Laser alignment jig for reactor system

Abstract

A laser alignment jig for a reactor system can be used to align components of the reactor system to allow uniform deposition of a thin film onto a substrate. The laser alignment jig may include: a cap assembly; and a plurality of laser and sensor assemblies. The laser alignment jig may align at least: the flow control ring, the susceptor, and a sidewall of the reactor system.

Description

[0001] This application is a divisional application of the invention patent application with application number 202110520955X, application date May 13, 2021, entitled "Laser Alignment Fixture for Reactor Systems". Technical Field

[0002] This disclosure generally relates to a laser alignment fixture for positioning components within a reactor system. A related fixture is disclosed in U.S. Patent Application No. 62 / 985,184, entitled “Alignment Fixture for a Reactor System,” filed March 4, 2020, the entire contents of which are incorporated herein by reference to the extent that they do not conflict with this disclosure. Background Technology

[0003] A reaction chamber can be used to deposit various material layers onto a semiconductor substrate. The semiconductor can be placed on a pedestal within the reaction chamber. Both the substrate and the pedestal can be heated to a desired substrate temperature setpoint. In an exemplary substrate processing procedure, one or more reactant gases can be passed over the heated substrate, resulting in the deposition of a thin film of material on the substrate surface. These layers can be used to form integrated circuits throughout subsequent deposition, doping, photolithography, etching, and other processes.

[0004] To achieve the desired result on the substrate (e.g., uniform or robust film deposition), the substrate and / or the substrate can be positioned within the reaction chamber. For example, the substrate can be positioned such that a desired space exists between the substrate and the sidewalls of the reaction chamber (e.g., a uniform space obtained by centering the substrate within the reaction chamber). Such positioning prevents uneven processing of the substrate within the reaction chamber and can facilitate the achievement of the desired result. However, achieving the desired position of the substrate or other components within the reaction chamber can be difficult, and errors in such positioning can lead to undesirable processing results.

[0005] Environmental conditions can make achieving the desired placement difficult. Many substrate processing procedures can occur at high temperatures and low pressures. Therefore, systems that allow for precise alignment and leveling of components within a reaction chamber under specific environmental conditions are desirable. Summary of the Invention

[0006] This invention provides a simplified overview of some concepts. These concepts are described in more detail in the following exemplary embodiments. This invention is not intended to identify key or essential features of the claimed subject matter, nor is it intended to limit the scope of the claimed subject matter.

[0007] According to at least one embodiment of the present invention, a laser alignment fixture for a reactor system is disclosed. The reactor system is used to deposit thin films on a substrate. The laser alignment fixture includes: a cover assembly configured to be placed on the reactor system, the cover assembly including an observation window; a plurality of laser and sensor assemblies disposed on the cover assembly; wherein the reactor system includes: a base configured to receive a substrate thereon; a base positioning system configured to move the base along an xy plane; a flow control ring disposed on an outer edge of the base; and a spacer plate contacting the flow control ring and disposed on an outer edge of the flow control ring; wherein the plurality of laser and sensor assemblies illuminate and sense light for determining the alignment of the base, the flow control ring, and the spacer plate; wherein the light is used to adjust the position of the base by using the base positioning system.

[0008] All of these embodiments are intended to be within the scope of this disclosure. These and other embodiments will become apparent to those skilled in the art from the following detailed description of some of the embodiments, with reference to the accompanying drawings. This disclosure is not limited to any of the particular embodiments(s) discussed. Attached Figure Description

[0009] The concluding section of the specification specifically points out and explicitly claims protection for the subject matter of this disclosure. However, a more complete understanding of this disclosure can be best obtained by taking into account the accompanying drawings, detailed embodiments, and claims, wherein like reference numerals refer to like elements.

[0010] Figure 1 The illustration shows a simplified schematic diagram of a reactor system according to various embodiments.

[0011] Figure 2 The illustration shows a perspective view of the lower portion of a reactor system according to various embodiments.

[0012] Figure 3 A perspective view of an alignment fixture for a reaction chamber according to various embodiments is shown.

[0013] Figure 4 The illustration shows a side view of an alignment clamp disposed on a reactor system according to various embodiments.

[0014] Figure 5 The illustration shows a side view of an alignment clamp disposed on a reactor system according to various embodiments.

[0015] Figure 6 The illustration shows a schematic diagram of an alignment fixture according to various embodiments.

