Server and processor heat dissipation method

Abstract

The invention discloses a server and a processor heat dissipation method, relates to the technical field of computers, and aims to avoid large temperature difference of different processors caused by manufacturing tolerance or an independent heat conduction path by arranging a radiator shared by a plurality of processors, thereby being beneficial to reducing frequency reduction of the processors. Besides, flow guide fan covers are respectively arranged between the radiator and the plurality of fans, and the flow guide directions of the flow guide fan covers and the rotating speeds of the fans are dynamically adjusted through the management controller, so that the temperatures of the plurality of processors are equivalent, and the frequency reduction of the processors can be further reduced. Therefore, the cooperative computing performance of the server is improved from two aspects.

Description

TECHNICAL FIELD

[0001] The present application relates to the computer technical field, and particularly relates to a server and a processor heat dissipation method. BACKGROUND

[0002] With the development of computer technology, the heat dissipation performance of a server is more and more important, which will affect the operation performance of the server, especially for the server with more processors.

[0003] In the prior art, a heat sink is arranged on each processor of the server to dissipate heat of the processor respectively. However, this scheme will cause a large temperature difference between different processors, and reduce the cooperative computing performance of the server. SUMMARY

[0004] The present application provides a server and a processor heat dissipation method to at least solve the problem of low cooperative computing performance in the related art.

[0005] The present application provides a server, comprising: one or more processors, a heat sink, a flow guide cover, a fan and a management controller, wherein the processor is provided with a temperature sensor; the heat sink covers the one or more processors, and the heat sink is used for conducting the temperature of the processor; the flow guide cover is located between the heat sink and the fan, the flow direction of the flow guide cover is adjustable, and the wind output by the fan reaches the heat sink through the flow guide cover to dissipate the temperature on the heat sink to the outside of the server; the temperature sensor is connected to the management controller, and the flow guide cover and / or the fan is connected to the management controller, and the management controller is used for controlling the flow direction of the flow guide cover and / or the rotating speed of the fan based on the temperature measured by the temperature sensor.

[0006] The present application also provides a processor heat dissipation method applied to the above-mentioned server, and the method comprises:

[0007] The management controller acquires the temperature measured by the temperature sensor, and controls the flow direction of the flow guide cover and / or the rotating speed of the fan according to the temperature.

[0008] Through the present application, the heat sink shared by multiple processors is arranged, the heat sink integration is realized, the large temperature difference between different processors caused by manufacturing tolerance or independent heat conduction path is avoided, and the frequency reduction of the processor is reduced. In addition, the flow guide cover is arranged between the heat sink and the multiple fans respectively, and the flow direction of the flow guide cover and the rotating speed of the fan are dynamically adjusted by the management controller, so that the temperatures of the multiple processors are equivalent, and the frequency reduction of the processor is further reduced. In this way, the cooperative computing performance of the server is improved from two aspects. BRIEF DESCRIPTION OF DRAWINGS

[0009] In order to more clearly illustrate the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments. Obviously, the drawings described in the following embodiments are only some of the embodiments of the present application, and other drawings can be obtained by those skilled in the art without any creative effort based on these drawings.

[0010] Figure 1 is a schematic diagram of a server radiator layout provided by a related art;

[0011] Figure 2 is a schematic diagram of a server structure provided by an embodiment of the present application;

[0012] Figure 3 is a schematic diagram of a position relationship between a fan and a guide cover provided by an embodiment of the present application;

[0013] Figure 4 is a schematic diagram of a radiator structure provided by an embodiment of the present application;

[0014] Figure 5 is a step flow chart of a processor heat dissipation method provided by an embodiment of the present application;

[0015] Figure 6 is a step flow chart of another processor heat dissipation method provided by an embodiment of the present application. DETAILED DESCRIPTION

[0016] The technical solutions in the embodiments of the present application will be described clearly and completely in the following with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without any creative effort fall within the protection scope of the present application.

[0017] It should be noted that, in the description of the present application, the terms "comprise", "include" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements not only includes those elements, but also includes other elements not explicitly listed, or further includes the elements inherent to such process, method, article or equipment. The terms "first", "second" and the like in the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence.

[0018] Embodiments of the present application are applied to a server heat dissipation scene, and are specifically used for dissipating heat of a processor (CPU, Central Processing Unit) of a server to improve the operation performance of the server. The server can include one or more processors. For example, in a high-density server scene including but not limited to a cloud computing data center, an edge computing node and an artificial intelligence training cluster, such as a dual-channel processor, a four-channel processor and more processors.

[0019] In some related technologies, one heat dissipation device is arranged for each processor in the server, and one fan is arranged for each heat dissipation device. One heat dissipation device and its corresponding fan together dissipate heat for one processor.

[0020] Figure 1 A server heat dissipation device layout diagram provided by a related technology is shown in FIG. 1. As shown in FIG. 1, three processors A1, A2 and A3 are exemplarily shown. The processor A1 corresponds to a heat dissipation device B1 and a fan C1, the processor A2 corresponds to a heat dissipation device B2 and a fan C2, and the processor A3 corresponds to a heat dissipation device B3 and a fan C3. Figure 1

[0021] It should be noted that the number of processors in practice can be any number greater than or equal to 1, and the number of processors is not limited by the present application.

