Coating monitoring mechanism

Abstract

The invention relates to the technical field of vacuum coating, and discloses a coating monitoring mechanism. A monitoring end is used for acquiring information related to the thickness of a film on a monitoring piece and is arranged corresponding to a monitoring hole formed in a shell; the monitoring piece loading plate is provided with a plurality of monitoring positions used for placing monitoring pieces, and at least part of the monitoring positions are in a linear type and are arranged in the first direction. The monitoring piece switching module is used for enabling the monitoring piece loading plate to linearly move relative to the shell in the first direction, so that the monitoring pieces in the first direction sequentially face the monitoring holes, linear position free switching of the multiple monitoring pieces is achieved, and when the monitoring pieces move to face the monitoring holes, the monitoring piece switching module is matched with the monitoring module to monitor the coating thickness and the deposition rate in real time; on the premise that the monitoring effect is not affected in the process of monitoring the thickness and the deposition rate of the film, linear position switching of the monitoring piece is achieved, the structural width of the film coating monitoring mechanism is smaller, the film coating monitoring mechanism is installed in the film coating machine and occupies a smaller film coating area, and the influence on the productivity is reduced.

Description

Technical Field

[0001] This invention relates to the field of vacuum coating technology, and more particularly to a coating monitoring mechanism. Background Technology

[0002] The thin film thickness monitoring mechanism is a key module of vacuum coating equipment, achieving precise control over vacuum coating by real-time monitoring parameters such as thin film deposition thickness and deposition rate. Common thin film thickness monitoring mechanisms include crystal vibration monitoring and optical film thickness monitoring. In both types, the film thickness is extracted by measuring the quality and optical information of the monitoring plate on which the coating material is deposited. Since the control accuracy of the monitoring plate often decreases after a period of use, the thin film thickness monitoring mechanism typically has multiple monitoring plate placement positions distributed around a circumference, and a rotational motion ensures that the monitoring plate at each monitoring point is sequentially aligned with the monitoring aperture. Generally, the probe end formed by multiple monitoring points is preferably as close as possible to the coating substrate, and the plane of the probe end is as close as possible to the plane of the coating substrate to ensure both on-demand switching of monitoring plates and guaranteed film thickness monitoring accuracy. However, in existing rotary thin film thickness monitoring mechanisms, the probe end formed by multiple monitoring points occupies a significant amount of coating space, affecting the substrate loading capacity of the coating equipment. Summary of the Invention

[0003] The purpose of this invention is to provide a coating monitoring mechanism that enables free switching of multiple monitoring plates without affecting the monitoring of relevant coating parameters. Compared with the rotary switching method, the coating monitoring mechanism provided by this invention has a narrower structure and occupies less coating area when installed inside the coating machine, thus reducing the impact on production capacity.

[0004] To achieve this objective, the present invention adopts the following technical solution:

[0005] Coating monitoring agencies include:

[0006] The outer casing has a monitoring hole.

[0007] The monitoring module includes a monitoring end, which is configured to correspond to the monitoring hole. The monitoring end is used to acquire information related to the film thickness on the monitoring chip.

[0008] A surveillance video loading module includes a surveillance video loading plate with multiple monitoring positions, at least some of which are arranged in a straight line along a first direction. These monitoring positions are used to hold the surveillance video.

[0009] A monitoring chip switching module is used to move the monitoring chip loading plate along the first direction so that the monitoring chips in the first direction can be sequentially aligned with the monitoring holes.

[0010] As an optional technical solution for the coating monitoring mechanism, the outer shell is provided with a linear guide rail, the monitoring film loading module includes a slider, the monitoring film loading plate is fixedly connected to the slider, and the slider is slidably connected to the linear guide rail along the first direction.

[0011] As an optional technical solution for the coating monitoring mechanism, the monitoring film switching module includes a switching input shaft, and the rotation of the switching input shaft can move the monitoring film loading plate along the first direction.

[0012] As an optional technical solution for the coating monitoring mechanism, the monitoring film switching module includes a grooved wheel and an active dial. The active dial is provided with an eccentric follower and a convex locking arc part. The switching input shaft is coaxially fixed with the convex locking arc part. The grooved wheel is rotatably disposed on the inner wall of the housing. The rotation axis of the grooved wheel is parallel to the rotation axis of the switching input shaft. The grooved wheel is provided with multiple radial grooves. The extension direction of the radial grooves passes through the rotation axis of the grooved wheel. A concave locking arc part is provided between two adjacent radial grooves. The rotation of the grooved wheel causes the monitoring film loading plate to move linearly.

