Co-packaged optical wafer module

Abstract

The invention discloses a co-packaging optical chip module, which comprises a first chip, a first optical transceiver unit, a second chip, a second optical transceiver unit and a first optical transmission element, the first light transmission element comprises a first light-transmitting substrate, a first micro-collimating lens, a first frame adhesive and a second light-transmitting substrate. The first micro-collimating lens is arranged on the first working area of the first light-transmitting substrate. The first frame glue is arranged on the first peripheral area of the first light-transmitting substrate and surrounds the first micro-collimating lens. The second light-transmitting substrate is arranged opposite to the first light-transmitting substrate. The first frame glue is connected with the first light-transmitting substrate and the second light-transmitting substrate.

Description

Technical Field

[0001] This invention relates to a co-packaged optical chip module. Background Technology

[0002] With the rise of artificial intelligence (AI) applications, the increasing number of Graphics Processing Units (GPUs) and Central Processing Units (CPUs) has become a major trend. Due to the increasing number of chips, the data transmission distances between GPUs / CPUs, between GPUs, and even between circuit boards will become increasingly longer. However, the bandwidth of wires will reach its limit as the transmission distance increases, making the question of how to replace wire transmission with optical transmission a crucial research topic. Summary of the Invention

[0003] This invention provides a co-packaged optical chip module with excellent performance.

[0004] The co-packaged optical chip module of the present invention includes a first chip, a first optical transceiver unit, a second chip, a second optical transceiver unit, and a first optical transmission element. The first optical transceiver unit is electrically connected to the first chip. The first optical transceiver unit includes at least one first light-emitting element and at least one first light-receiving element. The second optical transceiver unit is electrically connected to the second chip. The second optical transceiver unit includes at least one second light-emitting element and at least one second light-receiving element. At least one first light-emitting element of the first optical transceiver unit is used to emit a first signal beam. The first signal beam is transmitted to at least one second light-receiving element of the second optical transceiver unit through the first optical transmission element. The first optical transmission element includes a first light-transmitting substrate, at least one first micro-collimating lens, a first sealant, and a second light-transmitting substrate. The first light-transmitting substrate has a first working area and a first peripheral area surrounding the first working area. At least one first micro-collimating lens is disposed on the first working area of ​​the first light-transmitting substrate. The first sealant is disposed on the first peripheral area of ​​the first light-transmitting substrate and surrounds the at least one first micro-collimating lens. The second light-transmitting substrate is disposed opposite to the first light-transmitting substrate. The first frame adhesive connects the first light-transmitting substrate and the second light-transmitting substrate.

[0005] In one embodiment of the present invention, the aforementioned at least one first light-emitting element includes a plurality of first light-emitting elements, the at least one first light-receiving element includes a plurality of first light-receiving elements, the at least one first micro-collimating lens includes a plurality of first micro-collimating lenses, and the plurality of first micro-collimating lenses of the first light transmission element are respectively disposed corresponding to the plurality of first light-emitting elements and the plurality of first light-receiving elements.

[0006] In one embodiment of the present invention, the first light transmission element further includes a first protrusion structure located between a first peripheral region of the first light-transmitting substrate and a second light-transmitting substrate, wherein a first frame adhesive is sandwiched between the first protrusion structure and one of the first light-transmitting substrate and the second light-transmitting substrate.

[0007] In one embodiment of the present invention, the first light-transmitting substrate, the second light-transmitting substrate, and the first frame adhesive enclose a vacuum-like space.

[0008] In one embodiment of the present invention, the first light-transmitting substrate is closer to the first optical transceiver unit than the second light-transmitting substrate, and the thickness of the first light-transmitting substrate is less than the thickness of the second light-transmitting substrate.

[0009] In one embodiment of the present invention, the co-packaged optical chip module further includes a main circuit board and a first intermediate substrate. The first intermediate substrate is disposed between the first optical transceiver unit and the main circuit board. The first intermediate substrate includes a substrate, at least one conductive layer, and at least one dielectric layer. The substrate is disposed on the main circuit board. The at least one conductive layer is disposed on the substrate and electrically connected to the main circuit board. The at least one dielectric layer covers the at least one conductive layer. A plurality of first light-emitting elements and a plurality of first light-receiving elements are bonded to the at least one conductive layer of the first intermediate substrate.

[0010] In one embodiment of the present invention, the substrate of the first intermediate substrate has a plurality of through holes. The first intermediate substrate further includes a plurality of conductive elements disposed in the plurality of through holes of the substrate of the first intermediate substrate. The plurality of conductive elements are electrically connected to at least one conductive layer of the first intermediate substrate and the main circuit board.

[0011] In one embodiment of the present invention, the co-packaged optical chip module further includes a second optical transmission element. The second optical transmission element includes a third light-transmitting substrate, at least one second micro-collimating lens, a second sealant, and a fourth light-transmitting substrate. The third light-transmitting substrate has a first working area and a first peripheral area surrounding the first working area. At least one second micro-collimating lens is disposed on the first working area of ​​the third light-transmitting substrate. The second sealant is disposed on the first peripheral area of ​​the third light-transmitting substrate and surrounds the at least one second micro-collimating lens. The fourth light-transmitting substrate is disposed opposite to the third light-transmitting substrate. The second sealant connects the third light-transmitting substrate and the fourth light-transmitting substrate. The two ends of the optical fiber bundle are respectively coupled to the first optical transmission element and the second optical transmission element.

[0012] In one embodiment of the present invention, the first light-transmitting substrate further includes a second working area located outside the first working area. The first light transmission element further includes at least one second micro-collimating lens and at least one waveguide. The at least one second micro-collimating lens is disposed on the second working area of ​​the first light-transmitting substrate, wherein the first frame adhesive further surrounds the at least one second micro-collimating lens. The second light-transmitting substrate of the first light transmission element has an inner surface and an outer surface. The inner surface faces the at least one first micro-collimating lens. The outer surface is opposite to the inner surface. The at least one waveguide is disposed on the outer surface of the second light-transmitting substrate, and the two ends of the at least one waveguide correspond to the at least one first micro-collimating lens and the at least one second micro-collimating lens, respectively.

