Laser processing system
By using a spatial light modulator to load a multi-ring aperiodic phase diagram in a laser processing system, Gaussian laser is converted into a multi-ring laser beam, solving the problem of low processing efficiency of Gaussian laser and achieving uniform distribution of laser energy and efficient processing.
Patent Information
- Application Number
- CN202511169751.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-20
- Publication Date
- 2025-12-19
Smart Images
Figure CN121156478A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the technical fields of optical engineering and precision manufacturing, and in particular to a laser processing system. Background Technology
[0002] Existing laser processing systems utilize Gaussian lasers. The intensity of a Gaussian laser exhibits a high-intensity, low-intensity distribution at the center and diminishing towards the edges. This results in extremely high energy density at the center and a sharp drop in energy at the edges, leading to overheating and a high risk of carbonization in the center of the processing area, while also causing insufficient heat input at the edges. Furthermore, the limited processing range of Gaussian lasers necessitates complex processing trajectories (such as spiral filling and concentric circle filling), resulting in low processing efficiency for existing laser processing systems. Summary of the Invention
[0003] The main objective of this invention is to provide a laser processing system that addresses the technical problem of low processing efficiency in existing laser processing systems.
[0004] To achieve the above-mentioned objectives, this invention proposes a laser processing system.
[0005] A laser processing system, comprising:
[0006] Laser, used to provide Gaussian laser light;
[0007] A beam expanding module is used to expand the Gaussian laser provided by the laser.
[0008] Polarization module; used to polarize Gaussian laser beams after beam expansion; and
[0009] The spatial light modulator, the beam expander module, the polarization module and the spatial light modulator are arranged sequentially along the direction of the Gaussian laser generated by the laser. The spatial light modulator is used to load a multi-ring aperiodic phase distribution diagram onto the Gaussian laser, convert the Gaussian laser into a multi-ring laser beam, and process the workpiece by the multi-ring laser beam.
[0010] In one embodiment, the spatial light modulator includes a transparent electrode, a liquid crystal layer, a dielectric film reflector, and a pixel electrode. The transparent electrode, the liquid crystal layer, the dielectric film reflector, and the pixel electrode are stacked sequentially. The transparent electrode abuts against the liquid crystal layer, and the transparent electrode and the pixel electrode are electrically connected. The transparent electrode and the pixel electrode form an electric field to regulate the molecular arrangement state of the liquid crystal layer.
[0011] In one embodiment, the spatial light modulator includes a glass substrate and a silicon substrate, the glass substrate being disposed on the side of the transparent electrode opposite to the liquid crystal layer, and the silicon substrate being disposed on the side of the pixel electrode opposite to the dielectric film reflector.
[0012] In one embodiment, the polarization module includes a waveplate, a polarizing beam splitter, and a power meter. The waveplate and the polarizing beam splitter are disposed between the beam expander and the spatial light modulator, and are arranged along the direction of the Gaussian laser provided by the laser. The waveplate is used to adjust the polarization direction of the Gaussian laser generated by the laser. The polarizing beam splitter can divide the Gaussian laser into a first part and a second part. The first part of the Gaussian laser enters the spatial light modulator, and the second part of the Gaussian laser enters the power meter. The power meter is used to dynamically monitor the laser energy of the second part of the Gaussian laser.
[0013] In one embodiment, the laser processing system includes a filtering module disposed opposite to the spatial light modulator, the filtering module being used to filter the multi-ring laser beam emitted by the spatial light modulator.
[0014] In one embodiment, the filtering module includes a first lens, a spectral plane, and a second lens. The first lens is positioned close to the spatial light modulator relative to the spectral plane and the second lens. The first lens, the spectral plane, and the second lens are arranged sequentially along the direction of the multi-ring laser beam emitted from the spatial light modulator, and the focal lengths of the first lens and the second lens are equal.
[0015] In one embodiment, the first lens, the spectral plane, and the second lens are arranged coaxially.
[0016] In one embodiment, the spectral plane is located at the point where the focal lengths of the first lens and the second lens coincide.
[0017] In one embodiment, the laser processing system includes a galvanometer module, the spatial light modulator and the galvanometer module being arranged along the direction of the multi-ring laser beam provided by the laser, the galvanometer module being used to change the reflection angle of the multi-ring laser beam, thereby adjusting the relative position of the multi-ring laser beam to the workpiece.