[0013] As an optional technical solution for the coating monitoring mechanism, the grooved wheel is coaxially fixed with a gear, and the monitoring sheet loading plate is provided with a rack along the extension direction of the multiple monitoring sheets. The rotation of the grooved wheel can drive the gear and the rack to mesh and transmit power, so that the monitoring sheet loading plate moves linearly.

[0014] As an optional technical solution for the coating monitoring mechanism, four radial grooves are provided, and the included angle between the extension directions of two adjacent radial grooves is 90°. When the groove wheel rotates 90°, the monitoring plate loading module can switch the next monitoring plate to face the monitoring hole.

[0015] As an optional technical solution for the coating monitoring mechanism, the monitoring plate switching module includes a lead screw and a lead screw nut. When the lead screw rotates, the lead screw nut rotates along the axis of the lead screw. The switching input shaft is fixed coaxially with the lead screw. The axis of the lead screw is parallel to the extension direction of the multiple monitoring plates arranged together. The lead screw nut is fixed to the connecting plate.

[0016] As an optional technical solution for the coating monitoring mechanism, a micro switch is provided on the inner wall of the housing, and multiple rollers are spaced apart along the extension direction of the multiple monitoring sheets on the monitoring sheet loading plate. Each roller corresponds to a monitoring sheet. When one of the monitoring sheets is facing the monitoring hole, the corresponding roller is tangent to the micro switch and the corresponding roller presses the micro switch. The micro switch is communicatively connected to the monitoring sheet switching module.

[0017] As an optional technical solution for the coating monitoring mechanism, a non-contact sensor is provided on the inner wall of the housing, and a sensing plate is provided on the monitoring plate loading module. When the monitoring plate in the first position is facing the monitoring hole, the sensing plate is within the sensing range of the non-contact sensor, and the non-contact sensor is communicatively connected to the monitoring plate switching module.

[0018] As an optional technical solution for the coating monitoring mechanism, the monitoring module also includes a cooling component, which includes a cooling box, a lower cooling pipe, and an upper cooling pipe. The cooling box has a cooling through hole, and the monitoring end is inserted into the cooling through hole. The remaining part of the cooling box is hollow and has a cooling cavity. The lower cooling pipe passes through the bottom wall of the cooling box and communicates with the cooling cavity. The upper cooling pipe passes through the top wall of the cooling box and communicates with the cooling cavity.

[0019] The beneficial effects of this invention are:

[0020] The coating monitoring mechanism provided by this invention is used to monitor coating-related parameters in real time within a coating machine. It includes a housing, a monitoring module, a monitoring sheet loading module, and a monitoring sheet switching module. The housing has monitoring holes. The monitoring module includes a monitoring end, which is correspondingly positioned to the monitoring hole. The monitoring end is used to acquire information related to the film thickness from the monitoring sheet. The monitoring sheet loading module includes a monitoring sheet loading plate with multiple monitoring positions, at least some of which are arranged linearly along a first direction. These monitoring positions are used to place monitoring sheets. The monitoring sheet switching module enables the monitoring sheet loading plate to move linearly relative to the housing along the first direction, allowing the monitoring sheets in the first direction to sequentially face the monitoring holes. This allows for free switching of the linear positions of multiple monitoring sheets. When a monitoring sheet moves to face a monitoring hole, it can cooperate with the monitoring module to monitor the coating thickness and deposition rate in real time. Compared to a rotary switching method, this coating monitoring mechanism is narrower, occupies less coating area inside the coating machine, and reduces the impact on production capacity. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the coating monitoring mechanism provided in a specific embodiment of the present invention;

[0022] Figure 2This is a cross-sectional view of the coating monitoring mechanism provided in a specific embodiment of the present invention;

[0023] Figure 3 This is a structural schematic diagram of the coating monitoring mechanism (hidden shell) provided in a specific embodiment of the present invention;

[0024] Figure 4 This is a first working schematic diagram of the coating monitoring mechanism (hidden shell) provided in a specific embodiment of the present invention;

