In-hole laser parallel machining device and method

Abstract

The invention provides an in-hole laser parallel processing device and method, relates to the field of laser processing, and aims to solve the problems of low in-hole structure processing efficiency and low in precision in existing laser processing, a single beam of laser is divided into multiple beams of parallel laser for simultaneous processing, and the processing efficiency can be doubled compared with that of a traditional single-point scanning mode. A plurality of feature points can be formed through one-time processing, so that the overall processing time is greatly shortened; each laser beam is provided with an independent condensing lens in one-to-one correspondence, so that the laser energy of each processing point can be accurately focused, the problems of aberration and the like possibly caused by using a single large lens are avoided, and the processing quality and precision of each point under parallel processing are ensured; a parallel beam splitting system which is complex in function and large in size is arranged outside a hole, only a reflector which is relatively simple in structure and a compact condensing lens array extend into the hole, and the problem that a complex optical system is integrated in a limited hole cavity is solved by adopting the design that the interior and the exterior are separated.

Description

Technical Field

[0001] This invention relates to the field of laser processing, and specifically to an intra-hole laser parallel processing device and method. Background Technology

[0002] Laser processing utilizes high-energy-density laser beams to cut, drill, etch, or modify the surface of materials. The processing location has gradually expanded from planar surfaces to complex internal cavities, hole walls, and curved structures. However, due to the confined space and limited optical path within the hole, traditional laser focusing methods struggle to achieve efficient and stable energy transfer and shaping within the hole, thus limiting processing efficiency and consistency.

[0003] Existing laser processing devices for engraving the inner walls of rotating parts utilize a combination of beam expanders, reflectors, and 3D scanning galvanometers, along with X / Y motion components and rotary clamping, to achieve point-by-point or small-area scanning processing of the inner wall pattern. This is suitable for image engraving of the inner walls of rotating parts of various sizes. However, it still relies on a single-beam point-by-point processing mode based on galvanometer scanning, limiting processing efficiency. While some solutions exist that can achieve planar multi-beam output in free space, these structures are transmission-type beam splitters and do not address beam reflection, direction changing, and focusing control within a confined cavity. Therefore, existing technologies struggle to solve the problem of achieving high-precision parallel processing within the limited space of an aperture. Summary of the Invention

[0004] In view of this, the present invention provides a parallel laser processing device and method for in-hole processing. The parallel beam splitting system is located outside the hole and outputs multiple parallel laser beams. The working reflector is inserted into the hole, and the reflected multiple laser beams are focused by the focusing lens for processing, thereby improving processing accuracy and processing efficiency.

[0005] The first objective of this invention is to provide an intra-hole laser parallel processing device, which employs the following solution: include: Laser; The working reflector is inserted into the hole; A parallel beam splitting system is arranged between the laser and the working mirror. It consists of multiple beam splitters and beam splitting mirrors. It splits the laser beam output by the laser into multiple parallel laser beams and projects them onto the working mirror. A focusing lens is arranged on the path of the working reflector reflecting multiple laser beams. The focusing lens and the multiple laser beams are distributed in a one-to-one correspondence so that the laser is focused onto the hole wall to perform laser processing.

[0006] Furthermore, the working reflector has a strip-shaped structure, and the reflecting surface of the working reflector is inclined relative to the axis of the hole it probes.

[0007] Furthermore, the multiple laser beams transmitted by the working reflector are distributed coplanarly with the axis of the hole in which they are located.

[0008] Furthermore, the condensing lens is provided in multiple parts, which are distributed sequentially at intervals along the axis of the aperture.

[0009] Furthermore, the working reflector is connected to a reflection adjustment structure for adjusting the position and tilt angle of the working reflector, and the focusing lens is connected to a focusing adjustment mechanism for adjusting the position of the focusing lens to adapt to the multi-beam laser output after adjusting the working reflector.

[0010] A second objective of the present invention is to provide a method for parallel laser machining within a hole, utilizing the parallel laser machining apparatus for within a hole as described in the first objective, comprising: Place the working mirror inside the hole that needs to be machined; The laser outputs laser light and projects it onto a parallel beam splitting system. The parallel beam splitting system splits the single laser beam into multiple parallel laser beams that are transmitted onto the working reflector inside the aperture. Multiple laser beams are reflected by the working mirror and transmitted towards the hole wall, and then focused by the focusing lens to perform laser processing on the hole wall.

