Degradable single-component epoxy resin composition and application thereof

Abstract

The invention belongs to the field of thermosetting resin, and discloses a degradable single-component epoxy resin composition and application thereof.The epoxy resin composition comprises 10%-50% of epoxy prepolymer, 5%-30% of modified organic acid dihydrazide curing agent, 0.1%-2% of accelerant, 0-10% of reactive diluent, 10%-70% of filler, 1%-15% of flexibilizer, 0.5%-5% of flame retardant and 0-2% of thixotropic agent, the epoxy prepolymer contains more than two epoxy groups, the modified organic acid dihydrazide curing agent contains two acylhydrazone dynamic covalent bonds and two hydrazide groups, and the end groups of the hydrazide groups are primary amino groups. The composition provided by the invention has the advantages of good storage stability, fast curing property, good corrosion resistance, high bonding strength, high thermal stability of a bonding layer, fast degumming speed and simple preparation process.

Description

TECHNICAL FIELD

[0001] The present application belongs to the field of thermosetting resin, and particularly relates to a degradable single-component epoxy resin composition and application thereof. BACKGROUND

[0002] As a key latent curing agent of epoxy resin system, the core characteristic of organic acid dihydrazide curing agent is that it can coexist stably with epoxy prepolymer at room temperature, and the material formed after curing has excellent flexibility, water resistance, bonding strength and corrosion resistance, so it has wide application value in the fields of coatings, electronic packaging, composite materials and adhesives. However, the traditional organic acid dihydrazide curing system has defects in environmental protection: the permanent three-dimensional cross-linked network formed by curing with epoxy prepolymer makes the material difficult to degrade and recycle, thereby causing resource waste and environmental pollution problems. Specifically, epoxy adhesives and coatings cannot be recycled, and epoxy packaging materials are difficult to degrade efficiently after the retirement of electrical equipment, and these limitations seriously restrict the application prospect in the field of sustainable development. SUMMARY

[0003] The purpose of the present application is to provide a degradable single-component epoxy resin composition containing a modified organic acid dihydrazide curing agent.

[0004] Another purpose of the present application is to provide an application of the degradable single-component epoxy resin composition.

[0005] The purpose of the present application is achieved by the following technical solutions:

[0006] A degradable single-component epoxy resin composition, the raw materials include the following components by weight percentage:

[0007] Epoxy prepolymer: 10% to 50%

[0008] Modified organic acid dihydrazide curing agent: 5% to 30%

[0009] Promoter: 0.1% to 2%

[0010] Active diluent: 0 to 10%

[0011] Filler: 10% to 70%

[0012] Toughening agent: 1% to 15%

[0013] Flame retardant: 0.5% to 5%

[0014] Thixotropic agent: 0 to 2%

[0015] Defoaming agent: 0.1% to 1%

[0016] Coupling agent: 0.1% to 1%

[0017] Leveling agent: 0% to 1%

[0018] The epoxy prepolymer contains two or more epoxy groups, the modified organic acid dihydrazide curing agent contains 2 acylhydrazone dynamic covalent bonds and 2 hydrazide groups, and the terminal groups of the hydrazide groups are both primary amine groups.

[0019] Preferably, the epoxy prepolymer is any one or more of bisphenol A glycidyl ether, hydrogenated bisphenol A glycidyl ether, organosilicon degradable bisphenol A glycidyl ether, bisphenol F glycidyl ether, bisphenol S glycidyl ether, bisphenol AD glycidyl ether, resorcinol diglycidyl ether, ethylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, glycerol diglycidyl ether, 1,4-butanediol diglycidyl ether, neopentyl glycol diglycidyl ether, trimethylolpropane glycidyl ether, tetraphenyl ethane tetraglycidyl ether, polyphenol glycidyl ether, phthalic acid diglycidyl ester, tetrahydrophthalic acid diglycidyl ester, hexahydrophthalic acid diglycidyl ester, 4,5-epoxycyclohexane-1,2-dicarboxylic acid diglycidyl ester, p-aminophenol glycidyl ether, 4,4-diaminodiphenylmethane tetraglycidyl amine, N,N-bis(glycidyl)aniline, 3,4-epoxycyclohexylmethyl-3',4'-epoxycyclohexylmethyl ester, bis((3,4-epoxycyclohexyl)methyl)adipate, dioxo vinyl cyclohexene, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexylmethyl ester, dicyclopentadiene diepoxide, 1,4-cyclohexane dimethanol bis(3,4-epoxycyclohexane carboxylate) ester.

