Advertising luminous character LED lamp strip and manufacturing method thereof

Abstract

The invention discloses an advertising light-emitting word LED lamp strip and a manufacturing method thereof.The manufacturing method comprises the steps that metal foil and a non-conductive polymer plastic film are pasted together to form a composite material, then photoresist is coated on the metal foil of the composite material, then exposure, developing and etching are conducted, and a conductive circuit with the line distance smaller than or equal to 0.1 mm is obtained; insulating ink is printed or a layer of die cutting insulating film is pasted to cover a non-welding area, selective surface treatment is carried out on a bonding pad to achieve tin affinity, then a surface-mounted luminous body is fixedly connected to the bonding pad, then glue is evenly dripped on the surface of the lamp strip for curing to achieve corrosion prevention and insulation, and stickiness is achieved through back glue on the back face; and then stamping and striping are carried out to obtain lamp strips, the lamp strips subjected to different stamping and striping are electrified, whether defects exist or not is checked, and then the LED lamp strips of the advertising luminous characters are obtained. The tin-affinity is large, the compactness of the bonding pad is larger, the bonding pad is not prone to being oxidized and rusted, and the service life is long. The luminous body can be directly integrated with a circuit, and the luminous angle can reach 180 degrees. The pad area is small, and the solder paste usage amount is reduced.

Description

Technical Field

[0001] This invention relates to LED light strips, and more particularly to an LED light strip for advertising illuminated signs and its manufacturing method. Background Technology

[0002] Traditional illuminated advertising signs use LED chips soldered onto the light strips, which has the following drawbacks: 1. The use of gravure printing technology results in a large spacing between conductive lines, leading to a low effective area utilization rate of the circuit board; 2. Due to the large area of ​​the solder pads, solder is wasted during soldering; 3. Due to the large area of ​​the solder pads, the light emission characteristics of the soldering point source result in uneven axial light intensity distribution; 4. The multi-level packaging structure of LED chips increases light energy loss and material costs; 5. Poor density, easily oxidized and rusted, short service life, and high installation cost. Summary of the Invention

[0003] Based on this, the purpose of this application is to provide an LED light strip for advertising illuminated signs and a method for manufacturing the same.

[0004] A method for manufacturing an LED light strip for illuminated advertising signs includes the following steps: A composite material is formed by bonding a metal foil and a non-conductive first polymer plastic film together. Photoresist is then applied to the metal foil of the composite material, followed by exposure, development, and etching to obtain conductive lines with a spacing ≤0.1mm. An insulating cover film, which is either printed insulating ink or a die-cut insulating film, is then applied to the non-soldering areas of the metal foil. Tin affinity is achieved by selectively surface-treating the pads. Tin is then applied to the pads to fix the surface-mount LED emitter. Adhesive is then uniformly applied to the surface of the LED strip and cured to achieve corrosion resistance and insulation. Adhesive on the reverse side provides adhesion. The strip is then stamped and slit to obtain the LED strip. Power is applied to the different stamped and slit LED strips to check for defects. Defective areas are repaired or replaced to obtain the LED LED strip for advertising illuminated signs.

[0005] A further improvement is that the selective surface treatment includes sequentially applying zinc or active metal plating and nickel plating to the pads.

[0006] A further improvement is that the selective surface treatment includes sequentially applying zinc or active metal plating, nickel plating, and copper plating to the pads.

[0007] A further improvement is that the size of the pad is adapted to the size of the surface mount light emitter.

[0008] An LED light strip for advertising illuminated signs, comprising: Polymer plastic film; Metal foil circuit; Patch light emitter and cover layer; The metal foil circuit is fixed on the surface of the polymer plastic film and etched to form conductive lines with a line spacing of ≤0.1mm. The cover layer covers the surface of the metal foil circuit and forms pad windows. The pads are plated with zinc or active metal, nickel and / or copper. The patch light emitter is electrically connected to the metal foil circuit through the pad windows. A transparent coating adhesive is uniformly covered on the patch light emitter and the cover layer.

[0009] A further improvement is that the patch light emitter is an unpackaged LED light source with a light emission angle ≥180°.

[0010] In a further improvement, the metal foil used in the metal foil circuit is aluminum foil, copper foil, or a copper-aluminum composite material.

[0011] In a further improvement, the polymer plastic film is a PET film, a PI film, a PEN film, or a fiberglass cloth.

[0012] In a further improvement, the covering layer is an insulating ink screen-printed on the surface of a metal foil or a second polymer plastic film with pad windows cut out.

[0013] In summary, this application includes the following beneficial technical effects: 1. The composite material of metal foil and polymer plastic film is used to etch conductive lines with a line spacing of ≤0.1mm, resulting in high effective area utilization.

[0014] 2. Achieve direct integration of the light source and the circuit, with a light emission angle ≥180°.

[0015] 3. The pad size is matched with the size of the surface mount light source. The pad area is small, and the flip-chip process can be used to directly mount the light source, resulting in low manufacturing cost.

[0016] 4. Small pad area reduces solder paste usage, resulting in lower costs and faster processing.

[0017] 5. Selective surface treatments such as zinc plating, nickel plating, and copper plating are performed sequentially on the pads. This increases their tin affinity, making the pads denser and less prone to oxidation and rust, thus extending the lifespan of the LED strip and reducing installation costs. Attached Figure Description

[0018] Figure 1 This diagram illustrates the use of metal and polymer materials to bond together to form a composite material. Figure 2 To achieve solderability, a layer of polymer material with molded solder pad windows is used to cover the non-soldering area by screen printing insulating ink or pasting a layer of molded insulating ink.