[0022] In the above scheme, due to manufacturing tolerances of different heat dissipation devices or independent heat conduction paths, and different computing task amounts of different processors, the temperatures of different processors can be quite different. The processor with a too high temperature can be frequency-reduced, thereby causing poor collaborative computing performance of the server. For example, for the server shown in FIG. 1, if the temperatures of the processors A1 and A2 are equivalent, but the temperature of the processor A3 is much higher than the temperatures of the processors A1 and A2, the processor A3 can be frequency-reduced. Therefore, when the server performs collaborative operation through the processors A1, A2 and A3, the operation performance is poor. Figure 1

[0023] To solve the above technical problem, the present application sets a heat dissipation device shared by multiple processors to avoid a large temperature difference between different processors caused by manufacturing tolerances or independent heat conduction paths, which helps to reduce frequency reduction of the processor. In addition, a flow guide hood is arranged between the heat dissipation device and multiple fans, and a baseboard management controller (BMC) is used to dynamically adjust the flow guide direction of the flow guide hood and the rotating speed of the fan, so that the temperatures of the multiple processors are equivalent, which can further reduce frequency reduction of the processor. In this way, the collaborative computing performance of the server is improved from two aspects.

[0024] ​​In order for those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0025] Figure 2 is a structural schematic diagram of a server provided by an embodiment of the present application, referring to Figure 2 , the server of the present application comprises one or more processors 101, a heat sink 102, a flow guide cover 104, a fan 103 and a management controller 106, and the processor 101 is provided with a temperature sensor 105.

[0026] The heat sink 102 covers the one or more processors 101, referring to Figure 2 , the processor 101 is located below the heat sink 102, so it is represented by a dashed line in the top view. The heat sink 102 is used to conduct the temperature of the processor 101. The flow guide cover 104 is located between the heat sink 102 and the fan 103, the flow direction of the flow guide cover 104 is adjustable, and the wind output by the fan 103 reaches the heat sink 102 through the flow guide cover 104 to dissipate the temperature on the heat sink 102 to the outside of the server.

[0027] The temperature sensor 105 is connected to the management controller 106, and the flow guide cover 104 and / or the fan 103 are connected to the management controller 106, and the management controller 106 is used to control the flow direction of the flow guide cover 104 and / or the rotating speed of the fan 103 based on the temperature measured by the temperature sensor 105.

[0028] In some embodiments, referring to Figure 3 , the flow guide cover 104 can be fixedly arranged at the air outlet of the fan 103, that is, the flow guide cover 104 and the fan 103 are integrated together. In this way, the flow guide cover 104 is provided with a plurality of flow guide plates 1041, and the direction of the flow guide plate 1041 can be adjusted, so that the adjustment of the wind direction, that is, the adjustment of the flow direction, can be realized.

[0029] It can be understood that the heat sink 102 is used to conduct the temperature on the processor 101 to itself, and then through the fan 103 towards the heat sink 102 to reduce the temperature of the heat sink 102 through the wind, so as to realize the continuous cooling of the processor 101. The present application sets the flow guide cover 104 with adjustable flow direction between the heat sink 102 and the fan 103, so as to flexibly adjust the wind direction of the fan 103, so as to adjust the cooling object of the fan 103, and the cooling object is different processors 101.

[0030] Based on the above structure, the temperature sensor 105 is used to measure the temperature on the processor 101 in real time, and send the temperature to the management controller 106, which can control the direction of the flow guide hood 104 and / or the rotating speed of the fan 103 according to the temperature on the processor 101, so as to control the temperature of all the processors 101 as evenly as possible below a preset temperature threshold. For example, when the temperature of part of the processors 101 is greater than or equal to the preset temperature threshold, the management controller 106 can increase the rotating speed of the fan 103 corresponding to the processor 101, and control the direction of the flow guide hood 104 of the remaining processors 101 to be directed to the processor 101, so as to increase the heat dissipation of the processor 101, while the fan 103 of the remaining processors 101 with a temperature less than the preset temperature threshold can be controlled to run at a default rotating speed, and the flow guide hood 104 of the remaining processors 101 can be controlled to guide the flow in a default direction, so as to ensure normal heat dissipation. For another example, when the temperature of all the processors 101 is greater than or equal to the preset temperature threshold, the management controller 106 can control all the fans 103 to run at a maximum rotating speed, and all the flow guide hoods 104 to guide the flow in a default direction.

[0031] It can be seen that the control of the direction of the flow can realize the flexible distribution of the fan 103, and therefore, the application combines the direction of the flow and the rotating speed of the fan 103 to realize dynamic heat dissipation and precise heat dissipation in local positions, which is helpful to achieve temperature balance faster on the basis of energy saving.

[0032] In addition, the one or more processors 101 of the application share one heat sink 102, realizing the integration of the heat sink 102. Compared with the separate heat sink 102 arranged for each processor 101, the installation steps are simple, the occupied space is small, the disassembly is simple during maintenance, which is helpful to avoid damage to the hardware during disassembly, the heat dissipation area is large, and the heat dissipation efficiency can be improved. And the integrated heat sink 102 does not have the manufacturing tolerance and independent heat conduction path between the split heat sink 102, which can ensure that the temperatures of the processors 101 are as small as possible.

[0033] In some possible implementations, the fans 103 are distributed in multiple areas, each area including a plurality of micro turbine fans 103, forming a micro turbine fan 103 array, and the micro turbine fans 103 in each area can be independently controlled. Referring to Figure 2As shown, the server further includes a storage unit 107 connected to the management controller 106, and the storage unit 107 stores some information required by the management controller 106, for example, a preset mapping relationship used to indicate the mapping relationship between the area, the processor 101, the temperature sensor 105, the fan 103 and the flow guide shroud 104. Based on this, the management controller 106 is further configured to read the preset mapping relationship from the storage unit 107, and control the rotating speed of the fan 103 and the flow guide direction of the flow guide shroud 104 in each area based on the preset mapping relationship and the temperature.

[0034] It can be understood that the storage unit 107 described above can also be arranged inside the management controller 106 to reduce the time delay of the management controller 106 reading the preset mapping relationship.

[0035] Based on the preset mapping relationship stored in the storage unit 107, the management controller 106 can accurately find the processor 101 whose temperature is greater than or equal to the preset temperature threshold, the area, the fan 103 and the flow guide shroud 104 corresponding to the processor 101, and the adjacent fan 103 and the flow guide shroud 104. In this way, the fan 103 and the flow guide shroud 104 that need to be adjusted can be accurately located based on the preset mapping relationship, which is helpful to realize accurate heat dissipation.