[0013] In one embodiment of the present invention, there is a gap between the first optical transceiver unit and the second optical transceiver unit, and at least one waveguide of the first optical transmission element crosses this gap.

[0014] In one embodiment of the present invention, the co-packaged optical chip module further includes a main circuit board. A first chip is disposed on and electrically connected to the main circuit board. The first chip and the first optical transmission element are located on different sides of the main circuit board, respectively.

[0015] In one embodiment of the present invention, the co-packaged optical chip module further includes a main circuit board, a first intermediate substrate, a first driver, and a first amplifier. The first chip is disposed on the main circuit board and electrically connected to it. The first intermediate substrate is disposed between the first optical transceiver unit and the main circuit board and is electrically connected to it. The first driver is electrically connected to at least one first light-emitting element of the first optical transceiver unit. The first amplifier is electrically connected to at least one first light-receiving element of the first optical transceiver unit. The first optical transceiver unit, the first driver, and the first amplifier are disposed on the same first intermediate substrate.

[0016] In one embodiment of the present invention, the co-packaged optical chip module further includes a main circuit board, a first intermediate substrate, a third intermediate substrate, a first driver, and a first amplifier. The first chip is disposed on the main circuit board and electrically connected to it. The first intermediate substrate is disposed between the first optical transceiver unit and the main circuit board and electrically connected to it. The third intermediate substrate is electrically connected to the main circuit board and structurally separated from the first intermediate substrate. The first driver is electrically connected to at least one first light-emitting element of the first optical transceiver unit. The first amplifier is electrically connected to at least one first light-receiving element of the first optical transceiver unit. The first optical transceiver unit is disposed on the first intermediate substrate, and the first driver and the first amplifier are disposed on the third intermediate substrate.

[0017] In one embodiment of the present invention, the co-packaged optical chip module further includes a main circuit board, a first intermediate substrate, a fourth intermediate substrate, a first driver, and a first amplifier. The first chip is disposed on the main circuit board and electrically connected to it. The first intermediate substrate is disposed between the first optical transceiver unit and the main circuit board and electrically connected to it. The fourth intermediate substrate is electrically connected to the main circuit board and structurally separated from the first intermediate substrate. The first driver is electrically connected to at least one first light-emitting element of the first optical transceiver unit. The first amplifier is electrically connected to at least one first light-receiving element of the first optical transceiver unit. The first optical transceiver unit is disposed on the first intermediate substrate, and the first driver, the first amplifier, and the first chip are disposed on the fourth intermediate substrate.

[0018] In one embodiment of the present invention, the co-packaged optical chip module further includes a main circuit board, a first driver, and a first amplifier. The first chip is disposed on the main circuit board and electrically connected to the main circuit board. The first driver is electrically connected to at least one first light-emitting element of the first optical transceiver unit. The first amplifier is electrically connected to at least one first light-receiving element of the first optical transceiver unit. The first optical transmission element, the first driver, and the first amplifier are directly disposed on the main circuit board. Attached Figure Description

[0019] Figure 1 This is a cross-sectional schematic diagram of a co-packaged optical chip module according to an embodiment of the present invention.

[0020] Figure 2 This is a cross-sectional schematic diagram of the first optical transmission element according to an embodiment of the present invention.

[0021] Figure 3 This is a cross-sectional schematic diagram of the second optical transmission element according to an embodiment of the present invention.

[0022] Figure 4 This is a cross-sectional schematic diagram of a co-packaged optical wafer module according to another embodiment of the present invention.

[0023] Figure 5 This is a cross-sectional schematic diagram of a co-packaged optical chip module according to another embodiment of the present invention.

[0024] Figure 6 This is a cross-sectional schematic diagram of a co-packaged optical chip module according to another embodiment of the present invention.

[0025] Figure 7 This is a cross-sectional schematic diagram of a co-packaged optical chip module according to an embodiment of the present invention.

[0026] Figure 8 This is a cross-sectional schematic diagram of a co-packaged optical wafer module according to another embodiment of the present invention.

[0027] Figure 9This is an enlarged schematic diagram of one end of the first optical transmission element according to another embodiment of the present invention.

[0028] Figure 10 This is an enlarged schematic diagram of the other end of the first optical transmission element according to another embodiment of the present invention.

[0029] Figure 11 This is a cross-sectional schematic diagram of a co-packaged optical chip module according to another embodiment of the present invention.

[0030] Figure 12 This is a cross-sectional schematic diagram of a co-packaged optical chip module according to another embodiment of the present invention.

[0031] Figure 13 This is a cross-sectional schematic diagram of a co-packaged optical chip module according to an embodiment of the present invention.

[0032] Figure 14 This is a cross-sectional schematic diagram of a co-packaged optical wafer module according to another embodiment of the present invention.

[0033] Figure 15 This is a cross-sectional schematic diagram of a co-packaged optical chip module according to another embodiment of the present invention.

[0034] In the attached figures, the following labels are used:

[0035] 10, 10A, 10B, 10C, 10D, 10E, 10F, 10G, 10H, 10I, 10J: Co-packaged optical chip modules

