Thermophysical parameter measuring device and test piece thermophysical parameter measuring method

Abstract

The invention relates to a thermophysical parameter measuring device and a test piece thermophysical parameter measuring method, and the device comprises a hot end crimping mechanism which comprises a first heat flow member with a first heat conductivity coefficient, a first heat flow meter which is installed on the first heat flow member, and at least two first temperature sensors which are arranged at intervals along a first direction. The first heat-flow meter is used for measuring heat flow of the first heat-flow member; the cold end crimping mechanism comprises a second heat flow piece with a second heat conductivity coefficient, a second heat flow meter installed on the second heat flow piece and at least two second temperature sensors arranged at intervals in the first direction, and the second heat flow meter is used for measuring heat flow of the second heat flow piece; wherein the first heat flow piece and the second heat flow piece are oppositely arranged in the first direction, a test space for installing a test piece is formed between the first heat flow piece and the second heat flow piece, and the hot end crimping mechanism and the cold end crimping mechanism can generate relative motion in the first direction, so that the first heat flow piece and the second heat flow piece cooperatively crimp the test piece located in the test space.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of thermophysical parameter measurement, in particular to a thermophysical parameter measurement device and a test piece thermophysical parameter measurement method. BACKGROUND

[0002] Thermal resistance and thermal conductivity are the most critical physical parameters of materials in heat transfer design. Without accurate thermal resistance and thermal conductivity data, there will be a large deviation between the design value and the actual value of the heat transfer structure, resulting in abnormal temperature control of the equipment. Thermal resistance includes contact thermal resistance and material thermal resistance, and the sum of the contact thermal resistance and the material thermal resistance is the total thermal resistance. After obtaining the total thermal resistance and the material thermal resistance, the contact thermal resistance can be obtained, and the material thermal conductivity can be obtained according to the material thermal resistance and the material parameters.

[0003] The thermal resistance measurement principle is based on the Fourier heat transfer law R = △T / Q, R is the thermal resistance, △T is the temperature difference between two points, and Q is the heat flow between the two points. In theory, the greater the temperature difference between the two points and the heat flow between the two points and the more accurate the heat flow measurement, the more accurate the thermal resistance measurement. In the traditional technology, there is a problem that the heat flow measurement accuracy is high but the measurement range is small or the heat flow measurement range is large but the measurement accuracy is low, which cannot meet the demand for high-precision and wide-range heat flow measurement, and further cannot meet the demand for high-precision thermal resistance testing. SUMMARY

[0004] Therefore, it is necessary to provide a thermophysical parameter measurement device and a test piece thermophysical parameter measurement method which can improve the above problems.

[0005] A thermophysical parameter measurement device comprises:

[0006] A hot end compression mechanism comprises a first heat flow piece with a first thermal conductivity, a first heat flow meter and at least two first temperature sensors which are spaced apart along a first direction and are installed on the first heat flow piece, and the first heat flow meter is used for measuring the heat flow of the first heat flow piece;

[0007] A cold end compression mechanism comprises a second heat flow piece with a second thermal conductivity, a second heat flow meter and at least two second temperature sensors which are spaced apart along the first direction and are installed on the second heat flow piece, and the second heat flow meter is used for measuring the heat flow of the second heat flow piece;

[0008] Wherein, the first heat flow piece and the second heat flow piece are oppositely arranged in the first direction and form a test space for installing a test piece therebetween, and the hot end compression mechanism and the cold end compression mechanism can produce relative movement along the first direction so that the first heat flow piece and the second heat flow piece cooperate to compress the test piece located in the test space.

[0009] In one of the embodiments, the thermophysical parameter measuring device further comprises a heat source for heating the first heat flow member;

[0010] and / or

[0011] The thermophysical parameter measuring device further comprises a cold source for cooling the second heat flow member.

[0012] In one of the embodiments, the heat source comprises a heating sheet, and the thermophysical parameter measuring device further comprises a heat insulation compression assembly for compressing the heating sheet on the end surface of the first heat flow member away from the second heat flow member along the first direction;

[0013] and / or

[0014] The cold source further comprises a flow channel structure, a refrigerant machine and a heating member, the refrigerant machine is in communication with the flow channel of the flow channel structure, the second heat flow member and the heating member are both installed on the flow channel structure, and the refrigerant machine and the heating member cold-hotly confront to control the temperature of the flow channel structure.

[0015] In one of the embodiments, the first heat flow member comprises a first main body and a first pressure head, the first pressure head is arranged at one end of the first main body along the first direction to form the test space with the second heat flow member; the first heat flow meter is arranged on the first main body, at least two first temperature sensors are arranged on the first main body and located on both sides of the first heat flow meter, and at least one first temperature sensor is arranged on the first pressure head;

[0016] and / or

[0017] The second heat flow meter comprises a second main body and a second pressure head, the second pressure head is arranged at one end of the second main body along the first direction to form the test space with the first heat flow member; the second heat flow meter is arranged on the second main body, at least two second temperature sensors are arranged on the second main body and located on both sides of the second heat flow meter, and at least one second temperature sensor is arranged on the second pressure head.

[0018] In one of the embodiments, one of the first temperature sensors is installed on the first heat flow member for compressing the end of the test piece;

[0019] and / or

[0020] One of the second temperature sensors is installed on the second heat flow member for compressing the end of the test piece.

[0021] In one of the embodiments, the thermophysical parameter measuring device further comprises a first driving mechanism, one of the hot-end crimping mechanism and the cold-end crimping mechanism is connected with the first driving mechanism, and the first driving mechanism is used to drive the one and the other to generate relative movement in the first direction to crimp the test piece located in the test space.

[0022] In one of the embodiments, the thermophysical parameter measuring device further comprises a first connecting member, a second connecting member and an elastic member, the first connecting member is connected with one of the hot-end crimping mechanism and the cold-end crimping mechanism, the second connecting member connects the first connecting member and the first driving mechanism, and the elastic member is arranged between the second connecting member and the hot-end crimping mechanism or the cold-end crimping mechanism in the first direction;

[0023] The first driving mechanism can drive the first connecting member, the second connecting member, the elastic member, and the crimping mechanism connected with the first connecting member to move in the first direction; the second connecting member and the first connecting member are movably connected in the first direction, and when the crimping mechanism connected with the first connecting member contacts the test piece, the second connecting member moves relative to the first connecting member to compress the elastic member.

[0024] A test piece thermophysical parameter measuring method using the above measuring device, comprising:

[0025] Obtaining temperature values measured by at least two temperature sensors on each of the first heat flow member and the second heat flow member;

[0026] Obtaining a first heat flow value according to the thermal conductivity of the heat flow member, the cross-sectional area of the heat flow member, and a data set corresponding to the heat flow member, and obtaining a calculated heat flow value according to at least one of the first heat flow values; each of the data sets comprises a first height difference between two temperature sensors and first and second temperature values measured by the two temperature sensors respectively;

[0027] Correcting the calculated heat flow value based on a correction coefficient to obtain a corrected heat flow value, and determining the corrected heat flow value as a target heat flow value; the correction coefficient is a ratio of a measured heat flow value of a heat flow meter on each heat flow member to the corresponding calculated heat flow value in a heat flow correction working condition;

[0028] Obtaining the thermophysical parameter of the test piece located in the test space according to the target heat flow value of the first heat flow member, the target heat flow value of the second heat flow member, and a preset rule.

[0029] In one of the embodiments,

[0030] Q1 = λ1 * A1 * (T1 - T2) / L1, T1 > T2; Q2 = k * Q3;

[0031] Q1 is the first heat flow value, λ1 is the thermal conductivity of the heat flow member, A1 is the cross-sectional area of the heat flow member, T1 is the first temperature value, T2 is the second temperature value, L1 is the first height difference, Q2 is the target heat flow value, Q3 is the calculated heat flow value;

[0032] When the first heat flow value is one, the first heat flow value is taken as the calculated heat flow value; when the first heat flow value is multiple, the average of the multiple first heat flow values is taken as the calculated heat flow value.

[0033] In one embodiment, the thermal property parameter includes total thermal resistance; and the thermal property parameter of the test piece located in the test space is obtained according to the target heat flow value of the first heat flow member, the target heat flow value of the second heat flow member and a preset rule, including:

[0034] An average heat flow value is obtained according to the target heat flow value of the first heat flow member and the target heat flow value of the second heat flow member;

[0035] A third temperature value measured by a first temperature sensor installed on the first heat flow member for pressing the end of the test piece and a fourth temperature value measured by a second temperature sensor installed on the second heat flow member for pressing the end of the test piece are obtained;

[0036] The total thermal resistance of the test piece is obtained according to the average heat flow value, the third temperature value and the fourth temperature value.

[0037] In one embodiment,

[0038] Q=(Qh2+Qc2) / 2, R=(Th3-Tc3) / Q;

[0039] Wherein, Q is the average heat flow value, Qh2 is the target heat flow value of the first heat flow member, Qc2 is the target heat flow value of the second heat flow member, Th3 is the third temperature value, Tc3 is the fourth temperature value, and R is the total thermal resistance of the test piece.