[0036] In some embodiments, Figure 4 is a structural schematic diagram of a heat dissipation device 102 according to an embodiment of the present application. Referring to Figure 4 As shown, the heat dissipation device 102 can further include a heat dissipation substrate 1021 and a heat dissipation fin group 1022, the heat dissipation substrate 1021 covers one or more processors 101, and the heat dissipation substrate 1021 is provided with a boss 1025 matched with the top cover of the processor 101, the boss 1025 is composed of the heat dissipation fin group 1022 directly contacting the processor 101, and the processor contact position 1026 can refer to Figure 4 As shown, the heat dissipation substrate 1021 is provided with a plurality of heat conduction pipes 1024 arranged in a staggered manner, the heat conduction pipes 1024 are connected to each heat dissipation fin group 1022, and the heat conduction pipes 1024 are used to conduct the temperature on the heat dissipation fin group 1022 directly contacting the processor 101 to the remaining heat dissipation fin groups 1022.

[0037] Among them, the heat dissipation substrate 1021 can be made of any material, but in order to maximize the heat dissipation efficiency, a copper-aluminum composite substrate can be used as the heat dissipation substrate 1021, and the copper-aluminum has good heat conduction performance. The boss 1025 at the bottom of the heat dissipation substrate 1021 can be closely combined with the groove of the top cover of the processor 101 to ensure that the heat dissipation device 102 is firm and avoid loosening of the heat dissipation device 102.

[0038] The heat conduction pipe 1024 embedded in the heat dissipation substrate 1021 is used to accelerate heat conduction, which can be a copper pipe, arranged in a staggered manner in a bending manner to form a heat conduction network. In this way, the heat dissipation path can be increased, thereby improving the heat dissipation capacity.

[0039] The heat dissipation fin group 1022 is composed of a plurality of parallel arranged fin-shaped heat dissipation fins, and the heat dissipation fin group can be arranged obliquely to increase the heat dissipation length, thereby improving the heat dissipation capacity. The heat dissipation fin groups 1022 in different regions can be arranged in different oblique directions to maximize the space between the heat dissipation fin groups 1022 in different regions to improve the heat dissipation capacity.

[0040] The heat dissipation fin group 1022 in direct contact with the processor 101 can be made of pure copper material to improve the heat dissipation efficiency. The remaining heat dissipation fins can be thick aluminum fins, and the fin surface is subjected to anodic oxidation treatment to form a porous oxide layer to increase the heat dissipation area. The number of heat dissipation fins included in the heat dissipation fin group 1022 can be flexibly set, for example, it can be 40 to 60, the thickness of the heat dissipation fin can be 0.3 millimeters, and the inclination angle of the heat dissipation fin can be flexibly set according to the needs, for example, the conventional inclination angle can be 30 degrees, and the spacing between adjacent heat dissipation fins can be 2.5 millimeters.

[0041] In some possible implementations, the heat conduction pipe 1024 is filled with temperature-sensitive medium, and the flow rate of the temperature-sensitive medium is positively correlated with the temperature. The flow rate of the temperature-sensitive medium is related to the temperature of the processor 101, and when the temperature-sensitive medium passes through the surrounding of the processor 101 with high temperature, the high temperature causes the temperature-sensitive medium to flow faster, so that the heat can be dissipated faster around the processor 101 with high temperature; when the temperature-sensitive medium passes through the surrounding of the processor 101 with low temperature, the low temperature causes the temperature-sensitive medium to flow slower, so that the heat can be dissipated slower around the processor 101 with low temperature. In this way, the temperature conduction of the heat conduction pipe 1024 can be adapted to the temperature through the temperature-sensitive medium, and the temperature conduction can be realized more intelligently, which helps to improve the heat dissipation effect. It can be seen that the heat dissipation performance can be improved not only by the flow direction of the flow guide cover 104 and the rotating speed of the fan 103, but also by further combining the temperature-sensitive medium to improve the heat dissipation performance.

[0042] The temperature-sensitive medium can be a liquid or a gas, for example, a commonly used temperature-sensitive medium is a temperature-sensitive nanofluid.

[0043] In a possible implementation, a flow rate measuring device can also be arranged at multiple positions of the heat conduction pipe 1024 to measure the flow speed of the temperature sensitive medium and send the flow speed to the management controller 106, which can analyze the flow speed to determine whether the flow speed is normal and send the abnormal flow speed and the position of the corresponding heat conduction pipe 1024 to the management client for display. In this way, the user can conveniently monitor the medium flow in real time, so that the abnormality can be handled in time.

[0044] In some possible implementations, the processor 101 is arranged on the mainboard by means of slot insertion, and the heat sink 102 is fixed on the mainboard by means of the bolt 1023 shown in the figure, and the bolt 1023 is provided with a spring mechanism. Figure 4 In this way, the spring mechanism uniformly applies pressure to all processors 101, eliminating the installation deviation caused by manual installation.

[0045] In addition, a lever type locking mechanism is adopted to realize quick installation and disassembly of the heat sink 102.

[0046] Based on the above server, the application further provides a processor heat dissipation method, which is executed by the management controller. Figure 5 is a step flow chart of a processor heat dissipation method provided by an embodiment of the application, referring to Figure 5 The above method comprises the following steps.

[0047] S201, the management controller acquires the temperature measured by the temperature sensor.

[0048] It can be understood that one temperature sensor is arranged for each processor to measure the temperature of the processor. The management controller is in communication connection with the temperature sensor, and the temperature sensor is used to measure the temperature of the processor and send the measured temperature to the management controller. The management controller can receive the temperature of each processor.