[0036] 110: First chip

[0037] 120: First Optical Transceiver Unit

[0038] 121: First light-emitting element

[0039] 122: First light-receiving element

[0040] 130: Second chip

[0041] 140: Second optical transceiver unit

[0042] 141: Second light-emitting element

[0043] 142: Second light-receiving element

[0044] 150: First Driver

[0045] 160: First Amplifier

[0046] 170: Second drive

[0047] 180: Second Amplifier

[0048] 190, 190E: First optical transmission element

[0049] 191: First translucent substrate

[0050] 191a: First Working Area

[0051] 191b: First Surrounding Area

[0052] 191c: Second Working Area

[0053] 192: First Microcollimating Lens

[0054] 193: First frame glue

[0055] 194: Second translucent substrate

[0056] 194a: Inner surface

[0057] 194b: Outer surface

[0058] 195: First protruding structure

[0059] 196: Waveguide

[0060] 196a, 196b: End

[0061] 200: Second optical transmission element

[0062] 201: Third translucent substrate

[0063] 201a: First Working Area

[0064] 201b: First Surrounding Area

[0065] 202: Second Microcollimating Lens

[0066] 203: Second frame glue

[0067] 204: Fourth translucent substrate

[0068] 205: Second protrusion structure

[0069] 210: Fiber optic bundle

[0070] 211: First optical fiber

[0071] 212: Second optical fiber

[0072] 220: Main circuit board

[0073] 230: First Intermediate Substrate

[0074] 232, 242: Base

[0075] 232a, 242a: Through holes

[0076] 234, 244: Conductive layer

[0077] 236, 246: Dielectric layer

[0078] 238, 248: Conductive materials

[0079] 240: Second Intermediate Substrate

[0080] 250, 260, 280, 300: Intermediate substrate

[0081] 270: Third Intermediate Substrate

[0082] G: Gap

[0083] L1: First signal beam

[0084] L2: Second signal beam

[0085] R: Vacuum-like space

[0086] T1, T2, T3, T4: Thickness Detailed Implementation

[0087] Reference will now be made in detail to exemplary embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same element symbols are used in the drawings and description to denote the same or similar parts.

[0088] It should be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "connected" to another element, it may be directly on or connected to the other element, or an intermediate element may also be present. Conversely, when an element is referred to as being "directly on" or "directly connected" to another element, no intermediate element is present. As used herein, "connection" can refer to physical and / or electrical connection. Furthermore, "electrical connection" or "coupling" may involve the presence of other elements between the two elements.

[0089] As used herein, “about,” “approximately,” or “substantially” includes the value and the average value within an acceptable range of deviations from a particular value as determined by one of ordinary skill in the art, taking into account the measurement under discussion and a particular number of errors associated with the measurement (i.e., limitations of the measurement system). For example, “about” may mean within one or more standard deviations of the value, or within ±30%, ±20%, ±10%, ±5%. Furthermore, the use of “about,” “approximately,” or “substantially” herein may be chosen based on the optical, etched, or other properties to select a more acceptable range of deviations or standard deviations, and may not require a single standard deviation to apply to all properties.

[0090] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted as having meanings consistent with their meanings in the context of the relevant technology and this invention, and will not be interpreted as having idealized or overly formal meanings unless expressly defined herein.

[0091] Figure 1 This is a cross-sectional schematic diagram of a co-packaged optical chip module according to an embodiment of the present invention. Figure 2 This is a cross-sectional schematic diagram of the first optical transmission element according to an embodiment of the present invention. Figure 3 This is a cross-sectional schematic diagram of the second optical transmission element according to an embodiment of the present invention.

[0092] Please refer to Figure 1 The co-packaged optical chip module 10 includes a first chip 110, a first optical transceiver unit 120, a second chip 130, and a second optical transceiver unit 140. The first optical transceiver unit 120 is electrically connected to the first chip 110 and includes at least one first light-emitting element 121 and at least one first light-receiving element 122. The second optical transceiver unit 140 is electrically connected to the second chip 130 and includes at least one second light-emitting element 141 and at least one second light-receiving element 142.

[0093] In some embodiments, the first optical transceiver unit 120 includes an array of multiple first light-emitting elements 121 and an array of multiple first light-receiving elements 122. In some embodiments, the second optical transceiver unit 140 includes an array of multiple second light-emitting elements 141 and an array of multiple second light-receiving elements 142. In some embodiments, the first light-emitting elements 121 and the second light-emitting elements 141 include micro light-emitting diodes (μLEDs), and the first light-receiving elements 122 and the second light-receiving elements 142 include photodiodes, but the present invention is not limited thereto.

[0094] In some embodiments, the co-packaged optical chip module 10 further includes a first driver 150, a first amplifier 160, a second driver 170, and a second amplifier 180. The first driver 150 is electrically connected to the first light-emitting element 121 and the first chip 110. The first amplifier 160 is electrically connected to the first light-receiving element 122 and the first chip 110. The second driver 170 is electrically connected to the second light-emitting element 141 and the second chip 130. The second amplifier 180 is electrically connected to the second light-receiving element 142 and the second chip 130.

[0095] Please refer to Figure 1 , Figure 2 and Figure 3The first chip 110 emits a first transmission electrical signal. The first driver 150 emits a first light-emitting element driving electrical signal according to the first transmission electrical signal. The first light-emitting element 121 emits a first signal beam L1 according to the first light-emitting element driving electrical signal. The second light-receiving element 142 receives the first signal beam L1 and converts it into a first conversion electrical signal. The second amplifier 180 receives the first conversion electrical signal and amplifies it into a first receiving electrical signal. The first receiving electrical signal can be transmitted to the second chip 130. The first receiving electrical signal received by the second chip 130 is substantially the same as or close to the first transmission electrical signal emitted by the first chip 110.

[0096] Similarly, the second chip 130 emits a second transmission electrical signal. The second driver 170 emits a second light-emitting element driving electrical signal according to the second transmission electrical signal. The second light-emitting element 141 emits a second signal beam L2 according to the second light-emitting element driving electrical signal. The first light-receiving element 122 receives the second signal beam L2 and converts it into a second converted electrical signal. The first amplifier 160 receives the second converted electrical signal and amplifies it into a second received electrical signal. The second received electrical signal can be transmitted to the first chip 110. The second received electrical signal received by the first chip 110 is substantially the same as or close to the second transmission electrical signal emitted by the second chip 130. Therefore, signal communication between the first chip 110 and the second chip 130 can be achieved using optical communication, reducing the length of the transmission wires required for electrical signals and significantly improving bandwidth delay and heat dissipation issues.

