistant tape (2). At the same time, the plastic ruler (48) will push the excess capacitor body (3) away from the placement frame (1). After the attachment of the capacitor body (3) is completed, peel off the high temperature resistant tape (2) with the capacitor body (3) attached. S3. The high-temperature resistant tape (2) with the capacitor body (3) attached to it is clamped on the clamping fixture (7). After clamping, the moving mechanism is controlled. The moving mechanism can use the existing common structure, which will not be described in detail here. The moving mechanism moves the clamping fixture (7). The clamping fixture (7) drives the high-temperature resistant tape (2) to be immersed in the flux and the solder pot (8) in sequence to realize the immersion tinning operation and use the immersion tinning to test the capacitor body (3). S4. When subsequent batches need to be tested after the first batch of testing is completed, pull the movable end of the tape roller (53). The high-temperature resistant tape (2) on the tape roller (53) is pulled out. After the tape is pulled out to the appropriate length, press the tape firmly onto the placement frame (1). Then reset the covering device (4). The covering device (4) drives the cutter (57) to reset. After the cutter (57) resets, move the connecting frame (56). The connecting frame (56) cooperates with the guide frame (55) to move the cutter (57). 7) Move along the specified direction and cut the high-temperature resistant tape (2) pulled out from the tape roller (53) to complete the pasting of the high-temperature resistant tape (2); after the tape on the tape roller (53) is used up, rotate the threaded sleeve (54) to remove the threaded sleeve (54) from the constraint shaft (52). After disassembly, remove the constraint shaft (52) and replace the tape roller (53) on the constraint shaft (52). After replacement, use the threaded sleeve (54) to fix the constraint shaft (52) again.

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