[0020] Preferably, the modified organic acid dihydrazide curing agent is any one or more of the following structures:

[0021] Preferably, the accelerator is one or a mixture of two or more of N-(2-hydroxyphenyl)-N,N'-dimethylurea, N-(3,5-dimethyl-2-hydroxyphenyl)-N,N'-dimethylurea, N-(2-hydroxy-4-nitrophenyl)-N,N'-dimethylurea, N-(2-hydroxy-5-nitrophenyl)-N,N'-dimethylurea, N-(4-chloro-2-hydroxyphenyl)-N,N'-dimethylurea, N-(5-chloro-2-hydroxyphenyl)-N,N'-dimethylurea, N-(4-chlorophenyl)-N,N'-dimethylurea.

[0022] Preferably, the reactive diluent is one or a mixture of two or more of n-butyl glycidyl ether, 2-ethyl-hexyl glycidyl ether, styrene oxide, phenyl glycidyl ether, tolyl glycidyl ether, benzoic acid glycidyl ester.

[0023] Preferably, the filler is one or more than two mixtures of alumina, aluminum nitride, silicon nitride, boron nitride, silicon carbide, aluminum hydroxide, titanium white powder, mica, graphite, nanocarbon fiber, diamond, carbon black, carbon nanotube, graphene, graphyne, iron oxide, zinc oxide, magnesium oxide, talc powder, calcium carbonate, kaolin, barium sulfate, barium titanate, silicon dioxide, quartz powder, glass microbeads, iron powder, copper powder, aluminum powder, zinc powder, silver powder.

[0024] Preferably, the toughening agent is one or more than two mixtures of phenoxy resin, polyether sulfone, polyether imide, polyamide, thermoplastic polyurethane, methyl methacrylate block copolymer, butyl rubber, polysulfide rubber, silicone rubber.

[0025] Preferably, the flame retardant is one or more than two mixtures of melamine cyanurate, dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, phenoxy cyclic phosphazene, triphenyl phosphate, dimethyl methylphosphonate, chlorinated paraffin-52, triethyl phosphate.

[0026] Preferably, the thixotropic agent is one or more than two mixtures of nanosilica, organic bentonite, hydrogenated castor oil, polyamide wax.

[0027] Preferably, the defoaming agent is one or more than two mixtures of BYK-1765, BYK-A525, BYK-A530, BYK-054.

[0028] Preferably, the coupling agent is one or more than two mixtures of 3-(2,3-epoxypropoxy) propyl trimethoxysilane, 3-aminopropyl triethoxysilane, 3- mercaptopropyl trimethyl silane.

[0029] Preferably, the leveling agent is one or more than two mixtures of BYK-310, BYK-358N, BYK-333, BYK-306, BYK-360P.

[0030] Preferably, the raw materials include the following components by weight percentage:

[0031] Epoxy prepolymer: 12% to 45%

[0032] Modified organic acid dihydrazide curing agent: 10% to 20%

[0033] Accelerator: 0.1% to 0.5%

[0034] Active diluent: 0 to 5%

[0035] Filler: 30% to 65%

[0036] Toughening agent: 3% to 10%

[0037] Flame retardant: 3%~5%

[0038] Thixotropic agent: 0~1.5%

[0039] Defoaming agent: 0.2%~0.5%

[0040] Coupling agent: 0.2%~1%

[0041] Leveling agent: 0~0.5%.