[0016] It should be understood that the elements in the figures are shown for simplicity and clarity and are not necessarily drawn to scale. For example, the dimensions of some elements in the figures may be enlarged relative to other elements to help improve the understanding of the embodiments shown in this disclosure. Detailed Implementation

[0017] Although certain embodiments and examples are disclosed below, those skilled in the art will understand that this disclosure extends beyond the specific disclosed embodiments and / or the uses of this disclosure and their obvious modifications and equivalents. Therefore, the scope of this disclosure is not intended to be limited to the specific embodiments described herein.

[0018] The descriptions presented herein are not actual views of any particular material, device, structure, or apparatus, but are merely representations for describing embodiments of this disclosure.

[0019] As used herein, the term “substrate” can refer to any one or more underlying materials or materials on which devices, circuits or films can be formed.

[0020] As used herein, the term "atomic layer deposition" (ALD) can refer to a vapor deposition process in which deposition cycles, preferably multiple successive deposition cycles, are performed in a process chamber. During each cycle, a precursor can be chemisorbed onto the deposition surface (e.g., a substrate surface or a previously deposited lower layer surface, such as material from a previous ALD cycle), forming a monolayer or sub-monolayer that is not readily reactive with additional precursors (i.e., a self-limiting reaction). Subsequently, if desired, reactants (e.g., another precursor or reactive gas) can be introduced into the process chamber to convert the chemisorbed precursor into the desired material on the deposition surface. The reactants may be able to react further with the precursor. Additionally, a purging step can be employed during each cycle to remove excess precursor from the process chamber and / or excess reactants and / or reaction byproducts after the conversion of the chemisorbed precursor. Additionally, as used herein, the term “atomic layer deposition” also includes processes referred to by related terms, such as chemical vapor deposition, atomic layer epitaxy (ALE), molecular beam epitaxy (MBE), gas source MBE, or organometallic MBE and chemical beam epitaxy when performed with alternating pulses of (multiple) precursor components, reactive gases, and purging (e.g., inert carrier gases).

[0021] As used herein, the term “chemical vapor deposition” (CVD) can refer to any process in which a substrate is exposed to one or more volatile precursors that react and / or decompose on the substrate surface to produce the desired deposition.

[0022] As used herein, the terms “membrane” and “thin film” can refer to any continuous or discontinuous structure and material deposited by the methods disclosed herein. For example, “membrane” and “thin film” can comprise 2D materials, nanorods, nanotubes, or nanoparticles, or even partially or entirely molecular layers, partially or entirely atomic layers, or clusters of atoms and / or molecules. “Membrane” and “thin film” can include materials or layers having pinholes but still being at least partially continuous.

[0023] As used herein, the term "gas" may include vaporized solids and / or liquids, and may consist of a single gas or a mixture of gases.

[0024] Reactor systems for ALD, CVD, etc., can be used in a variety of applications, including depositing and etching materials on substrate surfaces. Figure 1 A reaction system 100 according to at least one embodiment of the present invention is illustrated. The reaction system includes: an upper reaction chamber assembly 110A; a lower reaction chamber assembly 110B; a base 120 configured to hold a substrate 140; a base positioning system 130 configured to move the base 120 along an xy plane; a gas distribution device 150 configured to uniformly disperse gas on the substrate 140; a first gas source 160 configured to provide a first gas; a second gas source 170 configured to provide a second gas; an inert gas source 180 configured to provide an inert gas; and a gas passage 190 configured to be connected to the upper reaction chamber assembly 110A.

[0025] The upper reaction chamber assembly 110A may include multiple components and ports to allow gas hookups. The lower reaction chamber assembly 110B may include multiple rings and spacer plates. The base 120 may include a heater to heat the substrate 140. The gas distribution device 150 is illustrated as a nozzle arrangement, but other gas distribution arrangements may be used, such as a cross-flow gas distribution device or an injection rake.

[0026] In various embodiments, a pedestal (e.g., pedestal 120) may be positioned within the reaction chamber to achieve the desired result (e.g., material deposition or etching on a substrate) from the process within the reaction chamber. For example, to achieve uniform material deposition on and over the substrate, pedestal 120 may be positioned centrally within the reaction chamber such that the sides of pedestal 120 are uniformly spaced from the internal sidewalls of the reaction chamber (e.g., the lower reaction chamber assembly 110B). If such spacing between the pedestal and the internal sidewalls of the reaction chamber is non-uniform, a portion of the substrate may be subjected to a greater amount of reactant gases within the reaction chamber than another portion, resulting in non-uniform material deposition (i.e., undesirable results).

