Server mainboard water cooling device with liquid leakage detection structure

Abstract

The invention discloses a server mainboard water-cooling cooling device with a liquid leakage detection structure, and relates to the technical field of mainboard cooling, the server mainboard water-cooling cooling device comprises a case, a heat dissipation assembly used for dissipating heat of a mainboard body is arranged in the case, a plurality of heat dissipation fins are arranged in the heat dissipation assembly, and a liquid leakage detection structure is arranged in the case. A cooling assembly used for rapidly reducing the surface temperature of the heat dissipation fins is arranged in the machine box. Compared with the first water cooling pipe, the two ends of the second water cooling pipe are designed in a crossed mode and are finally connected with the first main header pipe and the second main header pipe, so that cooling liquid in the first water cooling pipe flows from the side close to the first main header pipe to the other side; the cooling liquid in the second water cooling pipe flows from one side close to the second main header to the other side, the flowing directions of the cooling liquid in the two water cooling pipes are opposite, and the defect that the heat exchange effect is reduced when the cooling liquid flows to the rear section is mutually compensated, so that the temperature reduction amplitudes of the cooling fins at all positions are roughly the same; and the problem that the local temperature of the mainboard body is relatively high is avoided.

Description

Technical Field

[0001] This invention relates to the field of motherboard cooling technology, and in particular to a server motherboard water-cooling device with a leakage detection structure. Background Technology

[0002] The server motherboard is the core hardware component of a server, bearing the crucial responsibility of connecting key components such as the CPU, memory, storage, and expansion cards, and coordinating system operation. Its design must meet requirements for high stability, strong scalability, high-performance computing, and data security. The processor and other electronic components on the server motherboard generate a significant amount of heat during operation. As a core component, the faster the processor operates, the higher the heat generated. Therefore, server motherboards are typically equipped with cooling devices (primarily water cooling) to reduce heat and ensure the normal operation of the server motherboard.

[0003] In existing technologies, the liquid pipes used for water cooling are mostly evenly distributed in the area to be cooled. As the coolant flows in the liquid pipes, the cooling effect becomes worse as the coolant moves further back, resulting in uneven heat dissipation on the motherboard, causing local temperature increases on the motherboard and poor cooling performance, which fails to meet people's usage needs. Summary of the Invention

[0004] The purpose of this invention is to address the shortcomings of uneven heat dissipation on motherboards in existing technologies, and to propose a server motherboard water-cooling device with a leakage detection structure.

[0005] To address the problems existing in the prior art, the present invention adopts the following technical solution: A server motherboard water-cooling device with a leakage detection structure includes a chassis, in which three motherboard bodies are detachably installed. The chassis is equipped with a heat dissipation component for dissipating heat from the motherboard bodies. The heat dissipation component has multiple heat dissipation fins. The chassis is also equipped with a cooling component for rapidly reducing the surface temperature of the heat dissipation fins.

[0006] Preferably, the heat dissipation assembly includes three heat-conducting plates, which are respectively fixedly disposed on the upper end of three main body panels, and the plurality of heat dissipation fins are respectively fixedly connected to the three heat-conducting plates.

[0007] Preferably, the cooling assembly includes a first water-cooled pipe, a second water-cooled pipe, a first manifold, a second manifold, a water tank, and a chiller. The first and second water-cooled pipes are respectively embedded in multiple heat dissipation fins. The arrangement of the first and second water-cooled pipes extends from the middle of the chassis to both sides, with the pipes gradually decreasing in density. One end of each of the first and second water-cooled pipes is fixedly connected to the first manifold, and the other end of each is fixedly connected to the second manifold. The water tank and the chiller are both fixedly installed inside the chassis. The inlet of the water tank is fixedly connected to the first manifold, the inlet of the chiller is fixedly connected to the second manifold, and the outlet of the water tank is connected to the inlet of the chiller via a pipe.

[0008] Preferably, the water tank is equipped with a water pump, and the output end of the water pump is connected to the outlet end of the water tank.

[0009] Preferably, a temperature sensor is fixedly installed inside the chassis.

[0010] Preferably, each of the three heat-conducting plates is fixed with a large cooling chip and a pair of small cooling chips. The large cooling chip is located at the center of the heat-conducting plate, and the pair of small cooling chips are symmetrically arranged on both sides of the large cooling chip. The large cooling chip and the small cooling chips are electrically connected to the temperature sensor.