[0018] In one embodiment, the laser processing system includes a telecentric field mirror, which is disposed opposite to the galvanometer module, and is used to focus the multi-ring laser beam output by the galvanometer module.
[0019] Beneficial effects:
[0020] The laser processing system of this invention includes a laser, a beam expander module, a polarization module, and a spatial light modulator. The laser provides Gaussian laser light. The beam expander module expands the Gaussian laser light provided by the laser. The polarization module polarizes the expanded Gaussian laser light. The spatial light modulator, beam expander module, polarization module, and spatial light modulator are arranged sequentially along the direction of the Gaussian laser light generated by the laser. The spatial light modulator loads a multi-ring aperiodic phase diagram onto the Gaussian laser light, converting it into a multi-ring laser beam, and then processes the workpiece using this multi-ring laser beam.
[0021] During operation, the spatial light modulator modulates the phase of the Gaussian laser by loading a multi-ring aperiodic phase map, converting it into a multi-ring laser beam with energy uniformly distributed along the multi-ring region. This multi-ring laser beam allows the laser energy distribution to directly match the target processing area of a preset size, eliminating the need for complex trajectories such as spiral filling or concentric circle filling required by traditional Gaussian lasers to cover the processing area. The uniform multi-ring energy distribution of the multi-ring laser beam enables full coverage processing of the target processing area in a single operation, eliminating the trajectory filling step required by Gaussian lasers due to energy distribution limitations. This simplifies the processing path, thereby shortening processing time and improving processing efficiency. Attached Figure Description
[0022] Figure 1 This is a schematic diagram of the structure of a laser processing system according to an embodiment of the present invention.
[0023] Figure 2 This is a schematic diagram of the structure of a spatial light modulator according to an embodiment of the present invention.
[0024] Figure 3 This is a schematic diagram of the structure of a filtering module according to an embodiment of the present invention.
[0025] Figure 4 This is a schematic diagram of Gaussian light according to an embodiment of the present invention.
[0026] Figure 5 This is a schematic diagram of a multi-ring laser according to an embodiment of the present invention.
[0027] in:
[0028] 100. Laser;
[0029] 200. Beam expander module;
[0030] 310. Wave plate; 320. Polarizing beam splitter; 330. Power meter;
[0031] 400 Spatial light modulator; 410 Transparent electrode; 420 Liquid crystal layer; 430 Dielectric film reflector; 440 Pixel electrode; 450 Glass substrate; 460 Silicon substrate;
[0032] 500. Reflector;
[0033] 600. Processing platform;
[0034] 700. Filtering module; 710. First lens; 720. Spectral plane; 730. Second lens;
[0035] 800, Galvanometer module;
[0036] 900, Telecentric field lens.
[0037] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation
[0038] It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
[0039] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of the stated features. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.
[0040] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, a direct connection, or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.
[0041] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0042] like Figures 1 to 5 As shown, in some embodiments, the laser processing system includes a laser 100, a beam expander 200, a polarization module, and a spatial light modulator 400. The laser 100 provides Gaussian laser light. The beam expander 200 expands the Gaussian laser light provided by the laser 100. The polarization module polarizes the expanded Gaussian laser light. The spatial light modulator 400, beam expander 200, polarization module, and spatial light modulator 400 are arranged sequentially along the direction of the Gaussian laser light generated by the laser 100. The spatial light modulator 400 loads a multi-ring aperiodic phase diagram onto the Gaussian laser light, converting it into a multi-ring laser beam, and then processes the workpiece using this multi-ring laser beam. Specifically, the multi-ring laser beam can be a five-ring laser beam. The spatial light modulator 400 loads a five-ring aperiodic phase diagram onto the Gaussian laser light, thereby obtaining a single laser beam with uniform energy distribution in space.
[0043] Specifically, laser 100 serves as the laser source, outputting an initial Gaussian laser beam. The intensity of the Gaussian laser beam exhibits a Gaussian distribution, with a high intensity at the center and a low intensity at the edges. Specifically, the workpiece to be processed is the object of laser processing, such as various materials requiring window-opening processing.