[0049] The temperature sensor can collect the temperature according to a preset frequency or under the control of the management controller. In an example, for each processor, the management controller can determine the temperature collection frequency of the processor according to the temperature change curve of the processor to control the corresponding temperature sensor to collect the temperature according to the temperature collection frequency. The above temperature collection frequency can be positively correlated with the change amplitude and / or change frequency of the temperature change curve of the processor, that is, the temperature collection frequency can be increased when the change amplitude and / or change frequency is larger, and the temperature collection frequency can be decreased when the change amplitude and / or change frequency is smaller. In this way, the temperature collection frequency can be intelligently controlled to accurately capture the temperature change on the basis of energy saving as much as possible, which is helpful to improve the heat dissipation effect.

[0050] S202, the management controller controls the direction of the air guide hood and / or the rotating speed of the fan according to the temperature.

[0051] In an embodiment, the management controller can receive the temperature of each processor, and when the temperature of each processor is less than or equal to a preset temperature threshold, it indicates that the current temperature control effect is good, and then the management controller executes a default cooling mode. In the default cooling mode, all fans can be controlled to run at a default rotating speed, and / or all air guide hoods can be controlled to guide air in a default direction, so as to maintain the current cooling effect. The default rotating speed is usually low, for example, it can be a rotating speed less than a preset rotating speed threshold, and the default direction can be towards the area where the corresponding processor is located.

[0052] In an example, the rotating speed of the fan is positively correlated with the temperature, that is, the higher the temperature, the greater the rotating speed of the fan, and the lower the temperature, the smaller the rotating speed of the fan.

[0053] In another example, the direction of the air guide hood is towards the area with a higher temperature.

[0054] In some possible implementations, the management controller controls the direction of the air guide hood and / or the rotating speed of the fan according to the temperature, including:

[0055] The management controller obtains a preset mapping relationship, which is used to indicate the mapping relationship between the area, the processor, the temperature sensor, the fan and the air guide hood; and the management controller controls the rotating speed of the fan and / or the direction of the air guide hood in each area based on the preset mapping relationship and the temperature. In this way, the management controller can accurately find the fan and the air guide hood corresponding to the processor with an abnormal temperature according to the preset mapping relationship, so as to control them and quickly dissipate heat.

[0056] It can be understood that the above preset mapping relationship can be stored in the form of a list, and the above preset mapping relationship can be configured in the management client corresponding to the management controller. The user can adjust the preset mapping relationship through a graph. When the management client obtains the graphically represented preset mapping relationship, it can send the graphically represented preset mapping relationship to the management controller for storage in the storage unit 107; the management client can also convert the graphically represented preset mapping relationship into a list form and send it to the management controller for storage in the storage unit 107. It can be seen that the present application not only supports dynamic adjustment of the preset mapping relationship by the user, but also facilitates user management through the graphically represented preset mapping relationship, thereby reducing the user management complexity.

[0057] Of course, the management client can also support the preset mapping relationship in the form of a list, so that the user can adjust the preset mapping relationship based on the list.

[0058] In some possible implementations, the management controller controls the rotation speed of the fan and / or the air guiding direction of the air guiding shroud in each region based on the preset mapping relationship and the temperature, including:

[0059] The management controller determines the heat dissipation mode according to the temperature, and the heat dissipation mode includes one of the following: a default heat dissipation mode, an equalization heat dissipation mode, or an enhanced heat dissipation mode. When the temperature of each region is less than or equal to a preset temperature threshold, the heat dissipation mode is the default heat dissipation mode. When there is a region whose temperature is greater than the preset temperature threshold, the heat dissipation mode is the equalization heat dissipation mode. When the temperature of each region is greater than the preset temperature threshold, the heat dissipation mode is the enhanced heat dissipation mode. The management controller controls the rotation speed of the fan and / or the air guiding direction of the air guiding shroud in each region according to the temperature, the heat dissipation mode, and a preset mapping relationship. In this way, different heat dissipation controls are performed in different heat dissipation modes, and the heat dissipation effect can be improved.

[0060] The target of the default heat dissipation mode is to maintain the current temperature.

[0061] The target of the equalization heat dissipation mode is to perform heat dissipation on the region with a temperature that is too high to make the temperature of all processors below the preset temperature threshold.

[0062] The target of the enhanced heat dissipation mode is to quickly perform heat dissipation on the temperature of all processors to make all processors quickly reach below the preset temperature threshold.

[0063] After obtaining the heat dissipation mode, the management controller can send the heat dissipation mode to the management client for display.

[0064] In one possible implementation, the management controller controls the rotation speed of the fan and / or the air guiding direction of the air guiding shroud in each region according to the temperature, the heat dissipation mode, and a preset mapping relationship, including: in the default heat dissipation mode, the management controller controls each fan to operate at a default rotation speed, and / or controls the air guiding direction of the air guiding shroud to be a default air guiding direction. In the equalization heat dissipation mode, the management controller controls each fan to operate at a corresponding rotation speed according to the temperature and the preset mapping relationship, and / or the air guiding shroud corresponding to the fan performs air guiding in a corresponding air guiding direction. A region in which a processor with a temperature greater than or equal to a preset temperature threshold is a target cooling region. A region with a temperature less than the preset temperature threshold and a distance less than or equal to a preset distance threshold from the target cooling region is an auxiliary cooling region. The rotation speed of the fan in the target cooling region and the auxiliary cooling region is a maximum rotation speed. The rotation speed of the fan in the remaining regions is a default rotation speed. The air guiding direction of the air guiding shroud in the auxiliary cooling region is toward the target cooling region. The air guiding direction of the air guiding shroud outside the auxiliary cooling region is the default air guiding direction. In the enhanced heat dissipation mode, the management controller controls each fan to operate at a maximum rotation speed, and / or controls the air guiding direction of the air guiding shroud to be a default air guiding direction.