[0011] Preferably, three mounting brackets are fixedly installed inside the chassis, and a fan is fixedly installed on each of the three mounting brackets. The three fans correspond one-to-one with the three motherboard bodies.

[0012] Preferably, the chassis has multiple heat dissipation holes on its side and top surfaces.

[0013] Preferably, a leakage sensor is detachably installed inside the chassis.

[0014] Compared with the prior art, the beneficial effects of the present invention are: 1. In this invention, the first and second water-cooling pipes are designed with bends, passing through all the heat dissipation fins in sequence and exchanging heat with the heat dissipation fins. Compared with the first water-cooling pipe, the two ends of the second water-cooling pipe are designed to cross each other and then connect to the first and second manifolds respectively. This makes the coolant in the first water-cooling pipe flow from the side closest to the first manifold to the other side, while the coolant in the second water-cooling pipe flows from the side closest to the second manifold to the other side. The coolant flows in opposite directions in the two water pipes, which compensates for the lack of heat exchange effect when the coolant flows to the later stage. This makes the temperature drop of the heat dissipation fins at each position about the same, avoiding the problem of local high temperature of the motherboard body. 2. In this invention, the first water cooling pipe and the second water cooling pipe extend from the middle of the chassis to both sides, and the pipe arrangement changes from dense to sparse. The cooling effect in the center is better than that around the perimeter. The cooling components can adaptively allocate cooling resources according to the temperature distribution on the motherboard body 11, which is highly practical. 3. In this invention, the temperature sensor detects the temperature of the motherboard body in real time. When the surface temperature of the motherboard body reaches a predetermined threshold, the large and small cooling chips work. The end of the cooling chip that contacts the heat-conducting plate is the cold end, which, together with the heat dissipation component and the cooling component, rapidly cools the motherboard body. The device has various cooling methods and can work in combination. Even if the temperature of the motherboard body is high, it can still effectively cool it. Attached Figure Description

[0015] The accompanying drawings, which are included to provide a further understanding of the invention and form part of this application, illustrate exemplary embodiments of the invention and, together with their description, serve to explain the invention and do not constitute an undue limitation thereof. In the drawings: Figure 1 This is a schematic diagram of the main structure of the present invention; Figure 2 This is a schematic diagram of the internal structure of the chassis of the present invention; Figure 3 This is a schematic diagram showing the connection relationship between the water tank and the chiller in this invention; Figure 4 This is a schematic diagram of the heat dissipation component structure of the present invention; Figure 5 This is a schematic diagram of the large and small cooling chips of the present invention; Figure 6 This is a schematic diagram showing the positional relationship between the first water-cooling pipe and the second water-cooling pipe of the present invention; Figure 7 This is a schematic diagram of the fan structure of the present invention.

[0016] The numbers in the diagram are as follows: 1. Chassis; 11. Motherboard; 2. Heat sink; 21. Heat sink fins; 3. First water cooling pipe; 31. Second water cooling pipe; 32. First main manifold; 33. Second main manifold; 4. Water tank; 41. Chiller; 5. Temperature sensor; 6. Large cooling chip; 61. Small cooling chip; 7. Mounting bracket; 71. Fan; 8. Ventilation holes; 9. Leakage sensor. Detailed Implementation