[0027] Figure 2The illustration shows a bird's-eye view of the lower reaction chamber assembly 200. The lower reaction chamber assembly includes: a base 210; a flow control ring 220; and a spacer plate 230. The alignment of these three components can significantly affect the uniformity of the thin film deposited on the substrate disposed on the base 210.

[0028] Flow control ring 220 surrounds base 210 and is responsible for regulating gas flow to the exhaust port. Flow control ring 220 may include materials such as quartz, ceramic, or metals such as titanium, aluminum, stainless steel, or Hastelloy alloy, as examples. Spacer plate 230 may surround flow control ring 220 and provide a surface for mounting flow control ring 220. Spacer plate 230 may include materials such as titanium, aluminum, stainless steel, or Hastelloy alloy, as examples.

[0029] Figure 3 A laser alignment fixture 300 according to at least one embodiment of the present invention is illustrated. The laser alignment fixture 300 is designed to directly fit onto the lower reaction chamber assembly 200 and can sense the position of at least the base 210 and the flow control ring 220. The laser alignment fixture 300 can be positioned on top of the lower reaction chamber assembly 200 using a lift. The laser alignment fixture 300 includes: a cover assembly 310; and a laser and sensor assembly 320. The cover assembly 310 may comprise materials such as titanium, aluminum, stainless steel, or Hastelloy alloy.

[0030] Figure 3 The diagram shows multiple laser and sensor assemblies 320 disposed on top of the cover assembly 310. The laser and sensor assemblies 320 are illustrated as being equidistantly disposed on the base 210 and the flow control ring 220. At least three laser and sensor assemblies 320 may be required to provide accurate measurement and alignment of components within the lower reaction chamber assembly 200.

[0031] Figure 4 The figure illustrates a side view of a laser alignment fixture 300 disposed on a lower reaction chamber assembly 200 according to at least one embodiment of the present invention. The lower reaction chamber assembly 200 includes: a substrate heater 210A; a substrate holder 210B; a flow control ring 220; a spacer plate 230; and a lower reaction chamber sidewall 240. For ease of illustration, O-rings and other components that allow sealing between the various parts of the lower reaction chamber assembly 200 and the laser alignment fixture 300 are omitted from the figures.

[0032] The laser alignment fixture 300 includes: a cover assembly 310; a laser and sensor assembly 320; and a quartz viewing port 330. The laser and sensor assembly 320 may include a bracket mounted on the cover assembly, and also includes a laser and sensor disposed above the quartz viewing port 330. The laser and sensor assembly 320 is positioned to observe at least one of the following: a substrate holder 210B, a flow control ring 220, and a spacer plate 230.

[0033] Figure 5 The illustration shows a laser alignment fixture 300 when the laser in the laser and sensor assembly 320 generates light 340. The light 340 is incident on at least one of: a substrate holder 210B; a flow control ring 220; or a spacer plate 230. The light 340 is reflected from at least one component of the lower reaction chamber assembly 200 (not shown) back to a photosensor disposed in the laser and sensor assembly 320.

[0034] Figure 6 A schematic diagram of a laser alignment fixture according to at least one embodiment of the present invention is illustrated. The laser alignment fixture includes a laser and sensor assembly 320. The laser and sensor assembly 320 includes: a laser 370; and a light sensor 350. The laser 370 may include a laser source packaged by Keyence Corporation. The light sensor 350 may include a sensor packaged by Keyence Corporation.

[0035] The signal generated by the light sensor 350 can then be sent to the base controller 360. The base controller 360 can then determine the position of the base 120 by providing a movement command to the base positioning system 130.

[0036] The base controller 360 may include a computer or a human operator. In the case where the base controller 360 includes a computer, automation commands can be sent to the base positioning system 130 to cause automated operation of the laser alignment fixture.