[0019] Figure 3 After the patch is applied, a stamping and slitting process is performed. Different voltages are applied to the slitting LED strips to check for defects. Any unqualified parts are repaired or replaced.

[0020] Explanation of reference numerals in the attached figures: 1. Metal foil; 2. Polymer plastic film; 3. First pad; 4. Second pad; 5. Third pad. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. The manufacturing method of the LED light strip for advertising illuminated signs in this embodiment includes the following steps: Metal foil 1 and non-conductive polymer plastic film 2 are bonded together to form a composite material. Then, photoresist is applied to the metal foil 1 of the composite material, followed by exposure, development, and etching to obtain conductive lines with a line spacing ≤0.1mm. An insulating cover film is then applied to the non-soldering area of ​​the metal foil 1. The cover film is either printed with insulating ink or a layer of die-cut insulating film is pasted on. Tin affinity is achieved by selectively surface treating the pads. Then, the chip light emitter is fixed after soldering on the pads. Then, glue is evenly dripped onto the surface of the light strip and cured to achieve corrosion resistance and insulation. Adhesive on the back side achieves adhesion. The light strip is then stamped and slit to obtain the light strip. The light strips with different stamping and slits are powered on and inspected for defects. Defective parts are repaired or replaced to obtain the advertising illuminated letter LED light strip.

[0022] Selective surface treatments include sequentially applying zinc or active metal plating to the pads, followed by nickel plating; or sequentially applying zinc or active metal plating to the pads, followed by nickel plating, followed by copper plating.

[0023] The LED light strip for advertising illuminated signs in this embodiment includes: 2. Polymer plastic film; Metal foil circuit; Patch light emitter and cover layer; The metal foil circuit is fixed on the surface of the polymer plastic film 2 and etched to form conductive lines with a line spacing of ≤0.1mm. The cover layer covers the surface of the metal foil circuit and forms pad windows. The pads are plated with zinc or active metal, nickel and / or copper. The patch light emitter is electrically connected to the metal foil circuit through the pad windows. A transparent coating adhesive is uniformly covered on the patch light emitter and the cover layer.

[0024] The surface-mount LED is an unencapsulated LED light source with a beam angle ≥180°.

[0025] The metal foil used in metal foil circuits is aluminum foil, copper foil, or copper-aluminum composite material.

[0026] The polymer plastic film is a PET film, PI film, PEN film, or fiberglass cloth.

[0027] The covering layer is either an insulating ink screen-printed on the surface of the metal foil 1 or a second polymer plastic film with solder pad windows cut out.

[0028] Although embodiments of the present invention have been disclosed above, they are not limited to the applications listed in the specification and embodiments. They can be applied to various fields suitable for the present invention. Other modifications can be easily made by those skilled in the art. Therefore, without departing from the general concept defined by the claims and their equivalents, the present invention is not limited to the specific details and shown herein.

Claims

1. A method for manufacturing an LED light strip for illuminated advertising signs, characterized in that, Includes the following steps: Metal foil (1) and non-conductive polymer plastic film (2) are bonded together to form a composite material. Then, photoresist is applied to the metal foil (1) of the composite material, and then exposure, development and etching are performed to obtain a conductive line with a line spacing ≤0.1mm. Then, an insulating cover film is covered on the non-welding area of ​​the metal foil (1). The cover film is printed insulating ink or a layer of die-cut insulating film is pasted. Tin affinity is achieved by selectively surface treating the pads, then the chip light emitter is fixed after soldering on the pads, and then adhesive is uniformly dripped onto the surface of the light strip to achieve corrosion resistance and insulation, and the backing adhesive achieves adhesion. The strips are then stamped and slit to obtain LED strips. Power is supplied to the LED strips that have been stamped and slit, and any defects are checked. Any defective parts are repaired or replaced to obtain LED LED strips for advertising illuminated signs.

2. The method for manufacturing LED light strips for advertising illuminated signs according to claim 1, characterized in that: The selective surface treatment includes sequentially applying zinc or active metal plating and nickel plating to the pads.

3. The method for manufacturing LED light strips for advertising illuminated signs according to claim 1, characterized in that: The selective surface treatment includes sequentially applying zinc or active metal plating, nickel plating, and copper plating to the pads.

4. The method for manufacturing LED light strips for advertising illuminated signs according to claim 2 or 3, characterized in that: The size of the pads is matched to the size of the surface mount light emitter.

5. An LED light strip for advertising illuminated signs, characterized in that, include: Polymer plastic film (2); Metal foil circuit; Patch light emitter and cover layer; The metal foil circuit is fixed on the surface of the polymer plastic film (2) and etched to form conductive lines with a line spacing of ≤0.1mm. The cover layer covers the surface of the metal foil circuit and forms a pad window. The pad is plated with zinc or active metal, nickel or copper. The patch light emitter is electrically connected to the metal foil circuit through the pad window. The patch light emitter and the cover layer are uniformly covered with a transparent coating adhesive.

6. The LED light strip for advertising illuminated signs as described in claim 5, characterized in that: The patch-mount light emitter is an unencapsulated LED light source with a light emission angle ≥180°.

7. The LED light strip for advertising illuminated signs as described in claim 6, characterized in that: The metal foil (1) used in the metal foil circuit is aluminum foil, copper foil or copper-aluminum composite material.

8. The LED light strip for advertising illuminated signs as described in claim 7, characterized in that: The polymer plastic film (2) is a PET film, PI film, PEN film or fiberglass cloth.

9. The LED light strip for advertising illuminated signs as described in claim 8, characterized in that: The covering layer is an insulating ink screen-printed on the surface of a metal foil (1) or a second polymer plastic film with solder pad windows cut out.

Images