[0044] During operation, the spatial light modulator 400 modulates the phase of the Gaussian laser by loading a multi-ring aperiodic phase map, converting it into a multi-ring laser beam with energy uniformly distributed along the multi-ring region. This multi-ring laser beam allows the laser energy distribution to directly match the target processing area of a preset size, eliminating the need for complex trajectories such as spiral filling or concentric circle filling required by traditional Gaussian lasers to cover the processing area. The uniform multi-ring energy distribution of the multi-ring laser beam enables full coverage processing of the target processing area in a single operation, eliminating the trajectory filling step required by Gaussian lasers due to energy distribution limitations. This simplifies the processing path, thereby shortening processing time and improving processing efficiency.
[0045] In addition, this laser processing system utilizes a spatial light modulator 400 to achieve dynamic beam dot-mapping, punching, shaping, and windowing. This laser processing system is suitable for precision laser machining, improving processing efficiency and enhancing windowing stability.
[0046] The spatial light modulator 400 enables dynamic beam punching and shaping for windowing, which is applied to a high-precision, non-contact laser processing system based on ultrashort pulse lasers. It achieves rapid shaping of micron-sized holes or windows on material surfaces through the instantaneous impact of a high-energy laser beam. This laser processing system features high repeatability, no mechanical stress, and uniform etching. It is suitable for processing materials sensitive to heat or requiring complex microstructures. Traditional Gaussian lasers face significant challenges in efficient windowing, including substantial heat accumulation, low efficiency in fill-in processing, poor etching consistency, and limited applicability and target size after adding diffraction optical elements. The spatial light modulator 400's dynamic beam shaping punching mode significantly improves processing efficiency and quality through precise control of pulse energy and spatial phase.
[0047] Furthermore, this laser processing system enables highly efficient parallel processing. By dynamically adjusting the phase data, the spot size, shape, and energy distribution of the processed circular window can be changed in real time according to the target requirements. This overcomes the inconveniences of using Gaussian beams and diffractive optical elements (DOEs) for circular windows with diameters ranging from 80µm to 200µm. It also changes the dependence of traditional Gaussian beam window opening using apertures and DOE components to shape the beam, and the complexity of using spiral or concentric circle filling for circular window sizes ranging from 80µm to 200µm. In addition, it improves production efficiency and processing quality.
[0048] This laser processing system can precisely control the energy intensity of each spatial phase. It effectively suppresses problems such as the expansion of the heat-affected zone caused by excessive or uneven energy concentration, significantly improving the quality of the window surface and the geometric accuracy of the window.
[0049] This laser processing system requires no physical hardware replacement (such as a fixed DOE), can adapt to the processing needs of different laser windowing patterns, and reduces the time and cost of process changeover.
[0050] In summary, this invention provides a novel, efficient, precise, flexible, and economical approach to address the limitations of traditional Gaussian laser filling-type processing and the use of fixed DOE beam shaping devices, as well as the bottleneck problem of opening windows in circular sizes with diameters of approximately 80µm to 200µm, through the dynamic dotting and punching beam shaping windowing of the spatial light modulator 400. This improves the overall performance and industrial applicability of laser windowing processing.
[0051] The specific implementation methods are shown in the table below:
[0052]
[0053]
[0054]
[0055] Specifically, the beam expander module 200 can be a variable magnification beam expander. The beam expander module 200 expands the Gaussian laser output from the laser 100 and adjusts the diameter of the Gaussian laser to fit subsequent optical components such as polarization modules.
[0056] Specifically, the beam expander module 200 is located at the exit of the laser 100.
[0057] In some embodiments, the polarization module is used to polarize the Gaussian laser after beam expansion. The polarization module can change the polarization direction of the Gaussian laser so that the polarization direction of the Gaussian laser can be adjusted to match the polarization direction of the spatial light modulator 400.
[0058] Specifically, the polarization module includes a waveplate 310, a polarizing beam splitter 320, and a power meter 330. The waveplate 310 and polarizing beam splitter 320 are positioned between the beam expander module 200 and the spatial light modulator 400, and are arranged along the direction of the Gaussian laser provided by the laser 100. The waveplate 310 is used to adjust the polarization direction of the Gaussian laser generated by the laser 100, and the polarizing beam splitter 320 can divide the Gaussian laser into a first part and a second part. The first part of the Gaussian laser enters the spatial light modulator 400, and the second part of the Gaussian laser enters the power meter 330. The power meter 330 is used to dynamically monitor the laser energy of the second part of the Gaussian laser. Specifically, the waveplate 310 can be a half-waveplate.