[0097] Please refer to Figure 1 and Figure 2 It is worth noting that the co-packaged optical chip module 10 also includes a first optical transmission element 190. The co-packaged optical chip module 10 utilizes the special first optical transmission element 190 to complete the aforementioned optical communication. The first signal beam L1 emitted by the first light-emitting element 121 of the first optical transceiver unit 120 is transmitted to the second light-receiving element 142 of the second optical transceiver unit 140 through the first optical transmission element 190.

[0098] Please refer to Figure 1 , Figure 2 and Figure 3Specifically, in some embodiments, the co-packaged optical chip module 10 further includes a second optical transmission element 200 and an optical fiber bundle 210. The second optical transmission element 200 is disposed corresponding to the second optical transceiver unit 140. The two ends of the optical fiber bundle 210 are respectively coupled to the first optical transmission element 190 and the second optical transmission element 200. The optical fiber bundle 210 includes a first optical fiber 211. The first signal beam L1 emitted by the first light-emitting element 121 of the first optical transceiver unit 120 is transmitted sequentially through the first optical transmission element 190, the first optical fiber 211, and the second optical transmission element 200 to the second light-receiving element 142 of the second optical transceiver unit 140.

[0099] Similarly, the second signal beam L2 emitted by the second light-emitting element 141 of the second optical transceiver unit 140 is transmitted to the first light-receiving element 122 of the first optical transceiver unit 120 via the first optical transmission element 190. More specifically, in some embodiments, the fiber bundle 210 further includes a second optical fiber 212, and the second signal beam L2 emitted by the second light-emitting element 141 of the second optical transceiver unit 140 is transmitted sequentially through the second optical transmission element 200, the second optical fiber 212, and the first optical transmission element 190 to the first light-receiving element 122 of the first optical transceiver unit 120.

[0100] Please refer to Figure 2 The first light transmission element 190 includes a first light-transmitting substrate 191, at least one first micro-collimating lens 192, a first adhesive 193, and a second light-transmitting substrate 194. The first light-transmitting substrate 191 has a first working area 191a and a first peripheral area 191b surrounding the first working area 191a. At least one first micro-collimating lens 192 is disposed in the first working area 191a of the first light-transmitting substrate 191. The first adhesive 193 is disposed in the first peripheral area 191b of the first light-transmitting substrate 191 and surrounds the at least one first micro-collimating lens 192. The second light-transmitting substrate 194 is disposed opposite to the first light-transmitting substrate 191. The first adhesive 193 connects the first light-transmitting substrate 191 and the second light-transmitting substrate 194.

[0101] In some embodiments, the first optical transmission element 190 includes a plurality of first microcollimating lenses 192, and the plurality of first microcollimating lenses 192 are respectively disposed corresponding to a plurality of first light-emitting elements 121 and a plurality of first light-receiving elements 122. That is, the plurality of first microcollimating lenses 192 are aligned with the plurality of first light-emitting elements 121 and the plurality of first light-receiving elements 122 respectively.

[0102] In some embodiments, the first optical transmission element 190 further includes a first protrusion structure 195 located between a first peripheral region 191b of the first light-transmitting substrate 191 and a second light-transmitting substrate 194, wherein a first adhesive 193 is sandwiched between the first protrusion structure 195 and one of the first light-transmitting substrate 191 and the second light-transmitting substrate 194. The provision of the first protrusion structure 195 helps to maintain a sufficient distance between the first light-transmitting substrate 191 and the second light-transmitting substrate 194, thereby enabling the signal beam to couple smoothly.

[0103] In some embodiments, the first protruding structure 195 and a plurality of first microcollimating lenses 192 are formed on the first light-transmitting substrate 191 by a photolithography process; then, a frame adhesive 193 is applied to the first protruding structure 195; next, the first light-transmitting substrate 191 and the second light-transmitting substrate 194 are assembled in a near-vacuum environment to complete the first light transmission element 190. In some embodiments, the first frame adhesive 193 may be located between the second light-transmitting substrate 194 and the first protruding structure 195, but the present invention is not limited thereto. In some embodiments, the first light-transmitting substrate 191, the second light-transmitting substrate 194, the first frame adhesive 193, and the first protruding structure 195 may enclose a near-vacuum space R. The near-vacuum space R helps to reduce the degree of thermal expansion and contraction of the first light transmission element 190, making the first light transmission element 190 more suitable for installation in various environments.

[0104] In some embodiments, the first transparent substrate 191 of the first optical transmission element 190 is closer to the first optical transceiver unit 120 than the second transparent substrate 194 of the first optical transmission element 190, and the thickness T1 of the first transparent substrate 191 is less than the thickness T2 of the second transparent substrate 194. The thinner first transparent substrate 191 with a thickness T1 helps to reduce the divergence of the first signal beam L1, thereby enabling the first signal beam L1 to be coupled into the first optical fiber 211 more effectively.

[0105] Please refer to Figure 3 The second light transmission element 200 includes a third light-transmitting substrate 201, at least one second micro-collimating lens 202, a second frame adhesive 203, and a fourth light-transmitting substrate 204. The third light-transmitting substrate 201 has a first working area 201a and a first peripheral area 201b surrounding the first working area 201a. At least one first micro-collimating lens 202 is disposed on the first working area 201a of the third light-transmitting substrate 201. The second frame adhesive 203 is disposed on the first peripheral area 201b of the third light-transmitting substrate 201 and surrounds the at least one second micro-collimating lens 202. The fourth light-transmitting substrate 204 is disposed opposite to the first light-transmitting substrate 201. The second frame adhesive 203 connects the third light-transmitting substrate 201 and the fourth light-transmitting substrate 204.

[0106] In some embodiments, the second light transmission element 200 includes a plurality of second micro-collimating lenses 202, and the plurality of second micro-collimating lenses 202 of the second light transmission element 200 are respectively disposed corresponding to a plurality of second light-emitting elements 141 and a plurality of second light-receiving elements 142. That is, the plurality of second micro-collimating lenses 202 are respectively aligned with the plurality of second light-emitting elements 141 and the plurality of second light-receiving elements 142.