[0042] The application of the degradable single-component epoxy resin composition is to use the high-temperature cured composition after being uniformly mixed as an adhesive, a coating or an insulating sealing material.

[0043] Preferably, the curing temperature is 120~200℃, and the curing time is 5min~1h.

[0044] The degradation method of the cured product of the degradable single-component epoxy resin composition is characterized by using an amine solution for immersion degradation.

[0045] Preferably, the solute of the amine solution is one or more than two mixtures of ethylenediamine, diethylenetriamine, triethylenetetramine, tetraethylenepentamine, isophorone diamine, m-xylene diamine, diethylaminopropylamine, menthane diamine, N-aminoethylpiperazine, 1-methyl-2,4-cyclohexanediamine and 1,3-bis(aminomethyl)cyclohexane.

[0046] Preferably, the solvent of the amine solution is one or more than two mixtures of N,N-dimethylformamide, N,N-dimethylacetamide, N-methylpyrrolidone, dimethyl sulfoxide, tetrahydrofuran, phenoxyethanol, cyclohexanone, methylcyclohexanone, acetone, butanone, and cellosolve.

[0047] The present application uses an epoxy prepolymer to react with a modified organic acid dihydrazide curing agent to prepare a cured product containing an acylhydrazone dynamic covalent bond structure, which has the characteristics of epoxy resin and can obtain degradable function and good corrosion resistance through the acylhydrazone dynamic covalent bond. The representative curing reaction mechanism is as follows:

[0048]

[0049] The epoxy prepolymer, The modified organic acid dihydrazide curing agent.

[0050] Compared with the prior art, the present application has the following advantages and beneficial effects:

[0051] (1) The epoxy resin containing acylhydrazone dynamic covalent bond structure is prepared by reacting epoxy prepolymer with modified organic acid dihydrazide curing agent, and can be used as paint, adhesive, encapsulating material, etc. When used as adhesive, the bonding strength is high (tensile shear strength reaches 26.8-28.5 MPa at 23℃). When used as paint, the paint film has excellent adhesion and impact resistance.

[0052] (2) The epoxy resin composition of the present application does not release solvent and small molecule by-products during the curing reaction process, and the cured resin structure contains acylhydrazone dynamic covalent bond, which gives the resin good corrosion resistance (resistance to strong base, strong acid, weak acid, water, solvent, etc.) and degradability, and can quickly degrade in special chemical environment.

[0053] (3) The degradable one-component epoxy resin composition prepared by the present application has good storage stability, and when used as adhesive at room temperature, the storage period is ≥4 months, and when used as powder paint, the storage period is ≥12 months; it is easy to store and convenient to use, and the structure and performance can be adjusted arbitrarily; and the preparation method of the present application is simple and easy to scale up. BRIEF DESCRIPTION OF DRAWINGS

[0054] Figure 1 The representative load-displacement curve for tensile shear strength test of Example 1 (a), Example 2 (b), Comparative Example 1 (c), Comparative Example 2 (d) is shown in the figure. DETAILED DESCRIPTION

[0055] The present application will be further described below in conjunction with specific examples, but the content of the present application is not limited to the following examples.

[0056] Synthesis of modified organic acid dihydrazide curing agent (2): Under nitrogen protection, 2.65 kg of malonic acid dihydrazide, 10 g of acetic acid and 5 L of N-methyl pyrrolidone were added to a 20 L three-necked flask equipped with a condenser, stirred and heated to 140℃ until the solution was clear and transparent. Another 5 L flask was added with 1.35 kg of isophthaldehyde and 3 L of N-methyl pyrrolidone, heated to 70℃ and stirred to dissolve, obtaining a light yellow clear isophthaldehyde solution. The isophthaldehyde solution was slowly added to the three-necked flask through a constant pressure dropping funnel, and the reaction was continued for 1 h after the addition was completed. After natural cooling to room temperature, the reaction solution was filtered to obtain a yellow transparent solution. The filtrate was poured into 3 times the volume of deionized water, and white precipitate was obtained by stirring. After washing with deionized water and vacuum drying, 3.44 kg of target product was obtained with a yield of 95%. Other types of modified organic acid dihydrazide curing agents were prepared by similar methods. The synthesis reaction mechanism is as follows:

[0057]

[0058] Example 1

[0059] A mixture of 20 parts of bisphenol A glycidyl ether (NPEL-128), 10 parts of 4,4-diaminodiphenylmethane tetraglycidyl amine, 17.5 parts of modified organic acid dihydrazide curing agent (2), 5 parts of phenyl glycidyl ether, 10 parts of carboxyl-terminated butylnitrile rubber, 30 parts of quartz powder, 5 parts of melamine cyanurate, 0.2 parts of N-(2-hydroxyphenyl)-N,N'-dimethylurea, 0.5 parts of 3-(2,3-epoxypropoxy)propyl trimethoxysilane, 0.3 parts of BYK-1765, 1.5 parts of nano-silicon dioxide was added into a stirred tank, and mixed uniformly. Further, a three-roll mill was used for grinding and dispersing uniformly to obtain a degradable one-component epoxy resin composition.

[0060] The tensile shear strength of the adhesive was tested according to the method of GB / T 7124-2008 "Determination of tensile shear strength of adhesives (rigid material to rigid material)". The one-component epoxy resin composition was evenly applied to the bonding part of the stainless steel test piece, two copper wires with a diameter of 0.2 mm were arranged in parallel along the length direction of the test piece to adjust the thickness of the adhesive layer, the steel sheet was tightly attached, the excess adhesive on the edge was removed, and the test piece was fixed with a reverse tail clamp. The curing condition was 120°C for 1h. Five samples were tested in each group, and the average value was taken. The storage period was evaluated according to the method of GB / T 7123.2-2002 "Determination of storage period of adhesives", and the test determination temperature was 23±2°C. According to GB / T13353-2025 "Determination method of chemical reagent resistance of adhesives metal and metal", the change rate of tensile shear strength was used to evaluate the chemical reagent resistance of the adhesive, and the immersion temperature and time were 23±2°C and 24h respectively. Adhesive debonding speed test: the tensile shear strength sample of the adhesive was completely immersed in 60°C amine solution (mass ratio of ethylenediamine, butanone, N-methyl pyrrolidone is 2:3:5), until completely debonded, the debonding speed was the bonding area divided by the debonding time.

[0061] Example 2

[0062] A mixture of 4 parts of hydrogenated bisphenol A glycidyl ether (ST-3000), 5 parts of 4,5-epoxycyclohexane-1,2-dicarboxylic acid diglycidyl ester, 3 parts of hexahydrophthalic acid diglycidyl ester, 3 parts of modified organic acid dihydrazide curing agent (3), 7 parts of modified organic acid dihydrazide curing agent (9), 5 parts of benzoic acid glycidyl ester, 3 parts of liquid polysulfide rubber, 55 parts of alumina powder, 10 parts of boron nitride powder, 3 parts of flame retardant triphenyl phosphate, 0.2 parts of N-(3,5-dimethyl-2-hydroxyphenyl)-N,N'-dimethylurea, 0.5 parts of 3-aminopropyl triethoxysilane, 0.3 parts of BYK-A525, 1 part of organic bentonite was added into a stirred tank, and mixed uniformly. Further, a three-roll mill was used for grinding and dispersing uniformly to obtain a degradable one-component epoxy resin composition. The curing condition of the adhesive was 150°C for 30min. The sample preparation and performance test method were the same as those of Example 1.