[0059] It should be noted that a half-wave plate is an optical device that utilizes the birefringence effect. A half-wave plate can adjust the polarization direction of incident laser light by changing the optical path difference between the two orthogonal components of linearly polarized light. A polarizing beam splitter 320 (PBS) is an optical element that achieves beam separation based on polarization characteristics. The polarizing beam splitter 320 can separate incident light into transmitted and reflected light according to the polarization direction of the Gaussian laser. A power meter 330 is an instrument used for real-time measurement of laser energy. The power meter 330 can dynamically monitor changes in the energy of the incident laser.
[0060] During operation, waveplate 310 is positioned near beam expander module 200 to directly receive the expanded Gaussian laser beam. The optical principal axis of waveplate 310 forms a specific angle with the laser polarization direction to achieve precise adjustment of the polarization direction. Polarizing beam splitter 320 is located behind waveplate 310 and receives the Gaussian laser beam adjusted by waveplate 310. Polarizing beam splitter 320 splits the Gaussian laser beam into two parts: a first part that continues to propagate along the original optical path and a second part that is reflected perpendicular to the original optical path. The first part of the Gaussian laser beam directly enters the subsequent spatial light modulator 400. The second part of the Gaussian laser beam is guided to power meter 330. Power meter 330 is aligned with the reflected optical path of polarizing beam splitter 320 to ensure accurate reception and monitoring of the energy of the second part of the Gaussian laser beam.
[0061] In some embodiments, the laser processing system includes a reflector 500. The reflector 500 is disposed between the polarizing beam splitter 320 and the spatial light modulator 400. The reflector 500 is used to change the reflection angle of the Gaussian laser.
[0062] In some embodiments, the laser processing system includes a processing platform 600. The processing platform 600 carries the workpiece to be processed.
[0063] In some embodiments, the spatial light modulator 400 includes a transparent electrode 410, a liquid crystal layer 420, a dielectric film reflector 430, and a pixel electrode 440. The transparent electrode 410, liquid crystal layer 420, dielectric film reflector 430, and pixel electrode 440 are stacked sequentially. The transparent electrode 410 abuts against the liquid crystal layer 420, and the transparent electrode 410 and pixel electrode 440 are electrically connected. The transparent electrode 410 and pixel electrode 440 form an electric field to modulate the molecular arrangement state of the liquid crystal layer 420.
[0064] It should be noted that the transparent electrode 410 can be a transparent thin film with conductive properties. The transparent electrode 410 is typically made of indium tin oxide (ITO). The transparent electrode 410 can both conduct electrical signals and transmit Gaussian laser light. The liquid crystal layer 420 is a functional layer composed of liquid crystal molecules. The molecular arrangement of the liquid crystal layer 420 can be changed under the action of an external electric field, thereby modulating the phase of the incident light beam. The dielectric film reflector 430 is a reflective device formed by stacking multiple dielectric films. The dielectric film reflector 430 can efficiently reflect the light beam modulated by the liquid crystal layer 420, enabling the light beam to carry phase information and transmit in the reverse direction. The pixel electrode 440 is a micro-electrode distributed in an array. Each pixel of the pixel electrode 440 corresponds to an independent control unit, which can realize local phase modulation of the light beam.
[0065] A transparent electrode 410, a liquid crystal layer 420, a dielectric film reflector 430, and a pixel electrode 440 are stacked sequentially along the incident direction of the light beam. The lower surface of the transparent electrode 410 directly abuts against the upper surface of the liquid crystal layer 420, ensuring that the electric field can effectively act on the liquid crystal layer 420. The lower surface of the liquid crystal layer 420 is tightly attached to the upper surface of the dielectric film reflector 430, allowing the modulated light beam to directly incident on the reflector 500. The lower surface of the dielectric film reflector 430 is connected to the upper surface of the pixel electrode 440, and the pixel electrode 440 is electrically connected to the transparent electrode 410 via a wire. When the transparent electrode 410 and the pixel electrode 440 are energized, a stable electric field is formed between them, which penetrates the liquid crystal layer 420 and regulates the alignment of liquid crystal molecules.
