Growth equipment and growth method of multiple epitaxial layers

Abstract

The invention relates to the technical field of semiconductor material preparation, in particular to a multi-epitaxial-layer growth device and method, and the device comprises a processing box, a partition plate, a reaction ventilation mechanism, and a heating plate. The machining assembly comprises a transposition support, bottom frames, placing discs, a lower partition component, a transposition component and a guide component, the transposition support is rotationally installed in the machining box, the bottom frames are slidably installed on the outer side of the transposition support, the placing discs are fixedly installed on the bottom frames, the lower partition component is installed on the machining box, and the transposition component is fixedly installed on the lower partition component. The partition plates are installed in the machining box and used for being matched with the partition plates to completely isolate a plurality of divided small areas, the guide component is installed in the machining box and used for guiding the bottom frame on the transposition support to move, and the machining quality of workpieces can be guaranteed while the machining efficiency of the workpieces is maintained through the growth equipment and the growth method.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor material preparation, in particular to a multi-epitaxial layer growth device and a growth method. BACKGROUND

[0002] Multi-epitaxial layer growth is a technology for growing single-crystal thin film materials with controllable thickness and doping concentration in a multilayer structure on a single-crystal substrate. In actual operation, by controlling growth conditions such as temperature, atmosphere, and material source flow, atomic or molecular layer-by-layer adsorption, migration, and arrangement on the substrate surface are realized to accurately control the thickness, composition, and doping concentration of each epitaxial layer. A multi-epitaxial layer growth device is core equipment in semiconductor manufacturing for depositing a multilayer crystal coating (epitaxial layer) on a substrate. It realizes the growth of high-quality multilayer epitaxial structures by precisely controlling gas passage, doping element concentration, and temperature distribution.

[0003] Existing multi-epitaxial layer growth devices are mainly divided into single-piece epitaxial furnaces and multi-piece epitaxial furnaces. Single-piece epitaxial furnaces are characterized by high uniformity and low defect rate, but have low production efficiency. Multi-piece epitaxial furnaces have significant production capacity advantages, but have difficulty in controlling inter-piece uniformity and have low yield, resulting in the inability of existing multi-epitaxial layer growth devices to combine the advantages and disadvantages of single-piece epitaxial furnaces and multi-piece epitaxial furnaces, to improve actual processing efficiency while ensuring processing quality, and to enable high-quality and high-efficiency processing in actual operation. SUMMARY

[0004] The present application aims to provide a multi-epitaxial layer growth device and a growth method that can maintain the processing efficiency of a workpiece while ensuring the processing quality of the workpiece.

[0005] To achieve the above-mentioned purpose, the present application provides a multi-epitaxial layer growth device, which comprises a processing box, partitioning partitions, a reaction gas supply mechanism, and heating plates. A plurality of partitioning partitions are fixedly installed in the processing box, dividing the half area of the processing box into a plurality of small areas. A plurality of heating plates are installed in the same small area formed by the processing box and the corresponding two partitioning partitions. This area is the processing area. The reaction gas supply mechanism is installed on the processing box and communicates with the processing area. The device further comprises a processing assembly.

[0006] The processing assembly comprises an indexing support, a base, a resting disc, a lower partitioning member, an indexing member, and a guide member. The indexing support is rotatably installed in the processing box. A plurality of bases are slidably installed on the outer side of the indexing support. Each base is fixedly installed with a resting disc. The lower partitioning member is installed on the processing box and cooperates with the partitioning partitions to completely separate the plurality of small areas. The guide member is installed in the processing box to guide the movement of the bases on the indexing support.

[0007] The lower partition member comprises a blocking plate, a lower pressing plate and a lower pressing cylinder, the blocking plate is installed between every two partition plates, all the blocking plates are fixedly installed below the lower pressing plate, the lower pressing plate is slidingly installed on the top of the processing box, the output end of the lower pressing cylinder is connected with the lower pressing plate, and the lower pressing cylinder is fixedly installed on the processing box.

[0008] The rotating member comprises a rotating sleeve, a sleeving gear, a rotating gear and a rotating motor, the rotating sleeve is fixedly connected with the rotating support and is rotatably installed on the processing box, the sleeving gear is fixedly sleeved on the rotating sleeve, the rotating gear is engaged with the sleeving gear and is rotatably installed on the bottom of the processing box, the output shaft of the rotating motor is connected with the rotating gear, and the rotating motor is fixedly installed on the bottom of the processing box.