[0040] In one embodiment, the thermal property parameter includes thermal conductivity and contact thermal resistance; and the measurement method further includes:

[0041] A fifth temperature value at a first position close to the first heat flow member and a sixth temperature value at a second position close to the second heat flow member are obtained;

[0042] The thermal conductivity of the test piece is obtained according to the average heat flow value, the fifth temperature value, the sixth temperature value, the second height difference between the first position and the second position, and the cross-sectional area of the test piece;

[0043] The contact thermal resistance of the test piece is obtained according to the total thermal resistance of the test piece and the thermal conductivity of the test piece.

[0044] The aforementioned thermophysical parameter measuring device and specimen thermophysical parameter measuring method utilize a heat flow meter to measure the heat flow on its corresponding heat flow element, and a temperature sensor to detect the temperature of the corresponding heat flow element. The heat flow on the heat flow element can also be obtained from the temperature value detected by the temperature sensor. Since the heat flow meter can measure relatively small heat flows with high accuracy, when the heat flow is small, the heat flow measured by the heat flow meter can be used to correct the heat flow obtained from the temperature value to obtain a correction coefficient. Accurate large heat flow data can be obtained using the temperature value and the correction coefficient. Therefore, the thermophysical parameter measuring device and specimen thermophysical parameter measuring method provided in this application embodiment have a large range of heat flow measurement and high measurement accuracy, meeting the requirements for high-precision, large-range heat flow measurement. Since the measurement accuracy of thermophysical parameters is related to the heat flow range and the heat flow accuracy, when high-precision, large-range heat flow measurement is possible, the requirement for high-precision measurement of thermophysical parameters is guaranteed. Attached Figure Description

[0045] Figure 1 A front view of a thermophysical parameter measuring device provided in an embodiment of this application;

[0046] Figure 2 for Figure 1 A structural diagram of a partial structure of the thermophysical property parameter measuring device shown in the figure;

[0047] Figure 3 for Figure 1 A front view of a partial structure of the thermophysical parameter measuring device shown in the figure;

[0048] Figure 4 for Figure 1 A cross-sectional view of a partial structure of the thermophysical parameter measuring device shown in the figure;

[0049] Figure 5 for Figure 1 The diagram shows a portion of the thermophysical property parameter measuring device including a hot-end pressing mechanism.

[0050] Figure 6 for Figure 5 A cross-sectional view of the structure shown;

[0051] Figure 7 for Figure 1 The diagram shows a portion of the thermophysical parameter measuring device including the cold end pressing mechanism.

[0052] Figure 8 for Figure 7 A cross-sectional view of the structure shown;

[0053] Figure 9 for Figure 1Structure diagram of the activity sleeve of the thermophysical parameter measuring device shown in the middle when the activity sleeve is sleeved outside the first sealing sleeve and the second sealing sleeve;

[0054] Figure 10 Flow chart of the thermophysical parameter measuring method of the test piece provided for an embodiment of the present application;

[0055] Figure 11 Test principle diagram of the thermophysical parameter measuring device provided for another embodiment of the present application.

[0056] Explanation of reference numerals:

[0057] 100, thermophysical parameter measuring device; 10, hot end pressing mechanism; 11, first heat flow piece; 111, first main body; 1111, first mounting section; 1112, first connecting section; 1113, first pressing section; 112, first pressing head; 12, first heat flow meter; 13, first temperature sensor; 14, first support piece; 20, cold end pressing mechanism; 21, second heat flow piece; 211, second main body; 2111, second mounting section; 2112, second connecting section; 2113, second pressing section; 212, second pressing head; 22, second heat flow meter; 23, second temperature sensor; 24, second support piece; 30, test space; 40, mounting structure; 50, heat source; 60, cold source; 61, flow channel structure; 62, heating piece; 70, heat insulation pressing assembly; 71, pressing piece; 72, heat insulation piece; 80, first driving mechanism; 81, first driving piece; 82, first transmission assembly; 821, screw rod; 822, nut; 90, first connecting piece; 91, guide part; 92, limiting part; 110, second connecting piece; 120, elastic piece; 130, pressure sensor; 140, linear bearing; 150, first sealing sleeve; 160, second sealing sleeve; 170, activity sleeve; 180, second driving mechanism; 181, second driving piece; 182, second transmission assembly; 1821, gear; 1822, rack; 190, vacuum generator; 200, adjusting mechanism; 201, adjusting piece; 210, displacement sensor; 300, test piece. DETAILED DESCRIPTION

[0058] In order to make the above objectives, features and advantages of the present application more apparent and comprehensible, the specific embodiments of the present application are described in detail below with reference to the drawings. In the following description, a lot of specific details are set forth in order to fully understand the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the concept of the present application, so the present application is not limited to the specific embodiments disclosed below.

[0059] In the description of the application, it should be understood that the orientation or positional relationship indicated by terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like is based on the orientation or positional relationship shown in the drawings, and is only for the purpose of facilitating the description of the application and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation of the application.

[0060] In addition, the terms "first", "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include at least one of the features. In the description of the application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise explicitly specified and limited.

[0061] In the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting", "fixing" and the like should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise explicitly limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0062] In the present application, unless otherwise explicitly specified and limited, the first feature "on" or "under" the second feature can be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature "above", "over" and "on" the second feature can be that the first feature is directly above or obliquely above the second feature, or it can only mean that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "under" and "under" the second feature can be that the first feature is directly below or obliquely below the second feature, or it can only mean that the horizontal height of the first feature is less than that of the second feature.

[0063] It is to be understood that when an element as a preamble is referred to as being "on" or "connected to" another element, it can be directly on or connected to the other element or intervening elements can also be present. In contrast, when an element as a preamble is referred to as being "connected to" another element, it can be directly on or connected to the other element or intervening elements can also be present. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar terms as used herein are used for the purpose of illustration only and are not intended to be limiting.

[0064] Referring to Figure 1 An embodiment of the present application provides a thermal physical parameter measuring device 100 for measuring thermal physical parameters of a test piece 300. Specifically, the thermal physical parameters of the test piece include total thermal resistance of the test piece, contact thermal resistance, and thermal conductivity of the test piece. Thermal resistance is the resistance encountered in the process of heat transfer. When heat flows through the interface of two contacting solids, the interface itself presents a significant thermal resistance to the heat flow, which is called contact thermal resistance. Thermal resistance is inversely proportional to the thermal conductivity of the material. The higher the thermal conductivity, the smaller the thermal resistance, and vice versa. The heat flow is the amount of heat flowing through a unit area per unit time. It can also be understood as the rate of heat energy passing through a unit area.

[0065] Referring to Figure 2 and Figure 3 The thermal physical parameter measuring device 100 includes a hot end compression mechanism 10 and a cold end compression mechanism 20. The hot end compression mechanism 10 and the cold end compression mechanism 20 cooperate to compress the test piece 300.

[0066] Referring to Figure 4 The hot end compression mechanism 10 includes a first heat flow piece 11 having a first thermal conductivity, which is a known calibration value. The cold end compression mechanism 20 includes a second heat flow piece 21 having a second thermal conductivity, which is a known calibration value. The first heat flow piece 11 and the second heat flow piece 21 are oppositely arranged in a first direction and form a test space 30 for mounting the test piece 300 therebetween. The hot end compression mechanism 10 and the cold end compression mechanism 20 can produce relative motion in the first direction so that the first heat flow piece 11 and the second heat flow piece 21 cooperate to compress the test piece 300 in the test space 30. The temperature of the first heat flow piece 11 is greater than the temperature of the second heat flow piece 21. When the first heat flow piece 11 and the second heat flow piece 21 cooperate to compress the test piece 300, heat will be conducted in the test piece 300.

[0067] After a certain time, when the temperature of the two ends of the test piece 300 and the heat flow of the first heat flow piece 11 and the second heat flow piece 21 tend to be stable, the thermal physical parameters of the test piece 300 can be measured. Since the total thermal resistance of the test piece, the thermal resistance of the test piece (the thermal resistance in the test piece 300) is related to the heat flow and the temperature difference, the total thermal resistance of the test piece and the thermal resistance of the test piece can be obtained by obtaining the temperature difference and the heat flow. When the total thermal resistance of the test piece and the thermal resistance of the test piece are obtained, the contact thermal resistance can be obtained.

[0068] Wherein, the heat flow of the test piece 300 can be obtained according to the heat flow of the first heat flow piece 11 and the second heat flow piece 21. Specifically, the average value of the heat flow of the first heat flow piece 11 and the heat flow of the second heat flow piece 21 is taken as the heat flow of the test piece 300.