[0065] It can be understood that in the balanced heat dissipation mode, the area where the processor is located is divided into a target cooling area and a normal temperature area, wherein the target cooling area is an area with a temperature greater than or equal to a preset temperature threshold, and the normal temperature area outside the target cooling area is an area with a temperature less than the preset temperature threshold. The normal temperature area is further divided into an auxiliary cooling area and a normal cooling area according to the distance from the target cooling area. The normal cooling area is a normal temperature area with a distance greater than a preset distance threshold from the target cooling area, and the auxiliary cooling area is a normal temperature area with a distance less than or equal to the preset distance threshold from the target cooling area.

[0066] The auxiliary cooling area is used to assist the target cooling area in heat dissipation, so that the target cooling area quickly reaches below the preset temperature threshold. When assistance is not needed, the fan of the target cooling area is used to reduce the temperature of its own area, but when assistance is needed, the fan of the target cooling area is used to reduce the temperature of the target cooling area.

[0067] In this way, the present application can perform heat dissipation through the default rotation speed and the default flow direction in the default heat dissipation mode to continuously ensure that the temperature of the processor in all areas is less than or equal to the preset temperature threshold; in the balanced heat dissipation mode, the target cooling area is assisted by the auxiliary cooling area to quickly achieve temperature control; in the enhanced heat dissipation mode, the maximum rotation speed is used to achieve rapid cooling of each area.

[0068] It should be noted that the above-mentioned management controller of the present application controls the rotation speed and flow direction of the fan, which can be periodically executed, so that the rotation speed and flow direction can be flexibly adjusted according to the temperature situation of the current period in different periods. That is, as time goes on, the heat dissipation mode is constantly switched between the default heat dissipation mode, the balanced heat dissipation mode and the enhanced heat dissipation mode. For example, in the last period T1, the heat dissipation mode is the default heat dissipation mode, but in the next period T2, it may be switched to the enhanced heat dissipation mode, in the next period T3, it may be switched to the balanced heat dissipation mode, in the next period T4, it is switched to the enhanced heat dissipation mode again, and in the next period T5, it is switched to the default heat dissipation mode again.

[0069] In some possible implementation manners, the method further includes: when the first fan is abnormal and the temperature of the processor corresponding to the region of the first fan is greater than or equal to the preset temperature threshold, the management controller determines a second fan within a preset range around the first fan, and the temperature of the processor corresponding to the region of the second fan is less than the preset temperature threshold; the management controller determines an angle between the second fan and the first fan, and controls the second fan to guide air flow according to the air guide direction of the air guide shroud of the first fan and the angle. In this way, when the fan is abnormal, the abnormal fan can be compensated by the fan of the remaining processor with a lower temperature, so that the temperature of the processor can be controlled and the temperature of the processor caused by the abnormal fan can be reduced.

[0070] Specifically, first, a plurality of the second fan is obtained to be arranged in ascending order of distance from the first fan, to obtain a second fan sequence; then, the second fan is sequentially taken as a supplement of the first fan according to the second fan sequence, to adjust the air guide direction of the second fan, and the temperature of the processor of the first fan after the supplement is continuously observed; when the reduced temperature of the processor of the first fan is greater than or equal to a preset reduced temperature threshold, the subsequent second fan is stopped from being taken as a supplement of the first fan; when the reduced temperature of the processor of the first fan is less than the preset reduced temperature threshold, the next second fan is also taken as a supplement of the first fan, the air guide direction of the second fan is adjusted, and the temperature of the processor of the first fan after the supplement is continuously observed. In this way, the process is continuously performed until the reduced temperature of the processor of the first fan is greater than the preset reduced temperature threshold or the last second fan is taken as a supplement.

[0071] The air guide direction of the air guide shroud of the second fan is related to the angle and the air guide direction of the air guide shroud of the first fan; when the angle is an angle required for the orientation of the first fan to rotate to the orientation of the second fan, the air guide direction of the air guide shroud of the second fan can be a sum of the air guide direction of the air guide shroud of the first fan and the angle; when the angle is an angle required for the orientation of the second fan to rotate to the orientation of the first fan, the air guide direction of the air guide shroud of the second fan can be a difference between the air guide direction of the air guide shroud of the first fan and the angle.

[0072] The air guide direction of the air guide shroud can be an angle of the air guide plate on the air guide shroud compared with a default position of the air guide plate.

[0073] As can be seen from the above scheme, the second fan closest to the first fan and having a temperature of the corresponding processor less than or equal to a preset temperature threshold is preferentially selected as a supplement of the first fan, so that the number of the second fan can be reduced as much as possible, and a large number of adjustments of the air guide shroud can be avoided.

[0074] In some embodiments, when the first fan is abnormal, if the temperature of the processor corresponding to the region of the first fan is greater than or equal to the preset temperature, the management controller can further generate temperature abnormality information to send to the management client for display, prompting the user to maintain or replace the abnormal fan. The temperature abnormality information can include the temperature of the processor corresponding to the abnormal first fan, the identification of the first fan, and the like, to facilitate the user to quickly determine the position of the first fan.

[0075] In some embodiments, when the first fan is abnormal, if the temperature of the processor corresponding to the region of the first fan is less than the preset temperature, it is represented that although the first fan is abnormal, the temperature of the processor corresponding to the region of the first fan is normal, and at this time, no heat dissipation compensation is needed by the second fan.

[0076] The management controller can further generate temperature abnormality information to send to the management client for display, prompting the user to maintain or replace the abnormal fan. The temperature abnormality information can include the temperature of the processor corresponding to the abnormal first fan, the identification of the first fan, and the like, to facilitate the user to quickly determine the position of the first fan.

[0077] Of course, the management controller can also analyze the temperature variation curve of the processor corresponding to each normal fan to obtain the fan corresponding to the processor with a temperature less than the preset temperature threshold, as a replaceable fan, and add the identification of the replaceable fan to the temperature abnormality information, so that the user temporarily replaces the replaceable fan to the position of the first fan. In this way, the fan can be temporarily replaced without timely purchasing the fan, and the maintenance cost can be reduced without purchasing the fan.