[0009] The guide member comprises a guide groove ring support, a guide block, a ball and a transposition component, the guide groove ring support is fixedly installed in the processing box, the guide block is fixedly arranged on the bottom of each bottom frame and slidingly arranged in the guide groove ring support, the ball is arranged on the upper side and the lower side of each guide block, the ball makes the guide block more smoothly slide in the guide groove ring support, and the transposition component is arranged on the guide groove ring support and used for changing the sliding height of the bottom frame on the guide groove ring support.

[0010] The transposition component comprises a jacking frame and a jacking cylinder, two jacking frames are slidingly installed on the two sides of the guide groove ring support, the jacking cylinder is arranged below each jacking frame, the output end of the jacking cylinder is connected with the corresponding jacking frame, and the jacking cylinder is fixedly installed on the bottom of the processing box.

[0011] The processing assembly further comprises a rotating door plate, a heat absorbing support, a heat absorbing fan, a gas control component and a sealing component, the rotating door plate is arranged on the processing box, the heat absorbing support is fixedly installed on the processing box, the heat absorbing fan is connected with the heat absorbing support and fixedly installed on the processing box, the gas control component is installed on the processing box and used for controlling the heat flow in the processing box, and the sealing component is installed on the processing box and used for saving heat in a specified station during station conversion.

[0012] The gas control component comprises a shielding ring block, an outer gear base, a driving gear and a driving motor, the shielding ring block is installed in the processing box, the outer gear base is fixedly installed outside the shielding ring block, the driving gear is engaged with the outer gear base and is rotatably installed on one side of the processing box, and the output shaft of the driving motor is connected with the driving gear, and the driving motor is fixedly installed on the processing box.

[0013] The sealing component comprises an outer sealing box, a guiding support and a sliding sealing plate, the outer sealing box is fixedly installed outside the processing box, the guiding support is fixedly installed on one side of the processing box close to the outer sealing box, and the sliding sealing plate is arranged in the outer sealing box and is slidably connected with the guiding support.

[0014] The sealing component further comprises a guiding screw rod and a guiding motor, the guiding screw rod is threadedly connected with the sliding sealing plate and is rotatably installed in the outer sealing box, and the output shaft of the guiding motor is connected with the guiding screw rod, and the guiding motor is fixedly installed outside the outer sealing box.

[0015] A growth method of a plurality of epitaxial layers and a growth device of the plurality of epitaxial layers are provided.

[0016] The workpiece is placed on the resting disc, and then the rotation of the indexing support and the indexing member drives the bottom frame and the workpiece on the resting disc to rotate in the processing box.

[0017] When the workpiece on the resting disc is transferred to the processing area, the plurality of small areas separated by the plurality of partition plates are isolated by the lower partition member.

[0018] After the plurality of small areas are separated, the heating plate and the reaction aeration mechanism arranged in the processing area perform epitaxial growth processing on the workpiece on the resting disc in the processing area.

[0019] After the workpiece in the processing area is processed, the workpiece in the processing area is transferred out of the processing area by the lower partition member, the indexing member and the guide member.

[0020] After the workpiece in the processing area is transferred, the subsequent workpiece can enter the processing area for processing, and when the workpiece in the processing area is processed, the workpiece in the subsequent small area can be preheated by the heat in the processing area to ensure continuous and rapid processing of the plurality of workpieces in the processing box.

[0021] The growth equipment of the multiple epitaxial layers of the application, in actual operation, first places the workpiece on the resting disc, then drives the bottom frame and the workpiece on the resting disc in the processing box to rotate through the rotation of the indexing member cooperating with the indexing support, when the workpiece on the resting disc is transferred to the processing area, the multiple small areas separated by the multiple partition plates are isolated through the lower partition member, after separating the multiple small areas, the heating plate and the reaction aeration mechanism arranged in the processing area perform epitaxial growth processing on the workpiece on the resting disc in the processing area, after the workpiece in the processing area is processed, the workpiece in the processing area is transferred out of the processing area through the lower partition member cooperating with the indexing member and the guide member, after the workpiece in the processing area is transferred, the subsequent workpiece can enter the processing area for processing, and when the workpiece in the processing area is processed, the workpiece in the subsequent small area can be preheated by the heat inside the processing area, so as to ensure the continuous and rapid processing of multiple workpieces in the processing box, and the processing quality of the workpiece is ensured while the processing efficiency of the workpiece is maintained through the growth equipment and the growth method arranged. BRIEF DESCRIPTION OF DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced.