[0069] Referring to Figure 5 and Figure 6 , the hot end compression mechanism 10 further comprises a first heat flow meter 12 and a first temperature sensor 13, and the first heat flow meter 12 and the first temperature sensor 13 are both installed on the first heat flow piece 11. Specifically, the number of the first temperature sensor 13 is at least two, and all the first temperature sensors 13 are sequentially and spaced apart on the first heat flow piece 11 in the first direction. In this way, the plurality of first temperature sensors 13 can detect the temperature of the first heat flow piece 11 at different positions in the first direction.

[0070] The first heat flow meter 12 can directly measure the heat flow of the first heat flow piece 11. The first heat flow meter 12 is more accurate in measuring the heat flow, but its measurement range of the heat flow is limited. Since the heat flow of the first heat flow piece 11 is related to the first thermal conductivity of the first heat flow piece 11, the cross-sectional area of the first heat flow piece 11 (the cross-sectional area formed by cutting the first heat flow piece 11 with a cross section perpendicular to the first direction (generally a known value)), the temperature difference between two points and the height difference between two points. Then the heat flow of the first heat flow piece 11 can be calculated according to the first thermal conductivity, the cross-sectional area of the first heat flow piece 11, the height difference between the first temperature sensors 13 and the temperature measured by the first temperature sensors 13. In the case of small heat flow, the heat flow measured by the first heat flow meter 12 is corrected to obtain a correction coefficient. In the case of large heat flow, the calculated heat flow of the first heat flow piece 11 is multiplied by the correction coefficient to obtain a correction value, which is the accurate value. In this way, the high-precision measurement of the large heat flow of the first heat flow piece 11 is realized.

[0071] Referring to Figure 7 and Figure 8The cold end pressure contact mechanism 20 further comprises a second heat flow meter 22 and a second temperature sensor 23, both of which are installed on the second heat flow piece 21. The second heat flow meter 22 can directly measure the heat flow of the second heat flow piece 21, and the second temperature sensor 23 is used to measure the temperature on the second heat flow piece 21. Specifically, the number of the second temperature sensor 23 is at least two, and all the second temperature sensors 23 are sequentially and spaced apart on the second heat flow piece 21 along the first direction. In this way, the plurality of second temperature sensors 23 can detect the temperature of the second heat flow piece 21 at different positions in the first direction.

[0072] The measurement of the second heat flow meter 22 on the heat flow is more accurate, but its measurement range of the heat flow is limited. Since the heat flow of the second heat flow piece 21 is related to the second thermal conductivity of the second heat flow piece 21, the cross-sectional area of the second heat flow piece 21 (the cross-sectional area formed by cutting the second heat flow piece 21 with a section perpendicular to the first direction, which is generally a known value), the temperature difference between two points and the height difference between two points. Then the heat flow of the second heat flow piece 21 can be calculated according to the second thermal conductivity, the cross-sectional area of the second heat flow piece 21, the height difference between the second temperature sensors 23 and the temperature measured by the second temperature sensors 23. In the working condition of small heat flow, the heat flow measured by the second heat flow meter 22 is corrected to obtain a correction coefficient. In the large heat flow working condition, the calculated heat flow of the second heat flow piece 21 is multiplied by the correction coefficient to obtain a correction value, which is the accurate value. In this way, the high-precision measurement of the large heat flow of the second heat flow piece 21 is realized.

[0073] It should be noted that the second thermal conductivity of the second heat flow piece 21 and the first thermal conductivity of the first heat flow piece 11 can be the same or different. Generally, in order to simplify the calculation, the first thermal conductivity and the second thermal conductivity are set to be the same, that is, the first heat flow piece 11 and the second heat flow piece 21 are made of the same material (such as copper). Moreover, in order to reduce the sudden change of the heat flow and ensure the measurement accuracy, the shape of the region of the first heat flow piece 11 and the second heat flow piece 21 for measuring the heat flow is regular and the cross-sectional area is equal.

[0074] When the heat flows of the first heat flow piece 11 and the second heat flow piece 21 are obtained, the heat flow of the test piece 300 can be obtained through the heat flows of the first heat flow piece 11 and the second heat flow piece 21, and the total thermal resistance of the test piece can be obtained through the heat flow of the test piece 300 and the temperature difference of the end of the first heat flow piece 11 and the second heat flow piece 21, and the thermal resistance of the test piece can be obtained through the heat flow of the test piece 300 and the temperature difference between the two ends of the test piece 300. Finally, the contact thermal resistance of the test piece 300 is obtained through the total thermal resistance of the test piece and the thermal resistance of the test piece. Moreover, the thermal conductivity of the test piece can also be obtained through the thermal resistance of the test piece and the parameters of the test piece 300 (the cross-sectional area of the test piece 300 and the height difference between the two temperature points measured on the test piece 300, etc.).

[0075] The thermal physical parameter measuring device 100 provided by the embodiment of the present application, the thermal flow piece of the hot end compression mechanism 10 and the cold end compression mechanism 20 is provided with a heat flow meter and a temperature sensor, the heat flow meter can measure the heat flow on the corresponding thermal flow piece, the temperature sensor can detect the temperature of the corresponding thermal flow piece, and the heat flow on the thermal flow piece can also be obtained according to the temperature value detected by the temperature sensor. Since the heat flow meter can measure a smaller heat flow and has high measurement accuracy, when the heat flow is small, the heat flow measured by the heat flow meter can be used to correct the heat flow obtained by the temperature value to obtain a correction coefficient, and the accurate large heat flow data can be obtained by the temperature value and the correction coefficient. It can be seen that the thermal physical parameter measuring device 100 provided by the embodiment of the present application has a large range of heat flow measurement and high measurement accuracy, and can meet the demand of high-precision large-range heat flow measurement. Since the thermal physical parameter measurement accuracy is related to the heat flow range and the heat flow accuracy, when the heat flow can be measured with high precision and in a large range, the high-precision measurement demand of the thermal physical parameter is ensured.

[0076] It should be noted here that the thermal conductivity needs to be measured by increasing the heat flow of the test piece 300 to pull apart the temperature difference between the two ends of the test piece 300 to ensure the test accuracy. In the present application, since the range of heat flow measurement is large and the measurement accuracy is high, the measurement demand of the thermal conductivity of the material can be met.

[0077] Referring to Figure 3 , the thermal physical parameter measuring device 100 further comprises a mounting structure 40, and the hot end compression mechanism 10 and the cold end compression mechanism 20 are mounted on the mounting structure 40 to improve the integration of the thermal physical parameter measuring device 100.

[0078] In some embodiments, referring to Figure 6 , the first thermal flow piece 11 comprises a first main body 111 and a first pressure head 112, and the first pressure head 112 is arranged at one end of the first main body 111 along the first direction to form a test space 30 with the second thermal flow piece 21. The first heat flow meter 12 is arranged on the first main body 111, at least two first temperature sensors 13 are arranged on the first main body 111 and located on both sides of the first heat flow meter 12, and at least one first temperature sensor 13 is arranged on the first pressure head 112. In this way, the first pressure head 112 cooperates with the second thermal flow piece 21 to facilitate the compression of the test piece 300, and the first heat flow meter 12 is arranged on the first main body 111 instead of the first pressure head 112 to ensure the measurement accuracy of the heat flow. At the same time, the at least two first temperature sensors 13 are arranged on both sides of the first heat flow meter 12, so that the distance between the first temperature sensors 13 is far, which also ensures the measurement accuracy of the heat flow.

[0079] Generally, the temperature value measured by the first temperature sensor 13 arranged on the first body 111 is selected to obtain the heat flow of the first heat flow member 11, and the temperature value measured by the first temperature sensor 13 arranged on the first pressure head 112 is selected to obtain the temperature of the end of the first heat flow member 11, so as to obtain the temperature difference between the ends of the first heat flow member 11 and the second heat flow member 21 close to each other. Specifically, the first pressure head 112 is provided with a first temperature sensor 13 arranged at the end of the first pressure head 112, which is used to measure the temperature of the end of the first heat flow member 11 close to the second heat flow member 21, so as to obtain the temperature difference between the ends of the first heat flow member 11 and the second heat flow member 21 close to each other, thereby obtaining the total thermal resistance of the test piece.

[0080] Optionally, the first body 111 comprises a first mounting section 1111 for mounting the first heat flow meter 12 and the first temperature sensor 13, the first mounting section 1111 has a regular shape so that the cross-sectional area thereof is equal everywhere, the first heat flow meter 12 measures the heat flow of the first mounting section 1111 and the first temperature sensor 13 measures the temperature of the first mounting section 1111 to obtain the heat flow of the first heat flow member 11, thereby ensuring the test accuracy. In some embodiments, the first pressure head 112 is directly connected to the first mounting section 1111. In other embodiments, the first body 111 further comprises a first connecting section 1112 connected to the first mounting section 1111, the first pressure head 112 is connected to the first connecting section 1112, and the cross-sectional area of the first connecting section 1112 can be different from that of the first mounting section 1111.