[0017] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0018] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," "sleeved / connected," "connected," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0019] Example: This example provides a server motherboard water-cooling device with a leakage detection structure. See [link to example]. Figure 1-7 Specifically, it includes a chassis 1, in which three motherboard bodies 11 are detachably installed. The chassis 1 is equipped with a heat dissipation component for dissipating heat from the motherboard bodies 11. The heat dissipation component is equipped with multiple heat dissipation fins 21. The chassis 1 is equipped with a cooling component for quickly reducing the surface temperature of the heat dissipation fins 21. In this optional embodiment, the heat dissipation fins 21 in the heat dissipation component exchange heat with the air, thereby cooling the motherboard body 11. The cooling component compensates for the insufficient heat exchange effect of the coolant flowing to the later stage, so that the temperature drop of the heat dissipation fins 21 in each position is roughly the same, avoiding the problem of local high temperature of the motherboard body 11. Moreover, the cooling component can adaptively allocate cooling resources according to the temperature distribution on the motherboard body 11, which is highly practical. Optionally, the heat dissipation assembly includes three heat conduction plates 2, which are respectively fixedly mounted on the upper end of three motherboard bodies 11, and multiple heat dissipation fins 21 are respectively fixedly connected to the three heat conduction plates 2. In this optional embodiment, the motherboard body 11 generates heat, which is transferred to the heat conduction plate 2. The heat conduction plate 2 then transfers the heat to the heat dissipation fins 21, which exchange heat with the air, thereby cooling the motherboard body 11. Optionally, the cooling assembly includes a first water-cooling pipe 3, a second water-cooling pipe 31, a first manifold 32, a second manifold 33, a water tank 4, and a chiller 41. The first water-cooling pipe 3 and the second water-cooling pipe 31 are respectively embedded on multiple heat dissipation fins 21. The arrangement of the first water-cooling pipe 3 and the second water-cooling pipe 31 extends from the middle of the chassis 1 to both sides, and the arrangement of the pipes gradually decreases from dense to sparse. One end of the first water-cooling pipe 3 and the second water-cooling pipe 31 is fixedly connected to the first manifold 32, and the other end of the first water-cooling pipe 3 and the second water-cooling pipe 31 is fixedly connected to the second manifold 33. The water tank 4 and the chiller 41 are both fixedly installed inside the chassis 1. The inlet end of the water tank 4 is fixedly connected to the first manifold 32, and the inlet end of the chiller 41 is fixedly connected to the second manifold 33. The outlet end of the water tank 4 is connected to the inlet end of the chiller 41 through a pipe. A water pump is installed inside the water tank 4, and the output end of the water pump is connected to the outlet end of the water tank 4. In this optional embodiment, a water pump (not shown in the figure) draws water from the water tank 4 into the chiller 41. The chiller 41 cools the water, and the water then enters the second manifold 33 from the outlet end of the chiller 41. The cooled water then flows from the second manifold 33 into the first water-cooling pipe 3 and the second water-cooling pipe 31, and then from the other end into the first manifold 32. Finally, it flows along the first manifold 32 into the water tank 4. The first water-cooling pipe 3 and the second water-cooling pipe 31 are designed with bends, passing through all the heat dissipation fins 21 in sequence and exchanging heat with the heat dissipation fins 21. Compared with the first water-cooling pipe 3... The two ends of the second water-cooling pipe 31 are designed to cross each other and then connect to the first manifold 32 and the second manifold 33 respectively. This allows the coolant in the first water-cooling pipe 3 to flow from the side closest to the first manifold 32 to the other side, while the coolant in the second water-cooling pipe 31 flows from the side closest to the second manifold 33 to the other side. The coolant flows in opposite directions in the two water pipes, which compensates for the decrease in heat exchange effect when the coolant flows to the later stage. This makes the temperature drop of the heat dissipation fins 21 at each position about the same, avoiding the problem of local high temperature of the motherboard body 11. The processor is located in the center of the motherboard body 11, which allows the heat of the motherboard body 11 to be dissipated from the center to the sides. The temperature in the center is higher than the temperature around the edges. The first water cooling pipe 3 and the second water cooling pipe 31 extend from the center of the chassis 1 to both sides. The pipe arrangement changes from dense to sparse. The cooling effect in the center is better than that around the edges. The cooling components can adaptively allocate cooling resources according to the temperature distribution on the motherboard body 11, which is highly practical. Optionally, a temperature sensor 5 is fixedly installed inside the chassis 1, and a large cooling chip 6 and a pair of small cooling chips 61 are fixedly installed on each of the three heat conduction plates 2. The large cooling chip 6 is located at the center of the heat conduction plate 2, and the pair of small cooling chips 61 are symmetrically arranged on both sides of the large cooling chip 6. The large cooling chip 6 and the small cooling chips 61 are electrically connected to the temperature sensor 5. In this optional embodiment, the temperature sensor 5 detects the temperature of the motherboard body 11 in real time. When the surface temperature of the motherboard body 11 reaches a predetermined threshold, the large cooling chip 6 and the small cooling chip 61 start working. The end of the cooling chip that contacts the heat-conducting plate 2 is the cold end, which, together with the heat dissipation component and the cooling component, quickly cools down the motherboard body 11. It should be noted that the cooling effect of the large cooling chip 6 is better than that of the small cooling chip 61. It is also assembled according to the temperature distribution on the motherboard body 11. Optionally, three mounting brackets 7 are fixedly installed inside the chassis 1, and fans 71 are fixedly installed on each of the three mounting brackets 7. The three fans 71 correspond one-to-one with the three motherboard bodies 11. Multiple heat dissipation holes 8 are opened on the side and top surfaces of the chassis 1. In this optional embodiment, the fan 71 blows air to force the air around the heat dissipation fins 21 to flow. The forced airflow can break the thermal boundary layer on the surface of the heat dissipation fins 21, so that the cold air can continuously contact the hot surface, thereby improving the heat exchange efficiency. The heat dissipation holes 8 are used for air exchange inside and outside the chassis 1 to improve the cooling effect. Optionally, a leak sensor 9 is removably installed inside the chassis 1; In this optional embodiment, the probe of the leak sensor 9 is equipped with a chemical adsorption material. When the water cooling system leaks, the chemical adsorption material captures the leaking liquid. The weight change of the liquid after adsorption generates an electrical signal, enabling the leak sensor 9 to detect whether the cold water pipe is leaking in real time, which facilitates timely maintenance by the staff.