[0023] Figure 1 is a structural schematic diagram of the bottom of the growth equipment of the multiple epitaxial layers of the present application.

[0024] Figure 2 is a structural schematic diagram of the bottom of the growth equipment of the multiple epitaxial layers of the present application.

[0025] Figure 3 is a structural schematic diagram of the side of the processing box after being cut open.

[0026] Figure 4 is a structural schematic diagram of the guide groove ring frame after being cut open.

[0027] Figure 5 is an enlarged view of A of the present application. Figure 4

[0028] Figure 6 is a structural schematic diagram of the top of the processing box after being cut open.

[0029] Figure 7 is a structural schematic diagram of the side of the processing box and the outer sealing box after being cut open.

[0030] Figure 8 is a flow chart of the growth method of the multiple epitaxial layers of the present application.

[0031] ​In the figure: 101 - processing box, 102 - partitioning partition, 103 - reaction ventilation mechanism, 104 - heating plate, 105 - indexing support, 106 - base frame, 107 - resting disc, 201 - blocking plate, 202 - lower pressing plate, 203 - lower pressing cylinder, 301 - rotating sleeve, 302 - sleeve gear, 303 - rotating gear, 304 - rotating motor, 401 - guide groove ring frame, 402 - guide block, 403 - ball, 404 - jacking frame, 405 - jacking cylinder, 501 - rotating door plate, 502 - heat absorption support, 503 - heat absorption fan, 601 - shielding ring block, 602 - outer tooth table, 603 - driving gear, 604 - driving motor, 701 - outer sealing box, 702 - guide support, 703 - sliding sealing plate, 704 - guide screw rod, 705 - guide motor. DETAILED DESCRIPTION

[0032] Embodiments of the present application are described below in detail with reference to the accompanying drawings, wherein the same or similar components or components having the same or similar functions are denoted by the same or similar reference numerals throughout. The embodiments described below by reference to the accompanying drawings are exemplary and are intended to explain the present application, and cannot be understood as limiting the present application.

[0033] In the description of the present application, it is understood that the meaning of "a plurality of" is two or more, unless otherwise explicitly and specifically limited.

[0034] Please refer to Figure 1 The present application provides a multi-epitaxial layer growth equipment and growth method: including a processing box 101, a partitioning partition 102, a reaction ventilation mechanism 103, a heating plate 104 and a processing assembly, the processing assembly includes an indexing support 105, a base frame 106, a resting disc 107, a lower partitioning member, an indexing member and a guide member, the lower partitioning member includes a blocking plate 201, a lower pressing plate 202 and a lower pressing cylinder 203, the indexing member includes a rotating sleeve 301, a sleeve gear 302, a rotating gear 303 and a rotating motor 304, the guide member includes a guide groove ring frame 401, a guide block 402, a ball 403 and a transposition component, the transposition component includes a jacking frame 404 and a jacking cylinder 405, the foregoing scheme solves the problem that the existing multi-epitaxial layer growth equipment is mainly divided into single wafer epitaxial furnace and multi-wafer epitaxial furnace, the single wafer epitaxial furnace is good at high uniformity and low defect rate, but the production efficiency is low, and the multi-wafer epitaxial furnace has significant production capacity advantage, but the wafer uniformity control is difficult and the yield is low, so that the existing multi-epitaxial layer growth equipment cannot comprehensively combine the advantages and disadvantages of single wafer epitaxial furnace and multi-wafer epitaxial furnace, and the actual processing efficiency is improved while ensuring the generation quality, so that high-quality and high-efficiency processing can be realized in actual operation.