[0011] Furthermore, the laser output power is adjusted according to the in-hole machining method.

[0012] Furthermore, the tilt angle of the working reflector is adjusted to change the spacing of the multiple laser beams projected onto the condenser lens, and the spacing of the condenser lens is adjusted to match the multiple laser beams.

[0013] Furthermore, the relative positions of the working mirror and the hole are adjusted to change the laser processing position.

[0014] Furthermore, based on the laser processing location, a parallel beam splitting system is selected to match the number of laser beams output by the parallel beam splitting system with the number of simultaneous processing locations.

[0015] Compared with the prior art, the advantages and positive effects of this invention are: To address the issues of low efficiency and low precision in laser processing of internal hole structures, this method splits a single laser beam into multiple parallel laser beams for simultaneous processing. This significantly improves processing efficiency compared to traditional single-point scanning, allowing multiple feature points to be formed in a single process, thus greatly reducing overall processing time. By equipping each laser beam with an independent, one-to-one corresponding focusing lens, the laser energy at each processing point is precisely focused, avoiding aberrations that may occur when using a single large lens, and ensuring the processing quality and precision of each point under parallel processing. The complex and bulky parallel beam splitting system is placed outside the hole, while only the relatively simple working mirror and compact focusing lens array are inserted into the hole. This internal and external separation design solves the problem of integrating a complex optical system within a limited cavity. Attached Figure Description

[0016] The accompanying drawings, which form part of this invention, are used to provide a further understanding of the invention. The illustrative embodiments of the invention and their descriptions are used to explain the invention and do not constitute an improper limitation of the invention.

[0017] Figure 1 This is a schematic diagram of the structure of the in-hole laser parallel processing device in one or more embodiments of the present invention.

[0018] Figure 2 This is a schematic diagram of one implementation of the parallel beam splitting system in one or more embodiments of the present invention.

[0019] Among them, 1. laser; 2. parallel beam splitting system; 3. workpiece; 4. working mirror; 5. focusing lens; 6. beam splitter; 7. first beam splitter mirror; 8. second beam splitter mirror. Detailed Implementation

[0020] Example 1 In a typical embodiment of the present invention, such as Figures 1-2 As shown, a parallel laser processing device for in-hole processing is presented.

[0021] The problem this embodiment aims to solve is how to achieve both high efficiency and high precision in parallel laser processing within the limited space inside a hole in a rotating part. To address this, an in-hole laser parallel processing device is provided, which can utilize multiple beams to achieve parallel processing to improve efficiency, while cleverly overcoming the physical limitations of the narrow space inside the hole of the workpiece 3 and ensuring processing accuracy.

[0022] The in-hole laser parallel processing device mainly includes a laser 1, a parallel beam splitting system 2, a working mirror 4, and a focusing lens 5. The laser 1 serves as the energy source, providing an initial laser beam required for processing. Along the laser's optical path, the parallel beam splitting system 2, the working mirror 4, and the focusing lens 5 are distributed sequentially.

[0023] The parallel beam splitting system 2 is the foundation for parallel processing. It consists of multiple beam splitters 6 and beam-splitting mirrors, arranged outside the aperture between the laser 1 and the mirror 4. This places the relatively complex optical function of generating multiple beams in an external region with unrestricted space. Its function is to convert the single laser beam output from the laser 1 into multiple parallel laser beams, such as… Figure 2 The laser beam output from the laser shown illuminates a beam splitter 6. The laser beam transmitted through the beam splitter 6 is used as the first split laser beam, and the second split laser beam is reflected to the first beam splitter mirror 7. Then, the first beam splitter mirror 7 reflects the laser beam to the second beam splitter mirror 8 for further reflection and adjustment of the laser beam direction, so that it is parallel to the first split laser beam transmitted through the beam splitter 6. On this basis, the first split laser beam is further split, transmitted and reflected through another beam splitter 6, and finally, multiple parallel distributed laser beams are output.

[0024] The working reflector 4 can penetrate into the aperture, acting as a light path deflector to receive multiple pre-splitned parallel laser beams from outside the aperture and reflect them as a whole, directing them towards the inner wall of the aperture. A focusing lens 5 is positioned after the working reflector 4, along the path of the multiple laser beams towards the aperture wall. Multiple focusing lenses 5 are distributed one-to-one with the multiple laser beams, forming a lens array. Each lens independently and precisely focuses its corresponding laser beam into a small spot on the aperture wall, thereby achieving high-precision material removal or modification.