[0025] Figure 5 This is a second working schematic diagram of the coating monitoring mechanism (hidden shell) provided in a specific embodiment of the present invention;

[0026] Figure 6 This is a schematic diagram of the coating monitoring mechanism in another embodiment provided by the specific implementation of the present invention;

[0027] Figure 7 This is a cross-sectional view of the coating monitoring mechanism (hidden cooling component) in another embodiment provided by a specific implementation of the present invention;

[0028] Figure 8 This is a first working schematic diagram of the coating monitoring mechanism (hidden cooling component) in another embodiment provided by the specific implementation of the present invention;

[0029] Figure 9 This is a second working schematic diagram of the coating monitoring mechanism (hidden cooling component) in another embodiment provided by the specific implementation of the present invention;

[0030] Figure 10 This is a cross-sectional view of the coating monitoring mechanism in another embodiment provided by a specific implementation of the present invention;

[0031] Figure 11 This is an exploded view of the cooling component of the coating monitoring mechanism provided in a specific embodiment of the present invention.

[0032] In the picture:

[0033] 100. Housing; 110. Anti-fouling plate; 111. Monitoring hole; 120. Linear guide rail; 130. Micro switch; 140. Non-contact sensor;

[0034] 200. Monitoring module; 210. Monitoring terminal; 220. Mounting plate; 230. Cooling assembly; 231. Cooling box; 2311. Cooling through hole; 2312. Cooling cavity; 232. Lower cooling pipe; 233. Upper cooling pipe;

[0035] 300. Monitoring film loading module; 310. Monitoring film loading board; 320. Connecting plate; 321. Rack; 322. Roller; 323. Sensor sheet;

[0036] 400. Monitoring plate switching module; 401. Switching input shaft; 411. Grooved wheel; 4111. Radial groove; 4112. Concave locking anti-arc part; 4113. Gear; 412. Active dial; 4121. Eccentric follower part; 4122. Convex locking anti-arc part; 421. Trapezoidal lead screw; 422. Lead screw nut;

[0037] 500, Driver module; 600, Monitoring chip. Detailed Implementation

[0038] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, and not all of the structures.

[0039] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0040] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0041] In the description of this embodiment, the terms "upper," "lower," "right," and "left," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention. In addition, the terms "first" and "second" are used only for distinction in description and have no special meaning.

[0042] During vacuum coating machine operation, the probe end can acquire real-time information such as film deposition thickness and deposition rate. During use, as film material continuously deposits on the surface of the monitoring chip, it eventually becomes unusable and unable to acquire accurate data. Therefore, the failed monitoring chip within the probe end needs to be replaced with an unused one to continue the coating monitoring task. Thus, the probe end typically carries multiple monitoring chips, such as those made of quartz, and these chips must be able to automatically switch between each other. Understandably, the monitoring chips can be crystal control chips or light control chips.

[0043] like Figures 1 to 11 As shown, this invention discloses a coating monitoring mechanism, including a housing 100, a monitoring module 200, a monitoring sheet loading module 300, and a monitoring sheet switching module 400. The coating monitoring mechanism is installed inside a coating machine to monitor coating-related parameters in real time. The monitoring module 200 includes a monitoring end 210, which corresponds to a monitoring hole 111 opened on the housing 100. The monitoring end 210 is used to acquire information related to the film thickness on the monitoring sheet 600. The monitoring sheet loading module 300 includes a monitoring sheet loading plate 310, which has multiple monitoring positions, at least some of which are arranged linearly along a first direction. These monitoring positions are used to place the monitoring sheets 600. The monitoring sheet switching module 400 enables the monitoring sheet loading plate 310 to move linearly relative to the housing 100 along the first direction, so that the monitoring sheets 600 in the first direction can sequentially face the monitoring holes 111, achieving free switching of the linear positions of multiple monitoring sheets 600. It can replace the existing method of using pneumatic rotary switching to switch monitoring plates. Since the rotary switching device is large in size and width, it will occupy more coating space and affect coating capacity. Therefore, using linear switching is more space-saving and convenient for structural control.