[0035] Further, a plurality of the partitioning plates 102 are fixedly installed in the processing box 101, so as to divide the half side area of the processing box 101 into a plurality of small areas, a plurality of the heating plates 104 are installed in the same small area formed by the processing box 101 and the corresponding two partitioning plates 102, which is the processing area, the reaction gas feeding mechanism 103 is installed on the processing box 101 and communicates with the processing area, the processing assembly comprises an indexing support 105, a base frame 106, a resting disc 107, a lower partitioning member, an indexing member and a guide member, the indexing support 105 is rotatably installed in the processing box 101, a plurality of the base frames 106 are slidably installed outside the indexing support 105, the resting disc 107 is fixedly installed on each base frame 106, the lower partitioning member is installed on the processing box 101 and cooperates with the partitioning plates 102 to completely separate the plurality of small areas, and the guide member is installed in the processing box 101 and guides the base frame 106 on the indexing support 105 to move.

[0036] Specifically, the reaction gas feeding mechanism 103 is a device for gas discharge, through a plurality of gas passages and a switching valve system, the flow ratio of the doping elements (such as Si and Mg) and the bulk material (such as GaN and SiC) is dynamically adjusted, so as to realize the layered growth of different doping concentrations or components, the heating plate 104 is a module for rapid heating, the inside of the processing box 101 is divided into a plurality of same independent spaces by the plurality of partitioning plates 102, the two foremost and last end areas are the material receiving area and the processing area respectively, and the preheating area is between the processing area and the material receiving area, and the plurality of heating plates 104 are arranged in the processing area to realize rapid heating in the processing area.

[0037] The indexing support 105 is provided with a plurality of branches, in the present scheme, the indexing support 105 is provided with twelve branches in total, one base frame 106 is slidably installed on each branch, the base frame 106 cooperates with the corresponding branch of the indexing support 105 through the sliding groove, so that the base frame 106 can slide up and down on the indexing support 105, and the resting disc 107 is fixed on each base frame 106, the resting disc 107 is provided with a placing groove on the top for placing the workpiece, so that the user can directly place the workpiece to be processed in the placing groove on the resting disc 107.

[0038] In actual operation, first, the workpiece is placed on the resting disc 107, and then the workpiece on the resting disc 107 is driven to rotate in the machining box 101 by the rotation of the indexing support 105 cooperating with the rotation of the indexing member, when the workpiece on the resting disc 107 is transferred to the machining area, the plurality of small areas separated by the plurality of partition plates 102 are isolated by the lower partition member, after the plurality of small areas are separated, the heating plate 104 and the reaction aeration mechanism 103 in the machining area perform epitaxial growth processing on the workpiece on the resting disc 107 in the machining area, after the workpiece in the machining area is processed, the workpiece in the machining area is transferred out of the machining area by the lower partition member cooperating with the indexing member and the guide member, after the workpiece in the machining area is transferred, the subsequent workpiece can enter the machining area for processing, and when the workpiece in the machining area is processed, the workpiece in the subsequent small area can be preheated by the heat inside the machining area to ensure the continuous and rapid processing of the plurality of workpieces in the machining box 101, and the processing quality of the workpiece is ensured while maintaining the processing efficiency of the workpiece by the growth equipment and the growth method.

[0039] Please refer to Figure 3 Further, the blocking plate 201 is installed between every two partition plates 102, all the blocking plates 201 are fixedly installed below the lower pressing plate 202, the lower pressing plate 202 is slidingly installed on the top of the machining box 101, the output end of the lower pressing cylinder 203 is connected with the lower pressing plate 202, and the lower pressing cylinder 203 is fixedly installed on the machining box 101.

[0040] In use, the blocking plate 201 is arranged between two partition plates 102, the plurality of partition plates 102 are fixed below the lower pressing plate 202, the lower pressing plate 202 is driven by the lower pressing cylinder 203, and the lower pressing plate 202 and the blocking plate 201 can slide up and down on the machining box 101 by the lower pressing cylinder 203.

[0041] When the plurality of sets of the base frame 106 and the resting disc 107 arranged on the indexing support 105 rotate, the blocking plate 201 is driven by the lower pressing plate 202 and the lower pressing cylinder 203 to move upwards to avoid affecting the rotation of the base frame 106 and the resting disc 107, and when the indexing support 105 completes a position conversion, the blocking plate 201 is driven by the lower pressing plate 202 and the lower pressing cylinder 203 to move downwards to separate the machining area, the receiving area and the plurality of preheating areas between the machining area and the receiving area, and ensure the stable processing of the workpiece in the machining area.