[0107] In some embodiments, the second optical transmission element 200 further includes a second protrusion structure 205 located between the first peripheral region 201b of the third light-transmitting substrate 201 and the fourth light-transmitting substrate 204, wherein the second frame adhesive 203 is sandwiched between the second protrusion structure 205 and one of the third light-transmitting substrate 201 and the fourth light-transmitting substrate 204.

[0108] In some embodiments, the third transparent substrate 201 of the second optical transmission element 200 is closer to the second optical transceiver unit 140 than the fourth transparent substrate 204 of the second optical transmission element 200, and the thickness T3 of the third transparent substrate 201 is less than the thickness T4 of the fourth transparent substrate 204. The thinner third transparent substrate 201 with a thickness T3 helps to reduce the divergence of the second signal beam L2, thereby enabling the second signal beam L2 to be coupled into the second optical fiber 212 more effectively.

[0109] Please refer to Figure 1 In some embodiments, the co-packaged optical chip module 10 further includes a main circuit board 220. A first chip 110, a first driver 150, a first amplifier 160, a first optical transceiver unit 120, a second optical transceiver unit 140, a second amplifier 180, a second driver 170, and a second chip 130 are disposed on the main circuit board 220 and electrically connected to the main circuit board 220.

[0110] In some embodiments, the co-packaged optical chip module 10 may optionally include a first intermediate substrate 230 disposed between the first optical transceiver unit 120 and the main circuit board 220. The first intermediate substrate 230 includes a substrate 232, at least one conductive layer 234, and at least one dielectric layer 236. The substrate 232 is disposed on the main circuit board 220. The at least one conductive layer 234 is disposed on the substrate 232 and electrically connected to the main circuit board 220. The at least one dielectric layer 236 covers the at least one conductive layer 234. A plurality of first light-emitting elements 121 and a plurality of first light-receiving elements 122 are bonded to the at least one conductive layer 234 of the first intermediate substrate 230. In some embodiments, the substrate 232 may selectively transmit light. In some embodiments, the material of the substrate 232 may be glass, quartz, or other suitable materials. However, the invention is not limited thereto, and in some embodiments, the substrate 232 may also be opaque.

[0111] In some embodiments, the substrate 232 of the first interposer substrate 230 has a plurality of through holes 232a, and the first interposer substrate 230 further includes a plurality of conductive elements 238, which are respectively disposed in the plurality of through holes 232a of the substrate 232. The plurality of conductive elements 238 are electrically connected to at least one conductive layer 234 of the first interposer substrate 230 and the main circuit board 220.

[0112] In some embodiments, the first optical transceiver unit 120, the first driver 150 and the first amplifier 160 may be selectively disposed on the same first intermediate substrate 230, wherein the first driver 150 and the first amplifier 160 may be electrically connected to the main circuit board 220 and the first chip 110 through the first intermediate substrate 230, but the present invention is not limited thereto.

[0113] In some embodiments, the co-packaged optical chip module 10 may optionally include a second intermediate substrate 240 disposed between the second optical transceiver unit 140 and the main circuit board 220, and electrically connected to the second optical transceiver unit 140 and the main circuit board 220. The second intermediate substrate 240 includes a substrate 242, at least one conductive layer 244, and at least one dielectric layer 246. The substrate 242 is disposed on the main circuit board 220. At least one conductive layer 244 is disposed on the substrate 242 and electrically connected to the main circuit board 220. At least one dielectric layer 246 covers at least one conductive layer 244. A plurality of second light-emitting elements 141 and a plurality of second light-receiving elements 142 are bonded to at least one conductive layer 244 of the second intermediate substrate 240. In some embodiments, the substrate 242 may selectively transmit light. In some embodiments, the material of the substrate 242 may be glass, quartz, or other suitable materials. However, the invention is not limited thereto, and in some embodiments, the substrate 242 may also be opaque.

[0114] In some embodiments, the substrate 242 of the second interposer 240 has a plurality of through holes 242a, and the second interposer 240 further includes a plurality of conductive elements 248, which are respectively disposed in the plurality of through holes 242a of the substrate 242 of the second interposer 240. The plurality of conductive elements 248 are electrically connected to at least one conductive layer 244 of the second interposer 240 and the main circuit board 220.

[0115] In some embodiments, the second optical transceiver unit 140, the second driver 170, and the second amplifier 180 may be selectively disposed on the same second intermediate substrate 240, wherein the second driver 170 and the second amplifier 180 may be electrically connected to the main circuit board 220 and the second chip 130 through the second intermediate substrate 240, but the present invention is not limited thereto.

[0116] In some embodiments, the co-packaged optical chip module 10 may optionally include an interposer substrate 250 disposed between the first chip 110 and the main circuit board 220, and structurally separate from the first interposer substrate 230. The first chip 110 can be electrically connected to the main circuit board 220 through the interposer substrate 250.

[0117] In some embodiments, the co-packaged optical chip module 10 may optionally include an interposer substrate 260 disposed between the second chip 130 and the main circuit board 220, and structurally separate from the second interposer substrate 240. The second chip 130 can be electrically connected to the main circuit board 220 through the second interposer substrate 240.

[0118] It must be noted that the following embodiments use the component reference numerals and some content from the foregoing embodiments, with the same reference numerals used to represent the same or similar components, and descriptions of the same technical content omitted. For explanations of the omitted parts, please refer to the foregoing embodiments; these will not be repeated in the following embodiments.

[0119] Figure 4 This is a cross-sectional schematic diagram of a co-packaged optical wafer module according to another embodiment of the present invention. Figure 4 The co-packaged optical chip module 10A and Figure 1 Similar to the co-packaged optical chip module 10, the difference between the two is: Figure 4 In one embodiment, the first optical transceiver unit 120 is disposed on the first intermediate substrate 230, but the first driver 150 and the first amplifier 160 are disposed on a third intermediate substrate 270 which is separate from the first intermediate substrate 230 and the intermediate substrate 250, wherein the third intermediate substrate 270 is electrically connected to the main circuit board 220; the second optical transceiver unit 140 is disposed on the second intermediate substrate 240, but the second driver 170 and the second amplifier 180 are disposed on another intermediate substrate 280 which is separate from the second intermediate substrate 240 and the intermediate substrate 260, wherein the intermediate substrate 280 is electrically connected to the main circuit board 220.