[0025] By working in concert with laser 1, parallel beam splitting system 2, working mirror 4, and focusing lens 5, the problem of high-efficiency and high-precision parallel machining within a hole is completely solved. Taking the machining of the feature structure on the inner wall of workpiece 3 as an example, the principle and process are as follows: First, laser 1 emits a laser beam. Before reaching the aperture, this laser beam passes through an externally arranged parallel beam splitting system 2. The parallel beam splitting system 2 decomposes this single laser beam into multiple parallel laser beams. At this point, the parallel processing foundation has been established, and this process is not affected by the space inside the aperture.

[0026] Subsequently, multiple parallel laser beams are irradiated onto the surface of the working reflector 4, which has already penetrated the hole. The angle of the working reflector 4 is designed to reflect these multiple laser beams as a whole, changing their propagation direction from axial to radial, directly hitting the inner wall of the hole. This directs the laser energy from outside the hole into the processing area inside the hole.

[0027] After being reflected, these multiple laser beams pass through corresponding focusing lenses 5 within a short distance before reaching the hole wall. Each focusing lens 5 focuses the laser beam it receives, forming multiple independent, high-energy-density micro-spots on the hole wall. These spots simultaneously act on different positions on the hole wall, thereby performing parallel laser processing tasks (such as engraving, marking, etc.).

[0028] By employing a process of external parallel beam splitting, internal reflection steering, and internal parallel focusing, the capability for multi-beam parallel processing has been transferred from open spaces to the narrow cavity interior.

[0029] This embodiment divides a single laser beam into multiple parallel laser beams for simultaneous processing, significantly improving processing efficiency compared to traditional single-point scanning methods. Multiple feature points can be formed in a single processing operation, drastically reducing overall processing time. By equipping each laser beam with an independent, one-to-one corresponding focusing lens 5, it ensures that the laser energy at each processing point is precisely focused. This avoids aberrations and other problems that may occur when using a single large lens, guaranteeing the processing quality and accuracy of each point under parallel processing.

[0030] The complex and potentially bulky parallel beam splitter system 2 is placed outside the aperture, while only the relatively simple working mirror 4 and the compact condenser lens array 5 are inserted into the aperture. This internal-external separation structure solves the problem of integrating a complex optical system within a limited aperture cavity, demonstrating practicality and feasibility.

[0031] Specifically, such as Figure 1 As shown, the working reflector 4 has a strip-shaped structure, with its reflecting surface distributed at an angle relative to the axis of the aperture. The working reflector 4 adopts a slender shape to maximize its adaptation to the narrow space within the aperture. Its small radial dimension allows it to easily penetrate apertures of different diameters, solving the problem of space constraints.

[0032] The laser beam enters along the axis of the hole and illuminates the reflective surface of the tilted working mirror 4. According to the law of reflection, the propagation direction of the beam is changed and redirected to the inner wall of the hole. The tilt angle is key to achieving the radial processing of the beam. The function and form of the working mirror 4 are highly unified. Its strip structure makes it a probe that can penetrate deep into the processing area; the tilted reflective surface makes it a deflector that accurately guides multiple laser beams from outside the hole to the target processing surface, forming the basis of the core step of internal reflection and deflection.

[0033] The multiple laser beams reflected by the working reflector 4 are coplanar with the axis of the aperture they are in. After being reflected, all the parallel laser beams lie on the same plane containing the central axis of the aperture. On the inner wall of the aperture, a straight array of laser spots is formed along the axis of the aperture.

[0034] In this embodiment, parallel processing is specifically defined as linear parallel processing. When processing a straight line, a row of points, or other axially distributed patterns, the in-hole laser parallel processing device can complete the processing of multiple points at once, without the need for point-by-point scanning as with traditional galvanometers. For example, to engrave a straight line, traditional methods require scanning countless points, while in this embodiment, multiple lines can be drawn in one stroke by rotating or translating the workpiece 3, greatly improving efficiency.

[0035] Multiple focusing lenses 5 are arranged sequentially and spaced apart along the axis of the aperture. The focusing system consists of a one-dimensional lens array, rather than a single complex lens. Each lens is precisely positioned to correspond to a laser beam, and they are arranged in a row along the axis of the aperture. By equipping each beam with an independent focusing element, precise and independent focusing control can be achieved at each processing point, ensuring that the energy density and size of each spot meet the process requirements. This divide-and-conquer design, compared to using a large, complex lens to simultaneously focus all beams, makes it easier to achieve high image quality, and the structure is simpler and more compact, further adapting to the space constraints within the aperture.