[0042] Please refer to Figure 2 Further, the rotating sleeve 301 is fixedly connected with the indexing support 105 and is rotatably installed on the machining box 101; the sleeve gear 302 is fixedly sleeved on the rotating sleeve 301; the rotating gear 303 is engaged with the sleeve gear 302 and is rotatably installed at the bottom of the machining box 101; the output shaft of the rotating motor 304 is connected with the rotating gear 303, and the rotating motor 304 is fixedly installed at the bottom of the machining box 101.

[0043] In use, the rotating sleeve 301 is matched with the annular groove arranged in the machining box 101, the sleeve gear 302 is fixedly sleeved at the bottom of the rotating sleeve 301, the sleeve gear 302 is engaged with the rotating gear 303 rotatably installed at the bottom of the machining box 101, the rotating gear 303 is driven by the rotating motor 304, when the rotating motor 304 drives the rotating gear 303 to rotate, the rotating gear 303 can drive the sleeve gear 302 and the rotating sleeve 301 to rotate, and further drive the indexing support 105 to rotate in the machining box 101, so that the user can directly control the rotating motor 304 to drive the indexing support 105, thereby realizing the process conversion of the plurality of bottom frames 106 and the rest plates 107 on the indexing support 105.

[0044] Please refer to Figure 4 and Figure 5 Further, the guide groove ring frame 401 is fixedly installed in the machining box 101; each bottom frame 106 is fixedly provided with the guide block 402, and the guide block 402 is slidingly arranged in the guide groove ring frame 401; the guide block 402 is provided with the rolling ball 403 on the upper and lower sides, so that the guide block 402 slides in the guide groove ring frame 401 more smoothly; the indexing component is arranged on the guide groove ring frame 401 and is used for changing the sliding height of the bottom frame 106 on the guide groove ring frame 401 in cooperation with the guide block 402.

[0045] Further, two lifting frames 404 are slidingly installed on the two sides of the guide groove ring frame 401; the lifting cylinder 405 is arranged below each lifting frame 404, the output end of the lifting cylinder 405 is connected with the corresponding lifting frame 404, and the lifting cylinder 405 is fixedly installed at the bottom of the machining box 101.

[0046] The guide groove ring frame 401 is fixed at the bottom of the processing box 101, and the guide groove ring frame 401 is provided with a corresponding annular guide groove. The annular guide groove provided on the guide groove ring frame 401 is matched with the connecting support at the bottom of the bottom frame 106. The annular guide groove provided on the guide groove ring frame 401 is divided into upper and lower annular grooves. The upper annular groove is matched with the half region of the processing box 101 in which the partition plate 102 is fixed. The lower annular groove is matched with the half region of the processing box 101 in which the partition plate 102 is not arranged.

[0047] The connecting support at the bottom of the bottom frame 106 is fixed with the guide block 402 at the position matched with the annular groove of the guide groove ring frame 401. Each guide block 402 is matched with the annular groove in the guide groove ring frame 401. The guide block 402 is further provided with the ball 403 on the upper and lower sides. The ball 403 can make the guide block 402 slide more smoothly in the annular groove of the guide groove ring frame 401.

[0048] The guide groove ring frame 401 is provided with a vertical groove for connecting the upper and lower annular grooves at the position corresponding to the processing area and the material receiving area. Two jack frames 404 are respectively and slidably arranged at the positions of the guide groove ring frame 401 corresponding to the processing area and the material receiving area. Each jack frame 404 is driven by the corresponding jack cylinder 405.

[0049] The guide block 402 in the material receiving area is lifted by the jack frame 404 and the jack cylinder 405. The guide block 402 in the processing area can be lifted by the corresponding jack frame 404 during processing. When the workpiece in the processing area is finished processing, the jack frame 404 arranged in the processing area can be lowered under the drive of the corresponding jack cylinder 405. Then the guide block 402, the corresponding bottom frame 106 and the resting disc 107 are lowered under the action of their own weight, so as to realize the alternating matching of the guide block 402 and the upper and lower annular grooves. Since the bottom frame 106 and the resting disc 107 arranged on the adjacent two stations have a certain conversion distance, when the guide block 402 and the corresponding bottom frame 106 and the resting disc 107 are alternately connected in the upper and lower annular grooves, the jack frame 404 can be lowered under the drive of the jack cylinder 405 after lifting the corresponding guide block 402, so as to lift the guide block 402 transferred subsequently. The lowering and guiding of the guide block 402 in the processing area and the lifting of the material receiving area have the same principle, so that the upper and lower annular grooves of the guide block 402 can be smoothly converted.