[0078] In some possible implementations, each guide vane can be arranged on a rotating component, which can be communicatively connected to the management controller. The management controller can control the rotating component to drive the guide vane to rotate, so that the guide direction is determined by the direction of the guide vane and the direction of the guide vane on the guide vane, and the guide direction can be more flexible. For example, if the guide plate is arranged transversely, adjusting the guide plate can only change the guide direction within a certain range upward and downward, and cannot be adjusted in the transverse direction. If the rotating component is superimposed, the rotating component can drive the guide vane to rotate upward and downward and left and right, and the guide direction can be adjusted arbitrarily.

[0079] Each guide plate on the guide vane can have an independent adjusting component, and each adjusting component is connected to the management controller to independently control the direction of different guide plates, that is, different guide plates on the same guide vane can have different guide directions. In this way, the guide direction of the same guide vane can be split to more flexibly control the guide direction of the guide vane, and the heat dissipation can be more uniform.

[0080] In some possible implementation manners, the temperature sensor is arranged on the heat dissipation device, and the target wind speed required for the temperature on the heat dissipation device to drop to the target temperature within the preset time length is calculated according to the temperature measured by the temperature sensor on the heat dissipation device. Specifically, first, a target temperature difference between the temperature on the heat dissipation device and the target temperature is calculated; then, a ratio of the target temperature difference to the preset time length is calculated to obtain a target temperature drop speed, that is, a temperature required to be reduced within a unit time length; then, a target wind speed corresponding to the target temperature drop speed is selected; finally, the target wind speed is converted into the target rotating speed of the fan.

[0081] The relationship between the target temperature drop speed and the target wind speed can be represented by a first relationship table, and the relationship between the target wind speed and the target rotating speed of the fan can also be represented by a second relationship table. Therefore, the target rotating speed of the fan can be obtained by searching the first relationship table according to the target temperature drop speed and searching the second relationship table according to the target wind speed.

[0082] Of course, the target temperature drop speed and the target wind speed can be converted by using a first conversion coefficient, and the target wind speed and the target rotating speed of the fan can also be converted by using a second conversion coefficient. For example, the target wind speed can be a product of the target temperature drop speed and the first conversion coefficient, the target rotating speed of the fan can be a product of the target wind speed and the second conversion coefficient, the first conversion coefficient can be obtained by function fitting according to a large number of temperature drop speeds and wind speeds, and the second conversion coefficient can be obtained by function fitting according to a large number of wind speeds and rotating speeds of the fan.

[0083] The above process can be calculated by the following formula:

[0084]

[0085] wherein R1 is the target rotating speed of the fan, T1 is the temperature on the heat dissipation device, TT is the target temperature, SC is the preset time length, and P is a product of the first conversion coefficient P1 and the second conversion coefficient P2, that is, P = P1 x P2. Therefore, is the target temperature drop speed, is the target wind speed.

[0086] In some possible implementation manners, a wind speed sensor can also be arranged on the deflector to detect whether the wind speed calculated above is reached. Of course, the temperature change on the heat sink can also be used to calculate in real time whether the target temperature can be reached within the preset time length. Specifically, the real cooling speed can be calculated according to the collected temperatures on the heat sink and the corresponding time, and then the estimated time length required to reach the target temperature at the real cooling speed can be calculated. The estimated time length is the ratio between the difference between the measured current temperature and the target temperature and the real cooling speed. When the estimated time length is less than or equal to the preset time length, it is determined that the target temperature can be reached within the preset time length. When the estimated time length is greater than the preset time length, it is determined that the target temperature cannot be reached within the preset time length, and the speed of the fan can be increased appropriately. The temperature on the heat sink can be measured continuously, and the estimated time length can be calculated to adjust the speed of the fan until the target temperature can be reached within the preset time length.

[0087] Figure 6 Another step flow chart of the processor heat dissipation method provided by the embodiment of the application is shown in Figure 6 The embodiment of the application provides a processor heat dissipation method, and the method is described in detail as follows.

[0088] S301, the management controller obtains a preset mapping relationship, and the preset mapping relationship is used to indicate the mapping relationship between the region, the processor, the temperature sensor, the fan and the deflector.

[0089] Specifically, the management controller can obtain the preset mapping relationship from the storage unit. The management controller can obtain the preset mapping relationship from the storage unit when the heat dissipation control period is reached, and then perform heat dissipation control in different heat dissipation modes.

[0090] In some embodiments, the heat dissipation control period can be dynamically changed. For example, initially, the heat dissipation control period can be a default time period. The user can set the heat dissipation control period on the management client to adjust the heat dissipation control period. The heat dissipation control period set by the user can be a time period range or a fixed time period. When the heat dissipation control period set by the user is a time period range, the management controller can also flexibly adjust the heat dissipation control period according to the temperature change of each processor in a preset time period before the current time, but the adjusted heat dissipation control period needs to be within the time period range set by the user.

[0091] Of course, in another embodiment, when the temperature change frequency of each processor in the preset time period before the current time is high, the management controller can also display a period adjustment prompt on the management client if the set heat dissipation control period is not within the time period range, to prompt the user to adjust the time period range of the heat dissipation control period, and give a recommended time period range. In this way, the heat dissipation control period can be flexibly adjusted according to the real-time running situation of the processor, thereby improving the heat dissipation effect.

[0092] In a possible implementation, when the temperature sensor collects the temperature, it can make a simple judgment on the temperature, specifically, determine the size relationship between the temperature and the preset temperature threshold, and determine whether to send the temperature and the identifier of the corresponding temperature sensor to the management controller according to the size relationship. Including but not limited to: when the temperature is less than or equal to the preset temperature threshold, the temperature sensor does not send the temperature, and when the temperature is greater than the preset temperature threshold, the temperature sensor sends the temperature to the management controller. In this way, the data transmission amount can be reduced as much as possible, and the workload of the management controller can be reduced.