[0044] Specifically, the information related to film thickness depends on the working principle of the film thickness monitoring device. For crystal vibration monitoring, the information related to film thickness is the quality information of the monitoring plate 600 and the film attached to it; for optical film thickness monitoring, the information related to film thickness is the optical film thickness information of the monitoring plate 600 and the film attached to it. Understandably, any information from which film thickness can be calculated or extracted using certain technical means can be considered information related to film thickness. When the monitoring plate 600 moves to face the monitoring hole 111, it can cooperate with the monitoring module 200 to monitor the coating thickness and deposition rate in real time.

[0045] In this embodiment, the monitoring module 200 further includes a monitoring component and a mounting plate 220. The mounting plate 220 is fixed to the inner wall of the housing 100, and the monitoring end 210 and the monitoring component are fixed on the mounting plate 220.

[0046] For example, the monitoring chip 600 can be a crystal control chip or a photoelectric control chip. If the monitoring chip 600 is a crystal control chip, the monitoring end 210 abuts against the monitoring chip 600 facing the monitoring hole 111. That is, when the monitoring chips 600 arrive at the monitoring positions in sequence, the monitoring end 210 abuts against the monitoring chips 600. In addition, a contact point can be added between the monitoring chip 600 and the monitoring end 210 to act as an intermediate connector. If the monitoring chip 600 is a photoelectric control chip, there can be a gap between the monitoring end 210 and the monitoring chip 600.

[0047] Furthermore, the outer casing 100 is provided with a detachable anti-fouling plate 110, and a monitoring hole 111 is provided on the anti-fouling plate 110. The anti-fouling plate 110 can be flexibly installed and removed to clean, maintain or replace the monitoring chip loading plate 310 inside at any time. The monitoring chip loading plate 310 is located between the monitoring end 210 and the monitoring hole 111, and is used to connect the monitoring chip 600 and the monitoring end 210, and can detect the coating parameters through the monitoring hole 111.

[0048] Multiple monitoring chips 600 are spaced apart on the monitoring chip loading plate 310, arranged in a straight line along a first direction. A linear guide rail 120 is provided on the inner wall of the outer shell 100, extending parallel to the extension direction of the multiple monitoring chips 600. The monitoring chip loading module 300 also includes a connecting plate 320 and a slider. The connecting plate 320 is fixedly connected to the monitoring chip loading plate 310 and the slider. The slider is slidably connected to the linear guide rail 120 along the first direction, allowing the monitoring chip loading module 300 to move linearly relative to the outer shell 100. Because the monitoring chip loading module 300 is mounted on the linear guide rail 120, the monitoring chip loading plate 310 and the connecting plate 320 move linearly under the drive of the slider, realizing the linear position switching of the monitoring chips 600. When the monitoring chip 600 moves to the position directly opposite the monitoring hole 111, it can cooperate with the monitoring module 200 to monitor the coating thickness and deposition rate in real time.

[0049] Specifically, multiple monitoring plates 600 are evenly distributed along the same straight line. The monitoring plate switching module 400 includes a switching input shaft 401. The switching input shaft 401 rotates to move the connecting plate 320 linearly along a first direction, allowing the multiple monitoring plates 600 to sequentially face the monitoring holes 111, thus realizing the switching of the monitoring plates 600 and the monitoring of related parameters. Simultaneously, the angle between the connecting plate 320 and the monitoring plate loading plate 310 is set to 90°. During the monitoring of film thickness and deposition rate, and without affecting the monitoring effect, the coating monitoring mechanism enables linear free switching of multiple monitoring plates 600. Compared with a rotary switching method, this coating monitoring mechanism is narrower, occupies less coating area inside the coating machine, and reduces the impact on production capacity.

[0050] For example, the monitoring film loading board 310 is configured to have 12 loading positions, corresponding to 12 monitoring films 600 arranged in a straight line.

[0051] In this embodiment, the coating monitoring mechanism also includes a drive module 500, which is installed on the side wall of the housing 100 and includes a stepper motor, a coupling and a reducer. The output shaft of the stepper motor is connected to the input shaft of the reducer through the coupling. The output shaft of the reducer is connected to the switching input shaft 401 of the monitoring chip switching module 400, so as to convert the high speed and low torque output of the stepper motor into a low speed and high torque output suitable for the operation of the monitoring chip switching module 400.