[0036] The working reflector 4 is connected to a reflection adjustment structure for adjusting the position and tilt angle of the working reflector 4. The focusing lens 5 is connected to a focusing adjustment mechanism for adjusting the position of the focusing lens 5 to adapt to the multi-beam laser output after adjusting the working reflector 4.

[0037] The reflection adjustment structure can employ a telescopic mechanism in conjunction with a rotating mechanism. The telescopic mechanism can be an electric push rod, and the rotating mechanism can be a servo motor, allowing the operator to fine-tune the insertion position and tilt angle of the working reflector 4. The focusing adjustment mechanism can be a combination of multiple telescopic mechanism components, with the telescopic mechanism also employing an electric push rod, allowing the operator to fine-tune the position of the focusing lens 5 group.

[0038] By adjusting the position and angle of the working reflector 4, the position of the light beam on the hole wall can be changed, thus adapting to holes of different diameters and lengths. The precision of laser processing is highly dependent on whether the focal point is accurately positioned on the processing surface. When the optical path changes due to changing the workpiece 3 or adjusting the working reflector 4, the focusing adjustment mechanism can re-optimize the distance from the lens to the hole wall to ensure that it is always at the optimal focal point, thereby guaranteeing the highest processing precision and quality.

[0039] This embodiment not only solves the core problem through the architecture of external parallel beam splitting and internal reflection focusing, but also improves the flexibility and high-precision maintenance capability of the device by introducing an adjustment mechanism, enabling it to adapt to different processing needs and ensuring stable, efficient and accurate in-hole parallel laser processing under various conditions, thereby achieving the final technical effect.

[0040] Example 2 In another typical embodiment of the present invention, such as Figure 1 As shown, an in-hole laser parallel processing method is presented, utilizing the in-hole laser parallel processing apparatus as described in Example 1, including the following steps: Place the working mirror 4 into the hole that needs to be machined; Laser 1 outputs laser light and projects it onto parallel beam splitting system 2. Parallel beam splitting system 2 splits the single laser beam into multiple parallel laser beams and transmits them onto the working reflector 4 inside the hole. Multiple laser beams are reflected by the working mirror 4 and transmitted towards the hole wall, and focused by the focusing lens 5 to perform laser processing on the hole wall.

[0041] Specifically, in combination Figure 1 The parallel laser processing method for holes is described in detail in Example 1.

[0042] The working mirror 4 is placed inside the hole to be machined. The working mirror 4 of the device needs to be precisely positioned within the predetermined machining area inside the hole of the workpiece 3. This is the starting point of the entire machining process, introducing the core function of optical path steering into a confined space.

[0043] Laser 1 outputs laser light, which is split into multiple parallel laser beams and transmitted to the working mirror 4 inside the aperture. This is the process of generating and transmitting parallel laser beams. When laser 1 is activated, the single laser beam passes through the parallel beam splitting system 2 outside the aperture and is converted into multiple parallel laser beams. Subsequently, this set of parallel beams enters the aperture as a whole along the axial direction and illuminates the already positioned working mirror 4.

[0044] Multiple laser beams are focused by the working reflector 4 to perform laser processing on the hole wall. The multiple laser beams reaching the working reflector 4 are reflected simultaneously, and their direction changes from axial to radial. At the instant they hit the hole wall, they are each precisely focused into a high-energy-density spot by their corresponding focusing lens 5, and act on the hole wall simultaneously to achieve material removal or modification.

[0045] Depending on the machining method within the hole, the output power of laser 1 is adjusted to control the machining energy. Different materials (such as metals, ceramics, and plastics) and different machining types (such as deep engraving, surface marking, and heat treatment) require different laser energies. This step allows the operator to precisely set the laser power according to specific process requirements, which is fundamental to ensuring machining quality and results.

[0046] Adjusting the tilt angle of the working reflector 4 and the spacing of the condenser lenses 5 controls the geometric features of the parallel processing pattern. By changing the tilt angle of the working reflector 4, the spacing of the reflected multiple laser beams on the aperture wall can be directly changed. To ensure focusing accuracy, the spacing of the condenser lens array 5 must also be adjusted to re-match the beams. This provides the ability to dynamically adjust the spacing of processing points without replacing the beam splitter 2, greatly enhancing the flexibility of the process.