[0093] When the management controller receives the temperature of a temperature sensor, it means that the temperature is greater than the preset temperature threshold, and when it does not receive the temperature sent by the temperature sensor, it means that the temperature is less than the preset temperature threshold. Then, the heat dissipation mode can be determined.

[0094] Further, the temperature sensor can send a flag bit to the management controller to indicate whether the temperature is greater than the preset temperature threshold, and does not need to send the specific temperature. In this way, the data transmission amount and the calculation amount of the management controller can be further reduced, which helps to improve the heat dissipation control efficiency.

[0095] S302, the management controller determines the heat dissipation mode according to the temperature, and the heat dissipation mode includes one of the following: a default heat dissipation mode, a balanced heat dissipation mode or an enhanced heat dissipation mode. When the processor temperature in each region is less than or equal to the preset temperature threshold, the heat dissipation mode is the default heat dissipation mode, when there is a temperature greater than the preset temperature threshold in some regions, the heat dissipation mode is the balanced heat dissipation mode, and when the temperature in each region is greater than the preset temperature threshold, the heat dissipation mode is the enhanced heat dissipation mode.

[0096] For example, when the flag bit sent by the temperature sensor is 1, it indicates that the temperature of the processor corresponding to the temperature sensor is greater than the preset temperature threshold; when the flag bit sent by the temperature sensor is 0, it indicates that the temperature of the processor corresponding to the temperature sensor is less than or equal to the preset temperature threshold. Of course, the flag bit of 0 can also not be sent. The management controller can determine the heat dissipation mode according to the number of received flag bits of 1. For example, when the number of flag bits of 1 is 0, it is determined that the heat dissipation mode is the default heat dissipation mode; when the number of flag bits of 1 is greater than 0 and less than the total number of processors, it is determined that the heat dissipation mode is the balanced heat dissipation mode; and when the number of flag bits of 1 is greater than or equal to the total number of processors, it is determined that the heat dissipation mode is the enhanced heat dissipation mode.

[0097] S303, in the default heat dissipation mode, the management controller controls each fan to operate at a default rotation speed, and / or controls the flow direction of the flow guide hood to be a default flow direction.

[0098] The default flow direction can be the same as the orientation of the flow guide hood, and the orientation of the flow guide hood is the same as the orientation of the corresponding fan. In this way, the deformation of the flow guide plate of the flow guide hood can be avoided as much as possible, which helps to improve the service life of the flow guide hood.

[0099] In order to realize the above scheme, when the flow guide hood is arranged, it is necessary to ensure that the orientation of the flow guide hood is consistent with the orientation of the fan, and the flow guide plate of the flow guide hood is arranged at a default position where the rotating part of the flow guide plate does not deform.

[0100] S304, in the balanced heat dissipation mode, the management controller controls each fan to operate at a corresponding rotation speed according to the temperature and a preset mapping relationship, and / or the corresponding flow guide hood of the fan guides in a corresponding flow direction, the region where the processor whose temperature is greater than or equal to the preset temperature threshold is a target cooling region, the region whose distance from the target cooling region is less than or equal to a preset distance threshold and whose temperature is less than the preset temperature threshold is an auxiliary cooling region, the rotation speed of the fan in the target cooling region and the auxiliary cooling region is a maximum rotation speed, the rotation speed of the fan in the remaining region is a default rotation speed, the flow direction of the flow guide hood in the auxiliary cooling region is towards the target cooling region, and the flow direction of the flow guide hood outside the auxiliary cooling region is a default flow direction.

[0101] For example, the management controller can determine the target cooling region and the auxiliary cooling region according to the identification of the temperature sensor whose flag bit is 1. The target cooling region is the region of the processor corresponding to the temperature sensor whose flag bit is 1, and then the auxiliary cooling region can be determined according to the target cooling region.

[0102] S305, in the enhanced heat dissipation mode, the management controller controls each fan to operate at a maximum rotation speed, and / or controls the flow direction of the flow guide hood to be a default flow direction.

[0103] It can be seen that in the default heat dissipation mode, no sub-area control is needed, and the working states of the fans and the guide hoods in all areas are the same.

[0104] In the balanced heat dissipation mode, sub-area control is needed, and the working states of the fans and the guide hoods in different areas are different.

[0105] In the enhanced heat dissipation mode, no sub-area control is needed, and the working states of the fans and the guide hoods in all areas are the same.

[0106] S306, the management controller determines a second fan within a preset range around the first fan when the first fan is abnormal and the temperature of the processor in the area of the first fan is greater than or equal to the preset temperature threshold.

[0107] S307, the management controller determines the angle between the second fan and the first fan, and controls the second fan to guide according to the guide direction of the guide hood of the first fan and the angle.

[0108] To sum up, the application can not only eliminate manufacturing tolerances and conduction path differences through an integrated heat sink to avoid large temperature differences between different processors caused by manufacturing tolerances or independent heat conduction paths, but also help to reduce processor frequency reduction. In addition, the application can set guide hoods between the heat sink and the multiple fans, and dynamically adjust the guide direction of the guide hoods and the rotation speed of the fans through the management controller, so that the temperatures of the multiple processors are equivalent, which can further reduce processor frequency reduction. The combination of the two improves the collaborative computing performance of the server.

[0109] In addition, the management controller can also accurately find the fan and guide hood corresponding to the processor with temperature anomaly according to the preset mapping relationship to control and quickly dissipate heat. Different heat dissipation controls can be performed in different heat dissipation modes to improve the heat dissipation effect, and compensation can be made by the remaining fans when the fan is abnormal.