[0052] like Figures 1 to 5 As shown, the monitoring plate switching module 400 includes a grooved wheel 411 and an active dial 412. The active dial 412 is disc-shaped and is provided with an eccentric follower part 4121 and a convex locking arc part 4122. The eccentric follower part 4121 is eccentrically positioned in the circumferential direction of the active dial 412 and can be specifically configured as a cylindrical pin structure, and is fixed to the active dial 412 by threads. The switching input shaft 401 is coaxially fixed with the convex locking arc part 4122. The grooved wheel 411 is rotatably mounted on the inner wall of the housing 100. The axis of rotation of the grooved wheel 411 is parallel to the axis of rotation of the switching input shaft 401. The grooved wheel 411 is provided with multiple radial grooves 4111. The extension direction of the radial grooves 4111 passes through the axis of rotation of the grooved wheel 4111. A concave locking arc part 4112 is provided between two adjacent radial grooves 4111. The rotation of the grooved wheel 411 causes the connecting plate 320 to move linearly.

[0053] When the switching input shaft 401 rotates, the eccentric follower part 4121 can slide into the radial groove 4111, and the eccentric follower part 4121 can drive the grooved wheel 411 to rotate until the eccentric follower part 4121 can slide out of the radial groove 4111, and the eccentric follower part 4121 disengages from the grooved wheel 411. When the eccentric follower part 4121 slides out of the radial groove 4111 and the switching input shaft 401 continues to rotate, the convex locking anti-arc part 4122 and the concave locking anti-arc part 4112 slide in contact, which can realize the mechanism self-locking to make the grooved wheel 411 stationary, that is, the monitoring plate loading plate 310 and the connecting plate 320 stop moving. At this time, the switched monitoring plate 600 is facing the monitoring hole 111 and reaches the working position, and can perform corresponding detection work until the convex locking anti-arc part 4122 and the concave locking anti-arc part 4112 separate. When it is necessary to switch chips again, the above process is repeated. When the convex locking arc part 4122 and the concave locking arc part 4112 separate and the switching input shaft 401 continues to rotate, the eccentric follower part 4121 can slide into the next radial groove 4111. The groove wheel 411 continues to rotate. The stepper motor and the switching input shaft 401 are controlled by the drive module 500 to drive the monitoring chip switching module 400, so as to realize the sequential switching of different monitoring chips 600. With the active dial 412 as the driving wheel, when the switching input shaft 401 drives the active dial 412 to rotate in a central motion, the eccentric follower part 4121 on the active dial 412 drives the grooved wheel 411 to rotate intermittently; when the eccentric follower part 4121 enters the radial groove 4111 of the grooved wheel 411, the convex locking arc part 4122 separates from the concave locking arc part 4112, and the grooved wheel 411 begins to rotate intermittently in one direction under the drive of the active dial 412; when the eccentric follower part 4121 exits the radial groove 4111, the convex locking arc and the concave locking arc are engaged again, and the grooved wheel 411 is locked and no longer rotates, thus realizing the self-locking of the mechanism.

[0054] Furthermore, a gear 4113 is coaxially fixed to the grooved wheel 411, and a rack 321 is provided on the connecting plate 320 along the extension direction of the multiple monitoring segments 600. The stepper motor drives the grooved wheel 411 to rotate intermittently. During the rotation of the grooved wheel 411, the gear 4113 coaxial with it also rotates synchronously. The rotation of the grooved wheel 411 can drive the gear 4113 to mesh with the rack 321, converting the rotational motion into linear motion. The rotation of the gear 4113 drives the rack 321, so that the connecting plate 320 moves linearly. At the same time, the slider connected to the connecting plate 320 moves and limits the entire monitoring segment switching module 400 along the linear guide rail 120, realizing the linear position switching of the monitoring segments 600.

[0055] In this embodiment, the grooved wheel 411 has four radial grooves 4111, and the angle between the extension directions of two adjacent radial grooves 4111 is 90°. When the grooved wheel 411 rotates 90°, the monitoring chip loading module 300 can switch the next monitoring chip 600 to face the monitoring hole 111. The grooved wheel 411 rotates intermittently in one direction under the drive of the active dial 412. The gear 4113, which is coaxially fixed to the grooved wheel 411, rotates synchronously with the grooved wheel 411. When the active dial 412 rotates one revolution, the grooved wheel 411 and the coaxial gear 4113 rotate synchronously one-quarter revolution. The gear 4113 meshes with the rack 321, converting the rotational motion into the linear motion of the rack 321. The single intermittent movement distance of the rack 321 is equal to the arrangement spacing of the monitoring chips 600. Therefore, the intermittent motion further ensures the accuracy of the monitoring chips 600 moving sequentially to the film thickness monitoring position facing the monitoring hole 111.