[0063] Example 3

[0064] Into a high-speed mixer, 35 parts of bisphenol A glycidyl ether (NPES-904), 8.8 parts of silicone-modified bisphenol A glycidyl ether (3201S), 10 parts of modified organic acid dihydrazide curing agent (5), 9 parts of phenoxy resin powder, 20 parts of ultra-fine silica powder, 10 parts of barium sulfate powder, 5 parts of phenoxy cyclophosphazene, 0.5 parts of N-(4-chloro-2-hydroxyphenyl)-N,N'-dimethylurea, 1 part of 3- mercaptopropyl trimethylsilane, 0.5 parts of BYK-A530, and 0.2 parts of BYK-360P were added, pre-mixed at 800 rpm for 15 minutes to ensure uniform dispersion of the materials. The mixture was melt-extruded through a twin-screw extruder, tablet-cooled, crushed and sieved, with an average particle size of about 70 μm. The film was prepared by electrostatic spraying and baked at 160°C for 20 min, with a film thickness of about 80 μm.

[0065] The paint film adhesion was tested according to GB / T 1720-2020 “Paint Film Scratch Test”, the paint film hardness was tested according to GB / T 6739-2022 “Pencil Method for Testing Paint Film Hardness”, the paint film impact resistance was tested according to GB / T 1732-2020 “Paint Film Impact Resistance Test Method”, and the paint film water resistance was tested according to GB / T 1733-1993 “Paint Film Water Resistance Test Method”. The paint film resistance to chemical media such as acid, base, and solvent was evaluated according to GB / T 30648.1-2014 “Determination of Resistance to Liquids of Coatings - Part 1: Immersion in Liquids other than Water”. Referring to the test method of GB / T 30648.1-2014, the paint film sample was completely immersed in a 50°C amine solution (mass ratio of diethylene triamine to N,N-dimethylacetamide of 3:7) until complete degradation, and the degradation rate was calculated by dividing the paint film area by the delamination time.

[0066] Example 4

[0067] Example 1 20 parts of bisphenol A glycidyl ether (NPEL-128), 10 parts of 4,4-diaminodiphenylmethane tetraglycidyl amine, 17.5 parts of modified organic acid dihydrazide curing agent (2), 5 parts of methyl methacrylate block copolymer powder, 10 parts of titanium dioxide powder, 25 parts of barium sulfate powder, 3 parts of dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (flame retardant DOPO), 0.1 part of N-(4-chlorophenyl)-N,N'-dimethylurea, 0.2 part of 3-(2,3-epoxypropoxy)propyl trimethoxysilane, 0.2 part of BYK-1765, and 0.5 part of BYK-333 were added to a high-speed mixer, and pre-mixed at 800 rpm for 15 minutes to ensure uniform dispersion of the materials. The mixture was melt-extruded through a twin-screw extruder, tabletted, cooled, crushed, and sieved to obtain a powder with an average particle size of about 70 μm. The sample was prepared by electrostatic spraying and baked at 200°C for 5 minutes to form a film with a thickness of about 80 μm. The sample preparation and performance test methods were the same as in Example 3.

[0068] Comparative Example 1

[0069] Example 2 5.5 parts of hydrogenated bisphenol A glycidyl ether (ST-3000), 6.9 parts of 1,2-epoxy cyclohexane-4,5-dicarboxylic acid diglycidyl ester, 4.2 parts of hexahydrophthalic acid diglycidyl ester, 1.8 parts of succinic acid dihydrazide, 3.6 parts of sebacic acid dihydrazide, 5 parts of methyl methacrylate block copolymer powder, 10 parts of titanium dioxide powder, 25 parts of barium sulfate powder, 3 parts of dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (flame retardant DOPO), 0.1 part of N-(4-chlorophenyl)-N,N'-dimethylurea, 0.2 part of 3-(2,3-epoxypropoxy)propyl trimethoxysilane, 0.2 part of BYK-1765, and 0.5 part of BYK-333 were added to a high-speed mixer, and pre-mixed at 800 rpm for 15 minutes to ensure uniform dispersion of the materials. The mixture was melt-extruded through a twin-screw extruder, tabletted, cooled, crushed, and sieved to obtain a powder with an average particle size of about 70 μm. The sample was prepared by electrostatic spraying and baked at 200°C for 5 minutes to form a film with a thickness of about 80 μm. The sample preparation and performance test methods were the same as in Example 3.