[0081] The size of the first pressure head 112 is not less than that of the end of the first body 111 connected thereto, so that the size of the first pressure head 112 is large enough to press the test piece 300 with a large size.

[0082] Continuing to refer to Figure 8 The second heat flow member 21 comprises a second body 211 and a second pressure head 212, the second pressure head 212 is arranged at one end of the second body 211 to form a test space 30 with the first heat flow member 11. The second heat flow meter 22 is arranged on the second body 211, at least two second temperature sensors 23 are arranged on the second body 211 and located on both sides of the second heat flow meter 22, and at least one second temperature sensor 23 is arranged on the second pressure head 212. In this way, the second pressure head 212 cooperates with the first heat flow member 11 to facilitate the pressing of the test piece 300, and the second heat flow meter 22 is arranged on the second body 211 rather than on the second pressure head 212, which ensures the accuracy of the heat flow measurement. At the same time, the at least two second temperature sensors 23 are arranged on both sides of the second heat flow member 21, so that the distance between the second temperature sensors 23 is far, which also ensures the accuracy of the heat flow measurement.

[0083] Generally, the temperature value measured by the second temperature sensor 23 arranged on the second main body 211 is selected to obtain the heat flow of the second heat flow member 21, and the temperature value measured by the second temperature sensor 23 arranged on the second pressure head 212 is selected to obtain the temperature of the end of the second heat flow member 21, so as to obtain the temperature difference between the ends of the first heat flow member 11 and the second heat flow member 21 close to each other. Specifically, the second pressure head 212 is provided with a second temperature sensor 23 arranged at the end of the second pressure head 212, which is used to measure the temperature of the end of the second heat flow member 21 close to the first heat flow member 11, so as to obtain the temperature difference between the ends of the first heat flow member 11 and the second heat flow member 21 close to each other, thereby obtaining the total thermal resistance of the test piece 300.

[0084] Optionally, the second main body 211 comprises a second mounting section 2111 for mounting the second heat flow meter 22 and the second temperature sensor 23, the second mounting section 2111 has a regular shape so that the cross-sectional area of the second mounting section 2111 is equal at different positions, the second heat flow meter 22 measures the heat flow of the second mounting section 2111, and the second temperature sensor 23 measures the temperature of the second mounting section 2111 to obtain the heat flow of the second heat flow member 21, thereby ensuring the measurement accuracy. In some embodiments, the second pressure head 212 is directly connected to the second mounting section 2111. In other embodiments, the second main body 211 further comprises a second connecting section 2112 connected to the second mounting section 2111, and the second pressure head 212 is connected to the second connecting section 2112, and the cross-sectional area of the second connecting section 2112 can be different from that of the second mounting section 2111.

[0085] Optionally, the first main body 111 and the second main body 211 have the same structure, so that the cross-sectional areas of the first mounting section 1111 and the second mounting section 2111 are the same, thereby reducing the heat flow mutation and ensuring the measurement accuracy. In some embodiments, the cross-sectional shape of the first mounting section 1111 and the second mounting section 2111 is rectangular. Of course, in other embodiments, the cross-sectional shape of the first mounting section 1111 and the second mounting section 2111 is not limited.

[0086] The size of the second pressure head 212 is not less than the size of the end of the second main body 211 connected thereto, so that the size of the second pressure head 212 is large enough to press the test piece 300 with a large size.

[0087] In some embodiments, referring back to Figure 2 , the thermophysical parameter measurement device 100 further comprises a heat source 50 for heating the first heat flow member 11, and a cold source 60 for cooling the second heat flow member 21. By arranging the heat source 50 and the cold source 60, the temperature of the first heat flow member 11 is relatively high, and the temperature of the second heat flow member 21 is relatively low, so that a temperature difference is generated between the two, thereby facilitating the measurement of the thermophysical parameters of the test piece 300.

[0088] Optionally, the heat source 50 comprises a heating sheet, and the thermophysical parameter measuring device 100 further comprises a heat insulation and pressing assembly 70, which presses the heating sheet on the end face of the first heat flow piece 11 away from the second heat flow piece 21. In this way, the heat of the heating sheet can be transmitted to the first heat flow piece 11 from the end of the first heat flow piece 11 away from the second heat flow piece 21, so as to ensure the temperature difference between the first heat flow piece 11 and the second heat flow piece 21. Specifically, the first main body 111 further comprises a first pressing section 1113 connected to the end of the first mounting section 1111 away from the second heat flow piece 21, and the heat insulation and pressing assembly 70 presses the heating sheet on the end face of the first pressing section 1113 away from the first mounting section 1111.

[0089] Optionally, the first main body 111 has an I-shaped structure, and the two ends of the I-shaped structure are respectively the first connecting section 1112 and the first pressing section 1113, and the middle part of the I-shaped structure is the first mounting section 1111. Of course, in some other embodiments, the shape of the first heat flow piece 11 is not limited.

[0090] Continuing to refer to Figure 5 and Figure 6 , the heat end pressing mechanism 10 further comprises a first support 14 arranged between the two ends of the I-shaped first main body 111 and supporting the two end parts of the I-shaped first main body 111 through a support column, and the area of the support column is small, thereby reducing the heat conducted to the outside through the first support 14.

[0091] Continuing to refer to Figure 3 , the heat insulation and pressing assembly 70 comprises a pressing piece 71 and a heat insulation piece 72, the pressing piece 71 presses the heating sheet on the first heat flow piece 11, and the heat insulation piece 72 is arranged at the end of the pressing piece 71 away from the first heat flow piece 11 to reduce the heat transfer between the heating sheet and the outside. Specifically, the pressing piece 71 has a plating layer and the contact area of the heat insulation piece 72 with the pressing piece 71 is small, so that the heat insulation piece 72 plays a role of heat preservation and heat insulation, thereby reducing the heat conducted to the outside by the heating sheet, allowing more heat to be conducted to the first heat flow piece 11, and facilitating the temperature control of the first heat flow piece 11.

[0092] Continuing to refer to Figure 4 , the cold source 60 comprises a flow channel structure 61, a refrigerant machine and a heating piece 62, the flow channel structure 61 is mounted on the mounting structure 40, the refrigerant machine is in communication with the flow channel of the flow channel structure 61, the second heat flow piece 21 and the heating piece 62 are both mounted on the flow channel structure 61, and the refrigerant machine and the heating piece 62 cold and hot against each other to control the temperature of the flow channel structure 61. The refrigerant machine can provide refrigerant for the flow channel structure 61, thereby refrigerating the equipment. By controlling the heating power of the heating piece 62, the effect of controlling the cold end temperature is achieved.

[0093] In the conventional technology, the cold water bath is generally selected as the cold source 60 of the device, and the lowest temperature is above 0℃. However, the thermal resistance characteristics of many materials, especially non-metallic materials, will change at low temperatures, and it is difficult for the cold source 60 in the conventional technology to meet the test requirements. In the present application, the refrigerant machine is selected to have a large power, and can provide refrigerant as low as-60℃, greatly increasing the temperature difference between the cold and hot ends, greatly expanding the temperature range, thereby increasing the heat flow of the device, and meeting the test requirements.

[0094] Optionally, the heating member 62 is also a sheet structure, and is clamped between the second heat flow member 21 and the flow channel structure 61. Specifically, the second main body 211 further includes a second pressing section 2113 connected to the end of the second mounting section 2111 away from the first heat flow member 11, and the heating member 62 is clamped between the second pressing section 2113 and the flow channel structure 61.

[0095] In some embodiments, the second main body 211 is also an I-shaped structure, and the two ends of the I-shaped structure are respectively used as the second connecting section 2112 and the second pressing section 2113, and the middle part of the I-shaped structure is used as the second mounting section 2111. Of course, in other embodiments, the shape of the second main body 211 is not limited.

[0096] Continuing to refer to Figure 7 and Figure 8 , the cold end pressing mechanism 20 further includes a second support member 24 arranged between the two ends of the I-shaped second main body 211, and supporting the two end parts of the I-shaped second main body 211 through support columns. The area of the support column is small, thereby reducing the heat conducted to the outside through the second support member 24.

[0097] Continuing to refer to Figure 1 , the thermophysical parameter measuring device 100 further includes a first driving mechanism 80 mounted on the mounting structure 40, one of the hot end pressing mechanism 10 and the cold end pressing mechanism 20 is connected to the first driving mechanism 80, and the first driving mechanism 80 is used to drive the one to produce relative motion with the other in the first direction, so as to press the test piece 300 located in the test space 30. The arrangement of the first driving mechanism 80 can make the hot end pressing mechanism 10 and the cold end pressing mechanism 20 produce relative motion, so as to ensure the pressing effect of the test piece 300 pressed in the test space 30.

[0098] It should be noted that when the first driving mechanism 80 drives the pressing mechanism connected thereto to move in the first direction, the structure fixedly connected with the pressing mechanism also moves in the first direction synchronously.