[0056] Repeating the above steps, the drive module 500 operates in a stepper mode. The output shaft of the stepper motor drives the active dial 412 inside the housing 100 to rotate via a coupling, causing the active dial 412 to rotate centrally. Through the motor drive and mechanism cooperation, the monitoring chip loading plate 310 performs intermittent linear motion on the guide rail, sequentially completing the switching of all the monitoring chips 600. It can achieve switching actions and accurate positioning of any number of monitoring chips 600, and can realize linear switching of monitoring chips 600. It has the advantages of compact structure, high motion accuracy, and stable and reliable operation. Throughout the process, the intermittent movement of the monitoring chip switching module 400 ensures the accuracy of the monitoring chips 600 moving to the film thickness monitoring position in sequence, realizing stable switching and monitoring functions. After the coating monitoring mechanism completes the switching of all the monitoring chips 600, the old and new monitoring chips 600 can be easily replaced by removing the front-mounted anti-fouling plate 110. Under the condition of carrying the same number of wafers, the coating monitoring mechanism in this solution is about 40% narrower than the probe end of the rotary switching mechanism, which effectively reduces the coating area loss.

[0057] In another embodiment of this example, such as Figures 6 to 10 As shown, the monitoring chip switching module 400 may also include a trapezoidal lead screw 421 and a lead screw nut 422. The switching input shaft 401 is coaxially fixed with the trapezoidal lead screw 421, and the lead screw nut 422 is fixed to the connecting plate 320. When the trapezoidal lead screw 421 rotates, the lead screw nut 422 rotates along the axis of the trapezoidal lead screw 421. The axis of the trapezoidal lead screw 421 is parallel to the extension direction of the multiple monitoring chips 600. Using the combination mechanism of the trapezoidal lead screw 421, the position switching action and accurate positioning of the monitoring chip 600 can be realized.

[0058] Similarly, a stepper motor is installed on the inner wall of the outer casing 100, serving as the power source for the switching action of the entire device. The output shaft of the stepper motor is fixedly connected to one end of the trapezoidal lead screw 421 via a coupling. As the power source, the stepper motor's output shaft drives the trapezoidal lead screw 421 to rotate via the coupling. The lead screw nut 422 converts the rotational motion into linear motion, which simultaneously moves linearly along the axis of the trapezoidal lead screw 421 parallel to the extension direction of the multiple monitoring chips 600. Due to the self-locking property of the trapezoidal lead screw 421, the lead screw nut 422 and the connecting plate 320 maintain their stable positions when stationary and will not slide in the opposite direction due to gravity or external forces. At the same time, the connecting plate 320 and the slider slide along the linear guide rail 120, and the single movement distance of the connecting plate 320 driven by the lead screw nut 422 is equal to the distance between two adjacent monitoring chips 600. By repeatedly performing the above steps in one direction to control the movement of the monitoring chip loading plate 310, the sequential switching of all the monitoring chips 600 can be achieved.

[0059] Furthermore, the connecting plate 320 is floatingly connected to the lead screw nut 422 via a threaded pin. While the lead screw nut 422 moves linearly, it drives the connecting plate 320 and the monitoring plate loading plate 310 to move synchronously.

[0060] Optionally, a micro switch 130 is provided on the inner wall of the housing 100, and multiple rollers 322 are provided at intervals along the extension direction of the multiple monitoring pieces 600. The micro switch 130 and the rollers 322 serve as positioning components for confirming the switching position of each monitoring piece 600. The rollers 322 are arranged one-to-one with the monitoring pieces 600 and are arranged horizontally in a line. When one of the monitoring pieces 600 is facing the monitoring hole 111, the corresponding roller 322 is tangent to the micro switch 130 and the corresponding roller 322 presses the micro switch 130. The micro switch 130 is communicatively connected to the monitoring piece switching module 400. For example, twelve rollers 322 are fixed to the long edge of the connecting plate 320. The spacing between the rollers 322 is the same as the spacing between the monitoring chips 600. When the monitoring chip switching module 400 controls the monitoring chip loading plate 310 to reach the preset switching position, one of the rollers 322 presses the micro switch 130 fixed to the inner wall of the housing 100. The monitoring chip switching module 400 confirms whether the monitoring chip 600 has switched to the predetermined position based on the switch signal received from the micro switch 130, so as to avoid affecting the monitoring effect of the monitoring chip 600 due to excessive position deviation and ensure the accuracy of the switching position of the monitoring chip 600.