[0050] When the guide block 402 drives the corresponding chassis 106 and the resting disc 107 to rotate on the guide of the ring groove of the guide groove ring frame 401, the chassis 106 and the resting disc 107 can cooperate with the small area composed of the processing area, the material receiving area and the plurality of preheating areas inside the processing box 101, and when the guide block 402 drives the corresponding chassis 106 and the resting disc 107 to rotate on the guide of the ring groove below the guide groove ring frame 401, the chassis 106 and the resting disc 107 will cooperate with the remaining half area of the processing box 101, and the remaining half area is the heat dissipation area.

[0051] Preferably, referring to Figure 1 , the processing assembly provided by the application further comprises a rotating door plate 501, a heat absorption support 502, a heat absorption fan 503, a gas control component and a sealing component, the gas control component comprises a shielding ring block 601, an outer toothed table 602, a driving gear 603 and a driving motor 604, the sealing component comprises an outer sealing box 701, a guide support 702 and a sliding sealing plate 703, and the sealing component further comprises a guide lead screw 704 and a guide motor 705.

[0052] Referring to Figure 1 , further, the rotating door plate 501 is arranged on the processing box 101; the heat absorption support 502 is fixedly installed on the processing box 101; the heat absorption fan 503 is connected with the heat absorption support 502 and is fixedly installed on the processing box 101; the gas control component is installed on the processing box 101 and is used for controlling the heat flow in the processing box 101; and the sealing component is installed on the processing box 101 and is used for saving heat in a specified station during station conversion.

[0053] In use, the heat absorption support 502 is arranged at the position where the heat dissipation area and the material receiving area meet, the heat absorption support 502 is in communication with the air inlet end of the heat absorption fan 503, the heat absorption fan 503 cooperates with the heat absorption support 502 to accelerate heat dissipation of the heat dissipation area in the processing box 101, the rotating door plate 501 is arranged on the side of the area where the heat absorption support 502 is installed, corresponding handles are arranged on the rotating door plate 501, so that the user can operate more easily and quickly, and the empty slot arranged on the processing box 101 is opened through rotation of the rotating door plate 501, thereby facilitating the user to load and unload materials;

[0054] The processing area, the heat dissipation area and the material receiving area inside the processing box 101 are communicated through the air guide grooves arranged on the inner wall. The heat inside the processing area is continuously transmitted to the preheating area through the arranged air guide grooves. The farther from the processing area, the less the transmitted heat is, so that the workpieces in the preheating area can be heated in sequence, avoiding the influence of the workpieces due to the rapid heating.

[0055] Please refer to Figure 6 Further, the shielding ring block 601 is installed in the processing box 101, the outer gear table 602 is fixedly installed outside the shielding ring block 601, the driving gear 603 is engaged with the outer gear table 602 and is rotatably installed on one side of the processing box 101, and the output shaft of the driving motor 604 is connected with the driving gear 603, and the driving motor 604 is fixedly installed on the processing box 101.

[0056] In use, the shielding ring block 601 is arranged in the air guide groove for communication with the subsequent preheating area, the outer gear table 602 is fixed outside the shielding ring block 601, the tooth groove of the driving gear 603 is matched with the outer gear table 602 fixed outside the shielding ring block 601, the driving gear 603 is driven by the driving motor 604, and when the driving motor 604 drives the driving gear 603 to rotate, the driving gear 603 can drive the shielding ring block by cooperating with the outer gear table 602 outside the shielding ring block 601, so as to control the opening size of the air guide groove on the side of the processing area.

[0057] The heat inside the subsequent preheating area is regulated by regulating the opening size of the air guide groove on the side of the processing area, so that the user can control the heat export of the preheating area according to the actual situation.

[0058] Please refer to Figure 7 Further, the outer sealing box 701 is fixedly installed outside the processing box 101, the guide bracket 702 is fixedly installed on one side of the processing box 101 close to the outer sealing box 701, the sliding sealing plate 703 is arranged in the outer sealing box 701, and the sliding sealing plate 703 is slidably connected with the guide bracket 702.

[0059] Further, the guide screw rod 704 is threadedly connected with the sliding sealing plate 703 and is rotatably installed in the outer sealing box 701, the output shaft of the guide motor 705 is connected with the guide screw rod 704, and the guide motor 705 is fixedly installed outside the outer sealing box 701.