[0020] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A server motherboard water-cooling device with a leakage detection structure, comprising a chassis (1), characterized in that: The chassis (1) is detachably installed with three motherboard bodies (11). The chassis (1) is provided with a heat dissipation component for dissipating heat from the motherboard bodies (11). The heat dissipation component is provided with multiple heat dissipation fins (21). The chassis (1) is provided with a cooling component for rapidly reducing the surface temperature of the heat dissipation fins (21).

2. The server motherboard water-cooling device with a leakage detection structure according to claim 1, characterized in that: The heat dissipation assembly includes three heat-conducting plates (2), which are fixedly mounted on the upper ends of three main body bodies (11), and multiple heat dissipation fins (21) are fixedly connected to the three heat-conducting plates (2).

3. The server motherboard water-cooling device with a leakage detection structure according to claim 1, characterized in that: The cooling assembly includes a first water-cooling pipe (3), a second water-cooling pipe (31), a first manifold (32), a second manifold (33), a water tank (4), and a chiller (41). The first water-cooling pipe (3) and the second water-cooling pipe (31) are respectively embedded on multiple heat dissipation fins (21). The first water-cooling pipe (3) and the second water-cooling pipe (31) extend from the middle of the chassis (1) to both sides, and the pipe arrangement gradually decreases from dense to sparse. One end of each is fixedly connected to the first main pipe (32), and the other end of the first water cooling pipe (3) and the second water cooling pipe (31) are fixedly connected to the second main pipe (33). The water tank (4) and the chiller (41) are both fixedly installed inside the casing (1). The inlet end of the water tank (4) is fixedly connected to the first main pipe (32), the inlet end of the chiller (41) is fixedly connected to the second main pipe (33), and the outlet end of the water tank (4) is connected to the inlet end of the chiller (41) through a pipe.

4. A server motherboard water-cooling device with a leakage detection structure according to claim 3, characterized in that: The water tank (4) is equipped with a water pump, and the output end of the water pump is connected to the outlet end of the water tank (4).

5. A server motherboard water-cooling device with a leakage detection structure according to claim 1, characterized in that: A temperature sensor (5) is fixedly installed inside the chassis (1).

6. A server motherboard water-cooling device with a leakage detection structure according to claim 2, characterized in that: Each of the three heat-conducting plates (2) is fixed with a large cooling chip (6) and a pair of small cooling chips (61). The large cooling chip (6) is located at the center of the heat-conducting plate (2), and the pair of small cooling chips (61) are symmetrically arranged on both sides of the large cooling chip (6). The large cooling chip (6) and the small cooling chips (61) are electrically connected to the temperature sensor (5).

7. A server motherboard water-cooling device with a leakage detection structure according to claim 1, characterized in that: The chassis (1) is fixedly provided with three fixed brackets (7), and each of the three fixed brackets (7) is fixedly provided with a fan (71). The three fans (71) correspond one-to-one with the three main body (11).

8. A server motherboard water-cooling device with a leakage detection structure according to claim 1, characterized in that: Multiple heat dissipation holes (8) are provided on the side and top surfaces of the chassis (1).

9. A server motherboard water-cooling device with a leakage detection structure according to claim 1, characterized in that: A leak sensor (9) is detachably installed inside the chassis (1).

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