[0061] In this embodiment, a non-contact sensor 140 for origin positioning is provided on the inner wall of the outer casing 100. The non-contact sensor 140 is mounted directly opposite the short side of the connecting plate 320. A sensing element 323 that cooperates with the non-contact sensor 140 is provided on the edge of the connecting plate 320 and moves linearly with the connecting plate 320. When the first monitoring piece 600 is directly opposite the monitoring hole 111, the sensing element 323 moves into the detection range of the non-contact sensor 140. The sensing element 323 is within the sensing range of the non-contact sensor 140. The non-contact sensor 140 is communicatively connected to the monitoring piece switching module 400. At this time, the monitoring piece switching module 400 knows that the monitoring piece loading plate 310 has moved to the origin position, i.e., the first position of the monitoring piece 600 is directly opposite the monitoring hole 111, based on the sensing signal received from the non-contact sensor 140.

[0062] It is understandable that a non-contact sensor 140 for endpoint positioning can be provided on the other side of the inner wall of the outer casing 100. The principle is the same as described above. A sensing piece 323 corresponding to the last position is provided at the other end of the connecting plate 320. The monitoring piece switching module 400 knows that the monitoring piece loading plate 310 has moved to the endpoint position based on the sensing signal received from another non-contact sensor 140, that is, the last position of the monitoring piece 600 is facing the monitoring hole 111. The coating monitoring mechanism completes the sequential switching of all monitoring pieces 600.

[0063] Alternatively, the PLC control module can synchronously receive the counting signal from the micro switch 130. The electrical signal from the micro switch 130 is sent to the PLC control module outside the probe end, capturing and counting the signal generated each time the micro switch 130 is pressed, thereby accurately counting the number of times the micro switch 130 has been pressed. When the counting signal matches the number of monitored wafers loaded on the monitoring wafer loading plate 310, it also indicates that the coating monitoring mechanism has completed the sequential switching of all monitored wafers 600. The various components cooperate with each other to further realize the functions of switching monitored wafers 600, confirming switching positions, and continuously monitoring coating deposition parameters.

[0064] like Figure 10 and Figure 11As shown, to ensure the monitoring effect of the coating monitoring mechanism during the vacuum coating operation, the monitoring module 200 also includes a cooling assembly 230. The cooling assembly 230 includes a cooling box 231, a lower cooling pipe 232, and an upper cooling pipe 233. The cooling box 231 has a cooling through hole 2311, and the monitoring end 210 is inserted into the cooling through hole 2311. The remaining part of the cooling box 231 is hollow and has a cooling cavity 2312. The lower cooling pipe 232 passes through the bottom wall of the cooling box 231 and communicates with the cooling cavity 2312. The upper cooling pipe 233 passes through the top wall of the cooling box 231 and communicates with the cooling cavity 2312. Cooling liquid enters through the bottom wall of the cooling box 231, fills the cooling cavity 2312, and flows out through the top wall of the cooling box 231. The water-cooled box is fixedly installed behind the monitoring module 200 and close to the monitoring module 200, so that the monitoring module 200 is always at a suitable working temperature and ensures the stability of the monitoring work.

[0065] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art will be able to make various obvious changes, readjustments, and substitutions without departing from the scope of protection of the present invention. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.

Claims

1. A coating monitoring mechanism, characterized in that, include: The outer casing (100) has a monitoring hole (111); The monitoring module (200) includes a monitoring end (210), and the monitoring end (210) is correspondingly set with the monitoring hole (111). The monitoring end (210) is used to acquire information related to the film thickness on the monitoring sheet (600). A monitoring film loading module (300) includes a monitoring film loading plate (310), which has multiple monitoring positions, at least some of which are arranged in a straight line along a first direction. These monitoring positions are used to place the monitoring film. The monitoring chip switching module (400) is used to move the monitoring chip loading plate (310) along the first direction so that the monitoring chips (600) in the first direction can be aligned with the monitoring holes (111) in sequence.