[0120] Figure 5 This is a cross-sectional schematic diagram of a co-packaged optical chip module according to another embodiment of the present invention. Figure 5 Co-packaged optical chip module 10B and Figure 1 Similar to the co-packaged optical chip module 10, the difference between the two is: Figure 5In one embodiment, the first optical transceiver unit 120 is disposed on the first intermediate substrate 230, but the first driver 150, the first amplifier 160 and the first chip 110 are disposed on the fourth intermediate substrate 290 which is separate from the first intermediate substrate 230; the second optical transceiver unit 140 is disposed on the second intermediate substrate 240, but the second driver 170, the second amplifier 180 and the second chip 130 are disposed on the intermediate substrate 300 which is separate from the second intermediate substrate 240.

[0121] Figure 6 This is a cross-sectional schematic diagram of a co-packaged optical chip module according to another embodiment of the present invention. Figure 6 Co-packaged optical chip module 10C and Figure 1 Similar to the co-packaged optical chip module 10, the difference between the two is: Figure 6 In one embodiment, the first driver 150, the first amplifier 160, the second driver 170, and the second amplifier 180 are directly disposed on the main circuit board 220.

[0122] Figure 7 This is a cross-sectional schematic diagram of a co-packaged optical chip module according to an embodiment of the present invention. Figure 7 10D co-packaged optical chip module and Figure 1 Similar to the co-packaged optical chip module 10, the difference between the two is: Figure 7 In this embodiment, the first optical transmission element 190, the first driver 150, the first amplifier 160, the second optical transmission element 200, the second driver 170, and the second amplifier 180 are all directly disposed on the main circuit board 220.

[0123] Figure 8 This is a cross-sectional schematic diagram of a co-packaged optical wafer module according to another embodiment of the present invention. Figure 8 Co-packaged optical chip module 10E and Figure 1 Similar to the co-packaged optical chip module 10, the difference between the two is: Figure 8 The first optical transmission element 190E of the co-packaged optical chip module 10E and Figure 1 The first optical transmission element 190 of the co-packaged optical chip module 10 is different. Figure 8 The first optical transmission element 190E can replace Figure 1 The functions of the first optical transmission element 190, the second optical transmission element 200, and the optical fiber bundle 210.

[0124] Figure 9 This is an enlarged schematic diagram of one end of the first optical transmission element according to another embodiment of the present invention. Figure 10 This is an enlarged schematic diagram of the other end of the first optical transmission element according to another embodiment of the present invention. Please refer to... Figure 8 , Figure 9 and Figure 10 In this embodiment, the first optical transmission element 190E includes a first light-transmitting substrate 191, at least one first micro-collimating lens 192, a first adhesive 193, a second light-transmitting substrate 194, at least one second micro-collimating lens 202, and at least one waveguide 196. The first light-transmitting substrate 191 has a first working area 191a and a first peripheral area 191b surrounding the first working area 191a. At least one first micro-collimating lens 192 is disposed on the first working area 191a of the first light-transmitting substrate 191. The first adhesive 193 is disposed on the first peripheral area 191b of the first light-transmitting substrate 191 and surrounds the at least one first micro-collimating lens 192. The second light-transmitting substrate 194 is disposed opposite to the first light-transmitting substrate 191. The first adhesive 193 connects the first light-transmitting substrate 191 and the second light-transmitting substrate 194. The first light-transmitting substrate 191 further has a second working area 191c located outside the first working area 191a. At least one second microcollimating lens 202 is disposed on the second working area 191c of the first light-transmitting substrate 191. A first frame adhesive 193 further surrounds the at least one second microcollimating lens 202. The second light-transmitting substrate 194 of the first optical transmission element 190E has an inner surface 194a and an outer surface 194b. The inner surface 194a faces the at least one first microcollimating lens 192. The outer surface 194b is opposite to the inner surface 194a. At least one waveguide 196 is disposed on the outer surface 194b of the second light-transmitting substrate 194. The two ends 196a and 196b of the at least one waveguide 196 correspond to the at least one first microcollimating lens 192 and the at least one second microcollimating lens 202, respectively. In this embodiment, a gap G exists between the first optical transceiver unit 120 and the second optical transceiver unit 140, and the at least one waveguide 196 of the first optical transmission element 190E spans the gap G.

[0125] In this embodiment, the co-packaged optical chip module 10E can complete optical communication using the first optical transmission element 190E, without requiring Figure 1 The second optical transmission element 200 and the optical fiber bundle 210.

[0126] In detail, in this embodiment, the first chip 110 emits a first transmission electrical signal. The first driver 150 emits a first light-emitting element driving electrical signal according to the first transmission electrical signal. The first light-emitting element 121 emits a first signal beam L1 according to the first light-emitting element driving electrical signal. The first signal beam L1 is transmitted to the second micro-collimating lens 202 via the waveguide 196 of the first optical transmission element 190E, and is then received by the second light-receiving element 142. The second light-receiving element 142 receives the first signal beam L1 and converts it into a first converted electrical signal. The second amplifier 180 receives the first converted electrical signal and amplifies it into a first received electrical signal. The first received electrical signal can be transmitted to the second chip 130. The first received electrical signal received by the second chip 130 is substantially the same as or close to the first transmission electrical signal emitted by the first chip 110.