[0060] The machining box 101 is fixed with the outer sealing box 701 outside the corresponding position of the machining area, the outer sealing box 701 is fixed with the guide bracket 702, the sliding sealing plate 703 is slidingly arranged on the guide bracket 702, and the machining area of the machining box 101 is provided with a sliding groove matched with the sliding sealing plate 703, so that the sliding sealing plate 703 can slide on one side of the machining box 101.

[0061] The plate block on the rear side of the sliding sealing plate 703 is provided with a threaded hole matched with the guide screw rod 704, the guide screw rod 704 is driven by the guide motor 705, and when the guide motor 705 drives the guide screw rod 704 to rotate, the sliding sealing plate 703 can slide under the drive of the guide screw rod 704.

[0062] The upper and lower areas of the machining area can be divided by sliding the sliding sealing plate 703, when the bottom frame 106 and the resting disc 107 in the machining area need to be moved downward, the heating area on the upper side of the machining area can be divided in advance by sliding the sliding sealing plate 703, so as to avoid excessive heat loss in the machining area, and when the subsequent workpiece continues to enter the machining area, the sliding sealing plate 703 can slide to make the heat at the top of the machining area quickly cooperate with the workpiece in the machining area, so as to complete the rapid and stable processing of the workpiece in the machining area.

[0063] Please refer to Figure 8 , a method for growing multiple epitaxial layers, using the multiple epitaxial layer growth device, comprising the following steps:

[0064] S1: Place the workpiece on the resting disc 107, and then drive the workpiece on the bottom frame 106 and the resting disc 107 to rotate in the machining box 101 by the rotation of the indexing member cooperating with the indexing bracket 105;

[0065] S2: When the workpiece on the resting disc 107 is transferred to the machining area, isolate the multiple small areas divided by the multiple partition plates 102 by the lower partition member;

[0066] S3: After the multiple small areas are separated, the heating plate 104 and the reaction gas mechanism 103 arranged in the machining area perform epitaxial growth processing on the workpiece on the resting disc 107 in the machining area;

[0067] S4: After the workpiece in the machining area is processed, the workpiece in the machining area is transferred out of the machining area by the lower partition member cooperating with the indexing member and the guide member;

[0068] S5: After the workpiece in the processing area is transferred, the subsequent workpiece can enter the processing area for processing, and when the workpiece in the processing area is processed, the workpiece in the subsequent small area can be preheated by the heat inside the processing area to ensure continuous and rapid processing of multiple workpieces in the entire processing box 101.

[0069] The above disclosure is only one or more preferred embodiments of the present application, and cannot limit the scope of the rights of the present application. Those skilled in the art can understand that all or part of the above-mentioned embodiments can be implemented, and equivalent changes made according to the claims of the present application still belong to the scope covered by the present application.

Claims

1. A multi-epitaxy layer growth apparatus, comprising a processing chamber, partitions, a reaction ventilation mechanism, and heating plates, wherein multiple partitions are fixedly installed inside the processing chamber, dividing one half of the processing chamber into multiple small areas; multiple heating plates are installed within the same small area formed by the processing chamber and corresponding two partitions, this area being the processing zone; the reaction ventilation mechanism is installed on the processing chamber and communicates with the processing zone, characterized in that... It also includes processing components; The processing assembly includes a rotation bracket, a base frame, a shelf, a lower partition, a rotation component, and a guide component. The rotation bracket is rotatably installed inside the processing box. Multiple base frames are slidably installed on the outside of the rotation bracket. Each base frame is fixedly installed with the shelf. The lower partition is installed on the processing box and is used to completely isolate multiple small areas in conjunction with the partition plate. The guide component is installed inside the processing box and is used to guide the movement of the base frames on the rotation bracket.

2. The multi-epipolar layer growth apparatus as described in claim 1, characterized in that, The lower partition component includes a baffle plate, a lower pressure plate, and a lower pressure cylinder. The baffle plate is installed between every two partition plates. All the baffle plates are fixedly installed below the lower pressure plate. The lower pressure plate is slidably installed on the top of the processing box. The output end of the lower pressure cylinder is connected to the lower pressure plate, and the lower pressure cylinder is fixedly installed on the processing box.