[0066] Furthermore, the array design of the pixel electrodes 440 enables precise local control of the liquid crystal layer 420. The pixel electrodes 440, in conjunction with the transparent electrode 410, can load a multi-ring aperiodic phase map, converting the Gaussian laser into a uniformly energetic multi-ring laser beam, effectively solving the problem of uneven energy distribution in traditional Gaussian lasers. Moreover, the dielectric film reflector 430 can efficiently reflect the modulated beam, reducing energy loss and improving beam utilization.
[0067] During operation, a specific electrical signal is first applied to the transparent electrode 410 and the pixel electrode 440 to create an electric field between them, which then acts on the liquid crystal layer 420. Under the influence of the electric field, the liquid crystal molecules change their alignment, forming a molecular orientation distribution corresponding to the multi-ring aperiodic phase diagram. Subsequently, a Gaussian laser beam is incident on and passes through the transparent electrode 410. After entering the liquid crystal layer 420, its phase is modulated by the alignment of the liquid crystal molecules. The modulated beam reaches the dielectric film reflector 430, is reflected, and carries the phase information in the reverse direction. It then passes through the liquid crystal layer 420 and the transparent electrode 410 again, ultimately outputting a multi-ring laser beam that meets the requirements, completing the beam shaping and modulation. This process controls the phase distribution in real time through changes in the electrical signal.
[0068] In some embodiments, the spatial light modulator 400 includes a glass substrate 450 and a silicon substrate 460. The glass substrate 450 is disposed on the side of the transparent electrode 410 opposite to the liquid crystal layer 420, and the silicon substrate 460 is disposed on the side of the pixel electrode 440 opposite to the dielectric film reflector 430.
[0069] It should be noted that the spatial light modulator 400 includes a glass substrate 450, a transparent electrode 410, a liquid crystal layer 420, a dielectric film reflector 430, a pixel electrode 440, and a silicon substrate 460 arranged sequentially. The glass substrate 450 is the uppermost transparent support substrate. The glass substrate 450 is made of a high-transmittance glass material, allowing the laser beam to enter the internal optical structure without obstruction. The silicon substrate 460 is the lowermost substrate. The silicon substrate 460 can be made of semiconductor silicon material.
[0070] In some embodiments, the laser processing system includes a filtering module 700. The filtering module 700 is disposed opposite to the spatial light modulator 400. The filtering module 700 is used to filter the multi-ring laser beam emitted from the spatial light modulator 400. The filtering module 700 can be a 4f Fourier transform system.
[0071] The filter module 700 is an optical component equipped with a pinhole aperture, the diameter of which can be adjusted according to processing requirements. The function of the filter module 700 is to filter out stray light and ineffectively modulated zero-order light in the beam, retaining only the target-order multi-ring laser beam.
[0072] The filter module 700 is located in the propagation path of the multi-ring laser beam emitted by the spatial light modulator 400. The multi-ring laser beam output by the spatial light modulator 400 is directly incident on the filter module 700. This configuration ensures that the entire multi-ring laser beam emitted by the spatial light modulator 400 enters the effective filtering area of the filter module 700, enabling the filter module 700 to accurately process the multi-ring laser beam and provide a high-quality laser beam for subsequent precision machining.
[0073] By filtering the multi-ring laser beam emitted from the spatial light modulator 400, zero-order invalid light and higher-order diffraction noise in the beam can be effectively filtered out, preventing these stray lights from interfering with the processing area and thus improving the utilization rate of laser energy. At the same time, the energy distribution of the filtered multi-ring laser beam is more concentrated and uniform, which can reduce the problem of heat-affected zone expansion caused by energy fluctuations during processing, and significantly improve the quality of the window surface and the geometric accuracy of the window.
[0074] Specifically, the filtering module 700 includes a first lens 710, a spectral plane 720, and a second lens 730. The first lens 710 is positioned close to the spatial light modulator 400 relative to the spectral plane 720 and the second lens 730. The first lens 710, the spectral plane 720, and the second lens 730 are arranged sequentially along the direction of the multi-ring laser beam emitted from the spatial light modulator 400, and the focal lengths of the first lens 710 and the second lens 730 are equal. The spectral plane 720 is equipped with an adjustable pinhole filter. The diameter of this filter is 50-200 μm.