[0099] In some embodiments, the hot end compression mechanism 10 is connected to the first driving mechanism 80, and the first driving mechanism 80 is capable of driving the hot end compression mechanism 10, the heating sheet and the thermal insulation compression assembly 70 mounted on the first thermal flow member 11 to move synchronously in the first direction to compress the test piece 300. In other embodiments, the cold end compression mechanism 20 is connected to the first driving mechanism 80, and the first driving mechanism 80 is capable of driving the cold end compression mechanism 20, the heating member 62 and the flow channel structure 61 to move synchronously in the first direction to compress the test piece 300.

[0100] With reference to Figure 3 , the first driving mechanism 80 comprises a first driving member 81 and a first transmission assembly 82. The first driving member 81 is mounted on the mounting structure 40, and the first transmission assembly 82 connects the first driving member 81 and the compression mechanism. Optionally, the first driving member 81 is a servo motor. The first transmission assembly 82 comprises a screw rod 821 and a nut 822. The screw rod 821 is mounted on the mounting structure 40 and extends in the first direction. The nut 822 is connected to the screw rod 821, and the compression mechanism is connected to the nut 822. When the servo motor operates, the screw rod 821 rotates to drive the compression mechanism to move in the first direction through the nut 822. Specifically, the servo motor drives the screw rod 821 to rotate through a belt pulley.

[0101] With reference to Figure 1 , Figure 3 and Figure 4 , the thermophysical parameter measuring device 100 further comprises a first connecting member 90, a second connecting member 110 and an elastic member 120. The first connecting member 90 is connected to one of the hot end compression mechanism 10 and the cold end compression mechanism 20. The second connecting member 110 connects the first connecting member 90 and the first driving mechanism 80. The elastic member 120 is arranged between the second connecting member 110 and the hot end compression mechanism 10 or the cold end compression mechanism 20 in the first direction. The first driving mechanism 80 is capable of driving the first connecting member 90, the second connecting member 110, the elastic member 120 and the compression mechanism connected to the first connecting member 90 to move in the first direction. The second connecting member 110 is movably connected to the first connecting member 90 in the first direction. When the compression mechanism connected to the first connecting member 90 contacts the test piece 300, the second connecting member 110 moves relative to the first connecting member 90 to compress the elastic member 120.

[0102] The above arrangement, when the crimping mechanism connected with the first driving mechanism 80 is crimped to the test piece 300, the first driving mechanism 80 can also drive the second connecting piece 110 to continue moving to compress the elastic piece 120, the second connecting piece 110 continuously provides pressure to the crimping mechanism connected with the first connecting piece 90 through the elastic piece 120, and the first driving mechanism 80 stops working when the pressure reaches the preset value. In this way, the pressure of the crimping surface of each pressure head during testing can be ensured to be constant and controllable, thereby ensuring the close contact between the test piece 300 and the pressure head and ensuring the measurement accuracy.

[0103] Further, referring to Figure 2 , the thermophysical parameter measuring device 100 further comprises a pressure sensor 130 connected with one of the hot-end crimping mechanism 10 and the cold-end crimping mechanism 20 for detecting the pressure when the two crimp the test piece 300. Specifically, the pressure sensor 130 can be arranged between the first connecting piece 90 and the crimping mechanism to ensure the sensitivity of detection.

[0104] By arranging the pressure sensor 130, the pressure provided by the pressure head to the test piece 300 can be detected in real time, and the test pressure can be adjusted according to the test requirements.

[0105] In some embodiments, referring to Figure 4 , the first connecting piece 90 comprises a guide portion 91 and a limiting portion 92, the two limiting portions 92 are respectively connected with the two ends of the guide portion 91, the guide portion 91 is arranged in the second connecting piece 110 and a linear bearing 140 is arranged therebetween, the elastic piece 120 is a compression spring and is sleeved outside the guide portion 91, and the two limiting portions 92 at the ends limit the compression spring and the second connecting piece 110. The crimping mechanism is connected with the limiting portion 92 at one end. In this way, when the first driving mechanism 80 drives the crimping mechanism to be crimped to the test piece 300, the second connecting piece 110 moves in the first direction relative to the guide portion 91 under the guidance of the linear bearing 140 and compresses the compression spring, and the compression spring applies pressure to the limiting portion 92 at one end, thereby providing pressure to the crimping mechanism connected with the limiting portion 92.

[0106] In some embodiments, referring to Figure 1 and Figure 9 , the thermophysical parameter measuring device 100 further comprises a first sealing sleeve 150 and a second sealing sleeve 160, the first sealing sleeve 150 is sleeved outside the hot-end crimping mechanism 10, and the second sealing sleeve 160 is sleeved outside the cold-end crimping mechanism 20 to reduce the heat conduction between the hot-end crimping mechanism 10 and the cold-end crimping mechanism 20 and the outside world.

[0107] Further, the thermophysical parameter measuring device 100 further comprises a movable sleeve 170 and a second driving mechanism 180, the movable sleeve 170 being connected with the second driving mechanism 180. When the hot end crimping mechanism 10 and the cold end crimping mechanism 20 are crimping the test piece 300, the second driving mechanism 180 drives the movable sleeve 170 to move in the first direction to be sleeved on the first sealing sleeve 150, the second sealing sleeve 160 and the test piece 300, so as to ensure the sealing effect on the test piece 300, reduce the heat conduction between the test piece 300 and the outside world, and facilitate the rapid and stable temperature of the test piece 300, and reduce the test time.

[0108] In some embodiments, the second driving mechanism 180 is connected with the first driving mechanism 80 and moves synchronously with the crimping mechanism connected with the first driving mechanism 80. Generally, the movable sleeve 170 is sleeved on the outside of the sealing sleeve corresponding to the crimping mechanism connected with the first driving mechanism 80, so as to save space.

[0109] Alternatively, the second driving mechanism 180 is installed on the second connecting piece 110 and moves synchronously with the second connecting piece 110.

[0110] Continuing to refer to Figure 9 , the second driving mechanism 180 comprises a second driving member 181 and a second transmission assembly 182, the second transmission assembly 182 connecting the first driving member 81 and the movable sleeve 170. Specifically, the second driving member 181 is a direct current motor, and the second transmission assembly 182 comprises a gear 1821 and a rack 1822 extending in the first direction. When the linear motor works, the gear 1821 is driven to rotate, and the gear 1821 drives the rack 1822 to move in the first direction, thereby driving the movable sleeve 170 to move in the first direction.

[0111] It should be understood that in other embodiments, the second driving member 181 and the second transmission assembly 182 are not limited in the arrangement.

[0112] In some embodiments, when the movable sleeve 170 is sleeved on the outside of the first sealing sleeve 150 and the second sealing sleeve 160, the inner cavities of the first sealing sleeve 150, the second sealing sleeve 160 and the movable sleeve 170 are communicated. Continuing to refer to Figure 9 , the thermophysical parameter measuring device 100 further comprises a vacuum generator 190, the vacuum generator 190 being connected with the inner cavity of one of the first sealing sleeve 150 and the second sealing sleeve 160, so as to make the sealing sleeve connected therewith in a vacuum state. Since the inner cavities of the first sealing sleeve 150, the second sealing sleeve 160 and the movable sleeve 170 are communicated, the other sealing sleeve and the movable sleeve 170 are also in a vacuum state. Specifically, the vacuum generator 190 is a vacuum pump.

[0113] Since the heat exchange between the heat flow piece and the specimen 300 and the external environment is mainly in the form of heat convection and heat radiation, the vacuum generator 190 is used to draw vacuum in the sealing sleeve to avoid heat convection. In addition, a plating layer can be added on the surface of the heat flow piece and the specimen 300 to reduce radiation. The combination of the two measures can minimize the heat loss, which is conducive to the rapid and stable temperature of the heat flow piece and the specimen 300, avoids the use of the existing heat preservation materials to heat the specimen 300 and the heat flow piece (in the existing heat preservation mode, the heat preservation material and the external environment need a long time to reach thermal equilibrium), and reduces the test time.

[0114] It is found that the measurement accuracy of the thermophysical parameter measuring device 100 is not only affected by the heat flow size, the heat preservation effect, the heat flow measurement accuracy, and the pressure of the pressure contact surface, but also affected by the parallelism of the pressure contact surface.

[0115] Referring back to Figure 1 , the thermophysical parameter measuring device 100 further comprises an adjusting mechanism 200, the adjusting mechanism 200 is installed on the mounting structure 40, one of the hot-end pressure contact mechanism 10 and the cold-end pressure contact mechanism 20 is connected with the adjusting mechanism 200, and the adjusting mechanism 200 is used to adjust the position of the pressure contact mechanism connected therewith relative to the mounting structure 40, so that the pressure contact surfaces of the two pressure contact mechanisms remain parallel. Generally, the adjusting mechanism 200 is connected with the pressure contact mechanism not connected with the first driving mechanism 80.