[0127] The second chip 130 emits a second transmission electrical signal. The second driver 170 emits a second light-emitting element driving electrical signal according to the second transmission electrical signal. The second light-emitting element 141 emits a second signal beam L2 according to the second light-emitting element driving electrical signal. The second signal beam L2 is transmitted to the first micro-collimating lens 192 via the waveguide 196 of the first optical transmission element 190E, and is then received by the first light-receiving element 122. The first light-receiving element 122 receives the second signal beam L2 and converts it into a second converted electrical signal. The first amplifier 160 receives the second converted electrical signal and amplifies it into a second received electrical signal. The second received electrical signal can be transmitted to the first chip 110. The second received electrical signal received by the first chip 110 is substantially the same as or close to the second transmission electrical signal emitted by the second chip 130.

[0128] The first optical transmission element 190E enables signal communication between the first chip 110 and the second chip 130 via optical communication. This not only reduces the length of wires required for transmitting electrical signals and significantly improves bandwidth delay and heat dissipation, but also reduces the assembly complexity of the co-packaged optical chip module 10E.

[0129] Figure 11 This is a cross-sectional schematic diagram of a co-packaged optical chip module according to another embodiment of the present invention. Figure 11 10F co-packaged optical chip module and Figure 8 Similar to the co-packaged optical chip module 10E, the difference between the two lies in: Figure 11In one embodiment, the first optical transceiver unit 120 is disposed on the first intermediate substrate 230, but the first driver 150 and the first amplifier 160 are disposed on a third intermediate substrate 270 which is separate from the first intermediate substrate 230 and the intermediate substrate 250, wherein the third intermediate substrate 270 is electrically connected to the main circuit board 220; the second optical transceiver unit 140 is disposed on the second intermediate substrate 240, but the second driver 170 and the second amplifier 180 are disposed on another intermediate substrate 280 which is separate from the second intermediate substrate 240 and the intermediate substrate 260, wherein the intermediate substrate 280 is electrically connected to the main circuit board 220.

[0130] Figure 12 This is a cross-sectional schematic diagram of a co-packaged optical chip module according to another embodiment of the present invention. Figure 12 10G co-packaged optical chip module and Figure 8 Similar to the co-packaged optical chip module 10E, the difference between the two lies in: Figure 12 In one embodiment, the first optical transceiver unit 120 is disposed on the first intermediate substrate 230, but the first driver 150, the first amplifier 160 and the first chip 110 are disposed on the fourth intermediate substrate 290 which is separate from the first intermediate substrate 230; the second optical transceiver unit 140 is disposed on the second intermediate substrate 240, but the second driver 170, the second amplifier 180 and the second chip 130 are disposed on the intermediate substrate 300 which is separate from the second intermediate substrate 240.

[0131] Figure 13 This is a cross-sectional schematic diagram of a co-packaged optical chip module according to an embodiment of the present invention. Figure 13 Co-packaged optical chip module 10H and Figure 8 Similar to the co-packaged optical chip module 10E, the difference between the two lies in: Figure 13 In one embodiment, the first driver 150, the first amplifier 160, the second driver 170, and the second amplifier 180 are directly disposed on the main circuit board 220.

[0132] Figure 14 This is a cross-sectional schematic diagram of a co-packaged optical wafer module according to another embodiment of the present invention. Figure 14 Co-packaged optical chip module 10I and Figure 8 Similar to the co-packaged optical chip module 10E, the difference between the two lies in: Figure 14 In this embodiment, the first optical transmission element 190E, the first driver 150, the first amplifier 160, the second driver 170, and the second amplifier 180 are all directly disposed on the main circuit board 220.

[0133] Figure 15 This is a cross-sectional schematic diagram of a co-packaged optical chip module according to another embodiment of the present invention. Figure 15Co-packaged optical chip module 10J and Figure 11 Similar to the 10F co-packaged optical chip module, the difference between the two lies in: Figure 15 In this embodiment, the first chip 110 and the first optical transmission element 190E are located on different sides of the main circuit board 220. The first optical transceiver unit 120 and the second optical transceiver unit 140 are disposed on the same side of the main circuit board 220 as the first optical transmission element 190E. By disposing of the first optical transmission element 190E on the back side of the main circuit board 220, the placement of the first optical transmission element 190E is not limited by the original wiring of the main circuit board 220.

[0134] Of course, the present invention may have other various embodiments. Without departing from the spirit and essence of the present invention, those skilled in the art can make various corresponding changes and modifications according to the present invention, but these corresponding changes and modifications should all fall within the protection scope of the appended claims.

Claims

1. A co-packaged optical chip module, characterized in that, include: The first chip; A first optical transceiver unit is electrically connected to the first chip, wherein the first optical transceiver unit includes at least one first light-emitting element and at least one first light-receiving element; A second chip; A second optical transceiver unit is electrically connected to the second chip, wherein the second optical transceiver unit includes at least one second light-emitting element and at least one second light-receiving element; and A first optical transmission element, wherein the at least one first light-emitting element of the first optical transceiver unit is used to emit a first signal beam, the first signal beam being transmitted through the first optical transmission element to the at least one second light-receiving element of the second optical transceiver unit, wherein the first optical transmission element includes: A first light-transmitting substrate having a first working area and a first peripheral area surrounding the first working area; At least one first microcollimating lens is disposed on the first working area of ​​the first light-transmitting substrate; A first frame adhesive is disposed on the first peripheral area of ​​the first light-transmitting substrate and surrounds the at least one first microcollimating lens; and A second light-transmitting substrate is disposed opposite to the first light-transmitting substrate, wherein the first frame adhesive connects the first light-transmitting substrate and the second light-transmitting substrate.

2. The co-packaged optical wafer module as described in claim 1, characterized in that, The at least one first light-emitting element includes a plurality of first light-emitting elements, the at least one first light-receiving element includes a plurality of first light-receiving elements, the at least one first micro-collimating lens includes a plurality of first micro-collimating lenses, and the first micro-collimating lenses of the first light transmission element are respectively disposed opposite to the first light-emitting elements and the first light-receiving elements.