[0075] It should be noted that the first lens 710 is a convex lens with a specific focal length. The first lens 710 performs a Fourier transform on the incident multi-ring laser beam, converting the beam distribution in the spatial domain into a spectral domain distribution. The spectral plane 720 is a planar region located at the back focal plane of the first lens 710. The spectral plane 720 is used to house spatial filters such as pinhole apertures. This spatial filter can filter out invalid components such as zero-order light and higher-order diffraction noise in the beam. The second lens 730 is also a convex lens with a specific focal length. The second lens 730 performs an inverse Fourier transform on the spectrum after filtering by the spectral plane 720, converting the spectral domain distribution back into a beam distribution in the spatial domain.
[0076] During operation, the multi-ring laser beam emitted from the spatial light modulator 400 first enters the first lens 710. The first lens 710 performs a Fourier transform on the beam, converting it into a spectral domain distribution and projecting it onto the spectral plane 720. A spatial filter on the spectral plane 720 filters this spectrum, retaining the target-order light while filtering out the zero-order light and higher-order noise. The filtered spectrum then enters the second lens 730. The second lens 730 reconstitutes it into a spatial domain multi-ring laser beam through an inverse Fourier transform. After processing, the beam has a more uniform energy distribution and higher purity, and continues to propagate to the workpiece to complete the precision windowing process.
[0077] Specifically, the first lens 710, the spectrum plane 720, and the second lens 730 are coaxially arranged to ensure that the Fourier transform spectrum of the first lens 710 is accurately projected onto the spectrum plane 720. The spatial filter can accurately filter out invalid light, avoid incomplete filtering or loss of target light due to optical path offset, and improve energy utilization.
[0078] Specifically, the spectrum plane 720 is located at the intersection of the focal length of the first lens 710 and the focal length of the second lens 730, ensuring that the spectrum after Fourier transform by the first lens 710 can be accurately projected onto the spectrum plane 720.
[0079] In some embodiments, the laser processing system includes a galvanometer module 800. The spatial light modulator 400 and the galvanometer module 800 are positioned along the direction of the multi-ring laser beam provided by the laser 100. The galvanometer module 800 is used to change the reflection angle of the multi-ring laser beam, thereby adjusting the relative position of the multi-ring laser beam to the workpiece.
[0080] It should be noted that the multi-ring laser beam output from the spatial light modulator 400 is directly incident on the reflector 500 of the galvanometer module 800. The spatial light modulator 400 and the galvanometer module 800 are coupled through an optical path. The galvanometer module 800 is located between the spatial light modulator 400 and the workpiece to be processed. The angle of the reflector 500 within the galvanometer module 800 can be adjusted by a control system, allowing the reflected multi-ring laser beam to be precisely projected onto different positions on the workpiece. This arrangement ensures a stable path for the multi-ring laser beam during propagation and allows for flexible adjustment of its position on the workpiece by the galvanometer module 800, providing a basis for diverse processing needs.
[0081] In some embodiments, the laser processing system includes a telecentric field mirror 900. The telecentric field mirror 900 is disposed opposite to the galvanometer module 800. The telecentric field mirror 900 is used to focus the multi-ring laser beam output from the galvanometer module 800.
[0082] It should be noted that the telecentric field lens 900 is a special type of focusing lens. The design of the telecentric field lens 900 features telecentric characteristics. That is, the principal ray of the beam incident on the lens is parallel to the optical axis, maintaining a consistent focused spot size over a large range and ensuring processing accuracy at different locations.
[0083] The multi-ring laser beam output from the galvanometer module 800 is directly incident on the telecentric field mirror 900. The galvanometer module 800 and the telecentric field mirror 900 are arranged sequentially along the beam propagation path.
[0084] The telecentric characteristics of the telecentric field lens 900 maintain the stability of the focused spot size and energy distribution when the galvanometer module 800 adjusts the beam direction, avoiding spot distortion caused by changes in the beam incident angle and ensuring consistent precision across the processing area. The high-efficiency focusing capability of the telecentric field lens 900 concentrates the energy of multi-ring laser beams, enhancing processing results. The combination of the rapid angle adjustment of the galvanometer module 800 and the stable focusing of the telecentric field lens 900 ensures both processing speed and improved geometric accuracy of the window opening, making it suitable for high-precision, large-area laser windowing processing.