[0070] Comparative Example 2

[0071] Example 3 5.5 parts of hydrogenated bisphenol A glycidyl ether (ST-3000), 6.9 parts of 1,2-epoxy cyclohexane-4,5-dicarboxylic acid diglycidyl ester, 4.2 parts of hexahydrophthalic acid diglycidyl ester, 1.8 parts of succinic acid dihydrazide, 3.6 parts of sebacic acid dihydrazide, 5 parts of methyl methacrylate block copolymer powder, 10 parts of titanium dioxide powder, 25 parts of barium sulfate powder, 3 parts of dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (flame retardant DOPO), 0.1 part of N-(4-chlorophenyl)-N,N'-dimethylurea, 0.2 part of 3-(2,3-epoxypropoxy)propyl trimethoxysilane, 0.2 part of BYK-1765, and 0.5 part of BYK-333 were added to a high-speed mixer, and pre-mixed at 800 rpm for 15 minutes to ensure uniform dispersion of the materials. The mixture was melt-extruded through a twin-screw extruder, tabletted, cooled, crushed, and sieved to obtain a powder with an average particle size of about 70 μm. The sample was prepared by electrostatic spraying and baked at 200°C for 5 minutes to form a film with a thickness of about 80 μm. The sample preparation and performance test methods were the same as in Example 3.

[0072] Comparative Example 3

[0073] The 35 parts of bisphenol A glycidyl ether (NPES-904), 8.8 parts of organosilicon-modified bisphenol A glycidyl ether (3201S), and 10 parts of modified organic acid dihydrazide curing agent (5) in Example 3 were replaced with 38.3 parts of bisphenol A glycidyl ether (NPES-904), 11 parts of organosilicon-modified bisphenol A glycidyl ether (3201S), and 4.5 parts of adipic acid dihydrazide curing agent (5). Other components were the same as in Example 3. The sample preparation and performance testing methods were the same as in Example 3.

[0074] Compare with Example 4

[0075] The curing agent consisted of 24.8 parts hydrogenated bisphenol A glycidyl ether (ST-5080), 11.2 parts hydrogenated bisphenol A glycidyl ether (ST-3000), 9.8 parts tetraphenol ethane tetraglycidyl ether (EPON1031), 5.9 parts sebacic acid dihydrazide, and 4.3 parts organic acid dihydrazide. Instead of 20 parts of hydrogenated bisphenol A glycidyl ether (ST-5080), 9 parts of hydrogenated bisphenol A glycidyl ether (ST-3000), 8 parts of tetraphenol ethane tetraglycidyl ether (EPON1031), 11 parts of modified organic acid dihydrazide curing agent (9), and 8 parts of modified organic acid dihydrazide curing agent (21) in Example 4, the other components were the same as in Example 4. The sample preparation and performance testing methods were the same as in Example 3.

[0076] Table 1. Comparison of properties of single-component epoxy resin compositions (adhesives)

[0077]

[0078] ＊ Note: A strength change rate of 0% and 100% represent that the tensile shear strength of the adhesive is completely unaffected and the strength is completely lost, respectively.

[0079] Table 2. Comparison of properties of single-component epoxy resin compositions (powder coatings)

[0080]

[0081] The results of Examples 1, 2, Comparative Examples 1 and 2, and Table 1 above show that, compared with ordinary one-component epoxy adhesives, the biodegradable one-component epoxy resin composition of the present invention exhibits better adhesive properties when used as an adhesive, with tensile shear strengths increased by 33.3% and 25.6%, respectively. In particular, the cured products of the one-component epoxy resin composition of the present invention can withstand degradation in the solution at concentrations of 56 and 79 mm, respectively. 2 It degrades at a rate of / h, while ordinary single-component epoxy adhesives do not have the ability to degrade.