[0037] Benefits and other advantages have been described herein with respect to specific embodiments. Furthermore, the connecting lines shown in the various figures included herein are intended to indicate exemplary functional relationships and / or physical connections between various elements. It should be noted that many alternative or additional functional relationships or physical connections may exist in actual systems. However, benefits, advantages, solutions to problems, and any elements that may lead to or make more significant any benefit, advantage, or solution should not be construed as key, essential, or necessary features or elements of this disclosure. Therefore, the scope of this disclosure is limited only by the appended claims, in which elements referred to in the singular form are not intended to mean "one and only one," but rather "one or more" unless expressly stated otherwise. Furthermore, when phrases such as "at least one of A, B, or C" are used in the claims, it is intended to be interpreted as indicating that A may exist alone in one embodiment, B may exist alone in one embodiment, C may exist alone in one embodiment, or any combination of elements A, B, and C may exist in a single embodiment; for example, A and B, A and C, B and C, or A and B and C.

[0038] This document provides systems, methods, and apparatus. In the detailed description herein, references to "an embodiment," "an embodiment," "an exemplary embodiment," etc., indicate that the described embodiment may include specific features, structures, or characteristics; however, each embodiment need not necessarily include specific features, structures, or characteristics. Furthermore, such phrases do not necessarily refer to the same embodiment. Additionally, when a specific feature, structure, or characteristic is described in connection with an embodiment, it is understood that incorporating other embodiments to affect such a feature, structure, or characteristic is within the knowledge of those skilled in the art. Not explicitly described. How this disclosure can be implemented in alternative embodiments will become apparent to those skilled in the art after reading this specification.

[0039] Furthermore, regardless of whether the elements, components, or method steps of the invention are expressly described in the claims, they are not intended to be made public. No claim element herein should be interpreted in accordance with 35 USC(f) unless expressly referenced using the phrase “for an apparatus of…”. As used herein, the term “coupled” for two or more components can mean physical, mechanical, fluid, and / or electrical coupling, as may be determined by the respective context. As used herein, the terms “comprising,” “including,” or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but may also include other elements not expressly listed or other elements inherent to such a process, method, article, or apparatus.

Claims

1. A laser alignment fixture for placement on a reactor system, comprising: A cover assembly configured to be placed on the reactor system; Multiple laser and sensor assemblies are disposed on the cover assembly; The reactor system mentioned above includes: Base, including substrate holder; A base positioning system configured to move the base along the xy plane; A flow control ring is disposed on the outer edge of the base; and A spacer plate is in contact with the flow control ring and is disposed on the outer edge of the flow control ring; The plurality of laser and sensor assemblies are configured to generate light incident on at least one of the substrate holder, the flow control ring, or the spacer plate, and to receive light reflected back from the at least one of the substrate holder, the flow control ring, or the spacer plate, and to generate a signal based on the received light, wherein the base positioning system is configured to adjust the base in response to the signal.

2. The laser alignment fixture of claim 1, wherein the cover assembly comprises at least one of the following: titanium, aluminum, stainless steel, or Hastelloy alloy.

3. The laser alignment fixture of claim 1 further includes an observation window disposed below a corresponding component of the plurality of laser and sensor assemblies, the corresponding component including a photosensor, the observation window being configured to allow light reflected from at least one of the substrate holder, the flow control ring, or the spacer plate to pass through.

4. The laser alignment fixture of claim 1, wherein each of the plurality of laser and sensor assemblies comprises: Lasers and optical sensors.

5. The laser alignment fixture of claim 1, further comprising a base controller configured to receive signals from at least one of the plurality of laser and sensor assemblies.

6. The laser alignment fixture of claim 5, wherein the base controller provides instructions to the base positioning system to move the base.

7. The laser alignment fixture of claim 5, wherein the base controller includes a human operator.

8. The laser alignment fixture of claim 5, wherein the base controller comprises a computer.

9. The laser alignment fixture according to claim 1, wherein, The plurality of laser and sensor assemblies includes at least three laser and sensor assemblies.

10. The laser alignment fixture according to claim 9, wherein, The plurality of laser and sensor components are arranged at equal intervals on the cover assembly.

11. The laser alignment fixture according to claim 10, wherein, The plurality of laser and sensor assemblies consists of three laser and sensor assemblies, each of which is disposed above the edge of the substrate and is positioned at 120 degrees to each other.

12. The laser alignment fixture according to claim 3, wherein, The viewing window is made of quartz.

13. The laser alignment fixture according to claim 1, wherein, The base includes a substrate heater disposed below the substrate holder.

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