2. The coating monitoring mechanism according to claim 1, characterized in that, The outer casing (100) is provided with a linear guide rail (120), the monitoring chip loading module (300) includes a slider, the monitoring chip loading plate (310) is fixedly connected to the slider, and the slider is slidably connected to the linear guide rail (120) along the first direction.

3. The coating monitoring mechanism according to claim 1, characterized in that, The monitoring chip switching module (400) includes a switching input shaft (401), and the rotation of the switching input shaft (401) can cause the monitoring chip loading plate (310) to move along the first direction.

4. The coating monitoring mechanism according to claim 3, characterized in that, The monitoring chip switching module (400) includes a grooved wheel (411) and an active dial (412). The active dial (412) is provided with an eccentric follower part (4121) and a convex locking arc part (4122). The switching input shaft (401) is coaxially fixed with the convex locking arc part (4122). The grooved wheel (411) is rotatably disposed on the inner wall of the housing (100). The axis of rotation of the grooved wheel (411) is parallel to the axis of rotation of the switching input shaft (401). The grooved wheel (411) is provided with a plurality of radial grooves (4111). The extension direction of the radial grooves (4111) passes through the axis of rotation of the grooved wheel (411). A concave locking arc part (4112) is provided between two adjacent radial grooves (4111). The grooved wheel (411) rotates to make the monitoring chip loading plate (310) move linearly.

5. The coating monitoring mechanism according to claim 4, characterized in that, The grooved wheel (411) is coaxially fixed with a gear (4113), and the monitoring chip loading plate (310) is provided with a rack (321) along the extension direction of the arrangement of the plurality of monitoring chips (600). The rotation of the grooved wheel (411) can drive the gear (4113) to mesh with the rack (321) for transmission, so that the monitoring chip loading plate (310) moves linearly.

6. The coating monitoring mechanism according to claim 4, characterized in that, The radial grooves (4111) are provided in four places. The angle between the extension directions of two adjacent radial grooves (4111) is 90°. When the groove wheel (411) rotates 90°, the monitoring chip loading module (300) can switch the next monitoring chip (600) to face the monitoring hole (111).

7. The coating monitoring mechanism according to claim 1, characterized in that, The monitoring chip switching module (400) includes a lead screw and a lead screw nut (422). When the lead screw rotates, the lead screw nut (422) rotates along the axis of the lead screw. The switching input shaft (401) is fixed coaxially with the lead screw. The axis of the lead screw is parallel to the extension direction of the multiple monitoring chips (600) arranged in a row. The lead screw nut (422) is fixed to the connecting plate (320).

8. The coating monitoring mechanism according to claim 1, characterized in that, The inner wall of the housing (100) is provided with a micro switch (130). The monitoring chip loading plate (310) is provided with a plurality of rollers (322) at intervals along the extension direction of the plurality of monitoring chips (600). The rollers (322) are arranged one-to-one with the monitoring chips (600). When one of the monitoring chips (600) is facing the monitoring hole (111), the corresponding roller (322) is tangent to the micro switch (130) and the corresponding roller (322) presses the micro switch (130). The micro switch (130) is communicatively connected to the monitoring chip switching module (400).

9. The coating monitoring mechanism according to claim 1, characterized in that, The inner wall of the housing (100) is provided with a non-contact sensor (140), and the monitoring chip loading module (300) is provided with a sensing chip (323). When the monitoring chip (600) located at the first position is facing the monitoring hole (111), the sensing chip (323) is within the sensing range of the non-contact sensor (140), and the non-contact sensor (140) is communicatively connected to the monitoring chip switching module (400).

10. The coating monitoring mechanism according to any one of claims 1-9, characterized in that, The monitoring module (200) further includes a cooling assembly (230), which includes a cooling box (231), a lower cooling pipe (232), and an upper cooling pipe (233). The cooling box (231) has a cooling through hole (2311), and the monitoring end (210) is inserted into the cooling through hole (2311). The remaining part of the cooling box (231) is hollow and has a cooling cavity (2312). The lower cooling pipe (232) passes through the bottom wall of the cooling box (231) and communicates with the cooling cavity (2312). The upper cooling pipe (233) passes through the top wall of the cooling box (231) and communicates with the cooling cavity (2312).

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