[0082] The results of Example 3, Example 4, Comparative Example 3, Comparative Example 4 and Table 2 above show that the degradable one-component epoxy resin composition of the present application has similar excellent comprehensive properties as a powder coating compared with a general epoxy powder coating. However, the cured product of the one-component epoxy resin composition of the present application can be decomposed at a degradation rate of 353 and 316 mm / h, respectively, in a degradation solution, while the general epoxy powder coating does not have degradation ability. 2 The one-component epoxy resin composition of the present application has similar excellent comprehensive properties as a powder coating compared with a general epoxy powder coating.

[0083] The above examples are the preferred embodiments of the present application, but the embodiments of the present application are not limited to the above examples, and any changes, modifications, substitutions, combinations, simplifications, etc. made without departing from the spirit and principles of the present application are equivalent replacement modes and are included in the scope of protection of the present application.

Claims

1. A degradable one-part epoxy resin composition, characterized by, Raw materials include the following components by weight percentage: Epoxy prepolymer: 10%~50% Modified organic acid dihydrazide curing agent: 5%~30% Accelerator: 0.1%~2% Active diluent: 0~10% Filler: 10%~70% Toughening agent: 1%~15% Flame retardant: 0.5%~5% Thixotropic agent: 0~2% Defoaming agent: 0.1%~1% Coupling agent: 0.1%~1% Leveling agent: 0%~1% The epoxy prepolymer contains two or more epoxy groups, the modified organic acid dihydrazide curing agent contains 2 acylhydrazone dynamic covalent bonds and 2 hydrazide groups, and the terminal groups of the hydrazide groups are both primary amine groups.

2. The degradable one-part epoxy resin composition according to claim 1, characterized in that, The epoxy prepolymer is any one or more of bisphenol A glycidyl ether, hydrogenated bisphenol A glycidyl ether, organosilicon degradable bisphenol A glycidyl ether, bisphenol F glycidyl ether, bisphenol S glycidyl ether, bisphenol AD glycidyl ether, resorcinol diglycidyl ether, ethylene glycol diglycidyl ether, polyethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, glycerol diglycidyl ether, 1,4-butanediol diglycidyl ether, neopentyl glycol diglycidyl ether, trimethylolpropane glycidyl ether, tetraphenyl ethane tetraglycidyl ether, polyphenol glycidyl ether, phthalic acid diglycidyl ester, tetrahydrophthalic acid diglycidyl ester, hexahydrophthalic acid diglycidyl ester, 4,5-epoxycyclohexane-1,2-dicarboxylic acid diglycidyl ester, p-aminophenol glycidyl ether, 4,4-diaminodiphenylmethane tetraglycidyl amine, N,N-bis(glycidyl)aniline, 3,4-epoxycyclohexylmethyl-3',4'-epoxycyclohexylmethyl ester, bis((3,4-epoxycyclohexyl)methyl)adipate, ethylene dioxy cyclohexene, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexylmethyl ester, dicyclopentadiene diepoxide, 1,4-cyclohexane dimethanol bis(3,4-epoxycyclohexane carboxylate) ester.