[0085] Working principle:
[0086] A beam expander module 200 is placed at the exit of the laser 100. A half-wave plate is located behind the beam expander module 200. The Gaussian laser provided by the laser 100 passes through the beam expander module 200 and then through a polarization module composed of a half-wave plate and a polarizing beam splitter 320, changing the laser's linear polarization direction to make it parallel to the optical axis of the spatial light modulator 400. At this point, the Gaussian laser is divided into a first part and a second part. The second part of the Gaussian laser enters the power meter 330. The power meter 330 is used for dynamic monitoring of laser energy. The first part of the Gaussian laser reaches the reflector 500 along the optical axis. After reflection, the Gaussian laser reaches the spatial light modulator 400, where a phase map is loaded. Using a first lens 710, a pinhole aperture, and a second lens 730, the zero-order light of the spectral plane is filtered, retaining only the target-order light. This light then passes through a galvanometer module 800 and a telecentric field mirror 900, finally processing the workpiece on the processing platform 600.
[0087] The above description is merely a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural or procedural transformations made based on the content of the present invention's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present invention.
Claims
1. A laser processing system characterized by, The laser processing system comprises a laser for providing a Gaussian laser beam; a beam expanding module for expanding the Gaussian laser beam provided by the laser; a polarization module; a spatial light modulator; and a filter module. The spatial light modulator comprises a transparent electrode, a liquid crystal layer, a dielectric mirror, and a pixel electrode, which are sequentially stacked and arranged, the transparent electrode and the liquid crystal layer are in abutment, the transparent electrode and the pixel electrode are electrically connected, and the transparent electrode and the pixel electrode form an electric field to regulate the molecular arrangement state of the liquid crystal layer. The spatial light modulator comprises a glass substrate and a silicon substrate, the glass substrate is arranged on the side of the transparent electrode away from the liquid crystal layer, and the silicon substrate is arranged on the side of the pixel electrode away from the dielectric mirror. The polarization module comprises a wave plate, a polarization beamsplitter, and a power meter, the wave plate and the polarization beamsplitter are arranged between the beam expanding module and the spatial light modulator, and the wave plate and the polarization beamsplitter are arranged along the direction of the Gaussian laser beam provided by the laser, the wave plate is used to adjust the polarization direction of the Gaussian laser beam generated by the laser, the polarization beamsplitter can split the Gaussian laser beam into a first part and a second part, the first part of the Gaussian laser beam enters the spatial light modulator, the second part of the Gaussian laser beam enters the power meter, and the power meter is used to dynamically monitor the laser energy of the second part of the Gaussian laser beam. The laser processing system comprises a filter module, which is arranged opposite to the spatial light modulator, and is used to filter the multi-ring laser beam emitted by the spatial light modulator. The filter module comprises a first lens, a spectral plane, and a second lens, the first lens is arranged close to the spatial light modulator relative to the spectral plane and the second lens, the first lens, the spectral plane, and the second lens are sequentially arranged along the direction of the multi-ring laser beam emitted by the spatial light modulator, and the focal length of the first lens is equal to the focal length of the second lens.
2. The laser processing system according to claim 1, characterized by, The first lens, the spectral plane, and the second lens are coaxially arranged.
3. The laser processing system of claim 2, wherein, The spectral plane is located at the overlapping position of the focal length of the first lens and the focal length of the second lens.
4. The laser processing system of claim 1, wherein, The laser processing system comprises a galvanometer module, the spatial light modulator and the galvanometer module are arranged along the direction of the multi-ring laser beam provided by the laser, the galvanometer module is used to change the reflection angle of the multi-ring laser beam, thereby adjusting the relative position of the multi-ring laser beam relative to the workpiece.
5. The laser processing system of claim 1, wherein, 6. The laser processing system of claim 5, wherein, 7. The laser processing system of claim 6, wherein, 8. The laser processing system of claim 6, wherein, 9. The laser processing system of claim 1, wherein, 10. The laser processing system of claim 9, wherein, The laser processing system comprises a telecentric field lens, which is arranged opposite to the galvanometer module and used for focusing the multi-ring laser beam output by the galvanometer module.