3. The multi-epipolar layer growth apparatus as described in claim 1, characterized in that, The indexing component includes a rotating sleeve, a sleeve gear, a rotating gear, and a rotating motor. The rotating sleeve is fixedly connected to the indexing bracket and rotatably mounted on the processing box. The sleeve gear is fixedly sleeved on the rotating sleeve. The rotating gear meshes with the sleeve gear and is rotatably mounted on the bottom of the processing box. The output shaft of the rotating motor is connected to the rotating gear, and the rotating motor is fixedly mounted on the bottom of the processing box.

4. The multi-epipolar layer growth apparatus as described in claim 1, characterized in that, The guiding component includes a guide groove ring frame, guide blocks, ball bearings, and a shifting component. The guide groove ring frame is fixedly installed inside the processing box. Each base frame has a guide block fixed to its bottom, and the guide block is slidably disposed within the guide groove ring frame. Each guide block has ball bearings on its upper and lower sides, which make the guide block slide more smoothly within the guide groove ring frame. The shifting component is disposed on the guide groove ring frame and is used to cooperate with the guide block to change the sliding height of the base frame on the guide groove ring frame.

5. The multi-epipolar layer growth apparatus as described in claim 4, characterized in that, The shifting component includes a lifting frame and a lifting cylinder. The two lifting frames are slidably installed on both sides of the guide groove ring frame. Each lifting frame is provided with a lifting cylinder below it. The output end of the lifting cylinder is connected to the corresponding lifting frame. The lifting cylinder is fixedly installed at the bottom of the processing box.

6. The multi-epipolar layer growth apparatus as described in claim 1, characterized in that, The processing assembly also includes a rotating door panel, a heat-absorbing bracket, a heat-absorbing fan, an air control component, and a sealing component. The rotating door panel is mounted on the processing box; the heat-absorbing bracket is fixedly mounted on the processing box; the heat-absorbing fan is connected to the heat-absorbing bracket and fixedly mounted on the processing box; the air control component is mounted on the processing box and is used to regulate the flow of hot air inside the processing box; the sealing component is mounted on the processing box and is used to retain the heat in the designated workstation during workstation switching.

7. The multi-epipolar layer growth apparatus as described in claim 6, characterized in that, The air control component includes a shielding ring block, an external gear platform, a drive gear, and a drive motor. The shielding ring block is installed inside the processing box. The external gear platform is fixedly installed on the outside of the shielding ring block. The drive gear meshes with the external gear platform and is rotatably installed on one side of the processing box. The output shaft of the drive motor is connected to the drive gear, and the drive motor is fixedly installed on the processing box.

8. The multi-epipolar layer growth apparatus as described in claim 6, characterized in that, The sealing component includes an outer sealing box, a guide bracket, and a sliding sealing plate. The outer sealing box is fixedly installed on the outside of the processing box; the guide bracket is fixedly installed on the side of the processing box near the outer sealing box; the sliding sealing plate is disposed inside the outer sealing box and is slidably connected to the guide bracket.

9. The multi-epipolar layer growth apparatus as described in claim 8, characterized in that, The sealing component also includes a guide screw and a guide motor. The guide screw is threadedly connected to the sliding sealing plate and is rotatably installed inside the outer sealing box. The output shaft of the guide motor is connected to the guide screw, and the guide motor is fixedly installed on the outside of the outer sealing box.

10. A method for growing multiple epitaxial layers, using the multi-epitaxy layer growth apparatus as described in claim 1, characterized in that, Includes the following steps, The workpiece is placed on the shelf, and then the rotation of the indexing bracket and the indexing component drives the base frame and the workpiece on the shelf to rotate in the processing box. When the workpiece on the shelf is transferred to the processing area, the lower partition member isolates multiple small areas divided by multiple partition plates. After dividing the area into multiple small regions, the heating plate and reaction ventilation mechanism set in the processing area perform epitaxial growth processing on the workpiece on the shelf located in the processing area. After the workpiece in the processing area is processed, the workpiece located in the processing area is transferred out of the processing area by the lower partition member in conjunction with the indexing member and the guide member. After the workpiece is transferred in the processing area, the subsequent workpiece can enter the processing area for processing. When the workpiece in the processing area is being processed, the workpiece in the subsequent small area can be preheated by the heat inside the processing area to ensure continuous and rapid processing of multiple workpieces in the entire processing box.

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