3. The degradable one-part epoxy resin composition according to claim 1, characterized in that, The modified organic acid dihydrazide curing agent is any one or more of the following structures:

4. The degradable one-component epoxy resin composition according to claim 1, characterized in that, The accelerator is one or a mixture of two or more of N-(2-hydroxyphenyl)-N,N'-dimethylurea, N-(3,5-dimethyl-2-hydroxyphenyl)-N,N'-dimethylurea, N-(2-hydroxy-4-nitrophenyl)-N,N'-dimethylurea, N-(2-hydroxy-5-nitrophenyl)-N,N'-dimethylurea, N-(4-chloro-2-hydroxyphenyl)-N,N'-dimethylurea, N-(5-chloro-2-hydroxyphenyl)-N,N'-dimethylurea, N-(4-chlorophenyl)-N,N'-dimethylurea. The active diluent is one or a mixture of two or more of n-butyl glycidyl ether, 2-ethyl-hexyl glycidyl ether, styrene oxide, phenyl glycidyl ether, tolyl glycidyl ether, benzoic acid glycidyl ester. The filler is one or more than two mixtures of alumina, aluminum nitride, silicon nitride, boron nitride, silicon carbide, aluminum hydroxide, titanium white powder, mica, graphite, nanometer carbon fiber, diamond, carbon black, carbon nanotube, graphene, graphyne, iron oxide, zinc oxide, magnesium oxide, talcum powder, calcium carbonate, kaolin, barium sulfate, barium titanate, silicon dioxide, quartz powder, glass microbeads, iron powder, copper powder, aluminum powder, zinc powder, silver powder; The toughening agent is one or more than two mixtures of phenoxy resin, polyether sulfone, polyether imide, polyamide, thermoplastic polyurethane, methyl methacrylate block copolymer, nitrile rubber, polysulfide rubber, silicone rubber; The flame retardant is one or more than two mixtures of melamine cyanurate, dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, phenoxy cyclic phosphazene, triphenyl phosphate, dimethyl methylphosphonate, chlorinated paraffin-52, triethyl phosphate; The thixotropic agent is one or more than two mixtures of nanometer silicon dioxide, organic bentonite, hydrogenated castor oil, polyamide wax; The defoaming agent is one or more than two mixtures of BYK-1765, BYK-A525, BYK-A530, BYK-054; The coupling agent is one or more than two mixtures of 3-(2,3-epoxypropoxy) propyl trimethoxysilane, 3-aminopropyl triethoxysilane, 3-mercaptopropyl trimethylsilane; The leveling agent is one or more than two mixtures of BYK-310, BYK-358N, BYK-333, BYK-306, BYK-360P.

5. The degradable one-part epoxy resin composition according to any one of claims 1 to 4, characterized in that, The raw materials include the following components by weight percentage: Epoxy prepolymer: 12%~45% Modified organic acid dihydrazide curing agent: 10%~20% Accelerator: 0.1%~0.5% Active diluent: 0~5% Filler: 30%~65% Toughening agent: 3%~10% Flame retardant: 3%~5% Thixotropic agent: 0~1.5% Defoaming agent: 0.2%~0.5% Coupling agent: 0.2%~1% Leveling agent: 0~0.5%.

6. Use of the degradable one-component epoxy resin composition according to any one of claims 1 to 5, characterized in that The composition mixed uniformly is used as an adhesive, a paint or an insulating sealing material after high temperature curing.

7. Use according to claim 6, characterized in that, The curing temperature is 120~200℃, and the curing time is 5min~1h.

8. The method of degrading the cured product of the degradable one-component epoxy resin composition according to any one of claims 1 to 7, characterized by, Degradation by soaking in amine solution.

9. The degradation method of claim 8, wherein, The solute of the amine solution is one or more than two mixtures of ethylenediamine, diethylenetriamine, triethylenetetramine, tetraethylenepentamine, isophorone diamine, m-xylene diamine, diethylaminopropylamine, menthane diamine, N-aminoethylpiperazine, 1-methyl-2,4-cyclohexanediamine, 1,3-bis(aminomethyl)cyclohexane.

10. The degradation method of claim 8, wherein, The solvent of the amine solution is one or more than two mixtures of N,N-dimethylformamide, N,N-dimethylacetamide, N-methylpyrrolidone, dimethyl sulfoxide, tetrahydrofuran, phenoxy ethanol, cyclohexanone, methylcyclohexanone, acetone, butanone, cellosolve.

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