[0116] The above arrangement adjusts the parallelism of the pressure contact surfaces (the pressure contact surfaces are the planes of the heat flow piece used to press the specimen 300) of the two pressure contact mechanisms through the adjusting mechanism 200, so as to ensure that the two pressure contact surfaces remain horizontal, thereby ensuring the measurement accuracy of the thermophysical parameters.

[0117] Specifically, the adjusting mechanism 200 comprises a plurality of adjusting pieces 201 penetrating the mounting structure 40 along a first direction, and the plurality of adjusting pieces 201 cooperate with each other to adjust the parallelism of the pressure contact surfaces of the two pressure contact mechanisms. Optionally, the adjusting piece 201 is screwed with the pressure contact mechanism, and has an operating part. When adjusting, the operating part is held to screw the adjusting piece 201, so as to adjust the screwing length of the adjusting piece 201 with the pressure contact mechanism, thereby achieving the purpose of adjusting the parallelism of the pressure contact surfaces.

[0118] In some specific embodiments, the hot-end pressure contact mechanism 10 is connected with the first driving mechanism 80, and the adjusting mechanism 200 is used to adjust the position of the cold-end pressure contact mechanism 20 relative to the mounting structure 40. Since the cold-end pressure contact mechanism 20 is installed on the flow channel structure 61, the adjusting mechanism 200 is directly connected with the flow channel structure 61. When the position of the flow channel structure 61 relative to the mounting structure 40 is adjusted, the adjustment of the cold-end pressure contact mechanism 20 is realized.

[0119] Referring back to Figure 1The thermal physical parameter measuring device 100 further comprises a displacement sensor 210 for measuring the size of the test piece 300 in the first direction, so as to calculate the thermal physical parameter according to the size of the test piece 300.

[0120] The thermal physical parameter measuring device 100 further comprises a controller, and the heat flow meter, the temperature sensor, the pressure sensor 130, the displacement sensor 210, the heat source 50, the cold source 60, the driving mechanism and the like are connected with the controller. When the test piece 300 is placed, the controller can control the device to automatically complete the processes of pressing, heat preservation, testing and calculation, and the degree of automation is high, which greatly improves the work efficiency.

[0121] In the specific embodiment, the working principle of the thermal physical parameter measuring device 100 is as follows:

[0122] During testing, the test piece 300 is placed on the second pressure head 212, and the testing process is started after the temperature and pressure testing conditions are set.

[0123] The first driving member 81 drives the hot end pressing mechanism 10 to move downward through the first transmission assembly 82, and the first pressure head 112 contacts the test piece 300. The first driving member 81 continues to work, and the second connecting member 110 provides pressure to the hot end pressing mechanism 10 through the elastic member 120. When the pressure value measured by the pressure sensor 130 reaches the set value, the first driving member 81 stops working.

[0124] The second driving member 181 starts to work, and drives the movable sleeve 170 to move downward through the second transmission assembly 182. The movable sleeve 170 moves to the outside of the first sealing sleeve 150 and the second sealing sleeve 160, and the second driving member 181 stops working.

[0125] The displacement sensor 210 measures the size of the test piece 300 in the first direction (the size of the test piece 300 in the first direction is the height difference between two temperature points on the test piece 300).

[0126] The vacuum generator 190 works to perform vacuumization in the sealing sleeve.

[0127] The controller sends a control command, the heat source 50 starts to heat, and the cold source 60 starts to cool. After the cold and hot end temperatures and the measured heat flow value are stable, the test result is obtained.

[0128] The first driving member 81 and the second driving member 181 are reset, and the testing is completed.

[0129] Referring to Figure 10 The application further provides a test piece thermal physical parameter measuring method using the above thermal physical parameter measuring device 100, which comprises the following steps:

[0130] S110: Obtain temperature values measured by at least two temperature sensors on each of the first heat flow member 11 and the second heat flow member 21;

[0131] That is, obtain temperature values measured by at least two first temperature sensors 13 on the first heat flow member 11, and obtain temperature values measured by at least two second temperature sensors 23 on the second heat flow member 21. In some embodiments, two first temperature sensors 13 on the first heat flow member 11 are obtained, and two second temperature sensors 23 on the second heat flow member 21 are obtained. In other embodiments, more than two first temperature sensors 13 on the first heat flow member 11 are obtained, and more than two second temperature sensors 23 on the second heat flow member 21 are obtained.

[0132] S120: Obtain a first heat flow value according to the thermal conductivity of the heat flow member, the cross-sectional area of the heat flow member, and a data set corresponding to the heat flow member, and obtain a calculated heat flow value according to at least one first heat flow value; each data set includes a first height difference between two temperature sensors and first and second temperature values measured by the two temperature sensors, respectively;

[0133] That is, obtain a first heat flow value according to the first thermal conductivity of the first heat flow member 11, the cross-sectional area of the first heat flow member 11, and a data set corresponding to the first heat flow member 11, and obtain a calculated heat flow value according to at least one first heat flow value. Each data set includes a first height difference between two first temperature sensors 13 and first and second temperature values measured by the two first temperature sensors 13, respectively. When only two first temperature sensors 13 are obtained, the corresponding data set is a set, a first heat flow value is obtained, and a calculated heat flow value is obtained by the first heat flow value. When more than two first temperature sensors 13 are obtained, the corresponding data set is a plurality of sets, a plurality of first heat flow values are obtained, and a calculated heat flow value is obtained by the plurality of first heat flow values.

[0134] The manner of obtaining the calculated heat flow value of the second heat flow member 11 is referred to the first heat flow member 11.

[0135] Wherein, the first thermal conductivity of the first heat flow member 11 and the second thermal conductivity of the second heat flow member 21 are known calibration values. The cross-sectional area of the first heat flow member 11 is the cross-sectional area of the regular shape region of the first heat flow member 11, and the cross-sectional area of the second heat flow member 21 is the cross-sectional area of the regular shape region of the second heat flow member 21. Specifically, the cross-sectional area of the first heat flow member 11 is the cross-sectional area of the first mounting section 1111, and the cross-sectional area of the second heat flow member 21 is the cross-sectional area of the second mounting section 2111. Generally, the cross-sectional areas of the first mounting section 1111 and the second mounting section 2111 are equal and known values.

[0136] Further, the temperature measured by the first temperature sensors 13 is the temperature on the first installation section 1111, and the first height difference between the two first temperature sensors 13 is also a known value. The temperature measured by the second temperature sensors 23 is the temperature on the second installation section 2111, and the first height difference between the two second temperature sensors 23 is also a known value.

[0137] S130: correcting the calculated heat flow value based on the correction coefficient to obtain a corrected heat flow value, and determining the corrected heat flow value as the target heat flow value; the correction coefficient is the ratio of the measured heat flow value of the heat flow meter on each heat flow piece to the corresponding calculated heat flow value under the heat flow correction working condition;

[0138] The heat flow correction working condition is a working condition in which the temperature difference between the first heat flow piece 11 and the second heat flow piece 21 is less than a preset threshold. Under the heat flow correction working condition, the heat flow of the first heat flow piece 11 and the second heat flow piece 21 is small, and the heat flow of the first heat flow piece 11 can be measured by the first heat flow meter 12 with a small measurement range and high measurement accuracy, and the heat flow of the second heat flow piece 21 can be measured by the second heat flow meter 22 with a small measurement range and high measurement accuracy.

[0139] Since the first heat flow meter 12 and the second heat flow meter 22 have high measurement accuracy for heat flow, the measured heat flow value of the heat flow meter on each heat flow piece under the heat flow correction working condition is the accurate heat flow value of the heat flow piece. After obtaining the correction coefficient by comparing the measured heat flow value with the calculated heat flow value, the corrected heat flow value obtained by correcting the calculated heat flow value under the large heat flow working condition by the correction coefficient is also an accurate heat flow value. Since the corrected heat flow value is the accurate heat flow value of the heat flow piece, the corrected heat flow value can be used as the target heat flow value of the heat flow piece. In this way, no matter how large the heat flow is, the target heat flow value is the accurate heat flow value of the corresponding heat flow piece.

[0140] S140: obtaining the thermal physical parameters of the test piece 300 in the test space 30 according to the target heat flow value of the first heat flow piece 11, the target heat flow value of the second heat flow piece 21, and a preset rule.