[0047] Adjusting the relative position of the working reflector 4 and the hole controls the machining position. By moving the device or the workpiece 3, the axial position of the working reflector 4 within the hole can be changed (machining different depths) or the circumferential position (machining on the entire inner circumference by rotating the workpiece 3). This step allows parallel beams that could originally only machine a straight line to form complex two-dimensional patterns on the entire inner wall surface through combined movements.

[0048] Depending on the laser processing location, parallel beam splitting system 2 is selected to control the number of parallel processing channels. Some tasks may only require processing two points simultaneously, while others may require eight or more. Utilizing the modular nature of the in-hole laser parallel processing device, the operator can change different parallel beam splitting systems 2 to alter the number of beams processed simultaneously, based on the characteristics of the processing pattern and efficiency requirements. This provides a higher level of freedom for process optimization.

[0049] When using laser parallel drilling: A pulsed laser 1 emits a laser beam, which is split into six parallel laser beams by a parallel beam splitting system 2. The laser beams are then reflected by a strip-shaped working mirror 4 onto a series-distributed focusing lens 5, thereby performing a parallel laser drilling process on the inner wall of the cylindrical workpiece 3.

[0050] During laser welding: A laser beam is emitted from a laser source, split by a parallel beam splitting system 2, and then reflected onto a focusing lens 5 by adjusting the angle of a working reflector 4. This allows for the repair of cracks or defects on the inner wall of a workpiece 3, as well as multi-point rapid welding of the inner wall with other parts.

[0051] The above description is merely a preferred embodiment of the present invention and is not intended to limit the invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A parallel laser processing device for in-hole machining, characterized in that, include: Laser; The working reflector is inserted into the hole; A parallel beam splitting system is arranged between the laser and the working mirror. It consists of multiple beam splitters and beam splitting mirrors. The parallel beam splitting system splits a single laser beam output from the laser into multiple parallel laser beams and projects them onto the working mirror. A focusing lens is arranged on the path of the working reflector reflecting multiple laser beams. The focusing lens and the multiple laser beams are distributed in a one-to-one correspondence so that the laser is focused onto the hole wall to perform laser processing.

2. The in-hole laser parallel processing apparatus as described in claim 1, characterized in that, The working reflector has a strip-shaped structure, and the reflecting surface of the working reflector is inclined relative to the axis of the hole it probes.

3. The in-hole laser parallel processing apparatus as described in claim 2, characterized in that, The multiple laser beams transmitted by the working reflector are coplanar with the axis of the hole in which they are located.

4. The in-hole laser parallel processing apparatus as described in claim 1, characterized in that, The condensing lens is provided in multiple parts, which are distributed sequentially at intervals along the axis of the aperture.

5. The in-hole laser parallel processing apparatus as described in claim 4, characterized in that, The working reflector is connected to a reflection adjustment structure for adjusting the position and tilt angle of the working reflector, and the focusing lens is connected to a focusing adjustment mechanism for adjusting the position of the focusing lens to adapt to the multi-beam laser output after adjusting the working reflector.

6. A method for parallel laser machining within a hole, utilizing the parallel laser machining apparatus for a hole as described in any one of claims 1-5, comprising: Place the working mirror inside the hole that needs to be machined; The laser outputs laser light and projects it onto a parallel beam splitting system. The parallel beam splitting system splits the single laser beam into multiple parallel laser beams that are transmitted onto the working reflector inside the aperture. Multiple laser beams are reflected by the working mirror and transmitted towards the hole wall, and then focused by the focusing lens to perform laser processing on the hole wall.

7. The in-hole laser parallel processing method as described in claim 6, characterized in that, Adjust the laser output power according to the machining method inside the hole.

8. The in-hole laser parallel processing method as described in claim 6, characterized in that, Adjust the tilt angle of the working reflector to change the spacing of the multiple laser beams projected onto the condenser lens, and adjust the spacing of the condenser lens to match the multiple laser beams.

9. The in-hole laser parallel processing method as described in claim 8, characterized in that, Adjust the relative positions of the working mirror and the hole to change the laser processing position.

10. The in-hole laser parallel processing method as described in claim 6, characterized in that, Based on the laser processing location, select a parallel beam splitting system to match the number of laser beams output by the parallel beam splitting system with the number of processing locations simultaneously.

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