3. The co-packaged optical wafer module as described in claim 1, characterized in that, The first optical transmission element further includes: A first protruding structure is located between the first peripheral area of ​​the first light-transmitting substrate and the second light-transmitting substrate, wherein the first frame adhesive is sandwiched between the first protruding structure and one of the first light-transmitting substrate and the second light-transmitting substrate.

4. The co-packaged optical wafer module as described in claim 1, characterized in that, The first light-transmitting substrate, the second light-transmitting substrate, and the first frame adhesive enclose a vacuum space.

5. The co-packaged optical wafer module as described in claim 1, characterized in that, The first light-transmitting substrate is closer to the first optical transceiver unit than the second light-transmitting substrate, and the thickness of the first light-transmitting substrate is less than the thickness of the second light-transmitting substrate.

6. The co-packaged optical wafer module as described in claim 1, characterized in that, Including: A main circuit board, wherein the first chip is disposed on the main circuit board and electrically connected to the main circuit board; and A first intermediate substrate is disposed between the first optical transceiver unit and the main circuit board, the first intermediate substrate comprising: A substrate is disposed on the main circuit board; At least one conductive layer is disposed on the substrate and electrically connected to the main circuit board; and At least one dielectric layer covers the at least one conductive layer, wherein the first light-emitting elements and the first light-receiving elements are bonded to the at least one conductive layer of the first intermediate substrate.

7. The co-packaged optical wafer module as described in claim 6, characterized in that, The substrate of the first interposer substrate has a plurality of through holes, and the first interposer substrate further includes: Multiple conductive materials are respectively disposed in the through holes of the substrate of the first intermediate substrate, wherein the conductive materials are electrically connected to at least one conductive layer of the first intermediate substrate and the main circuit board.

8. The co-packaged optical wafer module as described in claim 1, characterized in that, Including: A second optical transmission element, comprising: A third light-transmitting substrate has a first working area and a first peripheral area surrounding the first working area; At least one second microcollimating lens is disposed on the first working area of ​​the third light-transmitting substrate; A second frame adhesive is disposed on the first peripheral region of the third light-transmitting substrate and surrounds the at least one second microcollimating lens; and A fourth light-transmitting substrate is disposed opposite the third light-transmitting substrate, wherein the second frame adhesive connects the third light-transmitting substrate and the fourth light-transmitting substrate; and An optical fiber bundle, wherein the two ends of the optical fiber bundle are respectively coupled to the first optical transmission element and the second optical transmission element.

9. The co-packaged optical wafer module as described in claim 1, characterized in that, The first light-transmitting substrate further includes a second working area located outside the first working area, and the first light transmission element further includes: At least one second microcollimating lens is disposed on the second working area of ​​the first light-transmitting substrate, wherein the first frame adhesive further surrounds the at least one second microcollimating lens; and At least one waveguide, wherein the second light-transmitting substrate of the first optical transmission element has an inner surface and an outer surface, the inner surface facing the at least one first microcollimating lens, the outer surface being opposite to the inner surface, the at least one waveguide being disposed on the outer surface of the second light-transmitting substrate, and the two ends of the at least one waveguide corresponding to the at least one first microcollimating lens and the at least one second microcollimating lens, respectively.

10. The co-packaged optical wafer module as described in claim 9, characterized in that, There is a gap between the first optical transceiver unit and the second optical transceiver unit, and at least one waveguide of the first optical transmission element crosses the gap.

11. The co-packaged optical wafer module as described in claim 9, characterized in that, Including: A main circuit board, wherein the first chip is disposed on the main circuit board and electrically connected to the main circuit board, and the first chip and the first optical transmission element are respectively located on different sides of the main circuit board.

12. The co-packaged optical wafer module as described in claim 1, characterized in that, Including: A main circuit board, wherein the first chip is disposed on the main circuit board and electrically connected to the main circuit board; A first intermediate substrate is disposed between the first optical transceiver unit and the main circuit board, and is electrically connected to the main circuit board; A first driver, electrically connected to the at least one first light-emitting element of the first optical transceiver unit; and A first amplifier is electrically connected to the at least one first light-receiving element of the first optical transceiver unit; The first optical transceiver unit, the first driver, and the first amplifier are disposed on the same first intermediate substrate.

13. The co-packaged optical wafer module as described in claim 1, characterized in that, Including: A main circuit board, wherein the first chip is disposed on the main circuit board and electrically connected to the main circuit board; A first intermediate substrate is disposed between the first optical transceiver unit and the main circuit board, and is electrically connected to the main circuit board; A third intermediate substrate is electrically connected to the main circuit board and is structurally separated from the first intermediate substrate; A first driver, electrically connected to the at least one first light-emitting element of the first optical transceiver unit; and A first amplifier is electrically connected to the at least one first light-receiving element of the first optical transceiver unit; The first optical transceiver unit is disposed on the first intermediate substrate, and the first driver and the first amplifier are disposed on the third intermediate substrate.

14. The co-packaged optical wafer module as described in claim 1, characterized in that, Including: A main circuit board, wherein the first chip is disposed on the main circuit board and electrically connected to the main circuit board; A first intermediate substrate is disposed between the first optical transceiver unit and the main circuit board, and is electrically connected to the main circuit board; A fourth intermediate substrate is electrically connected to the main circuit board and is structurally separated from the first intermediate substrate; A first driver, electrically connected to the at least one first light-emitting element of the first optical transceiver unit; and A first amplifier is electrically connected to the at least one first light-receiving element of the first optical transceiver unit; The first optical transceiver unit is disposed on the first intermediate substrate, and the first driver, the first amplifier and the first chip are disposed on the fourth intermediate substrate.

15. The co-packaged optical wafer module as described in claim 1, characterized in that, Including: A main circuit board, wherein the first chip is disposed on the main circuit board and electrically connected to the main circuit board; A first driver, electrically connected to the at least one first light-emitting element of the first optical transceiver unit; and A first amplifier is electrically connected to the at least one first light-receiving element of the first optical transceiver unit; The first optical transmission element, the first driver, and the first amplifier are directly disposed on the main circuit board.

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