[0141] The test piece thermophysical property parameter measurement method provided by the embodiments of the present application can measure the heat flow on the heat flow piece corresponding to the heat flow piece under the heat flow correction working condition to obtain a measured heat flow value, and the temperature sensor can detect the temperature of the corresponding heat flow piece. The first heat flow value is obtained according to the thermal conductivity of the heat flow piece, the cross-sectional area of the heat flow piece, and the data set (each data set includes a first height difference between two temperature sensors and a first temperature value and a second temperature value measured by the two temperature sensors, respectively) of the corresponding heat flow piece. The calculated heat flow value is obtained according to the first heat flow value. The correction coefficient is obtained according to the ratio of the measured heat flow value under the heat flow correction working condition and the calculated heat flow value, and the corrected heat flow value is obtained by correcting the calculated heat flow value under other working conditions (such as a large heat flow working condition) based on the correction coefficient. The corrected heat flow value is taken as the target heat flow value, and finally the thermophysical property parameter of the test piece 300 is obtained according to the target heat flow value of the first heat flow piece 11, the target heat flow value of the second heat flow piece 21, and a preset rule. In this way, the heat flow measurement range of the heat flow piece is large and the measurement accuracy is high, which can meet the high-precision and large-range heat flow measurement requirement. Since the thermophysical property parameter measurement accuracy is related to the heat flow range and the heat flow accuracy, when the heat flow can be measured with high precision and in a large range, the high-precision measurement requirement for the thermophysical property parameter is ensured.

[0142] Further, the test piece thermophysical property parameter measurement method further comprises:

[0143] Q1 = λ1 * A1 * (T1 - T2) / L1, T1 > T2; Q2 = k * Q3;

[0144] Q1 is the first heat flow value, λ1 is the thermal conductivity of the heat flow piece, A1 is the cross-sectional area of the heat flow piece, T1 is the first temperature value, T2 is the second temperature value, L1 is the first height difference, Q2 is the target heat flow value, Q3 is the calculated heat flow value, and k is the correction coefficient.

[0145] It should be noted that Q2 can also represent the measured heat flow value measured by the heat flow meter under the heat flow correction working condition.

[0146] Wherein, referring to Figure 11 , the first temperature value and the second temperature value on the first heat flow piece 11 are denoted as Th1 and Th2 respectively, and the first height difference and the target heat flow value corresponding to the first heat flow piece 11 are denoted as Lh1 and Qh2 respectively. The first temperature value and the second temperature value on the second heat flow piece 21 are denoted as Tc1 and Tc2 respectively, and the first height difference and the target heat flow value corresponding to the second heat flow piece 21 are denoted as Lc1 and Qc2 respectively.

[0147] When the first heat flow value is one, the first heat flow value is taken as the calculated heat flow value; when the first heat flow value is multiple, the average of the multiple first heat flow values is taken as the calculated heat flow value.

[0148] When the thermal conductivity λ1 of the heat flow member, the cross-sectional area A1 of the heat flow member, and the first temperature value T1, the second temperature value T2, and the first height difference T1 in the data set are determined, the first heat flow value Q1 can be obtained according to the formula: Q1 = λ1*A1*(T1-T2) / L1.

[0149] When only two temperature sensors measure the temperature of the heat flow member, the first heat flow value is one, and the first heat flow value is used as the calculated heat flow value. When more than two temperature sensors measure the temperature of the heat flow member, the first heat flow value is more than one, and the average of the plurality of first heat flow values is used as the calculated heat flow value. The more accurate the calculated heat flow value obtained by the first heat flow value.

[0150] In some embodiments, the thermophysical parameter includes the total thermal resistance; S140 includes:

[0151] An average heat flow value is obtained according to the target heat flow value of the first heat flow member 11 and the target heat flow value of the second heat flow member 21.

[0152] The target heat flow value of the first heat flow member 11 and the target heat flow value of the second heat flow member 21 can be obtained in step S130, and the average heat flow value can be obtained according to the target heat flow values of the two.

[0153] A third temperature value measured by the first temperature sensor 13 installed on the first heat flow member 11 for pressing the end of the test piece 300 and a fourth temperature value measured by the second temperature sensor 23 installed on the second heat flow member 21 for pressing the end of the test piece 300 are obtained.

[0154] Specifically, the third temperature value measured by the first temperature sensor 13 installed on the first pressure head 112 is obtained, and the fourth temperature value measured by the second temperature sensor 23 installed on the second pressure head 212 is obtained.

[0155] The total thermal resistance of the test piece is obtained according to the average heat flow value, the third temperature value, and the fourth temperature value.

[0156] The total thermal resistance of the test piece is related to the average heat flow value, the temperatures of the cold and hot ends for pressing the end of the test piece 300, and the total thermal resistance of the test piece can be obtained according to the average heat flow value, the third temperature value, and the fourth temperature value.

[0157] Further, the test piece thermophysical parameter measurement method further comprises:

[0158] Q = (Qh2 + Qc2) / 2, R = (Th3 - Tc3) / Q;

[0159] Wherein, Q is the average heat flow value, Qh2 is the target heat flow value of the first heat flow member 11, Qc2 is the target heat flow value of the second heat flow member 21, Th3 is the third temperature value, Tc3 is the fourth temperature value, and R is the total thermal resistance of the test piece.

[0160] When the target heat flow value Qh2 of the first heat flow piece 11, the target heat flow value Qc2 of the second heat flow piece 21, the third temperature value Th3 and the fourth temperature value Tc3 are determined, the total thermal resistance of the test piece can be obtained according to the formula: Q=(Qh2+Qc2) / 2, R=(Th3-Tc3) / Q.

[0161] In some embodiments, the thermophysical parameters further include a thermal conductivity and a contact thermal resistance; and S140 further includes:

[0162] The fifth temperature value at the first position close to the first heat flow piece 11 and the sixth temperature value at the second position close to the second heat flow piece 21 of the test piece 300 are obtained.

[0163] Optionally, a third temperature sensor and a fourth temperature sensor are arranged on the test piece 300, the third temperature sensor detects the fifth temperature value at the first position, and the fourth temperature sensor detects the sixth temperature value at the second position.

[0164] The thermal conductivity of the test piece is obtained according to the average heat flow value, the fifth temperature value, the sixth temperature value, the second height difference between the first position and the second position, and the cross-sectional area of the test piece 300.

[0165] Generally, the second height difference between the first position and the second position is a known value, the test piece 300 is of a regular shape, and the cross-sectional area of the test piece 300 is known.

[0166] The contact thermal resistance of the test piece 300 is obtained according to the total thermal resistance of the test piece and the thermal conductivity of the test piece.

[0167] Since the total thermal resistance of the test piece is obtained as described above, when the thermal conductivity of the test piece is obtained, the contact thermal resistance of the test piece 300 can be obtained according to the total thermal resistance of the test piece and the thermal conductivity of the test piece.

[0168] Specifically, the test piece thermophysical parameter measurement method further includes:

[0169] Q=(Qh2+Qc2) / 2, λ2=L2 / [A2(Th4-Tc4) / Q], Rj=R-L2 / (λ2.A2)

[0170] Wherein, Q is the average heat flow value, Qh2 is the target heat flow value of the first heat flow piece 11, Qc2 is the target heat flow value of the second heat flow piece 21, λ2 is the thermal conductivity of the test piece, L2 is the second height difference, A2 is the cross-sectional area of the test piece 300, Th4 is the fifth temperature value, Tc4 is the sixth temperature value, R is the total thermal resistance of the test piece, and Rj is the contact thermal resistance of the test piece 300.

[0171] When the average heat flow value Q, the second height difference L2, the cross-sectional area A2 of the test piece 300, the fifth temperature value Th4 and the sixth temperature value Tc4 are determined, the thermal conductivity λ2 of the test piece can be obtained according to the formula λ2=L2 / [A2(Th4-Tc4) / Q].

[0172] When the thermal conductivity λ2 and the total thermal resistance R of the test piece are known, the contact thermal resistance of the test piece 300 can be obtained according to the formula Rj = R - L2 / (λ2.A2).

[0173] The technical features of the above-described embodiments can be combined in any manner. For the sake of brevity, not all possible combinations of the technical features in the above-described embodiments are described, but it should be understood that any combination of the technical features is within the scope of the present disclosure as long as the combination does not result in a contradiction.

[0174] The above-described embodiments only express several embodiments of the present application, and the description is relatively specific and detailed, but it should not be understood as a limitation on the scope of the patent. It should be noted that for those skilled in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which are within the scope of the present application. Therefore, the scope of protection of the present application should be subject to the appended claims.

Claims

1. A thermophysical property measurement apparatus, characterized by, The thermal physical parameter measuring device comprises a hot-end compression mechanism (10) and a cold-end compression mechanism (20). The hot-end compression mechanism (10) comprises a first heat flow member (11) having a first thermal conductivity, a first heat flow meter (12) and at least two first temperature sensors (13) which are arranged along a first direction and are mounted on the first heat flow member (11), the first heat flow meter (12) being used for measuring the heat flow of the first heat flow member (11). The cold-end compression mechanism (20) comprises a second heat flow member (21) having a second thermal conductivity, a second heat flow meter (22) and at least two second temperature sensors (23) which are arranged along the first direction and are mounted on the second heat flow member (21), the second heat flow meter (22) being used for measuring the heat flow of the second heat flow member (21). The first heat flow member (11) and the second heat flow member (21) are oppositely arranged along the first direction and form a test space (30) for mounting a test piece (300) therebetween, and the hot-end compression mechanism (10) and the cold-end compression mechanism (20) can generate relative movement along the first direction so that the first heat flow member (11) and the second heat flow member (21) cooperatively compress the test piece (300) located in the test space (30).