[0110] Through the description of the above embodiments, those skilled in the art can clearly understand that the method according to the above embodiments can be realized by software and the necessary general hardware platform, of course, it can also be realized by hardware, but in many cases the former is a better embodiment.

[0111] Those skilled in the art will further recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, computer software, or a combination of both. To clearly illustrate the interchangeability of hardware and software, the components and steps of the various examples have been generally described in terms of functionality in the foregoing description. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0112] The above provides a detailed description of a server and processor heat dissipation method provided in this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are merely for the purpose of helping to understand the method and its core ideas. It should be noted that those skilled in the art can make various improvements and modifications to this application without departing from its principles, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. A server, characterized in that, include: One or more processors, a heat sink, a fan shroud, a fan, and a management controller, wherein the processor is equipped with a temperature sensor; The heat sink covers the one or more processors and is used to conduct the temperature of the processors; The airflow guide shroud is located between the heat sink and the fan. The airflow direction of the airflow guide shroud is adjustable. The air output by the fan reaches the heat sink through the airflow guide shroud to dissipate the temperature on the heat sink to the outside of the server. The temperature sensor is connected to the management controller, and the airflow shroud and / or the fan is connected to the management controller. The management controller is used to control the airflow direction of the airflow shroud and / or the speed of the fan based on the temperature measured by the temperature sensor.

2. The server according to claim 1, characterized in that, The fans are distributed in multiple areas, and the server also includes a storage unit connected to the management controller. The management controller is also used to read a preset mapping relationship from the storage unit, and based on the preset mapping relationship and the temperature, control the fan speed and the airflow direction of the air guide shroud in each of the regions. The preset mapping relationship is used to indicate the mapping relationship between the region, the processor, the temperature sensor, the fan, and the air guide shroud.

3. The server according to claim 1, characterized in that, The heat sink includes a heat sink base plate and heat sink fins. The heat sink base plate covers the one or more processors. The heat sink base plate is provided with a boss that matches the top cover of the processor. The boss is composed of heat sink fins that directly contact the processor. The heat sink base plate is provided with multiple heat pipes arranged in an alternating pattern. The heat pipes connect each heat sink fin group and are used to conduct the temperature on the heat sink fin group that is in direct contact with the processor to the other heat sink fin groups.

4. The server according to claim 3, characterized in that, The heat pipe is filled with a temperature-sensitive medium, and the flow rate of the temperature-sensitive medium is positively correlated with the temperature.

5. The server according to any one of claims 1 to 3, characterized in that, The processor is mounted on the motherboard, and the heat sink is fixed to the motherboard by bolts, with a spring mechanism on the bolts.

6. A processor heat dissipation method, characterized in that, Applied to the server as described in any one of claims 1 to 5; the method includes: The management controller acquires the temperature measured by the temperature sensor; The management controller controls the airflow direction of the air guide shroud and / or the speed of the fan based on the temperature.

7. The method according to claim 6, characterized in that, The management controller controls the airflow direction of the air guide shroud and / or the fan speed according to the temperature, including: The management controller acquires a preset mapping relationship, which is used to indicate the mapping relationship between the area, the processor, the temperature sensor, the fan, and the air guide shroud. The management controller controls the fan speed and / or the airflow direction of the air guide shroud in each of the regions based on the preset mapping relationship and the temperature.

8. The method according to claim 7, characterized in that, The management controller, based on the preset mapping relationship and the temperature, controls the fan speed and / or the airflow direction of the air guide shroud in each of the aforementioned areas, including: The management controller determines the heat dissipation mode based on the temperature. The heat dissipation mode includes one of the following: default heat dissipation mode, balanced heat dissipation mode, or enhanced heat dissipation mode. When the processor temperature in each of the regions is less than or equal to a preset temperature threshold, the heat dissipation mode is the default heat dissipation mode. When the temperature in some of the regions is greater than the preset temperature threshold, the heat dissipation mode is the balanced heat dissipation mode. When the temperature in each of the regions is greater than the preset temperature threshold, the heat dissipation mode is the enhanced heat dissipation mode. The management controller controls the fan speed and / or the airflow direction of the air guide shroud in each of the regions based on the temperature, the heat dissipation mode, and the preset mapping relationship.

9. The method according to claim 8, characterized in that, The management controller controls the fan speed and / or the airflow direction of the air guide shroud in each of the aforementioned areas based on the temperature, the heat dissipation mode, and the preset mapping relationship, including: In the default cooling mode, the management controller controls each of the fans to run at a default speed, and / or controls the airflow direction of the air guide shroud to be the default airflow direction; In the balanced heat dissipation mode, the management controller controls each fan to operate at a corresponding speed according to the temperature and the preset mapping relationship, and / or the air guide shroud corresponding to the fan guides air in a corresponding airflow direction. The area where the processor is located with a temperature greater than or equal to a preset temperature threshold is the target cooling area, and the area where the distance from the target cooling area is less than or equal to a preset distance threshold and the temperature is less than the preset temperature threshold is the auxiliary cooling area. The fan speed in the target cooling area and the auxiliary cooling area is the maximum speed, and the fan speed in the other areas is the default speed. The air guide shroud of the auxiliary cooling area is oriented towards the target cooling area, and the air guide shroud outside the auxiliary cooling area is the default airflow direction. In the enhanced heat dissipation mode, the management controller controls each of the fans to run at maximum speed, and / or controls the airflow direction of the air guide shroud to the default airflow direction.

10. The method according to claim 8, characterized in that, Also includes: When the first fan malfunctions and the temperature of the processor in the area of ​​the first fan is greater than or equal to the preset temperature threshold, the management controller determines a second fan within a preset range around the first fan, wherein the temperature of the processor in the area of ​​the second fan is less than the preset temperature threshold. The management controller determines the angle between the second fan and the first fan, and controls the second fan to guide the airflow according to the airflow direction of the first fan's airflow shroud and the angle.

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