2. The thermophysical parameter measurement device according to claim 1, characterized in that The thermal physical parameter measuring device further comprises a heat source (50) for heating the first heat flow member (11). And / or The thermal physical parameter measuring device further comprises a cold source (60) for cooling the second heat flow member (21).

3. The thermophysical parameter measurement device according to claim 2, characterized in that The heat source (50) comprises a heating sheet, and the thermal physical parameter measuring device further comprises a heat insulation compression assembly (70) which compresses the heating sheet on an end surface of the first heat flow member (11) away from the second heat flow member (21) along the first direction. And / or The cold source (60) further comprises a flow channel structure (61), a refrigerant machine and a heating member (62), the refrigerant machine being in communication with a flow channel of the flow channel structure (61), the second heat flow member (21) and the heating member (62) being mounted on the flow channel structure (61), and the refrigerant machine and the heating member (62) being in cold and hot confrontation to control the temperature of the flow channel structure (61).

4. The thermophysical parameter measurement device according to claim 1, characterized in that The first heat flow member (11) comprises a first main body (111) and a first pressure head (112), the first pressure head (112) being arranged at one end of the first main body (111) along the first direction to form the test space (30) with the second heat flow member (21); the first heat flow meter (12) is arranged on the first main body (111), at least two first temperature sensors (13) are arranged on the first main body (111) and are located on both sides of the first heat flow meter (12), and at least one first temperature sensor (13) is arranged on the first pressure head (112). And / or The second heat flow meter (22) comprises a second main body (211) and a second pressure head (212), the second pressure head (212) is arranged at one end of the second main body (211) along the first direction to form the test space (30) with the first heat flow device (11); the second heat flow meter (22) is arranged on the second main body (211), at least two second temperature sensors (23) are arranged on the second main body (211) and located on both sides of the second heat flow meter (22), and at least one second temperature sensor (23) is arranged on the second pressure head (212).

5. The thermophysical parameter measurement device of claim 1, wherein One of the first temperature sensors (13) is mounted on the first heat flow device (11) for crimping the end of the test piece (300); And / or One of the second temperature sensors (23) is mounted on the second heat flow device (21) for crimping the end of the test piece (300).

6. The thermophysical parameter measurement device of claim 1, wherein The thermal physical parameter measuring device further comprises a first driving mechanism (80), one of the hot end crimping mechanism (10) and the cold end crimping mechanism (20) is connected with the first driving mechanism (80), and the first driving mechanism (80) is used to drive the one to generate relative motion with the other along the first direction to crimp the test piece (300) located in the test space (30).

7. The thermophysical parameter measurement device according to claim 6, characterized in that The thermal physical parameter measuring device further comprises a first connecting piece (90), a second connecting piece (110) and an elastic piece (120), the first connecting piece (90) is connected with one of the hot end crimping mechanism (10) and the cold end crimping mechanism (20), the second connecting piece (110) connects the first connecting piece (90) and the first driving mechanism (80), and the elastic piece (120) is arranged between the second connecting piece (110) and the hot end crimping mechanism (10) or the cold end crimping mechanism (20) along the first direction; The first driving mechanism (80) can drive the first connecting piece (90), the second connecting piece (110), the elastic piece (120) and the crimping mechanism connected with the first connecting piece (90) to move along the first direction; the second connecting piece (110) is movably connected with the first connecting piece (90) along the first direction, and when the crimping mechanism connected with the first connecting piece (90) contacts with the test piece (300), the second connecting piece (110) moves relative to the first connecting piece (90) to compress the elastic piece (120).

8. A method for measuring a thermal physical property of a test piece using the measuring apparatus according to any one of claims 1 to 7, characterized by, It comprises: Obtaining the temperature values measured by at least two temperature sensors on each of the first heat flow device (11) and the second heat flow device (21); Obtaining the first heat flow value according to the thermal conductivity of the heat flow device, the cross-sectional area of the heat flow device and the data set corresponding to the heat flow device, and obtaining the calculated heat flow value according to at least one first heat flow value; each data set comprises a first height difference between two temperature sensors and first and second temperature values measured by the two temperature sensors respectively; The calculated heat flow value is corrected based on the correction coefficient to obtain a corrected heat flow value, and the corrected heat flow value is determined as the target heat flow value; The thermal physical parameter measuring device further comprises a first driving mechanism (80), one of the hot end crimping mechanism (10) and the cold end crimping mechanism (20) is connected with the first driving mechanism (80), and the first driving mechanism (80) is used to drive the one to generate relative motion with the other along the first direction to crimp the test piece (300) located in the test space (30). The thermal physical parameter measuring device further comprises a first connecting piece (90), a second connecting piece (110) and an elastic piece (120), the first connecting piece (90) is connected with one of the hot end crimping mechanism (10) and the cold end crimping mechanism (20), the second connecting piece (110) connects the first connecting piece (90) and the first driving mechanism (80), and the elastic piece (120) is arranged between the second connecting piece (110) and the hot end crimping mechanism (10) or the cold end crimping mechanism (20) along the first direction; The first driving mechanism (80) can drive the first connecting piece (90), the second connecting piece (110), the elastic piece (120) and the crimping mechanism connected with the first connecting piece (90) to move along the first direction; the second connecting piece (110) is movably connected with the first connecting piece (90) along the first direction, and when the crimping mechanism connected with the first connecting piece (90) contacts with the test piece (300), the second connecting piece (110) moves relative to the first connecting piece (90) to compress the elastic piece (120). It comprises: Obtaining the temperature values measured by at least two temperature sensors on each of the first heat flow device (11) and the second heat flow device (21); Obtaining the first heat flow value according to the thermal conductivity of the heat flow device, the cross-sectional area of the heat flow device and the data set corresponding to the heat flow device, and obtaining the calculated heat flow value according to at least one first heat flow value; each data set comprises a first height difference between two temperature sensors and first and second temperature values measured by the two temperature sensors respectively; The calculated heat flow value is corrected based on the correction coefficient to obtain a corrected heat flow value, and the corrected heat flow value is determined as the target heat flow value; The correction coefficient is the ratio of the measured heat flow value of the heat flow meter on each heat flow piece to the corresponding calculated heat flow value under the heat flow correction working condition; The thermal physical parameters of the test piece (300) located in the test space (30) are obtained according to the target heat flow value of the first heat flow piece (11), the target heat flow value of the second heat flow piece (21) and a preset rule.

9. The test piece thermal physical parameter measurement method according to claim 8, characterized in that, Q1 = λ1 * A1 * (T1 - T2) / L1, T1 > T2; Q2 = k * Q3; Q1 is the first heat flow value, λ1 is the thermal conductivity of the heat flow piece, A1 is the cross-sectional area of the heat flow piece, T1 is the first temperature value, T2 is the second temperature value, L1 is the first height difference, Q2 is the target heat flow value, and Q3 is the calculated heat flow value; When the first heat flow value is one, the first heat flow value is taken as the calculated heat flow value; when the first heat flow value is multiple, the average of the multiple first heat flow values is taken as the calculated heat flow value.

10. The method according to claim 8 or 9, wherein The thermal physical parameters include total thermal resistance; and the thermal physical parameters of the test piece (300) located in the test space (30) are obtained according to the target heat flow value of the first heat flow piece (11), the target heat flow value of the second heat flow piece (21) and a preset rule. An average heat flow value is obtained according to the target heat flow value of the first heat flow piece (11) and the target heat flow value of the second heat flow piece (21); A third temperature value measured by a first temperature sensor (13) installed on the first heat flow piece (11) for pressing the end of the test piece (300) and a fourth temperature value measured by a second temperature sensor (23) installed on the second heat flow piece (21) for pressing the end of the test piece (300) are obtained; A test piece total thermal resistance is obtained according to the average heat flow value, the third temperature value and the fourth temperature value.

11. The test piece thermal physical parameter measurement method according to claim 10, characterized in that, Q = (Qh2 + Qc2) / 2, R = (Th3 - Tc3) / Q; Wherein, Q is the average heat flow value, Qh2 is the target heat flow value of the first heat flow piece (11), Qc2 is the target heat flow value of the second heat flow piece (21), Th3 is the third temperature value, Tc3 is the fourth temperature value, and R is the test piece total thermal resistance.

12. The method according to claim 10, wherein The thermal physical parameters include thermal conductivity and contact thermal resistance; and the measurement method further comprises: A fifth temperature value of the test piece (300) at a first position close to the first heat flow piece (11) and a sixth temperature value at a second position close to the second heat flow piece (21) are obtained; A test piece thermal conductivity is obtained according to the average heat flow value, the fifth temperature value, the sixth temperature value, a second height difference between the first position and the second position, and the cross-sectional area of the test piece (300); A test piece (300) contact thermal resistance is obtained according to the test piece total thermal resistance and the test piece thermal conductivity.

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